Method for increasing content and uniformity of micro powder in superhard material electroplated product

Abstract

The invention discloses a method for increasing the content and uniformity of micro powder in a superhard material electroplated product. The method comprises the following steps: S1, cleaning the surface of the superhard material micro powder until the superhard material micro powder can be infiltrated with water; s2, soaking the superhard material micro powder by using a cationic surfactant, and stirring and wetting by using a magnetic stirrer; s3, performing ultrasonic dispersion, and uniformly stirring by using magnetic force to obtain superhard material micro powder with positive ions on the surface; s4, standing, and pouring out part of liquid on the upper layer; s5, pouring the residual liquid and the superhard material micro powder into a prepared plating solution for normal electroplating production; after the superhard material micro powder treated by the method is put into a plating solution, in the electroplating process, the superhard material micro powder can be accelerated to settle towards the metal surface, is not easy to agglomerate and can form a uniform and compact composite coating with nickel, the content of the superhard material micro powder can be increased from 70% to 130%, the service life of a superhard material electroplating product can be obviously prolonged, the sand accumulation phenomenon in the product is avoided, and the product quality is improved. And the surface quality of the processed superhard material electroplated product is obviously improved.

Description

Technical Field

[0001] The invention belongs to the technical field of micropowder processing of superhard material electroplating products, and in particular relates to a method for increasing the micropowder content and uniformity in superhard material electroplating products. Background Art

[0002] Superhard material electroplating products refer to a type of tool formed by consolidating superhard materials on a metal matrix with a certain shape through metal electrodeposition. It has the characteristics of simple process and high concentration of superhard materials. For superhard materials with powder diameters greater than 20μm, due to their large specific gravity (density between 1.7-1.76g / cm 3 ), the shape is relatively regular, not easy to agglomerate, and can quickly and naturally settle to the metal substrate in the plating solution to achieve co-deposition with nickel. The superhard material can be evenly and highly concentrated in the plating layer, but for superhard materials with a powder diameter of ≤20μm, since they are all crushed from coarse-grained superhard materials, they have irregular shapes, generally in the form of needles and flakes, with a large surface area, and particles are easily adsorbed and agglomerated. Although the specific gravity is still large in the plating solution, the surface area is large and the buoyancy is doubled, making the superhard material suspended in the plating solution, and not easy to settle to the metal substrate to achieve co-deposition with nickel, resulting in sparse density of superhard materials and uneven particle agglomeration in superhard material electroplating products.

[0003] In order to increase the concentration of micropowder and improve the uniformity of superhard material electroplating products, we must find a way to charge the surface of the superhard material. Due to the repulsion of like charges, when the adsorption force between particles is less than the repulsive force, it is not easy for superhard material particles to agglomerate. The production process of electroplating products is an electrodeposition process, that is, the charging and discharging process between positive and negative ions, that is, the migration process of anions and cations. The metal substrate of the electroplated product serves as the cathode during the electroplating process, and its surface is negatively charged. When the surface of the superhard material is positively charged, due to the attraction of opposite charges, the superhard material micropowder with the positive charge on the surface is accelerated to deposit on the metal substrate and co-deposit with nickel, thereby obtaining an electroplated product with a high concentration and uniform distribution of superhard materials. Based on the above content, the present invention proposes a method for increasing the micropowder content and uniformity in superhard material electroplating products. Summary of the invention

[0004] The object of the present invention is to provide a method for increasing the content and uniformity of micropowder in superhard material electroplating products, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: A method for increasing the content and uniformity of micropowder in superhard material electroplating products, specifically comprising: S1: cleaning the surface of superhard material micropowder until it can be wetted with water;

[0006] S2: Then soak the superhard material micropowder with a cationic surfactant and stir it with a magnetic stirrer to wet it;

[0007] S3: Then perform ultrasonic dispersion and then stir evenly with a magnetic stirrer for 5 - 30 minutes to obtain superhard material micropowder with a cationic surface;

[0008] S4: Let it stand for 1 hour and pour out the upper part of the liquid;

[0009] S5: Pour the remaining liquid together with the superhard material micropowder into the pre - prepared plating solution to start normal production.

[0010] Preferably, in S1, the surface treatment of the superhard material micropowder can be any one of sodium hydroxide solution, hydrochloric acid solution, nitric acid solution, and sulfuric acid solution.

[0011] Preferably, in S2, the concentration of the cationic surfactant is 5 - 65%.

[0012] Preferably, the cationic surfactant is at least one selected from poly(diallyldimethylammonium chloride), cetyltrimethylammonium chloride, cetyltrimethylammonium bromide, dodecyltrimethylammonium bromide, and dodecyltrimethylammonium chloride.

[0013] Preferably, in S3, the frequency of ultrasonic dispersion is 0.5 - 24 kHz and the time is 5 - 25 minutes.

