Method and device for detecting operation state of pot bottom embossing device

Abstract

The invention relates to the field of equipment state detection, and discloses a method and equipment for detecting the operation state of pot bottom embossing equipment, and the method comprises the steps: obtaining a first pressure value for embossing a horizontal region of a pot bottom, and a second pressure value for embossing a side wall region of the pot bottom; determining a difference value between the first pressure value and the second pressure value as a pressure difference value; when the second pressure value is smaller than a preset second pressure value, a second pressure adjustment value is increased for the second pressure value; when the pressure difference value is smaller than the preset pressure difference value, a first pressure adjustment value is increased for the first pressure value; when the first pressure value is larger than a preset first pressure threshold value, the pressure value of the first pressure value is reduced according to a first proportion value, and the pressure value of the second pressure value is reduced according to a second proportion value; wherein the first proportion value is greater than the second proportion value. The knurling process of the side wall and the bottom of the pot body can be detected, and the knurling quality is improved.

Description

Technical Field

[0001] This application relates to the technical field of equipment status detection, and more specifically, to a method and device for detecting the operating status of a bottom embossing device for cookware. Background Art

[0002] In the production process of non-stick cookware without coating, there is no need to spray anti-stick coating on the inner side of the pot bottom. Instead, an embossing structure is adopted on the inner side of the pot bottom to achieve the anti-stick effect. The existing pot bottoms of non-stick cookware without coating are generally formed by one-time pressing of multiple layers of materials. During the pressing process, it is necessary to control the pressing parameters for forming the embossing pattern on the inner side of the non-stick pot bottom. The height of the protrusions of the embossing pattern cannot be too low (for example, 1 mm). If it is lower than 1 mm, the anti-stick effect will not be achieved. Since the process of embossing the pot bottom requires controlling the height of the embossing pattern formed on the pot bottom, the pressing force and related pressing parameters are monitored and controlled during the pressing process of the pot bottom.

[0003] During the process of embossing the pot bottom, the existing pot bottom embossing detection technology has certain limitations. Currently, this detection technology mainly focuses on the pressure detection of the horizontal area of the pot bottom, and a uniform pressure is applied to the pot bottom to ensure the integrity and consistency of the embossing pattern. However, this detection method cannot comprehensively cover the entire embossing process of the pot body, especially for the embossing process of the side wall of the pot body, and it cannot effectively detect and control the pressure. This leads to problems such as uneven pressure, pattern deformation, or different depths during the embossing process of the side wall of the pot body, thereby affecting the overall aesthetics and performance of the cookware. Summary of the Invention

[0004] The purpose of this application is to provide a method and device for detecting the operating status of a bottom embossing device for cookware, which solves the technical problem that the embossing process of the side wall of the pot body cannot be detected, and achieves the technical effect of detecting the embossing processes of the side wall and the bottom of the pot body and improving the embossing quality.

[0005] A method for detecting the operating status of a bottom embossing device for cookware provided by an embodiment of this application includes: obtaining a first pressure value for embossing the horizontal area of the pot bottom and a second pressure value for embossing the side wall area of the pot bottom; determining the difference between the first pressure value and the second pressure value as the pressure difference; when the second pressure value is less than a preset second pressure value, increasing the second pressure value by a second pressure adjustment value; when the pressure difference is less than a preset pressure difference, increasing the first pressure value by a first pressure adjustment value; when the first pressure value is greater than a preset first pressure threshold, reducing the first pressure value by a first ratio value and reducing the second pressure value by a second ratio value; wherein, the first ratio value is greater than the second ratio value.

[0006] In a possible implementation, the method further includes: obtaining the embossing depths at different heights in the sidewall region of the pot bottom, and determining the depth variance value of the embossing depths at different heights; when the depth variance value of the embossing depths at different heights is greater than or equal to a preset depth variance value, sending a prompt message for adjusting the indenter in the sidewall region of the pot bottom; when the depth variance value of the embossing depths at different heights is less than the preset depth variance value, not sending a prompt message for adjusting the indenter in the sidewall region of the pot bottom, and embossing the horizontal region of the pot bottom and the sidewall region of the pot bottom.

[0007] In another possible implementation, reducing the pressure value of the first pressure value according to the first ratio value and reducing the pressure value of the second pressure value according to the second ratio value includes: when the depth variance value of the embossing depths at different heights is less than the preset depth variance value, determining the maximum sidewall embossing depth at different heights in the sidewall region of the pot bottom, and determining the ratio of the maximum sidewall embossing depth to the second pressure value as the first ratio; determining the maximum horizontal embossing depth of the horizontal region of the pot bottom, and determining the ratio of the maximum horizontal embossing depth to the first pressure value as the second ratio; determining the ratio of the first ratio to the second ratio as the pressure adjustment ratio; determining the ratio of the maximum first pressure value to the first pressure value as the first ratio value. Determining the product of the first ratio value and the pressure adjustment ratio as the second ratio value.

[0008] In another possible implementation, the method further includes: obtaining the material information of the pot body, detecting the temperature value of the pot body by infrared, and obtaining the pot body extrusion correction parameter corresponding to the material information and the temperature value of the pot body; determining the product of the first ratio value, the pressure adjustment ratio and the pot body extrusion correction parameter as the second ratio value.

[0009] In another possible implementation, the method further includes: obtaining the pot bottom thickness value corresponding to the horizontal region of the pot bottom and the sidewall thickness value corresponding to the sidewall region of the pot bottom, and obtaining the first die temperature value of the die region corresponding to the horizontal region of the pot bottom and the second die temperature value of the die region corresponding to the sidewall region of the pot bottom by infrared detection; determining the first correction factor corresponding to the pot bottom thickness value and the first die temperature value, and determining the second correction factor corresponding to the sidewall thickness value and the second die temperature value; multiplying the first ratio value by the first correction factor to adjust the first ratio value; multiplying the second ratio value by the second correction factor to adjust the second ratio value.

