An additively manufactured high-damping manganese-copper alloy lattice structure and its preparation method and application

Abstract

The present invention discloses an additively manufactured high-damping manganese-copper alloy lattice structure, a preparation method and an application, and specifically relates to the field of additive manufacturing technology of lattice metals. The lattice structure is formed by expanding a three-dimensional lattice unit cell, and the lattice unit cell is composed of a rod-type structure reinforced by vertices. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A, and the vertices of the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point connected by the four connecting rods A is reinforced by a sphere C, and the vertex connected by every three connecting rods B is reinforced by a 1 / 4 sphere C. The connection between the lattice unit cell rod-type structure and the sphere C is rounded, and expanded in the horizontal and vertical directions to obtain a high-damping manganese-based alloy lattice structure. The integrated preparation of structure and function is achieved through the selective laser melting process, and the pre-printing process, autonomous partition scanning and layer-by-layer multiple scanning strategies are adopted to control the manganese element burnout rate and density to ensure stable operation of the equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of additive manufacturing of lattice metals, and specifically relates to an additively manufactured high-damping manganese-copper alloy lattice structure, a preparation method, and an application thereof. Background Art

[0002] In recent years, with the rapid development of equipment in the aerospace, shipbuilding, and other sectors, high-end equipment has placed higher demands on the vibration and noise reduction performance of its components. For example, for some critical equipment within a ship, vibration can cause fatigue, wear, and even fracture in mechanical components. Vibration damage to critical equipment (such as engines and generators) can be reduced by installing vibration-damping bases or damping materials. Over the long term, vibration can cause cracks in components such as the tail cowling and wind vanes, seriously impacting the aircraft's flight reliability and service life. High-speed flight can easily damage the tail fin due to resonance, causing the aircraft to change direction and leading to serious consequences such as insufficient precision and equipment damage. Today, with the rapid development of both civilian industry and defense equipment, the new generation of high-end equipment, such as aerospace and shipbuilding, is placing even higher demands on the vibration and noise reduction performance of its components. Vibration and noise reduction have become a key technical bottleneck restricting the high-performance service of mechanical equipment in sectors such as shipbuilding and aerospace.

[0003] Manganese-copper alloy is a typical twin-crystal damping alloy. Its combination of high strength and high damping performance has led to its widespread use in aerospace and deep-sea applications. The rapid development of high-end equipment in aerospace, shipbuilding, and other sectors has placed higher demands on the damping performance of manganese-copper alloys. However, the difficulty in forming these high-strength, highly complex manganese-copper damping alloys has severely limited their widespread application.

[0004] The rapid development of additive manufacturing technology has made it possible to prepare high-strength and high-complexity manganese-copper damping alloy structures. Porous lattice structures are another effective way to improve the overall damping performance of components. The lattice structure based on manganese-copper damping alloy has obvious advantages in mechanical properties, anti-aging properties, corrosion resistance, etc., showing broad application prospects and scientific value. However, due to the volatility of manganese and the low laser absorption rate of copper, the manganese-copper damping alloy lattice structure is prone to many problems such as insufficient damping performance, poor mechanical properties, high porosity, and manganese burnout during the additive manufacturing process. At the same time, when using conventional processes to print manganese-copper alloy for a long time, the volatilization of manganese may cause the element to accumulate on the laser lens, which will cause damage to the galvanometer system of the additive manufacturing equipment and cause large economic losses. The above technical difficulties have seriously restricted the widespread application of manganese-copper alloy.

[0005] At present, there are relatively few studies on additively manufactured manganese-copper damping alloys in China. There are no related reports at home and abroad on improving the vibration reduction effect based on lattice structure design and realizing the effective preparation of high-damping manganese-copper alloy lattice structure through pre-printing processing, autonomous partition scanning strategy, and multiple scanning layer by layer. Summary of the Invention

[0006] The purpose of the present invention is to provide a high-damping manganese-copper alloy lattice structure manufactured by additive manufacturing, a preparation method and an application thereof.

