Data acquisition analysis and management and control system for wafer production process flow

Abstract

The invention discloses a data acquisition analysis and management and control system for a wafer production process flow. The data acquisition analysis and management and control system comprises a user authority module, a process product flow module, a parameter set module, an equipment card control module, a data analysis module, a flow alarm module and an external system interface module, the user permission module is used for proofreading user role permissions; the process product flow module is used for monitoring and managing the wafer production process flow; the equipment card control module is used for controlling the state of wafer processing equipment; the data analysis module is used for matching a wafer parameter acquisition rule and performing wafer parameter data analysis; the flow alarm module is used for carrying out alarm notification on a wafer parameter data analysis result; the parameter set module is used for defining the number of collection points and collection rules of the wafers; and the external system interface module is used for performing interface communication and data synchronization with the MES system and the EAP system. According to the invention, high-density data acquisition, intelligent analysis and accurate management and control in the whole wafer manufacturing process can be realized.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of semiconductor wafer processing technology, and particularly relates to a data acquisition, analysis and control system for a wafer production process flow. Background Art

[0002] The semiconductor wafer manufacturing process is very complex, involving hundreds of process steps, and each step will have an important impact on the performance and yield of the final wafer. In the highly automated wafer manufacturing process, a large amount of process data will be generated, including equipment parameters, process parameters, product detection data, etc. How to effectively collect, store and analyze these data is the key to realizing refined process control. Traditional wafer manufacturing process control mainly relies on manual sampling inspection and real-time monitoring of key parameters, which has the problems of narrow coverage of sampled process data, difficult to comprehensively reflect the status of the entire production process; limited key parameter monitoring, difficult to detect many small but important process deviations in time; lack of systematic analysis and mining of a large amount of process data, unable to deeply understand the process status and conduct refined control, etc. Summary of the Invention

[0003] In view of the technical problems existing in the prior art, the present invention provides a data acquisition, analysis and control system for a wafer production process flow that can achieve high-density data acquisition, intelligent analysis and precise control of the entire wafer manufacturing process.

[0004] To solve the above technical problems, the technical solution proposed by the present invention is as follows:

[0005] A data acquisition, analysis and control system for a wafer production process flow includes a user permission module, a process product flow module, a parameter set module, an equipment control module, a data analysis module, a process alarm module and an external system interface module;

[0006] The user permission module is used to verify user role permissions;

[0007] The process product flow module is used to monitor and manage the wafer production process flow;

[0008] The equipment control module is used to control the state of wafer processing equipment;

[0009] The data analysis module is used to match the wafer parameter acquisition rules and perform data analysis on wafer parameters;

[0010] The process alarm module is used to give an alarm notification for the data analysis result of wafer parameters;

[0011] The parameter set module is used to define the acquisition points and acquisition rules of the wafer;

[0012] The external system interface module is used to communicate and synchronize data with the MES system and the EAP system through the interface.

[0013] Preferably, the user permission module, the process product flow module, the equipment control module, the data analysis module, the process alarm module, the parameter set module, and the external system interface module are communicatively connected to each other;

[0014] The user permission module communicates unidirectionally with the equipment control module, the process product flow module, and the parameter set module. The user configures different equipment control permissions, measurement step permissions for the process product flow, and acquisition rule permissions for the parameter set through the user permission module;

[0015] The process product flow module communicates bidirectionally with the equipment control module. The process product flow module transmits the wafer process step information to the equipment control module, and the equipment control module changes the equipment status according to the equipment information corresponding to the process step and feeds back to the process product flow module;

[0016] The parameter set module communicates unidirectionally with the process product flow module and the data analysis module. The parameter set module defines the acquisition rules for the measurement steps, the number of wafers to be collected, the number of collection points for each wafer, the wafer collection parameters, and the wafer collection parameter set, binds the acquisition parameter information to the measurement steps under the process product flow module, and transmits the collected data to the data analysis module. The data analysis module performs real-time data rule calculation, data analysis, and processing;

[0017] The data analysis module communicates unidirectionally with the process alarm module. The data analysis module transmits the analysis result of the wafer collection data to the process alarm module, and the process alarm module analyzes the analysis result to generate corresponding wafer process step alarm information;

[0018] The process alarm module communicates unidirectionally with the equipment control module and the external system interface. The process alarm module transmits the process step alarm information to the MES system and the EAP system through the external system interface, and the equipment control module performs corresponding equipment processing operations according to the alarm information;

[0019] The user permission module, the process product flow module, the equipment control module, and the external system interface module communicate bidirectionally. The user permission information of the user permission module, the wafer process flow information of the process product flow module, and the equipment status control information of the equipment control module are synchronized and stored with the MES system and the EAP system through the external system interface module.

