Small-sized bistable relay capable of realizing high-insulation process structure

Abstract

The invention discloses a small-sized bistable relay capable of realizing a high-insulation process structure, relates to the technical field of relays, and solves the problems that the relay needs to be continuously electrified to maintain a closed state, the energy consumption is high, the temperature rise is large, the service life of the relay is easily influenced, the misoperation is out of control due to unstable working voltage, and the reliability is high. And the working stability is poor. The small-sized bistable relay capable of realizing the high-insulation process structure comprises a base, an integrated steady-state relay mechanism, a movable and static reed assembly and automatic dispensing equipment. According to the invention, based on the base body technology of the relay, the production and assembly work of a high-insulation relay product can be realized, the insulation performance of the relay is greatly improved, and after the forward direct-current pulse voltage is introduced to magnetize the iron core, the closed state of the movable contact can be kept unchanged only by the magnetic force of the magnetized iron core of the annular magnet; the coil does not need to be electrified continuously, so that the energy consumption is greatly reduced, the temperature rise of the relay is smaller, and the safety is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and particularly to a small bistable relay with a high-insulation process structure that can be realized. Background Art

[0002] A relay is an electrical control device. When the change of the input quantity (excitation quantity) reaches the specified requirement, it is an electrical appliance that causes a predetermined step change in the controlled quantity in the electrical output circuit. It has an interactive relationship between a control system (also known as an input circuit) and a controlled system (also known as an output circuit), and is usually applied to an automated control circuit, playing roles such as automatic regulation, safety protection, and circuit conversion in the circuit.

[0003] During the production and assembly process of a relay, the insulation process is a main process in the relay assembly, which can ensure that the assembled relay has an insulation function and guarantee the safety of the relay during use.

[0004] The existing Chinese patent application with the publication number CN118800623A discloses a relay, including a contact container, a static contact lead-out terminal, a fixing member, a movable member, a movable piece, and a first magnetic conductor. The contact container includes an insulating cover and a yoke iron plate. The insulating cover is connected to the side surface of the yoke iron plate, and the insulating cover and the yoke iron plate form a contact chamber; the insulating cover is provided with a first through hole, and the first through hole communicates with the contact chamber; the static contact lead-out terminal passes through the first through hole; the fixing member is arranged in the contact chamber and is fixedly connected to the yoke iron plate; the movable member is movably arranged in the contact chamber and includes a moving spring, and the moving spring is used to contact or separate from a pair of static contact lead-out terminals; the movable piece is movably connected to the fixing member; the first magnetic conductor is arranged in the contact chamber and is connected to the movable piece. The first magnetic conductor is arranged on the side of the moving spring facing the static contact lead-out terminal; in this invention, the fixing member is connected to the yoke iron plate. Since the fixing member is fixed relative to the yoke iron plate, the magnetic attraction force generated between the first magnetic conductor and the movable member is transferred to the yoke iron plate, so that there is no need for excessive coil holding force, thereby reducing the coil power consumption and the volume of the relay, and improving the short-circuit resistance.

[0005] However, the relay has the following defects in specific use: 1. With the increasing competition in the relay industry, the economy of thrift has become the first element for the survival and development of enterprises. Therefore, high-energy-consuming products can no longer meet the modern production requirements. The current power relays need to be continuously powered on to maintain the closed state, with high energy consumption, resulting in a large temperature rise, which is likely to affect the service life of the relay, and is prone to malfunction and out-of-control due to unstable working voltage, and the working stability is poor; 2. With the development of applications, small-sized bistable relays have great development potential. Especially in recent years, there have been significant breakthroughs in the development of smart homes. However, due to the high-precision and high-quality requirements during the assembly of small-sized bistable relays, most of the small-sized bistable relays on the market currently cannot meet the insulation requirements and are difficult to be put into actual production. Summary of the Invention

[0006] The purpose of the present invention is to provide a small-sized bistable relay with a high-insulation process structure to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned invention purpose, the present invention adopts the following technical solutions: The present invention provides a small-sized bistable relay with a high-insulation process structure, including a base, an integrated bistable relay mechanism, a moving and static reed assembly, and an automatic dispensing device. The integrated bistable relay mechanism is installed on the top of the base. A group of moving and static reed assemblies are connected to both the left and right sides of the integrated bistable relay mechanism, and the moving and static reed assemblies are installed on the side of the base. The automatic dispensing device performs dispensing treatment on the assembled small-sized bistable relay with a high-insulation process structure. Among them, the integrated bistable relay mechanism includes: A magnetic circuit component, which is installed on one side of the top of the base. Moving and static reed assemblies are arranged on both the left and right sides of the magnetic circuit component, and a magnet component is arranged on the side of the magnetic circuit component. Among them, moving and static reed assemblies are arranged on both sides of the bottom of the magnet component. The magnet component is electrically connected to the magnetic circuit component, and the top of the magnetic circuit component and the magnet component are assembled and sealed through a housing.