[0007] In order to achieve the above object, the present invention provides the following technical solutions:

[0008] Disclosed is an additively manufactured high-damping manganese-copper alloy lattice structure, which is formed by expanding a three-dimensional lattice unit cell. The lattice unit cell consists of a vertex-reinforced rod-type structure. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A. The vertices on the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point connected by the four connecting rods A is reinforced by a sphere C, and the vertex connected by every three connecting rods B is reinforced by a 1 / 4 sphere C. The connection between the lattice unit cell rod-type structure and the sphere C is rounded and expanded in the horizontal and vertical directions to obtain a high-damping manganese-based alloy lattice structure. The high-damping manganese-copper alloy lattice structure has a damping ratio of not less than 0.085 at a frequency of 0.01 Hz to 10 Hz.

[0009] Furthermore, the cross-section of connecting rod A is circular with a radius of 1mm to 5mm, the cross-section of connecting rod B is semicircular with a radius of 0.5mm to 2.5mm, the radius of the reinforced sphere C is 2mm to 4mm, the side length L of the lattice structure cube is 5mm to 15mm, and the porosity of the expanded high-damping manganese-based alloy lattice structure is 21% to 85%. The filleting treatment mentioned above refers to the need to fillet the connection between sphere C and connecting rod A or sphere C and connecting rod B, with a fillet radius of 0.1mm to 2mm.

[0010] Furthermore, its base material is manganese-copper alloy, and the base material contains the following chemical components by weight: manganese: 71.5%~81.5%, copper: 11.5%~22.0%, iron: 1.5%~2.5%, nickel: 4.4%~5.1%, sulfur: ≤0.015%, phosphorus: ≤0.02%, silicon: ≤0.08%, carbon: ≤0.1%, oxygen: ≤0.12%, and the remainder is unavoidable impurities.

[0011] A method for preparing a high-damping manganese-copper alloy lattice structure by additive manufacturing specifically comprises the following steps:

[0012] Step 1: Design a high-damping manganese-copper alloy lattice structure using 3D design software, and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains an angle of 0° to 45° with the forming substrate, and the substrate and the 3D model are connected by supports;

[0013] Step 2: Slice the three-dimensional model of the high-damping manganese-copper alloy lattice structure established in step 1 using slicing software. After pre-printing the formed substrate, use a laser melting additive manufacturing process to prepare the high-damping manganese-copper alloy lattice structure. The laser melting additive manufacturing process is characterized by autonomous partition scanning and multiple layer-by-layer scanning.

[0014] Step 3: heat treat the high damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 850°C~930°C, the solution treatment time is 1 hour~2 hours, the aging treatment temperature is 400°C~450°C, and the aging treatment time is 1 hour~4 hours.

[0015] Furthermore, the pre-printing process described in step 2 refers to scanning and printing on the entire forming surface of the substrate, with a printing power of 75W~250W, a scanning speed of 600mm / s~1000mm / s, a scanning interval of 80μm~100μm, a single layer thickness of 20μm~40μm, a scanning angle of 45°~90°, and a volume energy density of 31.25J / mm 3 ~83.33J / mm 3 ; Total pre-print height 1mm~5mm.

[0016] Furthermore, the autonomous partitioning scanning strategy described in step 2 is to achieve autonomous partitioning of different cross sections of the cross sections of the lattice structure connecting rod A, connecting rod B and sphere C through three-dimensional model split modeling; different areas adopt different scanning strategies, among which the scanning strategy for connecting rods A and connecting rods B is strip scanning with a strip width of 2mm~10mm and an interlayer rotation angle of 0°~67°, and sphere C adopts a circular scanning strategy.

[0017] Furthermore, the layer-by-layer multiple scanning described in step 2 is: when the weight percentage of manganese is not higher than 77.5%, each layer is scanned twice, and when the weight percentage of manganese is higher than 77.5%, each layer is scanned not less than 3 times; the printing power is 40W~150W, the scanning speed is 600mm / s~1200mm / s, the scanning interval is 90μm~120μm, the single layer thickness is 20μm~40μm, the scanning angle is 45°~90°, and the volume energy density is 17.3J / mm 3 ~83.3J / mm 3 .

[0018] An application of an additively manufactured high-damping manganese-copper alloy lattice structure, wherein the high-damping manganese-copper alloy lattice structure is used in vibration and noise reduction functional components in the fields of aviation, aerospace, and shipbuilding.

[0019] Beneficial effects of the present invention:

[0020] 1. Excellent vibration damping performance. The present invention designs a vertex-reinforced rod-type lattice structure, which provides more refraction and reflection paths for vibration wave transmission and has excellent damping and vibration reduction performance. At the same time, the use of manganese-copper alloy as a raw material further improves the damping performance of the lattice structure. The present invention realizes the structural and functional integration of the lattice structure through selective laser melting additive manufacturing technology. The prepared manganese-copper alloy lattice structure has a damping ratio of not less than 0.085 in the range of 0.01Hz to 10Hz.

