Optical fiber array and silicon optical chip coupling method

Abstract

The invention provides an optical fiber array and silicon optical chip coupling method, which comprises the following steps that: FA (Fiber Array) reaches an initial position, and the distance between the FA and a PIC (Peripheral Integrated Circuit) at the initial position is an initial distance A; the first fixing piece is driven to move in the direction of the PIC by a second distance B in the X-axis direction, the first fixing piece drives the FA to synchronously move to make contact with the PIC, in the process, the FA moves by a third distance C, C is smaller than B, and B is larger than A; the FA is driven to move in the direction away from the PIC in the X-axis direction by a fourth distance D; the FA and the PIC are pre-coupled, so that the optical axis of the FA is parallel to the optical axis of the PIC; the first fixing piece is driven to move by a fifth distance E in the direction of the PIC in the X-axis direction, the first fixing piece drives the FA to synchronously move to make contact with the PIC, in the process, the FA moves by a sixth distance F, F is smaller than E, and E is larger than D; and driving the FA to move a target distance G away from the PIC direction in the X-axis direction so as to enable the FA to reach a coupling position. According to the invention, the coupling efficiency of the optical fiber array and the silicon optical chip is high, the cost is low and the stability is high.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and particularly relates to a method for coupling an optical fiber array with a silicon photonics chip. Background Art

[0002] With the continuous growth of global AI computing power and the rapid popularization of AI large model applications, the demand for high-speed optical modules has been directly promoted, and the demand for optical modules with low-cost silicon photonics solutions has also increased accordingly. Among them, the input cost of equipment determines the competitiveness of products. In an optical communication system, the coupling of an optical fiber array (FA) and a photonic integrated circuit (PIC) is one of the key technologies for realizing optical signal transmission. The traditional coupling method is to determine the optical path focus coordinates by making the FA contact the PIC through a high-precision position sensor. This method has the following problems:

[0003] 1. High equipment cost: Adding a high-precision position sensor to the coupling machine increases the equipment cost.

[0004] 2. Poor equipment stability: The high-precision position sensor needs to be installed on the optical path focus axis, and an active mechanism needs to be added to this axis. The later stability is relatively poor, and the influence of external factors is relatively large.

[0005] 3. Complex coupling logic: The coupling position of the FA requires continuous determination until the index of the high-precision position sensor changes.

[0006] Therefore, it is of great significance to develop an efficient, low-cost, and stable direct coupling technology. Summary of the Invention

[0007] The purpose of the present invention is to provide a method for coupling an optical fiber array with a silicon photonics chip to solve the problems of low efficiency, high cost, and poor stability in the existing method for coupling an optical fiber array with a silicon photonics chip.

[0008] To solve the above technical problems, the present invention provides a method for coupling an optical fiber array with a silicon photonics chip, including:

[0009] Move the FA to the initial position, where the distance between the FA and the PIC at the initial position is the initial distance A;

[0010] Drive the first fixing member to move a second distance B in the X-axis direction towards the PIC, and the first fixing member drives the FA to move synchronously until it contacts the PIC. During this process, the FA moves a third distance C, and C is less than B, and B is greater than A;

[0011] Drive the FA to move a fourth distance D in the X-axis direction away from the PIC;

[0012] Pre-couple the FA and the PIC to make the optical axis of the FA parallel to the optical axis of the PIC;

[0013] Drive the first fixing member to move along the X-axis in the direction of PIC by a fifth distance E. The first fixing member drives the FA to move synchronously until it contacts the PIC. During this process, the FA moves a sixth distance F, and F is less than E, and E is greater than D.

[0014] Drive the FA to move along the X-axis in the direction away from the PIC by a target distance G so that the FA reaches the coupling position.

[0015] Optionally, before moving the FA to the initial position, it further includes:

[0016] Make the bottoms of the FA and the PIC parallel to the XOY plane respectively.

[0017] Identify the positions of the FA and the PIC to obtain the measured distance L1 between the FA and the PIC on the X-axis.

[0018] Move the FA along the X-axis by a first distance L2 so that the FA reaches the initial position. The first distance L2 for moving the FA along the X-axis is L1 - A.

