Liquid cooling plate

Abstract

The liquid cooling plate comprises a heat dissipation plate, an upper cover plate, a heat dissipation piece and a bottom plate, the upper cover plate is connected to the heat dissipation plate and defines a heat dissipation cavity, the upper cover plate is provided with a liquid inlet and a liquid outlet which are communicated with the heat dissipation cavity, the heat dissipation piece is arranged in the heat dissipation cavity, the heat dissipation piece is provided with a plurality of heat dissipation flow channels in the height direction, and the heat dissipation flow channels are communicated with the liquid inlet and the liquid outlet. At least part of the cooling working medium entering the heat dissipation cavity from the liquid inlet flows through the heat dissipation flow channel and flows out from the liquid outlet, the bottom plate is connected to the side, back to the upper cover plate, of the heat dissipation plate and defines an evaporation cavity, and the side, back to the heat dissipation plate, of the bottom plate is used for being connected with equipment to be subjected to heat dissipation. The heat of the to-be-cooled equipment is transmitted to the evaporation cavity, the phase change cooling medium in the evaporation cavity is subjected to phase change, the heat is transmitted to the cooling cavity and taken away by the cooling working medium flowing in the cooling cavity, the evaporated phase change cooling medium in the evaporation cavity is condensed and flows back, and circulation is conducted in this way, so that the cooling efficiency is improved; and the contact area with the cooling working medium is increased through the heat dissipation piece, so that the heat dissipation efficiency is further improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for electronic devices, and particularly to a liquid cooling plate. Background Art

[0002] With the rapid development of technologies such as cloud computing, big data processing, and artificial intelligence, the workload of servers has been continuously increasing, and the power consumption has also risen accordingly, resulting in a significant increase in heat generation. To ensure the stable operation of servers in high-temperature environments and extend their service life, it has become crucial to develop efficient heat dissipation solutions.

[0003] In the process of implementing this application, the inventors found that there are at least the following technical problems in the prior art: The existing heat dissipation method of the cold plate is to directly contact the heat source, and the working fluid circulates through the cold plate to achieve the heat dissipation effect. The heat transfer efficiency is not high, and the heat dissipation effect for high power is poor. Summary of the Invention

[0004] In order to overcome the above problems existing in the prior art, the main purpose of this application is to provide a liquid cooling plate that can improve the heat dissipation efficiency to meet the heat dissipation requirements of high power.

[0005] To achieve the above purpose, this application specifically adopts the following technical solutions: A liquid cooling plate, comprising: A heat dissipation plate; An upper cover plate, which is connected to the heat dissipation plate and encloses a heat dissipation cavity with the heat dissipation plate, and the upper cover plate is provided with a liquid inlet and a liquid outlet that communicate with the heat dissipation cavity; A heat dissipation member, which is arranged in the heat dissipation cavity, and the heat dissipation member is provided with a plurality of heat dissipation channels along the height direction. At least part of the cooling working fluid entering the heat dissipation cavity from the liquid inlet flows through the heat dissipation channels and flows out from the liquid outlet; A bottom plate, which is connected to the side of the heat dissipation plate facing away from the upper cover plate and encloses an evaporation cavity with the heat dissipation plate. The evaporation cavity is used to store the phase change cooling medium, and the side of the bottom plate facing away from the heat dissipation plate is used to connect with the device to be cooled.

[0006] In some embodiments, there are a plurality of the heat dissipation members, and the plurality of heat dissipation members are respectively arranged at intervals along the width direction of the heat dissipation plate. In some embodiments, a convex portion is provided between two adjacent heat dissipation members along the width direction of the heat dissipation plate.

[0007] In some embodiments, the liquid cooling plate further includes a plurality of first heat dissipation protrusions, and the plurality of first heat dissipation protrusions are respectively located in the evaporation cavity and are arranged at intervals on the bottom plate and / or the heat dissipation plate.

[0008] In some embodiments, the liquid cooling plate further includes a plurality of second heat dissipation protrusions, and the plurality of second heat dissipation protrusions are respectively located in the heat dissipation cavity and are spaced apart on the upper cover plate and / or the heat dissipation plate.

