An on-board temperature test automatic device for a quartz crystal oscillator

Abstract

The present invention relates to the technical field of automatic detection of oscillators, and proposes an on-board temperature test automatic device for a quartz crystal oscillator, including a positioning frame, which is rotatably arranged, and the positioning groove penetrates up and down, and the positioning groove is used to accommodate the oscillator body; a flipping disk, which is rotatably arranged, and the flipping disk and the positioning frame are arranged to move relative to each other along the axial direction; a lower tray, which is arranged on the flipping disk, and the lower tray has a lower supporting block and a lower through hole that are opposite to the position of the positioning groove, and the lower supporting block and the lower through hole are arranged at intervals in the axial direction of the flipping disk; an upper cover plate, which is arranged above the lower tray, and the upper cover plate has an upper supporting block and an upper through hole that are opposite to the position of the positioning groove, the upper through hole is arranged opposite to the lower supporting block up and down, the upper supporting block is arranged opposite to the lower through hole up and down, and the oscillator body is placed in the positioning groove after passing through the upper through hole or the lower through hole. Through the above technical solution, the problem that the existing flipping mechanism or feeding structure of the testing machine cannot stably flip the crystal oscillator is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic detection of oscillators, and particularly to an automatic on-board temperature testing device for quartz crystal oscillators. Background Art

[0002] Currently, with the development of product miniaturization, higher requirements are placed on the temperature parameters of products. The number of oscillator temperature measurements is increasing. Originally, only random sampling of the same batch of products was sent for temperature testing, and the number of samples was very small. Now, the production of automotive-grade products has increased explosively, and more and more high and low temperature tests at various temperatures are required. The production capacity of manual placement and loading can no longer meet the production needs.

[0003] During testing, the crystal oscillator needs to be placed in a dedicated test socket to detect its various parameters. The pins of the crystal oscillator need to correspond one by one and be uniquely electrically connected to the test probes of the test socket. Therefore, during the automated detection process, it is necessary to identify the front and back of the crystal oscillator and quickly flip the crystal oscillator placed on the reverse side. The existing test machine flipping mechanism or feeding structure cannot stably flip the crystal oscillator. Summary of the Invention

[0004] The technical problem to be solved by the present invention is, in view of the above-mentioned technical deficiencies, to provide an automatic on-board temperature testing device for quartz crystal oscillators, which solves the problem that the existing test machine flipping mechanism or feeding structure cannot stably flip the crystal oscillator.

[0005] The technical solution adopted by the present invention is: to provide an automatic on-board temperature testing device for quartz crystal oscillators, including:

[0006] A positioning frame, rotatably arranged, having a positioning groove that penetrates up and down, and the positioning groove is used to accommodate the oscillator body.

[0007] A flipping disk, rotatably arranged, the positioning frame is located on the axis of the flipping disk, and the flipping disk and the positioning frame are arranged to move relative to each other along the axis direction.

[0008] A lower tray, arranged on the flipping disk, the lower tray has a lower supporting block and a lower through hole that are opposite to the position of the positioning groove, and the lower supporting block and the lower through hole are arranged at intervals in the axis direction of the flipping disk.

[0009] An upper cover plate, arranged above the lower tray, the upper cover plate has an upper supporting block and an upper through hole that are opposite to the position of the positioning groove, the upper through hole is arranged opposite to the lower supporting block up and down, the upper supporting block is arranged opposite to the lower through hole up and down, and the oscillator body passes through the upper through hole or the lower through hole and is placed in the positioning groove. In the vertical direction, the oscillator body is located between the lower supporting block and the upper supporting block.

[0010] To further optimize this technical solution, a guiding hole is provided in the middle of the flipping disk, and the guiding hole is slidably sleeved outside the positioning frame, and the positioning frame drives the flipping disk to rotate; further comprising:

[0011] A flipping driving unit for driving the positioning frame to rotate;

[0012] A workbench, and the flipping driving unit is arranged on the workbench;

[0013] A reciprocating driving unit is arranged on the workbench and has a moving end. The moving end abuts against the flipping disk to drive the flipping disk to move relative to the positioning frame, and the moving end is rotatably arranged relative to the flipping disk.