[0010] In another possible implementation, the method further includes: when the sidewall region of the pot bottom is a planar structure, obtaining the tilt angle value corresponding to the sidewall region of the pot bottom, and obtaining the sidewall extrusion correction coefficient corresponding to the tilt angle value; when the sidewall region of the pot bottom is a curved surface structure, obtaining the maximum curvature value corresponding to the sidewall region of the pot bottom, and obtaining the sidewall extrusion correction coefficient corresponding to the maximum curvature value; multiplying the second ratio value by the sidewall extrusion correction coefficient to adjust the second ratio value.

[0011] In another possible implementation, the method further includes: obtaining the embossing depth of the transition region between the horizontal region of the pot bottom and the sidewall region of the pot bottom, and determining the depth variance value of the embossing depth of the transition region as the transition embossing depth variance value; obtaining the transition adjustment coefficient corresponding to the pot bottom material, and determining the product of the transition adjustment coefficient and the pressure difference as the transition pressure adjustment value; when the transition embossing depth variance value is greater than or equal to the preset transition embossing depth variance value, reducing the first pressure value by the transition pressure adjustment value and increasing the second pressure value by the transition pressure adjustment value; when the transition embossing depth variance value is less than the preset transition embossing depth variance value, not adjusting the first pressure value and the second pressure value.

[0012] In another possible implementation, the method further includes: determining the maximum embossing depth and the minimum embossing depth of the transition region, and determining the embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition region; and determining the minimum embossing depth at different heights of the sidewall region of the pot bottom; when the minimum embossing depth of the transition region and the minimum embossing depth of the sidewall region of the pot bottom at different heights are both less than the preset minimum embossing depth, increasing the second pressure value by the transition pressure adjustment value; when the minimum embossing depth of the transition region and the minimum embossing depth of the sidewall region of the pot bottom at different heights are both greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition region is greater than or equal to the preset maximum embossing depth, reducing the second pressure value by the transition pressure adjustment value.

[0013] In another possible implementation, the method further includes: when the embossing depth difference is greater than or equal to the preset embossing depth difference, sending a prompt message for prompting to improve the concentricity of embossing the horizontal region and the sidewall region of the pot bottom; when the embossing depth difference is greater than or equal to the preset embossing depth difference, not sending a prompt message for prompting to improve the concentricity of embossing the horizontal region and the sidewall region of the pot bottom.

[0014] The embodiment of the present application also provides a device for detecting the operating state of a pot bottom embossing device, including a unit for executing the method described in any one of the above.

[0015] The beneficial effects of the embodiment of the present application compared with the prior art are:

[0016] An embodiment of the present application provides a method for detecting the operating state of a bottom-of-pot embossing device. The method includes: obtaining a first pressure value for embossing the horizontal area of the bottom of the pot and a second pressure value for embossing the side wall area of the bottom of the pot; determining the difference between the first pressure value and the second pressure value as the pressure difference; when the second pressure value is less than a preset second pressure value, increasing the second pressure value by a second pressure adjustment value; when the pressure difference is greater than a preset pressure difference, increasing the first pressure value by a first pressure adjustment value; when the first pressure value is greater than a preset first pressure threshold, decreasing the first pressure value by a first ratio value and decreasing the second pressure value by a second ratio value; where the first ratio value is greater than the second ratio value. In the embodiment of the present application, the entire embossing process of the pot body can be comprehensively covered, the pressure during the bottom-of-pot embossing process can be detected and controlled in real time, the control effect of the bottom-of-pot embossing process is improved, and the control effect of the bottom-of-pot embossing is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a flowchart of the first method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the embossing process of the first method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0020] Figure 3 It is a schematic diagram of the embossing process of the second method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0021] Figure 4 It is a flowchart of the second method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0022] Figure 5 It is a flowchart of the third method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0023] Figure 6 It is a flowchart of the fourth method for detecting the operating state of a bottom-of-pot embossing device provided by an embodiment of the present application;

[0024] Figure 7Schematic flowchart of the fourth method for detecting the operating state of the bottom of the pot embossing device provided by the embodiments of the present application;

[0025] Figure 8 Schematic flowchart of the fourth method for detecting the operating state of the bottom of the pot embossing device provided by the embodiments of the present application;

[0026] Figure 9 Schematic flowchart of the fourth method for detecting the operating state of the bottom of the pot embossing device provided by the embodiments of the present application;

[0027] Figure 10 Schematic logical structure diagram of a device for detecting the operating state of the bottom of the pot embossing device provided by the embodiments of the present application. Detailed implementation manners

[0028] It should be understood that when used in the specification of the present application and the appended claims, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0029] It should also be understood that the term "and / or" used in the specification of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0030] As used in the specification of the present application and the appended claims, the term "if" can be interpreted as "when", "once", "in response to determining", or "in response to detecting" according to the context. Similarly, the phrase "if determined" or "if detecting [the described condition or event]" can be interpreted as meaning "once determined", "in response to determining", "once detecting [the described condition or event]", or "in response to detecting [the described condition or event]" according to the context.

[0031] In addition, in the description of the specification of the present application and the appended claims, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0032] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that specific features, structures, or characteristics described in connection with that embodiment are included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized.

[0033] The existing methods for detecting the embossing on the bottom of the pot cannot comprehensively cover the entire embossing process of the pot body. Especially for the embossing process on the side wall of the pot body, it cannot effectively detect and control the pressure, resulting in problems such as uneven pressure, pattern deformation, or inconsistent depth during the embossing process of the side wall of the pot body, thus affecting the overall aesthetics and performance of the cookware.

[0034] For the above reasons, the embodiments of this application provide a method for detecting the operating state of a bottom embossing device for a pot, the method including: obtaining a first pressure value for embossing the horizontal area of the bottom of the pot and a second pressure value for embossing the side wall area of the bottom of the pot; determining the difference between the first pressure value and the second pressure value as the pressure difference; when the second pressure value is less than a preset second pressure value, increasing the second pressure value by a second pressure adjustment value; when the pressure difference is greater than a preset pressure difference, increasing the first pressure value by a first pressure adjustment value; when the first pressure value is greater than a preset first pressure threshold, decreasing the first pressure value by a first ratio value and decreasing the second pressure value by a second ratio value; wherein, the first ratio value is greater than the second ratio value. In the embodiments of this application, the entire embossing process of the pot body can be comprehensively covered, the pressure during the bottom embossing process can be detected and controlled in real time, the control effect of the bottom embossing process is improved, and the control effect of the bottom embossing is improved.