[0009] In some embodiments, the liquid cooling plate further includes a capillary structure, and the capillary structure is disposed on the inner wall of the evaporation cavity.

[0010] In some embodiments, the liquid cooling plate further includes a lower cover plate, and the lower cover plate is connected to a side of the bottom plate facing away from the heat dissipation plate and encloses a storage cavity with the bottom plate. The storage cavity is used to store the phase change cooling medium, and a side of the lower cover plate facing away from the bottom plate is used to connect to the device to be cooled.

[0011] In some embodiments, the liquid cooling plate further includes a first flow dividing member and a second flow dividing member. The first flow dividing member and the second flow dividing member are respectively connected to a side of the heat dissipation plate facing the upper cover plate and are located at two ends of the heat dissipation plate. The first flow dividing member is correspondingly arranged with the liquid inlet, and the second flow dividing member is correspondingly arranged with the liquid outlet. In some embodiments, the liquid cooling plate further includes a liquid inlet nozzle and a liquid outlet nozzle. The liquid inlet nozzle is connected to the liquid inlet, and the liquid outlet nozzle is connected to the liquid outlet.

[0012] In some embodiments, the upper cover plate and the heat dissipation plate are connected by welding, and the bottom plate and the heat dissipation plate are connected by welding; or, The upper cover plate and the heat dissipation plate, and the bottom plate and the heat dissipation plate are detachably connected.

[0013] Compared with the prior art, the liquid cooling plate provided by the present application has at least the following beneficial effects: The upper cover plate of the present application is connected to the heat dissipation plate and encloses a heat dissipation cavity with the heat dissipation plate. The bottom plate is connected to a side of the heat dissipation plate facing away from the upper cover plate and encloses an evaporation cavity with the heat dissipation plate. During operation, a side of the bottom plate facing away from the heat dissipation plate is used to connect to the device to be cooled, so that the heat of the device to be cooled is transferred to the evaporation cavity. The phase change cooling medium in the evaporation cavity undergoes a phase change, evaporates and heats up to the top of the evaporation cavity. The heat is transferred to the heat dissipation cavity and is carried away by the cooling working medium flowing in the heat dissipation cavity. The evaporated phase change cooling medium in the evaporation cavity condenses and flows back. In this way, through the efficient combination of the two cavities, the heat dissipation efficiency is improved, thereby meeting the heat dissipation requirements of high power. Moreover, the heat dissipation member is provided with a plurality of heat dissipation channels in the height direction, and at least part of the cooling working medium entering the heat dissipation cavity from the liquid inlet flows through the heat dissipation channels and flows out from the liquid outlet. The contact area with the cooling working medium is increased through the heat dissipation member, thereby further improving the heat dissipation efficiency of the liquid cooling plate. Description of the Drawings

[0014] Figure 1 Schematic diagram of the structure of the liquid cooling plate provided by the embodiment of the present application; Figure 2 Exploded view of the liquid cooling plate provided by the embodiment of the present application; Figure 3 Cross-sectional view of the liquid cooling plate provided by the embodiment of the present application; Figure 4 Schematic diagram of the internal structure of the liquid cooling plate provided by the embodiment of the present application.

[0015] Reference numerals: 1, heat dissipation plate; 11, second groove; 12, evaporation cavity; 13, convex part; 2, upper cover plate; 21, liquid inlet; 22, liquid outlet; 23, heat dissipation cavity; 24, first groove; 3, bottom plate; 4, heat dissipation member; 41, heat dissipation flow channel; 5, liquid inlet nozzle; 6, liquid outlet nozzle; 7, first heat dissipation protrusion; 8, first flow dividing member; 9, second flow dividing member. Detailed implementation manners

[0016] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0017] In the description of the present application, unless otherwise clearly defined and limited, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated, the term "plural" refers to two or more, and the term "multiple types" refers to two or more; the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0018] In the description of this specification, it should be understood that the orientation terms such as "upper" and "lower" described in the embodiments of the present application are described from the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected "above" or "below" another element, it can not only be directly connected "above" or "below" another element, but also be indirectly connected "above" or "below" another element through an intermediate element.

