Additive manufacturing high-damping manganese-copper alloy lattice structure and preparation method and application thereof

Abstract

The invention discloses an additive manufacturing high-damping manganese-copper alloy lattice structure and a preparation method and application, and particularly relates to the technical field of additive manufacturing of lattice metal. The lattice structure is formed by expanding three-dimensional lattice unit cells, the lattice unit cells are composed of rod-shaped structures with reinforced vertexes, in a cubic space with the side length being L, every two farthest vertexes are connected pairwise to form four connecting rods A, the vertexes of the six surfaces of the cubic space are connected with diagonal lines to form twelve connecting rods B, the center point where the four connecting rods A are connected is reinforced through a ball body C, and the center point where the four connecting rods B are connected is reinforced through a ball body C; and the vertex of the connection of every three connecting rods B is reinforced by a 1 / 4 sphere C, the connection position of the lattice unit cell rod type structure and the sphere C is subjected to round corner treatment, and the high-damping manganese-based alloy lattice structure is obtained through expansion in the transverse and longitudinal directions. Structural and functional integrated preparation is achieved through a selective laser melting process, pre-printing treatment, autonomous partition scanning and layer-by-layer multi-time scanning strategies are adopted, the burnout rate and density of the manganese element are controlled, and stable operation of equipment is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of additive manufacturing of lattice metals, and particularly relates to an additive manufacturing high-damping manganese copper alloy lattice structure, a preparation method and an application thereof. Background Art

[0002] In recent years, with the rapid development of equipment such as aerospace and ships, high-end equipment has put forward higher requirements for the vibration reduction and noise reduction performance of components. For some key equipment inside ships, for example, vibration can cause fatigue, wear and even fracture of mechanical components. By installing shock-absorbing bases or damping materials, the vibration damage of key equipment (such as engines and generators) can be reduced; during the long-term use of an aircraft, due to vibration, problems such as cracks in components such as the tail cone and rudder will occur, seriously affecting the flight reliability and service life of the aircraft; during the high-speed flight of a spacecraft, the tail wing is easily damaged due to resonance, causing a change in its flight direction, resulting in serious consequences such as insufficient accuracy of the spacecraft and equipment damage. Nowadays, with the rapid development of civil industry and national defense equipment, new-generation high-end equipment such as aerospace and ships has put forward higher requirements for the vibration reduction and noise reduction performance of equipment components. Vibration reduction and noise reduction have become the key technical bottlenecks restricting the high-performance service of mechanical equipment in fields such as ships, aerospace, etc.

[0003] Manganese copper alloy is a typical twin-type damping alloy. Due to its combination of high strength and high damping performance, manganese copper alloy is widely used in the aerospace and deep-sea fields. Nowadays, the rapid development of high-end equipment such as aerospace and ships has put forward higher requirements for the damping performance of manganese copper alloy. At the same time, the forming problems of high-strength and high-complexity manganese copper damping alloy also severely limit its wide application.

[0004] The rapid development of additive manufacturing technology makes it possible to prepare high-strength and high-complexity manganese copper damping alloy structures. The porous lattice structure is another effective way to improve the overall damping performance of components. The lattice structure based on manganese copper damping alloy has obvious advantages in mechanical properties, anti-aging properties, corrosion resistance, etc., showing broad application prospects and scientific value. However, due to the easy volatilization characteristics of manganese element and the low laser absorption rate of copper element, etc., many problems such as insufficient damping performance, poor mechanical properties, high porosity, and manganese element burning loss are likely to occur during the additive manufacturing and forming process of the manganese copper damping alloy lattice structure. At the same time, when printing manganese copper alloy with conventional processes for a long time, due to the volatilization of manganese element, it may cause the accumulation of elements on the laser lens, which will damage the galvanometer system of the additive manufacturing equipment, resulting in great economic losses. The above technical problems severely limit the wide application of manganese copper alloy.

[0005] At present, the domestic research on additive manufacturing of manganese copper damping alloy is relatively scarce. There is no relevant report at home and abroad on effectively preparing a high-damping manganese copper alloy lattice structure based on lattice structure design to improve the vibration damping effect through pre-printing treatment, autonomous zoning scanning strategy, layer-by-layer multiple scanning, etc. Summary of the Invention

[0006] The purpose of the present invention is to provide a high-damping manganese copper alloy lattice structure prepared by additive manufacturing, a preparation method thereof, and an application.

