Wafer positioning device for gluing developing machine and use method of wafer positioning device

Abstract

The invention provides a wafer positioning device for a gluing developing machine and a use method of the wafer positioning device, and relates to the field of semiconductor manufacturing equipment. A positioning platform is connected to the middle of the top end face of the positioning base table, three sliding platforms are slidably connected to the outer side of the top end face of the positioning base table in an annular array mode, leveling vibration blocks are hinged to the center ends of the top end faces of the sliding platforms, and motor bases are fixedly installed at the centrifugal ends of the top end faces of the sliding platforms. A control motor is fixedly installed at the top of the motor base, an adjusting disc is rotationally connected into the positioning base table, and adjusting lead screws are rotationally connected to the front side and the rear side of the middle of the bottom end face of the positioning base table. The device optimizes the operation process, the adjustment mode of motor driving is simple and convenient, the labor intensity of operators is reduced, and the working efficiency is improved; the fan air cushion reduces the risk of wafer damage, reduces the rejection rate and cost, and solves the problems of low wafer positioning precision, poor compatibility and tedious operation.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer positioning device for a spin coater and a developing machine and a using method thereof. Background Art

[0002] In the complex process of semiconductor manufacturing, as a key pre-step, the spin coating process has extremely high requirements for the uniform coating of photoresist on the wafer surface, which is directly related to the success or failure of subsequent processes such as lithography and etching, and thus deeply affects the performance and yield of semiconductor devices.

[0003] Based on the above, the existing wafer positioning devices and their using methods have the following deficiencies: When facing wafers of different sizes, it is difficult to accurately adjust the distance between the support components, and there is a lack of an automatic leveling mechanism, resulting in large placement deviations and difficulty in leveling the wafers, seriously affecting the spin coating and developing accuracy and the yield rate. Its flexibility is poor. When processing wafers of different sizes, the device needs to be frequently replaced, and it is also impossible to flexibly adjust the height of the positioning platform or adopt effective auxiliary positioning means according to the process requirements, restricting the adaptability to different processes and wafer specifications. In addition, the operation process is cumbersome and relies on manual labor, which is prone to reduce work efficiency due to human errors. When placing the wafers, they are easily damaged by friction, increasing the scrap rate, and the device structure design is unreasonable, with poor stability, serious component wear, and large equipment impact, resulting in a short service life and being unfavorable for the long-term benefit improvement of the enterprise. Summary of the Invention

[0004] Embodiments of the present disclosure relate to a wafer positioning device for a spin coater and a developing machine and a using method thereof, which optimize the operation process. The adjustment method driven by a motor is simple and convenient, reducing the labor intensity of operators and improving work efficiency; the air cushion of the blower reduces the risk of wafer damage, reducing the scrap rate and cost.

[0005] In the first aspect of the present disclosure, there is provided a wafer positioning device for a spin coater and a developing machine and a using method thereof, specifically including: a positioning base; the positioning base is fixedly installed on the tabletop of the spin coater and a developing machine. In the middle of the top end face of the positioning base, there is a connected positioning platform. On the outer side of the top end face of the positioning base, three sliding platforms are slidably connected in an annular array. On the centripetal end of the top end face of the sliding platform, there is a hinged leveling trembler. On the centrifugal end of the top end face of the sliding platform, there is a fixedly installed motor base. On the top of the motor base, there is a fixedly installed control motor. Inside the positioning base, there is a rotatably connected adjusting disc. In the motor installation groove in the middle of the front side wall of the positioning base, there is a fixedly installed driving motor. On the front and back sides in the middle of the bottom end face of the positioning base, there is a rotatably connected adjusting lead screw. At the rear side in the middle of the bottom end face of the positioning base, there is a fixedly installed adjusting motor. The top driving shaft of the adjusting motor is connected to the bottom of the adjusting lead screw at the rear side of the bottom of the positioning base.

[0006] Further, three inverted "T"-shaped guiding chutes are arranged in an annular array on the top end face of the positioning base. An inverted "T"-shaped sliding platform is slidably connected in the guiding chutes. A circular inner groove is formed in the middle of the top end face of the positioning base. The top of the inner groove is stepped, and the positioning platform is fitted into the top of the inner groove.

[0007] Further, adjustment threaded grooves are equidistantly arranged on the bottom end face of the sliding platform. A guiding through hole is fixedly installed in the middle of the top end face of the sliding platform. Two spring bases are symmetrically arranged on the centripetal end of the top end face of the sliding platform, and a return spring is fixedly connected to the top of the spring bases.

