Semiconductor laser temperature control mechanism and method

Abstract

The invention discloses a semiconductor laser temperature control mechanism and method, and relates to the field of semiconductor lasers. A semiconductor laser temperature control mechanism comprises a thermal coupling substrate and further comprises a fixed connecting frame fixedly connected to the thermal coupling substrate, a fixed plate is fixedly connected to the fixed connecting frame, and a copper metal clad sheet and a steel metal clad sheet are fixedly connected to the thermal coupling substrate. A copper metal clad sheet and a steel metal clad sheet are sequentially and fixedly connected to the bottom of the thermal coupling substrate from top to bottom; a central shaft is fixedly connected to the fixed connecting frame, and a driving gear ring positive electrode is fixedly connected to the central shaft; the shell with the inner teeth rotates to enable the negative electrode of the driven gear ring to be far away from the positive electrode of the driving gear ring, a circuit is cut off, the heating electric wire stops working, the temperature is prevented from further rising, the shell with the inner teeth and the negative electrode of the driven gear ring are reset, the shell is meshed with the positive electrode of the driving gear ring again, the circuit is connected, and the heating electric wire starts heating.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor lasers, and specifically relates to a semiconductor laser temperature control mechanism and method. Background Art

[0002] Semiconductor lasers are extremely sensitive to temperature changes. Temperature fluctuations can cause output wavelength drift, power decline, and even device damage. Existing technologies mostly adopt active temperature control (such as TEC refrigeration) or passive heat dissipation (such as heat sink + fan), but there are the following problems: Active temperature control relies on electricity, has a complex structure and high energy consumption; passive heat dissipation has a slow response and is difficult to dynamically adapt to transient temperature changes; the mechanical structure is fixed, and the heat dissipation efficiency cannot be automatically adjusted according to the working conditions. The present invention proposes a pure mechanical self-adaptive temperature control mechanism, which realizes passive and efficient temperature control through the synergistic effect of a heat-deformable material adjustable heat dissipation structure. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a semiconductor laser temperature control mechanism that can overcome or at least partially solve the above problems.

[0004] To solve the above technical problem, the basic concept of the technical solution adopted by the present invention is: A semiconductor laser temperature control mechanism includes a thermal coupling substrate, and further includes: a fixed connection frame fixedly connected to the thermal coupling substrate, a fixed plate fixedly connected to the fixed connection frame, a copper metal composite sheet and a steel metal composite sheet fixedly connected to the thermal coupling substrate, and the copper metal composite sheet and the steel metal composite sheet are fixedly connected to the bottom of the thermal coupling substrate from top to bottom in sequence; a central shaft is fixedly connected to the fixed connection frame, a positive electrode of an active gear ring is fixedly connected to the central shaft, a negative electrode of a driven gear ring is rotatably connected to the central shaft, a housing with internal teeth is sleeved on the central shaft, and an external gear ring is fixedly connected to the housing with internal teeth; a fixed vertical tooth is fixedly connected to the copper metal composite sheet, and the fixed vertical tooth meshes with the external gear ring; when the copper metal composite sheet expands due to heat and the steel metal composite sheet bends downward, the copper metal composite sheet drives the fixed vertical tooth downward, and the fixed vertical tooth meshes with the external gear ring, driving the housing with internal teeth and the negative electrode of the driven gear ring away from one end of the positive electrode of the active gear ring; when the temperature drops, the copper metal composite sheet and the steel metal composite sheet return to a horizontal state, the fixed vertical tooth drives the external gear ring to rotate, and the housing with internal teeth and the negative electrode of the driven gear ring mesh with the positive electrode of the active gear ring.

[0005] Further, an installation groove is opened on the thermal coupling substrate, a laser chip is clamped on the installation groove, and a radial heat conduction groove is opened at one end of the thermal coupling substrate away from the installation groove, and the copper metal composite sheet and the steel metal composite sheet are fixedly connected to the radial heat conduction groove.

