Self-emptying pipeline system, temperature adjusting system comprising same and semiconductor processing equipment

Abstract

The invention provides a self-emptying pipeline system and a temperature adjusting system and semiconductor processing equipment comprising the self-emptying pipeline system, and the self-emptying pipeline system comprises a main pipeline part in which fluid flows; one end of the first conveying pipe is connected to the main pipeline part, and the first conveying pipe is used for conveying the fluid; one end of the second conveying pipe is connected to the main pipeline part, and the second conveying pipe is used for conveying the fluid; and a discharge part which is disposed on the side wall of the first delivery pipe so as to communicate with the first delivery pipe, and which discharges the fluid in the main line part. Therefore, the fluid in the main pipeline part can be discharged through the discharge part without removing the first conveying pipe or the second conveying pipe, so that the main pipeline part can be emptied.

Description

Technical Field

[0001] The present invention relates to a self-emptying pipeline system, a temperature control system including the same, and semiconductor processing equipment, and particularly to a self-emptying pipeline system capable of emptying the fluid inside without disassembly, a temperature control system including the same, and semiconductor processing equipment. Background Art

[0002] With the development of the economy, the public's demand for various commodities is increasing, and the commodities on the market are becoming increasingly diverse. With the development of technology, various product production equipment and assembly lines have emerged. A large number of commodities have started industrial mass production. At the same time, the production process has become increasingly diversified. For example, products are produced and processed in various process environments such as high temperature, high pressure, low temperature, low pressure, inert gas atmosphere, and vacuum atmosphere. To match these production processes, multiple conveying systems are often equipped, such as a refrigerant circulation system for cooling, a pipeline system for conveying raw materials or waste in a fluid state, a pumping system for pressure conveying, a circulating filtration system for purification, etc., to provide the required production elements.

[0003] Taking the recently popular semiconductor processing field as an example, as the refinement degree of integrated circuits increases, the requirement for the process accuracy also increases. Therefore, the requirement for the process environment is becoming more and more stringent. When processing a substrate, a deposition process is used to deposit a required thin film on a wafer. The deposition process can be physical vapor deposition or chemical vapor deposition, etc. Generally, the deposition process is carried out by supplying a process gas to the substrate in a high-temperature and vacuum environment to deposit the required thin film. Therefore, it is necessary to use a vacuum pump and an exhaust pipeline to evacuate the process chamber, provide the process gas from a process gas source and supply it evenly to the substrate through a shower head, and heat the substrate alone with a heater to reach a specified temperature. These operations are all realized through various pipelines. At this time, in order to keep the process chamber and the substrate, etc. at the above-mentioned specified temperature, a temperature adjustment device also needs to be equipped. At the same time, the parts that do not need to be heated are cooled to avoid being interfered by high temperature or even damaged by heat. This operation is also realized through pipelines.

[0004] Taking the temperature adjustment device as an example of a pipeline, currently, devices such as heat exchangers are usually used for heat preservation or cooling. Fluids such as cooling water or antifreeze coolant flow inside these devices, and temperature adjustment operations including heat preservation and cooling can be carried out. Taking a water cooling system as an example, the cooling water enters the water cooling system from the water inlet of the water cooling system. During the process of flowing through the manifold inside the water cooling system, it absorbs the heat transmitted from the outside through the manifold, and then flows out from the water outlet of the water cooling system, thereby taking away the absorbed heat. The outflowing cooling water can be cooled and then re-entered into the water cooling system for use. In this way, the cooling operation can be effectively and continuously carried out.

[0005] A temperature regulation device including the above-mentioned water cooling system is generally designed to inject a temperature regulating fluid through an injection pipe and discharge the temperature regulating fluid through a discharge pipe. The injection pipe is connected to an external temperature regulating fluid source that provides a temperature regulating fluid meeting usage requirements (such as temperature, etc.) so as to continuously inject the temperature regulating fluid meeting usage requirements through the injection pipe, and the discharge pipe can also be connected to the temperature regulating fluid source to timely discharge the heated temperature regulating fluid to the temperature regulating fluid source, so that the temperature regulating fluid source adjusts the temperature of the heated temperature regulating fluid and re-injects it into the above-mentioned injection pipe, and so on in a cycle.

[0006] Although this design can automatically circulate the temperature regulating fluid to implement the temperature regulation operation, when replacing components such as pipes of the temperature regulation device, it is necessary to remove the component to be replaced from the temperature regulation device and install a new component. At this time, since the temperature regulation device contains the temperature regulating fluid and it is impossible to pre-discharge this temperature regulating fluid, during the disassembly process, this temperature regulating fluid leaks out from the disassembly site and pollutes the workshop environment. Therefore, workers need to spend extra time cleaning. In addition, if it drips onto other components or equipment, it may also cause damage to other components or equipment, thus requiring additional maintenance and other operations. More importantly, these fluids may be toxic or corrosive, endangering human health. For example, when the temperature regulating fluid is an antifreeze coolant, it contains ethylene glycol. Ethylene glycol is colorless and odorless, and is toxic and corrosive. When the antifreeze coolant leaks, workers may inadvertently come into contact with or even inhale ethylene glycol, resulting in poisoning and / or injury. If such an operation is carried out on a pipeline transporting dangerous goods such as highly toxic substances, strongly corrosive substances, radioactive substances, etc. and leakage occurs, the consequences will be unthinkable. Therefore, leakage should be avoided as much as possible.

[0007] On the other hand, when cleaning the interior of the temperature regulation device, in order to inject a cleaning fluid into the temperature regulation device, it is necessary to remove the components to be cleaned, or disassemble the injection pipe and the discharge pipe to open the internal space of the temperature regulation device. Therefore, there will also inevitably be a problem that the temperature regulating fluid leaks out from the disassembly site. In addition, after completing the disassembly operation and the cleaning operation, reassembly is also required. Therefore, the cleaning difficulty, time consumption, and steps are increased, increasing the burden on workers. Even if an experienced worker operates to shorten the time consumption, there is still a problem of labor cost. Therefore, a pipeline system that can drain and clean the internal pipeline of the temperature regulation device without disassembling the injection pipe and the discharge pipe is needed. Summary of the Invention

[0008] Technical Problem

[0009] The object of the present invention is to provide a self-draining pipeline system that can drain the interior without disassembly.

[0010] Another object of the present invention is to provide a self-emptying pipeline system that can clean the interior without disassembly.

[0011] Another object of the present invention is to provide a temperature control system including the above self-emptying pipeline system.

[0012] Another object of the present invention is to provide a semiconductor processing apparatus including the above self-emptying pipeline system.