[0007] In order to achieve the above purpose, the present invention provides the following technical solutions: A high-damping manganese copper alloy lattice structure prepared by additive manufacturing, which is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of rod-shaped structures with reinforced vertices. In a cubic space with a side length of L, every two farthest vertices are connected pairwise to form 4 connecting rods A. The vertices on the 6 surfaces of the cubic space are connected by diagonals to form 12 connecting rods B. The center point connected by the 4 connecting rods A is reinforced by a sphere C. The vertex connected by every 3 connecting rods B is reinforced by a 1 / 4 sphere C. The connection between the rod-shaped structure of the lattice unit cell and the sphere C is rounded, and the high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. The damping ratio of the high-damping manganese copper alloy lattice structure is not less than 0.085 at a frequency of 0.01 Hz to 10 Hz.

[0008] Furthermore, the cross-section of the connecting rod A is circular, with a circular radius of 1 mm to 5 mm. The cross-section of the connecting rod B is semi-circular, with a semi-circular radius of 0.5 mm to 2.5 mm. The radius of the reinforced sphere C is 2 mm to 4 mm. The side length L of the cubic space of the lattice structure is 5 mm to 15 mm. The porosity of the obtained high-damping manganese-based alloy lattice structure is 21% to 85%. The rounding treatment refers to rounding the connection between the sphere C and the connecting rod A or the connection between the sphere C and the connecting rod B, with a rounding radius of 0.1 mm to 2 mm.

[0009] Furthermore, its matrix material is manganese copper alloy, and the matrix material contains the following chemical components by weight percentage: manganese: 71.5% to 81.5%, copper: 11.5% to 22.0%, iron: 1.5% to 2.5%, nickel: 4.4% to 5.1%, sulfur: ≤0.015%, phosphorus: ≤0.02%, silicon: ≤0.08%, carbon: ≤0.1%, oxygen: ≤0.12%, and the balance is inevitable impurities.

[0010] A preparation method of a high-damping manganese copper alloy lattice structure prepared by additive manufacturing specifically includes the following steps: Step 1: Design a high-damping manganese copper alloy lattice structure using 3D design software, establish a 3D model of the high-damping manganese copper alloy lattice structure, with the 3D model at an angle of 0° to 45° with the forming substrate, and the substrate and the 3D model are connected by supports; Step 2: Use slicing software to perform slicing processing on the 3D model of the high-damping manganese copper alloy lattice structure established in Step 1. After pre-printing the forming substrate, use the laser melting additive manufacturing process to prepare the high-damping manganese copper alloy lattice structure. The characteristics of the laser melting additive manufacturing process are independent zone scanning and multi-layer scanning layer by layer; Step 3: Heat-treat the high-damping manganese copper alloy lattice structure obtained in Step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 850°C to 930°C, the solution treatment time is 1 hour to 2 hours, the aging treatment temperature is 400°C to 450°C, and the aging treatment time is 1 hour to 4 hours.

[0011] Furthermore, the pre-printing treatment described in Step 2 refers to full-width scanning and printing on the forming surface of the substrate. The printing power is 75W to 250W, the scanning speed is 600mm / s to 1000mm / s, the scanning interval is 80μm to 100μm, the single-layer thickness is 20μm to 40μm, the scanning angle is 45° to 90°, and the volumetric energy density is 31.25J / mm 3 ~83.33J / mm 3 ; The total pre-printing height is 1mm to 5mm.

[0012] Furthermore, the independent zone scanning strategy described in Step 2 is to achieve independent zoning of different cross-sections through the method of splitting the 3D model for the cross-sections of the lattice structure connecting rod A, connecting rod B, and sphere C; different regions adopt different scanning strategies. Among them, the scanning strategy for connecting rod A and connecting rod B is strip scanning, the strip width is 2mm to 10mm, and the interlayer rotation angle is 0° to 67°. Sphere C adopts a circular scanning strategy.

[0013] Furthermore, the multi-layer scanning layer by layer described in Step 2 is that when the manganese weight percentage is not higher than 77.5%, each layer is scanned 2 times, and when the manganese weight percentage is higher than 77.5%, each layer is scanned at least 3 times; the printing power is 40W to 150W, the scanning speed is 600mm / s to 1200mm / s, the scanning interval is 90μm to 120μm, the single-layer thickness is 20μm to 40μm, the scanning angle is 45° to 90°, and the volumetric energy density is 17.3J / mm 3 ~83.3J / mm 3 。

[0014] Application of a high-damping manganese-copper alloy lattice structure in additive manufacturing, where the high-damping manganese-copper alloy lattice structure is applied to vibration reduction and noise reduction functional components in the fields of aviation, aerospace, and shipbuilding.