[0035] In some scenarios, a method and device for detecting the operating state of a bottom embossing device for a pot according to the embodiments of this application can be applied to the embossing processes of the horizontal area and the side wall area of the bottom of the pot, and can improve the embossing control effect of the bottom of the pot.

[0036] The following specifically describes a method for detecting the operating state of a bottom embossing device for a pot provided by the embodiments of this application with specific examples.

[0037] Figure 1 It is a flowchart of the first method for detecting the operating state of a bottom embossing device for a pot provided by the embodiments of this application, as Figure 1As shown, the method includes S110 to S120, and the following is a specific description of S110 to S120.

[0038] S110. Obtain a first pressure value for embossing the bottom horizontal area of the pot bottom and a second pressure value for embossing the side wall area of the pot bottom. Determine the difference between the first pressure value and the second pressure value as the pressure difference.

[0039] Figure 2 It is a schematic diagram of the embossing process of the first method for detecting the operating state of the pot bottom embossing device provided by the embodiment of the present application. Figure 3 It is a schematic diagram of the embossing process of the second method for detecting the operating state of the pot bottom embossing device provided by the embodiment of the present application. As Figure 2 and Figure 3 As shown, in the embodiment of the present application, the pot bottom 3 is embossed by the mold 1 and the pressing head 2. The mold 1 includes a recessed portion 11 for positioning the pot bottom 3. The pot bottom 3 has a bottom horizontal area 31 and a bottom side wall area 32. The pressing head 2 includes a central pressing head 21 and a circumferential pressing head 22. The central pressing head 21 is used to emboss the bottom horizontal area 31 of the pot bottom 3, and the circumferential pressing head 22 is used to emboss the bottom side wall area 32 of the pot bottom 3.

[0040] When the central pressing head 21 embosses the bottom horizontal area 31 of the pot bottom, the pressure of embossing the bottom horizontal area 31 can be detected by the first pressure detection component; when the circumferential pressing head 22 embosses the bottom side wall area 32 of the pot bottom, the pressure of embossing the bottom side wall area 32 by the circumferential pressing head 22 can be detected by the second pressure detection component.

[0041] Exemplarily, the first pressure detection component and the second pressure detection component can be piezoresistors provided on the pressing head transmission member, and the first pressure detection component and the second pressure detection component can also be hydraulic pressure sensors.

[0042] In the embodiment of the present application, during pressure detection, a first pressure value for embossing the bottom horizontal area of the pot bottom and a second pressure value for embossing the bottom side wall area of the pot bottom can be obtained, and then the embossing process of the pot bottom can be controlled according to the first pressure value and the second pressure value.

[0043] After the first pressure value and the second pressure value are detected, the difference between the first pressure value and the second pressure value can be determined as the pressure difference, and then the embossing processes of the bottom horizontal area and the bottom side wall area of the pot bottom can be controlled according to the pressure difference.

[0044] S120. When the second pressure value is less than the preset second pressure value, increase the second pressure value by the second pressure adjustment value. When the pressure difference is less than the preset pressure difference, increase the first pressure value by the first pressure adjustment value. When the first pressure value is greater than the preset first pressure threshold, decrease the first pressure value by the first ratio value and decrease the second pressure value by the second ratio value. Here, the first ratio value is greater than the second ratio value.

[0045] When performing pressure control, since the process of embossing the side wall area of the pot bottom is mainly shear pressure, it is necessary to preferentially control the magnitude of the extrusion pressure when extruding the side wall area of the pot bottom. When the second pressure value is less than the preset second pressure value, it indicates that the embossing pressure on the side wall area of the pot bottom is too small. At this time, the second pressure value can be increased by the second pressure adjustment value to ensure the accurate control of the second pressure value.

[0046] When extruding the pot bottom, since the area of the horizontal area of the pot bottom is larger and plastic deformation needs to be generated by positive pressure extrusion during extrusion, it is necessary to ensure that the extrusion pressure on the horizontal area of the pot bottom is greater than the extrusion pressure on the side wall area of the pot bottom. When performing pressure control, when the pressure difference is less than the preset pressure difference, the first pressure value can be increased by the first pressure adjustment value to ensure that the extrusion pressure on the horizontal area of the pot bottom is greater than the extrusion pressure on the side wall area of the pot bottom, so as to ensure the extrusion effect on the horizontal area of the pot bottom.

[0047] When extruding the pot bottom, when the first pressure value is greater than the preset first pressure threshold, it indicates that the extrusion pressure on the horizontal area of the pot bottom is too large. At this time, the first pressure value can be decreased by the first ratio value and the second pressure value can be decreased by the second ratio value to ensure that the extrusion pressure on the horizontal area of the pot bottom is greater than the extrusion pressure on the side wall area of the pot bottom, and by adjusting the ratio of the first pressure value and the second pressure value, the pressure distribution can be optimized, making the embossing effects on the horizontal area of the pot bottom and the side wall area of the pot bottom more uniform and improving the quality of the product.

[0048] When controlling the embossing pressure on the horizontal area of the pot bottom and the side wall area of the pot bottom, since the extrusion pressure on the horizontal area of the pot bottom is greater than the extrusion pressure on the side wall area of the pot bottom, by setting the first ratio value to be greater than the second ratio value, the uniformity of embossing on the horizontal area of the pot bottom and the side wall area of the pot bottom can be ensured by adjusting the ratio of the first pressure value and the second pressure value.

[0049] Exemplarily, the first ratio value can be 10% and the second ratio value can be 5%.

[0050] It should be noted that in the embodiments of the present application, no limitation is imposed on the embossing pattern, and the embossing pattern can be a diamond pattern, a polygon pattern, etc.

[0051] The beneficial effects of the above implementation method are as follows: it can comprehensively cover the entire embossing process of the pot body, can detect and control the pressure during the bottom embossing process in real time, improve the control effect of the bottom embossing process, and enhance the control effect of the bottom embossing.