[0013] Technical solution

[0014] An embodiment of the present invention provides a self-emptying pipeline system, which includes: a main pipeline part through which fluid flows internally; a first delivery pipe having one end connected to the main pipeline part for delivering fluid; a second delivery pipe having one end connected to the main pipeline part for delivering fluid; and a discharge part arranged on the side wall of the first delivery pipe in a manner communicating with the first delivery pipe for discharging the fluid in the main pipeline part. Thus, without removing the first delivery pipe or the second delivery pipe, the fluid in the main pipeline part can be discharged through the discharge part to empty the main pipeline part.

[0015] As an embodiment, the first delivery pipe is used to discharge the fluid in the main pipeline part to the outside, and the second delivery pipe is used to supply fluid to the main pipeline part. Thus, the fluid in the main pipeline part can be discharged smoothly in the flow state when flowing in the main pipeline part.

[0016] As an embodiment, the discharge part is arranged on the other end side of the first delivery pipe. Thus, the fluid in the main pipeline part and the first delivery pipe can be discharged more smoothly.

[0017] As an embodiment, the discharge part includes a discharge valve for controlling the opening and closing of the discharge part. Thus, the operation of discharging the fluid is easy to control.

[0018] As an embodiment, the discharge valve is arranged on the side of the discharge part close to the first delivery pipe. Thus, the amount of fluid in the first delivery pipe entering the discharge part in the state where the discharge valve is closed can be minimized.

[0019] As an embodiment, it may further include: a supply part arranged on the side wall of the second delivery pipe in a manner communicating with the second delivery pipe for supplying cleaning fluid. Thus, without removing the first delivery pipe or the second delivery pipe, cleaning fluid can be supplied into the main pipeline part through the supply part to clean the interior of the main pipeline part.

[0020] As an embodiment, the supply unit is disposed on one side of the other end of the second delivery pipe. Thus, the cleaning fluid can flow through the entire second delivery pipe to further clean the entire second delivery pipe.

[0021] As an embodiment, the supply unit includes a supply valve for controlling the opening and closing of the supply unit. Thus, it is easy to control the operation of supplying the cleaning fluid.

[0022] As an embodiment, the supply valve is disposed on the side of the supply unit close to the second delivery pipe. Thus, the amount of fluid in the second delivery pipe entering the supply unit in the state where the supply valve is closed can be minimized.

[0023] As an embodiment, the main pipeline portion includes a plurality of shunt pipelines. The first ends of the plurality of shunt pipelines communicate with the first delivery pipe, and the second ends of the plurality of shunt pipelines communicate with the second delivery pipe. First valves are respectively provided at the first ends of the respective shunt pipelines, and second valves are respectively provided at the second ends of the respective shunt pipelines. Thus, the plurality of shunt pipelines can be respectively opened and closed to selectively empty and clean the shunt pipelines.

[0024] Another embodiment of the present invention provides a temperature control system including the above self-emptying pipeline system. The main pipeline portion of the self-emptying pipeline system is made of a heat-conducting material and a temperature control fluid flows inside. Thus, a temperature control system capable of performing the above emptying operation and cleaning operation is provided.

[0025] Another embodiment of the present invention provides a semiconductor processing apparatus including the above self-emptying pipeline system. Thus, the semiconductor processing apparatus can perform the above emptying operation and cleaning operation.

[0026] As an embodiment, the main pipeline portion of the self-emptying pipeline system is made of a heat-conducting material and a temperature control fluid flows inside. Thus, the semiconductor processing apparatus is equipped with a temperature control system capable of performing the above emptying operation and cleaning operation.

[0027] Advantageous Effects

[0028] The present invention can provide a self-emptying pipeline system capable of emptying and cleaning the inside without disassembly, and a temperature control system and a semiconductor processing apparatus including the same. Description of the Drawings

[0029] Figure 1 is a schematic diagram of a cooling device in the prior art.

[0030] Figure 2Schematic diagram of a self - emptying pipeline system according to an embodiment of the present invention.

[0031] Figure 3 is Figure 2 a cross - sectional view of area A in

[0032] Figure 4 is Figure 2 a cross - sectional view of area B in

[0033] Figure 5 Schematic diagram of the internal structure of the main pipeline part according to an embodiment of the present invention.

[0034] Figure 6 Schematic diagram of a semiconductor processing device according to an embodiment of the present invention.

[0035] Reference numerals

[0036] C: Cooling device;

[0037] C20: Heat exchange part;

[0038] C21: Conduit;

[0039] C31: Coolant supply pipe;

[0040] C32: Coolant discharge pipe;

[0041] C40: Cooling device;

[0042] 100: Self - emptying pipeline system;

[0043] 100’: Temperature control system;

[0044] 2: Main pipeline part;

[0045] 2’: Temperature control part;

[0046] 21: Shunt pipeline;

[0047] 211: First shunt pipeline;

[0048] 212: Second shunt pipeline;

[0049] 221: First valve;

[0050] 222: Second valve;

[0051] 31: First delivery pipe;

[0052] 32: Second delivery pipe;

[0053] 4: Discharge part;

[0054] 41: Discharge valve;

[0055] 5: Supply Department;

[0056] 51: Supply Valve;

[0057] 6: Fluid Source;

[0058] 10: Semiconductor Processing Equipment;

[0059] 11: Chamber;

[0060] 12: Carrier Stage;

[0061] 13: Heater;

[0062] 14: Process Gas Source;

[0063] 15: Gas Duct;

[0064] 16: Showerhead;

[0065] W: Wafer. Detailed Embodiments

[0066] Next, with reference to the drawings of one or more embodiments of the present invention, a detailed description will be given of one or more embodiments of the present invention. Obviously, these one or more embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are also within the scope of protection of the present invention.

[0067] The terms used in the following embodiments are only for the purpose of explaining or interpreting specific embodiments, and are not intended to limit the scope of protection of the present invention. In addition, the singular forms used in the present invention, such as "a", "an", "the", "above-mentioned", "this" and "this one", are intended to include plural forms such as "one or more", unless there is a clear indication to the contrary in the context. It should also be understood that in the embodiments of the present invention, when using terms such as "one or more", "at least one", "more than one", etc., it is intended to include the cases of one, two and at least three.

[0068] In addition, when using terms such as "in one embodiment", "in some embodiments", "in one or more embodiments" in the specification of the present invention for explanation, it is intended that one or more embodiments of the present invention may include specific technical features described in conjunction with this embodiment. Therefore, the "in one embodiment", "in some embodiments", "in one or more embodiments" appearing in different parts of this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment or different embodiments, unless the specific technical features described in these embodiments cannot be used alone or combined.

