Wireless charging device and vehicle

Abstract

The invention belongs to the technical field of wireless charging, and discloses a wireless charging device and a vehicle. A semiconductor refrigeration structure of the wireless charging device is fixedly arranged in a first shell, and a refrigeration flow channel is formed between the semiconductor refrigeration structure and the inner wall of the first shell; the refrigeration flow channel is used for supplying air to the wireless charging electric device for heat dissipation; the charger body is fixed relative to the first shell. An inlet and an outlet of the refrigeration channel are located on the two sides of the charger body in the thickness direction, and the outlet of the refrigeration channel is close to the top of the charger body in the thickness direction relative to the inlet of the refrigeration channel. Or, the inlet of the refrigeration flow channel and the outlet of the refrigeration flow channel are located on the same side of the top of the charger body in the thickness direction, the refrigeration flow channel penetrates through the charger body, and the outlet of the refrigeration flow channel is flush with the top of the charger body in the thickness direction. A wireless charging coil of the charger body is located on the periphery of an outlet of the refrigeration flow channel. On the basis of not increasing energy consumption, the cooling effect and efficiency of the wireless charging electric device can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless charging, and particularly to a wireless charging device and a vehicle. Background Art

[0002] Wireless charging receiving coils of wireless charging electrical devices such as mobile phones and tablet computers are usually arranged on the back, that is, on the side of the wireless charging electrical device away from the display screen and close to the battery, and are located inside the housing of the wireless charging electrical device. Since wireless charging electrical devices such as mobile phones and tablet computers need to be made thin, FPC (Flexible Printed Circuit) is usually used to make the wireless charging receiving coil. During the wireless charging process, the heat generation of the wireless charging receiving coil will rise sharply, and the generated heat will also radiate and conduct to the battery side. Therefore, the back covers of wireless charging electrical devices such as mobile phones and tablet computers are usually made of materials with good heat dissipation such as glass and ceramics, and cold air is blown to the back of the wireless charging electrical devices such as mobile phones and tablet computers during the charging process for cooling.

[0003] Currently, the in-vehicle wireless charging devices in the prior art usually consist of a charger body, a fan, a semiconductor refrigeration module, a heat sink and a housing, etc. The charger body is arranged inside the housing. The heat sink is fixed to the semiconductor refrigeration module through a heat-conducting adhesive and forms a flow channel with the housing. The air flow output by the fan flows through the flow channel and is delivered to the air outlet to blow towards the wireless charging electrical device. Although it can blow cold air to the wireless charging electrical device for cooling, it cannot directly blow towards the area where the heat generation of the wireless charging electrical device is concentrated, resulting in poor cooling effect and low efficiency in cooling the wireless charging electrical device. Summary of the Invention

[0004] The purpose of the present invention is to provide a wireless charging device and a vehicle to solve the above problems existing in the wireless charging devices in the prior art.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A wireless charging device, comprising:

[0007] A semiconductor refrigeration structure and a first housing, the semiconductor refrigeration structure is fixedly arranged inside the first housing and forms a refrigeration flow channel with the inner wall of the first housing; the refrigeration flow channel is used for sending air to the wireless charging electrical device for heat dissipation;

[0008] A charger body, fixed relative to the first housing;

[0009] The inlet and the outlet of the refrigeration flow channel are located on two sides in the thickness direction of the charger body, and the outlet of the refrigeration flow channel is closer to the top in the thickness direction of the charger body than the inlet of the refrigeration flow channel; or, both the inlet and the outlet of the refrigeration flow channel are located on the same side at the top in the thickness direction of the charger body, the refrigeration flow channel penetrates through the charger body, and the outlet of the refrigeration flow channel is flush with the top in the thickness direction of the charger body.

[0010] The wireless charging coil of the charger body is located on the outer periphery of the outlet of the refrigeration flow channel.

[0011] As a preferred solution of the above wireless charging device, the extending direction of the refrigeration flow channel is parallel to the thickness direction of the charger body, and the refrigeration flow channel penetrates through the charger body along its own extending direction.

[0012] As a preferred solution of the above wireless charging device, a heat dissipation flow channel is further formed between the semiconductor refrigeration structure and the inner wall of the first shell, the refrigeration flow channel and the heat dissipation flow channel are not communicated with each other, and the outlets of the heat dissipation flow channel are spaced on the outer periphery of the charger body.

[0013] As a preferred solution of the above wireless charging device, the wireless charging device further includes a fan, the fan is fixed relative to the first shell, and the fan is used for blowing air into the refrigeration flow channel and the heat dissipation flow channel.

[0014] As a preferred solution of the above wireless charging device, the fan is located at the inlet of the refrigeration flow channel and the inlet of the heat dissipation flow channel, and the air outlet of the fan is hermetically communicated with the inlet of the refrigeration flow channel and hermetically communicated with the inlet of the heat dissipation flow channel.