[0008] As a preferred solution of the present invention, a plurality of positioning insertion rods penetrate through the inside of the base and extend into the inside of the magnetic circuit component. All the plurality of positioning insertion rods are arranged on the side of the moving and static reed assembly. Among them, an assembly opening is formed at the center of the inside of the base, and the magnetic circuit component is installed inside the assembly opening.

[0009] As a preferred solution of the present invention, the moving and static reed assembly includes: A conductive insertion rod, which penetrates through the base and extends to the inner wall of the magnetic circuit component. A plurality of protruding parts are installed on one side of the conductive insertion rod located inside the magnetic circuit component. Among them, a moving reed is installed on the outer side of the plurality of protruding parts. The moving reed is arranged on the side of the conductive insertion rod, and the moving reed is arranged on the outer side of the magnetic circuit component. The moving contact is installed on the side of the moving reed, the moving contact is arranged on the side of the convex part, and a static contact is arranged on the side of the moving contact; The static reed, the internal of the static reed is installed with a static contact, the static reed penetrates through the base, and the static reed is arranged on the side of the moving reed.

[0010] As a preferred solution of the present invention, the moving reed is installed at the eccentric position of the inner bottom of the magnet assembly, and the static reed is arranged on the side of the magnet assembly. Wherein, the moving reed is bent.

[0011] As a preferred solution of the present invention, the magnetic circuit assembly includes: The relay insulating sheet, the central part of the relay insulating sheet protrudes outward, and the protruding part of the relay insulating sheet constitutes an assembly convex, the assembly convex extends into the interior of the assembly port, and the relay insulating sheet is installed on the top of the base. Wherein, a plurality of the positioning insertion rods penetrate through the interior of the relay insulating sheet, and the relay insulating sheet is arranged as an enclosing structure; The coil skeleton is installed inside the relay insulating sheet, the positioning insertion rod penetrates through the interior of the coil skeleton, and a relay coil is wound around the outside of the coil skeleton. The iron core is installed inside the coil skeleton, the iron core extends to the outside of the coil skeleton, and the bottom of the iron core extends into the interior of the magnet assembly.

[0012] As a preferred solution of the present invention, a yoke iron is installed at the inner bottom of the relay insulating sheet, and the coil skeleton is assembled to the top of the yoke iron through a reserved port. Wherein, a concave block is arranged on one side of the yoke iron located outside the relay insulating sheet, the top of the concave block supports and positions the iron core, and the structural shape of the yoke iron is "L" shaped. Wherein, the iron core and the yoke iron are connected to the coil skeleton through a riveting process, and the coil skeleton and the relay coil are assembled through a potting process.

[0013] As a preferred solution of the present invention, the magnet assembly includes: The pushing piece is installed on the top of the base, the pushing piece abuts against the side of the relay insulating sheet, and the structural shape of the pushing piece is "T" shaped. The inner groove is opened at the center of the interior of the pushing piece, armature sheets are installed on the left and right sides inside the inner groove, and magnets are arranged on the inner sides of the armature sheets. Among them, the magnet is installed inside the inner groove, and an iron core is arranged on the side of the magnet, and the iron core is located between two armature plates.

[0014] As a preferred solution of the present invention, alignment bumps are installed on both sides of the bottom of the push piece, and the alignment bumps are arranged on the left and right sides of the inner groove. Among them, a moving reed is penetrated through the inside of the alignment bump.

[0015] As a preferred solution of the present invention, the push piece, the armature plate and the magnet are integrally formed by a mold.

[0016] Compared with the prior art, the small bistable high-insulation process structure relay proposed by the present invention can solve the problems that the existing power relay needs to be continuously powered on to maintain the closed state, resulting in high energy consumption and low stability.