[0069] In addition, in the present invention, when an element is described as "including", "comprising", or "having" another element, it is intended to be an open-ended limitation, that is, in addition to including the other element, the one element may further include other elements. When an element is described as "only including", "only comprising", "only having" another element or "consisting of" another element, it is intended to be a closed-ended limitation, that is, the one element does not include other elements except the other element. However, it should be noted that when the term "formed by" an element is used to illustrate the formation relationship between multiple elements, this term is not intended to be a closed-ended limitation, and it should be considered that the other element forms a part of the one element, and the one element may include other elements in addition to the other element.

[0070] It should be understood that when ordinal terms such as "first" and "second" are used to illustrate each element in this article, these ordinal terms are only used to distinguish one element from another element, and the terms such as "first" and "second" should not imply meanings such as primary-secondary relationship and sequence relationship. Without departing from the scope of the present invention, the first element may be labeled as the second element, and the second element may also be labeled as the first element.

[0071] In the present invention, when terms such as "on", "under", and "between" are used to illustrate the positional relationship between two or more elements, it means that one or more other elements may be further provided between the two or more elements, unless terms such as "exactly" and "adjacently" are used.

[0072] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can clearly and completely understand the present invention. When the description of well-known structures or features will unnecessarily obscure the gist of the present invention, the description of these well-known structures or features will be omitted.

[0073] One embodiment of the present invention provides a self-emptying pipeline system. Before describing the present invention in detail, the pipeline system in the prior art will be described first, and specifically, a cooling device will be taken as an example for description to clarify the technical problems that the present invention aims to solve.

[0074] Figure 1 is a schematic diagram of a cooling device in the prior art.

[0075] As Figure 1As shown, the cooling device C may include: a heat exchange part C20, provided with a plurality of conduits C21 for internally flowing coolant; a coolant supply pipe C31, connected to one end of the conduit C21 for providing coolant; a coolant discharge pipe C32, connected to the other end of the conduit C21 for discharging the heated coolant; and a cooling device C40, connected to the coolant discharge pipe C32 and the coolant supply pipe C31, for cooling the heated coolant received from the coolant discharge pipe C32 and supplying the cooled coolant to the heat exchange part C20 through the coolant supply pipe C31.

[0076] The entire cooling device C is in a closed loop and has no additional openings. Therefore, when replacing components in the cooling device C, the cooling device C is disassembled with coolant inside, resulting in leakage of coolant from the disassembly site. At the same time, impurities, dirt, etc. inside the cooling device C also leak out, causing environmental pollution. Moreover, when it drips onto other devices, it may also cause damage to other devices. More importantly, these substances may be toxic or corrosive, posing a risk of poisoning or injury to workers who come into contact with or even inhale these substances.

[0077] On the other hand, when cleaning the inside of the cooling device C, the cooling device C must be disassembled. For example, the coolant supply pipe C31 and the coolant discharge pipe C32 are disassembled to open the internal space of the cooling device C. At this time, disassembly operations are also required, so the above problems also exist. In addition, when cleaning in this way, the operation is very cumbersome, time-consuming, and requires reassembly later. Moreover, the cumbersome operation and increased time consumption also increase the risk of operation errors.

[0078] In view of the above technical problems existing in the prior art, the inventors of the present invention conducted in-depth research on pipeline systems in various fields and finally developed a preferred technical solution, thus completing the present invention.

[0079] An embodiment of the present invention provides a self-emptying pipeline system 100, which can be, for example, a water heating system for heating, a water cooling system for cooling, or a circulating purification device for facilities such as fish ponds and bathtubs. On this basis, the self-emptying pipeline system 100 further includes a structure for self-emptying.

[0080] Figure 2 It is a schematic diagram of the self-emptying pipeline system of an embodiment of the present invention.

[0081] Refer to Figure 2, the self-draining pipeline system 100 may include: a main pipeline section 2 through which a fluid flows internally; a first delivery pipe 31 having one end connected to the main pipeline section 2 for delivering the fluid; a second delivery pipe 32 having one end connected to the main pipeline section 2 for delivering the fluid; and a discharge section 4 disposed on the side wall of the first delivery pipe 31 in communication with the first delivery pipe 31 for discharging the fluid in the main pipeline section 2.

[0082] Wherein, the fluid may be a gas or a liquid as long as it can flow in the main pipeline section 2, and the present invention is not limited thereto. Additionally, when the fluid is recycled within the self-draining pipeline system 100, the other ends of the first delivery pipe 31 and the second delivery pipe 32 may be respectively connected to a first fluid port (not shown) and a second fluid port (not shown) of an external fluid source 6, so as to supply the fluid to the main pipeline section 2 through one of the first delivery pipe 31 and the second delivery pipe 32, and discharge the fluid used in the main pipeline section 2 to the fluid source 6 through the other of the first delivery pipe 31 and the second delivery pipe 32. At this time, a first fluid valve (not shown) and a second fluid valve (not shown) may be respectively provided at the first fluid port and the second fluid port to respectively control the opening and closing of the first fluid port and the second fluid port, so as to control the operation of supplying the fluid to the main pipeline section 2 and the operation of receiving the fluid from the main pipeline section 2. Figure 2 This is such an example shown. When the fluid is used only once, one of the other ends of the first delivery pipe 31 and the second delivery pipe 32 may be connected to a fluid supply port (not shown) of the fluid source 6, and the other of the other ends of the first delivery pipe 31 and the second delivery pipe 32 may be connected to a fluid receiving port (not shown) of another provided fluid waste storage tank or the like (not shown). At this time, a fluid supply valve (not shown) and a fluid receiving valve (not shown) may be respectively provided at the fluid supply port and the fluid receiving port to respectively control the opening and closing of the fluid supply port and the fluid receiving port, so as to control the operation of supplying the fluid to the main pipeline section 2 and the operation of discharging the fluid from the main pipeline section 2. Additionally, the above connections may adopt various methods such as threaded connection and flange connection as long as they can be sealed and firmly connected, and preferably are detachably connected for easy maintenance and replacement, and the present invention is not limited thereto.

[0083] Hereinafter, the discharge section 4 of the present invention will be described in detail.

[0084] As described above, the discharge part 4 is arranged on the side wall of the first conveying pipe 31 in a way that it communicates with the first conveying pipe 31. Thus, an additional outlet is provided. Therefore, when it is necessary to replace components in the main pipeline part 2 and disassemble the main pipeline part 2, or remove the first conveying pipe 31 or the second conveying pipe 32 from the main pipeline part 2, the fluid in the main pipeline part 2 can be discharged by opening the discharge part 4, so as to empty the main pipeline part 2 before the disassembly operation, thereby avoiding problems such as fluid leakage during the disassembly operation and resulting environmental pollution, damage to other equipment, and harm to human health. In addition, during the process of emptying the main pipeline part 2, impurities, dirt, etc. in the main pipeline part 2 are also discharged together with the fluid. Therefore, it can also play a certain cleaning role.