[0015] Advantages of the present invention: 1. Excellent vibration reduction performance. The present invention designs a rod-shaped lattice structure with vertex reinforcement, providing more refraction and reflection paths for the transmission of vibration waves, having excellent damping and vibration reduction performance. At the same time, using manganese-copper alloy as the raw material further improves the damping performance of the lattice structure. The present invention realizes the integrated preparation of the structure and function of the lattice structure through selective laser melting additive manufacturing technology. The prepared manganese-copper alloy lattice structure has a damping ratio of not less than 0.085 in the range of 0.01 Hz to 10 Hz.

[0016] 2. Good mechanical properties. The present invention uses selective laser melting to additively manufacture a high-damping manganese-copper alloy lattice structure. The lattice structure has a unique design of reinforced spheres, significantly enhancing its mechanical properties. At the same time, through the selective laser additive manufacturing process characterized by innovative pre-printing treatment, autonomous zoning scanning strategy, and layer-by-layer multiple scanning, the integrated preparation of the high-damping manganese-copper alloy lattice structure is realized. The prepared lattice structure has good mechanical properties and a relative density of not less than 99%.

[0017] 3. Effective control of manganese content. By innovatively adopting a selective laser additive manufacturing process that combines an autonomous zoning scanning strategy with layer-by-layer multiple scanning, the energy intensity of each layer of the manganese-copper alloy during laser additive manufacturing is effectively reduced. Through the additive manufacturing process of the autonomous zoning scanning strategy and layer-by-layer multiple scanning, while maintaining the overall energy intensity required for the effective forming of the manganese-copper alloy lattice structure, the volatilization of manganese elements is reduced, effectively controlling the manganese elements in the high-damping manganese-copper alloy lattice structure, so that the manganese content in the prepared high-damping manganese-copper alloy lattice structure does not exceed 3‰ compared with the raw material burn loss.

[0018] 4. Stable equipment operation. The present invention innovatively uses the process method of layer-by-layer multiple scanning to effectively prepare the high-damping manganese-copper alloy lattice structure, while effectively suppressing the burn loss and volatilization of manganese elements during the preparation process, effectively reducing the sintering problem of the volatilized manganese elements on the galvanometer of the additive manufacturing equipment, avoiding the damage of the galvanometer system of the equipment, effectively improving the stability of equipment operation, and extending the stable production duration of the additively manufactured manganese-copper alloy lattice structure. Description of the drawings

[0019] Figure 1 It is a schematic diagram of a unit cell model of a high-damping manganese-copper alloy lattice structure.

[0020] Figure 2 It is a schematic diagram of a high-damping manganese-copper alloy lattice structure model.

[0021] Figure 3 Schematic diagram of slice for the autonomous partition scanning strategy of the high-damping manganese copper alloy lattice structure.

[0022] Figure 4 Morphology diagram of the high-damping manganese copper alloy lattice structure sample.

[0023] Figure 5 Damping performance diagram of the high-damping manganese copper alloy lattice structure. Specific implementation mode

[0024] The preparation method of the present invention will be described in detail below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0025] Example 1 In this example, a high-damping manganese copper alloy lattice structure with a porosity of 73% is designed and prepared. The lattice structure is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of rod-shaped structures with reinforced vertices. In a cubic space with a side length of L, four connecting rods A are formed by connecting every two farthest vertices pairwise. The diagonal lines connecting the vertices on the six surfaces of the cubic space form 12 connecting rods B. The center points connected by the four rod connecting rods A are reinforced by spheres C. The vertices connected by every three connecting rods B are reinforced by 1 / 4 spheres C. The connection between the rod structure of the lattice unit cell and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding in the horizontal and vertical directions. The lattice unit cell model is as Figure 1 shown, and a high-damping manganese-based alloy lattice structure is obtained by expanding in the horizontal and vertical directions. The lattice structure is as Figure 2 shown. The cross-section of the connecting rod A of the lattice structure is circular with a radius of 1 mm. The cross-section of the connecting rod B is semi-circular with a radius of 0.5 mm. The radius of the reinforced sphere C is 2.5 mm. The side length L of the cubic space of the lattice structure is 10 mm. The connection between the sphere C and the connecting rod A or the connection between the sphere C and the connecting rod B is rounded with a fillet radius of 0.1 mm. The content of each component of the matrix material used in this example is The high-damping manganese copper alloy lattice structure is prepared by using the selective laser melting additive manufacturing process, which specifically includes the following steps: Step 1: Design a high-damping manganese copper alloy lattice structure using three-dimensional design software, establish a three-dimensional model of the high-damping manganese copper alloy lattice structure. The three-dimensional model forms a certain angle with the forming substrate, and the angle size is 45°. The substrate and the three-dimensional model are connected by supports.