[0019] Optionally, the second distance B is 1.5 times the initial distance A, the fifth distance E is 1.5 times the fourth distance D, the fourth distance D is 20 - 50 microns, the target distance G is 5 - 10 microns, and the initial distance A is 100 - 200 microns.

[0020] Optionally, after driving the FA to move along the X-axis in the direction away from the PIC by a target distance G so that the FA reaches the coupling position, move the FA along the Y-axis, and in real time obtain the optical power of a specific channel in the FA, and move the FA to the position where the optical power of this channel is the maximum in the Y-axis direction; move the FA along the Z-axis, in real time obtain the optical power of a specific channel in the FA, and move the FA to the position where the optical power of the specific channel is the maximum in the Z-axis direction.

[0021] Optionally, it further includes setting a drive shaft for the output end to move along the X-axis, and setting a chuck. The chuck and the first fixing member are respectively arranged on the output end of the drive shaft, and the chuck enables the FA to move only in the XOZ plane.

[0022] Optionally, the first fixing member is a vacuum suction nozzle.

[0023] Optionally, when driving the first fixing member to move along the X-axis in the direction of PIC by a second distance B, the first fixing member drives the FA to move synchronously until it contacts the PIC. During the process that the FA moves a third distance C, the chuck enables the FA to move only in the XOZ plane. The first fixing member drives the FA to move along the X-axis. When the FA moves to contact the PIC, the FA slips relative to the first fixing member.

[0024] Optionally, when driving the first fixing member to move the fifth pitch E in the X-axis direction towards the PIC direction, the first fixing member drives the FA to move synchronously until it contacts the PIC. During this process, when the FA moves the sixth pitch F, the chuck enables the FA to move only in the XOZ plane. The first fixing member drives the FA to move along the X-axis. When the FA moves to contact the PIC, the FA slides relative to the first fixing member.

[0025] Optionally, when driving the FA to move the fourth pitch D in the X-axis direction away from the PIC direction, the chuck clamps the FA.

[0026] Optionally, when driving the FA to move the target pitch G in the X-axis direction away from the PIC direction to move the FA to the coupling position, the chuck clamps the FA.

[0027] A method for coupling an optical fiber array with a silicon photonics chip provided by the present invention has the following beneficial effects:

[0028] In this embodiment, the first fixing member is driven to move a second distance B along the X axis in the direction of the PIC, so as to drive the FA to move a third distance C along the X axis in the direction of the PIC. C is less than B, and B is greater than A. The second distance B moved by the first fixing member is greater than the set initial distance A. Therefore, after the FA moves the third distance C along the X axis, it will surely come into contact with the PIC, thereby finding the position where the PIC and the FA come into contact for the first time. Then, the FA is driven to move a fourth distance D along the X axis in the direction away from the PIC, so that the FA can reach a position where optical coupling with the PIC can be performed. Then, the positions of the optical axes of the FA and the PIC are adjusted according to the result of the optical coupling, so that the optical axis of the FA is parallel to the optical axis of the PIC. After that, the first fixing member is driven to move a fifth distance E along the X axis in the direction of the PIC, so as to drive the FA to move a sixth distance F along the X axis in the direction of the PIC. Among them, when the FA moves F along the X axis, F is less than E, and E is greater than D. The fifth distance E moved by the first fixing member is greater than the fourth distance D by which the FA retreats relative to the PIC. Therefore, after the FA moves the sixth distance F along the X axis, it will surely come into contact with the PIC, thereby finding the position where the PIC and the FA come into contact for the second time. Then, the FA is driven to move a target distance G along the X axis in the direction away from the PIC, so that the FA reaches the coupling position. Since G is the target distance between the FA and the PIC, the coupling of the FA and the PIC on the X axis can be completed thus far. Since there is no need for a sensor to detect whether the PIC comes into contact with the FA during the entire coupling process, but by moving the first fixing member by the second distance B, moving the FA by the third distance C, and making the second distance B greater than the initial distance A and the third distance C less than the second distance B, it is judged that the FA that has moved the third distance C will surely come into contact with the PIC to know that the PIC and the FA come into contact for the first time; by moving the first fixing member by the fifth distance E, moving the FA by the sixth distance F, and making the fifth distance E greater than the fourth distance D and the sixth distance F less than the fifth distance E, it is judged that the FA that has moved the sixth distance F will surely come into contact with the PIC to know that the PIC and the FA come into contact for the second time; through two inevitable contacts between the PIC and the FA, replacing the judgment of whether the PIC and the FA are in contact by a position sensor, the coupling efficiency can be improved, the cost can be reduced, and the coupling stability can be improved. Description of the Drawings