[0085] As a specific example of the discharge part 4, the discharge part 4 can be a bypass extending outward from the side wall of the first conveying pipe 31, which can form a T shape with the first conveying pipe 31. Or, according to the actual installation position and installation angle, it can be configured at an angle other than 90 degrees with the first conveying pipe 31 to ensure that the bypass extends horizontally or slopes downward, so that the fluid in the main pipeline part 2 can be discharged more smoothly.

[0086] As a further specific example, the discharge part 4 can be further connected with pipes (not shown), such as hoses, steel pipes, etc. on the basis of the bypass, to divert the discharged fluid to facilities (not shown), such as storage tanks or storage troughs for recovery or disposal. In addition, the discharge part 4 can be further connected with a pump (not shown) on the basis of the bypass to suck the fluid in the main pipeline part 2, thereby improving the discharge efficiency. Among them, the pipes, pumps, etc. are preferably detachably connected for easy maintenance and replacement.

[0087] As a preferred implementation manner, one end of the first conveying pipe 31 is connected to the main pipeline part 2, and the discharge part 4 can be arranged on one side of the other end of the first conveying pipe 31, so that the whole first conveying pipe 31 is located on the side of the main pipeline part 2 relative to the discharge part 4, that is, both the first conveying pipe 31 and the main pipeline part 2 are located on the same side of the discharge part 4. Thus, the fluid in the first conveying pipe 31 and the fluid in the main pipeline part 2 can be discharged more smoothly along the same path, thereby improving the discharge efficiency. In addition, by arranging the discharge part 4 on one side of the other end of the first conveying pipe 31, the discharge part 4 can be kept away from the main pipeline part 2, thereby preventing interference between the discharge part 4 and the main pipeline part 2 and components adjacent to the main pipeline part 2.

[0088] On the contrary, when the discharge part 4 is arranged on one side of the end of the first delivery pipe 31, the first delivery pipe 31 and the main pipeline part 2 are respectively located on both sides of the discharge part 4. At this time, when the discharge part 4 is opened, the fluid in the first delivery pipe 31 and the fluid in the main pipeline part 2 gather and collide with each other from both sides of the discharge part 4 respectively, so that they cannot be discharged smoothly, reducing the discharge efficiency.

[0089] Hereinafter, with reference to Figure 3 , the discharge part 4 will be described in more detail.

[0090] Figure 3 is Figure 2 a cross-sectional view of area A in

[0091] As Figure 3 shown, as an embodiment, the discharge part 4 may include a discharge valve 41 for controlling the opening and closing of the discharge part 4. Thus, it is easy to control the operation of discharging the fluid.

[0092] Specifically, the discharge valve 41 may be a gate valve, a globe valve, a diaphragm valve, a cock valve, a ball valve, a butterfly valve, etc., as long as it can control the opening and closing of the discharge part 4, and the present invention is not limited thereto. In addition, the operation mode of the discharge valve 41 may include manual operation and automatic operation. When manual operation is adopted, the discharge valve 41 may have a switch that can be rotated or toggled. When automatic operation is adopted, the discharge valve 41 may have a control unit and a driving unit. The discharge valve 41 is preferably operable both manually and automatically. At this time, the discharge valve 41 may have all the components for manual operation and automatic operation described above. For example, the above switch can be manually controlled by being rotated or toggled, and can also be automatically controlled by the control unit and the driving unit.

[0093] As a preferred embodiment, the discharge valve 41 may be arranged on the side of the discharge part 4 close to the first delivery pipe 31. Thus, the amount of fluid in the first delivery pipe 31 entering the discharge part 4 in the state where the discharge valve 41 is closed can be minimized.

[0094] As Figure 3As shown, there may be a certain distance between the discharge valve 41 and the first delivery pipe 31, thus creating a space. When it is necessary to discharge fluid through the discharge portion 4 and the discharge valve 41 is opened, the fluid in the first delivery pipe 31 flows through the discharge valve 41 via this space and is discharged. When the discharge valve 41 is in the closed state, this space constitutes an interference area extending laterally from the first delivery pipe 31, causing the fluid to enter this space when flowing in the first delivery pipe 31 and collide with the wall surface to form a turbulent flow, thereby interfering with the normal flow of the fluid in the first delivery pipe 31 and reducing the overall working efficiency of the self-draining pipeline system 100. When the discharge valve 41 is configured to be far from the first delivery pipe 31, the interference area increases, resulting in a large amount of fluid flowing into the interference area, which will not only form a larger turbulent flow but also cause these fluids to be trapped in the interference area and unable to participate in the cycle normally, thereby further reducing the overall working efficiency of the self-draining pipeline system 100.

[0095] Therefore, the discharge valve 41 should be configured as close as possible to the first delivery pipe 31 to shorten the distance between the discharge valve 41 and the first delivery pipe 31, thereby reducing or even eliminating the interference area. Taking the discharge valve 41 as a gate valve as an example, preferably, it can be configured in such a way that the gate plate of the gate valve matches the shape of the inner surface of the first delivery pipe 31, so that when the discharge valve 41 is closed, the first delivery pipe 31 forms a smooth inner wall, thereby avoiding the formation of the interference area, so that the fluid can flow smoothly in the first delivery pipe 31, thereby ensuring the overall working efficiency of the self-draining pipeline system 100.

[0096] As described above, the discharge portion 4 of the present invention has been described in detail. It can be seen that the self-draining pipeline system 100 of the present invention includes the discharge portion 4, so that the main pipeline portion 2 can be drained first before replacing the components in the main pipeline portion 2, that is, by opening the discharge portion 4, the fluid in the main pipeline portion 2 can be smoothly discharged, and the impurities, dirt, etc. accumulated in the main pipeline portion 2 can also be discharged together with the temperature-adjusting fluid. Therefore, problems such as fluid leakage during the disassembly operation, resulting environmental pollution, damage to other equipment, and harm to human health can be avoided.

[0097] Hereinafter, another embodiment of the present invention will be described in detail.

[0098] Refer again to Figure 2, the self-emptying pipeline system 100 of the present invention may further include: a supply part 5, which is arranged on the side wall of the second conveying pipe 32 in a way that communicates with the second conveying pipe 32, and is used for supplying a cleaning fluid. Thus, the supply part 5 provides an additional opening on the second conveying pipe 32. Therefore, when cleaning the inside of the main pipeline part 2, only by opening the supply part 5 can the cleaning fluid be supplied into the main pipeline part 2 to clean the inside of the main pipeline part 2, so there is no need to remove the first conveying pipe 31 or the second conveying pipe 32 as in the past to open the internal space of the main pipeline part 2. Therefore, the operation is convenient, time-saving and labor-saving, and problems such as fluid leakage and resulting environmental pollution, damage to other equipment and harm to human health are also avoided.