[0014] To further optimize this technical solution, a testing mechanism is further included, and the testing mechanism includes:

[0015] A testing base is arranged on the workbench and has a testing groove for placing the oscillator body. The testing base also has testing probes for electrically connecting with the oscillator body, and a clamping portion is provided at the end of the testing base;

[0016] A testing pressing cover is rotatably connected to the testing base through a first torsion spring, and the first torsion spring is used to provide an elastic force for opening the testing pressing cover;

[0017] A fastening member, the middle of the fastening member is rotatably connected to the end of the testing pressing cover through a second torsion spring. The lower part of the fastening member has a clamping head. After the testing pressing cover is buckled on the upper end of the testing base, the clamping head is clamped with the clamping portion to fix the oscillator body. The second torsion spring is used to provide a pressure for the clamping head to be clamped in the clamping portion. The upper end of the fastening member has a triggering portion. After the triggering portion rotates, the clamping head disengages from the clamping portion.

[0018] To further optimize this technical solution, there are several of the testing mechanisms, and further comprising:

[0019] A carrying platform is movably arranged on the workbench, and several of the testing mechanisms are arranged in an array on the carrying platform;

[0020] A loading slider is movably arranged on the workbench, and the moving direction of the loading slider is perpendicular to the moving direction of the carrying platform;

[0021] A fastening pressing rod is arranged on the loading slider in a lifting manner, and after the fastening pressing rod descends, it approaches the testing mechanism;

[0022] The loading nozzle is vertically arranged on the loading slider. The loading nozzle is communicated with an external negative pressure mechanism and is used to transfer the oscillator body in the positioning groove to the test groove.

[0023] To further optimize this technical solution, it further includes:

[0024] The pin discrimination camera module is located between the positioning frame and the bearing table and below the positioning frame. When the loading nozzle slides with the loading slider, it passes through the pin discrimination camera module, and the pin discrimination camera module is used to take pictures and identify the pins of the oscillator body;

[0025] The alignment stepping motor is vertically arranged on the loading slider and is used to drive the loading nozzle to rotate.

[0026] To further optimize this technical solution, it further includes:

[0027] The feeding tray is movably arranged on the workbench and is used to carry the loose parts of the oscillator body;

[0028] The feeding slider is slidably arranged on the workbench and slides between the feeding tray and the positioning frame;

[0029] The feeding nozzle is vertically arranged on the feeding slider, and the feeding nozzle is used to transfer the oscillator body on the feeding tray to the positioning groove.

[0030] To further optimize this technical solution, it further includes:

[0031] The appearance discrimination camera module is movably arranged above the feeding tray and is used to take pictures and identify the appearance of the loose parts of the oscillator body;

[0032] The angle discrimination camera module is located between the feeding tray and the positioning frame and below the positioning frame. When the feeding nozzle slides with the feeding slider, it passes through the angle discrimination camera module, and the angle discrimination camera module is used to identify the angle of the oscillator body;

[0033] The angle adjustment stepping motor is vertically arranged on the feeding slider and is used to drive the feeding nozzle to rotate.

[0034] To further optimize this technical solution, it further includes:

[0035] The positive and negative discrimination camera module is arranged above the positioning groove and is used to identify the positive and negative of the oscillator body in the positioning groove.

[0036] To further optimize this technical solution, it further includes:

[0037] The test monitoring camera module is movably arranged above the test mechanism and is used to monitor the usage status of the test mechanism.

[0038] To further optimize this technical solution, it further includes:

[0039] The classification collection box is rotatably arranged on the workbench and is located beside the bearing table. The classification collection box has six collection grooves distributed circumferentially, and the collection grooves are used to accommodate the oscillator body after the test is completed.

[0040] The beneficial effects of the present invention are as follows:

[0041] 1. In the initial state, the upper cover plate is located above the lower tray. The oscillator body can enter the positioning groove from the upper through hole. The lower supporting block is located below and can abut against or be spaced from the lower end of the oscillator body, preventing the oscillator body from falling.