[0052] Another beneficial effect of the above implementation method is that by adjusting the ratio of the first pressure value and the second pressure value and optimizing the pressure distribution, the embossing effect in the horizontal area and the side wall area of the bottom of the pot can be made more uniform, improving the product quality.

[0053] Another beneficial effect of the above implementation method is to monitor the second pressure value and monitor whether the first pressure value is greater than the preset first pressure threshold, ensuring the accuracy of the pressure control during the extrusion process in the horizontal area and the side wall area of the bottom of the pot, and improving the control effect of the bottom embossing.

[0054] Figure 4 The flowchart of the second method for detecting the operating state of the bottom embossing device provided by the embodiment of the present application is as follows. As Figure 4 shown, the above method further includes S210 to S220, and the following is a specific description of S210 to S220.

[0055] S210: Obtain the embossing depths at different heights in the side wall area of the bottom of the pot, and determine the depth variance value of the embossing depths at different heights.

[0056] During operation, since the extrusion amplitude at different heights in the side wall area of the bottom of the pot may fluctuate greatly due to the extrusion head, the embossing depths at different heights in the side wall area of the bottom of the pot can be detected and obtained, and then the embossing depths at different heights in the side wall area of the bottom of the pot can be monitored, realizing the detection of the embossing effect at different heights in the side wall area of the bottom of the pot. After obtaining the embossing depths at different heights in the side wall area of the bottom of the pot, the depth variance value of the embossing depths at different heights can be determined, and then it can be determined whether the embossing depths at different heights meet the requirements according to the depth variance value of the embossing depths at different heights.

[0057] Exemplarily, the different heights in the side wall area of the bottom of the pot can be embossing areas at heights of 10 mm, 30 mm, and 50 mm respectively from the side wall area of the bottom of the pot.

[0058] Exemplarily, when detecting the embossing depths at different heights in the side wall area of the bottom of the pot, automatic detection can be performed through a laser detection head.

[0059] S220. When the depth variance value of the embossing depths at different heights is greater than or equal to a preset depth variance value, a prompt message for adjusting the indenter in the sidewall area of the pot bottom is issued. When the depth variance value of the embossing depths at different heights is less than the preset depth variance value, a prompt message for adjusting the indenter in the sidewall area of the pot bottom is not issued, and embossing is performed on the horizontal area of the pot bottom and the sidewall area of the pot bottom.

[0060] After obtaining the depth variance value of the embossing depths at different heights, when the depth variance value of the embossing depths at different heights is greater than or equal to the preset depth variance value, it indicates that the uniformity of the embossing depths at different heights is insufficient. At this time, a prompt message for adjusting the indenter in the sidewall area of the pot bottom can be issued to improve the extrusion effect of the circumferential indenter 22 for embossing in the sidewall area of the pot bottom.

[0061] After obtaining the depth variance value of the embossing depths at different heights, when the depth variance value of the embossing depths at different heights is less than the preset depth variance value, it indicates that the uniformity of the embossing depths at different heights meets the requirements. A prompt message for adjusting the indenter in the sidewall area of the pot bottom can be not issued, and embossing on the horizontal area of the pot bottom and the sidewall area of the pot bottom can be continued to continue pot bottom embossing.

[0062] Exemplarily, the depth variance value of the embossing depths at different heights can be determined by an empirical value.

[0063] The beneficial effect of the above implementation method is that it can monitor the embossing depths at different heights in the sidewall area of the pot bottom, and can prompt for optimization and adjustment of the sidewall area of the pot bottom, improving the embossing uniformity at different heights in the sidewall area of the pot bottom.

[0064] In some implementation methods, in the above S120, reducing the pressure value of the first pressure value according to the first ratio value and reducing the pressure value of the second pressure value according to the second ratio value includes S121 to S122. The following will specifically describe S121 to S122.

[0065] S121. When the depth variance value of the embossing depths at different heights is less than the preset depth variance value, determine the maximum sidewall embossing depth at different heights in the sidewall area of the pot bottom, and determine the ratio of the maximum sidewall embossing depth to the second pressure value as the first ratio. Determine the maximum horizontal embossing depth of the horizontal area of the pot bottom, and determine the ratio of the maximum horizontal embossing depth to the first pressure value as the second ratio. Determine the ratio of the first ratio to the second ratio as the pressure adjustment ratio.

[0066] After obtaining the depth variance value of the embossing depth at different heights, when the depth variance value of the embossing depth at different heights is less than the preset depth variance value, it indicates that the embossing uniformity of the side wall area of the pot bottom is relatively high. The maximum side wall embossing depth at different heights in the side wall area of the pot bottom can be further determined, and the ratio of the maximum side wall embossing depth to the second pressure value is determined as the first ratio, which characterizes the relationship between the maximum side wall embossing depth and the second pressure value.

[0067] Meanwhile, the maximum horizontal embossing depth of the pot bottom area can be determined, and the ratio of the maximum horizontal embossing depth to the first pressure value is determined as the second ratio, which characterizes the relationship between the maximum horizontal embossing depth and the first pressure value.

[0068] After obtaining the first ratio and the second ratio, the ratio of the first ratio to the second ratio can be determined as the pressure adjustment ratio, which characterizes the relationship between the maximum horizontal embossing depth and the first pressure value, and the maximum side wall embossing depth and the second pressure value.

[0069] S122: Determine the ratio of the maximum first pressure value to the first pressure value as the first proportional value. Determine the product of the first proportional value and the pressure adjustment ratio as the second proportional value.

[0070] When the first pressure value is greater than the maximum first pressure value, at this time, the first pressure value needs to be adjusted. The ratio of the maximum first pressure value to the first pressure value can be determined as the first proportional value. Through the first proportional value, the first pressure value can be adjusted and reduced to the maximum first pressure value to ensure that the first pressure value does not exceed the threshold, ensuring the accuracy of the first pressure value.

[0071] Exemplarily, the maximum first pressure value can be an empirical value determined according to the pot bottoms of different materials and sizes.

[0072] After obtaining the first proportional value, the product of the first proportional value and the pressure adjustment ratio can be determined as the second proportional value, and then the second pressure value can be reduced according to the second proportional value, ensuring a reasonable adjustment of the second pressure value.

