Dynamic electroplating process and device for deep groove ball bearing ring

Abstract

The invention discloses a dynamic electroplating process and device for a deep groove ball bearing ring, and relates to the technical field of bearing machining and electroplating. The rotary driving mechanism drives the electroplating hanging frames to rotate in the electroplating pool, electrolyte in the electroplating pool is continuously stirred, the ion concentration distribution of the electrolyte is more uniform, in addition, the voltage is changed according to the included angle between the electroplating hanging frames on the two sides and the reference line by dynamically adjusting the real-time voltage intensity of the anode, and the electroplating precision is improved. And when the distance between the electroplating hanger and the anode plate at the side position is maximum and the voltage attenuation is maximum, the maximum voltage intensity is provided, and the electroplating intensity is ensured. The high-concentration electrolyte close to the anode area is conducted to the low-concentration area between the middle electroplating hanging frame and the side electroplating hanging frame through the liquid flow pump, and the concentration of the electrolyte is balanced. By optimizing the voltage and the electrolyte concentration, it is guaranteed that the voltages borne by all parts of the bearing ring are relatively balanced, an electroplated layer is more uniform, and the abrasion resistance, corrosion resistance and other performance of the electroplated bearing ring are improved.

Description

Technical Field

[0001] The present invention relates to the technical fields of bearing processing and electroplating technology, and particularly relates to a dynamic electroplating process and device for deep groove ball bearing rings. Background Art

[0002] When the electroplating process is applied to the processing of deep groove ball bearing rings, the characteristics of the electrolyte will have a significant impact on the electroplating effect. The electrolyte itself has resistance. According to Ohm's law, when current passes through, a voltage drop will occur across the resistance. During the electroplating process, in the current path from the anode to the cathode, the resistance of the electrolyte causes the voltage to gradually decrease along with the current path.

[0003] In the electrolyte, ion migration is the main way of current conduction. When ions migrate, they will frequently collide and interact with solvent molecules and other ions. This process is similar to the hindrance of current by multiple resistors in an electric circuit, greatly reducing the ion migration efficiency and further exacerbating the voltage attenuation. Moreover, as the current path continues to extend, this hindrance effect will continue to accumulate, resulting in more serious voltage loss. When the electrolyte concentration is low, the number of ions is relatively small, the interaction between ions is weak, but the hindrance of ions by solvent molecules is relatively large, which increases the resistance of the electrolyte and further exacerbates the voltage attenuation.

[0004] In addition, the electroplating process is a process that continuously consumes ions in the electrolyte. As electroplating progresses, ions are continuously consumed. If the uniform fluidity of the electrolyte cannot be ensured, it will lead to uneven distribution of ions in the electrolyte. In the area with a higher ion concentration, the electroplating speed is relatively fast; while in the area with a lower ion concentration, the electroplating speed will slow down, and even incomplete electroplating may occur. This series of problems will ultimately lead to inconsistent voltages received by different parts of the bearing ring, thereby affecting the uniformity and quality of the electroplated layer, making it difficult for the electroplated bearing ring to reach an ideal state in terms of wear resistance, corrosion resistance and other properties, and reducing the final quality and service life of the product. Summary of the Invention

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention provides a dynamic electroplating process for deep groove ball bearing rings, including the following:

[0007] S1. Three electroplating racks full of bearing rings are vertically placed into the electroplating bath. When the electroplating racks are placed into the electroplating bath, the initial phase angles of the electroplating rack in the middle position and the electroplating racks in the two side positions differ by 90°.

[0008] S2. The anodes on both sides of the electroplating bath are electrified, and the rotation driving mechanism drives the electroplating rack to rotate. The electroplating racks at both positions rotate while maintaining a parallel state, and the electroplating rack at the middle position rotates with a 90° phase difference from the electroplating racks at both positions.

[0009] S3. Taking the vertical connection line between the two anodes as the reference line, let the angle between the electroplating racks at both positions and the reference line be , then the real-time voltage intensity of the anode is .

[0010] Among them, is the dynamically preset reference voltage of the system, is the preset minimum voltage of the system.