[0021] 2. Good mechanical properties. The present invention uses selective laser melting to additively manufacture a high-damping manganese-copper alloy lattice structure. The lattice structure has a unique reinforced spherical design, which significantly enhances its mechanical properties. At the same time, through the innovative development of pre-printing processing, autonomous partition scanning strategy, and layer-by-layer multiple scanning as the characteristic selective laser additive manufacturing process, the integrated preparation of the high-damping manganese-copper alloy lattice structure is achieved. The prepared lattice structure has good mechanical properties and a density of not less than 99%.

[0022] 3. Effective control of manganese content. Through the innovative use of a selective laser additive manufacturing process that combines an autonomous partition scanning strategy with multiple layer-by-layer scanning, the energy intensity of each layer of the manganese-copper alloy during the laser additive manufacturing process is effectively reduced. Through the autonomous partition scanning strategy and the additive manufacturing process of multiple layer-by-layer scanning, while maintaining the overall energy intensity required for the effective forming of the manganese-copper alloy lattice structure, the volatilization of the manganese element is reduced, effectively controlling the manganese element in the high-damping manganese-copper alloy lattice structure, so that the manganese content in the prepared high-damping manganese-copper alloy lattice structure does not exceed 3‰ compared to the burnout of the raw material.

[0023] 4. Stable equipment operation. The present invention innovatively uses a layer-by-layer multiple scanning process to achieve the effective preparation of high-damping manganese-copper alloy lattice structures. At the same time, it effectively suppresses the burning and volatilization of manganese elements during the preparation process, effectively reduces the sintering problem of volatilized manganese elements on the galvanometer of the additive manufacturing equipment, avoids damage to the equipment galvanometer system, effectively improves the stability of equipment operation, and extends the stable production time of the additively manufactured manganese-copper alloy lattice structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the unit cell model of high-damping manganese-copper alloy lattice structure.

[0025] Figure 2 Schematic diagram of the high damping manganese-copper alloy lattice structure model.

[0026] Figure 3 Schematic diagram of the autonomous partition scanning strategy for the high-damping manganese-copper alloy lattice structure.

[0027] Figure 4 This is the morphology of the high damping manganese-copper alloy lattice structure sample.

[0028] Figure 5 This is the damping performance diagram of the high damping manganese-copper alloy lattice structure. DETAILED DESCRIPTION

[0029] The preparation method of the present invention will be described in detail below with reference to the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0030] Example 1

[0031] This embodiment is to design and prepare a high-damping manganese-copper alloy lattice structure with a porosity of 73%. The lattice structure is formed by expanding a three-dimensional lattice unit cell. The lattice unit cell is composed of a rod-type structure reinforced by the vertex. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form 4 connecting rods A, and the vertices of the 6 surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point where the 4 rods connect the rods A is reinforced by a sphere C, and the vertex where every 3 connecting rods B are connected is reinforced by a 1 / 4 sphere C. The connection between the lattice unit cell rod structure and the sphere C is rounded and expanded in the horizontal and vertical directions to obtain a high-damping manganese-based alloy lattice structure. The lattice unit cell model is as follows: Figure 1 As shown, the high damping manganese-based alloy lattice structure is obtained by expanding in the horizontal and vertical directions. Figure 2 The cross section of the connecting rod A in the lattice structure is circular with a radius of 1mm, the cross section of the connecting rod B is semicircular with a radius of 0.5mm, the radius of the reinforced sphere C is 2.5mm, the side length L of the lattice structure cube space is 10mm, and the connection between the sphere C and the connecting rod A or the sphere C and the connecting rod B is rounded with a radius of 0.1mm. The content of each component of the matrix material used in this embodiment is

[0032]

[0033] The high-damping manganese-copper alloy lattice structure is prepared by a selective laser melting additive manufacturing process, which specifically includes the following steps:

[0034] Step 1: Use 3D design software to design a high-damping manganese-copper alloy lattice structure, and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains a certain angle with the forming substrate, the angle is 45°, and the substrate and the 3D model are connected by supports.