[0006] Furthermore, a connection column is inserted into one end of the thermal coupling substrate close to the copper metal composite sheet and the steel metal composite sheet, and the connection column penetrates the copper metal composite sheet and the steel metal composite sheet and extends to the periphery of the steel metal composite sheet.

[0007] Furthermore, a heating wire is fixedly connected to the positive electrode of the active gear ring, which is used for heating after the positive electrode of the active gear ring and the negative electrode of the driven gear ring are meshed with each other.

[0008] Furthermore, a shrinkable heat-conducting tube is fixedly connected to the positive electrode of the active gear ring, and a fixed end of the shrinkable heat-conducting tube passes through the positive electrode of the active gear ring and corresponds to one end of the heating wire.

[0009] Furthermore, a rotating shaft is threadedly connected to the outer shell with internal teeth.

[0010] Furthermore, a shielding curtain is fixedly connected to the fixed plate, a slide plate is fixedly connected to the shielding curtain, a pipe groove is opened on the fixed plate, and a limiting column is fixedly connected to the shielding curtain.

[0011] Furthermore, a sliding column is slidably connected to the fixed plate, and a heat conduction pipe wheel is rotatably connected to the sliding column. The heat conduction pipe wheel is energized and rotated after the positive electrode of the driving gear ring and the negative electrode of the driven gear ring are meshed with each other.

[0012] Furthermore, a starting shaft is rotatably connected to the heat conduction pipe wheel, the starting shaft is fixedly connected to the sliding column, a connecting rod is fixedly connected to the starting shaft, a fixed sliding wheel is fixedly connected to the connecting rod, and a roller is rotatably connected to the fixed sliding wheel.

[0013] Furthermore, a semiconductor laser temperature control method comprises the following steps: S1, when the temperature rises; Due to the difference in thermal expansion coefficients between the copper-metal composite sheet and the steel-metal composite sheet on the thermal coupling substrate, the expansion of the copper sheet drives the steel sheet to bend downward. At this time, the fixed vertical teeth on the copper-metal composite sheet move downward and mesh with the outer gear ring to drive the outer shell with the inner teeth to rotate, so that the negative electrode of the driven gear ring is away from the positive electrode of the active gear ring, cutting off the circuit, and the heating wire stops working to prevent the temperature from rising further. When the temperature drops; The copper metal composite sheet and the steel metal composite sheet return to a horizontal state, and the fixed vertical teeth drive the outer gear ring to rotate in the opposite direction, causing the outer shell with inner teeth and the negative electrode of the driven gear ring to reset, re-engage with the positive electrode of the active gear ring, connect the circuit, and the heating wire starts to heat; S2, heating and heat conduction work together; After the positive electrode of the driving gear ring meshes with the negative electrode of the driven gear ring, the heating wire is energized and generates heat. The heat is conducted to the thermal coupling substrate through the shrinkable heat conduction tube, maintaining the working temperature of the laser chip. At the same time, the heat conduction tube wheel rotates after the circuit is connected. Through the linkage of the starting shaft, connecting rod and fixed sliding wheel, the hot air inside the shrinkable heat conduction tube on the heat conduction tube wheel is continuously pushed towards one end of the slide plate, further maintaining the working temperature of the laser chip, optimizing the heat conduction path and improving the heat transfer efficiency; S3. Auxiliary structure cooperation; The radial heat conduction grooves of the thermal coupling substrate cooperate with the copper metal composite sheet and the steel metal composite sheet to quickly conduct the heat generated by the laser chip; the connecting column penetrates through the composite sheet, enhancing the structural stability and heat conduction performance; When the temperature rises, the shielding curtain on the fixing plate and the slide plate cooperate to open the shielding curtain to increase the heat dissipation area of the laser chip. The limiting column and the sliding column ensure the smooth sliding of components such as the heat conduction tube wheel, guaranteeing the stability of the temperature control process.