[0011] S4. The electrolyte near the anode area is conducted to the area between the electroplating rack at the middle position and the adjacent side electroplating rack through a liquid flow pump to ensure the electrolyte concentration in the area between the electroplating rack at the middle position and the adjacent side electroplating rack.

[0012] Among them, during the rotation of the three electroplating racks, let the maximum distance between the side end of the electroplating rack at the middle position and the side end of the adjacent side electroplating rack be , then when the real-time distance between the side end of the electroplating rack at the middle position and the side end of the adjacent side electroplating rack is , the power of the liquid flow pump for liquid supply is , among which, is the preset maximum liquid supply power of the liquid flow pump of the system.

[0013] As a preferred technical solution of the electroplating process of the present invention: the electrolyte in the electroplating bath contains zinc ions, nickel ions or chromium ions, and the temperature of the electrolyte is controlled between 25 and 40 °C.

[0014] As a preferred technical solution of the electroplating process of the present invention: during electroplating, the composition of the electrolyte in the electroplating bath is detected every 30 to 60 minutes, and the corresponding metal ions are supplemented according to the detection results to maintain the stability of the metal ion concentration in the electrolyte.

[0015] The present invention provides a dynamic electroplating device for deep groove ball bearing rings, including an electroplating bath, with an anode plate configured on each side of the electroplating bath. Inside the electroplating bath, three electroplating hanging racks are vertically placed, and a plurality of evenly distributed bearing rings are hung on both sides of the electroplating hanging racks. Above the electroplating hanging racks, a rotation driving mechanism is configured to drive the electroplating hanging racks to rotate. The rotation driving mechanism drives the electroplating hanging racks to rotate to form a circular electroplating area, and there is no interference between adjacent electroplating areas. An electrolyte confluence area is formed between the side ends of adjacent electroplating hanging racks. The electroplating bath is equipped with a plurality of liquid flow pumps, and the electroplating bath is equipped with a suction port connected to the area near the anode plate. The suction port is connected to the suction end of the liquid flow pump through a diversion pipe, and the liquid flow pump is equipped with an injection port facing the electrolyte confluence area.

[0016] As a preferred technical solution of the electroplating device of the present invention: the voltage intensities of the two anode plates are the same in real time, and a plurality of anode electrode columns vertically protruding from the surface of the anode plate are evenly configured on the side of the anode plate facing the electroplating bath, and the voltages carried by each anode electrode column are the same.

[0017] As a preferred technical solution of the electroplating device of the present invention: a plurality of evenly distributed hooks are arranged on the vertical surfaces on both sides of the electroplating hanging rack, and the bearing rings are hung at the hook positions.

[0018] As a preferred technical solution of the electroplating device of the present invention: a plurality of rotation driving mechanisms are jointly connected to the output structure of the same power device. A metal rotating shaft is provided at the center position of the top of the electroplating hanging rack, and a cathode brush mechanism is in frictional contact with the side of the metal rotating shaft. The cathode brush mechanism has the opposite electrode to the anode plate.

[0019] As a preferred technical solution of the electroplating device of the present invention: a temperature sensor for real-time monitoring of the real-time temperature of the electrolyte and a heating mechanism for heating the electrolyte are arranged inside the electroplating bath.

[0020] Compared with the existing technology, the beneficial effects of the present invention are:

[0021] 1. In the present invention, the rotation driving mechanism drives the electroplating hanging rack to rotate in the electroplating bath, continuously agitating the electrolyte in the electroplating bath, making the ion concentration distribution of the electrolyte more uniform. In addition, by dynamically adjusting the real-time voltage intensity of the anode, the voltage is changed according to the angle between the electroplating hanging rack on both sides and the reference line. When the distance between the electroplating hanging rack on the side and the anode plate is the largest and the voltage attenuation is the largest, the maximum voltage intensity is provided to ensure the electroplating intensity, effectively solving the adverse effect of voltage attenuation on the electroplating effect.