[0026] Step 2: Use slicing software to perform slicing processing on the three-dimensional model of the high-damping manganese-copper alloy lattice structure established in Step 1. Perform pre-printing processing on the forming substrate. The pre-printing processing of full-width scanning and forming on the forming surface of the substrate has a printing power of 75 W, a scanning speed of 800 mm / s, a scanning interval of 100 μm, a single-layer thickness of 30 μm, a scanning angle of 45°, and a volumetric energy density of 31.25 J / mm 3 , and the total pre-printing height is 1.5 mm. Then, prepare the high-damping manganese-copper alloy lattice structure through a selective laser melting additive manufacturing process characterized by an autonomous zoning scanning strategy and multi-layer scanning layer by layer. Design the scanning area using the autonomous zoning scanning strategy. The scanning strategy for connecting rod A and connecting rod B is strip scanning, the strip width is 2 mm, the interlayer rotation angle is 45°, and sphere C uses a circular scanning strategy. The schematic diagram of the slice of the autonomous zoning scanning strategy of the lattice structure is as shown in Figure 3 . Set the scanning parameters using the multi-layer scanning method layer by layer. According to the manganese element content in the matrix material, in this embodiment, the lattice structure is scanned 2 times per layer, the printing power per layer is 40 W, the scanning speed is 800 mm / s, the scanning interval is 90 μm, the single-layer thickness is 20 μm, the scanning angle is 45°, and the volumetric energy density is 27.7 J / mm 3 .

[0027] Step 3: Perform heat treatment on the high-damping manganese-copper alloy lattice structure obtained in Step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 880 °C, the solution treatment time is 1 hour, the aging treatment temperature is 430 °C, and the aging treatment time is 2 hours.

[0028] The manganese-copper alloy lattice structure processed according to the above preparation process is as shown in Figure 4 . At a frequency of 0.01 Hz to 10 Hz, the damping ratio is 0.0854, and the damping ratio performance is as shown in Figure 5 . The density of the lattice structure is 99.8%. The mass fraction of manganese element in the prepared high-damping manganese-copper alloy lattice structure is 71.8%, and the burn loss of manganese element compared with the matrix material is 2.7‰.

[0029] Example 2 This embodiment is about the design and preparation of a high-damping manganese-copper alloy lattice structure with a porosity of 21%. The lattice structure is extended from a three-dimensional lattice unit cell, and the lattice unit cell consists of a rod-shaped structure with reinforced vertices. In a cubic space with a side length of L, 4 connecting rods A are formed by connecting the two farthest vertices pairwise. The diagonal lines connecting the vertices on the 6 surfaces of the cubic space form 12 connecting rods B. The center point connected by the 4 rod connecting rods A is reinforced by a sphere C, and the vertex connected by every 3 connecting rods B is reinforced by a 1 / 4 sphere C. The connection between the rod structure of the lattice unit cell and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. The cross-section of the connecting rod A of this lattice structure is circular with a radius of 2.5 mm, the cross-section of the connecting rod B is semi-circular with a radius of 2.5 mm, the radius of the reinforced body C is 4 mm, the side length L of the cubic space of the lattice structure is 5 mm, and the connection between the sphere C and the connecting rod A or the connecting rod B of the sphere C is rounded with a radius of 1 mm. The content of each component of the matrix material used in this embodiment is The above-mentioned high-damping manganese-copper alloy lattice structure is prepared by a laser melting additive manufacturing process, which specifically includes the following steps: Step 1: Design a high-damping manganese-copper alloy lattice structure using 3D design software, establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains a certain angle with the forming substrate, and the angle size is 0°. The substrate and the 3D model are connected by supports.

[0030] Step 2: Slice the 3D model of the high-damping manganese-copper alloy lattice structure established in Step 1 using slicing software. The forming substrate is pre-printed. The pre-printing process of full-area scanning and printing on the forming surface of the substrate has a printing power of 250 W, a scanning speed of 1000 mm / s, a scanning interval of 80 μm, a single-layer thickness of 40 μm, a scanning angle of 60°, and a volume energy density of 78.13 J / mm 3 , and the total pre-printing height is 1 mm. Then, a selective laser melting additive manufacturing process characterized by an independent partition scanning strategy and multiple scans layer by layer is used to prepare the high-damping manganese-copper alloy lattice structure. The scanning area is designed using the independent partition scanning strategy. The scanning strategy for the connecting rod A and the connecting rod B is strip scanning, the strip width is 8 mm, the interlayer rotation angle is 0°, and the sphere C uses a circular scanning strategy. The scanning parameters are set using the method of multiple scans layer by layer. According to the manganese element content in the matrix material, in this embodiment, the lattice structure is scanned 2 times per layer, the printing power per layer is 150 W, the scanning speed is 600 mm / s, the scanning interval is 100 μm, the single-layer thickness is 30 μm, the scanning angle is 60°, and the volume energy density is 83.3 J / mm 3 .

