Display panel, manufacturing method and display device

Abstract

The invention is suitable for the technical field of display, and provides a display panel, a manufacturing method and a display device.The display panel comprises a light-emitting substrate and a first packaging structure, the light-emitting substrate comprises a first display area, a second display area and a bending area located between the first display area and the second display area, and the first packaging structure comprises a first packaging layer; the first packaging layer comprises a first packaging section and a second packaging section, the first packaging section is arranged in the first display area, the second packaging section is arranged in the second display area, and the ends, close to each other, of the first packaging section and the second packaging section are arranged at intervals. No interaction force is generated between the first packaging section and the second packaging section, cracking, stripping and the like of the first packaging section and the second packaging section can be avoided, and the packaging effectiveness and stability of the display panel are integrally improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a manufacturing method, and a display device. Background Art

[0002] Flexible display screens include flexible liquid crystal display screens and flexible OLED (Organic Light-Emitting Diode) display screens. Compared with flexible liquid crystal display screens, flexible OLEDs are thinner and more flexible, and are more likely to develop various bent and folded states. For example, there are more and more possibilities for the form of flexible foldable screen mobile phones.

[0003] Currently, higher requirements are put forward for the encapsulation effect of foldable screens. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a display panel, aiming to provide a technical solution for improving the encapsulation effect of foldable screens.

[0005] The embodiments of the present application are implemented as follows. A display panel includes:

[0006] A light-emitting substrate, including a first display area and a second display area, and a bending area located between the first display area and the second display area; and

[0007] A first encapsulation structure, including a first encapsulation layer. The first encapsulation layer includes a first encapsulation segment and a second encapsulation segment. The first encapsulation segment is disposed on the first display area of the light-emitting substrate, the second encapsulation segment is disposed on the second display area of the light-emitting substrate, and the first encapsulation segment and the second encapsulation segment are spaced apart.

[0008] In one embodiment, the first encapsulation structure further includes a second encapsulation layer and a third encapsulation layer. The second encapsulation layer and the third encapsulation layer are sequentially disposed on the side of the first encapsulation layer away from the light-emitting substrate; the second encapsulation layer is disposed on the side of the second encapsulation segment away from the light-emitting substrate, and the second encapsulation layer extends from one side of the first encapsulation segment to the second encapsulation segment, and the bending area is located within the orthographic projection of the second encapsulation layer on the light-emitting substrate; the third encapsulation layer is disposed on the side of the second encapsulation layer away from the light-emitting substrate;

[0009] Preferably, the first encapsulation layer includes an inorganic material, the second encapsulation layer includes an organic material, and the third encapsulation layer includes an inorganic material.

[0010] In one embodiment, the first encapsulation structure further includes a second encapsulation layer, which includes a third encapsulation segment and a fourth encapsulation segment. The third encapsulation segment is disposed on a side of the first encapsulation segment away from the light-emitting substrate, and a positive projection of the first encapsulation segment on the light-emitting substrate is located within a positive projection of the third encapsulation segment on the light-emitting substrate. The fourth encapsulation segment is disposed on a side of the first encapsulation segment away from the light-emitting substrate, and a positive projection of the second encapsulation segment on the light-emitting substrate is located within a positive projection of the fourth encapsulation segment on the light-emitting substrate. The third encapsulation segment and the fourth encapsulation segment are spaced apart.

[0011] Preferably, the first encapsulation layer includes an inorganic material, and the second encapsulation layer includes an organic material.

[0012] In one embodiment, the first encapsulation structure further includes a third encapsulation layer, which is disposed on a side of the third encapsulation segment, the bending region, and the second encapsulation segment away from the light-emitting substrate, and a positive projection of the third encapsulation segment, the bending region, and the second encapsulation segment on the light-emitting substrate is located within a positive projection of the third encapsulation layer on the light-emitting substrate.

[0013] Preferably, the third encapsulation layer includes an inorganic material.

[0014] In one embodiment, the first encapsulation structure further includes a second encapsulation layer and a third encapsulation layer. The second encapsulation layer includes a third encapsulation segment and a fourth encapsulation segment. The third encapsulation segment is disposed on a side of the first encapsulation segment away from the light-emitting substrate, and a positive projection of the first encapsulation segment on the light-emitting substrate is located within a positive projection of the third encapsulation segment on the light-emitting substrate. The fourth encapsulation segment is disposed on a side of the second encapsulation segment away from the light-emitting substrate, and a positive projection of the second encapsulation segment on the light-emitting substrate is located within a positive projection of the fourth encapsulation segment on the light-emitting substrate. The third encapsulation segment and the fourth encapsulation segment are spaced apart. The third encapsulation layer includes a fifth encapsulation segment and a sixth encapsulation segment. The fifth encapsulation segment is disposed on a side of the third encapsulation segment away from the light-emitting substrate, and a positive projection of the third encapsulation segment on the light-emitting substrate is located within a positive projection of the fifth encapsulation segment on the light-emitting substrate. The sixth encapsulation segment is disposed on a side of the fourth encapsulation segment away from the light-emitting substrate, and a positive projection of the fourth encapsulation segment on the light-emitting substrate is located within a positive projection of the sixth encapsulation segment on the light-emitting substrate. The fifth encapsulation segment and the sixth encapsulation segment are spaced apart.