[0015] As a preferred solution of the above wireless charging device, the wireless charging device further includes two heat conduction members, one heat conduction member is fixedly attached to the refrigeration side wall of the semiconductor refrigeration structure and is located in the refrigeration flow channel, and the other heat conduction member is fixedly attached to the heat dissipation side wall of the semiconductor refrigeration structure and is located in the heat dissipation flow channel.

[0016] As a preferred solution of the above wireless charging device, the first shell includes a first sub-shell and a first sub-cover body, the semiconductor refrigeration structure is fixedly arranged in the first sub-shell and divides the interior of the first sub-shell into a first through hole and a second through hole that are not communicated with each other;

[0017] The first sub-cover body is provided with a third through hole and a fourth through hole. The first sub-cover body is hermetically covered on the first sub-shell body and the semiconductor refrigeration structure, so that the first through hole is communicated with the third through hole to form the refrigeration flow channel, and the second through hole is communicated with the fourth through hole to form the heat dissipation flow channel.

[0018] As a preferred solution of the above wireless charging device, the wireless charging device further includes a second shell. The second shell is formed with an installation cavity and a refrigeration output hole. The first shell and the charger body are both fixedly arranged in the second shell, and the outlet of the refrigeration flow channel is communicated with the refrigeration output hole.

[0019] As a preferred solution of the above wireless charging device, the second shell includes a second sub-shell body and a second sub-cover body. The second sub-cover body is detachably covered on the second sub-shell body and forms the installation cavity with the second sub-shell body; the first shell and the charger body are both fixedly arranged in the second sub-shell body;

[0020] The second sub-cover body is formed with a placement groove and the refrigeration output hole. The refrigeration output hole communicates the outlet of the refrigeration flow channel with the placement groove. The charger body is located directly below the placement groove along the thickness direction of itself. The placement groove is used for placing wireless charging electrical components.

[0021] A vehicle includes the above wireless charging device.

[0022] Advantages of the present invention:

[0023] The present invention provides a wireless charging device and a vehicle. The wireless charging device includes a semiconductor refrigeration structure, a first shell and a charger body. The semiconductor refrigeration structure is fixedly arranged in the first shell and forms a refrigeration flow channel with the inner wall of the first shell; the refrigeration flow channel is used for sending air to cool and dissipate heat to the wireless charging electrical components; the charger body is fixed relative to the first shell. The inlet and the outlet of the refrigeration flow channel are located on both sides of the charger body along the thickness direction, and the outlet of the refrigeration flow channel is closer to the top of the charger body along the thickness direction than the inlet of the refrigeration flow channel; or, the inlet and the outlet of the refrigeration flow channel are both located on the same side of the top of the charger body along the thickness direction, the refrigeration flow channel penetrates through the charger body, and the outlet of the refrigeration flow channel is flush with the top of the charger body along the thickness direction. The wireless charging coil of the charger body is located on the outer periphery of the outlet of the refrigeration flow channel.

[0024] When charging a wireless charging electrical component with the wireless charging device, control the charger body to remain in an energized state, and place the wireless charging electrical component close to the charger body, so that the wireless charging electrical component is located within the area where the wireless charging coil of the charger body is located, so as to realize charging of the wireless charging electrical component.

[0025] During the charging process of the wireless charging electrical device, the synchronous control semiconductor refrigeration structure remains powered on and blows air into the refrigeration flow channel. The semiconductor refrigeration structure cools the air flowing through the refrigeration flow channel, so that the air sent out by the refrigeration flow channel is cold air. Secondly, by arranging the wireless charging coil of the charger body on the outer periphery of the outlet of the refrigeration flow channel, the cold air sent out by the refrigeration flow channel can directly blow the area where the heat is concentrated on the wireless charging electrical device, so that the effect and efficiency of cooling the wireless charging electrical device can be effectively improved without increasing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a cross-section of the wireless charging device provided by the specific embodiment of the present invention Figure One ;

[0027] Figure 2 is a cross-section of the wireless charging device provided by the specific embodiment of the present invention Figure Two ;

[0028] Figure 3 is a cross-section of the wireless charging device provided by the specific embodiment of the present invention Figure Three ;

[0029] Figure 4 is a schematic structural diagram of the heat conduction member provided by the specific embodiment of the present invention;

[0030] Figure 5 is a schematic structural diagram of the wireless charging device provided by the specific embodiment of the present invention along the first viewing angle;

[0031] Figure 6 is a schematic structural diagram of the wireless charging device provided by the specific embodiment of the present invention along the second viewing angle;

[0032] Figure 7 is a partial schematic structural diagram of the wireless charging device provided by the specific embodiment of the present invention.