[0042] 2. When the oscillator body is in the reverse side, that is, when the pins of the oscillator body are facing up, the positioning frame and the flipping disk rotate for flipping. The lower tray rotates to the upper side, and the flipping disk moves relative to the positioning frame, making the lower through hole of the lower tray opposite to the position of the oscillator body, facilitating the removal of the oscillator body. The upper supporting block is located below the oscillator body, preventing the oscillator body from falling, and completing the stable flipping of the oscillator body. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the three-dimensional general assembly structure of the present invention;

[0044] Figure 2 It is of the present invention Figure 1 The partial enlarged structure schematic diagram at position a in;

[0045] Figure 3 It is of the present invention Figure 1 The partial enlarged structure schematic diagram at position b in;

[0046] Figure 4 It is the front view structure schematic diagram of the present invention;

[0047] Figure 5 It is the top view structure schematic diagram of the present invention;

[0048] Figure 6 It is the structure schematic diagram of the flipping mechanism of the present invention;

[0049] Figure 7 It is the top view structure schematic diagram of the flipping mechanism of the present invention;

[0050] Figure 8 It is of the present invention Figure 7 The sectional structure schematic diagram at the A-A position in;

[0051] Figure 9For the present invention Figure 8 Schematic diagram of the partial enlarged structure at position c in the present invention;

[0052] Figures 10 - 12 Schematic diagram of the structure during the turning-over process of the present invention;

[0053] Figure 13 Schematic diagram of the test mechanism structure of the present invention;

[0054] Figure 14 Schematic diagram of the vertical cross-section structure of the test mechanism of the present invention;

[0055] Figure 15 Schematic diagram of the partial structure of the positioning frame of the present invention;

[0056] Figure 16 Schematic diagram of the oscillator main body structure of the present invention;

[0057] Explanation of the marks in the figure: 1. Oscillator main body; 101. Pin; 2. Workbench; 3. Positioning frame; 301. Positioning groove; 302. Spline shaft; 4. Flipping disk; 401. Lower tray; 4011. Lower supporting block; 4012. Lower through hole; 402. Upper cover plate; 4021. Upper supporting block; 4022. Upper through hole; 403. Guide hole; 404. Flipping drive unit; 405. Reciprocating drive unit; 4051. Mobile end; 406. Positive and negative discrimination camera module; 5. Test mechanism; 501. Test base; 5011. Test groove; 5012. Test probe; 5013. Clamping part; 502. Test pressing cover; 5021. First torsion spring; 503. Fastening part; 5031. Second torsion spring; 5032. Chuck; 5033. Trigger part; 504. Carrier table; 5041. PCB detection board; 505. Test monitoring camera module; 6. Loading slider; 601. Fastening pressure rod; 602. Loading suction nozzle; 603. Pin discrimination camera module; 604. Alignment stepping motor; 7. Feeding tray; 701. Feeding slider; 702. Feeding suction nozzle; 703. Appearance discrimination camera module; 704. Angle discrimination camera module; 705. Angle adjustment stepping motor; 8. Classification collection box; 801. Collection groove. Detailed implementation manners

[0058] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0059] To make the drawings concise, only the parts related to the invention are schematically shown in each drawing, and they do not represent the actual structure of the product as a whole. Additionally, to make the drawings concise and easy to understand, for components with the same structure or function in some drawings, only one of them is schematically shown, or only one of them is labeled. In this article, "one" not only means "only this one", but also can mean "more than one", and "several" includes "two" and "more than two".

[0060] In this article, it should be noted that unless otherwise clearly specified and defined, the terms "install", "connect", and "join" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] In addition, in the description of this application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0062] As Figures 1 - 16 shown, an on-board temperature test automatic device for a quartz crystal oscillator includes a positioning frame 3 which is rotatably arranged and has a positioning groove 301 that penetrates up and down. The positioning groove 301 is used to accommodate the oscillator body 1. A flipping disk 4 is rotatably arranged. The positioning frame 3 is located on the axis of the flipping disk 4, and the flipping disk 4 and the positioning frame 3 are arranged to move relatively along the axis direction. A lower tray 401 is arranged on the flipping disk 4. The lower tray 401 has a lower supporting block 4011 and a lower through hole 4012 that are opposite to the position of the positioning groove 301. The lower supporting block 4011 and the lower through hole 4012 are spaced apart in the axis direction of the flipping disk 4. An upper cover plate 402 is arranged above the lower tray 401. The upper cover plate 402 has an upper supporting block 4021 and an upper through hole 4022 that are opposite to the position of the positioning groove 301. The upper through hole 4022 is vertically opposite to the lower supporting block 4011, and the upper supporting block 4021 is vertically opposite to the lower through hole 4012. The oscillator body 1 is placed in the positioning groove 301 after passing through the upper through hole 4022 or the lower through hole 4012. In the vertical direction, the oscillator body 1 is located between the lower supporting block 4011 and the upper supporting block 4021.