[0015] Preferably, the first encapsulation layer includes an inorganic material, the second encapsulation layer includes an organic material, and the third encapsulation layer includes an inorganic material.

[0016] In one embodiment, the display panel further includes a second encapsulation structure disposed on one side of the light-emitting substrate, and a positive projection of the second encapsulation structure on the light-emitting substrate overlaps with the bending region.

[0017] In one embodiment, the first encapsulation structure further includes at least one fourth encapsulation layer disposed on the third encapsulation layer, and at least one fifth encapsulation layer disposed on the fourth encapsulation layer;

[0018] Preferably, the fourth encapsulation layer includes an organic material, and the fifth encapsulation layer includes an inorganic material.

[0019] In one embodiment, the light-emitting substrate further includes a border region disposed around the first display region and the second display region, and a first barrier dam and a second barrier dam disposed in the border region. The first barrier dam is disposed on a side of the second barrier dam close to the first display region and the second display region, and abuts against edges of the third encapsulation segment and the fourth encapsulation segment respectively. Positive projections of the first barrier dam and the second barrier dam on the light-emitting substrate are located within a positive projection of the third encapsulation layer on the light-emitting substrate.

[0020] Another object of the present application is to provide a method for manufacturing a display panel, which includes:

[0021] Manufacturing a light-emitting substrate, the light-emitting substrate including a first display region and a second display region, and a bending region located between the first display region and the second display region;

[0022] Forming a first encapsulation segment on one side of the first display region, and forming a second encapsulation segment on one side of the second display region, with a space provided between ends of the first encapsulation segment and the second encapsulation segment that are close to each other.

[0023] Another object of the embodiments of the present application is to provide a display device, which includes the display panel described in each of the above embodiments, or a display panel manufactured by the method for manufacturing a display panel described in the above embodiments.

[0024] The beneficial effects of the display panel, manufacturing method, and display device provided by the embodiments of the present application are as follows:

[0025] In the display panel provided by the embodiment of the present application, in the first encapsulation structure, the first encapsulation segment and the second encapsulation segment respectively encapsulate the first display area and the second display area, and they are spaced apart from each other. In this way, the first encapsulation layer is not continuously provided in the bending area, or equivalently, the first encapsulation layer is hollowed out and removed in the bending area. During and after the bending process in the bending area, there will be no interaction force between the first encapsulation segment and the second encapsulation segment, that is, the first encapsulation layer will not generate internal stress due to bending, which can avoid cracking, peeling, etc. of the first encapsulation segment and the second encapsulation segment, and can avoid causing the failure of the second encapsulation segment when the first encapsulation segment fails and avoid causing the failure of the first encapsulation segment when the second encapsulation segment fails, thereby improving the encapsulation effectiveness and stability of the display panel as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 is a schematic plan view of a display panel provided by the first embodiment of the present application;

[0028] Figure 2 is a sectional structure diagram of a display panel provided by the first embodiment of the present application, corresponding to Figure 1 the line A-A in

[0029] Figure 3 is a sectional structure diagram of a display panel provided by the second embodiment of the present application;

[0030] Figure 4 is a sectional structure diagram of a display panel provided by the third embodiment of the present application;

[0031] Figure 5 is a schematic plan view of a display panel provided by the fourth embodiment of the present application;

[0032] Figure 6 is a sectional structure diagram of a display panel provided by the fourth embodiment of the present application, corresponding to Figure 5 the line B-B in

[0033] Figure 7 is a sectional structure diagram of a display panel provided by the fifth embodiment of the present application;

[0034] Figure 8 is Figure 7 a sectional view of the line C-C in

[0035] Figure 9It is a flowchart of the steps of the method for manufacturing a display panel provided by the fifth embodiment of the present application.

[0036] The meanings of the marks in the figure are as follows:

[0037] 100 - Display panel;

[0038] 3 - Light - emitting substrate, 30 - Substrate, 31 - Driving layer, 311 - Circuit layer, 312 - Insulating layer, 32 - Light - emitting layer, 35 - First display area, 36 - Second display area, 37 - Bending area, 38 - Border area;

[0039] 4 - First encapsulation structure, 40, 40’ - Encapsulation structure layers;

[0040] 41 - First encapsulation layer, 411 - First encapsulation segment, 412 - Second encapsulation segment;

[0041] 42 - Second encapsulation layer, 421 - Third encapsulation segment, 422 - Fourth encapsulation segment;

[0042] 43 - Third encapsulation layer, 431 - Fifth encapsulation segment, 432 - Sixth encapsulation segment;

[0043] 44 - Fourth encapsulation layer;

[0044] 45 - Fifth encapsulation layer;

[0045] 46 - Second encapsulation structure;

[0046] 51 - First barrier rib, 52 - Second barrier rib;

[0047] 6 - Driving chip. Detailed implementation manners

[0048] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0049] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly fixed or disposed on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this patent. The terms "first" and "second" are only for convenience of description and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0050] In order to illustrate the technical solutions described in this application, the following will be described in detail with reference to specific drawings and embodiments.