[0073] The beneficial effect of the above implementation manner is that the pressure adjustment ratio characterizes the relationship between the maximum horizontal embossing depth and the first pressure value, and the maximum side wall embossing depth and the second pressure value. By determining the product of the first proportional value and the pressure adjustment ratio as the second proportional value, a reasonable adjustment of the second pressure value is ensured, improving the effect of overall embossing control of the pot bottom.

[0074] Figure 5 This is a schematic flowchart of the third method for detecting the operating state of the pot bottom embossing device provided by the embodiments of the present application, as Figure 5As shown above, the above method further includes S310 to S320, which will be specifically described below.

[0075] S310. Obtain the material information of the pot body, detect the temperature value of the pot body through infrared, and obtain the pot body extrusion correction parameter corresponding to the material information and temperature value of the pot body.

[0076] In order to improve the embossing effect of the pot body, the material information of the pot body can be further obtained, the temperature value of the pot body can be detected through infrared, and the pot body extrusion correction parameter corresponding to the material information and temperature value of the pot body can be obtained. Furthermore, the pot body extrusion process can be controlled according to the pot body extrusion correction parameter.

[0077] Exemplarily, the pot body extrusion correction parameter table corresponding to the material information and temperature value of the pot body can be determined through empirical values, and then the pot body extrusion correction parameter corresponding to the material information and temperature value of the pot body can be determined by looking up the table.

[0078] Exemplarily, the pot body extrusion correction parameter can be 0.95, 0.9 or 0.85.

[0079] S320. Determine the product of the first ratio value, the pressure adjustment ratio value and the pot body extrusion correction parameter as the second ratio value.

[0080] After obtaining the pot body extrusion correction parameter, the product of the first ratio value, the pressure adjustment ratio value and the pot body extrusion correction parameter can be further determined as the second ratio value. The second ratio value characterizes the adjustment amplitude of the second pressure value in combination with the pot body extrusion correction parameter. Furthermore, the second pressure value can be adjusted according to the second ratio value.

[0081] The beneficial effect of the above implementation manner is that, in combination with the adjustment amplitude of the second pressure value by the pot body extrusion correction parameter, the pot body extrusion correction parameter characterizes the influence of the material information and temperature value of the pot body on the pot body extrusion process, and improves the control effect of the pot body embossing process.

[0082] Figure 6 It is a schematic flowchart of the fourth method for detecting the operation state of the bottom embossing device provided by the embodiment of the present application. As Figure 6 shown above, the above method further includes S410 to S420, which will be specifically described below.

[0083] S410. Obtain the bottom thickness value corresponding to the bottom horizontal area of the pot bottom and the side wall thickness value corresponding to the bottom side wall area of the pot bottom, and obtain the first mold temperature value of the mold area corresponding to the bottom horizontal area of the pot bottom and the second mold temperature value of the mold area corresponding to the bottom side wall area of the pot bottom through infrared detection.

[0084] In order to further improve the effect of embossing on the bottom of the pot, the bottom thickness value corresponding to the horizontal area of the bottom of the pot and the side wall thickness value corresponding to the side wall area of the bottom of the pot can be obtained, and then the embossing process can be controlled by the bottom thickness value corresponding to the horizontal area of the bottom of the pot and the side wall thickness value corresponding to the side wall area of the bottom of the pot.

[0085] In order to further improve the effect of embossing on the bottom of the pot, the first mold temperature value of the mold area corresponding to the horizontal area of the bottom of the pot and the second mold temperature value of the mold area corresponding to the side wall area of the bottom of the pot can also be obtained through infrared detection, and then the embossing process of the bottom of the pot can be controlled by the mold temperature during the embossing process of the bottom of the pot.

[0086] S420. Determine the first correction factor corresponding to the bottom thickness value and the first mold temperature value, and determine the second correction factor corresponding to the side wall thickness value and the second mold temperature value. Multiply the first ratio value by the first correction factor to adjust the first ratio value. Multiply the second ratio value by the second correction factor to adjust the second ratio value.

[0087] When adjusting the embossing process of the bottom of the pot, the first correction factor corresponding to the bottom thickness value and the first mold temperature value can be further determined, and the second correction factor corresponding to the side wall thickness value and the second mold temperature value can be determined. Furthermore, the embossing process of the bottom of the pot can be adjusted according to the first correction factor and the second correction factor, realizing the optimal control of the embossing process of the horizontal area of the bottom of the pot according to the bottom thickness value and the first mold temperature value.

[0088] Exemplarily, when determining the first correction factor corresponding to the bottom thickness value and the first mold temperature value, it can be determined through an empirical value table.

[0089] Exemplarily, when determining the second correction factor corresponding to the side wall thickness value and the second mold temperature value, it can be determined through an empirical value table.

[0090] When adjusting the embossing process of the bottom of the pot according to the first correction factor and the second correction factor, the first ratio value can be multiplied by the first correction factor to adjust the first ratio value, and at the same time, the second ratio value can be multiplied by the second correction factor to adjust the second ratio value, realizing the optimal control of the embossing process of the side wall area of the bottom of the pot according to the side wall thickness value and the second mold temperature value.

[0091] The beneficial effect of the above implementation method is that it can optimize the control of the embossing process of the horizontal area of the bottom of the pot according to the bottom thickness value and the first mold temperature value, and can optimize the control of the embossing process of the side wall area of the bottom of the pot according to the side wall thickness value and the second mold temperature value, improving the control effect of embossing on the horizontal area and the side wall area of the bottom of the pot.

[0092] Figure 7Schematic flowchart of the fourth method for detecting the operating state of the bottom pot embossing device provided by the embodiments of the present application, as shown in Figure 7 shown, the above method further includes S510 to S520, and the following is a specific description of S510 to S520.

[0093] S510. When the side wall area of the bottom pot is a planar structure, obtain the corresponding tilt angle value of the side wall area of the bottom pot, and obtain the side wall extrusion correction coefficient corresponding to the tilt angle value. When the side wall area of the bottom pot is a curved surface structure, obtain the corresponding maximum curvature value of the side wall area of the bottom pot, and obtain the side wall extrusion correction coefficient corresponding to the maximum curvature value.