[0099] As a specific example of the supply part 5, the supply part 5 may be a bypass extending outward from the side wall of the second conveying pipe 32, which can form a T shape with the second conveying pipe 32, or can form an angle other than 90 degrees with the second conveying pipe 32 according to the actual assembly position and assembly angle. For example, the cleaning fluid is supplied in a direction along the second conveying pipe 32 and extending toward the main pipeline part 2, so that the cleaning fluid can flow more smoothly toward the main pipeline part 2.

[0100] As a further specific example, the supply part 5 may be further connected with pipes (not shown), such as hoses, steel pipes, etc. on the basis of the bypass, and is connected to a cleaning fluid source (not shown) through this pipe. Among them, the pipe and the cleaning fluid source are preferably detachably connected for easy maintenance and replacement.

[0101] On the other hand, the cleaning fluid may be a liquid such as a cleaning agent, water, or a gas such as pressurized air. According to different cleaning fluids, corresponding cleaning fluid sources can be configured. Taking the use of pressurized gas as an example, at this time, a pressurized air source can be connected, and the pressurized air source may include a compressor, a gas storage tank, a gas valve, etc. At this time, the supply part 5 can blow pressurized gas into the second conveying pipe 32, and the pressurized gas enters the main pipeline part 2 along the second conveying pipe 32 and blows and washes the inside of the main pipeline part 2, and then flows out along the first conveying pipe 31 and is discharged outward through the discharge part 4. During this process, the fluid, impurities, dirt, etc. in the main pipeline part 2 are blown out of the main pipeline part 2 by the cleaning fluid and discharged from the discharge part 4. At the same time, the fluid, impurities, dirt, etc. in the first conveying pipe 31 and the second conveying pipe 32 will also be discharged together.

[0102] In addition, multiple cleaning fluids can be used in combination. For example, first, cleaning is performed using a cleaning agent, then rinsing is carried out using water, and finally, blowing is done using pressurized air. For this purpose, the supply unit 5 can be connected to multiple corresponding cleaning fluid sources to provide multiple cleaning fluids. In addition, the supply unit 5 can be configured with a pump to adjust the pressure of the supplied cleaning fluid. The multiple cleaning fluid sources can be respectively configured with control valves to selectively supply different cleaning fluids.

[0103] As a preferred embodiment, one end of the second delivery pipe 32 is connected to the main pipeline portion 2, and the supply unit 5 can be arranged on one side of the other end of the second delivery pipe 32, so that the entire second delivery pipe 32 is located on the side of the main pipeline portion 2 relative to the supply unit 5, that is, both the second delivery pipe 32 and the main pipeline portion 2 are located on the same side of the supply unit 5. Thereby, it is possible to make the cleaning fluid flow through the entire second delivery pipe 32, so that while cleaning the main pipeline portion 2, the cleaning of the entire second delivery pipe 32 is also taken into account, improving the overall cleaning efficiency and cleaning effect. In addition, by arranging the supply unit 5 on one side of the other end of the second delivery pipe 32, the supply unit 5 can be kept away from the main pipeline portion 2, thereby preventing interference between the supply unit 5 and the main pipeline portion 2 as well as components adjacent to the main pipeline portion 2.

[0104] On the contrary, when the supply unit 5 is arranged on one side of the one end of the second delivery pipe 32, the second delivery pipe 32 and the main pipeline portion 2 are respectively located on both sides of the supply unit 5. At this time, when the supply unit 5 is opened, the cleaning fluid flows from the supply unit 5 to the one end and the other end of the second delivery pipe 32 respectively. The cleaning fluid flowing to the one end of the second delivery pipe 32 can clean the main pipeline portion 2, but the cleaning fluid flowing to the other end of the second delivery pipe 32 cannot participate in the cleaning of the main pipeline portion 2 and cannot be discharged through the discharge portion 4. Therefore, not only the cleaning efficiency and cleaning effect are reduced, but also the waste of cleaning fluid is caused.

[0105] Hereinafter, with reference to Figure 4 , the supply unit 5 will be described in more detail.

[0106] Figure 4 is Figure 2 a cross-sectional view of region B in

[0107] As Figure 4 shown, as an embodiment, the supply unit 5 can include a supply valve 51, and the supply valve 51 is used to control the opening and closing of the supply unit 5. Thereby, it is easy to control the operation of supplying the cleaning fluid.

[0108] Specifically, the supply valve 51 can be a gate valve, a stop valve, a diaphragm valve, a plug valve, a ball valve, a butterfly valve, etc., as long as it can control the opening and closing of the supply part 5, and the present invention is not limited thereto. In addition, the operation mode of the supply valve 51 can include manual operation and automatic operation. When manual operation is adopted, the supply valve 51 can have a switch that can be rotated or turned, and when automatic operation is adopted, the supply valve 51 can have a control unit and a drive unit. The supply valve 51 is preferably both manually and automatically operable. In this case, the supply valve 51 can have all the above-mentioned components for manual operation and automatic operation. For example, the above-mentioned switch can be rotated or turned and manually controlled, and can also be automatically controlled by a control unit and a drive unit.

[0109] As a preferred embodiment, the supply valve 51 may be disposed on a side of the supply unit 5 close to the second delivery pipe 32. Thus, the amount of fluid in the second delivery pipe 32 entering the supply unit 5 when the supply valve 51 is closed can be minimized.

[0110] like Figure 4 As shown, the supply valve 51 may be separated from the second delivery pipe 32 by a certain distance, thereby generating a space. When the supply valve 51 is opened when it is necessary to supply a clean fluid, the clean fluid flows through the supply valve 51 and is supplied to the second delivery pipe 32 via the space. When the supply valve 51 is in a closed state, the space constitutes an interference area extending laterally from the second delivery pipe 32, causing the fluid to enter the space and collide with the wall when flowing in the second delivery pipe 32 to form turbulence, thereby interfering with the normal flow of the fluid in the second delivery pipe 32 and reducing the overall working efficiency of the self-emptying pipeline system 100. When the supply valve 51 is configured to be away from the second delivery pipe 32, the interference area increases, causing a large amount of fluid to flow into the interference area, which not only forms a larger turbulence, but also causes these fluids to be trapped in the interference area and unable to participate in the circulation normally, thereby further reducing the overall working efficiency of the self-emptying pipeline system 100.