[0035] Step 2: Use slicing software to slice the high-damping manganese-copper alloy lattice structure 3D model established in step 1. Perform pre-printing on the formed substrate, and perform full-width scanning and printing on the substrate forming surface. The pre-printing process has a printing power of 75W, a scanning speed of 800mm / s, a scanning interval of 100μm, a single layer thickness of 30μm, a scanning angle of 45°, and a volume energy density of 31.25J / mm 3 The total pre-print height is 1.5mm. Then, a high-damping manganese-copper alloy lattice structure is prepared through a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multiple layer-by-layer scanning. The scanning area is designed using an autonomous partition scanning strategy. The scanning strategy for connecting rods A and B is strip scanning with a strip width of 2mm and an inter-layer rotation angle of 45°. The sphere C adopts a circular scanning strategy. The schematic diagram of the autonomous partition scanning strategy for the lattice structure is shown in the figure. Figure 3 The scanning parameters are set by using a layer-by-layer multiple scanning method. According to the manganese content in the base material, in this embodiment, the dot matrix structure is scanned twice per layer, the printing power per layer is 40W, the scanning speed is 800mm / s, the scanning interval is 90μm, the single layer thickness is 20μm, the scanning angle is 45°, and the volume energy density is 27.7J / mm 3 .

[0036] Step 3: heat-treating the high-damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment, with the solution treatment temperature being 880° C. for 1 hour and the aging treatment temperature being 430° C. for 2 hours.

[0037] The lattice structure of the manganese-copper alloy obtained by the above preparation process is as follows Figure 4 As shown, at the frequency of 0.01Hz~10Hz, the damping ratio is 0.0854, and the damping ratio performance is as follows Figure 5 As shown in the figure, the density of the lattice structure is 99.8%, and the mass fraction of manganese element in the prepared high damping manganese-copper alloy lattice structure is 71.8%. Compared with the matrix material, the manganese element burnout is 2.7‰.

[0038] Example 2

[0039] This embodiment is to design and prepare a high-damping manganese-copper alloy lattice structure with a porosity of 21%. The lattice structure is formed by expanding a three-dimensional lattice unit cell. The lattice unit cell is composed of a rod-type structure reinforced by the vertex. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A. The vertices of the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point where the four connecting rods A are connected is reinforced by a sphere C. The vertex where every three connecting rods B are connected is reinforced by 1 / 4 of a sphere C. The connection between the structure and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding in the horizontal and vertical directions. The cross-section of the connecting rod A of the lattice structure is circular with a circular radius of 2.5mm, the cross-section of the connecting rod B is semicircular with a semicircular radius of 2.5mm, the radius of the reinforced body C is 4mm, the side length L of the lattice structure cube space is 5mm, and the connection between the sphere C and the connecting rod A or the sphere C and the connecting rod B is rounded with a fillet radius of 1mm. The content of each component of the matrix material used in this embodiment is

[0040]

[0041] The laser melting additive manufacturing process is used to prepare the high-damping manganese-copper alloy lattice structure, which specifically includes the following steps:

[0042] Step 1: Use 3D design software to design a high-damping manganese-copper alloy lattice structure, and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains a certain angle with the forming substrate, the angle is 0°, and the substrate and the 3D model are connected by supports.

[0043] Step 2: Use slicing software to slice the high-damping manganese-copper alloy lattice structure 3D model established in step 1. Perform pre-printing on the formed substrate, and perform full-width scanning and printing on the substrate forming surface. The pre-printing process has a printing power of 250W, a scanning speed of 1000mm / s, a scanning interval of 80μm, a single layer thickness of 40μm, a scanning angle of 60°, and a volume energy density of 78.13J / mm 3, the total pre-print height is 1mm. Then, a high-damping manganese-copper alloy lattice structure was prepared by a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multiple layer scanning. The scanning area was designed using an autonomous partition scanning strategy. The scanning strategy for connecting rods A and B was strip scanning with a strip width of 8mm and an interlayer rotation angle of 0°. The sphere C adopted a circular scanning strategy. The scanning parameters were set using a layer-by-layer multiple scanning method. According to the manganese content in the matrix material, in this embodiment, the lattice structure was scanned twice per layer, the printing power per layer was 150W, the scanning speed was 600mm / s, the scanning interval was 100μm, the single layer thickness was 30μm, the scanning angle was 60°, and the body energy density was 83.3J / mm 3 .