[0051] The display panel includes a main display screen and a secondary display screen. The main display screen and the secondary display screen are arranged at intervals, and the area between them serves as a bending area. In the prior art, the main display screen and the secondary display screen are integrally packaged, that is, they share a set of packaging structures. After packaging, when the secondary display screen is bent and after bending, the packaging structure in the bending area has relatively large stress, which easily causes cracks and peeling in the packaging structure layer, and then leads to packaging failure. Or, if the packaging of the main display screen fails due to the overall drop of the display panel, it is also easy to cause the packaging failure of the secondary display screen, and vice versa.

[0052] To solve the above problems, an embodiment of this application first provides a display panel 100.

[0053] See Figure 1 and Figure 2 As shown, the display panel 100 includes a light-emitting substrate 3 and a first packaging structure 4. Among them, the light-emitting substrate 3 includes a first display area 35 and a second display area 36, and a bending area 37 located between the first display area 35 and the second display area 36. Please refer to Figure 2 As shown, the first packaging structure 4 includes a first packaging layer 41. The first packaging layer 41 includes a first packaging segment 411 and a second packaging segment 412. The first packaging segment 411 is disposed in the first display area 35, the second packaging segment 412 is disposed in the second display area 36, and there is an interval between the ends of the first packaging segment 411 and the second packaging segment 412 that are close to each other.

[0054] The accompanying drawings of the embodiments of the present application are described by taking the example of flattening the second display area 36 in the reverse direction onto the front surface of the display panel 100. The relative positions of the first display area 35 and the second display area 36 are not limited. For example, the bending area 37 may be located above the first display area 35. After actual bending, the second display area 36 is located on the back surface of the upper end of the first display area 35. The embodiments of the present application are described by taking this as an example. Refer to Figure 1 as shown. In other alternative embodiments, it is allowed that the bending area 37 is located in other orientations of the first display area 35.

[0055] It should be noted that the first encapsulation segment 411 covers the first display area 35. This means that in the direction perpendicular to the surface of the light-emitting substrate 3, the projection of the first encapsulation segment 411 can completely cover the projection of the first display area 35, or rather, the first display area 35 is located within the orthographic projection of the first encapsulation segment 411 on the light-emitting substrate 3. In this way, the first encapsulation segment 411 encapsulates the periphery of the first display area 35.

[0056] Similarly, in the direction perpendicular to the surface of the light-emitting substrate 3, the projection of the second encapsulation segment 412 can completely cover the projection of the second display area 36, or rather, the second display area 36 is located within the orthographic projection of the second encapsulation segment 412 on the light-emitting substrate 3. In this way, the second encapsulation segment 412 encapsulates the periphery of the second display area 36.

[0057] In the first encapsulation structure 4 of the display panel 100 provided by the embodiments of the present application, the first encapsulation segment 411 and the second encapsulation segment 412 encapsulate the first display area 35 and the second display area 36 respectively, and are spaced apart from each other. In this way, the first encapsulation layer 41 is not continuously provided in the bending area 37, that is, it is equivalent to that the first encapsulation layer 41 is hollowed out and removed in the bending area 37. During and after the bending process of the bending area 37, no mutual acting force will be generated between the first encapsulation segment 411 and the second encapsulation segment 412, that is, the first encapsulation layer 41 will not generate internal stress due to bending, which can avoid cracking and peeling of the first encapsulation segment 411 and the second encapsulation segment 412, and can avoid causing the failure of the second encapsulation segment 412 when the first encapsulation segment 411 fails and avoid causing the failure of the first encapsulation segment 411 when the second encapsulation segment 412 fails, thereby improving the encapsulation effectiveness and stability of the display panel 100 as a whole.

[0058] Refer to Figure 2 as shown. On the light-emitting substrate 3, both the first display area 35 and the second display area 36 include a driving layer 31 and a light-emitting layer 32 provided on the substrate 30. The light-emitting layer 32 is connected to the driving layer 31, and the driving layer 31 is connected to a driving chip 6 provided in the border area 38. Combining Figure 1As shown, the driving chip 6 is used to provide a display driving signal to the light-emitting layer 32 via the driving layer 31, so as to drive the light-emitting layer 32 in the first display area 35 and the light-emitting layer 32 in the second display area 36 to emit light according to the display driving signal respectively, and form a first display screen and a second display screen respectively.

[0059] The light-emitting layer 32 includes a plurality of pixels arranged in an array. Each pixel may specifically be an organic light-emitting unit.

[0060] In one embodiment, the first display area 35 and the second display area 36 are driven by the same driving chip 6, which can simplify the wiring layout of the driving layer 31 and reduce the structural cost of the display panel 100.

[0061] Please refer to Figure 2 As shown, on the light-emitting substrate 3, the driving layer 31 includes multiple circuit layers 311 and multiple insulating layers 312. For example, the driving layer 31 includes three circuit layers 311, and an insulating layer 312 is provided between two adjacent circuit layers 311; or, the driving layer 31 includes four circuit layers 311, and at least one insulating layer 312 is provided between two adjacent circuit layers 311; or, the driving layer 31 includes five circuit layers 311, etc.

[0062] In addition to being disposed in the first display area 35 and the second display area 36, the driving layer 31 is also disposed in the bending area 37. That is to say, each circuit layer 311 and insulating layer 312 extends from the first display area 35 through the bending area 37 to the second display area 36. The circuit layer 311 located in the bending area 37 is connected to the circuit layers 311 located in the first display area 35 and the second display area 36.