[0094] When performing bottom pot embossing control, as shown in Figure 2 shown, when the side wall area of the bottom pot is a planar structure, the corresponding tilt angle value of the side wall area of the bottom pot can be obtained. Different tilt angles of the side wall area of the bottom pot have different influences on the extrusion of the side wall. Furthermore, the side wall extrusion correction coefficient corresponding to the tilt angle value can be obtained, and the bottom pot side wall extrusion process can be corrected according to the side wall extrusion correction coefficient corresponding to the tilt angle value.

[0095] Exemplarily, the side wall extrusion correction coefficient corresponding to the tilt angle value can be determined through an empirical value table corresponding to the tilt angle value and the side wall extrusion correction coefficient.

[0096] As shown in Figure 3 shown, when the side wall area of the bottom pot is a curved surface structure, obtain the corresponding maximum curvature value of the side wall area of the bottom pot, and different maximum curvature values corresponding to the side wall area of the bottom pot have different influences on the extrusion of the side wall. Furthermore, the side wall extrusion correction coefficient corresponding to the maximum curvature value can be obtained, and then the bottom pot side wall extrusion process can be corrected according to the side wall extrusion correction coefficient corresponding to the maximum curvature value, and the bottom pot side wall extrusion process can be corrected according to the side wall extrusion correction coefficient corresponding to the maximum curvature value.

[0097] Exemplarily, the side wall extrusion correction coefficient corresponding to the maximum curvature value can be determined through an empirical value table corresponding to the maximum curvature value.

[0098] S510. Multiply the second ratio value by the side wall extrusion correction coefficient to adjust the second ratio value.

[0099] After obtaining the side wall extrusion correction coefficient, the second ratio value can be multiplied by the side wall extrusion correction coefficient to adjust the second ratio value, so that the embossing process of the side wall can be controlled in combination with the side wall extrusion correction coefficient.

[0100] The beneficial effects of the above implementation method are that different inclination angles in the side wall area of the pot bottom have different degrees of influence on the extrusion of the side wall, and different maximum curvature values corresponding to the side wall area of the pot bottom have different degrees of influence on the extrusion of the side wall. The extrusion process of the pot bottom can be controlled according to the degree of influence of different inclination angles on the extrusion of the side wall and the degree of influence of different maximum curvature values on the extrusion of the side wall, improving the optimization effect of the extrusion process of the pot bottom.

[0101] Figure 8 The flowchart of the fourth method for detecting the operating state of the pot bottom embossing device provided by the embodiment of the present application is shown in Figure 8 As shown, the above method further includes S610 to S620, and the following is a specific description of S610 to S620.

[0102] S610. Obtain the embossing depth of the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom, and determine the depth variance value of the embossing depth of the transition area as the transition embossing depth variance value. Obtain the transition adjustment coefficient corresponding to the pot bottom material, and determine the product of the transition adjustment coefficient and the pressure difference as the transition pressure adjustment value.

[0103] When extruding the pot bottom, the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom may affect the embossing quality due to the bending of the pot bottom. Therefore, the embossing depth of the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom can be obtained, and further monitoring of the embossing quality can be carried out through the embossing depth of the transition area.

[0104] When monitoring the embossing process, the depth variance value of the embossing depth of the transition area can be determined as the transition embossing depth variance value, and the embossing quality of the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom can be detected according to the transition embossing depth variance value.

[0105] Exemplarily, the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom can be the transition area within the range of 5 mm to 20 mm on both sides of the boundary line between the horizontal area of the pot bottom and the side wall area of the pot bottom.

[0106] When controlling the embossing of the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom, different pot bottom materials have different bending characteristics. At this time, the transition adjustment coefficient corresponding to the pot bottom material can be further obtained. At the same time, the pressure difference between the first pressure value and the second pressure value will affect the bending state and material slip of the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom. At this time, the product of the transition adjustment coefficient and the pressure difference can be determined as the transition pressure adjustment value, and then the transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom can be controlled according to the transition pressure adjustment value.

[0107] S620. When the variance value of the transition embossing depth is greater than or equal to the preset variance value of the transition embossing depth, decrease the transition pressure adjustment value for the first pressure value and increase the transition pressure adjustment value for the second pressure value. When the variance value of the transition embossing depth is less than the preset variance value of the transition embossing depth, do not adjust the first pressure value and the second pressure value.

[0108] After obtaining the transition pressure adjustment value, when the variance value of the transition embossing depth is greater than or equal to the preset variance value of the transition embossing depth, it indicates that the embossing quality of the transition area is not good. At this time, the transition pressure adjustment value can be decreased for the first pressure value, so that the extrusion pressure on the bottom horizontal area of the pot can be appropriately reduced to avoid affecting the embossing process of the transition area. At the same time, the transition pressure adjustment value can be increased for the second pressure value to appropriately increase the extrusion pressure on the side wall area of the pot bottom, avoiding the too small pressure on the side wall area of the pot bottom resulting in poor extrusion effect on the side wall area of the pot bottom, thereby improving the embossing quality of the transition area.

[0109] When the variance value of the transition embossing depth is less than the preset variance value of the transition embossing depth, it indicates that the embossing quality of the transition area is better. At this time, the first pressure value and the second pressure value can be not adjusted.

[0110] The beneficial effect of the above implementation manner is that by monitoring the embossing quality of the transition area between the bottom horizontal area and the side wall area of the pot bottom, when the embossing quality of the transition area between the bottom horizontal area and the side wall area of the pot bottom is not good, the transition pressure adjustment value is decreased for the first pressure value, which can avoid appropriately reducing the extrusion pressure on the bottom horizontal area of the pot and avoid affecting the embossing process of the transition area. At the same time, the transition pressure adjustment value can be increased for the second pressure value to appropriately increase the extrusion pressure on the side wall area of the pot bottom, avoiding the too small pressure on the side wall area of the pot bottom resulting in poor extrusion effect on the side wall area of the pot bottom, and improving the embossing quality of the transition area.