[0022] 2. The present invention uses a liquid flow pump to conduct the high-concentration electrolyte in the area near the anode to the low-concentration area between the middle and side electroplating hanging racks to balance the electrolyte concentration. And the liquid supply power of the liquid flow pump is adjusted according to the real-time distance between the side ends of the middle and side electroplating hanging racks to achieve precise liquid supply, ensuring efficient and high-quality electroplating in each area.

[0023] 3. By optimizing the voltage and electrolyte concentration, the present invention ensures that the voltages received by various parts of the bearing ring are relatively balanced, making the electroplated layer more uniform. This improves the wear resistance, corrosion resistance and other properties of the electroplated bearing ring, extends the service life of the product, and enhances the final quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a top view structural schematic diagram of the electroplating device of the present invention.

[0025] Figure 2 It is a top view structural schematic diagram when the electroplating hanger at the side position in the electroplating device of the present invention is parallel to the anode plate.

[0026] Figure 3 It is a top view structural schematic diagram when the electroplating hanger at the side position in the electroplating device of the present invention is perpendicular to the anode plate.

[0027] Figure 4 It is a top view structural schematic diagram when the electroplating hanger at the side position in the electroplating device of the present invention is inclined relative to the anode plate.

[0028] Figure 5 It is a specific structural schematic diagram of the electroplating hanger in the electroplating device of the present invention.

[0029] Among them: 1 - electroplating bath, 101 - electroplating area; 2 - anode plate, 201 - anode electrode column; 3 - electroplating hanger, 301 - hook; 4 - rotation driving mechanism; 5 - bearing ring; 6 - liquid flow pump; 7 - suction port; 8 - diversion pipe; 9 - injection port; 10 - electrolyte confluence area. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0031] Embodiment 1. Please refer to Figure 1 , the present invention designs a dynamic electroplating device for deep groove ball bearing rings, including structures such as an electroplating bath 1, an anode plate 2, an electroplating hanger 3, a rotation driving mechanism 4, a liquid flow pump 6, etc. The specific structural content is as follows:

[0032] Electroplating bath 1: Please refer to Figure 1 , the electroplating bath 1 is the container where the entire electroplating process takes place, and houses components such as the electrolyte and the electroplating hanger 3. A temperature sensor for real-time monitoring of the real-time temperature of the electrolyte and a heating mechanism for heating the electrolyte are provided inside the electroplating bath 1, which can control the electrolyte temperature within a suitable range to ensure the stability of the electroplating reaction.

[0033] Electroplating area 101: Please refer to Figure 2 , which is formed by driving the electroplating hanger 3 to rotate by the rotation driving mechanism 4. The adjacent electroplating areas 101 do not interfere with each other, ensuring that the bearing rings 5 on each electroplating hanger 3 are electroplated in independent areas to avoid mutual interference.

[0034] Anode plate 2: Please refer to Figure 1 , Figure 2 , and an anode plate 2 is arranged on both sides of the electroplating bath 1. The voltage intensities of the two anode plates 2 are the same in real time. A plurality of anode electrode columns 201 that protrude vertically from the surface of the anode plate 2 are evenly arranged on the side of the anode plate 2 facing the electroplating bath 1, and the voltages carried by the respective anode electrode columns 201 are the same. The anode plate 2 provides the anode for the electroplating process, and the anode electrode columns 201 increase the contact area between the anode and the electrolyte, making the current distribution more uniform and improving the electroplating efficiency and quality.

[0035] Electroplating hanger 3: Please refer to Figure 1 , Figure 2 , and three electroplating hangers 3 are vertically placed in the electroplating bath 1. A plurality of evenly distributed hooks 301 are arranged on the vertical surfaces on both sides of the electroplating hanger 3. The bearing rings 5 are hung at the positions of the hooks 301, which is convenient for fixing the bearing rings 5 for electroplating. A metal rotating shaft is provided at the center position of the top of the electroplating hanger 3, and a cathode brush mechanism is in frictional contact with the side of the metal rotating shaft. The cathode brush mechanism has the opposite electrode to the anode plate 2 and is used to conduct current so that the bearing rings 5 act as cathodes for electroplating reactions.