[0033] In the figure:

[0034] 100, wireless charging electrical device;

[0035] 1, semiconductor refrigeration structure; 11, semiconductor refrigeration body; 12, heat insulation member;

[0036] 2, first shell; 21, refrigeration flow channel; 22, heat dissipation flow channel; 23, first sub-shell; 231, first through hole; 232, second through hole; 233, wire passing hole; 24, first sub-cover; 241, plug post; 2411, third through hole; 242, fourth through hole;

[0037] 3, charger body;

[0038] 4, fan;

[0039] 5. Heat conduction component; 51. First heat sink; 52. Second heat sink;

[0040] 6. Second housing; 61. Installation cavity; 62. Second sub-housing; 621. Ventilation opening; 622. First overlapping surface; 623. Second overlapping surface; 63. Second sub-cover; 631. Refrigeration output hole; 632. Placing groove; 633. Heat dissipation output hole. Detailed implementation manners

[0041] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0042] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0043] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is lower than that of the second feature.

[0044] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0045] The present invention provides a wireless charging device, as Figures 1-3As shown in the figure, the wireless charging device includes a semiconductor refrigeration structure 1, a first housing 2, and a charger body 3. Among them, the semiconductor refrigeration structure 1 is fixedly arranged in the first housing 2 and a refrigeration flow channel 21 is formed between the semiconductor refrigeration structure 1 and the inner wall of the first housing 2; the refrigeration flow channel 21 is used for sending air to cool the wireless charging device 100; the charger body 3 is fixed relative to the first housing 2. The inlet and the outlet of the refrigeration flow channel 21 are located on both sides in the thickness direction of the charger body 3, and the outlet of the refrigeration flow channel 21 is closer to the top in the thickness direction of the charger body 3 relative to the inlet of the refrigeration flow channel 21; or, both the inlet and the outlet of the refrigeration flow channel 21 are located on the same side at the top in the thickness direction of the charger body 3, the refrigeration flow channel 21 penetrates through the charger body 3, and the outlet of the refrigeration flow channel 21 is flush with the top in the thickness direction of the charger body 3. The wireless charging coil of the charger body 3 is located on the outer periphery of the outlet of the refrigeration flow channel 21.

[0046] When charging the wireless charging device 100 with this wireless charging device, control the charger body 3 to keep the power-on state, and place the wireless charging device 100 close to the charger body 3, so that the wireless charging device 100 is located within the area where the wireless charging coil of the charger body 3 is located, so as to realize the charging of the wireless charging device 100.

[0047] During the charging process of the wireless charging device 100, synchronously control the semiconductor refrigeration structure 1 to keep the power-on state and send air to the refrigeration flow channel 21. The semiconductor refrigeration structure 1 cools the air flowing through the refrigeration flow channel 21, so that the air sent out by the refrigeration flow channel 21 is cold air; secondly, by setting the wireless charging coil of the charger body 3 on the outer periphery of the outlet of the refrigeration flow channel 21, the cold air sent out by the refrigeration flow channel 21 can directly blow the area where the heat is concentrated on the wireless charging device 100, so that on the basis of not increasing the energy consumption, the effect and efficiency of cooling the wireless charging device 100 can be effectively improved.

[0048] Among them, for the inlet and outlet of the refrigeration flow channel 21 located on both sides of the charger body 3 in the thickness direction, and the outlet of the refrigeration flow channel 21 is closer to the top of the charger body 3 in the thickness direction relative to the inlet of the refrigeration flow channel 21: preferably, the extending direction of the refrigeration flow channel 21 is parallel to the thickness direction of the charger body 3, and the refrigeration flow channel 21 penetrates the charger body 3 along its own extending direction. That is, the refrigeration flow channel 21 is a straight flow channel, and the area of the first shell 2 corresponding to the refrigeration flow channel 21 vertically penetrates the charger body 3, so that the inlet and outlet of the refrigeration flow channel 21 are located on both sides of the charger body 3 in the thickness direction, and the outlet of the refrigeration flow channel 21 is closer to the top of the charger body 3 in the thickness direction relative to the inlet of the refrigeration flow channel 21. With such a setting, the path of the refrigeration flow channel 21 is short, and the flow path of the cold air is short, which can further improve the cooling effect and efficiency on the wireless charging device 100.

[0049] As an alternative, the extending direction of the refrigeration flow channel 21 is not parallel to the thickness direction of the charger body 3, and the refrigeration flow channel 21 penetrates the charger body 3 along its own extending direction, and the inlet and outlet of the refrigeration flow channel 21 are located on both sides of the charger body 3 in the thickness direction, and the outlet of the refrigeration flow channel 21 is closer to the top of the charger body 3 in the thickness direction relative to the inlet of the refrigeration flow channel 21.

