Flexible display device

Abstract

Disclosed is a flexible display device having improved heat dissipation efficiency, the flexible display device including: a support frame having an accommodation space formed therein; a display panel disposed in the accommodating space of the support frame; a heat dissipation plate disposed on a rear surface of the display panel; and a buffer portion provided between the heat dissipation plate and the support frame and formed so as to be elastically deformable.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2023 - 0181872, filed on December 14, 2023, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical field

[0003] Embodiments of the present disclosure relate to a flexible display device. Background art

[0004] Recently, with the advent of the information age, the field of displays for visually expressing electrical information signals has developed rapidly. Accordingly, various display devices having excellent properties such as a thin - film design, light weight, and low power consumption have been developed.

[0005] Specific examples of such display devices include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an organic light - emitting display device (OLED).

[0006] Recently, a flexible display device, which is manufactured using a flexible material such as a plastic material instead of an existing non - flexible glass substrate and can maintain its display performance even when bent like paper, has emerged rapidly as a next - generation display device.

[0007] A flexible display device generally may include: a display panel configured to display an image; a heat - dissipation plate disposed on a rear surface of the display panel; and a support frame on which the display panel and the heat - dissipation plate are mounted. In this case, in order to prevent damage to the display panel when an external force is applied to bend the flexible display device, an air gap is formed between the display panel and the support frame.

[0008] Due to this air gap, convection and radiation are generated between the heat - dissipation plate and the support frame, causing the temperature of the display panel to rise, which has an adverse effect on the afterimage and lifespan of the display panel. Summary of the invention

[0009] Embodiments of the present disclosure may provide a flexible display device in which a buffer portion containing a conductive material is provided between a display panel and a support frame, so that heat dissipated from the heat - dissipation plate can be exchanged through the buffer portion and dissipated to the outside of the support frame.

[0010] Embodiments of the present disclosure may provide a flexible display device that has improved heat - dissipation efficiency because an air gap is not formed due to the buffer portion provided between the display panel and the support frame.

[0011] Embodiments of the present disclosure may provide a flexible display device that can exhibit high brightness, long life, low power consumption, and improved image retention by effectively removing heat generated in a display panel via a heat dissipation plate and a buffer unit.

[0012] Embodiments of the present disclosure may provide a flexible display device in which an elastically deformable buffer unit is provided between a heat dissipation plate and a support frame, so that the flexible display device exhibits improved durability by absorbing externally applied shock via the buffer unit.

[0013] Embodiments of the present disclosure may provide a flexible display device including: a support frame having an accommodation space formed therein; a display panel disposed in the accommodation space of the support frame; a heat dissipation plate disposed on a rear surface of the display panel; and a buffer unit disposed between the heat dissipation plate and the support frame and formed to be elastically deformable.

[0014] According to an embodiment of the present disclosure, there may be provided a flexible display device in which a buffer unit containing a conductive material is provided between a display panel and a support frame, so that heat dissipated from the heat dissipation plate can be exchanged through the buffer unit and dissipated to the outside of the support frame.

[0015] According to an embodiment of the present disclosure, there may be provided a flexible display device that has improved heat dissipation efficiency because an air gap is not formed due to a buffer unit provided between a display panel and a support frame.

[0016] According to an embodiment of the present disclosure, there may be provided a flexible display device that can exhibit high brightness, long life, low power consumption, and improved image retention by effectively removing heat generated in a display panel via a heat dissipation plate and a buffer unit.

[0017] According to an embodiment of the present disclosure, there may be provided a flexible display device in which an elastically deformable buffer unit is provided between a heat dissipation plate and a support frame, so that the flexible display device exhibits improved durability by absorbing externally applied shock via the buffer unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a cross-sectional view of a flexible display device according to an embodiment of the present disclosure.

[0019] Figure 2 is a cross-sectional perspective view of a buffer unit according to an embodiment of the present disclosure.

[0020] Figure 3It is a cross-sectional view showing a flexible display device without a buffer part according to a comparative embodiment.

[0021] Figure 4A The surface temperature of a flexible display device according to an embodiment of the present disclosure is shown.

[0022] Figure 4B The surface temperature of a flexible display device according to a comparative embodiment is shown.