[0014] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: The outer shell with internal teeth of the present invention rotates, making the negative electrode of the driven gear ring away from the positive electrode of the driving gear ring, cutting off the circuit, and the heating wire stops working to avoid further temperature rise. The outer shell with internal teeth and the negative electrode of the driven gear ring reset and re-mesh with the positive electrode of the driving gear ring to connect the circuit, and the heating wire starts to heat.

[0015] The hot air inside the shrinkable heat conduction tube on the heat conduction tube wheel is continuously pushed towards one end of the slide plate, further maintaining the working temperature of the laser chip, optimizing the heat conduction path and improving the heat transfer efficiency.

[0016] When the temperature rises, the shielding curtain on the fixing plate and the slide plate cooperate to open the shielding curtain to increase the heat dissipation area of the laser chip. The limiting column and the sliding column ensure the smooth sliding of components such as the heat conduction tube wheel, guaranteeing the stability of the temperature control process. Brief Description of the Drawings

[0017] In the drawings: Figure 1 is the front view schematic diagram of a semiconductor laser temperature control mechanism proposed by the present invention; Figure 2 is the side view structural schematic diagram of a semiconductor laser temperature control mechanism proposed by the present invention; Figure 3 is a semiconductor laser temperature control mechanism proposed by the present invention Figure 2 The structural schematic diagram at position A in; Figure 4 is the structural schematic diagram of the fixing plate and the shielding curtain in a semiconductor laser temperature control mechanism proposed by the present invention; Figure 5Schematic top view structure diagram of a semiconductor laser temperature control mechanism proposed by the present invention; Figure 6 Schematic structure diagram of a copper-metal composite sheet and a steel-metal composite sheet in a semiconductor laser temperature control mechanism proposed by the present invention; Figure 7 Schematic structure diagram of a thermal coupling substrate and a fixing plate in a semiconductor laser temperature control mechanism proposed by the present invention; Figure 8 A semiconductor laser temperature control mechanism proposed by the present invention Figure 7 Schematic structure diagram at position B in; Figure 9 Schematic structure diagram of a sliding column and a heat conduction tube roller in a semiconductor laser temperature control mechanism proposed by the present invention.

[0018] In the figure: 1. Thermal coupling substrate; 11. Installation groove; 12. Laser chip; 13. Radial heat conduction groove; 2. Connecting column; 21. Copper-metal composite sheet; 22. Steel-metal composite sheet; 23. Fixed vertical teeth; 3. Fixed connection frame; 31. Central axis; 32. Outer shell with internal teeth; 33. Outer gear ring; 34. Negative electrode of driven gear ring; 35. Positive electrode of driving gear ring; 36. Heating wire; 37. Contracting heat conduction tube; 38. Rotating shaft; 4. Fixing plate; 41. Shading curtain; 42. Slide plate; 43. Tube groove; 44. Limit column; 45. Sliding column; 46. Heat conduction tube wheel; 47. Starting shaft; 48. Connecting rod; 49. Fixed sliding wheel; 410. Roller. Specific implementation manners

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0020] Example 1: Refer to Figures 1-9, a semiconductor laser temperature control mechanism, including a thermal coupling substrate 1, further including: a fixed connection frame 3 fixedly connected to the thermal coupling substrate 1, a fixed plate 4 fixedly connected to the fixed connection frame 3, a copper metal composite sheet 21 and a steel metal composite sheet 22 fixedly connected to the thermal coupling substrate 1, and the copper metal composite sheet 21 and the steel metal composite sheet 22 are fixedly connected in sequence from top to bottom at the bottom of the thermal coupling substrate 1; a central shaft 31 is fixedly connected to the fixed connection frame 3, a positive electrode of the driving gear ring 35 is fixedly connected to the central shaft 31, a negative electrode of the driven gear ring 34 is rotatably connected to the central shaft 31, a housing 32 with internal teeth is sleeved on the central shaft 31, and an external gear ring 33 is fixedly connected to the housing 32 with internal teeth; a fixed vertical tooth 23 is fixedly connected to the copper metal composite sheet 21, and the fixed vertical tooth 23 meshes with the external gear ring 33; when the copper metal composite sheet 21 expands due to heat and the steel metal composite sheet 22 bends downward, the copper metal composite sheet 21 drives the fixed vertical tooth 23 downward, and the fixed vertical tooth 23 meshes with the external gear ring 33, driving the housing 32 with internal teeth and the negative electrode of the driven gear ring 34 away from one end of the positive electrode of the driving gear ring 35; when the temperature drops, the copper metal composite sheet 21 and the steel metal composite sheet 22 return to the horizontal state, the fixed vertical tooth 23 drives the external gear ring 33 to rotate, and the housing 32 with internal teeth and the negative electrode of the driven gear ring 34 mesh with the positive electrode of the driving gear ring 35.