[0050] As an alternative, the refrigeration flow channel 21 bypasses the outer periphery of the charger body 3, and the inlet and outlet of the cold flow channel are located on both sides of the charger body 3 in the thickness direction, and the outlet of the refrigeration flow channel 21 is closer to the top of the charger body 3 in the thickness direction relative to the inlet of the refrigeration flow channel 21. That is, the refrigeration flow channel 21 is generally in a "ji" shape, so that the first shell 2 forms an avoidance groove in a "ji" shape, and the charger body 3 is partially inserted into the avoidance groove so that the inlet of the cold flow channel and the outlet of the refrigeration flow channel 21 are located on both sides of the charger body 3 in the thickness direction, and the outlet of the refrigeration flow channel 21 is closer to the top of the charger body 3 in the thickness direction relative to the inlet of the refrigeration flow channel 21.

[0051] Among them, both the inlet and outlet of the refrigeration flow channel 21 are located on the same side of the top of the charger body 3 in the thickness direction, the refrigeration flow channel 21 penetrates the charger body 3, and the outlet of the refrigeration flow channel 21 is flush with the top of the charger body 3 in the thickness direction: such as Figures 1-3As shown, it is preferable that the extending direction of the refrigeration flow channel 21 is parallel to the thickness direction of the charger body 3, and the refrigeration flow channel 21 penetrates through the charger body 3 along its own extending direction. That is, the refrigeration flow channel 21 is a straight flow channel, and the area of the first shell 2 corresponding to the refrigeration flow channel 21 vertically penetrates through the charger body 3. Such a setting also makes the path of the refrigeration flow channel 21 short and the flow path of the cold air short, and can further improve the cooling effect and efficiency of the wireless charging device 100. As an alternative, the extending direction of the refrigeration flow channel 21 is not parallel to the thickness direction of the charger body 3.

[0052] In this embodiment, as Figures 1-3 shown, it is preferable that the extending direction of the refrigeration flow channel 21 is parallel to the thickness direction of the charger body 3, the refrigeration flow channel 21 penetrates through the charger body 3 along its own extending direction, and both the inlet and the outlet of the refrigeration flow channel 21 are located on the same side at the top in the thickness direction of the charger body 3, and the outlet of the refrigeration flow channel 21 is flush with the top in the thickness direction of the charger body 3. This can not only further improve the cooling effect and efficiency of the wireless charging device 100, but also make the size of the assembled wireless charging device in the thickness direction of the charger body 3 small, thereby reducing the space occupancy rate of the wireless charging device. Especially for applying the wireless charging device to a vehicle, it can reduce the design difficulty of the vehicle and the design cost.

[0053] Among them, as Figures 1-3 shown, a heat dissipation flow channel 22 is also formed between the inner wall of the semiconductor refrigeration structure 1 and the first shell 2. The refrigeration flow channel 21 and the heat dissipation flow channel 22 are not communicated with each other, and the outlets of the heat dissipation flow channel 22 are spaced apart on the outer periphery of the charger body 3. By setting the outlets of the heat dissipation flow channel 22 to be spaced apart on the outer periphery of the charger body 3, during the process of keeping the semiconductor refrigeration structure 1 energized, heat exchange using wind can effectively dissipate heat from the semiconductor refrigeration structure 1 itself and avoid affecting the heat dissipation of the wireless charging device 100.

[0054] Preferably, both the inlet and the outlet of the heat dissipation flow channel 22 are located on the same side at the top in the thickness direction of the charger body 3. The inlet of the heat dissipation flow channel 22 is arranged on the same side as the inlet of the refrigeration flow channel 21, and the outlet of the heat dissipation flow channel 22 is flush with the top in the thickness direction of the charger body 3. This further ensures that the size of the assembled wireless charging device in the thickness direction of the charger body 3 is small to reduce the space occupancy rate of the wireless charging device.

[0055] Among them, as Figures 1-3As shown, the wireless charging device further includes a fan 4, which is fixed relative to the first housing 2 and is used to send air to the refrigeration flow channel 21 and the heat dissipation flow channel 22. When the air flow sent by the fan 4 passes through the refrigeration flow channel 21, it is cooled by the cold side of the semiconductor refrigeration structure 1 to form cold air blowing towards the wireless charging electrical device 100 to cool down the wireless charging electrical device 100; when the air flow sent by the fan 4 passes through the heat dissipation flow channel 22, it takes away the heat dissipated by the hot side of the semiconductor refrigeration structure 1 to dissipate heat from the semiconductor refrigeration structure 1.

[0056] Preferably, as Figures 1-3 shown, the fan 4 is located at the inlet of the refrigeration flow channel 21 and the inlet of the heat dissipation flow channel 22, and the air outlet of the fan 4 is in sealed communication with the inlet of the refrigeration flow channel 21 and is in sealed communication with the inlet of the heat dissipation flow channel 22. The inlet of the heat dissipation flow channel 22 is arranged on the same side as the inlet of the refrigeration flow channel 21, so that the fan 4 can directly send air to the refrigeration flow channel 21 and the heat dissipation flow channel 22; secondly, compared with sealingly connecting the air outlet of the fan 4 to the inlet of the refrigeration flow channel 21 through a pipeline and sealingly connecting the air outlet of the fan 4 to the inlet of the heat dissipation flow channel 22 through a pipeline, it can effectively shorten the path of the air flow to the outlet of the heat dissipation flow channel 22, thereby further improving the efficiency and effect of dissipating heat from the semiconductor refrigeration structure 1; secondly, compared with separately arranging fans for the refrigeration flow channel and the heat dissipation flow channel in the prior art, it can simplify the structure, reduce costs, and further reduce energy consumption.