[0023] Figure 5 、 Figure 6 and Figure 7 The configurations of buffer parts according to other embodiments of the present disclosure are shown.

[0024] Figure 8 The state in which a buffer part according to an embodiment of the present disclosure is fixed to a support frame is shown.

[0025] Figure 9 and Figure 10 The states in which buffer parts according to other embodiments of the present disclosure are each fixed to a support frame are shown.

[0026] Figure 11A It is a diagram showing the gravitational acceleration of a display panel when an impact is applied to a flexible display device according to an embodiment of the present disclosure.

[0027] Figure 11B is shown in Figure 3 It is a diagram showing the gravitational acceleration of a display panel when an impact is applied to a flexible display device of the comparative embodiment shown. Detailed Embodiments

[0028] In the following description of examples or embodiments of the present invention, reference will be made to the accompanying drawings, in which specific examples or embodiments that can be implemented are illustrated by way of illustration, and the same reference numerals in the drawings can be used to designate the same or similar components, even if they are shown in different drawings from each other. Further, in the following description of examples or embodiments of the present invention, when it is determined that the description may make the subject matter in some embodiments of the present invention quite unclear, the detailed description of well-known functions and components incorporated herein will be omitted. Unless used together with the term "only", terms such as "comprising", "having", "containing", "composing", "consisting of", "formed of" used herein generally intend to allow the addition of other components. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form.

[0029] In this document, terms such as "first", "second", "A", "B", "(A)", or "(B)" may be used to describe elements of the present invention. Each of these terms is not used to define the nature, order, sequence, number, etc. of the elements, but only to distinguish the corresponding elements from other elements.

[0030] When referring to a first element being "connected or coupled to" a second element, "contacting or overlapping" with the second element, etc., it should be interpreted that not only can the first element be "directly connected or coupled to" the second element or "directly contact or overlap" with the second element, but also a third element can be "inserted" between the first element and the second element, or the first element and the second element can be "connected or coupled", "contacted or overlapped", etc. with each other via a fourth element. Here, the second element may be included in at least one of two or more elements that are "connected or coupled", "contacted or overlapped", etc. with each other.

[0031] When using time-related terms such as "after", "subsequently", "next", "before", etc. to describe the processing or operation of an element or configuration or the process or steps in an operation, processing, manufacturing method, these terms may be used to describe non-consecutive or non-sequential processing or operations, unless the terms "directly" or "immediately" are used together.

[0032] In addition, when referring to any size, relative size, etc., it should be considered that the numerical value or corresponding information of an element or feature (e.g., level, range, etc.) includes a tolerance or error range that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even if no relevant description is specified. Furthermore, the term "may" fully encompasses all meanings of the term "can".

[0033] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0034] Figure 1 is a cross-sectional view of a flexible display device according to an embodiment of the present disclosure.

[0035] Referring to Figure 1 , the flexible display device 100 may include a support frame 110, a display panel 120, a heat dissipation plate 130, a buffer portion 140, and a cover glass 150.

[0036] In the following embodiments of the present disclosure, for ease of explanation, on the premise that the display surface of the display panel 120 for displaying an image faces forward, an example will be described in which the heat dissipation plate 130 and the buffer portion 140 are located behind the display panel 120 and below the display panel 120 in the drawings.

[0037] The support frame 110 is used to accommodate and protect various components therein, and an accommodation space 110a can be formed therein. For example, the support frame 110 can be formed in a box shape with an open front. Accordingly, the display panel 120, the heat dissipation plate 130, and the buffer unit 140 can be accommodated through an opening 110b formed at the front, and can be disposed in the accommodation space 110a.

[0038] The support frame 110 can be formed of a metal material that can be elastically deformed and restored to achieve bending. When the support frame 110 is formed of a metal material that can be elastically deformed and restored as described above, bending can be achieved, and heat generated during the driving of the flexible display device 100 can be dissipated externally after heat exchange.

[0039] The display panel 120 is a panel for displaying an image, and can include a light-emitting element for displaying an image, a circuit for driving the light-emitting element, and wirings, and the display panel 120 can be disposed in the accommodation space 110a of the support frame 110.