[0029] Figure 1 is a schematic diagram of the initial states of the FA, PIC, vacuum suction nozzle, and substrate in an embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the first state of the FA, PIC, vacuum suction nozzle, and substrate in an embodiment of the present invention;

[0031] Figure 3 is a schematic diagram of the second state of the FA, PIC, vacuum suction nozzle, and substrate in an embodiment of the present invention;

[0032] Figure 4 It is a schematic diagram of the third state of FA, PIC, vacuum nozzle and substrate in the embodiments of the present invention;

[0033] Figure 5 It is a schematic diagram of the fourth state of FA, PIC, vacuum nozzle and substrate in the embodiments of the present invention;

[0034] Figure 6 It is a schematic diagram of the fifth state of FA, PIC, vacuum nozzle and substrate in the embodiments of the present invention;

[0035] Figure 7 It is a schematic diagram of the sixth state of FA, PIC, vacuum nozzle and substrate in the embodiments of the present invention;

[0036] Figure 8 It is a flowchart of the method for coupling an optical fiber array with a silicon photonics chip in the embodiments of the present invention. Detailed implementation manners

[0037] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0039] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0040] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0041] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0042] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0043] Reference Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 , Figure 1 are schematic diagrams of the initial states of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 2 is a schematic diagram of the first state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 3 is a schematic diagram of the second state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 4 is a schematic diagram of the third state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 5 is a schematic diagram of the fourth state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 6 is a schematic diagram of the fifth state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 7 is a schematic diagram of the sixth state of the FA, PIC, vacuum chuck, and substrate in the embodiments of the present invention, Figure 8 is a flowchart of a method for coupling an optical fiber array with a silicon photonic chip in the embodiments of the present invention. The present embodiment provides a method for coupling an optical fiber array with a silicon photonic chip, including:

[0044] Making the bottoms of the FA and PIC parallel to the XOY plane respectively;

[0045] Identifying the positions of the FA and PIC to obtain the measured spacing L1 between the FA and PIC on the X-axis;

[0046] Move FA to the initial position, where the distance between FA and PIC at the initial position is the initial distance A, and the relative positions of FA, PIC, the vacuum nozzle, and the substrate when FA reaches the initial position are as Figure 1 shown;

[0047] Drive the first fixing member to move along the X-axis in the direction of PIC by a second distance B. The first fixing member drives FA to move synchronously until it contacts PIC. During this process, FA moves a third distance C, and C is less than B, and B is greater than A. The relative positions of FA, PIC, the vacuum nozzle, and the substrate when FA just contacts PIC are as Figure 2 shown, and the relative positions of FA, PIC, the nozzle, and the substrate when the vacuum nozzle has finished slipping relative to FA are as Figure 3 shown;

[0048] Drive FA to move along the X-axis in the direction away from PIC by a fourth distance D. The relative positions of FA, PIC, the vacuum nozzle, and the substrate after FA and the nozzle have moved in the direction away from PIC are as Figure 4 shown;

[0049] Pre-couple FA and PIC to make the optical axis of FA parallel to the optical axis of PIC;

[0050] Drive the first fixing member to move along the X-axis in the direction of PIC by a fifth distance E. The first fixing member drives FA to move synchronously until it contacts PIC. During this process, FA moves a sixth distance F, and F is less than E, and E is greater than D. The relative positions of FA, PIC, the vacuum nozzle, and the substrate when FA just contacts PIC are as Figure 5 shown, and the relative positions of FA, PIC, the nozzle, and the substrate when the vacuum nozzle has finished slipping relative to FA are as Figure 6 shown;

[0051] Drive FA to move along the X-axis in the direction away from PIC by a target distance G to move FA to the coupling position. The relative positions of FA, PIC, the vacuum nozzle, and the substrate after FA and the nozzle have moved in the direction away from PIC are as Figure 7 shown.