[0057] As an alternative solution, the air outlet of the fan 4 is sealingly connected to the inlet of the refrigeration flow channel 21 through a first pipeline, and the air outlet of the fan 4 is sealingly connected to the inlet of the heat dissipation flow channel 22. It can be understood that the first pipeline is a tee pipe.

[0058] As another alternative solution, the number of fans 4 is set to two; the air outlet of one fan 4 is directly sealingly connected to the inlet of the refrigeration flow channel 21, or the air outlet of one fan 4 is sealingly connected to the inlet of the refrigeration flow channel 21 through a second pipeline; the air outlet of the other fan 4 is directly sealingly connected to the inlet of the heat dissipation flow channel 22, or the air outlet of the other fan 4 is sealingly connected to the inlet of the heat dissipation flow channel 22 through a third pipeline.

[0059] In this embodiment, as Figures 1-3 shown, the fan 4 is fixedly connected to the first housing 2 and is located at the inlet of the refrigeration flow channel 21 and the inlet of the heat dissipation flow channel 22, and a first sealing ring is used to sealingly connect the air outlet of the fan 4 to the inlet of the refrigeration flow channel 21 and to the inlet of the heat dissipation flow channel 22. Among them, the way of fixedly connecting the fan 4 to the first housing 2 includes but is not limited to snap connection, threaded connection, etc.

[0060] Preferably, as Figure 1 and Figure 4As shown, the wireless charging device further includes two heat conduction members 5. One heat conduction member 5 is fixedly attached to the refrigerating side wall of the semiconductor refrigeration structure 1 and is located within the refrigerating flow channel 21, and the other heat conduction member 5 is fixedly attached to the heat dissipation side wall of the semiconductor refrigeration structure 1 and is located within the heat dissipation flow channel 22. The heat conduction member 5 located within the refrigerating flow channel 21 can further improve the efficiency of cooling the flowing air into cold air, thereby further improving the effect and efficiency of cooling the wireless charging electrical device 100; the heat conduction member 5 located within the heat dissipation flow channel 22 can further improve the efficiency and effect of dissipating heat from the semiconductor refrigeration structure 1.

[0061] Specifically, the heat conduction member 5 is attached to the semiconductor refrigeration structure 1 through a heat conduction medium layer such as thermal grease, and is fixedly connected to the semiconductor refrigeration structure 1 by means of snap connection, screw connection, etc.

[0062] Further preferably, the heat conduction member 5 is a heat dissipation fin. It can increase the heat exchange area and enable the wind to flow smoothly through the heat dissipation flow channel 22 and the refrigerating flow channel 21.

[0063] In this embodiment, as Figure 1 and Figure 4 shown, the exemplary heat dissipation fins include a first heat dissipation fin 51 and a plurality of second heat dissipation fins 52. The plurality of second heat dissipation fins 52 are distributed at intervals in a direction and are all fixedly connected to the first heat dissipation fin 51. The first heat dissipation fin 51 is provided with a heat conduction medium layer and is attached and fixed to the semiconductor refrigeration structure 1. It can be understood that the specific structural form of the heat dissipation fins is not limited, as long as it can ensure an increase in the heat exchange area and enable the wind to flow smoothly through the heat dissipation flow channel 22 and the refrigerating flow channel 21.

[0064] Among them, in this embodiment, as Figures 1-3As shown, the first shell 2 includes a first sub-shell 23 and a first sub-cover 24, the semiconductor refrigeration structure 1 is fixedly arranged in the first sub-shell 23 and the interior of the first sub-shell 23 is divided into a first through hole 231 and a second through hole 232 which are not connected to each other; the first sub-cover 24 is provided with a third through hole 2411 and a fourth through hole 242, and the first sub-cover 24 is sealed and arranged on the first sub-shell 23 and the semiconductor refrigeration structure 1 so that the first through hole 231 is connected with the third through hole 2411 to form a refrigeration channel 21, and the second through hole 232 is connected with the fourth through hole 242 to form a heat dissipation channel 22. In this embodiment, it is preferred that the second through hole 232 is L-shaped, the fourth through hole 242 is I-shaped, the heat dissipation channel 22 formed is stepped, and the outlet of the heat dissipation channel 22 is located at the periphery of the charger body 3, and the inlet of the heat dissipation channel 22 is arranged on the same side as the inlet of the refrigeration channel 21. Further, the two heat conducting members 5 are both located in the first sub-shell 23. Furthermore, a second sealing ring is used to seal the gap between the outer periphery of the semiconductor refrigeration structure 1 and the first sub-shell 23, and the gap between the outer periphery of the semiconductor refrigeration structure 1 and the first sub-cover 24; a third sealing ring is used to seal the gap between the first sub-shell 23 and the first sub-cover 24. Furthermore, the first sub-shell 23 and the first sub-cover 24 are detachably connected by means of a snap connection, a threaded connection, etc. Such a configuration facilitates the assembly and disassembly of the semiconductor refrigeration structure 1 and the two heat conducting members 5 to the first sub-shell 23, and facilitates the molding of the refrigeration channel 21 and the heat dissipation channel 22 on the first shell 2.