[0063] The middle part of the flipping disk 4 has a guiding hole 403, and the guiding hole 403 is slidably sleeved outside the positioning frame 3, and the positioning frame 3 drives the flipping disk 4 to rotate; further comprising: a flipping driving unit 404 for driving the positioning frame 3 to rotate; a workbench 2, and the flipping driving unit 404 is arranged on the workbench 2; a reciprocating driving unit 405 is arranged on the workbench 2 and has a moving end 4051, and the moving end 4051 abuts against the flipping disk 4 for driving the flipping disk 4 to move relative to the positioning frame 3, and the moving end 4051 is rotatably arranged relative to the flipping disk 4.

[0064] During use, taking the initial state where the upper cover plate 402 is on the upper side as an example, the pin 101 of the oscillator main body 1 is on one side. It is required that the pins 101 of the oscillator main body 1 face downward uniformly, the positioning groove 301 and the upper through hole 4022 are vertically opposite, and the lower supporting block 4011 is located below the positioning groove 301.

[0065] The oscillator main body 1 realizes forward and reverse flipping in the flipping mechanism, as Figure 9 shown. The oscillator main body 1 enters the positioning groove 301 from the upper through hole 4022. The oscillator main body 1 can be clamped in the positioning groove 301, and positioning is realized by relying on the positioning groove 301. There is a gap between the lower end and the lower supporting block 4011, and the lower supporting block 4011 can prevent the oscillator main body 1 from falling; it is also possible that the oscillator main body 1 is clamped in the positioning groove 301, and the lower end abuts against the lower supporting block 4011, which can position the oscillator main body 1 more accurately. When the pins 101 of the oscillator main body 1 face downward, it can be taken out from the upper through hole 4022. When the pins 101 of the oscillator main body 1 face upward, the oscillator main body 1 needs to be flipped, and the following flipping process can be adopted, as Figures 10 - 12 shown. The first step, as Figure 10 shown, the flipping disk 4 moves to the right along the axial direction in the figure, so that the lower through hole 4012 and the upper supporting block 4021 approach the positioning groove 301, and the upper through hole 4022 and the lower supporting block 4011 move away from the positioning groove 301 to the right. At this time, the oscillator main body 1 is located in the positioning groove 301, and the left side of the oscillator main body 1 is located below the right part of the upper supporting block 4021, and the right side is located above the left part of the lower supporting block 4011; the second step, as Figure 11 shown, the flipping disk 4 and the positioning frame 3 rotate synchronously by 180° for flipping, and the lower tray 401 rotates to the upper side. At this time, the pins 101 of the oscillator main body 1 rotate to face downward, and the left part of the lower supporting block 4011 covers the upper side of the right side of the oscillator main body 1; the third step, as Figure 12 shown, the flipping disk 4 continues to move to the right, so that the lower through hole 4012 is vertically opposite to the positioning groove 301, and the upper supporting block 4021 is located below the oscillator main body 1, and the lower supporting block 4011 is separated from the oscillator main body 1. The flipped oscillator main body 1 can be taken out from the lower through hole 4012. Subsequently, keep the flipped state and continue to put in a new oscillator main body 1. When flipping is required, just perform the operations in reverse order of the above flipping process to reset to the initial state.

[0066] The shape of the positioning groove 301 is adapted to the shape of the oscillator body 1. The positioning groove 301 can be a rectangular structure, and the four corners are all reamed to facilitate the smooth entry of the oscillator body 1 and reduce obstacles.

[0067] The flipping disk 4 is movably sleeved outside the positioning frame 3. The positioning frame 3 may include a spline shaft 302, and the spline shaft 302 is in transmission connection with the flipping driving unit 404. The guiding hole 403 is slidably sleeved on the spline shaft 302 to enable movement. When the positioning frame 3 rotates, it can transmit rotation and drive the flipping disk 4 to rotate synchronously. The flipping driving unit 404 can use a stepping motor to control the rotation angle and is installed on the workbench 2. The reciprocating driving unit 405 can use a cylinder assembly or the like to drive the flipping disk 4 to reciprocate left and right. The mobile end 4051 can be "U"-shaped. The periphery of the flipping disk 4 has an annular convex edge. The mobile end 4051 is stuck on the convex edge, and the convex edge can rotate within the "U"-shaped structure. The mobile end 4051 can drive the flipping disk 4 to move left and right. The flipping disk 4 can rotate freely without affecting the mobile end 4051.