[0008] Further, two limiting plates are symmetrically installed on the top of the motor base. Through holes are formed in both the upper and lower sides of the limiting plates. One end of the control motor facing the center of the positioning base is fixedly connected with a control head. An "S"-shaped reciprocating guiding groove is formed in the outer side wall of the control head. Both ends of the control head are rotatably connected in the through holes on the upper side of the limiting plates on the top of the motor base.

[0009] Further, a counterpoint card slot is formed in a stepped manner on the top end face of the centripetal side of the leveling trembler. A connecting wire is fixedly connected to the centrifugal side of the bottom end face of the leveling trembler. The connecting wire is slidably connected in the guiding through hole on the top of the sliding platform. The end of the connecting wire is fixedly connected with a reciprocating sliding rod. The reciprocating sliding rod is slidably connected in the through holes on the lower side of the two limiting plates on the top of the motor base. A sliding guiding head is fixedly connected to the middle of the top of the reciprocating sliding rod. The sliding guiding head is slidably connected in the reciprocating guiding groove in the outer side wall of the control head connected to the control motor.

[0010] Further, spiral adjustment thread protrusions are arranged on the top end face of the adjustment disc. The adjustment thread protrusions are matched with the adjustment threaded grooves at the bottom of the sliding platform. A driven gear is arranged on the outer side of the bottom of the adjustment disc. A driving bevel gear is fixedly connected to the rear end of the driving shaft of the driving motor. The driving bevel gear and the driven gear are vertically meshed at a right angle.

[0011] Further, pressure relief grooves are arranged in a "rice" shape on the top end face of the positioning platform. A gas conduit is fixedly connected to the bottom of the middle where the pressure relief grooves intersect. A blower is fixedly connected to the bottom of the gas conduit. Adjusting vertical rods are fixedly connected to the front and rear ends of the bottom of the positioning platform. An adjusting screw rod is threadedly connected to the middle of the bottom end face of the adjusting vertical rod. Guiding vertical rods are symmetrically installed at the left and right ends of the bottom of the positioning platform. The bottoms of the guiding vertical rods are slidably connected in the bottom end face of the positioning base.

[0012] Further, a connecting base plate is fixedly connected to the bottom of the adjusting screw rod. The connecting base plate is rotatably connected in the bottom end face of the positioning base. A transmission gear is fixedly connected to the bottommost part of the adjusting screw rod. The transmission gears at the bottoms of the two adjusting screw rods are connected by a rack belt.

[0013] The present invention discloses a method for using a wafer positioning device for a spin coater and developer, comprising the following steps: 1). First, start the driving motor, and its driving shaft drives the driving bevel gear to rotate. Since the driving bevel gear is vertically meshed with the driven gear at a right angle, the driven gear rotates accordingly, thereby driving the adjusting disc to rotate. As the adjusting disc rotates, the spiral adjusting thread protrusions on its top interact with the adjusting thread grooves at the bottom of the sliding platform, causing the sliding platform to slide along the guiding chute. By observing the position of the sliding platform, adjust the spacing to a suitable size for the wafer, ensuring that when the wafer is placed, its edge can be stably supported by the three sliding platforms; 2). Then, carefully place the wafer on the supporting surface formed by the positioning platform and the three sliding platforms. During the placement process, the edge of the wafer will contact the alignment card slot on the top end face of the centripetal side of the leveling trembler; 3). By starting the control motor, its driving shaft drives the control head to rotate. An "S"-shaped reciprocating guide groove is provided on the outer side wall of the control head, and the sliding guide head is slidably connected in this reciprocating guide groove. As the control head rotates, it drives the sliding guide head to perform a reciprocating motion in the reciprocating guide groove, and then drives the leveling trembler to swing up and down through the reciprocating slide rod and the connecting wire. During this process, the leveling trembler will finely adjust the placement angle of the wafer to compensate for the slight inclination that may occur during the placement of the wafer until the wafer is in a horizontal state; 4). According to the specific requirements of the spin coating and developing process, start the adjusting motor. The top driving shaft of the adjusting motor drives the adjusting screw rod at the rear side of the bottom of the positioning base to rotate. Since the transmission gears at the bottom ends of the two adjusting screw rods are connected by a rack belt, when one adjusting screw rod rotates, the other adjusting screw rod will also rotate synchronously. When the adjusting screw rod rotates, a relative movement will occur between the part threadedly connected to the bottom end face of the adjusting vertical rod, thereby realizing the lifting of the positioning platform. By observing the height of the positioning platform and the distance from the spin coating and developing components, adjust the positioning platform to a suitable height; 5). Then start the blower, and the gas enters the pressure relief grooves formed in a "rice" shape on the top end face of the positioning platform through the gas conduit. The gas flows out from the pressure relief grooves, forming an air cushion between the wafer and the positioning platform. This air cushion can effectively reduce the friction between the wafer and the positioning platform, helping the wafer to move and position more smoothly on the positioning platform, and further improving the accuracy of wafer positioning. 6). Finally, after completing all the above adjustments and positioning operations, ensure that the wafer is in a stable, horizontal and accurate position. At this time, the spin coater and developer can be started to perform the spin coating and developing process operations on the wafer.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. With its innovative design, the wafer positioning device has achieved remarkable results in improving processing accuracy. By coordinating the driving motor, adjusting disc, and sliding platform, it can precisely adjust the distance to adapt to wafers of different sizes. It also controls the motor to drive the leveling trembler to automatically level, and the adjusting motor to achieve precise lifting of the positioning platform, comprehensively ensuring accurate wafer positioning, laying a solid foundation for the high-precision process of coating and developing, and significantly improving processing accuracy and product yield.