[0036] Rotation driving mechanism 4: Please refer to Figure 2 , Figure 3 , and a rotation driving mechanism 4 is arranged on the upper side of the electroplating hanger 3. A plurality of rotation driving mechanisms 4 are jointly connected to the output structure of the same power device to drive the electroplating hanger 3 to rotate to form a circular electroplating area 101, and the adjacent electroplating areas 101 do not interfere with each other. The rotation driving mechanism 4 realizes the rotation of the electroplating hanger 3, stirs the electrolyte, promotes the uniform distribution of ions, and at the same time ensures that the bearing rings 5 on each electroplating hanger 3 are electroplated at different positions (during the rotation process, the positions of the bearing rings 5 in the electroplating bath 1 also change, avoiding the problems of abnormal electroplating voltage or ion concentration when in a fixed position), improving the uniformity of electroplating.

[0037] Bearing ring 5: Please refer to Figure 1 , which is hung on the hooks 301 on both sides of the electroplating hanger 3 and serves as the object of electroplating. A plating layer is formed on the surface during the electroplating process to improve its wear resistance, corrosion resistance and other properties.

[0038] Liquid flow pump 6: Please refer to Figure 1 and Figure 2 . The electroplating bath 1 is equipped with multiple liquid flow pumps 6. An electrolyte confluence area 10 is formed between the side ends of adjacent electroplating racks 3. The electroplating bath 1 is equipped with a suction port 7 connected to the area near the anode plate 2. The suction port 7 is connected to the suction end of the liquid flow pump 6 through a diversion pipe 8. The liquid flow pump 6 is equipped with an injection port 9 facing the electrolyte confluence area 10. The liquid flow pump 6 conducts the high-concentration electrolyte near the anode area to the low-concentration area between the middle and side electroplating racks 3 to balance the electrolyte concentration (when the electrolyte ion concentration reaches the standard, the voltage attenuation degree is relatively small. Coupled with the qualified electrolyte ion concentration, the bearing rings 5 on the middle electroplating rack 3 can also be electroplated more efficiently), and adjusts the liquid supply power according to the real-time distance between the side ends of the middle and side electroplating racks 3 to ensure efficient and high-quality electroplating in each area.

[0039] Suction port 7: Please refer to Figure 1 and Figure 2 . It is connected to the area near the anode plate 2 of the electroplating bath 1 and is used to suck the high-concentration electrolyte near the anode plate 2 to provide the electrolyte source for the liquid flow pump 6 so as to transport it to the area where the electrolyte concentration needs to be replenished.

[0040] Diversion pipe 8: Please refer to Figure 1 and Figure 2 and Figure 4 . It connects the suction port 7 and the suction end of the liquid flow pump 6 to guide the electrolyte to flow from the suction port 7 to the liquid flow pump 6. The diversion pipe 8 is set in an external form. One is to supply electroplating ions to the low-concentration electrolyte area 10; the other is to avoid electroplating absorption from the inside of the electroplating bath 1 through the bearing rings 5 mounted on the side electroplating rack 3. In this way, it is impossible to efficiently supplement ions to the charging electrolyte area 10, and it will also cause a large difference in the electroplating conditions of the bearing rings 5 on the side electroplating rack 3 and the middle electroplating rack 3, which is not conducive to the normal operation of the electroplating process.

[0041] Injection port 9: Please refer to Figure 1 and Figure 2 and Figure 4 . It is connected to the liquid outlet end of the liquid flow pump 6 and faces the electrolyte confluence area 10 to inject the high-concentration electrolyte extracted by the liquid flow pump 6 into the electrolyte confluence area 10 between the middle electroplating rack 3 and the adjacent side electroplating rack 3 to achieve the balance of the electrolyte concentration.

[0042] Electrolyte confluence area 10: Please refer to Figure 4, formed between the side ends of adjacent electroplating racks 3, is an area where the electrolyte concentration is likely to decrease. A liquid flow pump 6 is required to extract and inject high-concentration electrolyte near the area with relatively fewer consumed ions to ensure the efficient and high-quality electroplating of the bearing rings 5 on both sides of the electrolyte intersection area 10.