[0020] Preferably, the user permission module further includes a device operation permission unit and a wafer process step permission unit; wherein the device operation permission unit is used to configure the permission for a user to operate a device, and only a specified user can operate a specified device; the wafer process step permission unit is used to configure the permission for a user to operate the wafer process steps, and select the wafer process steps for processing by a specified device.

[0021] Preferably, the process product flow module includes a product flow definition module and a product parameter set definition module; wherein the product flow definition module is used to configure the process steps of the wafer processing process; the product parameter set definition module is used to configure the measurement steps and the measurement acquisition parameter set in the wafer processing process.

[0022] Preferably, the parameter parameter set module includes a parameter definition unit, a parameter set definition unit, and a collection rule definition unit; wherein the parameter definition unit is used to define the collected parameters, define the number of wafer pieces collected for each parameter, the number of measurement points collected for a single wafer, the target value, the upper specification limit, the lower specification limit, the upper control limit, and the lower control limit; the parameter set definition unit is used to define the collected parameter set, define the number of parameters that need to be collected in the measurement steps under the wafer process steps; the collection rule definition unit is used to define the wafer sampling rules, define the number of wafer pieces, the wafer positions, and the preset rules for different devices, product flows, and batches.

[0023] Preferably, the data analysis module is used to extract the original wafer data under the collection rules matched by the measurement steps in the wafer processing process of the process product flow module, and then process the original wafer data according to the preset rules and output the results.

[0024] Preferably, the device control module includes a device status control module and a device data monitoring module; wherein the device data monitoring module is used to monitor the device operation parameters in real time, connect to the EAP system through the external system interface module to collect device temperature, pressure, and air flow data and provide immediate feedback; the device status control module is used to manage the device status, update the device status information in real time, and synchronize it to the MES system and the EAP system through the external system interface.

[0025] Preferably, the process alarm module includes a device data alarm module and a wafer data collection alarm module; wherein the device offline data alarm module detects the device operation parameters, and when the operation parameters exceed the limit value, it performs an alarm operation to prompt the process engineer that there is a problem with the device; the wafer data collection alarm module analyzes the wafer data collection results through the data analysis module and prompts the process engineer that there is a problem with the wafer processing process of the corresponding batch.

[0026] The present invention also discloses an analysis and control method for a data collection, analysis, and control system based on the wafer production process flow as described above, including the steps:

[0027] S1. Configure the device operation permissions, measurement step permissions, and collection rule permissions for different users through the user permission module;

[0028] S2. Configure the number of wafer collection pieces, sample points, and preset rules for different product processes through the parameter set module;

[0029] S3. The MES system synchronizes the process product flow information with the process product flow module through the external system interface module to determine the automated wafer processing process production line. The EAP system synchronizes the device status and device data information with the device control module through the external system interface module;

[0030] S4. Bind the wafer parameter set to the measurement steps of the wafer processing process through the process product flow module to determine the collected wafer parameter set;

[0031] S5. During the production process, the device control module collects device data, and the data analysis module processes the collected wafer data set according to the preset rules and outputs the analysis results;

[0032] S6. According to the wafer data analysis results in step S5, the process alarm module processes the device status through the device control module and notifies whether there are process problems with the wafers of the corresponding product process through the MES system interface module.

[0033] Preferably, the device data information includes one or more of the device central cavity temperature, the device central cavity wafer inlet temperature, the device central cavity wafer outlet temperature, the device bottom center wafer inlet temperature, the device bottom center wafer outlet temperature, the device bottom center temperature, the device top center temperature, the device top center wafer inlet temperature, the device top center wafer outlet temperature, the inlet air pressure, and the inlet air flow rate.