[0052] Since the bottoms of FA and PIC are respectively parallel to the XOY plane, identify the positions of FA and PIC to obtain that there is an error between the measured distance L1 of FA and PIC on the X-axis and the actual distance, and there is an angle between the optical axis of FA and the optical axis of PIC. Therefore, it is necessary to compensate the optical axes of FA and PIC to make the optical axis of FA parallel to the optical axis of PIC, and make the distance between FA and PIC the target distance G, so as to complete the coupling of FA and PIC on the X-axis.

[0053] In this embodiment, the first fixing member is driven to move a second spacing B along the X-axis toward the PIC direction, so that the FA is driven to move a third spacing C along the X-axis toward the PIC direction through the first fixing member, where C is smaller than B and B is larger than A, so that the second spacing B moved by the first fixing member is larger than the set initial spacing A, so that the FA can definitely contact the PIC after moving the third spacing C along the X-axis, thereby finding the contact position of the PIC and the FA for the first time; then the FA is driven to move a fourth spacing D along the X-axis away from the PIC direction, so that the FA can reach a position where it can be optically coupled with the PIC; then the positions of the optical axes of the FA and the PIC are adjusted according to the result of the optical coupling, so that the optical axis of the FA is parallel to the optical axis of the PIC; then the first fixing member is driven to move a fifth spacing E along the X-axis toward the PIC direction, so that the FA is driven to move a sixth spacing F along the X-axis toward the PIC direction through the first fixing member, wherein the FA moves F along the X-axis, where F is smaller than E and E is larger than D, so that the fifth spacing E moved by the first fixing member is larger than the fourth spacing D where the FA retreats relative to the PIC, so that the FA can definitely contact the PIC after moving the sixth spacing F along the X-axis, thereby finding the contact position of the PIC and the FA for the first time; The contact position between PIC and FA is found for the second time; then FA is driven to move the target spacing G in the X-axis direction away from PIC to move FA to the coupling position. Since G is the target spacing between FA and PIC, the coupling between FA and PIC on the X-axis can be completed at this point; since no sensor is required to detect whether PIC is in contact with FA during the entire coupling process, by moving the first fixing member to the second spacing B, FA is moved to the third spacing C, and the second spacing B is greater than the initial spacing A, and the third spacing C is less than the second spacing B, it is judged that FA moved by the third spacing C must be in contact with PIC, and then it is known that PIC and FA are in contact for the first time; by moving the first fixing member to the fifth spacing E, FA is moved to the sixth spacing F, and the fifth spacing E is greater than the fourth spacing D, and the sixth spacing F is less than the fifth spacing E, it is judged that FA moved by the sixth spacing F must be in contact with PIC, and then it is known that PIC and FA are in contact for the second time; the two inevitable contacts between PIC and FA replace the judgment of whether PIC and FA are in contact by the position sensor, thereby improving the efficiency of coupling, reducing costs, and improving the stability of coupling.

[0054] Preferably, the second spacing B is 1.5 times the initial spacing A, and the fifth spacing E is 1.5 times the fourth spacing D.

[0055] Preferably, the fourth distance D is 20-50 microns.

[0056] Preferably, the target spacing G is 5-10 microns.

[0057] Preferably, the initial spacing A is 100-200 microns.

[0058] Preferably, before the FA reaches the initial position, the method for coupling the fiber optic array with the silicon photonics chip further includes:

[0059] Making the bottoms of the FA and the PIC parallel to the XOY plane respectively;

[0060] Identifying the positions of the FA and the PIC to obtain the measured spacing L1 between the FA and the PIC on the X-axis;

[0061] Moving the FA along the X-axis by a first spacing L2 so that the FA reaches the initial position, and the first spacing L2 for moving the FA along the X-axis is L1 - A.

[0062] The method for coupling the fiber optic array with the silicon photonics chip further includes, after driving the FA to move a target spacing G along the X-axis away from the PIC so that the FA reaches the coupling position, further includes: moving the FA along the Y-axis, acquiring the optical power of a specific channel in the FA in real time, and moving the FA to the position where the optical power of the channel in the Y-axis direction is the maximum; moving the FA along the Z-axis, acquiring the optical power of a specific channel in the FA in real time, and moving the FA to the position where the optical power of the specific channel in the Z-axis direction is the maximum.