[0065] It is understandable that the specific structural form of the first shell 2 is not limited and can be adaptively adjusted according to actual working conditions to form the above-mentioned cooling channel 21 and heat dissipation channel 22 and meet the installation requirements of the semiconductor refrigeration structure 1.

[0066] Specifically, in this embodiment, Figures 1-3 As shown, the cover body of the first sub-cover body 24 located at the periphery of the third through hole 2411 forms a plug 241, and the charger body 3 is provided with a plug hole that penetrates along its thickness direction. In this embodiment, the plug 241 is plugged into the plug hole and makes the outlet of the cooling channel 21 flush with the top of the charger body 3 in the thickness direction. It can be understood that the wireless charging coil is spaced and located at the periphery of the plug hole.

[0067] Among them, Figures 1-3 As shown, the semiconductor refrigeration structure 1 includes a semiconductor refrigeration body 11, and the semiconductor refrigeration body 11 is formed with a refrigeration side wall and a heat dissipation side wall. The refrigeration side wall and the heat dissipation side wall are two side walls arranged relatively spaced apart. The specific structure and working principle of the semiconductor refrigeration body 11 belong to the prior art, so they are not described here.

[0068] Alternatively, if Figures 1-3As shown, the semiconductor refrigeration structure 1 further includes a heat insulation member 12. The semiconductor refrigeration body 11 further forms an outer peripheral wall connecting the refrigeration side wall and the heat dissipation side wall, and the heat insulation member 12 is coated on the outer peripheral wall of the semiconductor refrigeration body 11. The second sealing ring is sleeved on the outer periphery of the heat insulation member 12 and is used to seal the gaps between the heat insulation member 12 and the first sub-shell 23, and between the heat insulation member 12 and the first sub-cover 24. By providing the heat insulation member 12, not only can the loss caused by heat conduction between the wind in the heat dissipation channel 22 and the wind in the refrigeration channel 21 be reduced, but also the loss caused by conductive heat exchange between the semiconductor refrigeration body 11 and the first shell 2 can be reduced, thereby further improving the refrigeration effect and efficiency of the semiconductor refrigeration body 11 on the wind in the refrigeration channel 21; secondly, such a setting enables the size of the semiconductor refrigeration structure 1 to be adjusted to fit the first shell 2 by replacing the heat insulation member 12, which is convenient for installation.

[0069] Preferably, the heat insulation member 12 is made of heat insulation and non-conductive materials such as ceramic fiber cotton and ceramic fiber board.

[0070] Specifically, as Figure 2 and Figure 3 shown, the first sub-shell 23 is provided with a wire passing hole 233, and the wire passing hole 233 is used for the semiconductor refrigeration body 11 to pass a wire and be electrically connected to a power source. The wire passing hole 233 is communicated with the first through hole 231 and / or the second through hole 232. In this embodiment, as Figure 2 and Figure 3 shown, exemplarily, both the first through hole 231 and the second through hole 232 are communicated with the wire passing hole 233.

[0071] Furthermore, preferably, a fourth sealing ring is provided on the inner peripheral wall of the wire passing hole 233, and the fourth sealing ring is used to seal the gap between the wire of the semiconductor refrigeration body 11 and the inner peripheral wall of the wire passing hole 233. For this embodiment, it can avoid air leakage in the refrigeration channel 21 to further improve the cooling effect and efficiency on the wireless charging device 100; and it can avoid air leakage in the heat dissipation channel 22 to further improve the heat dissipation efficiency and effect on the semiconductor refrigeration structure 1.

[0072] Among them, as Figure 1 and Figures 5-7 shown, the wireless charging device further includes a second shell 6. The second shell 6 forms an installation cavity 61 and a refrigeration output hole 631. The first shell 2 and the charger body 3 are both fixedly arranged in the second shell 6. The outlet of the refrigeration channel 21 is communicated with the refrigeration output hole 631. The second shell 6 further forms a heat dissipation output hole 633, and the outlet of the heat dissipation channel 22 is communicated with the heat dissipation output hole 633.

[0073] It can be understood that the wireless charging coil of the charger body 3 is located on the outer periphery of the heat dissipation output hole 633. The heat dissipation output hole 633 is located on the outer periphery of the charger body 3.