[0015] 2. In terms of enhancing equipment compatibility, the device can flexibly adjust the distance between the sliding platforms to adapt to various wafer sizes, reducing the frequency of replacing the positioning device due to size changes. Its adjustable positioning platform height and the auxiliary positioning function of the air cushion of the blower can meet the requirements of various coating and developing processes, significantly enhancing the adaptability of the equipment to different processes and wafer specifications.

[0016] 3. In terms of comprehensive benefits, the device optimizes the operation process. The adjustment method driven by the motor is simple and convenient, reducing the labor intensity of operators and improving work efficiency. The air cushion of the blower reduces the risk of wafer damage, lowering the scrap rate and cost. At the same time, the stable structural design and good motion stability reduce component wear and equipment impact, extending the service life of the equipment and bringing long-term benefits to the enterprise. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0018] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0019] In the drawings: Figure 1 is the axonometric top view structural schematic diagram of the wafer positioning device and its usage method of the embodiment of the present invention.

[0020] Figure 2 is the axonometric bottom view structural schematic diagram of the wafer positioning device and its usage method of the embodiment of the present invention.

[0021] Figure 3 is the overall disassembled axonometric top view structural schematic diagram of the wafer positioning device and its usage method of the embodiment of the present invention.

[0022] Figure 4 is the axonometric top view and axonometric bottom view structural schematic diagram of the wafer positioning device and its usage method of the embodiment of the present invention.

[0023] Figure 5 is the sectional bottom view structural schematic diagram of the positioning base of the wafer positioning device and its usage method of the embodiment of the present invention.

[0024] Figure 6It is a schematic axonometric sectional view of the positioning base of the wafer positioning device and its usage method according to an embodiment of the present invention.

[0025] Figure 7 It is a schematic connection structure diagram of the sliding platform, leveling trembler and control motor of the wafer positioning device and its usage method according to an embodiment of the present invention.

[0026] Figure 8 It is a schematic split structure diagram of the positioning platform and adjusting lead screw of the wafer positioning device and its usage method according to an embodiment of the present invention.

[0027] List of reference numerals 1. Positioning base; 101. Guide chute; 102. Motor mounting groove; 103. Inner groove; 2. Positioning platform; 201. Pressure relief groove; 202. Gas conduit; 203. Adjusting vertical rod; 204. Guide vertical rod; 3. Sliding platform; 301. Adjusting thread groove; 302. Guide perforation; 303. Spring base; 4. Return spring; 5. Leveling trembler; 501. Alignment card slot; 502. Connecting wire; 503. Reciprocating slide bar; 504. Sliding guide head; 6. Motor base; 601. Limiting plate; 7. Control motor; 701. Control head; 702. Reciprocating guide groove; 8. Adjusting disc; 801. Adjusting thread protrusion; 802. Driven gear; 9. Driving motor; 901. Driving bevel gear; 10. Adjusting motor; 11. Adjusting lead screw; 1101. Connecting base plate; 1102. Driving gear; 12. Rack belt; 13. Fan. Detailed implementation manners

[0028] In order to make the objectives, solutions and advantages of the technical solutions of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments of the present invention. Unless otherwise specified, the terms used herein have the ordinary meanings in the art. The same reference numerals in the drawings represent the same components.