[0040] The display panel 120 can be composed of an organic light-emitting display panel that can maintain its display performance even when bent like paper. The configuration of the display panel is not limited to the above example, and the display panel can be composed of a liquid crystal display panel, a field emission display panel, etc.

[0041] The heat dissipation plate 130 is used to dissipate heat generated in the display panel 120 externally, and can be disposed on the rear surface of the display panel 120. For example, the heat dissipation plate 130 can be composed of any one selected from aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), and iron (Fe) having high thermal conductivity, or can be composed of an alloy of two or more of these metals. Specifically, the heat dissipation plate 130 is preferably formed of aluminum or an aluminum alloy, which has characteristics of high thermal conductivity, low weight, and low cost.

[0042] The end of the heat dissipation plate 130 can be formed not to exceed the end of the display panel 120. That is, the edge portion of the heat dissipation plate 130 can be formed not to exceed the edge of the display panel 120. This is because a large amount of heat is not generated at the edge of the display panel 120, and thus even if the end of the heat dissipation plate 130 is formed not to exceed the end of the display panel 120, the heat dissipation efficiency will not be reduced, and the product can be made compact and lightweight.

[0043] The buffer portion 140 is disposed between the heat dissipation plate 130 and the support frame 110 and may be formed to be elastically deformable. As described above, since the elastically deformable buffer portion 140 is disposed between the heat dissipation plate 130 and the support frame 110, when an external force is applied to bend the display panel 120, the buffer portion 140 can be compressed according to the shape of the display panel 120, thereby preventing damage to the display panel 120. In addition, vibrations occurring during the driving of the display panel 120 can be absorbed by the buffer portion 140. Further, when the buffer portion 140 is applied to a vehicle display device, impacts applied to the display panel 120 during driving can be absorbed by the buffer portion 140, thus minimizing deformation or damage to the display panel 120.

[0044] The buffer portion 140 may include a thermally conductive material. For example, the buffer portion 140 may include a metal such as aluminum, copper, or nickel or graphite, which has good thermal conductivity.

[0045] As described above, since the buffer portion 140 including the thermally conductive material is disposed between the heat dissipation plate 130 and the support frame 110, the buffer portion 140 can dissipate heat generated in the display panel 120 externally together with the heat dissipation plate 130, thereby improving the heat dissipation efficiency.

[0046] Figure 2 is a cross-sectional perspective view of a buffer portion according to an embodiment of the present disclosure. The configuration of the buffer portion 140 will be described below with reference to Figure 2 Describe the configuration of the buffer portion 140.

[0047] As Figure 2 shown, the buffer portion 140 may include a body portion 141 and a thermally conductive coating portion 142.

[0048] The body portion 141 is used to absorb impacts applied to the display panel 120 and may be formed of an expandable foam material. For example, the body portion 141 may be composed of one selected from polyurethane foam, phenolic resin foam, polyvinyl chloride foam, polypropylene foam, and polyethylene foam.

[0049] The thermally conductive coating portion 142 is used to perform secondary heat exchange with heat exchanged once through the heat dissipation plate 130 and dissipate the heat to the outside of the support frame 110, and the thermally conductive coating portion 142 may be formed on the surface of the body portion 141. For example, the thermally conductive coating portion 142 may be composed of a metal such as aluminum, copper, or nickel or a graphite material and may be formed on the surface of the body portion 141 by a method such as electroplating.

[0050] The front surface of the heat-conducting coating part 142 can be in contact with the heat dissipation plate 130, and its rear surface can be in contact with the support frame 110. Therefore, the heat-conducting coating part 142 can receive the heat exchanged once through the heat dissipation plate 130, conduct secondary heat exchange with the received heat, and then dissipate the heat toward the support frame 110. As described, since heat exchange can occur again through the heat-conducting coating part 142, the heat dissipation efficiency of the flexible display device 100 can be improved.

[0051] Figure 3 FIG. is a cross-sectional view showing a flexible display device without a buffer part according to a comparative embodiment.

[0052] Refer to Figure 3 , the flexible display device 1 according to the comparative embodiment has the same structure as the flexible display device 100 of the embodiment of the present disclosure, but is different from the flexible display device 100 in that an air gap G is formed between the heat dissipation plate 130 and the support frame 110 because no buffer part 140 is provided between the heat dissipation plate 130 and the support frame 110.