[0021] An installation groove 11 is formed on the thermal coupling substrate 1, a laser chip 12 is clamped on the installation groove 11, a radial heat conduction groove 13 is formed at one end of the thermal coupling substrate 1 away from the installation groove 11, and the copper metal composite sheet 21 and the steel metal composite sheet 22 are fixedly connected to the radial heat conduction groove 13.

[0022] A connecting column 2 is inserted at one end of the thermal coupling substrate 1 close to the copper metal composite sheet 21 and the steel metal composite sheet 22, and the connecting column 2 penetrates through the copper metal composite sheet 21 and the steel metal composite sheet 22 and extends to the periphery of the steel metal composite sheet 22.

[0023] A heating wire 36 is fixedly connected to the positive electrode of the driving gear ring 35 for energizing and heating after the positive electrode of the driving gear ring 35 and the negative electrode of the driven gear ring 34 mesh with each other.

[0024] A shrinkable heat conduction tube 37 is fixedly connected to the positive electrode of the driving gear ring 35, and the fixed end of the shrinkable heat conduction tube 37 penetrates through the positive electrode of the driving gear ring 35 and corresponds to one end of the heating wire 36.

[0025] A rotating shaft 38 is threadedly connected to the housing 32 with internal teeth.

[0026] A shielding curtain 41 is fixedly connected to the fixed plate 4, a sliding plate 42 is fixedly connected to the shielding curtain 41, a tube groove 43 is formed on the fixed plate 4, and a limiting column 44 is fixedly connected to the shielding curtain 41.

[0027] A sliding column 45 is slidably connected to the fixed plate 4, and a heat conduction tube wheel 46 is rotatably connected to the sliding column 45. The heat conduction tube wheel 46 rotates after being energized when the positive electrode 35 of the driving gear ring and the negative electrode 34 of the driven gear ring mesh with each other.

[0028] A starting shaft 47 is rotatably connected to the heat conduction tube wheel 46. The starting shaft 47 is fixedly connected to the sliding column 45. A connecting rod 48 is fixedly connected to the starting shaft 47. A fixed sliding wheel 49 is fixedly connected to the connecting rod 48. A roller 410 is rotatably connected to the fixed sliding wheel 49.