[0111] Therefore, the supply valve 51 should be arranged as close to the second delivery pipe 32 as possible to shorten the distance between the supply valve 51 and the second delivery pipe 32, thereby reducing or even eliminating the interference area. Taking the supply valve 51 as a gate valve as an example, preferably, the gate plate of the gate valve can be arranged in a manner that matches the shape of the inner surface of the second delivery pipe 32, so that when the supply valve 51 is closed, the second delivery pipe 32 forms a smooth inner wall, thereby avoiding the formation of the interference area, so that the fluid flows smoothly in the second delivery pipe 32, thereby ensuring the overall working efficiency of the self-emptying pipeline system 100.

[0112] Above, the supply unit 5 of the present invention has been described in detail. It can be seen that the self-emptying pipeline system 100 of the present invention includes the supply unit 5, so that the interior can be cleaned without disassembly. That is, only by supplying a cleaning fluid to the second delivery pipe 32 through the supply unit 5 can the interior of the main pipeline unit 2 be cleaned to remove the fluid remaining in the main pipeline unit 2 and impurities, dirt, etc. accumulated in the main pipeline unit 2.

[0113] Hereinafter, another embodiment of the present invention will be described in detail.

[0114] Figure 5 It is a schematic diagram of the internal structure of the main pipeline unit 2 of an embodiment of the present invention.

[0115] Referring to Figure 5 , the main pipeline unit 2 may include a plurality of shunt pipelines 21. The first ends of the plurality of shunt pipelines 21 are communicated with the first delivery pipe 31, and the second ends of the plurality of shunt pipelines 21 are communicated with the second delivery pipe 32. First valves 221 are respectively arranged at the first ends of the respective shunt pipelines 21, and second valves 222 are respectively arranged at the second ends of the respective shunt pipelines 21. Thus, the plurality of shunt pipelines 21 can be opened and closed respectively to selectively empty or clean the shunt pipelines 21.

[0116] Specifically, when all the first valves 221 and second valves 222 are opened, the plurality of shunt pipelines 21 are all in an open state. At this time, the plurality of shunt pipelines 21 can be emptied and cleaned. For example, the discharge part 4 is opened to discharge the fluid, impurities, dirt, etc. in the plurality of shunt pipelines 21, and the supply unit 5 is opened to supply a cleaning fluid to the plurality of shunt pipelines 21. When the first valves 221 and second valves 222 of a certain or some of the plurality of shunt pipelines 21 are selectively opened and the first valves 221 and second valves 222 of the remaining shunt pipelines 21 are closed, the certain or some of the shunt pipelines 21 can be selectively emptied and cleaned. For example, the discharge part 4 is opened to discharge the fluid, impurities, dirt, etc. in the certain or some of the shunt pipelines 21, and the supply unit 5 is opened to supply a cleaning fluid to the certain or some of the shunt pipelines 21. In addition, when only the temperature-adjusting fluid in the main pipeline unit 2 needs to be discharged, the first valves 221 can also be opened only and the second valves 222 can be closed, and the discharge part 4 is opened to discharge the fluid, impurities, dirt, etc. in the plurality of shunt pipelines 21.

[0117] Although Figure 5It is shown that the main pipeline part 2 includes four shunt pipelines 21 that are arranged in parallel and straight with the same diameter, but the number, distribution, shape, size, material, etc. of the shunt pipelines 21 can be deformed according to actual needs, and the present invention is not limited thereto.

[0118] On the other hand, as a preferred embodiment, the first delivery pipe 31 can be used to discharge the fluid in the main pipeline part 2, and the second delivery pipe 32 can be used to supply fluid to the main pipeline part 2. At this time, when the discharge part 4 is opened, the temperature-controlled fluid in the main pipeline part 2 flows to the discharge part 4 communicated with the first delivery pipe 31 and is discharged in the flow state (including speed and direction) when flowing in the main pipeline part 2. Therefore, the temperature-controlled fluid can be discharged more quickly and smoothly by virtue of the original flow state of the fluid, and the cleaning fluid flowing in from the supply part 5 flows in the same flow direction as the fluid, which is conducive to washing out the fluid, impurities, dirt, etc. in the main pipeline part 2 together. In addition, the operation of discharging the fluid and the operation of supplying the cleaning fluid can be carried out simultaneously, thereby improving the evacuation efficiency and cleaning efficiency at the same time.

[0119] On the contrary, when the first delivery pipe 31 is used to supply fluid to the main pipeline part 2 and the second delivery pipe 32 is used to discharge the fluid in the main pipeline part 2, the supply direction of the cleaning fluid and the discharge direction of the fluid are both opposite to the flow direction of the fluid in the main pipeline part 2 when flowing in the main pipeline part 2. Therefore, it is neither conducive to discharging the fluid nor to supplying the cleaning fluid.

[0120] The self-emptying pipeline system 100 of the present invention has been described in detail above. Hereinafter, another embodiment of the present invention will be described in detail. The content repeated in the description of the self-emptying pipeline system 100 of the present invention above will be omitted, and the specific applications of the self-emptying pipeline system 100 in the temperature control system and semiconductor processing equipment will be emphasized and described in detail.

[0121] Another embodiment of the present invention provides a temperature control system 100', which can be, for example, a heat exchange device, and can be cooled by using gases such as cold vapor or liquids such as coolant (for example, process cooling water, ethylene glycol, etc.), and can be a heating device, a heat preservation device or a cooling device that operates based on heat exchange. On this basis, the temperature control system 100' can further include the self-emptying pipeline system 100 of the present invention. At this time, the main pipeline part 2 of the self-emptying pipeline system 100 is made of a heat-conducting material, and a temperature-controlled fluid flows inside. That is, the main pipeline part 2 actually serves as a temperature control part 2' in the temperature control system 100', and plays a role of exchanging heat with the outside by using the temperature-controlled fluid flowing inside. Thus, a temperature control system capable of performing the above-mentioned evacuation operation and cleaning operation is provided.

[0122] At this time, the fluid source 6 can correspondingly provide the temperature-controlled fluid. When the temperature control system 100' is used for cooling, the temperature-controlled fluid can be process cooling water, antifreeze coolant, cold steam, etc. The fluid source 6 can cool the temperature-controlled fluid using, for example, Freon. When the temperature control system 100' is used for heating, the temperature-controlled fluid can be water, hot gas, etc. The fluid source 6 can heat the temperature-controlled fluid using, for example, an electric heating device, as long as it can provide a temperature-controlled fluid that meets the usage requirements (e.g., temperature), and the present invention is not limited thereto.

[0123] Although not described in detail, the temperature control system 100' of course includes the shunt pipe 21, the first valve 221, the second valve 222, the first delivery pipe 31, the second delivery pipe 32, the discharge part 4, the discharge valve 41, the supply part 5, the supply valve 51, etc. included in the self-emptying pipeline system 100 described above. Therefore, it can of course perform the emptying operation and cleaning operation as the self-emptying pipeline system 100 of the present invention, and can also achieve the same effect, and will not be elaborated here too much.