[0063] After that, moving the FA away from the coupling position along the X-axis to a predetermined position, then dispensing glue, and then moving the FA back to the coupling position along the X-axis from the predetermined position.

[0064] After that, performing fine coupling of the FA in the Y and Z directions, and then curing the glue by UV.

[0065] Wherein, the first fixing member is a vacuum suction nozzle.

[0066] The method for coupling the fiber optic array with the silicon photonics chip further includes setting a driving shaft for the output end to move along the X-axis, and setting a chuck. The chuck and the first fixing member are respectively arranged on the output end of the driving shaft, and the chuck enables the FA to move only within the XOZ plane.

[0067] Further, when driving the first fixing member to move a second spacing B along the X-axis towards the PIC, and the first fixing member drives the FA to move synchronously to contact the PIC, during the process that the FA moves a third distance C, the chuck enables the FA to move only within the XOZ plane. The first fixing member drives the FA to move along the X-axis. When the FA moves to contact the PIC, the FA slips relative to the first fixing member.

[0068] Further, when driving the first fixing member to move a fifth spacing E along the X-axis towards the PIC, and the first fixing member drives the FA to move synchronously to contact the PIC, during the process that the FA moves a sixth spacing F, the chuck enables the FA to move only within the XOZ plane. The first fixing member drives the FA to move along the X-axis. When the FA moves to contact the PIC, the FA slips relative to the first fixing member.

[0069] In this embodiment, the first fixing member drives the FA to move along the X-axis. When the FA moves to contact the PIC, when the FA slides relative to the first fixing member, the following conditions are satisfied:

[0070] The roughness of the surface of the FA in contact with the vacuum chuck is less than or equal to 1.45 microns;

[0071] The vacuum degree of the vacuum chuck is between -80 and -100 Kpa.

[0072] Further, when driving the FA to move a fourth distance D along the X-axis away from the PIC, the chuck clamps the FA.

[0073] Further, when driving the FA to move a target distance G along the X-axis away from the PIC so that the FA reaches the coupling position, the chuck clamps the FA.

[0074] Making the bottoms of the FA and the PIC parallel to the XOY plane respectively includes:

[0075] Placing the FA and the PIC on a substrate parallel to the XOY plane;

[0076] The distance between the FA and the substrate is 10 - 20 microns. The function of making the distance between the FA and the substrate 10 - 20 microns is to prevent the frictional force between the FA and the substrate from affecting the movement of the FA along the X-axis.

[0077] Among them, the optical coupling between the FA and the PIC includes:

[0078] Step 001, move the FA along the Y-axis, obtain the optical power of a certain channel in the FA in real time, move the FA to the position where the optical power of this channel in the FA in the Y-axis direction is the maximum, and generate the Y-axis displacement optical power curve of this channel. For the convenience of description, a certain channel is defined as the first channel, and the displacement optical power curve of this channel is the first channel Y-axis displacement optical power curve. Move the FA along the Z-axis, obtain the optical power of the first channel in the FA in real time, and move the FA to the position where the optical power of the first channel in the FA in the Z-axis direction is the maximum;

[0079] Step 002, then move the FA along the Y-axis, obtain the optical power of another channel in the FA in real time, move the FA to the position where the optical power of this channel in the FA in the Y-axis direction is the maximum, and generate the Y-axis displacement optical power curve of this channel. For the convenience of description, another channel is defined as the second channel, and the displacement optical power curve of this channel is the second channel Y-axis displacement optical power curve. Move the FA along the Z-axis, obtain the optical power of the second channel in the FA in real time, and move the FA to the position where the optical power of the second channel in the FA in the Z-axis direction is the maximum;

[0080] Step 003: Obtain the Y-axis offset, which is the difference between the coordinates corresponding to the point with the maximum optical power in the Y-axis displacement optical power curve of the first channel and the coordinates corresponding to the point with the maximum optical power in the Y-axis displacement optical power curve of the second channel;

[0081] Step 004: Determine whether the Y-axis offset is within the threshold range of the set angle between the FA and the PIC in the XOY plane. If it is, there is no need to adjust the FA. If not, rotate the FA around the Z-axis by a deflection of 0.05°, and then return to Step 001.