[0029] When the temperature rises; due to the difference in the coefficient of thermal expansion between the copper metal composite sheet 21 and the steel metal composite sheet 22 on the thermal coupling substrate 1, the expansion of the copper sheet drives the steel sheet to bend downward. At this time, the fixed vertical teeth 23 on the copper metal composite sheet 21 move downward accordingly, mesh with the external gear ring 33, and drive the outer shell 32 with internal teeth to rotate, so that the negative electrode 34 of the driven gear ring moves away from the positive electrode 35 of the driving gear ring, cutting off the circuit, and the heating wire 36 stops working to avoid further temperature rise; When the temperature drops; the copper metal composite sheet 21 and the steel metal composite sheet 22 return to the horizontal state, and the fixed vertical teeth 23 drive the external gear ring 33 to rotate in the reverse direction, prompting the outer shell 32 with internal teeth and the negative electrode 34 of the driven gear ring to reset, mesh with the positive electrode 35 of the driving gear ring again, connect the circuit, and the heating wire 36 starts to heat; Heating and heat conduction work together; after the positive electrode 35 of the driving gear ring and the negative electrode 34 of the driven gear ring mesh, the heating wire 36 is energized and generates heat. The heat is conducted to the thermal coupling substrate 1 through the contraction heat conduction tube 37 to maintain the working temperature of the laser chip 12. At the same time, after the circuit is connected, the heat conduction tube wheel 46 rotates, and through the linkage of the starting shaft 47, the connecting rod 48 and the fixed sliding wheel 49, the hot air inside the contraction heat conduction tube 37 on the heat conduction tube wheel 46 is continuously pushed towards one end of the sliding plate 42, further maintaining the working temperature of the laser chip 12, optimizing the heat conduction path, and improving the heat transfer efficiency; Auxiliary structure cooperation; the radial heat conduction grooves 13 of the thermal coupling substrate 1 cooperate with the copper metal composite sheet 21 and the steel metal composite sheet 22 to quickly conduct the heat generated by the laser chip 12; the connecting column 2 penetrates the composite sheet to enhance the structural stability and heat conduction performance; When the temperature rises, the shielding curtain 41 and the sliding plate 42 on the fixed plate 4 cooperate to open the shielding curtain 41 to increase the heat dissipation area of the laser chip 12. The limit post 44 and the sliding column 45 ensure the smooth sliding of components such as the heat conduction tube wheel 46, and ensure the stability of the temperature control process.

[0030] Embodiment 2: Refer to Figures 1-9 , a method for controlling the temperature of a semiconductor laser, including the following steps: S1. When the temperature rises: Due to the difference in the coefficient of thermal expansion between the copper metal composite sheet 21 and the steel metal composite sheet 22 on the thermal coupling substrate 1, when the copper sheet expands, it drives the steel sheet to bend downward. At this time, the fixed vertical teeth 23 on the copper metal composite sheet 21 move downward accordingly and engage with the external gear ring 33 to drive the rotation of the housing 32 with internal teeth, causing the negative electrode 34 of the driven gear ring to move away from the positive electrode 35 of the driving gear ring, cutting off the circuit, and the heating wire 36 stops working to prevent the temperature from rising further.

[0031] When the temperature drops: The copper metal composite sheet 21 and the steel metal composite sheet 22 return to the horizontal state, and the fixed vertical teeth 23 drive the external gear ring 33 to rotate in the reverse direction, prompting the housing 32 with internal teeth and the negative electrode 34 of the driven gear ring to reset and re-engage with the positive electrode 35 of the driving gear ring, turning on the circuit, and the heating wire 36 starts to heat.

[0032] S2. Heating and heat conduction work together; After the positive electrode 35 of the driving gear ring engages with the negative electrode 34 of the driven gear ring, the heating wire 36 is energized and generates heat. The heat is conducted to the thermal coupling substrate 1 through the shrinkable heat conduction tube 37 to maintain the working temperature of the laser chip 12. At the same time, after the circuit is turned on, the heat conduction tube wheel 46 rotates and is linked through the starting shaft 47, the connecting rod 48, and the fixed sliding wheel 49, continuously pushing the hot air inside the shrinkable heat conduction tube 37 on the heat conduction tube wheel 46 towards one end of the sliding plate 42, further maintaining the working temperature of the laser chip 12, optimizing the heat conduction path, and improving the heat transfer efficiency.

[0033] S3. Auxiliary structures cooperate; The radial heat conduction grooves 13 on the thermal coupling substrate 1 cooperate with the copper metal composite sheet 21 and the steel metal composite sheet 22 to quickly conduct the heat generated by the laser chip 12; the connecting columns 2 penetrate the composite sheets to enhance the structural stability and heat conduction performance.