[0019] Referring to Figures 1-3 as shown Figure 1 which is a schematic structural view of the liquid cooling plate provided by the embodiment of the present application, Figure 2 which is an exploded view of the liquid cooling plate provided by the embodiment of the present application, Figure 3 which is a cross-sectional view of the liquid cooling plate provided by the embodiment of the present application. This embodiment discloses a liquid cooling plate, which includes a heat dissipation plate 1, an upper cover plate 2, a heat dissipation member 4 and a bottom plate 3. The upper cover plate 2 is connected to the heat dissipation plate 1 and encloses a heat dissipation cavity 23 with the heat dissipation plate 1, and the upper cover plate 2 is provided with a liquid inlet 21 and a liquid outlet 22 communicating with the heat dissipation cavity 23. The heat dissipation member 4 is arranged in the heat dissipation cavity 23, and the heat dissipation member 4 is provided with a plurality of heat dissipation channels 41 along the height direction. The cooling medium entering the heat dissipation cavity 23 from the liquid inlet 21 at least partially flows through the heat dissipation channels 41 and flows out from the liquid outlet 22. Among them, the cooling medium can be pure water or ethylene glycol, etc. The bottom plate 3 is connected to the side of the heat dissipation plate 1 opposite to the upper cover plate 2 and encloses an evaporation cavity 12 with the heat dissipation plate 1. The evaporation cavity 12 is used to store a phase change cooling medium (i.e., a cooling medium that can undergo a phase change, such as water, freon, etc.). The side of the bottom plate 3 opposite to the heat dissipation plate 1 is used to connect with the device to be cooled. The heat dissipation plate 1 is provided with a liquid injection port, and the liquid injection port is used to connect with a liquid supply device to inject the phase change cooling medium into the evaporation cavity 12, and the amount of the injected phase change cooling medium can be adjusted according to the power, so as to realize a power-customized liquid cooling plate. Among them, the length direction of the heat dissipation plate 1 is Figure 2 the X direction in Figure 2 the width direction of the heat dissipation plate 1 is Figure 2 the Y direction in

[0020] In specific applications, the number of the heat dissipation channels 41 can be set according to the power and heat flux density that the liquid cooling plate needs to achieve. The higher the power and heat flux density that the liquid cooling plate needs to achieve, the more the number of the heat dissipation channels 41, so as to meet the heat dissipation requirements of high power.

[0021] In this embodiment, a plurality of heat dissipation members 4 are provided, and the plurality of heat dissipation members 4 are respectively arranged at intervals along the width direction of the heat dissipation plate 1 to increase the heat exchange area, thereby improving the heat exchange efficiency. Specifically, the number of the heat dissipation members 4 can be set according to needs, and no limitation is made here.

[0022] In this embodiment, the upper cover plate 2 and the heat dissipation plate 1, and the bottom plate 3 and the heat dissipation plate 1 are respectively connected by welding to ensure the connection tightness and the structural strength of the connection, reduce the leakage of liquid from the connection between the upper cover plate 2 and the heat dissipation plate 1 and the connection between the bottom plate 3 and the heat dissipation plate 1, and ensure the normal operation of the liquid cooling plate. It can be understood that in other embodiments, the upper cover plate 2 and the heat dissipation plate 1, and the bottom plate 3 and the heat dissipation plate 1 can also be detachably connected, such as bolt connection or rivet connection, etc.

[0023] In this embodiment, the liquid cooling plate further includes a capillary structure disposed on the inner wall of the evaporation chamber 12 to promote the reflux of the phase change cooling medium through capillary action, thereby accelerating the heat transfer rate and improving the heat exchange efficiency.

[0024] In this embodiment, the heat dissipation plate 1 is an aluminum plate, which has high thermal conductivity and can enhance the heat conduction effect, thereby further improving the heat exchange efficiency of the liquid cooling plate. Moreover, the heat dissipation plate 1 can be made by a cold forging process to reduce the manufacturing cost. In specific applications, the material and processing method of the heat dissipation plate 1 can be set according to needs.