[0068] Furthermore, it further includes a testing mechanism 5. The testing mechanism 5 includes: a testing base 501, which is arranged on the workbench 2 and has a testing groove 5011 for placing the oscillator body 1. The testing base 501 also has a testing probe 5012 for electrically connecting with the oscillator body 1, and the end of the testing base 501 has a clamping portion 5013; a testing pressing cover 502, which is rotatably connected to the testing base 501 through a first torsion spring 5021, and the first torsion spring 5021 is used to provide the elastic force for opening the testing pressing cover 502; a fastening member 503, the middle of the fastening member 503 is rotatably connected to the end of the testing pressing cover 502 through a second torsion spring 5031. The lower part of the fastening member 503 has a clamping head 5032. After the testing pressing cover 502 is buckled on the upper end of the testing base 501, the clamping head 5032 is clamped with the clamping portion 5013 to fix the oscillator body 1. The second torsion spring 5031 is used to provide the pressure for the clamping head 5032 to be clamped in the clamping portion 5013. The upper end of the fastening member 503 has a triggering portion 5033. After the triggering portion 5033 rotates, the clamping head 5032 disengages from the clamping portion 5013.

[0069] There are several testing mechanisms, and it further includes: a carrying platform 504, which is movably arranged on the workbench 2, and several testing mechanisms 5 are arranged in an array on the carrying platform 504; a loading slider 6, which is movably arranged on the workbench 2, and the moving direction of the loading slider 6 is perpendicular to the moving direction of the carrying platform 504; a fastening pressing rod 601, which is arranged on the loading slider 6 in a lifting manner, and after the fastening pressing rod 601 descends, it approaches the testing mechanism; a loading suction nozzle 602, which is arranged on the loading slider 6 in a lifting manner, and the loading suction nozzle 602 is communicated with an external negative pressure mechanism. The loading suction nozzle 602 is used to transfer the oscillator body 1 in the positioning groove 301 to the testing groove 5011.

[0070] It further includes: a pin 101 discrimination camera module, which is located between the positioning frame 3 and the carrier 504 and below the positioning frame 3. When the loading nozzle 602 follows the loading slider 6 to slide, it passes through the pin 101 discrimination camera module. The pin 101 discrimination camera module is used to take pictures and identify the pin 101 of the oscillator body 1; a positioning stepping motor 604, which is vertically arranged on the loading slider 6 and is used to drive the loading nozzle 602 to rotate.

[0071] It further includes: a test monitoring camera module 505, which is movably arranged above the test mechanism 5 and is used to monitor the usage status of the test mechanism 5.

[0072] It further includes: a classification collection box 8, which is rotatably arranged on the workbench 2 and beside the carrier 504. The classification collection box 8 has six collection grooves 801 distributed circumferentially. The collection grooves 801 are used to accommodate the oscillator body 1 after the test is completed.

[0073] During use, after the turnover is completed at the positioning frame 3, the pin 101 of the oscillator body 1 faces downward uniformly. After being taken out from the positioning groove 301, it can be placed in the test mechanism 5 for detection. The oscillator body 1 is placed in the test groove 5011. Test probes 5012 are arranged in the test groove 5011 and are connected to the pin 101 of the oscillator body 1 one by one. Then the test cover 502 is closed, and the buckle of the fastening member 503 is clamped on the clamping portion 5013. The test cover 502 can press the oscillator body 1 tightly in the test groove 5011 to ensure stable electrical connection between the pin 101 and the test probe 5012. After the detection is completed, the test cover 502 is opened to take out the oscillator body 1.

[0074] The carrier 504 may include a PCB detection board 5041. The PCB detection board 5041 is connected to the test probe 5012. A number of test mechanisms 5 are arranged in an array on the PCB detection board 5041 of the carrier 504, which is convenient for batch detection. The oscillator body 1 can be automatically placed into the test groove 5011 through the fastening lever 601 and the loading nozzle 602. By moving the loading slider 6, the fastening lever 601 and the loading nozzle 602 are driven to move between the positioning groove 301 and the test groove 5011. The loading nozzle 602 can be controlled by an external negative pressure mechanism to achieve negative pressure adsorption for picking and placing. After the loading nozzle 602 descends, it adsorbs the oscillator body 1 in the positioning groove 301, then rises to take out the oscillator body 1 and follows the slider to slide and transfer to the test groove 5011. The loading nozzle 602 descends to place the oscillator body 1 in the test groove 5011, as Figure 3As shown, the fastening pressure rod 601 descends, and then the carrier table 504 moves to bring the test pressing cover 502 closer to the fastening pressure rod 601. The test pressing cover 502 is in an inclined open state, and the outer inclined surface faces the fastening pressure rod 601. During the movement, the lower end of the fastening pressure rod 601 abuts against the test pressing cover 502, driving the test pressing cover 502 to gradually press down and fasten and close. Subsequently, the fastening pressure rod 601 quickly retracts, completing the loading of the oscillator main body 1 in the test mechanism 5, and then various parameter detections can be carried out.