[0044] Step 3: heat-treating the high-damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment, with the solution treatment temperature being 850° C. for 1.5 hours and the aging treatment temperature being 450° C. for 4 hours.

[0045] The manganese-copper alloy lattice structure obtained by the above preparation process has a damping ratio of 0.0883 at a frequency of 0.01Hz~10Hz, and a lattice structure density of 99.6%. The mass fraction of manganese element in the prepared high-damping manganese-copper alloy lattice structure is 76.9%, which is 2.5‰ compared to the manganese element burnout of the matrix material.

[0046] Example 3

[0047] This embodiment designs and prepares a high-damping manganese-copper alloy lattice structure with a porosity of 85%. The lattice structure is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of a rod-type structure reinforced by vertices. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A. The vertices of the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point where the four connecting rods A are connected is reinforced by a sphere C. The vertex where every three connecting rods B are connected is reinforced by 1 / 4 of a sphere C. The connection between the structure and the sphere C is rounded, and a high-damping manganese-based alloy lattice structure is obtained by expanding in the horizontal and vertical directions. The cross-section of the connecting rod A in the lattice structure is circular with a circular radius of 3mm, the cross-section of the connecting rod B is semicircular with a semicircular radius of 1mm, the radius of the reinforced sphere C is 2mm, the side length L of the lattice structure cube space is 15mm, and the connection between the sphere C and the connecting rod A or the sphere C and the connecting rod B is rounded with a fillet radius of 2mm. This embodiment uses the following components of the matrix material:

[0048]

[0049] The high-damping manganese-copper alloy lattice structure is prepared by a selective laser melting additive manufacturing process, which specifically includes the following steps:

[0050] Step 1: Use 3D design software to design a high-damping manganese-copper alloy lattice structure and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains a certain angle with the forming substrate, the angle is 40°, and the substrate and the 3D model are connected by supports.

[0051] Step 2: Use slicing software to slice the high-damping manganese-copper alloy lattice structure 3D model established in step 1. Perform pre-printing on the formed substrate, and perform full-width scanning and printing on the substrate forming surface. The pre-printing process has a printing power of 90W, a scanning speed of 600mm / s, a scanning interval of 90μm, a single layer thickness of 20μm, a scanning angle of 90°, and a volume energy density of 83.33J / mm 3 , the total pre-print height is 5mm. Then, a high-damping manganese-copper alloy lattice structure was prepared by a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multiple layer scanning. The scanning area was designed using an autonomous partition scanning strategy. The scanning strategy for connecting rods A and B was strip scanning with a strip width of 5mm and an interlayer rotation angle of 67°. The sphere C adopted a circular scanning strategy. The scanning parameters were set using a layer-by-layer multiple scanning method. According to the manganese content in the matrix material, in this embodiment, the lattice structure was scanned 3 times per layer, the printing power per layer was 100W, the scanning speed was 1200mm / s, the scanning interval was 120μm, the single layer thickness was 40μm, the scanning angle was 90°, and the body energy density was 17.3J / mm 3 .

[0052] Step 3: heat-treating the high-damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment, with the solution treatment temperature being 930° C. for 2 hours and the aging treatment temperature being 400° C. for 3 hours.

[0053] The manganese-copper alloy lattice structure obtained according to the above preparation process has a damping ratio of 0.0914 at a frequency of 0.01Hz~10Hz, a lattice structure density of 99.3%, and a manganese element mass fraction of 81.4% in the prepared high-damping manganese-copper alloy lattice structure, which is 1.2‰ compared with the manganese element burnout of the matrix material.

[0054] Example 4

[0055] This embodiment designs and prepares a high-damping manganese-copper alloy lattice structure with a porosity of 43%. The lattice structure is expanded from a three-dimensional lattice unit cell. The lattice unit cell is composed of a rod-type structure reinforced by vertices. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A. The vertices of the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point where the four connecting rods A are connected is reinforced by a sphere C. The vertex where every three connecting rods B are connected is reinforced by 1 / 4 of a sphere C. The lattice unit cell rod structure is connected to the lattice unit cell. The connection of sphere C is rounded and expanded in the horizontal and vertical directions to obtain a high-damping manganese-based alloy lattice structure. The cross-section of the connecting rod A of the lattice structure is circular with a radius of 5mm, the cross-section of the connecting rod B is semicircular with a radius of 2.5mm, the radius of the reinforced sphere C is 3mm, the side length L of the lattice structure cube space is 15mm, and the connection between sphere C and connecting rod A or sphere C and connecting rod B is rounded with a radius of 0.5mm. The content of each component of the matrix material used in this embodiment is

[0056]

[0057] The high-damping manganese-copper alloy lattice structure is prepared by selective laser melting additive manufacturing technology, which specifically includes the following steps:

[0058] Step 1: Use 3D design software to design a high-damping manganese-copper alloy lattice structure and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains a certain angle with the forming substrate, the angle is 30°, and the substrate and the 3D model are connected by supports.