[0029] Embodiment 1: Please refer to Figures 1 to 8 as shown in The present invention provides a wafer positioning device for a spin coater / developer and its usage method, including a positioning base 1; the positioning base 1 is fixedly installed on the tabletop of the spin coater / developer, a positioning platform 2 is connected to the middle of the top end face of the positioning base 1, and three sliding platforms 3 are slidably connected in an annular array on the outer side of the top end face of the positioning base 1. A leveling trembler 5 is hinged to the centripetal end of the top end face of the sliding platform 3, a motor base 6 is fixedly installed at the centrifugal end of the top end face of the sliding platform 3, a control motor 7 is fixedly installed on the top of the motor base 6, an adjusting disc 8 is rotatably connected inside the positioning base 1, a driving motor 9 is fixedly installed in the motor installation groove 102 in the middle of the front side wall of the positioning base 1, and adjusting lead screws 11 are rotatably connected to the front and back sides of the middle of the bottom end face of the positioning base 1. An adjusting motor 10 is fixedly installed at the rear side of the middle of the bottom end face of the positioning base 1, and the top driving shaft of the adjusting motor 10 is connected to the bottom of the adjusting lead screw 11 at the rear side of the bottom of the positioning base 1.

[0030] Among them, three inverted "T"-shaped guiding chutes 101 are arranged in an annular array on the top end face of the positioning base 1, an inverted "T"-shaped sliding platform 3 is slidably connected in the guiding chutes 101, a circular inner groove 103 is opened in the middle of the top end face of the positioning base 1, the top of the inner groove 103 is stepped, and the positioning platform 2 is fitted into the top of the inner groove 103.

[0031] Among them, adjusting threaded grooves 301 are equidistantly opened on the bottom end face of the sliding platform 3, a guiding perforation 302 is fixedly installed in the middle of the top end face of the sliding platform 3, and two spring bases 303 are symmetrically arranged at the centripetal end of the top end face of the sliding platform 3. A return spring 4 is fixedly connected to the top of the spring base 303.

[0032] Among them, a spiral adjusting thread projection 801 is arranged on the top end face of the adjusting disc 8, the adjusting thread projection 801 is matched with the adjusting threaded groove 301 at the bottom of the sliding platform 3, a driven gear 802 is arranged on the outer side of the bottom of the adjusting disc 8, the rear end of the driving shaft of the driving motor 9 is fixedly connected with a driving bevel gear 901, and the driving bevel gear 901 and the driven gear 802 are vertically meshed at a right angle.

[0033] With the above technical solution, by driving the engagement of the driving bevel gear 901 at the end of the driving shaft of the driving motor 9 and the driven gear 802, the adjustment disc 8 is controlled to rotate. Thus, when the adjustment disc 8 rotates, through the cooperation of the adjustment thread protrusions 801 on the top of the adjustment disc 8 and the adjustment thread grooves 301 at the bottoms of the three sliding platforms 3, the three sliding platforms 3 are simultaneously controlled to move closer to or away from each other, so that the sliding platforms 3 slide along the guiding sliding grooves 101. The advantage of this is that the distance between the three sliding platforms 3 can be flexibly and accurately adjusted according to the requirements of wafers of different sizes, ensuring the positioning accuracy when the wafers are placed, improving the compatibility of the positioning device with wafers of different specifications, reducing the problem of inaccurate positioning caused by wafer size differences, and thus enhancing the processing accuracy of the spin coater / developer for various wafers.

[0034] Among them, two limiting plates 601 are symmetrically installed on the top of the motor base 6. Through holes are opened on both the upper and lower sides of the limiting plates 601. One end of the control motor 7 facing the center of the positioning base 1 is fixedly connected with a control head 701. A reciprocating guide groove 702 in an "S" shape is opened on the outer side wall of the control head 701. Both ends of the control head 701 are rotatably connected in the through holes on the upper sides of the limiting plates 601 on the top of the motor base 6.

[0035] Among them, on the top end face of the centripetal side of the leveling trembler 5, a counterpoint card slot 501 is formed in a stepped shape. On the centrifugal side of the bottom end face of the leveling trembler 5, a connecting wire 502 is fixedly connected. The connecting wire 502 is slidably connected in the guiding through hole 302 on the top of the sliding platform 3. The end of the connecting wire 502 is fixedly connected with a reciprocating sliding rod 503. The reciprocating sliding rod 503 is slidably connected in the through holes on the lower sides of the two limiting plates 601 on the top of the motor base 6. In the middle of the top of the reciprocating sliding rod 503, a sliding guide head 504 is fixedly connected. The sliding guide head 504 is slidably connected in the reciprocating guide groove 702 on the outer side wall of the control head 701 connected to the control motor 7.