[0031] Step 3: Heat-treat the high-damping manganese-copper alloy lattice structure obtained in Step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 850 °C, the solution treatment time is 1.5 hours, the aging treatment temperature is 450 °C, and the aging treatment time is 4 hours.

[0032] The manganese-copper alloy lattice structure processed according to the above preparation process has a damping ratio of 0.0883 at a frequency of 0.01 Hz to 10 Hz, and the lattice structure density is 99.6%. The mass fraction of manganese element in the prepared high-damping manganese-copper alloy lattice structure is 76.9%, and the manganese element loss compared with the matrix material is 2.5‰ Example 3 This example is to design and prepare a high-damping manganese-copper alloy lattice structure with a porosity of 85%. The lattice structure is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of rod-shaped structures with reinforced vertices. In a cubic space with a side length of L, every two farthest vertices are connected pairwise to form 4 connecting rods A. The diagonal lines connecting the vertices on the 6 surfaces of the cubic space form 12 connecting rods B. The center points connected by the 4 rod connecting rods A are reinforced by a sphere C. The vertices connected by every 3 connecting rods B are reinforced by a 1 / 4 sphere C. The connection between the rod structure of the lattice unit cell and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. A high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. The cross-section of the connecting rod A of this lattice structure is circular, with a circular radius of 3 mm. The cross-section of the connecting rod B is semi-circular, with a semi-circular radius of 1 mm. The radius of the reinforced sphere C is 2 mm. The side length L of the cubic space of the lattice structure is 15 mm. The connection between the sphere C and the connecting rod A or the connection between the sphere C and the connecting rod B is rounded, and the fillet radius is 2 mm. The content of each component of the matrix material used in this example is The above-mentioned high-damping manganese-copper alloy lattice structure is prepared by selective laser melting additive manufacturing technology, which specifically includes the following steps: Step 1: Use three-dimensional design software to design a high-damping manganese-copper alloy lattice structure, establish a three-dimensional model of the high-damping manganese-copper alloy lattice structure. The three-dimensional model forms a certain angle with the forming substrate, and the angle size is 40°. The substrate and the three-dimensional model are connected by supports.

[0033] Step 2: Use slicing software to perform slicing processing on the three-dimensional model of the high-damping manganese-copper alloy lattice structure established in Step 1. The forming substrate is pre-printed. The pre-printing process of full-width scanning and printing on the forming surface of the substrate has a printing power of 90 W, a scanning speed of 600 mm / s, a scanning interval of 90 μm, a single-layer thickness of 20 μm, a scanning angle of 90°, and a volumetric energy density of 83.33 J / mm 3, the total pre-printing height is 5 mm. Then, a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multi-layer scanning layer by layer is used to prepare a high-damping manganese copper alloy lattice structure. The scanning area is designed using the autonomous partition scanning strategy. The scanning strategy for connecting rod A and connecting rod B is strip scanning, the strip width is 5 mm, the interlayer rotation angle is 67°, and sphere C uses a circular scanning strategy. The scanning parameters are set using the multi-layer scanning method layer by layer. According to the manganese element content in the matrix material, in this embodiment, the lattice structure is scanned 3 times per layer, the printing power per layer is 100 W, the scanning speed is 1200 mm / s, the scanning interval is 120 μm, the single-layer thickness is 40 μm, the scanning angle is 90°, and the volumetric energy density is 17.3 J / mm 3 .

[0034] Step 3: Heat-treat the high-damping manganese copper alloy lattice structure obtained in Step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 930 °C, the solution treatment time is 2 hours, the aging treatment temperature is 400 °C, and the aging treatment time is 3 hours.

[0035] The manganese copper alloy lattice structure processed according to the above preparation process has a damping ratio of 0.0914 at a frequency of 0.01 Hz to 10 Hz, the lattice structure density is 99.3%, the mass fraction of manganese element in the prepared high-damping manganese copper alloy lattice structure is 81.4%, and the manganese element loss compared to the matrix material is 1.2‰.