[0074] When charging the wireless charging device 100, place the wireless charging device 100 on the second shell 6 and make the wireless charging device 100 within the area where the wireless charging coil is located on the charger body 3 to achieve charging of the wireless charging device 100. The cold air output by the refrigeration flow channel 21 blows directly through the refrigeration output hole 631 to the area where the heat generation of the wireless charging device 100 is concentrated. The hot air output by the heat dissipation flow channel 22 is discharged to the outside through the heat dissipation output hole 633.

[0075] In this embodiment, as Figure 1 , Figure 2 and Figures 5-7 shown, the second shell 6 includes a second sub-shell 62 and a second sub-cover 63. The second sub-cover 63 is detachably covered on the second sub-shell 62 and forms an installation cavity 61 with the second sub-shell 62; both the first shell 2 and the charger body 3 are fixedly arranged in the second sub-shell 62; the second sub-cover 63 is formed with a placement groove 632 and a refrigeration output hole 631. The refrigeration output hole 631 communicates the outlet of the refrigeration flow channel 21 with the placement groove 632. The charger body 3 is located directly below the placement groove 632 along its own thickness direction. The placement groove 632 is used to place the wireless charging device 100. The heat dissipation output hole 633 is formed in the second sub-cover 63. It is convenient to install and disassemble the fan 4, the first shell 2 and the charger body 3 in the second shell 6; secondly, the placement groove 632 can limit the placement position of the wireless charging device 100, which is convenient for charging the wireless charging device 100, and enables the cold air output by the refrigeration flow channel 21 to blow directly through the refrigeration output hole 631 to the area where the heat generation of the wireless charging device 100 is concentrated.

[0076] In this embodiment, as Figure 1 and Figure 7 shown, an exemplary refrigeration output hole 631 is a long hole, and the number of refrigeration output holes 631 is four. It can be understood that the shape and number of the refrigeration output holes 631 can be adjusted according to the practicality of the actual working conditions.

[0077] In this embodiment, as Figure 1 , Figure 5 and Figure 7 shown, an exemplary heat dissipation output hole 633 is a long hole, and the number of heat dissipation output holes 633 is four. It can be understood that the shape and number of the heat dissipation output holes 633 can be adjusted according to the practicality of the actual working conditions.

[0078] In this embodiment, as Figure 1 , Figure 2 and Figure 6As shown, the second sub-housing 62 is further provided with a ventilation opening 621, and the ventilation opening 621 is in communication with both the air inlet of the fan 4 and the installation cavity 61. So as to enable the fan 4 to supply air to the refrigeration flow channel 21 and the heat dissipation flow channel 22.

[0079] In this embodiment, a fifth sealing ring is provided between the plug post 241 and the second sub-cover 63, and the fifth sealing ring is used to seal the gap between the plug post 241 and the second sub-cover 63. So as to further improve the effect and efficiency of cooling the wireless charging device 100.

[0080] Optionally, in this embodiment, as Figure 1 and Figure 2 shown, the second sub-housing 62 forms a first overlapping surface 622, and the first sub-cover 24 overlaps on the first overlapping surface 622 and is fixedly connected to the second sub-housing 62. So as to fix the first housing 2 in the installation cavity 61. Further, as Figure 1 and Figure 2 shown, the first sub-cover 24 overlapping on the first overlapping surface 622 makes the air inlet of the fan 4 and the ventilation opening 621 be spaced apart and in communication, so that the air inlet effect of the fan 4 is good. The ways of fixedly connecting the first sub-cover 24 and the second sub-housing 62 include but are not limited to snap connection, threaded connection, etc.

[0081] Optionally, in this embodiment, as Figure 1 and Figure 2 shown, the second sub-housing 62 further forms a second overlapping surface 623, the charger body 3 overlaps on the second overlapping surface 623, and the top of the charger body 3 along its own thickness direction is attached to the bottom wall of the second sub-cover 63. So as to clamp the charger body 3 between the second sub-cover 63 and the second overlapping surface 623 to limit the installation position of the charger body 3. Further, a fastener passes through the second sub-cover 63 and the charger body 3 and is fixedly connected to the second sub-housing 62. So as to further improve the effect of fixing the installation position of the charger body 3 in the installation cavity 61. The fastener is a screw or a snap connection part provided on the second sub-cover 63, etc.

[0082] As an alternative solution, the first housing 2 can also be directly fixed in the second housing 6 by means of snap connection or threaded connection; the charger body 3 can also be directly fixed in the second housing 6 by means of snap connection or threaded connection.

[0083] Wherein, the charger body 3 is the wireless charging printed circuit board, and the wireless charging coil is the main power transmitting coil. The specific structure and working principle of the wireless charging printed circuit board both belong to the prior art, so they will not be elaborated here.