[0063] Please refer to Figure 1 As shown, on the light-emitting substrate 3, a border area 38 is provided around the first display area 35 and the second display area 36. Please refer to Figure 2 As shown, the edges of the first encapsulation section 411 and the second encapsulation section 412 are also disposed in the border area 38 to ensure complete encapsulation of the first display area 35 and the second display area 36. It can be understood that after bending in the bending area 37, the part located on the front surface of the display panel 100 will substantially become a part of the upper border of the first display area 35.

[0064] The material of the first encapsulation layer 41 includes an inorganic material, specifically an inorganic transparent material, such as at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide.

[0065] The thickness of the first encapsulation layer 41 is 50 nanometers to 2000 nanometers, for example, 50 nanometers, 100 nanometers, 500 nanometers, 1000 nanometers, 1500 nanometers, 2000 nanometers, or other values.

[0066] Depending on the different formation methods of the first encapsulation layer 41, the thickness of the first encapsulation layer 41 can be different. For example, the first encapsulation layer 41 prepared by plasma chemical vapor deposition technology can have a greater thickness than the first encapsulation layer 41 prepared by atomic layer deposition technology.

[0067] Please continue to refer to Figure 2 As shown, in one embodiment, the first encapsulation structure 4 further includes a second encapsulation layer 42 and a third encapsulation layer 43. The second encapsulation layer 42 is disposed on the side of the second encapsulation segment 412 away from the light-emitting substrate 3, and extends from one side of the first encapsulation segment 411 to the second encapsulation segment 412. The bending region 37 is located within the orthographic projection of the second encapsulation layer 42 on the light-emitting substrate 3; the third encapsulation layer 43 is disposed on the side of the second encapsulation layer 42 away from the light-emitting substrate 3.

[0068] That is to say, the orthographic projection of the second encapsulation layer 42 on the light-emitting substrate 3 completely covers the first encapsulation segment 411, the second encapsulation segment 412, and the bending region 37; the orthographic projections of the first encapsulation segment 411, the second encapsulation segment 412, and the bending region 37 on the light-emitting substrate 3 are located within the orthographic projection of the second encapsulation layer 42 on the light-emitting substrate 3. And, the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3 completely covers the second encapsulation layer 42; the orthographic projection of the second encapsulation layer 42 on the light-emitting substrate 3 is located within the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3.

[0069] In this way, both the second encapsulation layer 42 and the third encapsulation layer 43 are used as a whole layer structure, and the entire light-emitting substrate 3 is encapsulated in sequence.

[0070] The inorganic / organic / inorganic encapsulation structure formed by the first encapsulation layer 41, the second encapsulation layer 42, and the third encapsulation layer 43 can achieve a good encapsulation effect on the light-emitting substrate 3, taking into account both bending flexibility and water and oxygen barrier effects.

[0071] In addition, it should be noted that although the third encapsulation layer 43 covers the bending region 37 and bends along with the bending region 37. However, since the third encapsulation layer 43 is located outside the first encapsulation layer 41 and the second encapsulation layer 42, its bending radius is relatively large. At this time, the third encapsulation layer 43 is not likely to generate internal stress, nor is it likely to crack or peel off relative to the second encapsulation layer 42.

[0072] The second encapsulation layer 42 may include an organic material, specifically an organic transparent material, such as a laminate of one or more of epoxy-based, polyurethane-based, and acrylate-based organic polymers.

[0073] The thickness of the second encapsulation layer 42 is between 800 nanometers and 20 micrometers, specifically such as 800 nanometers, 1 micrometer, 2 micrometers, 5 micrometers, 10 micrometers, 15 micrometers, 20 micrometers, or other values.

[0074] The second encapsulation layer 42 can be formed by coating and printing, for example, by inkjet printing.

[0075] The second encapsulation layer 42 can fill the step difference between the first encapsulation segment 411, the second encapsulation segment 412 and the bending area 37, so that the third encapsulation layer 43 can be formed on a flat surface. Furthermore, the surface of the entire first encapsulation structure 4 can be flattened.

[0076] The third encapsulation layer 43 can include an inorganic material, specifically an inorganic transparent material, such as at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide.

[0077] The thickness of the third encapsulation layer 43 is 50 nanometers to 2000 nanometers, for example, 50 nanometers, 100 nanometers, 500 nanometers, 1000 nanometers, 1500 nanometers, 2000 nanometers, or other values.

[0078] Among them, the thickness of the third encapsulation layer 43 can be the same as or different from the thickness of the first encapsulation layer 41.

[0079] Please refer to Figure 3 As shown, in one embodiment, the first encapsulation structure 4 further includes at least one fourth encapsulation layer 44 provided on the third encapsulation layer 43 and at least one fifth encapsulation layer 45 provided on the fourth encapsulation layer 44. That is to say, organic encapsulation layers and inorganic encapsulation layers can be continuously stacked crosswise on the third encapsulation layer 43. Among them, the fourth encapsulation layer 44 can refer to the foregoing embodiments, including two spaced encapsulation segments and respectively encapsulating the first display area 35 and the second display area 36, or, being a whole-layer structure and simultaneously encapsulating the first display area 35, the bending area 37 and the second display area 36; the fifth encapsulation layer 45 can refer to the foregoing embodiments, including two spaced encapsulation segments and respectively encapsulating the first display area 35 and the second display area 36, or, being a whole-layer structure and simultaneously encapsulating the first display area 35, the bending area 37 and the second display area 36.