[0053] Figure 4A shows the surface temperature of the flexible display device according to an embodiment of the present disclosure, and Figure 4B shows the surface temperature of the flexible display device according to the comparative embodiment.

[0054] The embodiments and comparative embodiments of the present disclosure are tested under the conditions of room temperature (25 °C) and a brightness of 900 nits. The hardness of the buffer part 140 in the embodiment of the present disclosure is 20 and the thickness is 3 mm, and a heat-conducting material is formed on the outer peripheral surface of the buffer part 140 by coating copper with a thermal conductivity of 401 W / (m*k). Therefore, the highest temperature of the flexible display device 100 according to the embodiment of the present disclosure is measured to be 40.55 °C, and the highest temperature of the flexible display device 1 according to the comparative embodiment is measured to be 42.52 °C.

[0055] From these results, it can be seen that when a buffer part 140 containing a heat-conducting material is provided between the heat dissipation plate 130 and the support frame 110, the surface temperature of the flexible display device 100 is lower than that of the flexible display device 1 according to the comparative embodiment. This is because, due to the air gap G formed between the heat dissipation plate 130 and the support frame 110, the flexible display device 1 according to the comparative embodiment is not easily dissipated to the outside of the support frame 110 by the convection and radiation acting in the air gap G the heat dissipated from the heat dissipation plate 130.

[0056] On the other hand, in the flexible display device 100 according to an embodiment of the present disclosure, the heat dissipated from the heat sink 130 can be exchanged through the buffer part 140 and easily dissipated to the outside of the support frame 110 because no air gap G is formed between the heat sink 130 and the support frame 110 due to the buffer part 140, and the buffer part 140 includes a thermally conductive material. Therefore, as in the embodiment of the present disclosure, when the buffer part 140 containing the thermally conductive material is disposed between the heat sink 130 and the support frame 110, the heat dissipation efficiency of the flexible display device 100 can be improved.

[0057] The cover glass 150 is used to protect the display panel 120 from external impacts and scratches, and can be disposed at the front of the support frame 110. Therefore, the cover glass 150 can cover the opening 110b formed at the front of the support frame 110, thereby preventing water or foreign substances from penetrating into the display panel 120.

[0058] The cover glass 150 may be composed of a material having impact resistance and light-transmitting properties. For example, the cover glass 150 may be composed of a glass substrate, or may be formed of a plastic film formed of one selected from polymethyl methacrylate (PMMA), polyimide (PI), polyethylene terephthalate (PET), and combinations thereof.

[0059] According to an embodiment of the present disclosure, the heat sink 130 may be fixed within the support frame 110 by a double-sided foam tape 160. For example, the double-sided foam tape 160 may be disposed along the rear edge of the heat sink 130, and the buffer part 140 may be disposed inside the double-sided foam tape 160 at an interval from the double-sided foam tape 160.

[0060] As described above, since the heat sink 130 is fixed to the support frame 110 by the double-sided foam tape 160, when the flexible display device 100 is bent, the double-sided foam tape 160 together with the buffer part 140 can elastically deform and recover. Therefore, during the process of applying an external force to the display panel 120, the damage to the display panel 120 is minimized, and due to its enhanced adhesiveness, the heat sink 130 can be prevented from detaching from the support frame 110.

[0061] The adhesive layers formed on the front and rear surfaces of the double-sided foam tape 160 may include a thermally conductive material. For example, the adhesive layer may be formed by mixing metal powder with an acrylic or silicone adhesive. Therefore, the heat dissipated from the heat sink 130 can also be exchanged through the double-sided foam tape 160, thereby improving the heat dissipation efficiency.

[0062] Meanwhile, the buffer part 140 may be formed to have a height equal to or greater than the height of the double-sided foam tape 160 and less than the height of the accommodation space 110a. This is because if the height of the buffer part 140 is less than the height of the double-sided foam tape 160, an air gap is formed between the buffer part 140 and the heat dissipation plate 130, thereby reducing the heat dissipation efficiency, and the buffer part 140 may not be stably fixed on the support frame 110. Additionally, if the height of the buffer part 140 is greater than the height of the accommodation space 110a, the buffer part 140 may be exposed to the outside instead of being located within the accommodation space 110a. Therefore, the height of the buffer part 140 is preferably less than the height of the accommodation space 110a.