[0036] With the above technical solution, by controlling the operation of the motor 7, its drive shaft drives the control head 701 to rotate. An "S"-shaped reciprocating guide groove 702 is formed in the outer side wall of the control head 701, and the sliding guide head 504 is slidably connected in the reciprocating guide groove 702. The sliding guide head 504 is fixedly connected to the middle of the top of the reciprocating slide bar 503. The reciprocating slide bar 503 is also slidably connected in the through holes under the two limiting plates 601 at the top of the motor base 6. The end of the connecting wire 502 is fixedly connected to the reciprocating slide bar 503. The connecting wire 502 is slidably connected in the guiding through hole 302 at the top of the sliding platform 3. The centrifugal side of the bottom end face of the leveling trembler 5 is fixedly connected to the connecting wire 502. Therefore, when the control head 701 rotates, it drives the sliding guide head 504 to reciprocate in the reciprocating guide groove 702, and then drives the leveling trembler 5 to swing up and down through the reciprocating slide bar 503 and the connecting wire 502. The advantage is that when the wafer is placed on the positioning device, the up-and-down swing of the leveling trembler 5 can finely adjust the placement angle of the wafer, compensate for the possible slight inclination during the placement process of the wafer, ensure that the wafer is in a horizontal state, provide a more stable basis for the subsequent coating and developing processes, improve the uniformity of coating and developing, and ensure the quality of wafer processing.

[0037] Among them, a pressure relief groove 201 is formed in a "rice" shape on the top end face of the positioning platform 2. A gas conduit 202 is fixedly connected to the bottom of the intersection of the pressure relief grooves 201. A blower 13 is fixedly connected to the bottom of the gas conduit 202. The front and rear ends of the bottom of the positioning platform 2 are fixedly connected to adjusting vertical rods 203. An adjusting screw rod 11 is threadedly connected to the middle of the bottom end face of the adjusting vertical rod 203. Guide vertical rods 204 are symmetrically installed at the left and right ends of the bottom of the positioning platform 2. The bottom of the guide vertical rod 204 is slidably connected in the bottom end face of the positioning base 1.

[0038] Among them, a connecting base plate 1101 is fixedly connected to the bottom of the adjusting screw rod 11. The connecting base plate 1101 is rotatably connected in the bottom end face of the positioning base 1. A transmission gear 1102 is fixedly connected to the bottommost part of the adjusting screw rod 11. The transmission gears 1102 at the bottom ends of the two adjusting screw rods 11 are connected by a rack belt 12.

[0039] With the above technical solution, by turning on the adjustment motor 10, the drive shaft at its top drives the adjustment screw rod 11 at the rear side of the bottom of the positioning base 1 to rotate. Since the transmission gears 1102 at the bottom ends of the two adjustment screw rods 11 are connected by a rack belt 12, when one adjustment screw rod 11 rotates, the other adjustment screw rod 11 will also rotate synchronously. When the adjustment screw rod 11 rotates, relative movement will occur between the threaded connection part in the bottom end face of the adjustment vertical rod 203, thereby realizing the lifting of the positioning platform 2. The guiding vertical rods 204 symmetrically installed at the left and right ends of the bottom of the positioning platform 2 are slidably connected to the bottom end face of the positioning base 1, playing a guiding role to ensure the stable lifting of the positioning platform 2. The advantage of such an operation is that the height of the positioning platform 2 can be precisely adjusted according to different process requirements, meeting the requirements for different distances between the wafer and the coating and developing components during the coating and developing process, improving the adaptability of the device under different processes, helping to optimize the coating and developing effects, and enhancing the yield rate of wafer processing. By turning on the blower 13, the gas enters the pressure relief grooves 201 in the shape of a "rice" character on the top end face of the positioning platform 2 through the gas conduit 202, and the gas flows out from the pressure relief grooves 201, forming an air cushion between the wafer and the positioning platform 2. The advantage is that this air cushion can effectively reduce the friction between the wafer and the positioning platform 2, avoiding scratches or damages on the wafer surface due to friction during the placement and positioning of the wafer, and also helping the wafer to move and position more stably on the positioning platform 2, further improving the quality and accuracy of wafer processing.