[0025] In this embodiment, a first groove 24 is recessed on the upper cover plate 2. The upper cover plate 2 is connected to the heat dissipation plate 1, and the cavity of the first groove 24 is the heat dissipation chamber 23. A second groove 11 is recessed on the heat dissipation plate 1. The bottom plate 3 is connected to the heat dissipation plate 1, and the cavity of the second groove 11 is the evaporation chamber 12, so as to reduce the thickness of the liquid cooling plate, thereby reducing the occupied space of the liquid cooling plate, lowering the cost, and improving the applicability of the liquid cooling plate. It can be understood that in other embodiments, a first groove 24 can also be recessed on the heat dissipation plate 1, and a second groove 11 can be recessed on the bottom plate 3; or, a first groove 24 can be recessed on the upper cover plate 2, and a second groove 11 can be recessed on the bottom plate 3; or, a first groove 24 and a second groove 11 can be recessed on the heat dissipation plate 1.

[0026] The upper cover plate 2 of this embodiment is connected to the heat dissipation plate 1 and encloses a heat dissipation chamber 23 with the heat dissipation plate 1. The bottom plate 3 is connected to the side of the heat dissipation plate 1 opposite to the upper cover plate 2 and encloses an evaporation chamber 12 with the heat dissipation plate 1. During operation, the side of the bottom plate 3 opposite to the heat dissipation plate 1 is used to connect with the device to be cooled, so that the heat of the device to be cooled is transferred to the evaporation chamber 12. The phase change cooling medium in the evaporation chamber 12 undergoes a phase change, evaporates and heats up to the top of the evaporation chamber 12, and the heat is transferred to the heat dissipation chamber 23 and taken away by the cooling working medium flowing in the heat dissipation chamber 23, thereby realizing the heat dissipation of the device to be cooled. The evaporated phase change cooling medium in the evaporation chamber 12 condenses and refluxes, and circulates in this way. Through the efficient combination of the two cavities, the heat dissipation efficiency is improved, thereby meeting the high-power heat dissipation requirements. Moreover, the heat dissipation member 4 is provided with a plurality of heat dissipation channels 41 in the height direction. At least part of the cooling working medium entering the heat dissipation chamber 23 from the liquid inlet 21 flows through the heat dissipation channels 41 and flows out from the liquid outlet 22. By the heat dissipation member 4, the contact area with the cooling working medium is increased, thereby further improving the heat dissipation efficiency of the liquid cooling plate.

[0027] Refer to Figure 4 as shown Figure 4 is a schematic structural diagram of the inside of the liquid cooling plate provided by the embodiment of the present application. A plurality of heat dissipation members 4 are provided, and the plurality of heat dissipation members 4 are respectively spaced apart along the width direction of the heat dissipation plate 1 to further increase the heat exchange area, thereby improving the heat exchange efficiency.

[0028] Specifically, a plurality of heat dissipation members 4 are evenly distributed at intervals along the width direction of the heat dissipation plate 1 to ensure the uniformity of the flow of the cooling working fluid, thereby ensuring the uniformity of heat dissipation and improving the heat dissipation effect.

[0029] A convex portion 13 is provided between two adjacent heat dissipation members 4, so that the cooling working fluid can flow out through the heat dissipation channel 41, and the convex portion 13 can also limit the heat dissipation members 4 and separate a plurality of heat dissipation members 4, thereby reducing the mutual influence between the heat dissipation members 4 and ensuring the heat exchange efficiency of the liquid cooling plate.

[0030] In this embodiment, the heat dissipation member 4 is a square tube. The square tube has a large contact area, high strength and stiffness, enhances the stability of the overall structure of the liquid cooling plate, improves the heat dissipation efficiency, and the square tube can be manufactured by die-casting, with low processing cost. It can be understood that in other embodiments, the heat dissipation member 4 can also be a round tube or a tube with other cross-sectional shapes.