[0063] Figure 5 FIG. is a cross-sectional view showing the configuration of a buffer part according to another embodiment of the present disclosure. This embodiment will be mainly described with respect to the differences from the previously described embodiment.

[0064] Referring to Figure 5 , the buffer part 240 may include an elastically deformable member 241 and a spring member 242.

[0065] The elastically deformable member 241 is formed of an expandable foam material and may have a plurality of seat holes 241a. For example, the elastically deformable member 241 may be formed to be long in the vertical direction as shown in the drawings and may have circular seat holes 241a spaced apart from each other.

[0066] The spring member 242 is disposed in each of the seat holes 241a provided in the elastically deformable member 241 and may be formed of a heat-conductive material. For example, the spring member 242 may be composed of a metal such as aluminum, copper, or nickel or a graphite material, and the spring member 242 may be disposed in the seat hole 241a such that both ends of the spring member 242 are in contact with the heat dissipation plate 130 and the support frame 110, respectively.

[0067] As described above, when the ends of the spring member 242 composed of a heat-conductive material are in contact with the heat dissipation plate 130 and the support frame 110, the heat exchanged through the heat dissipation plate 130 can be exchanged again through the spring member 242 and then dissipated toward the support frame 110. Additionally, since the spring member 242 elastically deforms when an external force is applied to the display panel 120 for bending, the display panel 120 can be bent without being damaged.

[0068] Figure 6 FIG. is a cross-sectional view showing the configuration of a buffer part according to another embodiment of the present disclosure. This embodiment will focus on the differences from the previously described embodiment.

[0069] Referring to Figure 6 , the buffer part 340 may include a cover part 341 and a spring member 342.

[0070] The cover portion 341 may have a plurality of pocket portions 341a formed therein. For example, the cover portion 341 may be made of a resin or fabric material, and its internal space may be divided into a plurality of pocket portions 341a.

[0071] The surface of the cover portion 341 may be coated with a heat-conductive coating material. Here, the heat-conductive coating material may be made of a metal such as aluminum, copper, or nickel or a graphite material, and may be coated by a method such as electroplating. As described above, when the surface of the cover portion 341 is coated with the heat-conductive coating material, the heat exchanged by the heat dissipation plate 130 once can be secondarily exchanged and dissipated to the outside of the support frame 110.

[0072] The cover portion 341 may be fixed to the heat dissipation plate 130 and the support frame 110 by an adhesive member containing metal or graphite powder. In this case, the heat exchanged by the heat dissipation plate 130 can be exchanged again by the adhesive member and dissipated to the outside of the support frame 110, thereby improving the heat dissipation efficiency.

[0073] A plurality of spring members 342 may be provided and disposed inside each pocket portion 341a. For example, a plurality of spring members 342 may be provided in one pocket portion 341a at intervals from each other, and may be formed of a metal material. Such a configuration of the spring members 342 enables elastic deformation of the buffer portion 140, thereby preventing damage to the display panel 120 during bending.

[0074] Although the present embodiment shows the spring members 342 separately disposed in the pocket portion 341a, an expandable foam may be further provided in the pocket portion 341a together with the spring members 342.

[0075] Figure 7 is a top view showing a configuration of a buffer portion according to another embodiment of the present disclosure. This embodiment will be described focusing on differences from the previously described embodiment.

[0076] Referring to Figure 7 , the buffer portion 440 may be formed of a metal material and have a plurality of holes 441 formed therein. That is, the buffer portion 440 may be formed to be compressible and recoverable by forming a plurality of holes 441 in a body 442 made of a metal material to reduce the density.

[0077] As described above, since the buffer portion 140 is entirely formed of a metal material, the heat exchange area can be increased, so that the heat generated from the display panel 120 can be dissipated faster and more effectively. Therefore, an increase in the temperature of the display panel 120 can be prevented, thereby reducing afterimage defects and improving the lifespan.

[0078] Figure 8Shows a state in which a buffer unit according to an embodiment of the present disclosure is fixed to a support frame.