[0111] Figure 9 The flow chart of the fourth method for detecting the operation state of the pot bottom embossing device provided by the embodiment of the present application is shown as Figure 9 shown. The above method further includes S710 to S720, and the following specifically describes S710 to S720.

[0112] S710. Determine the maximum embossing depth and the minimum embossing depth of the transition area, and determine the embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition area. And determine the minimum embossing depth at different heights of the side wall area of the pot bottom.

[0113] When controlling the embossing of the transition area, the maximum embossing depth and the minimum embossing depth of the transition area can be further determined, and the embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition area can be determined. The embossing depth difference characterizes the change range of the embossing depth of the transition area.

[0114] To further detect the transition region, the minimum embossing depth at different heights of the side wall region of the pot bottom can be determined. The minimum embossing depth at different heights of the side wall region of the pot bottom is the minimum embossing depth within the entire range of the side wall region of the pot bottom. Furthermore, the embossing quality can be evaluated based on the minimum embossing depth at different heights of the side wall region of the pot bottom.

[0115] S720: When both the minimum embossing depth of the transition region and the minimum embossing depth at different heights of the side wall region of the pot bottom are less than the preset minimum embossing depth, increase the transition pressure adjustment value for the second pressure value. When both the minimum embossing depth of the transition region and the minimum embossing depth at different heights of the side wall region of the pot bottom are greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition region is greater than or equal to the preset maximum embossing depth, decrease the transition pressure adjustment value for the second pressure value.

[0116] When evaluating the embossing quality of the transition region and the side wall region of the pot bottom, when both the minimum embossing depth of the transition region and the minimum embossing depth at different heights of the side wall region of the pot bottom are less than the preset minimum embossing depth, it indicates that the embossing depths of both the side wall region and the transition region of the pot bottom are too small. At this time, the transition pressure adjustment value can be increased for the second pressure value to ensure that both the minimum embossing depth of the transition region and the minimum embossing depth of the side wall region of the pot bottom meet the embossing depth requirements.

[0117] When evaluating the embossing quality of the transition region and the side wall region of the pot bottom, when both the minimum embossing depth of the transition region and the minimum embossing depth at different heights of the side wall region of the pot bottom are greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition region is greater than or equal to the preset maximum embossing depth, it indicates that the embossing depth of the transition region is too large, possibly due to the excessive second pressure value. At this time, the transition pressure adjustment value can be decreased for the second pressure value to reduce the embossing depth of the transition region and improve the embossing quality of the transition region.

[0118] The beneficial effect of the above implementation method is that it can comprehensively evaluate the embossing quality of the transition region and the side wall region of the pot bottom, avoid having an adverse impact on the embossing quality of the side wall region of the pot bottom when monitoring the embossing quality of the transition region alone, and improve the overall embossing quality of the side wall region and the transition region of the pot bottom.

[0119] In some implementation methods, the above method further includes: when the embossing depth difference is greater than or equal to the preset embossing depth difference, send a prompt message for prompting to improve the concentricity of embossing the pot bottom horizontal region and the side wall region of the pot bottom. When the embossing depth difference is greater than or equal to the preset embossing depth difference, do not send a prompt message for prompting to improve the concentricity of embossing the pot bottom horizontal region and the side wall region of the pot bottom.

[0120] When monitoring the difference in embossing depth, when the difference in embossing depth is greater than or equal to the preset difference in embossing depth, it indicates that the difference in embossing depth between the maximum embossing depth and the minimum embossing depth in the transition region is too large, which may be caused by poor concentricity of the die head that squeezes the bottom horizontal region and the bottom sidewall region of the pot bottom. Furthermore, a prompt message can be sent to prompt to improve the concentricity of embossing the bottom horizontal region and the bottom sidewall region of the pot bottom, so as to improve the embossing quality of the transition region.

[0121] When monitoring the difference in embossing depth, when the difference in embossing depth is greater than or equal to the preset difference in embossing depth, it indicates that the concentricity of the die head that squeezes the bottom horizontal region and the bottom sidewall region of the pot bottom is better. At this time, a prompt message for prompting to improve the concentricity of embossing the bottom horizontal region and the bottom sidewall region of the pot bottom is not sent.

[0122] The beneficial effect of the above implementation manner is that when the difference in embossing depth is greater than or equal to the preset difference in embossing depth, it indicates that the difference in embossing depth between the maximum embossing depth and the minimum embossing depth in the transition region is too large. By sending a prompt message to improve the concentricity of embossing the bottom horizontal region and the bottom sidewall region of the pot bottom, the embossing quality of the transition region can be improved.

[0123] The beneficial effect of the above implementation manner is also that by monitoring the concentricity of embossing the bottom horizontal region and the bottom sidewall region of the pot bottom through the transition region, compared with the overall monitoring of the bottom horizontal region and the bottom sidewall region of the pot bottom, the monitoring range of the bottom horizontal region and the bottom sidewall region of the pot bottom is reduced, and the accuracy of monitoring the concentricity of embossing the bottom horizontal region and the bottom sidewall region of the pot bottom is improved.

[0124] The embodiment of the present application also provides a device for detecting the operating state of a pot bottom embossing device, including a unit for executing the method described in any one of the above.

[0125] Figure 10 For the logical structure diagram of a device for detecting the operating state of a pot bottom embossing device provided by the embodiment of the present application, as Figure 10 shown, the device 4 of this embodiment includes a processing unit 41, a storage unit 42, and a transceiver unit 43. The processing unit 41 is used to process data, the storage unit 42 is used to store data, and the transceiver unit 43 is used to send and receive data. The processing unit 41, the storage unit 42, and the transceiver unit 43 cooperate with each other to implement the above method. The beneficial effects of the embodiment of the present application have been described in the above method and will not be elaborated here.

[0126] It should be noted that for the content such as information interaction and execution process between the above-mentioned devices / units, since it is based on the same concept as the method embodiment of the present application, for its specific functions and the technical effects brought, reference can be specifically made to the method embodiment part, and details will not be repeated here.

[0127] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into a processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiment, and details will not be repeated here.

[0128] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above method embodiments of the present application, a computer program can be used to instruct the relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the photographing device / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0129] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0130] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of this application.