[0036] Example 4 In this embodiment, a high-damping manganese copper alloy lattice structure with a porosity of 43% is designed and prepared. The lattice structure is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of rod-shaped structures with reinforced vertices. In a cubic space with a side length of L, every two farthest vertices are connected to form 4 connecting rods A, and the diagonal lines connecting the vertices on the 6 surfaces of the cubic space form 12 connecting rods B. The center point connected by the 4 rod connecting rods A is reinforced by sphere C, and the vertex connected by every 3 connecting rods B is reinforced by 1 / 4 sphere C. The connection between the rod structure of the lattice unit cell and sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. A high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions. The cross-section of connecting rod A of this lattice structure is circular, the circular radius is 5 mm, the cross-section of connecting rod B is semi-circular, the semi-circular radius is 2.5 mm, the radius of the reinforced sphere C is 3 mm, the side length L of the cubic space of the lattice structure is 15 mm, and the connection between sphere C and connecting rod A or sphere C and connecting rod B is rounded, and the fillet radius is 0.5 mm. The content of each component of the matrix material used in this embodiment is The selective laser melting additive manufacturing technology is used to prepare the above-mentioned high-damping manganese copper alloy lattice structure, which specifically includes the following steps: Step 1: Design a high-damping manganese copper alloy lattice structure using 3D design software, establish a 3D model of the high-damping manganese copper alloy lattice structure. The 3D model forms a certain angle with the forming substrate, and the angle size is 30°. The substrate and the 3D model are connected by supports.

[0037] Step 2: Use slicing software to perform slicing processing on the 3D model of the high-damping manganese copper alloy lattice structure established in Step 1. Perform pre-printing processing on the forming substrate. The pre-printing processing of full-width scanning and forming on the forming surface of the substrate has a printing power of 150W, a scanning speed of 1000mm / s, a scanning interval of 100μm, a single-layer thickness of 30μm, a scanning angle of 45°, and a volumetric energy density of 50J / mm 3 , and the total pre-printing height is 2mm. Then, prepare the high-damping manganese copper alloy lattice structure through a selective laser melting additive manufacturing process characterized by an autonomous zoning scanning strategy and multiple scans per layer. Use the autonomous zoning scanning strategy to design the scanning area. The scanning strategy for connecting rod A and connecting rod B is strip scanning, the strip width is 10mm, the interlayer rotation angle is 30°, and the sphere C uses a circular scanning strategy. Set the scanning parameters using the method of multiple scans per layer. According to the manganese element content in the matrix material, in this embodiment, the lattice structure is scanned 2 times per layer, the printing power per layer is 150W, the scanning speed is 1000mm / s, the scanning interval is 100μm, the single-layer thickness is 30μm, the scanning angle is 45°, and the volumetric energy density is 50J / mm 3 .

[0038] Step 3: Perform heat treatment on the high-damping manganese copper alloy lattice structure obtained in Step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 900°C, the solution treatment time is 1 hour, the aging treatment temperature is 420°C, and the aging treatment time is 1 hour.

[0039] The manganese copper alloy lattice structure processed according to the above preparation process has a damping ratio of 0.0874 at a frequency of 0.01Hz to 10Hz, the lattice structure density is 99.9%, the mass fraction of manganese element in the prepared high-damping manganese copper alloy lattice structure is 71.4%, and the manganese element loss compared to the matrix material is 1.3‰.

[0040] Comparative Example 1 This comparative example is the comparative example of Example 1. Compared with Example 1, in this comparative example, no pre-printing treatment is performed in Step 2, and the high-damping manganese copper alloy lattice structure is directly prepared through a selective laser melting additive manufacturing process characterized by an autonomous zoning scanning strategy and multiple scans per layer. Other process parameters are exactly the same as those in Example 1, and the matrix material used in this example is the same as that in Example 1.

[0041] The manganese - copper lattice structure prepared according to the above preparation process failed to be successfully printed. Obvious edge warping occurred near the 15th layer, and the printing process stopped due to excessive scraper torque, failing to achieve high - quality forming of the high - damping manganese - copper alloy lattice structure.

[0042] Comparative Example 2 This comparative example is a comparative example of Example 1. Compared with Example 1, in step two of this comparative example, the self - scanning strategy was not used, and the lattice structure all used the conventional strip - scanning strategy with a strip width of 2 mm and an inter - layer rotation angle of 45°. Other process parameters are exactly the same as those in Example 1, and the matrix material used in this example is the same as that in Example 1.

[0043] In the manganese - copper alloy lattice structure processed according to the above preparation process, a large number of spheres strengthened by the lattice structure and the joints were broken, mainly concentrated at the lattice edge, and a small amount was at the internal joints. The density of the lattice structure was 96.5%. Without using the self - partition scanning strategy, effective forming of the high - damping manganese - copper alloy lattice structure cannot be achieved.