[0017] The above one or more technical solutions have the following beneficial effects: 1. In a small bistable high-insulation process structure relay, based on the matrix process of the relay, the production and assembly operations of high-insulation relay products can be realized. At the same time, the potting (epoxy resin) process of the relay coil magnetic circuit inside the relay can greatly improve the insulation performance of the relay. After the iron core is magnetized by applying a positive DC pulse voltage, the magnetic force of the ring magnet magnetizing the iron core alone can keep the moving contact in the closed state unchanged, and the coil does not need to be continuously powered on, greatly reducing the energy consumption, the temperature rise of the relay is smaller, and the safety is higher; 2. In a small bistable high-insulation process structure relay, the bistable structure relay includes a setting process and a reset process. Among them, the setting process is: when it is necessary to make the relay in the closed state, a positive DC pulse voltage is applied to the relay coil. The relay coil generates a magnetic field, which interacts with the magnetic field of the permanent magnet, so that the moving reed of the relay is attracted and contacts the static contact, thereby realizing the closing of the circuit, and the moving contact and the static contact are locked in the closed state by the moving reed to ensure the stable operation of the relay. The reset process is: when it is necessary to make the relay in the open state, a reverse DC pulse voltage is applied to the relay coil. The magnetic field generated by the coil is opposite to the magnetic field direction of the permanent magnet, so that the moving reed is repelled and separated from the static contact, realizing the opening of the circuit, and the moving contact is restored to the initial position by the spring; 3. In a small bistable high-insulation process structure relay, through the design of the insulating sheet surrounding structure and the potting operation of the automatic dispensing equipment, the potting operation of the magnetic circuit (coil skeleton and relay coil) can be realized, and the design of high and low voltage insulation of the relay can be achieved. At the same time, the above design can better improve the insulation withstand voltage performance of the relay, so as to meet the requirements of various application scenarios; Description of the Drawings

[0018] The accompanying drawings of the specification, which form a part of the present invention, are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation to the present invention.

[0019] In addition, the terms "installed", "set up", "provided with", "connected", "linked", and "socketed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0020] Figure 1 is a schematic structural diagram of the whole of the present invention; Figure 2 is an exploded structural diagram of the whole of the present invention; Figure 3 is an exploded view of the connection between the relay and the automatic dispensing device of the present invention; Figure 4 is a schematic front view structural diagram of the whole of the present invention; Figure 5 is a schematic structural diagram of the moving and static reed assembly of the present invention; Figure 6 is an exploded view of the connection between the base and the relay insulating sheet of the present invention; Figure 7 is a schematic sectional view structural diagram of the connection between the base and the magnetic circuit assembly of the present invention; Figure 8 is a schematic structural diagram of the magnetic circuit assembly of the present invention; Figure 9 is a schematic structural diagram of the connection between the magnetic circuit assembly and the magnet assembly of the present invention; Figure 10 is a schematic structural diagram of the magnet assembly of the present invention; In the figure: 10. Base; 101. Positioning insertion rod; 102. Assembly port; 20. Integrated steady relay mechanism; 30. Moving and static reed assembly; 301. Conductive insertion rod; 302. Protrusion; 303. Moving reed; 304. Moving contact; 305. Static contact; 306. Static reed; 40. Automatic dispensing device; 50. Magnetic circuit assembly; 501. Relay insulating sheet; 502. Assembly protrusion; 503. Coil bobbin; 504. Relay coil; 505. Iron core; 506. Yoke iron; 5061. Concave block; 60. Magnet assembly; 601. Pushing piece; 6011. Alignment bump; 602. Inner groove; 603. Armature piece; 604. Magnet. Detailed implementation manners

[0021] In order to enable those skilled in the art to better understand the solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0022] Please refer to Figures 1-10 , a small bistable relay with a high-insulation process structure includes a base 10, an integrated bistable relay mechanism 20, a moving and static reed assembly 30, and an automatic dispensing device 40. An integrated bistable relay mechanism 20 is installed on the top of the base 10. A set of moving and static reed assemblies 30 are connected to both the left and right sides of the integrated bistable relay mechanism 20. The moving and static reed assemblies 30 are installed on the side of the base 10. The automatic dispensing device 40 performs dispensing on the assembled small bistable relay with a high-insulation process structure. Among them, the integrated bistable relay mechanism 20 includes a magnetic circuit assembly 50. The magnetic circuit assembly 50 is installed on one side of the top of the base 10. The moving and static reed assemblies 30 are arranged on both the left and right sides of the magnetic circuit assembly 50. A magnet assembly 60 is arranged on the side of the magnetic circuit assembly 50. Among them, the moving and static reed assemblies 30 are arranged on both sides of the bottom of the magnet assembly 60. The magnet assembly 60 is electrically connected to the magnetic circuit assembly 50. The tops of the magnetic circuit assembly 50 and the magnet assembly 60 are assembled and sealed through a housing.