[0075] The oscillator main body 1 can also be taken out of the test slot 5011 by using the loading suction nozzle 602. When taking out, the carrier table 504 moves so that the structure to be opened at this time moves to a position opposite to the fastening pressure rod 601. The fastening pressure rod 601 descends and abuts against the trigger part 5033 of the fastening part 503, causing the fastening part 503 to rotate, and the chuck 5032 disengages from the clamping part 5013. The fastening pressure rod 601 gradually rises, and under the elastic force of the first torsion spring 5021, the test pressing cover 502 is bounced up and opened, exposing the oscillator main body 1 in the test slot 5011. The carrier table 504 moves to make the oscillator main body 1 opposite to the loading suction nozzle 602. The loading suction nozzle 602 moves above the oscillator main body 1 and takes out the oscillator main body 1 from the test slot 5011 through descending and ascending actions. Subsequently, the oscillator main body 1 with the detection completed can be placed in the sorting and collection box 8.

[0076] When the pins 101 of the oscillator main body 1 and the test probes 5012 are in one-to-one and unique correspondence, the shape of one of the pins 101 of the oscillator main body 1 is different from that of the other pins 101. By taking a picture of the lower pins 101 of the oscillator main body 1 through the pin 101 discrimination camera module, it can be determined whether the positions of the pins 101 of the oscillator main body 1 correspond correctly to the test probes 5012. When they do not correspond, the alignment stepping motor 604 can be rotated 180°, and then the oscillator main body 1 is placed in the test slot 5011 again.

[0077] The test monitoring camera module 505 can monitor the usage status of the test mechanism 5 below, such as the open and closed states of the test pressing covers 502 of different test mechanisms 5, and whether there is an oscillator main body 1 in the test slot 5011 of the test mechanism 5 in the open state, which is convenient for controlling the loading action.

[0078] The classification collection box 8 can collect the oscillator bodies 1 that have been tested, and classify them into six levels according to the requirements of parameters such as capacitance and resistance. A database of classifications of each level can be established through the control center, and the different levels can be distinguished by comparing the test data of each oscillator body 1, and placed in the corresponding collection slot 801. The classification collection box 8 can be driven to rotate by a component motor, so as to rotate and change the position of the collection slot 801 to collect the oscillator bodies 1 of the corresponding level. Comparing the test data with the database is a prior art, and connecting the test probe 5012 and the detection system through the PCB board to perform parameter testing on the oscillator body 1 is a prior art.

[0079] Furthermore, it also includes: a loading tray 7, which is movably set on the workbench 2 and is used to carry the bulk material of the oscillator body 1; a loading slider 701, which is slidably set on the workbench 2 and slides between the loading tray 7 and the positioning frame 3; a loading nozzle 702, which is lifted and lowered on the loading slider 701, and the loading nozzle 702 is used to transfer the oscillator body 1 on the loading tray 7 to the positioning groove 301.

[0080] The appearance identification camera module 703 is movably arranged above the loading tray 7, and is used to photograph and identify the appearance of the bulk material of the oscillator body 1; the angle identification camera module 704 is located between the loading tray 7 and the positioning frame 3, and is located below the positioning frame 3. When the loading nozzle 702 slides along with the loading slider 701, it passes through the angle identification camera module 704. The angle identification camera module 704 is used to identify the angle of the oscillator body 1; the angle adjustment stepping motor 705 is raised and lowered on the loading slider 701, and is used to drive the loading nozzle 702 to rotate.

[0081] When in use, the positioning groove 301 can be automatically loaded by the loading nozzle 702. The oscillator bodies 1 can be randomly placed on the loading tray 7, and the moving direction of the loading tray 7 can be perpendicular to the sliding direction of the loading slider 701, so that the loading nozzle 702 can move above each oscillator body 1. The loading nozzle 702 drops down to pick up an oscillator body 1, and then moves up to pass through the angle discrimination camera module 704 to obtain the angle data of the oscillator body 1, and then adjusts the rotation of the nozzle through the angle adjustment step motor control, and aligns the oscillator body 1 so that it can smoothly enter the positioning groove 301.