[0044] Comparative Example 3 This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example did not use layer - by - layer multiple scanning, and the single - scan method was used to set the scanning parameters. In this example, the lattice structure was scanned 1 time per layer, the printing power per layer was 40 W, the scanning speed was 800 mm / s, the scanning interval was 90 μm, the single - layer thickness was 20 μm, the scanning angle was 45°, and the volumetric energy density was 27.7 J / mm 3 . Other process parameters are exactly the same as those in Example 1.

[0045] The density of the manganese - copper alloy lattice structure processed according to the above preparation process was 94.5%. Obvious holes could be seen on the surface of the lattice structure, and high - quality forming of the high - damping manganese - copper alloy lattice structure was not achieved.

[0046] Comparative Example 4 This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example did not use layer - by - layer multiple scanning, and a single - scan scheme with high - energy printing parameters was used. In this example, the lattice structure was scanned 1 time per layer, and compared with Example 1, the printing power was increased to 200 W, and the corresponding volumetric energy density was increased to 138.9 J / mm 3 , and other process parameters remained the same, specifically including a scanning speed of 800 mm / s, a scanning interval of 90 μm, a single - layer thickness of 20 μm, and a scanning angle of 45°.

[0047] Other process parameters are exactly the same as those in Example 1, and the matrix material used in this example is the same as that in Example 1.

[0048] The manganese-copper alloy lattice structure obtained by the above preparation process produced a large amount of black ash during the printing process. The additive manufacturing equipment alarmed and stopped after printing to 11.4mm. The galvanometer of the equipment was seriously contaminated. The additive manufacturing equipment could not print normally. A large number of rod structures of the printed lattice structure were broken, and the center of the reinforced spherical part was tilted. The density was 92.5%, and the high-quality forming of the high-damping manganese-copper alloy lattice structure could not be achieved. The manganese content of the finished product was 70.1%, and the manganese element burnout was 26.3‰ compared with the matrix material.

[0049] Comparative Example 5 This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example also adopts a layer-by-layer multiple scanning method to set the scanning parameters, but the number of scans is not determined according to the recorded manganese content. In this comparative example, the dot matrix structure is scanned 3 times per layer, the printing power per layer is 40W, the scanning speed is 800mm / s, the scanning interval is 90μm, the single layer thickness is 20μm, the scanning angle is 45°, and the volume energy density is 27.7J / mm 3 The other process parameters are completely consistent with those in Example 1, and the base material used in this example is the same as that in Example 1.

[0050] The manganese-copper alloy lattice structure obtained by the above preparation process has a damping ratio of 0.0534 at a frequency of 0.01Hz~10Hz, and the damping performance is poor. At the same time, the density of the obtained manganese-copper lattice structure is 91.4%, and the reinforced spheres and connecting rods in the lattice structure have multiple fractures, the surface of the reinforced spheres is severely convex, and a small number of obvious holes can be seen on the surface of the lattice structure, failing to achieve high-quality forming of the high-damping manganese-copper alloy lattice structure.

[0051] Comparative Example 6 This comparative example is a comparative example of Example 3. Compared with Example 3, this comparative example also adopts a layer-by-layer multiple scanning method to set the scanning parameters, but the number of scans is not determined according to the recorded manganese content. In this comparative example, the dot matrix structure is scanned twice per layer, the printing power per layer is 100W, the scanning speed is 1200mm / s, the scanning interval is 120μm, the single layer thickness is 40μm, the scanning angle is 90°, and the volume energy density is 17.3J / mm 3 The other process parameters are exactly the same as those in Example 3, and the base material used in this example is the same as that in Example 3. The manganese-copper alloy lattice structure obtained by the above preparation process has a damping ratio of 0.0484 at a frequency of 0.01Hz~10Hz, and the lattice structure density is 90.2%. A large number of unfused defects can be observed on the surface of the lattice structure, and high-quality forming of the high-damping manganese-copper alloy lattice structure cannot be achieved. Matters not covered by the present invention are known technologies.

[0052] The above embodiments are only used to illustrate the technical concept and features of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. It is not intended to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A high-damping manganese-copper alloy lattice structure by additive manufacturing, characterized in that The lattice structure is expanded from a three-dimensional lattice unit cell, which is composed of rod-shaped structures with reinforced vertices. In a cubic space with a side length of L, 4 connecting rods A are formed by connecting the two farthest vertices pairwise. The diagonal lines connecting the vertices on the 6 surfaces of the cubic space form 12 connecting rods B. The center point connected by the 4 connecting rods A is reinforced by a sphere C, and the vertex connected by every 3 connecting rods B is reinforced by a 1 / 4 sphere C. The connection between the rod-shaped structure of the lattice unit cell and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding along the horizontal and vertical directions; the high-damping manganese-copper alloy lattice structure has a damping ratio of not less than 0.085 at a frequency of 0.01 Hz to 10 Hz.