[0079] Referring to Figure 8 , the buffer unit 140 may be integrally formed with the support frame 110, and thus the buffer unit 140 can be fixed to the support frame 110 without a separate fastening tool. For example, during the injection molding of the support frame 110, the buffer unit 140 can be fixed to the support frame by an insert injection molding method in which a part of the buffer unit 140 is inserted into the support frame 110.

[0080] Figure 9 Shows a state in which a buffer unit according to another embodiment of the present disclosure is fixed to a support frame. This embodiment will be described focusing on the differences from the previously described embodiment.

[0081] Referring to Figure 9 , the buffer unit 140 can be fixed within the support frame 110 by guide pins 170 protruding from the bottom surface of the support frame 110. For example, the guide pins 170 may include a plurality of first guide pins 171 that support the sides of the buffer unit 140 and a plurality of second guide pins 172 that are spaced apart from each other inside the first guide pins 171 and pass through the buffer unit 140. Here, the ends of the first guide pins 171 may be formed to contact the heat sink 130, and the ends may be coated with a heat conductive material.

[0082] Meanwhile, the upper and lower surfaces of the buffer unit 140 are respectively shielded by the heat sink 130 and the support frame 110, and thus, even if the guide pins 170 only fix the sides of the buffer unit 140, the buffer unit 140 can be stably fixed to the support frame 110.

[0083] Figure 10 Shows a state in which a buffer unit according to another embodiment of the present disclosure is fixed to a support frame. This embodiment will be described focusing on the differences from the previously described embodiment.

[0084] Referring to Figure 10 , the support frame 110 may include a fixing part 180 that covers a part of the buffer unit 540 and fixes a part of the buffer unit 540 within the accommodation space 110a, and the buffer unit 540 can be fixed to the support frame 110 by the fixing part 180.

[0085] Specifically, the fixing part 180 may include a protruding member 181 and an anti - detachment part 182.

[0086] The protruding member 181 may be formed to protrude from the inner bottom surface of the support frame 110 and cover the side surface of the buffer portion 540. For example, the protruding member 181 may be formed of the same material as the support frame 110 and may have a square ring shape that covers the side surface of the buffer portion 540.

[0087] The anti-disengagement portion 182 may extend inward from the end of the protruding member 181 and support a part of the buffer portion 540. For example, the anti-disengagement portion 182 may be formed of the same material as the support frame 110 and may have a square ring shape that covers a part of the upper side of the buffer portion 540. As described above, since the anti-disengagement portion 182 is formed to cover a part of the upper side of the buffer portion 540, the buffer portion 540 can be fixed to the support frame 110.

[0088] The buffer portion 540 according to the present embodiment may include: a first buffer layer 541, whose side surface is covered by the protruding member 181 and a part of whose front side is covered by the anti-disengagement portion 182; a second buffer layer 542, which is disposed on the first buffer layer 541 and whose side surface is covered by the anti-disengagement portion 182; and a third buffer layer 543, which is disposed on the second buffer layer 542.

[0089] Due to this configuration of the buffer portion 540, the buffer portion 540 can be placed in the fixing portion 180. That is, when the buffer portion 540 is compressed by applying an external force and then the first buffer layer 541 is inserted into the space inside the protruding member 181 and then the external force is released, the shape of the buffer portion 540 is restored, and the upper edge of the first buffer layer 541 is covered by the anti-disengagement portion 182, so that the buffer portion 540 can be fixed to the support frame 110.

[0090] Figure 11A is a diagram showing the gravitational acceleration of the display panel when an impact is applied to a flexible display device according to an embodiment of the present disclosure, and Figure 11B is a diagram showing the gravitational acceleration of the display panel when an impact is applied to a flexible display device according to a Figure 3 shown comparative embodiment. Here, in the flexible display device 100 according to the present disclosure, a buffer portion 140 having a hardness of 20 and a thickness of 3 mm is provided between the heat dissipation plate 130 and the support frame 110, and in the flexible display device 1 according to the comparative embodiment, a 3-mm air gap is formed between the heat dissipation plate 130 and the support frame 110.