[0059] Step 2: Use slicing software to slice the high-damping manganese-copper alloy lattice structure 3D model established in step 1. Perform pre-printing on the formed substrate, and perform full-width scanning and printing on the substrate forming surface. The pre-printing process has a printing power of 150W, a scanning speed of 1000mm / s, a scanning interval of 100μm, a single layer thickness of 30μm, a scanning angle of 45°, and a volume energy density of 50J / mm 3, the total pre-print height is 2mm. Then, a high-damping manganese-copper alloy lattice structure is prepared by a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multiple layer scanning. The scanning area is designed using an autonomous partition scanning strategy. The scanning strategy for connecting rods A and B is strip scanning with a strip width of 10mm and an interlayer rotation angle of 30°. The sphere C adopts a circular scanning strategy. The scanning parameters are set using a layer-by-layer multiple scanning method. According to the manganese content in the matrix material, in this embodiment, the lattice structure is scanned twice per layer, the printing power per layer is 150W, the scanning speed is 1000mm / s, the scanning interval is 100μm, the single layer thickness is 30μm, the scanning angle is 45°, and the body energy density is 50J / mm 3 .

[0060] Step 3: heat-treating the high-damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment, with the solution treatment temperature being 900° C. for 1 hour and the aging treatment temperature being 420° C. for 1 hour.

[0061] The manganese-copper alloy lattice structure obtained according to the above preparation process has a damping ratio of 0.0874 at a frequency of 0.01Hz~10Hz, a lattice structure density of 99.9%, and a manganese element mass fraction of 71.4% in the prepared high-damping manganese-copper alloy lattice structure, which is 1.3‰ compared with the manganese element burnout in the matrix material.

[0062] Comparative Example 1

[0063] This comparative example is a comparative example of Example 1. Compared with Example 1, step 2 of this comparative example does not perform pre-printing processing. Instead, a high-damping manganese-copper alloy lattice structure is prepared directly through a selective laser melting additive manufacturing process characterized by an autonomous partition scanning strategy and multiple layer-by-layer scanning. The other process parameters are exactly the same as those in Example 1, and the base material used in this example is the same as that in Example 1.

[0064] The manganese-copper lattice structure prepared according to the above preparation process failed to be successfully printed. Obvious edge warping occurred near the 15th layer of printing. The scraper torque was too high, causing the printing process to stop, and high-quality forming of the high-damping manganese-copper alloy lattice structure could not be achieved.

[0065] Comparative Example 2

[0066] This comparative example is a comparison of Example 1. Unlike Example 1, step 2 of this comparative example does not utilize an autonomous scanning strategy. Instead, the lattice structure utilizes a conventional stripe scanning strategy, with a stripe width of 2 mm and an interlayer rotation angle of 45°. Other process parameters are identical to those of Example 1, and the substrate material used in this example is the same as in Example 1.

[0067] The manganese-copper alloy lattice structure obtained using the above fabrication process exhibited numerous fractures in the spheres and joints reinforced by the lattice structure, primarily at the edges of the lattice, with a small amount occurring at internal joints. The lattice density was 96.5%. Effective formation of high-damping manganese-copper alloy lattice structures is impossible without the use of an autonomous partitioning scanning strategy.

[0068] Comparative Example 3

[0069] This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example does not use multiple layer-by-layer scanning, and adopts a single scanning method to set the scanning parameters. In this embodiment, the dot matrix structure is scanned once per layer, the printing power per layer is 40W, the scanning speed is 800mm / s, the scanning interval is 90μm, the single layer thickness is 20μm, the scanning angle is 45°, and the volume energy density is 27.7J / mm 3 The other process parameters are exactly the same as those in Example 1.