[0023] The above working principle: When assembling the relay, the magnetic circuit assembly 50 and the magnet assembly 60 are respectively installed on the top of the base 10 according to the sequence. After the assembly is completed, the relay is assembled and sealed through the housing arranged on the top. Among them, the internal parts of the magnetic circuit assembly 50 are assembled by using the potting (epoxy resin) process, which can greatly improve the insulation performance and safety of the relay. The magnet assembly 60 is integrally formed by means of die processing. On the one hand, it can avoid defects such as gaps and air holes caused by die splicing or uneven pouring. On the other hand, it can reduce the weight, improve the production efficiency, and realize the efficient relay assembly processing operation.

[0024] In the present invention, the magnetic circuit assembly 50 adopts the principle of an electromagnet of "like poles repel, unlike poles attract".

[0025] In the present invention, a plurality of positioning pins 101 are disposed through the interior of the base 10, and the positioning pins 101 extend into the interior of the magnetic circuit assembly 50. The plurality of positioning pins 101 are all disposed on the side of the moving and static reed assembly 30. Among them, an assembly opening 102 is formed at the center of the interior of the base 10, and the magnetic circuit assembly 50 is installed inside the assembly opening 102.

[0026] In the small bistable high-insulation process structure relay of the present invention, through the design of the positioning pins 101 and the assembly opening 102, stable assembly of the internal parts of the magnetic circuit assembly 50 can be achieved.

[0027] Specifically referring to Figure 5 , the moving and static reed assembly 30 includes a conductive insertion rod 301. The conductive insertion rod 301 passes through the base 10 and extends to the inner wall of the magnetic circuit assembly 50. A plurality of protrusions 302 are installed on one side of the conductive insertion rod 301 inside the magnetic circuit assembly 50. Among them, a moving reed 303 is installed on the outer side of the plurality of protrusions 302. The moving reed 303 is disposed on the side of the conductive insertion rod 301, and the moving reed 303 is disposed on the outer side of the magnetic circuit assembly 50; a moving contact 304 is installed on the side of the moving reed 303. The moving contact 304 is disposed on the side of the protrusion 302, and a static contact 305 is disposed on the side of the moving contact 304; a static reed 306 has a static contact 305 installed inside it. The static reed 306 passes through the base 10 and is disposed on the side of the moving reed 303.

[0028] In this embodiment, the moving reed 303 is installed at the eccentric position of the inner bottom of the magnet assembly 60, and the static reed 306 is disposed on the side of the magnet assembly 60. Among them, the moving reed 303 is bent.

[0029] In the small bistable high-insulation process structure relay of the present invention, when a setting operation is performed, the magnetic circuit assembly 50 operates to generate a magnetic field, and the moving reed 303 inside the relay is attracted, driving the moving contact 304 to contact the static contact 305, thereby realizing the closing of the circuit. Then, the moving contact 304 and the static contact 305 are locked in the closed state by the moving reed 303 to ensure the stable operation of the relay.

[0030] Specifically referring to Figure 6 、 Figure 7 、 Figure 8 and Figure 9, the magnetic circuit component 50 includes a relay insulating sheet 501. The central part of the relay insulating sheet 501 protrudes outward, and the protruding part of the relay insulating sheet 501 constitutes an assembly protrusion 502. The assembly protrusion 502 extends into the interior of the assembly opening 102. The relay insulating sheet 501 is installed on the top of the base 10. Among them, a plurality of positioning insertion rods 101 are arranged through the interior of the relay insulating sheet 501, and the relay insulating sheet 501 is arranged in a surrounding structure; a coil bobbin 503, the coil bobbin 503 is installed inside the relay insulating sheet 501, a positioning insertion rod 101 is arranged through the interior of the coil bobbin 503, and a relay coil 504 is wound around the outside of the coil bobbin 503; an iron core 505, the iron core 505 is installed inside the coil bobbin 503, the iron core 505 extends to the outside of the coil bobbin 503, and the bottom of the iron core 505 extends into the interior of the magnet assembly 60.