[0040] The present invention discloses a usage method of a wafer positioning device for a coating and developing machine, including the following steps: 1). First, turn on the drive motor 9, and its drive shaft drives the drive bevel gear 901 to rotate. Since the drive bevel gear 901 is vertically meshed with the driven gear 802 at a right angle of ninety degrees, the driven gear 802 rotates accordingly, and then drives the adjustment disk 8 to rotate. As the adjustment disk 8 rotates, the spiral adjustment thread protrusions 801 on its top interact with the adjustment thread grooves 301 at the bottom of the sliding platform 3, causing the sliding platform 3 to slide along the guiding chute 101. By observing the position of the sliding platform 3, adjust the spacing suitable for the wafer size to ensure that when the wafer is placed, its edge can be stably supported by the three sliding platforms 3; 2). Then carefully place the wafer on the supporting surface formed by the positioning platform 2 and the three sliding platforms 3. During the placement process, the edge of the wafer will contact the alignment card slot 501 on the top end face of the centripetal side of the leveling trembler 5. 3). By turning on the control motor 7, its drive shaft drives the control head 701 to rotate. An "S"-shaped reciprocating guide groove 702 is formed in the outer side wall of the control head 701. The sliding guide head 504 is slidably connected in the reciprocating guide groove 702. As the control head 701 rotates, it drives the sliding guide head 504 to perform reciprocating motion in the reciprocating guide groove 702. Then, through the reciprocating slide rod 503 and the connecting wire 502, the leveling trembler 5 is driven to swing up and down. During this process, the leveling trembler 5 will finely adjust the placement angle of the wafer to compensate for the possible slight inclination during the placement of the wafer until the wafer is in a horizontal state; 4). According to the specific requirements of the photoresist coating and developing process, turn on the adjusting motor 10. The top drive shaft of the adjusting motor 10 drives the adjusting screw rod 11 at the rear side of the bottom of the positioning base 1 to rotate. Since the transmission gears 1102 at the bottom ends of the two adjusting screw rods 11 are connected by a rack belt 12, when one adjusting screw rod 11 rotates, the other adjusting screw rod 11 will also rotate synchronously. When the adjusting screw rod 11 rotates, relative movement will occur in the part that is threadedly connected to the bottom end face of the adjusting vertical rod 203, thereby realizing the lifting of the positioning platform 2. By observing the height of the positioning platform 2 and the distance from the photoresist coating and developing components, the positioning platform 2 is adjusted to an appropriate height; 5). Then turn on the blower 13. The gas enters the pressure relief grooves 201 formed in a "rice" shape on the top end face of the positioning platform 2 through the gas conduit 202. The gas flows out from the pressure relief grooves 201, forming an air cushion between the wafer and the positioning platform 2. This air cushion can effectively reduce the friction between the wafer and the positioning platform 2, helping the wafer to move and be positioned more smoothly on the positioning platform 2, and further improving the accuracy of wafer positioning; 6). Finally, after completing all the above adjustments and positioning operations, ensure that the wafer is in a stable, horizontal and accurately positioned state. At this time, the photoresist coater and developer can be started to perform photoresist coating and developing process operations on the wafer.