[0124] Although the application of the self-emptying pipeline system 100 of the present invention in the temperature control system 100' has been described in detail above, the present invention is not limited thereto. The self-emptying pipeline system 100 can also be applied to devices equipped with a pipeline system including a water heating system, a circulating filtration system, etc. Further, taking the circulating filtration system as an example, at this time, a filter (not shown) can be further provided in the main pipeline part 2 of the self-emptying pipeline system 100. That is, the main pipeline part 2 actually serves as a filtration part in the circulating filtration system, and functions to filter and purify the fluid flowing inside using the filter. At this time, the fluid source 6 can correspondingly provide the fluid that needs to be purified. In addition, the circulating filtration system of course includes the shunt pipe 21, the first valve 221, the second valve 222, the first delivery pipe 31, the second delivery pipe 32, the discharge part 4, the discharge valve 41, the supply part 5, the supply valve 51, etc. included in the self-emptying pipeline system 100. Therefore, it can of course perform the emptying operation and cleaning operation as the self-emptying pipeline system 100, and can also achieve the same effect.

[0125] Another embodiment of the present invention provides a semiconductor processing apparatus 10. The semiconductor processing apparatus 10 can be, for example, a thin film deposition apparatus, a lithography apparatus, an etching apparatus, etc., as long as it is a device equipped with a pipeline system, and the present invention is not limited thereto. Hereinafter, taking the semiconductor processing apparatus 10 as a chemical vapor deposition apparatus and the self-emptying pipeline system 100 applied thereto as the temperature control system 10' as an example for description.

[0126] Figure 6 It is a schematic diagram of a semiconductor processing apparatus according to an embodiment of the present invention.

[0127] Referring to Figure 6 , the semiconductor processing apparatus 10 may include: a chamber 11 for providing a space for performing a deposition operation; a stage 12 disposed on the bottom surface of the chamber 11 for placing a wafer W; a heater 13 disposed below the stage 12 for heating the wafer W placed on the stage 12; a process gas source 14 for supplying a process gas; a gas conduit 15 connecting the process gas source 14 and the chamber 11 for transporting the process gas from the process gas source 14 to the chamber 11; and a showerhead 16 connected to an end of the gas conduit 15 connected to the chamber 11 for uniformly supplying the process gas to the wafer W placed on the stage 12.

[0128] Chemical vapor deposition is performed at a specified temperature. Therefore, both the wafer W and the process gas are heated to an appropriate temperature to smoothly deposit a desired thin film. The heated process gas is supplied to the wafer W through the showerhead 16. The temperature of the showerhead 16 may interfere with the process gas. Therefore, it is necessary to adjust the temperature of the showerhead 16 to an appropriate value. In addition, the heat generated by the heater 13 not only heats the wafer W placed on the stage 12, but also causes the portion of the chamber 11 adjacent to the heater 13 to be heated and warmed up, which may interfere with the normal operation of the chamber 11 and even may affect the service life of the chamber 11. Therefore, it is necessary to provide a temperature adjustment device to adjust the temperatures of components such as the showerhead 16 and the heater 13.

[0129] Generally, the heat exchange portion of the temperature adjustment device is disposed inside components such as a showerhead and a heater to adjust the temperature here, and receives a temperature control fluid from the outside and discharges the used temperature control fluid to the outside through pipes connected to both ends thereof to circulate the temperature control fluid inside it, so as to continuously perform the operation of adjusting the temperature. The pipes are usually connected to an external temperature control fluid supply device and form a closed loop as a whole without additional openings.

[0130] When it is necessary to replace components such as the showerhead and the heater that are combined with the temperature adjustment device, it is necessary to disassemble the temperature adjustment device to separate components such as the showerhead and the heater. Since the temperature adjustment device has no additional openings to discharge the temperature control fluid inside it to the outside, during the above-mentioned disassembly operation, problems such as leakage of the temperature control fluid and resulting environmental pollution, damage to other equipment, and harm to human health will occur.

[0131] When it is necessary to clean the interior of the temperature regulating device, a disassembling operation is also required to open the interior space of the temperature regulating device. For example, the pipe is removed from the temperature regulating fluid supply device to open the interior space of the temperature regulating device. Therefore, there will inevitably be the same problems as the above-mentioned disassembling operation. Moreover, when cleaning in this way, the operation is very cumbersome, time-consuming, and requires reassembly later. Moreover, the cumbersome operation and increased time consumption will also increase the risk of operation errors.

[0132] For this reason, the semiconductor processing equipment 10 of the present invention further includes the temperature regulating system 100' of the present invention, so that the above-mentioned technical problems can be solved.

[0133] Refer again to Figure 6 , the temperature regulating part 2' of the temperature regulating system 100' (that is, the main pipeline part 2 made of heat-conducting material and with temperature regulating fluid flowing inside) may include: a first shunt pipeline 211, arranged inside the shower head 16, with temperature regulating fluid flowing inside, for regulating the temperature of the shower head 16; and a second shunt pipeline 212, arranged below the heater 13, with temperature regulating fluid flowing inside, for regulating the temperature of the heater 13. Although not described in detail, the temperature regulating system 100' of course includes the first valve 221, the second valve 222, the first delivery pipe 31, the second delivery pipe 32, the discharge part 4, the discharge valve 41, the supply part 5, the supply valve 51, etc. described above. Therefore, the above-mentioned evacuation operation and cleaning operation can of course be carried out, and the same effect can also be achieved, so no more details will be given here.

[0134] The first shunt pipeline 211 adjusts the temperature of the shower head 16 by using the temperature regulating fluid flowing inside, so that the process gas is supplied to the wafer W at a specified temperature. The temperature of the temperature regulating fluid in the first shunt pipeline 211 can be adjusted by the temperature regulating part 2' through the external fluid source 6 connected by the first delivery pipe 31 and the second delivery pipe 32. When it is necessary to increase the temperature of the shower head 16, the fluid source 6 can provide temperature regulating fluid with a temperature higher than that of the shower head 16. When it is necessary to decrease the temperature of the shower head 16, the fluid source 6 can provide temperature regulating fluid with a temperature lower than that of the shower head 16. When it is necessary to maintain the temperature of the shower head 16, the fluid source 6 can provide temperature regulating fluid with the same or similar temperature as the shower head 16, as long as the shower head 16 can be adjusted to an appropriate temperature. The present invention is not limited thereto.