[0082] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the art of the present invention based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A method for coupling an optical fiber array to a silicon photonic chip, characterized in that: include: Make FA reach an initial position, wherein the distance between FA and PIC at the initial position is an initial distance A; The first fixing member is driven to move along the X-axis toward the PIC by a second spacing B, and the first fixing member drives the FA to move synchronously until it contacts the PIC. During this process, the FA moves a third distance C, and C is smaller than B, and B is larger than A. Drive FA to move along the X-axis in a direction away from PIC by a fourth distance D; FA and PIC are pre-coupled so that the optical axis of FA is parallel to the optical axis of PIC; The first fixing member is driven to move along the X-axis toward the PIC by a fifth spacing E, and the first fixing member drives FA to move synchronously until it contacts the PIC. During this process, FA moves by a sixth spacing F, and F is smaller than E, and E is larger than D; Drive FA to move the target distance G along the X-axis direction away from PIC, so that FA reaches the coupling position.

2. The method for coupling an optical fiber array to a silicon photonic chip according to claim 1, characterized in that: Before the FA reaches the initial position, it also includes: Make the bottoms of FA and PIC parallel to the XOY plane respectively; Identify the positions of FA and PIC to obtain a measurement distance L1 between FA and PIC on the X-axis; FA is moved along the X-axis by a first distance L2 so that FA reaches an initial position. The first distance L2 for moving FA along the X-axis is L1-A.

3. The method for coupling an optical fiber array to a silicon photonic chip according to claim 1, characterized in that: The second spacing B is 1.5 times the initial spacing A, the fifth spacing E is 1.5 times the fourth spacing D, the fourth spacing D is 20-50 microns, the target spacing G is 5-10 microns, and the initial spacing A is 100-200 microns.

4. The method for coupling an optical fiber array to a silicon photonic chip according to claim 1, wherein: The method also includes driving FA to move a target distance G along the X-axis direction away from PIC to bring FA to the coupling position, moving FA along the Y-axis, acquiring the optical power of a specific channel in FA in real time, and moving FA to the point where the optical power of the channel in the Y-axis direction is maximum; moving FA along the Z-axis, acquiring the optical power of a specific channel in FA in real time, and moving FA to the point where the optical power of the specific channel in the Z-axis direction is maximum.

5. The method for coupling an optical fiber array to a silicon photonic chip according to claim 1, characterized in that: It also includes a driving shaft with an output end moving along the X direction, and a chuck. The chuck and the first fixing member are respectively arranged on the output end of the driving shaft, and the chuck enables the FA to move only in the XOZ plane.

6. The method for coupling an optical fiber array to a silicon photonic chip according to claim 5, characterized in that: The first fixing member is a vacuum nozzle.

7. The method for coupling an optical fiber array to a silicon photonic chip according to claim 5, characterized in that: When driving the first fixing member to move along the X-axis toward the PIC by a second spacing B, the first fixing member drives FA to move synchronously until it contacts the PIC. During this process, FA moves a third distance C. The chuck makes FA move only in the XOZ plane. The first fixing member drives FA to move along the X-axis. When FA moves to contact the PIC, the FA slides relative to the first fixing member.

8. The method for coupling an optical fiber array to a silicon photonic chip according to claim 5, characterized in that: When driving the first fixing member to move the fifth spacing E along the X-axis toward the PIC, the first fixing member drives FA to move synchronously until it contacts the PIC. During the process in which FA moves the sixth spacing F, the chuck makes FA move only in the XOZ plane. The first fixing member drives FA to move along the X-axis. When FA moves to contact the PIC, the FA slides relative to the first fixing member.

9. The method for coupling an optical fiber array to a silicon photonic chip according to claim 5, characterized in that: When FA is driven to move a fourth distance D along the X-axis direction away from PIC, the chuck clamps FA.

10. The method for coupling an optical fiber array to a silicon photonic chip according to claim 5, characterized in that: When FA is driven to move along the X-axis direction away from PIC by the target distance G so as to move FA to the coupling position, the chuck clamps FA.

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