[0034] Compared with the prior art, the advantages of the present invention are as follows:

[0035] The present invention can quickly respond to production problems, monitor the key parameters of each process link in real time, immediately discover and correct process deviations in the wafer processing process, and can issue early warnings and control functions when detecting abnormal situations, optimize the wafer production efficiency, reduce the problem handling time, and ensure the product yield.

[0036] The present invention can realize high-density data collection, intelligent analysis, and precise control of the entire wafer manufacturing process, specifically including:

[0037] High-performance data collection and storage: Customize data collection rules, can collect a large amount of data from devices and detection systems in real time and at high speed, and store it quickly and reliably in the database;

[0038] Process data analysis capability: Use industry-standard statistical process management techniques and data analysis algorithms to perform data analysis throughout the process;

[0039] Real-time monitoring and early warning function: Real-time monitor the key parameters of each process link, immediately discover and correct process deviations in the wafer processing process, and be able to issue early warnings and control functions when abnormal situations are detected. Brief Description of the Drawings

[0040] Figure 1 It is a block structure diagram of the data acquisition, analysis and control system of the present invention in an embodiment.

[0041] Figure 2 It is a flowchart of the data acquisition, analysis and control method of the present invention in an embodiment.

[0042] Figure 3 It is an embodiment diagram of the data acquisition, analysis and control system of the present invention in a specific application.

[0043] Figure 4 It is a schematic diagram of the position of measurement points on a batch of wafers in the present invention. Detailed Description of the Invention

[0044] The present invention will be further described below in conjunction with the specification drawings and specific embodiments.

[0045] As Figure 1 shown, the data acquisition, analysis and control system for the wafer production process flow provided by the embodiment of the present invention belongs to the technical field of semiconductor wafer processing technology, and specifically controls the wafer manufacturing process flow by collecting and analyzing wafer data and semiconductor equipment data.

[0046] The above-mentioned data acquisition, analysis and control system for the wafer production process flow includes a user permission module, a process product flow module, a parameter set module, an equipment control module, a data analysis module, a process alarm module and an external system interface module;

[0047] The user permission module is used to verify user role permissions;

[0048] The process product flow module is used to monitor and manage the wafer production process flow;

[0049] The equipment control module is used to control the state of wafer processing equipment;

[0050] The data analysis module is used to match the wafer parameter acquisition rules and perform wafer parameter data analysis;

[0051] The process alarm module is used for alarm notification of the wafer parameter data analysis results;

[0052] The parameter parameter set module (including parameters and parameter sets) is used to define the number of acquisition points and acquisition rules for the wafer.

[0053] The external system interface module is used to communicate and synchronize data with the MES system and EAP system through the interface.

[0054] Specifically, the user permission module, process product flow module, equipment control module, data analysis module, process alarm module, parameter parameter set module, and external system interface module communicate and connect with each other.

[0055] The user permission module communicates unidirectionally with the equipment control module, process product flow module, and parameter parameter set module. The user configures different equipment control permissions, measurement step permissions for the process product flow, and acquisition rule permissions for the parameter parameter set through the user permission module.

[0056] The process product flow module communicates bidirectionally with the equipment control module. The process product flow module transmits the wafer process step information to the equipment control module, and the equipment control module changes the equipment status according to the equipment information corresponding to the process step and feeds it back to the process product flow module.

[0057] The parameter parameter set module communicates unidirectionally with the process product flow module and the data analysis module. The parameter parameter set module defines the acquisition rules for measurement steps, the number of wafers to be collected, the number of acquisition points for wafer pieces, wafer acquisition parameters, and wafer acquisition parameter sets, binds the acquisition parameter information to the measurement steps under the process product flow module, and transmits the acquisition data to the data analysis module. The data analysis module performs real-time data rule calculation, data analysis, and processing.

[0058] The data analysis module communicates unidirectionally with the process alarm module. The data analysis module transmits the analysis results of wafer acquisition data to the process alarm module, and the process alarm module analyzes the analysis results to generate corresponding wafer process step alarm information.

[0059] The process alarm module communicates unidirectionally with the equipment control module and the external system interface. The process alarm module transmits the process step alarm information to the MES system and EAP system through the external system interface to notify the corresponding process engineer, and the equipment control module performs corresponding equipment handling operations according to the alarm information.