[0082] The appearance identification camera module 703 can take pictures of the oscillator bodies 1 scattered above the loading tray 7 to identify the appearance parameters. The products with a rectangular structure and four-side data within the preset parameters are qualified products in appearance. The loading nozzle 702 transfers the qualified oscillator bodies 1 to the positioning groove 301.

[0083] Further, it further includes: a positive and negative discrimination camera module 406, disposed above the positioning groove 301, for identifying the positive and negative of the oscillator body 1 in the positioning groove 301.

[0084] During use, the positive and negative discrimination camera module 406 can take pictures of the oscillator body 1 in the positioning groove 301 to identify the positive and negative, that is, to determine whether the pin 101 is facing up or down. After feeding back information, it is determined whether to perform turning over. The angle discrimination camera module 704 can also determine the positive and negative of the oscillator body 1 through image processing.

[0085] The loading nozzle 602 and the feeding nozzle 702 have the same structure, both of which are conical rubber tube heads.

[0086] The test monitoring camera module 505, the positive and negative discrimination camera module 406, the angle discrimination camera module 704, the appearance discrimination camera module 703, and the pin 101 discrimination camera module are all vision systems, which are prior art. The vision system can communicate with the control center. The control center processes the image information and performs drive control to control the movement of the feeding tray 7, the sliding of the feeding slider 701, the rotation of the angle adjustment stepping motor 705, and the lifting and adsorption switch of the feeding nozzle 702 to realize automatic feeding of the positioning groove 301; control the flipping drive unit 404 and the reciprocating drive unit 405 to perform automatic turning over; control the movement of the carrier plate, the sliding of the loading slider 6, the rotation of the alignment stepping motor 604, and the lifting of the loading nozzle 602 and the fastening pressure rod 601 to realize automatic loading and unloading of the test; control the classification and collection to rotate and adjust the position of the collection groove 801. Sliding and lifting, etc., can all be realized by prior art, such as cylinder components, lead screw mechanisms, link mechanisms, cam lifting structures, etc.

[0087] It can be understood that the present invention is described through some embodiments. Those skilled in the art know that without departing from the spirit and scope of the present invention, various changes or equivalent replacements can be made to these features and embodiments. In addition, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present invention.

Claims

1. An on-board temperature test automatic device for a quartz crystal oscillator, characterized in that, Comprising: A positioning frame (3), rotatably arranged, having a positioning groove (301) that penetrates up and down, and the positioning groove (301) is used to accommodate the oscillator body (1). A flipping disk (4), rotatably arranged, the positioning frame (3) is located on the axis of the flipping disk (4), and the flipping disk (4) and the positioning frame (3) are arranged to move relative to each other along the axis direction. A lower tray (401), arranged on the flipping disk (4), the lower tray (401) has a lower supporting block (4011) and a lower through hole (4012) that are relatively positioned with the positioning groove (301), and the lower supporting block (4011) and the lower through hole (4012) are arranged at intervals in the axis direction of the flipping disk (4). An upper cover plate (402), arranged above the lower tray (401), the upper cover plate (402) has an upper supporting block (4021) and an upper through hole (4022) that are relatively positioned with the positioning groove (301), the upper through hole (4022) is arranged vertically opposite to the lower supporting block (4011), the upper supporting block (4021) is arranged vertically opposite to the lower through hole (4012), and the oscillator body (1) is placed in the positioning groove (301) after passing through the upper through hole (4022) or the lower through hole (4012). In the vertical direction, the oscillator body (1) is located between the lower supporting block (4011) and the upper supporting block (4021).

2. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 1, characterized in that The middle part of the flipping disk (4) has a guiding hole (403), and the guiding hole (403) is slidably sleeved outside the positioning frame (3), and the positioning frame (3) drives the flipping disk (4) to rotate; further comprising: A flipping driving unit (404), used to drive the positioning frame (3) to rotate. A workbench (2), the flipping driving unit (404) is arranged on the workbench (2). A reciprocating driving unit (405), arranged on the workbench (2), having a moving end (4051), and the moving end (4051) abuts against the flipping disk (4) to drive the flipping disk (4) to move relative to the positioning frame (3), and the moving end (4051) is rotatably arranged relative to the flipping disk (4).

