Semiconductor module

Abstract

Provided is a semiconductor module having a wide area in which a circuit board can be provided. The upper surface of an insulating resin case (2) of a semiconductor module (1) is provided with a first circuit board installation region (7) on which a circuit board for controlling a plurality of semiconductor chips using an auxiliary terminal (6) can be installed, and a second circuit board installation region (8) on which a circuit board protruding part from which a part of the circuit board protrudes and extends can be installed. The second circuit board installation region (8) has a shape including at least a part of a region between the pair of first potential terminals (3) and at least a part of a region between the pair of second potential terminals (4), and is a first recess (12) partitioned by a first protrusion (9) provided on the upper surface of the insulating resin case (2). The upper surface of the insulating resin housing (2) has a second protrusion (10) provided between the first protrusion (9) and each of the pair of first potential terminals (3) on the high potential side, and a second recess (13) formed between the first protrusion (9) and the second protrusion (10).

Description

Technical Field

[0001] The present invention relates to a semiconductor module. Background Art

[0002] Figure 5 FIG. is a perspective view showing a state in which a circuit board is provided in an existing semiconductor module.

[0003] The semiconductor module 1 includes a plurality of semiconductor chips (not shown), an insulating resin housing 2 that houses the plurality of semiconductor chips therein, and a plurality of external terminals led out to the upper surface of the insulating resin housing 2. As the plurality of external terminals, there are a pair of first potential terminals 3, a pair of second potential terminals 4, an AC terminal 5, and auxiliary terminals (not shown).

[0004] A circuit board 20 for controlling the plurality of semiconductor chips housed therein is provided in the semiconductor module 1. The circuit board 20 has a semiconductor chip 22 for a drive circuit and a connector 23, and is fixed to the upper surface of the insulating resin housing 2 of the semiconductor module 1 by screws 24.

[0005] Such a semiconductor module is also described in Patent Document 1 Figure 2 etc.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-92789 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] However, in the existing semiconductor module 1, the circuit board 20 is generally arranged between a pair of second potential terminals 4 and the AC terminal 5, and there is a problem that the area where the circuit board 20 can be provided is narrow.

[0011] The problem to be solved by the present invention is to realize a semiconductor module in which the area where a circuit board can be provided is wide.

[0012] Means for Solving the Problems

[0013] In order to solve the above problems, a semiconductor module of the present invention includes a plurality of semiconductor chips, an insulating resin housing that houses the plurality of semiconductor chips therein, and a plurality of external terminals led out to the upper surface of the insulating resin housing. The semiconductor module is characterized in that the plurality of external terminals include a pair of first potential terminals, a pair of second potential terminals having a potential lower than that of the pair of first potential terminals, at least one AC terminal, and a plurality of auxiliary terminals for controlling the plurality of semiconductor chips. On the upper surface of the insulating resin housing, there are provided a first circuit board setting area where a circuit board for controlling the plurality of semiconductor chips using the plurality of auxiliary terminals can be set, and a second circuit board setting area where a circuit board protrusion part that protrudes and extends a part of the circuit board can be set. The second circuit board setting area has a shape including at least a part of the area between the pair of first potential terminals and at least a part of the area between the pair of second potential terminals, and is a first recess separated by a first protrusion provided on the upper surface of the insulating resin housing. On the upper surface of the insulating resin housing, there are provided second protrusions between each of the pair of first potential terminals and the first protrusion, and a second recess formed between the first protrusion and the second protrusion.

[0014] Effects of the Invention

[0015] According to the present invention, a semiconductor module with a wide area where a circuit board can be set can be realized.

[0016] Other structures and effects of the present invention will be described in the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a perspective view of the semiconductor module of the embodiment.

[0018] Figure 2 is a perspective view showing a state where a circuit board is provided in the semiconductor module of the embodiment.

[0019] Figure 3 is Figure 1 A - A cross-sectional view of

[0020] Figure 4 is a diagram showing a simulation result of the magnetic flux density distribution generated when a short circuit occurs in one semiconductor module in a state where two semiconductor modules of the embodiment are arranged in parallel.

[0021] Figure 5 is a perspective view showing a state where a circuit board is provided in an existing semiconductor module. DETAILED DESCRIPTION OF THE INVENTION

[0022] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In each figure, the same or similar components are denoted by the same reference numerals, and repeated descriptions are omitted.

[0023] Figure 1 is a perspective view of the semiconductor module of the embodiment. Figure 2 is a perspective view showing a state in which a circuit board is provided in the semiconductor module of the embodiment. Figure 3 is Figure 1 A - A cross-sectional view of

[0024] As Figure 1 shown, the semiconductor module 1 of the embodiment includes a plurality of semiconductor chips (not shown), an insulating resin housing 2 that houses the plurality of semiconductor chips therein, and a plurality of external terminals that are led out to the upper surface of the insulating resin housing 2. The semiconductor module 1 can be used, for example, in a power conversion device or the like. In the present embodiment, as the plurality of semiconductor chips, an example in which IGBT (Insulated Gate Bipolar Transistor) is used is described, but it is not limited thereto. For example, other semiconductor chips such as MOSFET (Metal Oxide Semiconductor Field Effect Transistor) can also be used.