[0031] In this embodiment, the heat dissipation member 4 is connected to the heat dissipation plate 1 by means of bolt connection for convenient disassembly and replacement. It can be understood that in other embodiments, the heat dissipation member 4 and the heat dissipation plate 1 can also be connected by other means, such as snap connection or rivet connection, or the heat dissipation member 4 and the heat dissipation plate 1 can also be integrally formed.

[0032] Refer to Figure 2 As shown, the liquid cooling plate further includes a plurality of first heat dissipation protrusions 7 and a plurality of second heat dissipation protrusions (not shown in the figure). The plurality of first heat dissipation protrusions 7 are respectively located in the evaporation chamber 12 and are spaced apart on the bottom plate 3. The plurality of second heat dissipation protrusions are respectively located in the heat dissipation chamber 23 and are spaced apart on the upper cover plate 2. The plurality of first heat dissipation protrusions 7 and the plurality of second heat dissipation protrusions are used to increase the contact area with the cooling working fluid, thereby improving the heat dissipation efficiency, and the first heat dissipation protrusions 7 and the second heat dissipation protrusions provide support for the liquid cooling plate, ensuring the strength and stability of the liquid cooling plate, thereby reducing the deformation or damage of the liquid cooling plate and improving the service life of the liquid cooling plate.

[0033] In this embodiment, the first heat dissipation protrusion 7 and the second heat dissipation protrusion are cylindrical structures to reduce the dead corners and turbulence of the cooling working fluid in the liquid cooling plate, thereby improving the utilization efficiency of the cooling working fluid and reducing the pressure loss. In specific applications, the shapes and sizes of the first heat dissipation protrusion 7 and the second heat dissipation protrusion can be adjusted according to requirements, and the first heat dissipation protrusion 7 and the second heat dissipation protrusion can also be shovel teeth or fins.

[0034] In this embodiment, a plurality of first heat dissipation protrusions 7 are formed on the bottom plate 3 and integrally formed with the bottom plate 3. A plurality of second heat dissipation protrusions are formed on the upper cover plate 2 and integrally formed with the upper cover plate 2, which is convenient for manufacturing. It can be understood that in other embodiments, the plurality of first heat dissipation protrusions 7 and the plurality of second heat dissipation protrusions can also be formed on the heat dissipation plate 1, or among the plurality of first heat dissipation protrusions 7, some first heat dissipation protrusions 7 are formed on the bottom plate 3, and some first heat dissipation protrusions 7 are formed on the heat dissipation plate 1. Among the plurality of second heat dissipation protrusions, some second heat dissipation protrusions are formed on the upper cover plate 2, and some second heat dissipation protrusions are formed on the heat dissipation plate 1.

[0035] Continuing to refer to Figure 2 As shown, the liquid cooling plate further includes an inlet water nozzle 5 and an outlet water nozzle 6. The inlet water nozzle 5 is connected to the inlet 21, and the outlet water nozzle 6 is connected to the outlet 22. The inlet water nozzle 5 and the outlet water nozzle 6 are used to control the opening and closing of the inlet 21 and the outlet 22, so as to reduce the situation of dust and other impurities entering the heat dissipation cavity 23, improve the service life of the liquid cooling plate, and the inlet water nozzle 5 and the outlet water nozzle 6 are also used to control the flow rate of the working medium to avoid excessive cooling and unnecessary energy waste, and reduce the overall energy consumption.

[0036] Referring to Figure 4 As shown, the liquid cooling plate further includes a first flow dividing member 8 and a second flow dividing member 9. The first flow dividing member 8 and the second flow dividing member 9 are respectively connected to one side of the heat dissipation plate 1 facing the upper cover plate 2 and are located at both ends of the heat dissipation plate 1. The first flow dividing member 8 is correspondingly arranged with the inlet 21, and the second flow dividing member 9 is correspondingly arranged with the outlet 22, so as to divide the cooling working medium to both sides through the first flow dividing member 8 and the second flow dividing member 9, thereby reducing the situation that the cooling working medium all passes through the middle, ensuring the uniform distribution of the cooling working medium, and thus improving the heat dissipation effect.