[0131] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical or other forms.

[0132] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0133] The above-described embodiments are only used to illustrate the technical solutions of this application, rather than to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included in the protection scope of this application.

Claims

1. A method for detecting the operating status of a pan bottom embossing device, characterized in that: The method comprises: Obtaining a first pressure value for embossing the horizontal area of ​​the pot bottom and a second pressure value for embossing the side wall area of ​​the pot bottom; determining a difference between the first pressure value and the second pressure value as a pressure difference value; When the second pressure value is less than the preset second pressure value, the second pressure adjustment value is increased for the second pressure value; when the pressure difference value is less than the preset pressure difference value, the first pressure adjustment value is increased for the first pressure value; when the first pressure value is greater than the preset first pressure threshold value, the pressure value of the first pressure value is reduced according to the first proportional value, and the pressure value of the second pressure value is reduced according to the second proportional value; wherein the first proportional value is greater than the second proportional value.

2. The method according to claim 1, characterized in that The method further comprises: Obtaining the embossing depths of the side wall area of ​​the pot bottom at different heights, and determining the depth variance values ​​of the embossing depths at different heights; When the depth variance value of the embossing depth at different heights is greater than or equal to the preset depth variance value, a prompt message is issued to adjust the pressure head in the side wall area of ​​the bottom of the pot; when the depth variance value of the embossing depth at different heights is less than the preset depth variance value, no prompt message is issued to adjust the pressure head in the side wall area of ​​the bottom of the pot, and the horizontal area and the side wall area of ​​the bottom of the pot are embossed.

3. The method according to claim 2, characterized in that The first pressure value is reduced according to a first proportional value, and the second pressure value is reduced according to a second proportional value, including: When the depth variance value of the embossing depth at different heights is less than the preset depth variance value, the maximum side wall embossing depth of the side wall area of ​​the pot bottom at different heights is determined, and the ratio of the maximum side wall embossing depth to the second pressure value is determined as the first ratio; the maximum horizontal embossing depth of the horizontal area of ​​the pot bottom is determined, and the ratio of the maximum horizontal embossing depth to the first pressure value is determined as the second ratio; the ratio of the first ratio to the second ratio is determined as the pressure adjustment ratio; The ratio of the maximum first pressure value to the first pressure value is determined as a first proportional value. The product of the first proportional value and the pressure adjustment ratio is determined as a second proportional value.

4. The method according to claim 3, characterized in that The method further comprises: Obtaining the material information of the pot body, detecting the temperature value of the pot body by infrared, and obtaining the pot body extrusion correction parameters corresponding to the material information of the pot body and the pot body temperature value; The product of the first proportional value, the pressure adjustment ratio and the pot body extrusion correction parameter is determined as the second proportional value.

5. The method according to claim 4, characterized in that The method further comprises: Obtain a pot bottom thickness value corresponding to a horizontal area of ​​the pot bottom and a side wall thickness value corresponding to a side wall area of ​​the pot bottom, and obtain a first mold temperature value of a mold area corresponding to the horizontal area of ​​the pot bottom and a second mold temperature value of a mold area corresponding to the side wall area of ​​the pot bottom through infrared detection; Determine a first correction factor corresponding to the pot bottom thickness value and the first mold temperature value, and determine a second correction factor corresponding to the side wall thickness value and the second mold temperature value; multiply the first correction factor by the first proportional value to adjust the first proportional value; multiply the second correction factor by the second proportional value to adjust the second proportional value.

6. The method according to claim 5, characterized in that The method further comprises: When the side wall area of ​​the pot bottom is a plane structure, the inclination angle value corresponding to the side wall area of ​​the pot bottom is obtained, and the side wall extrusion correction coefficient corresponding to the inclination angle value is obtained; when the side wall area of ​​the pot bottom is a curved surface structure, the maximum curvature value corresponding to the side wall area of ​​the pot bottom is obtained, and the side wall extrusion correction coefficient corresponding to the maximum curvature value is obtained; The second ratio value is multiplied by the sidewall extrusion correction factor to adjust the second ratio value.

7. The method according to claim 6, characterized in that The method further comprises: Obtain the embossing depth of the transition area between the horizontal area of ​​the pot bottom and the side wall area of ​​the pot bottom, and determine the depth variance value of the embossing depth of the transition area as the transition embossing depth variance value; obtain the transition adjustment coefficient corresponding to the pot bottom material, and determine the product of the transition adjustment coefficient and the pressure difference as the transition pressure adjustment value; When the transition embossing depth variance value is greater than or equal to the preset transition embossing depth variance value, the transition pressure adjustment value is reduced for the first pressure value, and the transition pressure adjustment value is increased for the second pressure value; when the transition embossing depth variance value is less than the preset transition embossing depth variance value, the first pressure value and the second pressure value are not adjusted.

8. The method according to claim 7, characterized in that The method further comprises: Determine the maximum embossing depth and the minimum embossing depth of the transition area, and determine the embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition area; and determine the minimum embossing depth of the side wall area of ​​the bottom of the pot at different heights; When the minimum embossing depth of the transition zone and the minimum embossing depth of the side wall zone of the bottom of the pot at different heights are both less than the preset minimum embossing depth, the transition pressure adjustment value is increased for the second pressure value; when the minimum embossing depth of the transition zone and the minimum embossing depth of the side wall zone of the bottom of the pot at different heights are both greater than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition zone is greater than or equal to the preset maximum embossing depth, the transition pressure adjustment value is reduced for the second pressure value.

9. The method according to claim 8, characterized in that The method further comprises: When the embossing depth difference is greater than or equal to the preset embossing depth difference, a prompt message is issued to prompt the improvement of the concentricity of the embossing of the horizontal area and the side wall area of ​​the pot bottom; when the embossing depth difference is greater than or equal to the preset embossing depth difference, a prompt message is not issued to prompt the improvement of the concentricity of the embossing of the horizontal area and the side wall area of ​​the pot bottom.

10. A device for detecting the operating status of a pan bottom embossing device, characterized in that: Comprising means for performing the method according to any one of claims 1 to 9.

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