[0031] In this embodiment, a yoke iron 506 is installed at the inner bottom of the relay insulating sheet 501. The coil bobbin 503 is assembled through a reserved opening at the top of the yoke iron 506. Among them, a concave block 5061 is arranged on one side of the yoke iron 506 located outside the relay insulating sheet 501, and the iron core 505 is supported and positioned at the top of the concave block 5061. The structural shape of the yoke iron 506 is "L" - shaped. Among them, the iron core 505 and the yoke iron 506 are connected to the coil bobbin 503 through a riveting process, and the coil bobbin 503 and the relay coil 504 are assembled through a potting process.

[0032] In the small - sized bistable relay with a high - insulation process structure of the present invention, when the relay is operating, the relay insulating sheet 501 can be installed on the top of the base 10 through the assembly protrusion 502, and the coil bobbin 503 can be installed inside the relay insulating sheet 501 through a plurality of positioning insertion rods 101. At the same time, the relay coil 504 of the coil bobbin 503 can be stably installed on the outside of the coil bobbin 503 by means of dispensing glue. When the relay coil 504 operates and generates a magnetic field, the iron core 505 inside it will operate.

[0033] Specifically referring to Figure 9 and Figure 10 , the magnet assembly 60 includes a push sheet 601. The push sheet 601 is installed on the top of the base 10. The push sheet 601 abuts against the side of the relay insulating sheet 501. The structural shape of the push sheet 601 is "T" - shaped; an inner groove 602, the inner groove 602 is opened at the central part inside the push sheet 601. Armature sheets 603 are installed on the left and right sides inside the inner groove 602. A magnet 604 is arranged on the inner side of the armature sheet 603. Among them, the magnet 604 is installed inside the inner groove 602, and the iron core 505 is arranged on the side of the magnet 604. The iron core 505 is located between the two armature sheets 603.

[0034] In this embodiment, alignment bumps 6011 are installed on both sides of the bottom of the push piece 601. The alignment bumps 6011 are arranged on the left and right sides of the inner groove 602. Among them, a moving reed 303 penetrates through the inside of the alignment bumps 6011.

[0035] In addition, in this embodiment, the push piece 601, the armature piece 603, and the magnet 604 are integrally formed by a mold.

[0036] In the small bistable high-insulation process structure relay of the present invention, the push piece 601 can be pushed to move the armature piece 603 and the magnet 604 to the side of the iron core 505. At this time, in cooperation with the operation of the iron core 505, electricity will be transmitted to the static reed 306 to achieve operations such as power transmission and power control.

[0037] Limited to this, any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, making equivalent replacements or changes, should be covered within the protection scope of the present invention.

Claims

1. A small bistable relay with a high-insulation process structure, comprising a base (10), an integrated steady-state relay mechanism (20), a moving and static reed assembly (30), and an automatic dispensing device (40), characterized in that: An integrated steady - state relay mechanism (20) is installed on the top of the base (10). A set of moving and static reed assemblies (30) are connected to both the left and right sides of the integrated steady - state relay mechanism (20). The moving and static reed assemblies (30) are installed on the side of the base (10). The automatic dispensing device (40) performs dispensing treatment on the assembled small - sized bistable relays with high - insulation process structures. Among them, the integrated steady - state relay mechanism (20) includes: A magnetic circuit assembly (50). The magnetic circuit assembly (50) is installed on one side of the top of the base (10). Moving and static reed assemblies (30) are arranged on both the left and right sides of the magnetic circuit assembly (50). A magnet assembly (60) is arranged on the side of the magnetic circuit assembly (50). Among them, moving and static reed assemblies (30) are arranged on both sides of the bottom of the magnet assembly (60). The magnet assembly (60) is electrically connected to the magnetic circuit assembly (50). The tops of the magnetic circuit assembly (50) and the magnet assembly (60) are assembled and sealed through a housing.