[0041] Specific usage and function of this embodiment: In the present invention, first, the driving motor 9 is turned on, and its driving shaft drives the driving bevel gear 901 to rotate. Since the driving bevel gear 901 is vertically meshed with the driven gear 802 at a right angle of 90 degrees, the driven gear 802 rotates accordingly, and then drives the adjusting disc 8 to rotate. As the adjusting disc 8 rotates, the spiral adjusting thread protrusions 801 on its top interact with the adjusting thread grooves 301 at the bottom of the sliding platform 3, causing the sliding platform 3 to slide along the guiding chute 101. By observing the position of the sliding platform 3, the spacing suitable for the wafer size is adjusted to ensure that when the wafer is placed, its edge can be stably supported by the three sliding platforms 3. Then, the wafer is carefully placed on the supporting surface formed by the positioning platform 2 and the three sliding platforms 3. During the placement process, the edge of the wafer will contact the alignment card slot 501 on the top end face of the centripetal side of the leveling trembler 5. By turning on the control motor 7, its driving shaft drives the control head 701 to rotate. A reciprocating guide groove 702 in the shape of an "S" is provided in the outer wall of the control head 701, and the sliding guide head 504 is slidably connected in this reciprocating guide groove 702. As the control head 701 rotates, it drives the sliding guide head 504 to perform a reciprocating motion in the reciprocating guide groove 702, and then drives the leveling trembler 5 to swing up and down through the reciprocating slide rod 503 and the connecting wire 502. During this process, the leveling trembler 5 will finely adjust the placement angle of the wafer to compensate for the possible slight inclination during the placement of the wafer until the wafer is in a horizontal state. According to the specific requirements of the photolithography process, the adjusting motor 10 is turned on, and the top driving shaft of the adjusting motor 10 drives the adjusting screw 11 at the rear side of the bottom of the positioning base 1 to rotate. Since the transmission gears 1102 at the bottom ends of the two adjusting screws 11 are connected by a rack belt 12, when one adjusting screw 11 rotates, the other adjusting screw 11 will also rotate synchronously. When the adjusting screw 11 rotates, a relative movement will occur in the part threadedly connected to the bottom end face of the adjusting vertical rod 203, thereby realizing the lifting of the positioning platform 2. By observing the height of the positioning platform 2 and the distance from the photolithography and developing components, the positioning platform 2 is adjusted to an appropriate height. Then, the blower 13 is turned on, and the gas enters the pressure relief grooves 201 in the shape of a "rice" character on the top end face of the positioning platform 2 through the gas conduit 202. The gas flows out from the pressure relief grooves 201, forming an air cushion between the wafer and the positioning platform 2. This air cushion can effectively reduce the friction between the wafer and the positioning platform 2, helping the wafer to move and be positioned more smoothly on the positioning platform 2, and further improving the accuracy of wafer positioning. After completing all the above adjustments and positioning operations, ensure that the wafer is in a stable, horizontal and accurate position. At this time, the photolithography machine can be started to perform the photolithography and developing process operations on the wafer.

[0042] The above is only an exemplary embodiment of the present invention and is not used to limit the protection scope of the present invention. The protection scope of the present invention is determined by the appended claims.

Claims

1. A wafer positioning device for a glue coating and developing machine, characterized in that: It includes a positioning base; the positioning base is fixedly installed on the table top of the glue coating and developing machine, a positioning platform is connected to the middle of the top end surface of the positioning base, three sliding platforms are slidably connected to the outer side of the top end surface of the positioning base in a circular array, a leveling vibrator block is hinged on the centrifugal end of the top end surface of the sliding platform, a motor base is fixedly installed at the centrifugal end of the top end surface of the sliding platform, a control motor is fixedly installed on the top of the motor base, an adjusting disk is rotatably connected inside the positioning base, a driving motor is fixedly installed in the motor mounting groove in the middle of the front side wall of the positioning base, an adjusting screw is rotatably connected to the front and rear sides in the middle of the bottom end surface of the positioning base, an adjusting motor is fixedly installed on the rear side of the middle of the bottom end surface of the positioning base, and the top driving shaft of the adjusting motor is connected to the bottom of the adjusting screw on the rear side of the bottom of the positioning base.

2. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: The top end surface of the positioning base is provided with three inverted "T"-shaped guide grooves in a circular array, and an inverted "T"-shaped sliding platform is slidably connected in the guide groove. A circular inner groove is provided in the middle of the top end surface of the positioning base, and the top of the inner groove is step-shaped, and the positioning platform is embedded in the top of the inner groove.

3. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: The bottom end face of the sliding platform is provided with adjusting thread grooves at medium distances, the middle of the top end face of the sliding platform is fixedly provided with a guide through hole, the top end face of the sliding platform is symmetrically provided with two spring bases at the center end, and the top of the spring base is fixedly connected with a reset spring.

4. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: Two limit plates are symmetrically installed on the top of the motor base, and through circular holes are opened on the upper and lower sides of the limit plates. A control head is fixedly connected to one end of the control motor facing the center of the positioning base, and an "S"-shaped reciprocating guide groove is opened in the outer wall of the control head. The two ends of the control head are rotatably connected to the through circular holes on the upper side of the limit plate on the top of the motor base.

5. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: The top end surface of the centripetal side of the leveling tremor block is provided with a positioning slot in a stepped shape, and the bottom end surface of the leveling tremor block is fixedly connected to a connecting wire on the centrifugal side, and the connecting wire is slidably connected to the guide through hole on the top of the sliding platform, and the end of the connecting wire is fixedly connected to a reciprocating slide rod, and the reciprocating slide rod is slidably connected to the through circular holes on the lower sides of the two limit plates on the top of the motor base, and a sliding guide head is fixedly connected to the middle of the top of the reciprocating slide rod, and the sliding guide head is slidably connected to the reciprocating guide groove in the outer side wall of the control head connected to the control motor.

6. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: A spiral adjusting thread protrusion is provided on the top end surface of the adjusting disc, and the adjusting thread protrusion matches the adjusting thread groove at the bottom of the sliding platform. A driven gear is provided on the outer side of the bottom of the adjusting disc, and a driving bevel gear is fixedly connected to the rear end of the driving shaft of the driving motor. The driving bevel gear and the driven gear are vertically meshed and connected at ninety degrees.

7. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: A pressure relief groove is provided in the shape of a "M" on the top end surface of the positioning platform, a gas duct is fixedly connected to the bottom at the middle where the pressure relief grooves intersect, a fan is fixedly connected to the bottom of the gas duct, an adjustment vertical rod is fixedly connected to the front and rear ends of the bottom of the positioning platform, an adjustment screw is threadedly connected to the bottom end surface of the adjustment vertical rod, guide vertical rods are symmetrically installed on the left and right ends of the bottom of the positioning platform, and the bottom of the guide vertical rod is slidably connected to the bottom end surface of the positioning base.

8. A wafer positioning device for a glue coating and developing machine as claimed in claim 1, characterized in that: The bottom of the adjusting screw is fixedly connected with a connecting base, which is rotatably connected to the bottom end surface of the positioning base. The bottom of the adjusting screw is fixedly connected with a transmission gear, and the transmission gears at the bottom ends of the two adjusting screws are connected by a rack belt.

9. A method for using a wafer positioning device for a glue coating and developing machine as claimed in claims 1 to 8, characterized in that: The following steps are involved: 1). First, turn on the drive motor, and its drive shaft drives the drive bevel gear to rotate. Since the drive bevel gear and the driven gear are vertically meshed at 90 degrees, the driven gear rotates accordingly, thereby driving the adjustment disc to rotate. As the adjustment disc rotates, the spiral adjustment thread protrusion on the top interacts with the adjustment thread groove at the bottom of the sliding platform, so that the sliding platform slides along the guide groove. By observing the position of the sliding platform, adjust it to a spacing suitable for the wafer size to ensure that when the wafer is placed, its edge can be stably supported by the three sliding platforms; 2). Then carefully place the wafer on the support surface formed by the positioning platform and the three sliding platforms. During the placement process, the edge of the wafer will contact the alignment groove on the top end surface of the centripetal side of the leveling block; 3). By turning on the control motor, its driving shaft drives the control head to rotate. An "S"-shaped reciprocating guide groove is opened in the outer wall of the control head. The sliding guide head is slidably connected in the reciprocating guide groove. As the control head rotates, the sliding guide head is driven to reciprocate in the reciprocating guide groove, and then the reciprocating slide rod and the connecting wire drive the leveling vibration block to swing up and down. In this process, the leveling vibration block will fine-tune the placement angle of the wafer to compensate for the slight tilt that may occur during the placement process of the wafer until the wafer is in a horizontal state; 4). According to the specific requirements of the coating and developing process, the adjusting motor is turned on. The top driving shaft of the adjusting motor drives the adjusting screw at the rear side of the bottom of the positioning base to rotate. Since the transmission gears at the bottom ends of the two adjusting screws are connected by a rack belt, when one adjusting screw rotates, the other adjusting screw will also rotate synchronously. When the adjusting screw rotates, the part connected with the threaded part of the bottom end face of the adjusting vertical rod will produce relative movement, thereby realizing the lifting and lowering of the positioning platform. By observing the height of the positioning platform and the distance between the positioning platform and the coating and developing components, the positioning platform is adjusted to a suitable height; 5). Then turn on the fan, and the gas enters the "M"-shaped pressure relief groove on the top end surface of the positioning platform through the gas duct. The gas flows out from the pressure relief groove and forms a layer of air cushion between the wafer and the positioning platform. This layer of air cushion can effectively reduce the friction between the wafer and the positioning platform, which helps the wafer to move and position more smoothly on the positioning platform, further improving the accuracy of wafer positioning; 6). Finally, after completing all the above adjustment and positioning operations, ensure that the wafer is in a stable, horizontal and accurately positioned state. At this time, the coating and developing machine can be started to perform the coating and developing process operations on the wafer.

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