[0043] Embodiment 2: The present invention designs a dynamic electroplating process for deep groove ball bearing rings, which is characterized by including the following contents:

[0044] First, in combination with Figure 1 , three electroplating racks 3 full of bearing rings 5 are vertically placed into the electroplating bath 1. When the electroplating rack 3 is placed into the electroplating bath 1, the initial phase angle of the middle electroplating rack 3 is 90° different from the initial phase angles of the electroplating racks 3 on both sides. Among them, the electrolyte in the electroplating bath 1 contains zinc ions, nickel ions or chromium ions, and the electrolyte temperature is controlled between 25 and 40 °C. During electroplating, the composition of the electrolyte in the electroplating bath 1 is detected every 30 to 60 minutes, and the corresponding metal ions are supplemented according to the detection results to maintain the stable concentration of metal ions in the electrolyte.

[0045] Second, in combination with Figure 2 , Figure 3 , the anodes on both sides of the electroplating bath 1 are energized, and the rotation drive mechanism 4 drives the electroplating rack 3 to rotate. The electroplating racks 3 on both sides rotate while maintaining a parallel state, and the middle electroplating rack 3 rotates with a 90° phase difference from the electroplating racks 3 on both sides, so as to reduce the direct shielding of the electroplating rack 3 at the side position on the middle electroplating rack 3.

[0046] Third, in combination with Figure 4 , Figure 5 , taking the vertical connection line between the two anodes as the reference line, let the included angle between the electroplating racks 3 on both sides and the reference line be , then the real-time anode voltage intensity is .

[0047] Among them, is the system-predefined dynamic reference voltage, is the system-predefined minimum voltage. When , , that is, the real-time anode voltage intensity reaches the maximum value; when , , that is, the real-time anode voltage intensity reaches the minimum value. is a reference value used to adjust the magnitude of the real-time anode voltage intensity . When When the bearing ring 5 on the side facing the anode of the side-position electroplating hanger 3 is parallel to the anode plate 2, it is equivalent to the shortest distance between the side-position electroplating hanger 3 and the anode plate 2 reaching the maximum. After passing through the electrolyte along the longest path, the voltage attenuation also reaches the maximum, while the voltage intensity reaches the maximum, which can ensure the electroplating intensity to the greatest extent.

[0048] Fourth, the liquid flow pump 6 is used to conduct the electrolyte in the area close to the anode to the area between the middle-position electroplating hanger 3 and the adjacent side-position electroplating hanger 3 to ensure the electrolyte concentration in the area between the middle-position electroplating hanger 3 and the adjacent side-position electroplating hanger 3.

[0049] During the rotation of the three electroplating hangers 3, combined with Figure 4 , let the maximum distance between the side end of the middle-position electroplating hanger 3 and the side end of the adjacent side-position electroplating hanger 3 be , then the real-time distance between the side end of the middle-position electroplating hanger 3 and the side end of the adjacent side-position electroplating hanger 3 is When, the power of the liquid flow pump for liquid supply is , where is the maximum liquid supply power of the liquid flow pump preset by the system.

[0050] The electrolyte in the area between the middle-position electroplating hanger 3 and the adjacent side-position electroplating hanger 3 needs to supply metal ions to both the middle-position electroplating hanger 3 side and the side-position electroplating hanger 3 side at the same time, resulting in a rapid decrease in the electrolyte concentration in this area, which is not conducive to efficient and high-quality electroplating on both sides of this area. The electrolyte close to the anode only provides metal ions to the bearing ring 5 on the electroplating hanger 3 facing the anode side, with a relatively high concentration. The high-concentration electrolyte is conducted to the low-concentration electrolyte area in real time to balance the electrolyte concentration in each area of the electroplating bath and ensure the electroplating quality.