2. The small bistable relay with a high-insulation process structure according to claim 1, characterized in that: A plurality of positioning insertion rods (101) are penetrated and arranged inside the base (10). The positioning insertion rods (101) extend into the inside of the magnetic circuit assembly (50). All the plurality of positioning insertion rods (101) are arranged on the side of the moving and static reed assemblies (30). Among them, an assembly opening (102) is opened at the center inside the base (10). The magnetic circuit assembly (50) is installed inside the assembly opening (102).

3. The small bistable relay with a high-insulation process structure according to claim 2, characterized in that: The moving and static reed assembly (30) includes: A conductive insertion rod (301). The conductive insertion rod (301) penetrates through the base (10) and extends to the inner wall of the magnetic circuit assembly (50). A plurality of protrusion parts (302) are installed on one side of the conductive insertion rod (301) inside the magnetic circuit assembly (50). Among them, a moving reed (303) is installed on the outer side of the plurality of protrusion parts (302). The moving reed (303) is arranged on the side of the conductive insertion rod (301). The moving reed (303) is arranged on the outer side of the magnetic circuit assembly (50). A moving contact (304). The moving contact (304) is installed on the side of the moving reed (303). The moving contact (304) is arranged on the side of the protrusion part (302). A static contact (305) is arranged on the side of the moving contact (304). A static reed (306). The static contact (305) is installed inside the static reed (306). The static reed (306) penetrates through the base (10) and is arranged on the side of the moving reed (303).

4. The small bistable relay with a high-insulation process structure according to claim 3, characterized in that: The moving reed (303) is installed at an eccentric position on the inner bottom of the magnet assembly (60). The static reed (306) is arranged on the side of the magnet assembly (60). Among them, the moving reed (303) is bent.

5. The small bistable relay with a high-insulation process structure according to claim 3, characterized in that: The magnetic circuit assembly (50) includes: A relay insulating sheet (501), wherein the central portion of the relay insulating sheet (501) protrudes outward, and the protruding portion of the relay insulating sheet (501) forms an assembly protrusion (502), and the assembly protrusion (502) extends to the inside of the assembly opening (102), and the relay insulating sheet (501) is installed on the top of the base (10), Wherein, a plurality of positioning rods (101) are arranged penetratingly inside the relay insulating sheet (501), and the relay insulating sheet (501) is arranged as an enclosing structure; A coil frame (503), the coil frame (503) being installed inside the relay insulating sheet (501), the positioning rod (101) being provided through the inside of the coil frame (503), and the relay coil (504) being wound around the outside of the coil frame (503); An iron core (505), the iron core (505) being installed inside the coil frame (503), the iron core (505) extending to the outside of the coil frame (503), and the bottom of the iron core (505) extending to the inside of the magnet assembly (60).

6. The small bistable relay with a high-insulation process structure according to claim 5, characterized in that: A yoke (506) is installed at the inner bottom of the relay insulating sheet (501), and the coil frame (503) is installed at the top of the yoke (506) through a reserved opening. A concave block (5061) is provided on one side of the yoke (506) located outside the relay insulating sheet (501), an iron core (505) is supported and positioned on the top of the concave block (5061), and the structural shape of the yoke (506) is "L"-shaped. The iron core (505) and the yoke (506) are connected to the coil frame (503) by a riveting process, and the coil frame (503) and the relay coil (504) are assembled by a glue pouring process.

7. The small bistable relay with a high-insulation process structure according to claim 5, characterized in that: The magnet assembly (60) comprises: A push piece (601), the push piece (601) being mounted on the top of the base (10), the push piece (601) being in contact with the side surface of the relay insulating piece (501), and the structural shape of the push piece (601) being a "T" shape; An inner groove (602), the inner groove (602) being opened at the inner center of the push plate (601), armature plates (603) being installed on the left and right sides of the inner groove (602), and a magnet (604) being arranged on the inner side of the armature plate (603), The magnet (604) is installed inside the inner groove (602), an iron core (505) is arranged on the side of the magnet (604), and the iron core (505) is located between two armature plates (603).

8. A small bistable relay with a high-insulation process structure according to claim 7, characterized in that: Alignment protrusions (6011) are installed on both sides of the bottom of the push sheet (601), and the alignment protrusions (6011) are arranged on the left and right sides of the inner groove (602). Wherein, a movable spring sheet (303) is provided penetratingly inside the alignment protrusion (6011).

9. A small bistable relay with a high-insulation process structure according to claim 7, characterized in that: The push piece (601), the armature piece (603) and the magnet (604) are integrally formed by a mold.

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