[0080] The fourth encapsulation layer 44 can include an organic material, specifically an organic transparent material, such as a laminate of one or more of epoxy-based, polyurethane-based, and acrylate-based organic polymers.

[0081] The fifth encapsulation layer 45 can include an inorganic material, specifically an inorganic transparent material, such as at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium oxide.

[0082] Next, please refer to Figure 4 As shown, in one embodiment, on the basis of the foregoing embodiment, the second encapsulation layer 42 is replaced by hollowing out and removing in the bending area 37.

[0083] Specifically, refer to Figure 4As shown, in this embodiment, in the first encapsulation structure 4, the second encapsulation layer 42 includes a third encapsulation segment 421 and a fourth encapsulation segment 422. The third encapsulation segment 421 is disposed on a side of the first encapsulation segment 411 away from the light-emitting substrate 3, and the fourth encapsulation segment 422 covers the side of the first encapsulation segment 411 away from the light-emitting substrate 3. The third encapsulation segment 421 and the fourth encapsulation segment 422 are spaced apart.

[0084] In this way, the orthographic projection of the first encapsulation segment 411 on the light-emitting substrate 3 is located within the orthographic projection of the third encapsulation segment 421 on the light-emitting substrate 3, and the orthographic projection of the second encapsulation segment 412 on the light-emitting substrate 3 is located within the orthographic projection of the fourth encapsulation segment 422 on the light-emitting substrate 3. This enables the third encapsulation segment 421 to completely cover the first encapsulation segment 411 to encapsulate the first encapsulation segment 411, and the fourth encapsulation segment 422 to completely cover the second encapsulation segment 412 to encapsulate the second encapsulation segment 412.

[0085] In this embodiment, the second encapsulation layer 42 is hollowed out and removed in the bending area 37. Therefore, when bending, no force is generated between the third encapsulation segment 421 and the fourth encapsulation segment 422. This can prevent the bending of the second encapsulation layer 42 from exerting a force on the first encapsulation segment 411 and the second encapsulation segment 412, and further prevent the encapsulation failure problems caused by the cracking and peeling of the first encapsulation segment 411 and the second encapsulation segment 412 on the light-emitting substrate 3.

[0086] In one embodiment, please refer to Figure 4 As shown, the third encapsulation layer 43 covers the third encapsulation segment 421, the bending area 37, and the second encapsulation segment 412. The orthographic projections of the third encapsulation segment 421, the bending area 37, and the second encapsulation segment 412 on the light-emitting substrate 3 are located within the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3.

[0087] In this way, the third encapsulation layer 43, as a whole layer structure, encapsulates the third encapsulation segment 421, the bending area 37, and the fourth encapsulation segment 422. The third encapsulation layer 43 provides an overall comprehensive water and oxygen barrier effect to the display panel 100.

[0088] Similarly, it should be noted that although the third encapsulation layer 43 covers the bending area 37 and bends along with the bending area 37. However, since the third encapsulation layer 43 is located outside the first encapsulation layer 41 and the second encapsulation layer 42, its bending radius is relatively large. At this time, the third encapsulation layer 43 is not easily cracked or peeled off relative to the second encapsulation layer 42.

[0089] It should be noted that a part of the above-mentioned first encapsulation layer 41, second encapsulation layer 42 and third encapsulation layer 43 are all disposed on the periphery of the first display area 35 and the second display area 36, that is, in the border area 38. The first encapsulation segment 411, the third encapsulation segment 421 and the third encapsulation layer 43 are also all disposed on the periphery of the first display area 35, and the second encapsulation segment 412, the fourth encapsulation segment 422 and the third encapsulation layer 43 are also all disposed on the periphery of the second display area 36, that is, in the border area 38.

[0090] Please continue to refer to Figure 7 and Figure 8 As shown, in one embodiment, the light-emitting substrate 3 further includes a plurality of barrier dams disposed in the border area 38 on the periphery of the first display area 35 and the periphery of the second display area 36. One barrier dam close to the first display area 35 and the second display area 36 is respectively used to abut against the edges of the third encapsulation segment 421 and the fourth encapsulation segment 422, and the orthographic projection of the barrier dam on the light-emitting substrate 3 is located within the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3.

[0091] Refer to Figure 7 and Figure 8 As shown, taking a plurality of barrier dams as an example, they are defined as the first barrier dam 51 and the second barrier dam 52. The first barrier dam 51 is disposed close to the second display area 36, and the second barrier dam 52 is spaced apart from the first barrier dam 51. The fourth encapsulation segment 422 is disposed on the side of the first barrier dam 51 close to the light-emitting layer 32, and the orthographic projections of the first barrier dam 51 and the second barrier dam 52 on the light-emitting substrate 3 are located within the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3.

[0092] In an alternative embodiment, the first barrier dam 51 can be multiple, such as two, or three, or more. The multiple first barrier dams 51 are arranged at intervals in the direction close to the first display area 35 and the direction close to the second display area 36; the second barrier dam 52 can be multiple, such as two, three or more. The multiple second barrier dams 52 are arranged at intervals in the direction close to the first display area 35 and the direction close to the second display area 36.