[0135] The second diversion pipeline 212 also adjusts the temperature of the heater 13 in the same manner as the first diversion pipeline 211. For example, a temperature-regulating fluid with a temperature lower than that of the heater 13 can be provided by the fluid source 6 to appropriately reduce the temperature of the lower part of the heater 13 and the part of the chamber 11 adjacent to the heater 13, so as to prevent high temperature from interfering with the normal operation of the chamber 11 and even affecting the service life of the chamber 11.

[0136] On the other hand, when a component in the semiconductor processing equipment 10 needs to be replaced, taking the replacement of the shower head 16 as an example, the first valves 221 and the second valves 222 of the first diversion pipeline 211 and the second diversion pipeline 212 can be opened to make both the first diversion pipeline 211 and the second diversion pipeline 212 open, or the first valves 221 and the second valves 222 of the first diversion pipeline 211 can be opened while the first valves 221 and the second valves 222 of the second diversion pipeline 212 are closed to make only the first diversion pipeline 211 open, or the first valve 221 of the first diversion pipeline 211 can be opened while the second valve 222 of the first diversion pipeline 211 and the first valves 221 and the second valves 222 of the second diversion pipeline 212 are closed to make only the end of the first diversion pipeline 211 connected to the first diversion pipeline 211 open, so as to discharge the temperature-regulating fluid in the first diversion pipeline 211 through the discharge part 4 before disassembling the shower head 16, thereby avoiding problems such as leakage of the temperature-regulating fluid during the disassembly operation and resulting environmental pollution, damage to other equipment, and harm to human health.

[0137] In addition, when cleaning the inside of the temperature-regulating system 100' in the semiconductor processing equipment 10, for example, the diversion pipeline 21 to be cleaned can be selected first and its first valve 221 and second valve 222 can be kept open. At the same time, the first valves 221 and second valves 222 of the other diversion pipelines 21 that do not need to be cleaned can be kept closed. Then, the discharge valve 41 can be opened to open the discharge part 4 to discharge the temperature-regulating fluid, impurities, dirt, etc. in the diversion pipeline 21 to be cleaned to the outside. At the same time, the supply valve 51 can be opened to open the supply part 5 to supply a cleaning fluid such as pressurized gas into the diversion pipeline 21 to be cleaned for cleaning. The cleaning fluid that has completed cleaning is also discharged to the outside through the discharge part 4.

[0138] After the cleaning is completed, the discharge valve 41 and the supply valve 51 are closed, and the temperature-regulating fluid is supplied to the temperature-regulating part 2' again, and the temperature-regulating operation can be carried out again.

[0139] As described above, the embodiment in which the temperature adjustment unit 2' includes two flow splitting pipelines 21, and the two flow splitting pipelines 21 respectively adjust the temperatures of the shower head 16 and the heater 13 in one chamber 11 of the semiconductor processing equipment 10 has been described, but the present invention is not limited thereto. The semiconductor processing equipment 10 may also be a multi-chamber semiconductor processing equipment such as a double-chamber or triple-chamber semiconductor processing equipment (not shown). At this time, flow splitting pipelines 21 may be added to adjust the temperatures of all chambers. Or, according to actual situations, a plurality of flow splitting pipelines 21 may be used to adjust the temperature of one component (for example, a shower head, a heater, etc.), or one flow splitting pipeline 21 may be used to adjust the temperatures of a plurality of components (for example, a shower head, a heater, etc.), as long as the purpose of temperature adjustment can be achieved.

[0140] It can be seen that the semiconductor processing equipment 10 of the present invention includes the self-emptying pipeline system 100 of the present invention. Therefore, the self-emptying pipeline system 100 can be emptied and cleaned without disassembly.

[0141] The embodiments of the present invention have been described above, but this is only for helping to comprehensively understand the present invention. The present invention is not limited thereto, and those skilled in the art can make various modifications and deformations from these descriptions. Therefore, the technical idea of the present invention is not limited to the above embodiments, and the appended claims and their equivalent or equivalent deformations all belong to the scope of the present invention.

Claims

1. A self-emptying pipeline system, characterized in that, Comprising: A main pipeline section (2) with fluid flowing inside; A first delivery pipe (31) having one end connected to the main pipeline section (2) for delivering the fluid; A second delivery pipe (32) having one end connected to the main pipeline section (2) for delivering the fluid; And A discharge section (4) arranged on the side wall of the first delivery pipe (31) in a manner communicating with the first delivery pipe (31) for discharging the fluid in the main pipeline section (2).

2. The self-emptying pipeline system according to claim 1, characterized in that, The first delivery pipe (31) is used to discharge the fluid in the main pipeline section (2) outward, The second delivery pipe (32) is used to supply fluid to the main pipeline section (2).

3. The self-emptying pipeline system according to claim 1, characterized in that, The discharge section (4) is arranged on one side of the other end of the first delivery pipe (31).

4. The self-emptying pipeline system according to claim 1, characterized in that, The discharge section (4) includes a discharge valve (41) which is used to control the opening and closing of the discharge section (4).

5. The self-emptying pipeline system according to claim 4, characterized in that, The discharge valve (41) is arranged on the side of the discharge section (4) close to the first delivery pipe (31).

6. The self-emptying pipeline system according to claim 1, characterized in that, Further comprising: A supply section (5) arranged on the side wall of the second delivery pipe (32) in a manner communicating with the second delivery pipe (32) for supplying cleaning fluid.

7. The self-emptying pipeline system according to claim 6, characterized in that, The supply section (5) is arranged on one side of the other end of the second delivery pipe (32).

8. The self-emptying pipeline system according to claim 6, characterized in that, The supply section (5) includes a supply valve (51) which is used to control the opening and closing of the supply section (5).

9. The self-emptying pipeline system according to claim 8, characterized in that, The supply valve (51) is arranged on the side of the supply section (5) close to the second delivery pipe (32).

10. The self-emptying pipeline system according to claim 1, characterized in that, The main pipeline section (2) includes a plurality of shunt pipelines (21), The first ends of the plurality of shunt pipelines (21) communicate with the first delivery pipe (31), The second ends of the plurality of shunt pipelines (21) communicate with the second delivery pipe (32), A first valve (221) is respectively arranged at the first end of each of the shunt pipelines (21), A second valve (222) is respectively arranged at the second end of each of the shunt pipelines (21).

11. A temperature control system, characterized in that, Including the self - emptying pipeline system (100) according to any one of claims 1 to 10, The main pipeline section (2) of the self - emptying pipeline system (100) is made of a heat - conducting material and has temperature - controlled fluid flowing inside.

12. A semiconductor processing device, characterized in that, Including the self - emptying pipeline system (100) according to any one of claims 1 to 10.

13. The semiconductor processing equipment according to claim 12, wherein, The main pipeline section (2) of the self - emptying pipeline system (100) is made of a heat - conducting material and has temperature - controlled fluid flowing inside.

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