[0070] The density of the manganese-copper alloy lattice structure obtained by the above preparation process is 94.5%, and obvious holes can be seen on the surface of the lattice structure, and high-quality forming of the high-damping manganese-copper alloy lattice structure cannot be achieved.

[0071] Comparative Example 4

[0072] This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example does not use multiple layer-by-layer scanning, but adopts a single scanning scheme with high energy printing parameters. In this embodiment, the dot matrix structure is scanned once per layer, and the process parameters are increased to 200W compared to Example 1, and the corresponding volume energy density is increased to 138.9J / mm 3 , other process parameters remain consistent, including scanning speed of 800 mm / s, scanning interval of 90 μm, single layer thickness of 20 μm, and scanning angle of 45°.

[0073] Other process parameters are exactly the same as those in Example 1, and the base material used in this example is the same as that in Example 1.

[0074] The manganese-copper alloy lattice structure obtained by the above preparation process produced a large amount of black ash during the printing process. The additive manufacturing equipment alarmed and stopped after printing to 11.4mm. The equipment galvanometer was seriously contaminated, and the additive manufacturing equipment could not print normally. The printed lattice structure rod structure was broken in large numbers, and the center of the reinforced spherical part was warped. The density was 92.5%, and the high-quality forming of the high-damping manganese-copper alloy lattice structure was not achieved. The manganese content of the finished product was 70.1%, and the manganese element burnout was 26.3‰ compared with the base material.

[0075] Comparative Example 5

[0076] This comparative example is a comparative example of Example 1. Compared with Example 1, this comparative example also adopts the layer-by-layer multiple scanning method to set the scanning parameters, but the number of scans is not determined according to the recorded manganese content. In this comparative example, the dot matrix structure is scanned 3 times per layer, the printing power per layer is 40W, the scanning speed is 800mm / s, the scanning interval is 90μm, the single layer thickness is 20μm, the scanning angle is 45°, and the volume energy density is 27.7J / mm 3 The other process parameters are exactly the same as those in Example 1, and the base material used in this example is the same as that in Example 1.

[0077] The manganese-copper alloy lattice structure obtained by the above preparation process has a damping ratio of 0.0534 at frequencies between 0.01Hz and 10Hz, indicating poor damping performance. Furthermore, the density of the obtained manganese-copper lattice structure is 91.4%. The reinforced spheres and connecting rods in the lattice structure have multiple fractures, the reinforced spheres have severe surface bulges, and a small number of obvious holes can be seen on the surface of the lattice structure, failing to achieve high-quality forming of the high-damping manganese-copper alloy lattice structure.

[0078] Comparative Example 6

[0079] This comparative example is a comparative example of Example 3. Compared with Example 3, this comparative example also adopts the layer-by-layer multiple scanning method to set the scanning parameters, but the number of scans is not determined according to the recorded manganese content. In this comparative example, the dot matrix structure is scanned twice per layer, the printing power per layer is 100W, the scanning speed is 1200mm / s, the scanning interval is 120μm, the single layer thickness is 40μm, the scanning angle is 90°, and the volume energy density is 17.3J / mm 3 The other process parameters are exactly the same as those in Example 3, and the base material used in this example is the same as that in Example 3.

[0080] The manganese-copper alloy lattice structure obtained by the above preparation process has a damping ratio of 0.0484 at a frequency of 0.01Hz~10Hz, and a lattice structure density of 90.2%. A large number of unfused defects can be observed on the surface of the lattice structure, and high-quality forming of the high-damping manganese-copper alloy lattice structure cannot be achieved.

[0081] Matters not covered by the present invention are known technologies.

[0082] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A high-damping manganese-copper alloy lattice structure manufactured by additive manufacturing, characterized in that: The lattice structure is formed by expanding a three-dimensional lattice unit cell, and the lattice unit cell is composed of a rod-type structure reinforced by vertices. In a cubic space with a side length of L, every two farthest vertices are connected in pairs to form four connecting rods A, and the vertices of the six surfaces of the cubic space are connected diagonally to form 12 connecting rods B. The center point connected by the four connecting rods A is reinforced by a sphere C, and the vertex connected by every three connecting rods B is reinforced by a 1 / 8 sphere C. The connection between the lattice unit cell rod-type structure and the sphere C is rounded and expanded in the horizontal and vertical directions to obtain a high-damping manganese-based alloy lattice structure; the high-damping manganese-copper alloy lattice structure is at 0 At a frequency of 0.01Hz to 10Hz, the damping ratio is not less than 0.085; the cross-section of the connecting rod A is circular with a circular radius of 1mm to 5mm, the cross-section of the connecting rod B is semicircular with a semicircular radius of 0.5mm to 2.5mm, the radius of the reinforced sphere C is 2mm to 4mm, the length of the side L of the lattice structure cube space is 5mm to 15mm, and the porosity of the expanded high-damping manganese-based alloy lattice structure is 21% to 85%; the fillet treatment means that the connection between the sphere C and the connecting rod A or the sphere C and the connecting rod B needs to be rounded, and the fillet radius is 0.1mm to 2mm.