[0093] In a specific embodiment, the number of the first barrier dams 51 is two, and the number of the second barrier dams 52 is two. The third encapsulation layer 43 of the whole layer structure covers the first barrier dam 51 and the second barrier dam 52 at the same time, and the orthographic projections of the first barrier dam 51 and the second barrier dam 52 on the light-emitting substrate 3 are located within the orthographic projection of the third encapsulation layer 43 on the light-emitting substrate 3.

[0094] In one embodiment, the organic encapsulation layer and the inorganic encapsulation layer in the first encapsulation structure 4 both include encapsulation segments disposed on both sides of the bending region 37, such that the first encapsulation structure 4 forms an encapsulation structure layer 40 covering the first display region 35 and another encapsulation structure layer 40' covering the second display region 36, as Figure 5 and Figure 6 shown.

[0095] Taking the first encapsulation structure 4 including a first encapsulation layer 41, a second encapsulation layer 42, and a third encapsulation layer 43 as an example, please refer to Figure 6 shown. On the basis of the foregoing embodiment, the third encapsulation layer 43 is replaced by being hollowed out and removed in the bending region 37.

[0096] Specifically, as Figure 5 and Figure 6 shown, in the first encapsulation structure 4, the second encapsulation layer 42 includes a third encapsulation segment 421 and a fourth encapsulation segment 422. The third encapsulation segment 421 is disposed on a side of the first encapsulation segment 411 away from the light-emitting substrate 3, and the orthographic projection of the first encapsulation segment 411 on the light-emitting substrate 3 is located within the orthographic projection of the third encapsulation segment 421 on the light-emitting substrate 3. The fourth encapsulation segment 422 is disposed on a side of the second encapsulation segment 412 away from the light-emitting substrate 3, and the orthographic projection of the second encapsulation segment 412 on the light-emitting substrate 3 is located within the orthographic projection of the fourth encapsulation segment 422 on the light-emitting substrate 3. The third encapsulation segment 421 and the fourth encapsulation segment 422 are spaced apart. The third encapsulation layer 43 includes a fifth encapsulation segment 431 and a sixth encapsulation segment 432. The fifth encapsulation segment 431 is disposed on a side of the third encapsulation segment 421 away from the light-emitting substrate 3, and the orthographic projection of the third encapsulation segment 421 on the light-emitting substrate 3 is located within the orthographic projection of the fifth encapsulation segment 431 on the light-emitting substrate 3. The sixth encapsulation segment 432 covers a side of the fourth encapsulation segment 422 away from the light-emitting substrate 3, and the orthographic projection of the fourth encapsulation segment 422 on the light-emitting substrate 3 is located within the orthographic projection of the sixth encapsulation segment 432 on the light-emitting substrate 3. The fifth encapsulation segment 431 and the sixth encapsulation segment 432 are spaced apart.

[0097] And, optionally, in this example, the fifth encapsulation segment 431 is further disposed on a side of the first barrier dam 51 away from the light-emitting substrate 3, and the sixth encapsulation segment 432 is further disposed on a side of the second barrier dam 52 away from the light-emitting substrate 3.

[0098] Thus, the orthographic projection of the first encapsulation segment 411 on the light-emitting substrate 3 is located within the orthographic projection of the third encapsulation segment 421 on the light-emitting substrate 3, and the orthographic projection of the second encapsulation segment 412 on the light-emitting substrate 3 is located within the orthographic projection of the fourth encapsulation segment 422 on the light-emitting substrate 3. This enables the third encapsulation segment 421 to completely cover the first encapsulation segment 411 to encapsulate the first encapsulation segment 411, and the fourth encapsulation segment 422 to completely cover the second encapsulation segment 412 to encapsulate the second encapsulation segment 412.

[0099] The orthographic projection of the third encapsulation segment 421 on the light-emitting substrate 3 is located within the orthographic projection of the fifth encapsulation segment 431 on the light-emitting substrate 3, and the orthographic projection of the fourth encapsulation segment 422 on the light-emitting substrate 3 is located within the orthographic projection of the sixth encapsulation segment 432 on the light-emitting substrate 3. This enables the fifth encapsulation segment 431 to completely cover the third encapsulation segment 421 to encapsulate the third encapsulation segment 421, and the sixth encapsulation segment 432 to completely cover the fourth encapsulation segment 422 to encapsulate the fourth encapsulation segment 422.

[0100] At least the first encapsulation segment 411, the third encapsulation segment 421, and the fifth encapsulation segment 431 form an encapsulation structure layer 40, and at least the second encapsulation segment 412, the fourth encapsulation segment 422, and the sixth encapsulation segment 432 form another encapsulation structure layer 40', as Figure 6 shown.

[0101] In this embodiment, the first encapsulation layer 41, the second encapsulation layer 42, and the third encapsulation layer 43 are all hollowed out and removed in the bending area 37. Equivalently, the first display area 35 and the second display area 36 are encapsulated independently. Therefore, when bending the bending area 37, no force is generated between the third encapsulation segment 421 and the fourth encapsulation segment 422, and no interaction force is generated between the fifth encapsulation segment 431 and the sixth encapsulation segment 432. This can further prevent the second encapsulation layer 42 and the third encapsulation layer 43 from exerting forces on the first encapsulation segment 411 and the second encapsulation segment 412, and further avoid the encapsulation failure problems caused by the cracking and falling off of the first encapsulation segment 411 and the second encapsulation segment 412 on the light-emitting substrate 3, further improving the encapsulation stability of the first display area 35 and the second display area 36.