[0060] The user permission module, process product flow module, equipment control module communicate bidirectionally with the external system interface module. The user permission information of the user permission module, the wafer process flow information of the process product flow module, and the equipment status control information of the equipment control module are synchronized and stored with the MES system and EAP system through the external system interface module.

[0061] The user permission module also includes a device operation permission unit and a wafer process step permission unit; among which, the device operation permission unit is used to configure the permissions for users to operate devices, and only specified users can operate specified devices; the wafer process step permission unit is used to configure the permissions for users to operate wafer process steps, and wafer process steps can be selected for processing on specified devices.

[0062] The process product flow module includes a product flow definition module and a product parameter set definition module; among which, the product flow definition module is used to configure the process steps of the wafer processing process; the product parameter set definition module is used to configure the measurement steps and measurement acquisition parameter sets in the wafer processing process.

[0063] The parameter set module includes a parameter definition unit, a parameter set definition unit, and a collection rule definition unit; among which, the parameter definition unit is used to define the parameters to be collected, defining the number of wafers to be collected for each parameter, the number of measurement points to be collected for a single wafer, the target value, the upper specification limit, the lower specification limit, the upper control limit, and the lower control limit; the parameter set definition unit is used to define the parameter sets to be collected, defining the number of parameters to be collected for the measurement steps under the wafer process steps; the collection rule definition unit is used to define the wafer sampling rules, defining the number of wafers, wafer positions, and preset rules for different devices, product flows, and batches.

[0064] The data analysis module is used to extract the original wafer data under the collection rules matched by the measurement steps in the wafer processing process of the process product flow module, and then process the original wafer data according to the preset rules and output the results. Among which, the preset rules adopt industry-standard statistical data analysis algorithms, specifically including: exceeding the upper and lower specification limits of the original wafer data; exceeding the upper and lower control limits of the original wafer data; N consecutive points falling on the same side of the center line; N consecutive points rising or falling; adjacent points among N consecutive points alternating up and down; N-1 points among N consecutive points exceeding the Sigma value of the original wafer data; where N is an integer.

[0065] The device control module includes a device status control module and a device data monitoring module; among which, the device data monitoring module is used to monitor the device operation parameters in real time, connect to the EAP system through the external system interface module to collect data such as device temperature, pressure, and air flow and provide instant feedback; the device status control module is used to manage the device status, instantaneously update the device status information, and synchronize it to the MES system and the EAP system through the external system interface.

[0066] The process alarm module includes an equipment data alarm module and a wafer data acquisition alarm module. Among them, the equipment offline data alarm module detects the equipment operation parameters and performs an alarm operation to prompt the process engineer that there is a problem with the equipment when the operation parameters exceed the limit value. The wafer data acquisition alarm module analyzes the wafer data acquisition results through the data analysis module and prompts the process engineer that there is a problem with the wafer processing technology of the corresponding batch.

[0067] The present invention can quickly respond to production problems, monitor the key parameters of each process link in real time, immediately discover and correct process deviations in the wafer processing process, and can issue early warnings and control functions when detecting abnormal situations, optimize the wafer production efficiency, reduce the problem handling time, and ensure the product yield.

[0068] The present invention can realize high-density data acquisition, intelligent analysis and precise control of the entire wafer manufacturing process, specifically including:

[0069] High-performance data acquisition and storage: Customize data acquisition rules, be able to collect a large amount of data from equipment and detection systems in real time and at high speed, and store it quickly and reliably in the database.

[0070] Process data analysis ability: Use industry-standard statistical process management techniques and data analysis algorithms to perform data analysis on the entire process.

[0071] Real-time monitoring and early warning functions: Real-time monitor the key parameters of each process link, immediately discover and correct process deviations in the wafer processing process, and can issue early warnings and control functions when detecting abnormal situations.

[0072] As Figure 2 shown, the embodiment of the present invention further provides a control method for a data acquisition analysis and control system based on the above-mentioned wafer production process flow, specifically including the following steps:

[0073] S1. The administrator configures the equipment operation permissions, measurement step permissions and acquisition rule permissions of different users through the user permission module.

[0074] S2. The user configures the number of wafer samples to be collected, the number of sample points and the preset rules for different product processes through the parameter set module.

[0075] S3. The MES system synchronizes the process product flow information with the process product flow module through the external system interface module to determine the automated wafer processing process production line, and the EAP system synchronizes the equipment status and equipment data information with the equipment control module through the external system interface module.