[0014] Preferably, in S2, stir with a magnetic stirrer for 5 - 30 minutes.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] After the superhard material micropowder treated by the technical method of the present invention is put into the plating solution, during the electroplating process, it can accelerate the sedimentation towards the metal surface, is not easy to agglomerate, and can form a uniform and dense composite coating with nickel. The content of the superhard material micropowder can be increased from 70% to 130%, which can significantly improve the service life of the electroplated products of the superhard material. At the same time, since the superhard material micropowder is not easy to agglomerate after treatment, the phenomenon of sand accumulation in the products is avoided, and the surface quality of the products processed by electroplating the superhard material can be significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a flow schematic diagram of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Example 1

[0020] See also Figure 1 The present invention provides a technical solution: a method for increasing the content and uniformity of micropowder in superhard material electroplating products, specifically comprising: S1: cleaning the surface of superhard material micropowder until it can be wetted with water; in this embodiment, preferably, in S1, the surface treatment of superhard material micropowder can be selected from any one of sodium hydroxide solution, hydrochloric acid solution, nitric acid solution, and sulfuric acid solution.

[0021] S2: Then soak the superhard material powder with a cationic surfactant, and stir and wet it with a magnetic stirrer for 5 minutes; in this embodiment, preferably, in S2, the concentration of the cationic surfactant is 5%;

[0022] In this embodiment, preferably, the cationic surfactant is at least one selected from polydiallyldimethylammonium chloride, hexadecyltrimethylammonium chloride, hexadecyltrimethylammonium bromide, dodecyltrimethylammonium bromide, and dodecyltrimethylammonium chloride.

[0023] S3: Then ultrasonic dispersion is performed. In this embodiment, preferably, in S3, the frequency of ultrasonic dispersion is 0.5 kHz and the time is 5 minutes. Then magnetic stirring is performed for 5 minutes to obtain a superhard material powder with cations on the surface.

[0024] S4: Let stand for 1 hour and pour out the upper liquid;

[0025] S5: Pour the remaining liquid together with the superhard material powder into the prepared plating solution to carry out normal electroplating production. Since the metal substrate of the electroplated product acts as a cathode during the electroplating process, its surface carries a negative charge. When the surface of the superhard material is positively charged, the superhard material powder with a positive charge on the surface is accelerated to deposit on the metal substrate due to the attraction of opposite charges, and co-deposition with nickel is achieved, thereby obtaining an electroplated product with a high concentration and uniform distribution of superhard material.

[0026] Example 2

[0027] See also Figure 1 The present invention provides a technical solution: a method for increasing the content and uniformity of micropowder in superhard material electroplating products, specifically comprising: S1: cleaning the surface of superhard material micropowder until it can be wetted with water;

[0028] S2: Then soak the superhard material micropowder with a cationic surfactant and stir with a magnetic stirrer to wet it;

[0029] S3: Then disperse it ultrasonically and then stir evenly with a magnetic stirrer for 30 minutes to obtain superhard material micropowder with a cationic surface;

[0030] S4: Let it stand for 1 hour and pour out the upper part of the liquid;

[0031] S5: Pour the remaining liquid together with the superhard material micropowder into the pre-prepared plating solution to start normal production.

[0032] In this embodiment, preferably, in S1, the surface treatment of the superhard material micropowder can select any one of sodium hydroxide solution, hydrochloric acid solution, nitric acid solution, and sulfuric acid solution.

[0033] In this embodiment, preferably, in S2, the concentration of the cationic surfactant is 65%.

[0034] In this embodiment, preferably, the cationic surfactant is at least one selected from polydiallyldimethylammonium chloride, cetyltrimethylammonium chloride, cetyltrimethylammonium bromide, dodecyltrimethylammonium bromide, and dodecyltrimethylammonium chloride.

[0035] In this embodiment, preferably, in S3, the frequency of ultrasonic dispersion is 24 kHz and the time is 25 minutes.

[0036] In this embodiment, preferably, in S2, stir with a magnetic stirrer for 30 minutes.

[0037] Although the embodiments of the present invention have been shown and described, see the above detailed description. For those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for increasing the content and uniformity of micropowder in superhard material electroplating products, characterized in that: Specifically include: S1: clean the surface of the superhard material powder until it can be wetted with water; S2: Then, the superhard material powder is soaked with a cationic surfactant and stirred and wetted with a magnetic stirrer; S3: Then ultrasonically disperse and then use magnetic stirring for 5-30 minutes to obtain superhard material powder with cations on the surface; S4: Let stand for 1 hour and pour out the upper liquid; S5: Pour the remaining liquid together with the superhard material powder into the prepared plating solution and resume normal production.

2. A method for increasing the content and uniformity of micropowder in superhard material electroplating products according to claim 1, characterized in that: In S1, the surface treatment of the superhard material powder can be carried out using any one of sodium hydroxide solution, hydrochloric acid solution, nitric acid solution and sulfuric acid solution.

3. A method for increasing the content and uniformity of micropowder in superhard material electroplating products according to claim 1, characterized in that: In the S2, the concentration of the cationic surfactant is 5-65%.

4. A method for increasing the content and uniformity of micropowder in superhard material electroplating products according to claim 3, characterized in that: The cationic surfactant is at least one selected from polydiallyldimethylammonium chloride, hexadecyltrimethylammonium chloride, hexadecyltrimethylammonium bromide, dodecyltrimethylammonium bromide and dodecyltrimethylammonium chloride.

5. The method for increasing the content and uniformity of micropowder in superhard material electroplating products according to claim 1, characterized in that: In S3, the frequency of ultrasonic dispersion is 0.5-24 kHz, and the time is 5-25 minutes.

6. The method for increasing the content and uniformity of micropowder in superhard material electroplating products according to claim 1, characterized in that: In S2, a magnetic stirrer is used to stir for 5-30 minutes.

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