[0037] In one embodiment, the liquid cooling plate further includes a lower cover plate. The lower cover plate is connected to the side of the bottom plate 3 facing away from the heat dissipation plate 1 and encloses a containing cavity with the bottom plate 3. The containing cavity is used to store the phase change cooling medium. The side of the lower cover plate facing away from the bottom plate 3 is used to connect with the device to be cooled. During operation, the heat of the device to be cooled is transferred to the containing cavity, and the phase change cooling medium in the containing cavity undergoes a phase change, evaporates and rises to the top of the containing cavity, and the heat is transferred to the evaporation cavity 12. The phase change cooling medium evaporated in the containing cavity condenses and flows back. The phase change cooling medium in the evaporation cavity 12 undergoes a phase change, evaporates and rises to the top of the evaporation cavity 12, and the heat is transferred to the heat dissipation cavity 23 and taken away by the cooling working medium flowing in the heat dissipation cavity 23. And the phase change cooling medium evaporated in the evaporation cavity 12 condenses and flows back, and cycles in this way, further increasing the heat dissipation efficiency of the liquid cooling plate.

[0038] As described above, it is only the preferred specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A liquid cooling plate, characterized in that: include: Heat sink; An upper cover plate, the upper cover plate is connected to the heat dissipation plate and encloses the heat dissipation plate to form a heat dissipation cavity, and the upper cover plate is provided with a liquid inlet and a liquid outlet communicating with the heat dissipation cavity; A heat sink, the heat sink is arranged in the heat sink cavity, and the heat sink is provided with a plurality of heat sink channels along the height direction, and the cooling medium entering the heat sink cavity from the liquid inlet at least partially flows through the heat sink channels and flows out from the liquid outlet; The bottom plate is connected to the side of the heat sink facing away from the upper cover plate and is enclosed with the heat sink to form an evaporation chamber, wherein the evaporation chamber is used to store phase-change cooling medium, and the side of the bottom plate facing away from the heat sink is used to connect to the device to be cooled.

2. The liquid cooling plate according to claim 1, characterized in that: There are a plurality of heat sinks, and the plurality of heat sinks are distributed at intervals along the width direction of the heat sink.

3. The liquid cooling plate according to claim 2, characterized in that: A protrusion is provided between two adjacent heat sinks along the width direction of the heat sink plate.

4. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate further includes a plurality of first heat dissipation protrusions, which are respectively located in the evaporation chamber and are spaced apart from each other on the bottom plate and / or the heat dissipation plate.

5. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate further comprises a plurality of second heat dissipation protrusions, which are respectively located in the heat dissipation cavity and are arranged at intervals on the upper cover plate and / or the heat dissipation plate.

6. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate further includes a capillary structure, and the capillary structure is arranged on the inner wall of the evaporation chamber.

7. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate also includes a lower cover plate, which is connected to the side of the base plate facing away from the heat dissipation plate and is enclosed with the base plate to form a receiving cavity, wherein the receiving cavity is used to store phase-change cooling medium, and the side of the lower cover plate facing away from the base plate is used to be connected to the device to be cooled.

8. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate also includes a first flow divider and a second flow divider, the first flow divider and the second flow divider are respectively connected to the side of the heat sink facing the upper cover plate and are located at both ends of the heat sink, the first flow divider is arranged corresponding to the liquid inlet, and the second flow divider is arranged corresponding to the liquid outlet.

9. The liquid cooling plate according to claim 1, characterized in that: The liquid cooling plate further comprises a liquid inlet nozzle and a liquid outlet nozzle, wherein the liquid inlet nozzle is connected to the liquid inlet, and the liquid outlet nozzle is connected to the liquid outlet.

10. The liquid cooling plate according to any one of claims 1 to 9, characterized in that: The upper cover plate and the heat sink plate, and the bottom plate and the heat sink plate are connected by welding respectively; or, The upper cover plate and the heat sink plate, and the bottom plate and the heat sink plate are detachably connected.

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