[0102] Please refer to Figure 6 shown. In this embodiment, the edge of the fifth encapsulation segment 431 is hermetically connected to the edge of the first barrier dam 51 close to the first display area 35. Even more, the fifth encapsulation segment 431 is disposed on the side of the first barrier dam 51 away from the light-emitting substrate 3; the edge of the sixth encapsulation segment 432 is hermetically connected to the edge of the second barrier dam 52 close to the second display area 36. Even more, the sixth encapsulation segment 432 is disposed on the side of the second barrier dam 52 away from the light-emitting substrate 3.

[0103] On this basis, in one embodiment, in order to further ensure the encapsulation effect of the bending region 37 and prevent the circuit layer 311 in the driving layer 31 of the bending region 37 from being exposed, the display panel 100 further includes a second encapsulation structure 46, which is disposed on the side of the bending region 37 away from the light-emitting substrate 3, and the bending region 37 is within the orthographic projection of the second encapsulation structure 46 on the light-emitting substrate 3. Refer to Figure 6 As shown. At least one side of the two sides of the second encapsulation structure 46 is connected to at least one side of the first barrier dam 51 and the second barrier dam 52 that are close to each other, so as to jointly form an encapsulation structure with the first encapsulation section 411 and the second encapsulation section 412, preventing water, oxygen, etc. from entering the circuit layer 311 of the bending region 37.

[0104] The second encapsulation structure 46 can be a single-layer or multi-layer structure formed by methods such as dispensing and deposition. For example, the second encapsulation structure 46 includes an adhesive layer formed by dispensing ultraviolet curable adhesive before bending and curing after bending, specifically such as epoxy resin sealant; alternatively, the second encapsulation structure 46 includes a material layer formed by deposition after bending.

[0105] Please refer to Figure 9 As shown, the embodiment of the present application further provides a method for manufacturing a display panel, which includes:

[0106] Step S1, manufacturing a light-emitting substrate 3, the light-emitting substrate 3 includes a first display area 35 and a second display area 36, and a bending region 37 located between the first display area 35 and the second display area 36;

[0107] Specifically, in this step S1, a substrate substrate 30 is provided, a first area, a second area, and a third area located between the first area and the second area are provided on the substrate substrate 30, a driving layer 31 is formed on the first area, the second area, and the third area, a light-emitting layer 32 is formed on the driving layer 31 of the first area and the second area, the first display area 35 provided in the first area and the second display area 36 provided in the second area are respectively obtained, and a part of the driving layer 31 provided in the third area is used as the bending region 37.

[0108] Step S2, forming a first encapsulation section 411 on one side of the first display area 35 and forming a second encapsulation section 412 on one side of the second display area 36, and the ends of the first encapsulation section 411 and the second encapsulation section 412 that are close to each other are spaced apart.

[0109] Optionally, in this step S2, the above-mentioned first encapsulation section 411 and second encapsulation section 412 can be formed by physical vapor deposition.

[0110] Preferably, in one embodiment, please continue to refer to Figure 9 As shown, the method for manufacturing the display panel further includes:

[0111] Step S3: Form a third encapsulation segment 421 on the side of the first encapsulation segment 411 away from the light-emitting substrate 3, and form a fourth encapsulation segment 422 on the side of the second encapsulation segment 412 away from the light-emitting substrate 3. The third encapsulation segment 421 and the fourth encapsulation segment 422 are arranged at intervals.

[0112] Optionally, in this step S3, the above-mentioned third encapsulation segment 421 and fourth encapsulation segment 422 can be formed by chemical vapor deposition.

[0113] Preferably, in one embodiment, please continue to refer to Figure 9 As shown, the manufacturing method of the display panel further includes:

[0114] Step S4: Form a fifth encapsulation segment 431 on the side of the third encapsulation segment 421 away from the light-emitting substrate 3, and form a sixth encapsulation segment 432 on the side of the fourth encapsulation segment 422 away from the light-emitting substrate 3. The fifth encapsulation segment 431 and the sixth encapsulation segment 432 are arranged at intervals.

[0115] Optionally, in this step S4, the above-mentioned fifth encapsulation segment 431 and sixth encapsulation segment 432 can be formed by physical vapor deposition.

[0116] Finally, the embodiment of the present application also provides a display device board, which includes the display panel 100 described in the foregoing embodiments. Therefore, the display device has the same technical features and technical effects as the display panel 100 of the foregoing embodiments, which will not be elaborated here.

[0117] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A light-emitting substrate, comprising a first display area and a second display area, and a bending area between the first display area and the second display area; as well as The first packaging structure includes a first packaging layer, the first packaging layer includes a first packaging segment and a second packaging segment, the first packaging segment is arranged in the first display area of ​​the light-emitting substrate, the second packaging segment is arranged in the second display area of ​​the light-emitting substrate, and the first packaging segment and the second packaging segment are arranged at intervals.