[0084] The present invention also provides a vehicle, including the above wireless charging device. By adopting the above wireless charging device, the safety and reliability of charging the wireless charging electrical device 100 on the vehicle can be effectively improved, and the energy consumption, design cost and production cost of the vehicle can be effectively reduced.

[0085] Among them, the wireless charging electrical device 100 is a mobile phone or a tablet computer, etc. In this embodiment, by way of example, the wireless charging electrical device 100 is taken as a mobile phone.

[0086] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A wireless charging device, characterized in that: include: A semiconductor refrigeration structure (1) and a first shell (2), wherein the semiconductor refrigeration structure (1) is fixedly arranged in the first shell (2) and forms a refrigeration channel (21) between the semiconductor refrigeration structure (1) and the inner wall of the first shell (2); the refrigeration channel (21) is used to supply air to the wireless charging electrical device (100) for heat dissipation; A charger body (3) is fixed relative to the first shell (2); The inlet of the cooling channel (21) and the outlet of the cooling channel (21) are located on both sides of the charger body (3) in the thickness direction, and the outlet of the cooling channel (21) is closer to the top of the charger body (3) in the thickness direction relative to the inlet of the cooling channel (21); or, the inlet of the cooling channel (21) and the outlet of the cooling channel (21) are both located on the same side of the top of the charger body (3) in the thickness direction, the cooling channel (21) passes through the charger body (3), and the outlet of the cooling channel (21) is flush with the top of the charger body (3) in the thickness direction; The wireless charging coil of the charger body (3) is located at the outer periphery of the outlet of the cooling channel (21).

2. The wireless charging device according to claim 1, characterized in that: The extension direction of the cooling flow channel (21) is parallel to the thickness direction of the charger body (3), and the cooling flow channel (21) penetrates the charger body (3) along its own extension direction.

3. The wireless charging device according to claim 1, characterized in that: A heat dissipation channel (22) is also formed between the semiconductor refrigeration structure (1) and the inner wall of the first shell (2); the refrigeration channel (21) and the heat dissipation channel (22) are not connected to each other, and the outlet of the heat dissipation channel (22) is located at the periphery of the charger body (3).

4. The wireless charging device according to claim 3, characterized in that: The wireless charging device further comprises a fan (4), wherein the fan (4) is fixed relative to the first shell (2), and the fan (4) is used to supply air to the cooling channel (21) and the heat dissipation channel (22).

5. The wireless charging device according to claim 4, characterized in that: The fan (4) is located at the entrance of the cooling channel (21) and the entrance of the heat dissipation channel (22); an air outlet of the fan (4) is sealedly connected to the entrance of the cooling channel (21) and is sealedly connected to the entrance of the heat dissipation channel (22).

6. The wireless charging device according to any one of claims 3 to 5, characterized in that: The wireless charging device further comprises two heat conducting members (5), one of the heat conducting members (5) being fixedly attached to the refrigeration side wall of the semiconductor refrigeration structure (1) and being located in the refrigeration channel (21), and the other heat conducting member (5) being fixedly attached to the heat dissipation side wall of the semiconductor refrigeration structure (1) and being located in the heat dissipation channel (22).

7. The wireless charging device according to any one of claims 3 to 5, characterized in that: The first shell (2) comprises a first sub-shell (23) and a first sub-cover (24); the semiconductor refrigeration structure (1) is fixedly arranged in the first sub-shell (23) and divides the interior of the first sub-shell (23) into a first through hole (231) and a second through hole (232) which are not connected to each other; The first sub-cover body (24) is provided with a third through hole (2411) and a fourth through hole (242); the first sub-cover body (24) is sealed and arranged on the first sub-shell (23) and the semiconductor refrigeration structure (1) so that the first through hole (231) is connected to the third through hole (2411) to form the refrigeration channel (21), and the second through hole (232) is connected to the fourth through hole (242) to form the heat dissipation channel (22).

8. The wireless charging device according to any one of claims 1 to 5, characterized in that: The wireless charging device also includes a second shell (6), the second shell (6) is formed with a mounting cavity (61) and a cooling output hole (631), the first shell (2) and the charger body (3) are both fixedly arranged in the second shell (6), and the outlet of the cooling channel (21) is connected to the cooling output hole (631).

9. The wireless charging device according to claim 8, characterized in that: The second shell (6) comprises a second sub-shell (62) and a second sub-cover (63); the second sub-cover (63) is detachably disposed on the second sub-shell (62) and forms the mounting cavity (61) with the second sub-shell (62); the first shell (2) and the charger body (3) are both fixedly disposed in the second sub-shell (62); The second sub-cover (63) is formed with a placement groove (632) and the cooling output hole (631), and the cooling output hole (631) connects the outlet of the cooling channel (21) and the placement groove (632). The charger body (3) is located directly below the placement groove (632) along its own thickness direction, and the placement groove (632) is used to place the wireless charging electrical device (100).

10. A vehicle, characterized in that A wireless charging device comprising any one of claims 1 to 9.

Images