[0076] S4. The user binds the wafer parameter set to the measurement steps of the wafer processing process through the process product flow module to determine the acquired wafer parameter set.

[0077] In S5, during the production process, the equipment control module collects equipment data, and the data analysis module processes the collected wafer dataset according to preset rules and outputs the analysis results.

[0078] In S6, based on the wafer data analysis results in S5, the process alarm module processes the equipment status through the equipment control module and notifies the corresponding process engineer through the MES system interface module that there are process problems with the wafers in the corresponding product process.

[0079] In the whole wafer production process of the present invention, the production status is monitored in real time, a large amount of data is collected from equipment and wafer processing steps in real time and at high speed, and is quickly and reliably stored in the database; during the data collection process, the data is analyzed in real time, and the data analysis results are immediately fed back; production problems are quickly responded to, the key parameters of each process link are monitored in real time, process deviations in the wafer processing process are immediately discovered and corrected, and early warnings and control functions are issued when abnormal situations are detected, optimizing the wafer production efficiency, reducing the problem handling time, and ensuring the product yield.

[0080] In order to better understand the above technical solution, the above technical solution will be described in detail below in combination with the specification drawings and specific implementation manners.

[0081] As Figure 2 shown, the present invention specifically includes the following steps:

[0082] Configure equipment operation permissions: Different equipment operation permissions are configured according to different process engineers. For example, the wet process engineer only has the operation permission for wet process equipment, the diffusion engineer only has the operation permission for diffusion equipment, and the etching engineer only has the operation permission for etching equipment.

[0083] Configure measurement step permissions: Configure the operation permissions of process engineers according to the processing areas of specified measurement steps.

[0084] Configure collection rule permissions: Configure the processing collection rule permissions of process engineers and specify the rule processing permissions for the original wafer data.

[0085] Configure the number of collected wafers: Configure the number of sampled wafers in the product process of batch processing wafers in the parameter definition.

[0086] Configure the number of sampled points: Configure the number of sampled points for the number of sampled wafers in the parameter definition.

[0087] Set preset rules: Configure the rules that each wafer parameter needs to match, match the number of wafers and wafer positions that need to be matched under different batches, equipment, and product processes, and at the same time set the upper specification limit, lower specification limit, upper control limit, and lower control limit of the parameters.

[0088] Synchronize the product process of the MES system: Communicate with the MES system through the external system interface module for the wafer processing batch and the wafer processing product process to synchronize the wafer processing technological process information. For example, Figure 3 As shown, the data transmission communication protocol is the HTTP protocol, and the interface form adopts the API interface in the standard RestFul form.

[0089] Synchronize the device data of the EAP system: Communicate with the EAP system through the external system interface module for the device information and device data to synchronize the device information and device data. For example, Figure 3 As shown, the data transmission communication protocol is the HTTP protocol, and the interface form adopts the API interface in the standard RestFul form. The system of the present invention will collect device data in real time for monitoring, and the device data supports custom transmission, including but not limited to the temperature of the central cavity of the device, the temperature of the wafer entering the central cavity of the device, the temperature of the wafer exiting the central cavity of the device, the temperature of the wafer entering the bottom center of the device, the temperature of the wafer exiting the bottom center of the device, the temperature of the bottom center of the device, the temperature of the top center of the device, the temperature of the wafer entering the top center of the device, the temperature of the wafer exiting the top center of the device, the inlet air pressure, the inlet air flow rate, etc.

[0090] Determine the parameter set of the wafer for the measurement step: Bind the parameter set for the measurement step of the wafer processing technological process. Each measurement step corresponds to a parameter set, and the parameter set can have any number of custom parameters. In a preferred embodiment of the present invention, in the step where the measurement step is the mark depth test, a parameter set named SACREMOVE is bound. There are two parameters under this parameter set, namely the thickness credibility of the film after sacrificial layer etching and the thickness of the film after sacrificial layer etching.