[0025] The plurality of external terminals include a pair of first potential terminals 3, a pair of second potential terminals 4 having a potential lower than that of the pair of first potential terminals 3, at least one AC terminal 5, and a plurality of auxiliary terminals 6 for controlling the plurality of semiconductor chips housed inside the insulating resin housing 2. In the present embodiment, an example in which there are three AC terminals 5 is shown, but the number is not limited thereto. As the auxiliary terminals 6, for example, gate terminals, emitter auxiliary terminals, etc. are included, but it is not limited thereto, and collector auxiliary terminals, temperature detection terminals, etc. can also be included.

[0026] And, on the upper surface of the insulating resin housing 2 of the semiconductor module 1 of the present embodiment, in addition to the first circuit board setting area 7 where a circuit board 20 that controls the plurality of semiconductor chips using the plurality of auxiliary terminals 6 can be provided (refer to Figure 2 ), there is also a second circuit board setting area 8 where a circuit board protrusion 21 where a part of the circuit board 20 protrudes and extends can be provided (refer to Figure 2 ).

[0027] The second circuit board setting area 8 has a shape including at least a part of the area between a pair of first potential terminals 3 and at least a part of the area between a pair of second potential terminals 4, and forms a first recess 12 separated by a first protrusion 9 provided on the upper surface of the insulating resin housing 2. Thus, a semiconductor module 1 with a wide area where a circuit board can be set can be achieved.

[0028] Here, when a circuit board protrusion 21 is provided in the second circuit board setting area 8, it is necessary to ensure a sufficient insulation distance between the circuit board protrusion 21 and the first potential terminal 3 on the high potential side. Here, there are two types of insulation distances: the shortest distance connected by a straight line and the creepage distance along the surface.

[0029] Therefore, in the semiconductor module 1 of the present embodiment, in order to ensure the creepage distance between the second circuit board setting area 8 and the first potential terminal 3, as Figure 3 shown, the following structure is adopted: on the upper surface of the insulating resin housing 2, there are second protrusions 10 provided between each of the pair of first potential terminals 3 and the first protrusion 9, and a second recess 13 formed between the first protrusion 9 and the second protrusion 10. Thus, the creepage distance becomes the sum of the distances along the surfaces of the first protrusion 9, the second recess 13, and the second protrusion 10, so that a sufficient insulation distance can be ensured.

[0030] In addition, in Figure 3 an example is shown in which a third protrusion 11 is provided on the upper surface of the insulating resin housing 2 between the first protrusion 9 and the second protrusion 10, and the second recess 13 is divided into a plurality of recesses by the third protrusion 11. Thus, the creepage distance can be further extended. In addition, as long as the creepage distance is sufficient, the third protrusion 11 is not necessary and can be omitted. Also, in order to further ensure the creepage distance, a structure in which a plurality of third protrusions 11 are provided can be adopted.

[0031] The circuit board 20 is divided into an area for controlling semiconductor chips on the high potential side (upper branch) and an area for controlling semiconductor chips on the low potential side (lower branch). In the present embodiment, the potential of the circuit board protrusion 21 is set to the area for controlling the low potential side. Therefore, the potential of the circuit board protrusion 21 in the present embodiment is close to the second potential terminal 4 on the low potential side, so a structure is adopted in which the second circuit board setting area 8 and the second potential terminal 4 are separated only by the first protrusion 9 without providing additional recesses. Thus, additional recesses are not required, and the second circuit board setting area 8 can be enlarged.

[0032] In addition, between the second circuit board setting area 8 and the second potential terminal 4, an additional recess may be provided to ensure the creepage distance. In this case, for example, the following structure may be adopted: on the upper surface of the insulating resin housing 2, there are fourth protrusions (not shown) provided between each of the pair of second potential terminals 4 and the first protrusion 9, and a third recess (not shown) formed between the first protrusion 9 and the fourth protrusion (not shown). Also, the following structure may be adopted: on the upper surface of the insulating resin housing 2, there is a fifth protrusion (not shown) provided between the first protrusion 9 and the fourth protrusion (not shown), and the third recess (not shown) is divided into a plurality of recesses by the fifth protrusion (not shown).

[0033] As Figure 2 shown, the circuit board 20 has a circuit board protrusion 21 where a part of the circuit board 20 protrudes and extends. The circuit board 20 has a semiconductor chip 22 for a drive circuit. Thus, a plurality of auxiliary terminals 6 (refer to Figure 1 ) are used to control a plurality of semiconductor chips (not shown). The auxiliary terminals 6 also serve as threaded holes, and screws 24 can be used for electrical connection with the circuit board 20 and physical fixation of the circuit board 20.

[0034] Here, as Figure 1 shown, the second circuit board setting area 8 preferably has a structure in which a threaded hole 14 for fixing the circuit board protrusion 21 is provided on the upper surface of the insulating resin housing 2. Thus, the circuit board protrusion 21 can be fixed.