[0034] The shielding curtain 41 on the fixing plate 4 and the sliding plate 42 cooperate to open the shielding curtain 41 when the temperature rises to increase the heat dissipation area of the laser chip 12. The limiting column 44 and the sliding column 45 ensure the smooth sliding of components such as the heat conduction tube wheel 46, guaranteeing the stability of the temperature control process.

[0035] In the present invention, through the rotation of the housing 32 with internal teeth, the negative electrode 34 of the driven gear ring moves away from the positive electrode 35 of the driving gear ring, cutting off the circuit, and the heating wire 36 stops working to prevent the temperature from rising further. The housing 32 with internal teeth and the negative electrode 34 of the driven gear ring reset and re-engage with the positive electrode 35 of the driving gear ring, turning on the circuit, and the heating wire 36 starts to heat.

[0036] The hot air inside the shrinkable heat conduction tube 37 on the heat conduction tube wheel 46 is continuously pushed towards one end of the sliding plate 42, further maintaining the working temperature of the laser chip 12, optimizing the heat conduction path, and improving the heat transfer efficiency.

[0037] When the temperature rises, the shielding curtain 41 and the sliding plate 42 on the fixing plate 4 cooperate to open the shielding curtain 41 to increase the heat dissipation area of the laser chip 12. The limiting column 44 and the sliding column 45 ensure the smooth sliding of components such as the heat conduction tube wheel 46, ensuring the stability of the temperature control process.

[0038] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the technical content prompted above within the scope of the technical solution of the present invention. However, as long as the content does not depart from the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the present invention.

Claims

1. A semiconductor laser temperature control mechanism, comprising a thermal coupling substrate (1), characterized in that: Also includes: A fixed connection frame (3) fixedly connected to the thermal coupling substrate (1), a fixed plate (4) fixedly connected to the fixed connection frame (3), a copper metal composite sheet (21) and a steel metal composite sheet (22) fixedly connected to the thermal coupling substrate (1), and the copper metal composite sheet (21) and the steel metal composite sheet (22) are fixedly connected in sequence from top to bottom at the bottom of the thermal coupling substrate (1); The fixed connection frame (3) is fixedly connected to a central shaft (31), a driving gear ring positive electrode (35) is fixedly connected to the central shaft (31), a driven gear ring negative electrode (34) is rotatably connected to the central shaft (31), an outer shell (32) with internal teeth is sleeved on the central shaft (31), and an outer shell (32) with internal teeth is fixedly connected to an outer gear ring (33); The copper metal composite sheet (21) is fixedly connected with a fixed vertical tooth (23), and the fixed vertical tooth (23) is meshed with the outer gear ring (33).

2. A semiconductor laser temperature control mechanism according to claim 1, characterized in that: The thermal coupling substrate (1) is provided with a mounting groove (11), a laser chip (12) is clamped on the mounting groove (11), and a radial heat conduction groove (13) is provided at one end of the thermal coupling substrate (1) away from the mounting groove (11), a copper metal composite sheet (21) and a steel metal composite sheet (22) are fixedly connected to the radial heat conduction groove (13).

3. A semiconductor laser temperature control mechanism according to claim 1, characterized in that: A connection column (2) is inserted into one end of the thermal coupling substrate (1) close to the copper metal composite sheet (21) and the steel metal composite sheet (22); the connection column (2) penetrates the copper metal composite sheet (21) and the steel metal composite sheet (22) and extends to the periphery of the steel metal composite sheet (22).

4. A semiconductor laser temperature control mechanism according to claim 1, characterized in that: A heating wire (36) is fixedly connected to the driving gear ring positive electrode (35) and is used for heating after the driving gear ring positive electrode (35) and the driven gear ring negative electrode (34) are meshed with each other.

5. A semiconductor laser temperature control mechanism according to claim 4, characterized in that: A shrinkable heat-conducting tube (37) is fixedly connected to the active gear ring positive electrode (35), and a fixed end of the shrinkable heat-conducting tube (37) passes through the active gear ring positive electrode (35) and corresponds to one end of the heating wire (36).