2. The high-damping manganese-copper alloy lattice structure manufactured by additive manufacturing according to claim 1, characterized in that: The base material is a manganese-copper alloy, which contains the following chemical components by weight: manganese: 71.5% to 81.5%, copper: 11.5% to 22.0%, iron: 1.5% to 2.5%, nickel: 4.4% to 5.1%, sulfur: ≤0.015%, phosphorus: ≤0.02%, silicon: ≤0.08%, carbon: ≤0.1%, oxygen: ≤0.12%, and the remainder is unavoidable impurities.

3. A method for preparing a high-damping manganese-copper alloy lattice structure by additive manufacturing as claimed in any one of claims 1 to 2, characterized in that: The specific steps include: Step 1: Design a high-damping manganese-copper alloy lattice structure using 3D design software, and establish a 3D model of the high-damping manganese-copper alloy lattice structure. The 3D model maintains an angle of 0° to 45° with the forming substrate, and the substrate and the 3D model are connected by supports; Step 2: Slice the three-dimensional model of the high-damping manganese-copper alloy lattice structure established in step 1 using slicing software. After pre-printing the formed substrate, use a laser melting additive manufacturing process to prepare the high-damping manganese-copper alloy lattice structure. The laser melting additive manufacturing process is characterized by autonomous partition scanning and multiple layer-by-layer scanning. Step 3: heat treat the high damping manganese-copper alloy lattice structure obtained in step 2. The heat treatment method is solution treatment plus aging treatment. The solution treatment temperature is 850°C to 930°C, the solution treatment time is 1 hour to 2 hours, the aging treatment temperature is 400°C to 450°C, and the aging treatment time is 1 hour to 4 hours.

4. The method for preparing a high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 3, characterized in that: The pre-printing process described in step 2 refers to scanning and printing on the entire surface of the substrate, with a printing power of 75W to 250W, a scanning speed of 600mm / s to 1000mm / s, a scanning interval of 80μm to 100μm, a single layer thickness of 20μm to 40μm, a scanning angle of 45° to 90°, and a volume energy density of 31.25J / mm 3 ~83.33J / mm 3 ; Total pre-print height 1mm~5mm.

5. The method for preparing a high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 3, characterized in that: The autonomous partitioning scanning strategy described in step 2 is to realize autonomous partitioning of different cross sections of the cross sections of the lattice structure connecting rod A, connecting rod B and sphere C through three-dimensional model split modeling; different scanning strategies are adopted in different areas, among which the scanning strategy for connecting rods A and connecting rods B is strip scanning with a strip width of 2mm to 10mm and an interlayer rotation angle of 0° to 67°, and sphere C adopts a circular scanning strategy.

6. The method for preparing a high-damping manganese-copper alloy lattice structure by additive manufacturing according to claim 3, characterized in that: The layer-by-layer multiple scanning described in step 2 is: when the weight percentage of manganese is not higher than 77.5%, each layer is scanned twice, and when the weight percentage of manganese is higher than 77.5%, each layer is scanned not less than 3 times; the printing power is 40W to 150W, the scanning speed is 600mm / s to 1200mm / s, the scanning interval is 90μm to 120μm, the single layer thickness is 20μm to 40μm, the scanning angle is 45° to 90°, and the volume energy density is 17.3J / mm 3 ~83.3J / mm 3 .

7. An application of an additively manufactured high-damping manganese-copper alloy lattice structure, using the additively manufactured high-damping manganese-copper alloy lattice structure according to claim 1, characterized in that: The high-damping manganese-copper alloy lattice structure is used in vibration and noise reduction functional components in the fields of aviation, aerospace, and shipbuilding.

Images