[0035] In addition, as Figure 2 shown, the circuit board 20 has a connector 23 for connection with the outside.

[0036] Moreover, the circuit board 20 has a magnetic flux detection part 25 such as a Hall element, for example, at the circuit board protrusion 21.

[0037] Figure 4 is a diagram showing the simulation results of the magnetic flux density distribution generated when a short circuit occurs in one semiconductor module in a state where two semiconductor modules of embodiments are arranged in parallel.

[0038] Figure 4 is a diagram showing the magnetic flux density distribution generated when a short circuit occurs between the upper and lower branches in the semiconductor module 1 on the right side and a large current flows from the first potential terminal 3 to the second potential terminal 4. The areas shown in bright colors are areas with high magnetic flux density, and the areas shown in dark colors are areas with low magnetic flux density. As Figure 4As shown, in the semiconductor module 1 on the right side where a short circuit has occurred, the vicinity of the center of the region surrounded by a pair of first potential terminals 3 and a pair of second potential terminals 4 becomes a region with a high magnetic flux density. By providing the second circuit board setting region 8 here, the magnetic flux detection unit 25 can be arranged here, and the short circuit can be detected with good sensitivity by the magnetic flux detection unit 25. In addition, in the semiconductor module 1 on the left side where no short circuit has occurred, the region near the second circuit board setting region 8 has a small magnetic flux density. By arranging the magnetic flux detection unit 25 here, it is also possible to avoid false detection of short circuits in adjacent semiconductor modules 1.

[0039] As described above, according to the semiconductor module 1 of the embodiment, a semiconductor module with a wide area where a circuit board can be set can be realized. In addition, according to the semiconductor module 1 of the embodiment, the magnetic flux detection unit 25 for detecting a short circuit can also be arranged in the second circuit board setting region 8.

[0040] The embodiments of the present invention have been described above, but the present invention is not limited to the structures described in the embodiments, and various changes can be made within the scope of the technical idea of the present invention. In addition, a part or all of the structures described in the embodiments can be combined and applied.

[0041] Description of reference numerals

[0042] 1 - Semiconductor module, 2 - Insulating resin housing, 3 - First potential terminal, 4 - Second potential terminal, 5 - AC terminal, 6 - Auxiliary terminal, 7 - First circuit board setting region, 8 - Second circuit board setting region, 9 - First protrusion, 10 - Second protrusion, 11 - Third protrusion, 12 - First recess, 13 - Second recess, 14 - Threaded hole, 20 - Circuit board, 21 - Circuit board protrusion, 22 - Semiconductor chip for drive circuit, 23 - Connector, 24 - Screw, 25 - Magnetic flux detection unit.

Claims

1. A semiconductor module includes a plurality of semiconductor chips, an insulating resin housing that houses the plurality of semiconductor chips therein, and a plurality of external terminals led out to the upper surface of the insulating resin housing. The semiconductor module is characterized in that the plurality of external terminals include a pair of first potential terminals, a pair of second potential terminals having a potential lower than that of the pair of first potential terminals, at least one AC terminal, and a plurality of auxiliary terminals for controlling the plurality of semiconductor chips, on the upper surface of the insulating resin housing, there are a first circuit board setting area where a circuit board for controlling the plurality of semiconductor chips using the plurality of auxiliary terminals can be set, and a second circuit board setting area where a circuit board protrusion part that protrudes and extends a part of the circuit board can be set, the second circuit board setting area is in a shape including at least a part of the area between the pair of first potential terminals and at least a part of the area between the pair of second potential terminals, and is a first recess separated by a first protrusion provided on the upper surface of the insulating resin housing, on the upper surface of the insulating resin housing, there are second protrusions provided between each of the pair of first potential terminals and the first protrusion, and a second recess formed between the first protrusion and the second protrusion.

2. The semiconductor module according to claim 1, characterized in that On the upper surface of the above-mentioned insulating resin housing, there is a third protrusion provided between the above-mentioned first protrusion and the above-mentioned second protrusion. The above-mentioned second recess is divided into a plurality of recesses by the above-mentioned third protrusion.

3. The semiconductor module according to claim 1, characterized in that On the upper surface of the above-mentioned insulating resin housing, there is a fourth protrusion provided between each of the pair of second potential terminals and the above-mentioned first protrusion, and a third recess formed between the above-mentioned first protrusion and the above-mentioned fourth protrusion.

4. The semiconductor module according to claim 3, characterized in that On the upper surface of the above-mentioned insulating resin housing, there is a fifth protrusion provided between the above-mentioned first protrusion and the above-mentioned fourth protrusion. The above-mentioned third recess is divided into a plurality of recesses by the above-mentioned fifth protrusion.

5. The semiconductor module according to claim 1, characterized in that The above-mentioned second circuit board setting area has a threaded hole for fixing the above-mentioned circuit board protrusion to the upper surface of the above-mentioned insulating resin housing.

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