2. The high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 1, characterized in that The cross-section of the connecting rod A is circular, with a circular radius of 1 mm to 5 mm. The cross-section of the connecting rod B is semi-circular, with a semi-circular radius of 0.5 mm to 2.5 mm. The radius of the reinforced sphere C is 2 mm to 4 mm. The side length L of the cubic space of the lattice structure is 5 mm to 15 mm. The porosity of the obtained high-damping manganese-based alloy lattice structure is 21% to 85%; the rounding treatment means that the connection between the sphere C and the connecting rod A or the connection between the sphere C and the connecting rod B needs to be rounded, and the rounding radius is 0.1 mm to 2 mm.

3. The high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 1, characterized in that Its matrix material is manganese-copper alloy, and the matrix material contains the following chemical components by weight percentage: manganese: 71.5% to 81.5%, copper: 11.5% to 22.0%, iron: 1.5% to 2.5%, nickel: 4.4% to 5.1%, sulfur: ≤0.015%, phosphorus: ≤0.02%, silicon: ≤0.08%, carbon: ≤0.1%, oxygen: ≤0.12%, and the balance is inevitable impurities.

4. A preparation method of the high-damping manganese-copper alloy lattice structure by additive manufacturing according to any one of claims 1-3, characterized in that Specifically, it includes the following steps: Step 1: Use 3D design software to design a high-damping manganese-copper alloy lattice structure, establish a 3D model of the high-damping manganese-copper alloy lattice structure, and the 3D model forms an angle of 0° to 45° with the forming substrate, and the substrate and the 3D model are connected by supports; Step 2: Use slicing software to slice the 3D model of the high-damping manganese-copper alloy lattice structure established in Step 1. After pre-printing the forming substrate, use the laser melting additive manufacturing process to prepare the high-damping manganese-copper alloy lattice structure. The characteristics of the laser melting additive manufacturing process are independent zone scanning and layer-by-layer multiple scanning; Step 3: Heat-treat the high-damping manganese-copper alloy lattice structure obtained in Step 2. The heat-treatment method is solution treatment plus aging treatment. The solution treatment temperature is 850°C to 930°C, the solution treatment time is 1 hour to 2 hours, the aging treatment temperature is 400°C to 450°C, and the aging treatment time is 1 hour to 4 hours.

5. The preparation method of the high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 4, characterized in that The pre-printing process described in step 2 refers to full-width scanning and printing on the forming surface of the substrate. The printing power is 75W - 250W, the scanning speed is 600mm / s - 1000mm / s, the scanning interval is 80μm - 100μm, the single-layer thickness is 20μm - 40μm, the scanning angle is 45° - 90°, and the volumetric energy density is 31.25J / mm 3 ~83.33J / mm 3 ; The total pre-printing height is 1mm - 5mm.

6. The preparation method of the high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 4, characterized in that The independent zone scanning strategy described in Step 2 is that for the cross-sections of the connecting rod A, connecting rod B, and sphere C of the lattice structure, different cross-sections are independently zoned by means of 3D model split modeling; different regions adopt different scanning strategies. Among them, the scanning strategy for the connecting rod A and the connecting rod B is strip scanning, the strip width is 2 mm to 10 mm, and the interlayer rotation angle is 0° to 67°. The sphere C adopts a circular scanning strategy.

7. The preparation method of the high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 4, characterized in that The step of layer-by-layer multiple scanning described in Step 2 is as follows: when the manganese weight percentage is not higher than 77.5%, each layer is scanned 2 times; when the manganese weight percentage is higher than 77.5%, each layer is scanned not less than 3 times; the printing power is 40W - 150W, the scanning speed is 600mm / s - 1200mm / s, the scanning interval is 90μm - 120μm, the single-layer thickness is 20μm - 40μm, the scanning angle is 45° - 90°, and the volumetric energy density is 17.3J / mm 3 ~83.3J / mm 3 .

8. An application of the high-damping manganese-copper alloy lattice structure by additive manufacturing, using the high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 1, characterized in that The high-damping manganese copper alloy lattice structure is applied to the vibration and noise reduction functional components in the fields of aviation, aerospace and shipbuilding.

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