[0091] Refer to Figure 11A and Figure 11B, it can be confirmed that when the buffer part 140 is provided between the heat dissipation plate 130 and the support frame 110 as in the present embodiment, the gravitational acceleration during the application of impact is smaller than that in the comparative embodiment where the buffer part 140 is not provided between the heat dissipation plate 130 and the support frame 110. Specifically, when comparing between 0.008 hours and 0.011 hours, it can be seen that when the buffer part 140 is provided, the gravitational acceleration can be reduced by about 7%. This is because when an impact is applied to the display panel 120, the elastic member absorbs the impact.

[0092] Based on these results, it can be seen that when the buffer part 140 is provided between the heat dissipation plate 130 and the support frame 110, the durability of the flexible display device 100 can be improved. In particular, when the buffer part 140 is applied to the flexible display device 100 of a vehicle that continuously undergoes impacts during driving, the buffer part 140 can reduce the impact applied to the display panel 120, thereby increasing the lifespan.

[0093] The embodiments of the present disclosure are briefly described as follows.

[0094] According to an embodiment of the present disclosure, a flexible display device can be provided, which includes: a support frame having an accommodation space formed therein; a display panel disposed in the accommodation space of the support frame; a heat dissipation plate disposed on the rear surface of the display panel; and a buffer part disposed between the heat dissipation plate and the support frame and formed to be elastically deformable.

[0095] According to an embodiment of the present disclosure, the buffer part may include a heat-conductive material.

[0096] According to an embodiment of the present disclosure, the heat-conductive material may be composed of metal or graphite.

[0097] According to an embodiment of the present disclosure, the buffer part may include a main body part formed of an expandable foam material and a heat-conductive coating part formed on the surface of the main body part.

[0098] According to an embodiment of the present disclosure, the buffer part may include an elastically deformable member formed of an expandable foam material and having a plurality of seat holes, and a spring member disposed in each seat hole and formed of a heat-conductive material.

[0099] According to an embodiment of the present disclosure, the buffer part may include: a cover part having a plurality of bag parts formed therein; and a plurality of spring members disposed inside the bag parts.

[0100] According to an embodiment of the present disclosure, the surface of the cover part may be coated with a heat-conductive coating material.

[0101] According to an embodiment of the present disclosure, the cover portion may be fixed to the heat sink and the support frame by an adhesive member including a heat-conductive powder.

[0102] According to an embodiment of the present disclosure, the buffer portion may be formed of a metal material and have a plurality of holes formed therein.

[0103] According to an embodiment of the present disclosure, the support frame and the buffer portion may be integrally formed with each other.

[0104] According to an embodiment of the present disclosure, the support frame may include a fixing portion that covers a part of the buffer portion and fixes a part of the buffer portion within the accommodation space.

[0105] According to an embodiment of the present disclosure, the fixing portion may include a protruding member that protrudes from the inner bottom surface of the support frame and covers the side surface of the buffer portion, and a detachment prevention portion that extends inward from an end of the protruding member.

[0106] According to an embodiment of the present disclosure, the buffer portion may include: a first buffer layer whose side surface is covered by the protruding member and a part of whose front side is covered by the detachment prevention portion; a second buffer layer that is disposed on the first buffer layer and whose side surface is covered by the detachment prevention portion; and a third buffer layer that is disposed on the second buffer layer.

[0107] According to an embodiment of the present disclosure, the buffer portion may be fixed within the support frame by guide pins protruding from the bottom surface of the support frame.

[0108] According to an embodiment of the present disclosure, the guide pins may include a plurality of first guide pins that support the side surface of the buffer portion and a plurality of second guide pins that are spaced apart from each other and are disposed inside the first guide pins and pass through the buffer portion.

[0109] According to an embodiment of the present disclosure, the support frame may be open at its front portion and have an opening at the front portion, and a cover glass for shielding the opening may be provided on the front portion of the support frame.

[0110] According to an embodiment of the present disclosure, the heat sink may be fixed within the support frame by a double-sided foam tape.

[0111] According to an embodiment of the present disclosure, the double-sided foam tape may be disposed along the rear edge of the heat sink, and the buffer portion may be disposed inside the double-sided foam tape and spaced apart from the double-sided foam tape.