[0051] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A dynamic electroplating process for deep groove ball bearing rings, characterized in that: Includes the following: S1. Three fully loaded plating racks of bearing rings are placed vertically in the plating tank. When the plating racks are placed in the plating tank, the initial phase angle of the plating rack in the middle position differs by 90° from the initial phase angle of the plating racks on both sides; S2. The anodes on both sides of the electroplating tank are energized, and the rotating drive mechanism drives the electroplating rack to rotate. The electroplating racks on both sides rotate in parallel, and the electroplating racks in the middle position rotate with a 90° phase difference from the electroplating racks on both sides; S3. Take the vertical line between the two anodes as the reference line, and set the angle between the electroplating racks on both sides and the reference line to be , then the real-time voltage intensity of the anode is ; in, Dynamic reference voltage preset for the system, The minimum voltage preset for the system; S4. The electrolyte near the anode area is transferred to the area between the middle position electroplating rack and the adjacent side position electroplating rack by a liquid flow pump to ensure the electrolyte concentration in the area between the middle position electroplating rack and the adjacent side position electroplating rack; During the rotation of the three electroplating racks, the maximum distance between the side end of the electroplating rack at the middle position and the side end of the electroplating rack at the adjacent side position is , then the real-time distance between the side end of the electroplating rack at the middle position and the side end of the electroplating rack at the adjacent side position is When the power of the liquid pump to supply liquid is ,in, The maximum liquid supply power of the liquid flow pump preset for the system.

2. A deep groove ball bearing ring dynamic electroplating process according to claim 1, characterized in that: The electrolyte in the electroplating cell contains zinc ions, nickel ions or chromium ions, and the electrolyte temperature is controlled between 25 and 40°C.

3. A deep groove ball bearing ring dynamic electroplating process according to claim 1, characterized in that: During the electroplating process, the composition of the electrolyte in the electroplating bath is tested every 30 to 60 minutes, and corresponding metal ions are added based on the test results to maintain a stable concentration of metal ions in the electrolyte.

4. An electroplating device for implementing the dynamic electroplating process of deep groove ball bearing rings in claim 1, characterized in that: It comprises an electroplating cell (1), wherein both sides of the electroplating cell (1) are provided with an anode plate (2); The electroplating pool (1) is provided with three electroplating racks (3) vertically placed therein, and a plurality of evenly distributed bearing rings (5) are mounted on both sides of the electroplating racks (3); A rotating drive mechanism (4) is arranged on the upper side of the electroplating rack (3) for driving the electroplating rack (3) to rotate; The rotary drive mechanism (4) drives the electroplating rack (3) to rotate to form a circular electroplating area (101), and adjacent electroplating areas (101) do not interfere with each other; An electrolyte intersection area (10) is formed between the side ends of adjacent electroplating racks (3), the electroplating cell (1) is provided with a plurality of liquid flow pumps (6), the electroplating cell (1) is provided with a suction port (7) connected to an area near the anode plate (2), the suction port (7) is connected to a suction end of the liquid flow pump (6) via a flow guide tube (8), and the liquid flow pump (6) is provided with an injection port (9) facing the electrolyte intersection area (10).

5. The electroplating device according to claim 4, characterized in that: The real-time voltage intensity of the two anode plates (2) is the same; a plurality of anode electrode columns (201) vertically protruding from the surface of the anode plate (2) are evenly arranged on one side of the anode plate (2) facing the electroplating tank (1); and each anode electrode column (201) carries the same voltage.

6. The electroplating device according to claim 4, characterized in that: A plurality of evenly distributed hooks (301) are provided on the vertical surfaces on both sides of the electroplating rack (3), and the bearing ring (5) is hung at the positions of the hooks (301).

7. The electroplating device according to claim 4, characterized in that: A plurality of rotary drive mechanisms (4) are commonly connected to the output structure of the same power device. A metal shaft is provided at the center of the top of the electroplating rack (3). A cathode brush mechanism is frictionally contacted on the ring side of the metal shaft. The cathode brush mechanism has an electrode opposite to that of the anode plate (2).

8. The electroplating device according to claim 4, characterized in that: The electroplating cell (1) is provided with a temperature sensor for real-time monitoring of the real-time temperature of the electrolyte and a heating mechanism for heating the electrolyte.

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