2. The display panel according to claim 1, wherein: The first encapsulation structure further includes a second encapsulation layer and a third encapsulation layer, the second encapsulation layer and the third encapsulation layer are sequentially arranged on a side of the first encapsulation layer away from the light-emitting substrate; the second encapsulation layer is arranged on a side of the second encapsulation section away from the light-emitting substrate, and the second encapsulation layer extends from one side of the first encapsulation section to the second encapsulation section, and the bending area is located within the orthographic projection of the second encapsulation layer on the light-emitting substrate; the third encapsulation layer is arranged on a side of the second encapsulation layer away from the light-emitting substrate; Preferably, the first encapsulation layer comprises an inorganic material, the second encapsulation layer comprises an organic material, and the third encapsulation layer comprises an inorganic material.

3. The display panel according to claim 1, wherein: The first encapsulation structure further includes a second encapsulation layer, the second encapsulation layer includes a third encapsulation segment and a fourth encapsulation segment, the third encapsulation segment is arranged on a side of the first encapsulation segment away from the light-emitting substrate, the orthographic projection of the first encapsulation segment on the light-emitting substrate is located within the orthographic projection of the third encapsulation segment on the light-emitting substrate, the fourth encapsulation segment is arranged on a side of the first encapsulation segment away from the light-emitting substrate, the orthographic projection of the second encapsulation segment on the light-emitting substrate is located within the orthographic projection of the fourth encapsulation segment on the light-emitting substrate, and the third encapsulation segment and the fourth encapsulation segment are arranged at intervals; Preferably, the first encapsulation layer comprises an inorganic material, and the second encapsulation layer comprises an organic material.

4. The display panel according to claim 3, wherein: The first encapsulation structure further includes a third encapsulation layer, which is arranged on a side of the third encapsulation segment, the bending area, and the second encapsulation segment away from the light-emitting substrate, and the orthographic projections of the third encapsulation segment, the bending area, and the second encapsulation segment on the light-emitting substrate are located within the orthographic projection of the third encapsulation layer on the light-emitting substrate; Preferably, the third encapsulation layer comprises an inorganic material.

5. The display panel according to claim 1, wherein: The first encapsulation structure further includes a second encapsulation layer and a third encapsulation layer; the second encapsulation layer includes a third encapsulation segment and a fourth encapsulation segment, the third encapsulation segment is arranged on a side of the first encapsulation segment away from the light-emitting substrate, the orthographic projection of the first encapsulation segment on the light-emitting substrate is located within the orthographic projection of the third encapsulation segment on the light-emitting substrate, the fourth encapsulation segment is arranged on a side of the second encapsulation segment away from the light-emitting substrate, the orthographic projection of the second encapsulation segment on the light-emitting substrate is located within the orthographic projection of the fourth encapsulation segment on the light-emitting substrate, and the third encapsulation segment and the fourth encapsulation segment are arranged at intervals; the third encapsulation layer includes a fifth encapsulation segment and a sixth encapsulation segment, the fifth encapsulation segment is arranged on a side of the third encapsulation segment away from the light-emitting substrate, the orthographic projection of the third encapsulation segment on the light-emitting substrate is located within the orthographic projection of the fifth encapsulation segment on the light-emitting substrate, the sixth encapsulation segment is arranged on a side of the fourth encapsulation segment away from the light-emitting substrate, the orthographic projection of the fourth encapsulation segment on the light-emitting substrate is located within the orthographic projection of the sixth encapsulation segment on the light-emitting substrate, and the fifth encapsulation segment and the sixth encapsulation segment are arranged at intervals; Preferably, the first encapsulation layer comprises an inorganic material, the second encapsulation layer comprises an organic material, and the third encapsulation layer comprises an inorganic material.

6. The display panel according to claim 5, wherein: The display panel further includes a second packaging structure disposed on one side of the light-emitting substrate, and an orthographic projection of the second packaging structure on the light-emitting substrate overlaps with the bending area.

7. The display panel according to claim 2, 4 or 5, characterized in that: The first encapsulation structure further includes at least one fourth encapsulation layer disposed on the third encapsulation layer, and at least one fifth encapsulation layer disposed on the fourth encapsulation layer; Preferably, the fourth encapsulation layer comprises an organic material, and the fifth encapsulation layer comprises an inorganic material.

8. The display panel according to claim 3 or 5, characterized in that: The light-emitting substrate also includes a frame area arranged at the periphery of the first display area and the second display area, and a first blocking dam and a second blocking dam arranged at the frame area, the first blocking dam is arranged on a side of the second blocking dam close to the first display area and the second display area, and is respectively abutted against edges of the third encapsulation segment and the fourth encapsulation segment, and the orthographic projections of the first blocking dam and the second blocking dam on the light-emitting substrate are located within the orthographic projection of the third encapsulation layer on the light-emitting substrate.

9. A method for manufacturing a display panel, characterized in that: include: Manufacturing a light-emitting substrate, wherein the light-emitting substrate comprises a first display area, a second display area, and a bending area between the first display area and the second display area; A first encapsulation segment is formed on one side of the first display area, and a second encapsulation segment is formed on one side of the second display area. The first encapsulation segment and the second encapsulation segment are spaced apart between ends adjacent to each other.

10. A display device, characterized in that: A display panel comprising the display panel as claimed in any one of claims 1 to 8, or a display panel manufactured by the method for manufacturing a display panel as claimed in claim 9.

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