[0112] According to an embodiment of the present disclosure, the adhesive layers formed on the front surface and the rear surface of the double-sided foam tape may contain a heat-conductive material.

[0113] According to an embodiment of the present disclosure, the buffer portion may be formed to be equal to or greater than the height of the double-sided foam tape and less than the height of the accommodation space.

[0114] The foregoing description has been presented to enable a person skilled in the art to make and use the inventive concept, and has been provided in the context of a particular application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be readily apparent to a person skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the invention. The foregoing description and drawings have provided only examples of the inventive concept for illustrative purposes. That is, the disclosed embodiments are intended to illustrate the scope of the inventive concept.

Claims

1. A flexible display device, comprising: a support frame having a receiving space formed therein; A display panel is disposed in the accommodation space of the support frame; a heat dissipation plate disposed on the rear surface of the display panel; as well as The buffer portion is provided between the heat dissipation plate and the support frame and is formed to be elastically deformable.

2. The flexible display device according to claim 1, wherein: The buffer portion includes a thermally conductive material.

3. The flexible display device according to claim 2, wherein: The thermally conductive material includes metal or graphite.

4. The flexible display device according to claim 1, wherein: The buffer portion includes a body portion formed of an expandable foam material and a thermal conductive coating portion formed on a surface of the body portion.

5. The flexible display device according to claim 1, wherein: The buffer portion includes an elastically deformable member formed of an expandable foam material and having a plurality of seat holes, and a spring member disposed in each of the seat holes and formed of a thermally conductive material.

6. The flexible display device according to claim 1, wherein: The buffer portion includes a cover portion having a plurality of pockets formed therein and a plurality of spring members disposed inside the pockets.

7. The flexible display device according to claim 6, wherein: The surface of the cover is coated with a thermal conductive coating material.

8. The flexible display device according to claim 6, wherein: The cover is fixed to the heat dissipation plate and the support frame by an adhesive member containing thermally conductive powder.

9. The flexible display device according to claim 1, wherein: The buffer portion is formed of a metal material and has a plurality of holes formed therein.

10. The flexible display device according to claim 1, wherein: The support frame and the buffer portion are formed integrally with each other.

11. The flexible display device according to claim 1, wherein: The supporting frame includes a fixing portion that covers a portion of the buffer portion and fixes the portion of the buffer portion in the accommodation space.

12. The flexible display device according to claim 11, wherein: The fixing portion includes a protruding member protruding from an inner bottom surface of the support frame and covering a side surface of the buffer portion, and a separation prevention portion extending inwardly from an end portion of the protruding member.

13. The flexible display device according to claim 12, wherein: The buffer portion comprises: a first buffer layer, a side surface of which is covered by the protruding member and a portion of a front surface of which is covered by the separation preventing portion; a second buffer layer, which is disposed on the first buffer layer and has a side surface covered by the anti-separation portion; and A third buffer layer is disposed on the second buffer layer.

14. The flexible display device according to claim 1, wherein: The buffer portion is fixed within the support frame by a guide pin protruding from a bottom surface of the support frame.

15. The flexible display device according to claim 14, wherein: The guide pins include a plurality of first guide pins supporting a side surface of the buffer portion and a plurality of second guide pins disposed inside the first guide pins at intervals from each other and passing through the buffer portion.

16. The flexible display device according to claim 15, wherein: Ends of the first guide pins are coated with a thermally conductive material.

17. The flexible display device according to claim 1, wherein: The support frame is open at a front portion thereof and has an opening at the front portion, and a cover glass shielding the opening is provided on a front side of the support frame.

18. The flexible display device according to claim 1, wherein: The heat sink is fixed in the support frame by double-sided foam tape.

19. The flexible display device according to claim 18, wherein: The double-sided foam tape is provided along a rear edge of the heat dissipation plate, and the buffer portion is provided inside the double-sided foam tape to be spaced apart from the double-sided foam tape.

20. The flexible display device according to claim 18, wherein: The adhesive layers formed on the front and rear surfaces of the double-sided foam tape contain a thermally conductive material.

21. The flexible display device according to claim 18, wherein: The height of the buffer portion is equal to or greater than the height of the double-sided foam tape and is less than the height of the accommodation space.

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