6. A semiconductor laser temperature control mechanism according to claim 1, characterized in that: A rotating shaft (38) is threadedly connected to the outer shell (32) with internal teeth.

7. A semiconductor laser temperature control mechanism according to claim 1, characterized in that: The fixing plate (4) is fixedly connected to a shielding curtain (41), the shielding curtain (41) is fixedly connected to a slide plate (42), a pipe groove (43) is provided on the fixing plate (4), and a limiting column (44) is fixedly connected to the shielding curtain (41).

8. A semiconductor laser temperature control mechanism according to claim 7, characterized in that: A sliding column (45) is slidably connected to the fixed plate (4), and a heat conduction pipe wheel (46) is rotatably connected to the sliding column (45). The heat conduction pipe wheel (46) is energized and rotates after the positive electrode (35) of the driving gear ring and the negative electrode (34) of the driven gear ring are meshed with each other.

9. A semiconductor laser temperature control mechanism according to claim 8, characterized in that: The heat conduction pipe wheel (46) is rotatably connected to a starting shaft (47), the starting shaft (47) is fixedly connected to a sliding column (45), the starting shaft (47) is fixedly connected to a connecting rod (48), the connecting rod (48) is fixedly connected to a fixed sliding wheel (49), and the fixed sliding wheel (49) is rotatably connected to a roller (410).

10. A semiconductor laser temperature control method, characterized in that: A semiconductor laser temperature control mechanism as claimed in any one of claims 1 to 9 is used, comprising the following steps: S1, when the temperature rises; Due to the difference in thermal expansion coefficients between the copper metal composite sheet (21) and the steel metal composite sheet (22) on the thermal coupling substrate (1), the copper sheet expands and drives the steel sheet to bend downward. At this time, the fixed vertical teeth (23) on the copper metal composite sheet (21) move downward and mesh with the outer gear ring (33) to drive the outer shell (32) with internal teeth to rotate, so that the negative electrode (34) of the driven gear ring is away from the positive electrode (35) of the driving gear ring, the circuit is cut off, and the heating wire (36) stops working; When the temperature drops; The copper metal composite sheet (21) and the steel metal composite sheet (22) return to a horizontal state, the fixed vertical teeth (23) drive the outer gear ring (33) to rotate in the opposite direction, causing the outer shell (32) with the inner teeth and the negative electrode (34) of the driven gear ring to reset and re-engage with the positive electrode (35) of the active gear ring, thus connecting the circuit and causing the heating wire (36) to start heating; S2, heating and heat conduction work together; After the positive electrode (35) of the active gear ring is meshed with the negative electrode (34) of the driven gear ring, the heating wire (36) is energized to generate heat, and the heat is transferred to the thermal coupling substrate (1) through the shrinkable heat-conducting tube (37), thereby maintaining the working temperature of the laser chip (12). At the same time, the heat-conducting tube wheel (46) rotates after the circuit is connected, and the hot air inside the shrinkable heat-conducting tube (37) on the heat-conducting tube wheel (46) is continuously pushed toward one end of the slide plate (42) through the linkage of the starting shaft (47), the connecting rod (48) and the fixed sliding wheel (49), thereby further maintaining the working temperature of the laser chip (12); S3, auxiliary structure coordination; The radial heat conduction grooves (13) of the thermal coupling substrate (1) cooperate with the copper metal composite sheet (21) and the steel metal composite sheet (22) to quickly conduct heat generated by the laser chip (12); the connecting column (2) penetrates the composite sheet; When the temperature rises, the shielding curtain (41) and the sliding plate (42) on the fixed plate (4) cooperate to open the shielding curtain (41) to increase the heat dissipation area of ​​the laser chip (12), and the limiting column (44) and the sliding column (45) ensure that components such as the heat transfer pipe wheel (46) slide smoothly.

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