3. The on-board temperature test automatic equipment for a quartz crystal oscillator according to claim 2, characterized in that, Further comprising a testing mechanism (5), and the testing mechanism (5) comprises: A testing base (501), arranged on the workbench (2), having a testing groove (5011) for placing the oscillator body (1), the testing base (501) also has a testing probe (5012) for electrically connecting with the oscillator body (1), and the end of the testing base (501) has a clamping portion (5013). A testing pressing cover (502), rotatably connected to the testing base (501) through a first torsion spring (5021), and the first torsion spring (5021) is used to provide an elastic force for opening the testing pressing cover (502). The fastening member (503), the middle part of the fastening member (503) is rotationally connected to the end of the test gland (502) through a second torsion spring (5031), the lower part of the fastening member (503) has a chuck (5032), after the test gland (502) is fastened to the upper end of the test base (501), the chuck (5032) is clamped with the clamping portion (5013) for fixing the oscillator body (1), the second torsion spring (5031) is used to provide the pressure for the chuck (5032) to be clamped in the clamping portion (5013), the upper end of the fastening member (503) has a triggering portion (5033), after the triggering portion (5033) rotates, the chuck (5032) disengages from the clamping portion (5013).

4. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 3, characterized in that There are several of the test mechanisms (5), and further include: A carrier table (504), movably arranged on the workbench (2), and several of the test mechanisms (5) are arranged in an array on the carrier table (504); A loading slider (6), movably arranged on the workbench (2), and the moving direction of the loading slider (6) is perpendicular to the moving direction of the carrier table (504); A fastening pressure rod (601), arranged to be lifted and lowered on the loading slider (6), and after the fastening pressure rod (601) descends, it approaches the test mechanism; A loading suction nozzle (602), arranged to be lifted and lowered on the loading slider (6), the loading suction nozzle (602) is communicated with an external negative pressure mechanism, and the loading suction nozzle (602) is used to transfer the oscillator body (1) in the positioning groove (301) into the test groove (5011).

5. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 4, characterized in that, Further include: A pin (101) discrimination camera module, located between the positioning frame (3) and the carrier table (504), and below the positioning frame (3), when the loading suction nozzle (602) slides following the loading slider (6), it passes through the pin (101) discrimination camera module, and the pin (101) discrimination camera module is used to take pictures and identify the pins (101) of the oscillator body (1); An alignment stepping motor (604), arranged to be lifted and lowered on the loading slider (6), for driving the loading suction nozzle (602) to rotate.

6. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 2, characterized in that, Further include: A loading tray (7), movably arranged on the workbench (2), for carrying the loose parts of the oscillator body (1); A loading slider (701), slidably arranged on the workbench (2), and slides between the loading tray (7) and the positioning frame (3); A loading suction nozzle (702), arranged to be lifted and lowered on the loading slider (701), and the loading suction nozzle (702) is used to transfer the oscillator body (1) on the loading tray (7) to the positioning groove (301).

7. An on-board temperature test automatic device for a quartz crystal oscillator according to claim 6, characterized in that, Further include: An appearance discrimination camera module (703), movably arranged above the loading tray (7), for taking pictures and identifying the appearance of the loose parts of the oscillator body (1). The angle discrimination camera module (704) is located between the loading tray (7) and the positioning frame (3) and below the positioning frame (3). When the loading suction nozzle (702) slides following the loading slider (701), it passes by the angle discrimination camera module (704). The angle discrimination camera module (704) is used to identify the angle of the oscillator body (1). The angle adjustment stepping motor (705) is arranged vertically on the loading slider (701) and is used to drive the loading suction nozzle (702) to rotate.

8. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 1, characterized in that, It further includes: The positive and negative discrimination camera module (406) is arranged above the positioning groove (301) and is used to identify the positive and negative of the oscillator body (1) in the positioning groove (301).

9. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 3, characterized in that, It further includes: The test monitoring camera module (505) is movably arranged above the test mechanism (5) and is used to monitor the usage status of the test mechanism (5).

10. The on-board temperature test automatic device for a quartz crystal oscillator according to claim 4, characterized in that It further includes: The classification collection box (8) is rotatably arranged on the workbench (2) and beside the bearing table (504). The classification collection box (8) has six collection grooves (801) distributed circumferentially. The collection grooves (801) are used to accommodate the oscillator bodies (1) after the test is completed.

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