[0091] Data acquisition and processing: Match the parameters according to the preset rules and the number of acquisition wafers and the number of acquisition sample points defined by the parameters. In a preferred embodiment of the present invention, the number of acquisition wafers for the parameter named the thickness of the film after sacrificial layer etching is 5, and the number of sample points is 9. According to the preset rules, 9 measurement points on 5 wafers in a batch are acquired. For example, Figure 4 As shown, in batch CP000010, wafers 1, 3, 5, 7, and 9 are acquired. A total of 5*9 = 45 data points are obtained by taking 9 measurement points on each wafer as a set of wafer data.

[0092] Data analysis and processing: Process the wafer data obtained from data acquisition and processing according to the rules set for this parameter in the preset rules to obtain the corresponding data analysis results. The data analysis results include the average value, range, standard deviation, maximum value, minimum value of a set of wafer data, and the result value of rule violation. Further, the preset rules include, but are not limited to, exceeding the upper and lower specification limits of the original wafer data, exceeding the upper and lower control limits of the original wafer data, N consecutive points falling on the same side of the center line, N consecutive points rising or falling, adjacent points alternating up and down among N consecutive points, and N - 1 points out of N consecutive points exceeding the Sigma value of the original wafer data. Here, N points are a set of wafer data.

[0093] Equipment status control and alarm: According to the data analysis and processing results, change the equipment operation status, send an alarm notification to the corresponding equipment engineer, and synchronize the equipment information to the EAP system.

[0094] Wafer process product flow control and alarm: According to the data analysis and processing results, change the process status of the batch - processed products, send an alarm notification to the corresponding process engineer, and synchronize the process status information of the batch - processed products to the MES system.

[0095] Repeat the above steps until all wafer process product flows are completed.

[0096] The specific implementation manners of the present invention are only examples and are not limited to the above. Within the scope of the present invention, various changes and modifications can be made to the present invention. For example, according to the specific production scenarios and requirements of the wafer processing technology measurement steps, the parameters under the corresponding wafer parameter set can be changed, the number of collected wafers, the number of collected sample points, and the preset rules can be changed. Also, according to different execution manners and data transmission communication protocols, the equipment data of different Eap systems can be collected.

[0097] The above are only the preferred implementation manners of the present invention. The protection scope of the present invention is not limited to the above - mentioned embodiments. All technical solutions falling within the concept of the present invention belong to the protection scope of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present invention should be regarded as within the protection scope of the present invention.

Claims

1. A data collection, analysis and control system for wafer production process, characterized in that: It includes user authority module, process product flow module, parameter parameter set module, equipment card control module, data analysis module, process alarm module and external system interface module; The user authority module is used to check the user role authority; The process product flow module is used to monitor and manage the wafer production process flow; The equipment card control module is used to control the state of the wafer processing equipment; The data analysis module is used to match the wafer parameter collection rules and perform wafer parameter data analysis; The process alarm module is used for alarm notification of wafer parameter data analysis results; The parameter set module is used to define the number of acquisition points and acquisition rules of the wafer; The external system interface module is used for communicating and synchronizing data with the MES system and the EAP system through interfaces.

2. The data collection, analysis and control system for wafer production process flow according to claim 1, characterized in that: The user authority module, process product flow module, equipment card control module, data analysis module, process alarm module, parameter parameter set module and external system interface module are interconnected and communicated with each other; The user authority module communicates one-way with the equipment card control module, the process product flow module, and the parameter parameter set module. The user configures different equipment control permissions, process product flow measurement step permissions, and parameter parameter set collection rule permissions through the user authority module; The process product flow module communicates bidirectionally with the equipment card control module. The process product flow module transmits the wafer process step information to the equipment card control module. The equipment card control module changes the equipment status according to the equipment information corresponding to the process step and feeds back to the process product flow module. The parameter set module communicates unidirectionally with the process product flow module and the data analysis module. The parameter set module defines the collection rules of the measurement steps, the number of wafers collected, the number of wafer collection points, the wafer collection parameters, and the wafer collection parameter set, binds the collection parameter information with the measurement steps under the process product flow module, and transmits the collected data to the data analysis module. The data analysis module performs real-time data rule calculation, data analysis and processing; The data analysis module communicates with the process alarm module in a one-way manner. The data analysis module transmits the analysis results of the wafer acquisition data to the process alarm module. The process alarm module analyzes the data analysis results and generates corresponding wafer process step alarm information. The process alarm module communicates with the equipment card control module and the external system interface in a one-way manner. The process alarm module transmits the process step alarm information to the MES system and the EAP system through the external system interface, and the equipment card control module performs the corresponding equipment processing operation according to the alarm information; The user authority module, process product flow module, and equipment card control module communicate bidirectionally with the external system interface module. The user authority information of the user authority module, the wafer process flow information of the process product flow module, and the equipment status card control information of the equipment card control module are synchronized and stored with the MES system and EAP system through the external system interface module.

3. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The user authority module also includes an equipment operation authority unit and a wafer process step authority unit; The device operation permission unit is used to configure the user's permission to operate the device. Only the specified user can operate the specified device. The wafer process step permission unit is used to configure the user's permission to operate the wafer process processing steps, and the selected wafer process steps are used to specify the equipment for processing.

4. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The process product flow module includes a product flow definition module and a product parameter set definition module; wherein the product flow definition module is used to configure the process steps of the wafer processing process flow; the product parameter set definition module is used to configure the measurement steps and measurement acquisition parameter sets in the wafer processing process flow.

5. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The parameter set module includes a parameter definition unit, a parameter set definition unit and an acquisition rule definition unit; wherein the parameter definition unit is used to define the acquisition parameters, define the number of wafers acquired for each parameter, the number of measurement points acquired for a single wafer, the target value, the upper specification limit, the lower specification limit, the upper control limit and the lower control limit; The parameter set definition unit is used to define the collection parameter set and the number of parameters that need to be collected in the measurement step under the wafer process step; the collection rule definition unit is used to define the wafer collection rules and define the number of wafers, wafer positions and preset rules for different equipment, product processes and batches.

6. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The data analysis module is used to extract the original data of the wafer under the acquisition rules matched by the measurement steps in the wafer processing process in the process product flow module, and then process the original data of the wafer according to the preset rules and output the results.

7. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The equipment card control module includes an equipment status control module and an equipment data monitoring module; the equipment data monitoring module is used to monitor the equipment operating parameters in real time, connect to the EAP system through the external system interface module to collect equipment temperature, pressure, and airflow data and provide instant feedback; the equipment status control module is used to manage the equipment status, update the equipment status information in real time, and synchronize it to the MES system and EAP system through the external system interface.

8. The data collection, analysis and control system for wafer production process flow according to claim 1 or 2, characterized in that: The process alarm module includes an equipment data alarm module and a wafer data acquisition alarm module; the equipment offline data alarm module detects the equipment operating parameters, and when the operating parameters exceed the limit value, it performs an alarm operation to prompt the process engineer that there is a problem with the equipment; the wafer data acquisition alarm module analyzes the wafer data acquisition results through the data analysis module, and prompts the process engineer that there is a problem with the wafer processing technology of the corresponding batch.

9. An analysis and control method based on the data collection, analysis and control system of the wafer production process according to any one of claims 1 to 8, characterized in that: Includes steps: S1. Configure different users' device operation permissions, measurement step permissions and collection rule permissions through the user permission module; S2. Configure the number of wafers collected, the number of sample points and preset rules for different product processes through the parameter set module; S3. The MES system synchronizes process product flow information with the process product flow module through the external system interface module to determine the automated wafer processing process flow production line. The EAP system synchronizes equipment status and equipment data information with the equipment card control module through the external system interface module. S4. Bind the wafer parameter set to the measurement steps of the wafer processing process through the process product flow module, and determine the acquisition wafer parameter set; S5. During the production process, the equipment card control module collects equipment data, and the data analysis module processes the collected wafer data set according to preset rules and outputs the analysis results; S6. The process alarm module processes the equipment status through the equipment card control module according to the wafer data analysis results in step S5, and notifies the corresponding product process through the MES system interface module whether there are process problems with the wafers.

10. The analysis and control method according to claim 9, characterized in that: The equipment data information includes one or more of the following: the temperature of the center cavity of the equipment, the film input temperature of the center cavity of the equipment, the film output temperature of the center cavity of the equipment, the film input temperature of the bottom center of the equipment, the film output temperature of the bottom center of the equipment, the bottom center temperature of the equipment, the center temperature of the top center of the equipment, the film input temperature of the top center of the equipment, the film output temperature of the top center of the equipment, the film input air pressure and the film input air flow rate.

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