Substrate processing system

Abstract

The invention relates to a substrate processing system. Provided is a technique capable of reducing the size of a substrate processing system. The substrate processing system is provided with: a feeding / discharging unit for feeding / discharging a cassette containing a plurality of substrates; a batch processing unit that processes batches including a plurality of substrates in batches; a single-chip processing unit that processes the batches of substrates one by one; and an interface unit for transferring the substrate between the batch processing unit and the single-sheet processing unit, the batch processing unit including a processing tank for storing a processing liquid for dipping the batch, the interface unit including a transport unit for taking out the substrate from the processing tank and transporting the substrate to the single-sheet processing unit, the transport unit being configured to transport the substrate from the processing tank to the single-sheet processing unit, and the transport unit being configured to transport the substrate from the processing tank to the single-sheet processing unit. The single-sheet processing unit includes a liquid processing device that supplies a liquid to the substrates one by one.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of September 30, 2020, an application number of 202011060753.3, and an invention title of "Substrate Processing System and Substrate Processing Method". Technical Field

[0002] The present disclosure relates to a substrate processing system and a substrate processing method. Background Art

[0003] The drying device described in Patent Document 1 includes a buffer tank, a transfer unit, and a rotary drying unit. The buffer tank holds a semiconductor wafer that has been subjected to a water washing process in water. The semiconductor wafers are subjected to a water washing process while being placed on one holding table in multiple pieces, and are held in the water of the buffer tank while maintaining the state of being placed on the holding table. The transfer unit takes out the semiconductor wafers from the buffer tank one by one and transfers them. The rotary drying unit supports one semiconductor wafer transferred by the transfer unit so that the main surface becomes horizontal and rotates at a high speed to remove water.

[0004] Patent Document 1: Japanese Patent Laid-Open No. 9-162157 Summary of the Invention

[0005] Problems to be Solved by the Invention

[0006] One technical solution of the present disclosure provides a technology that can miniaturize a substrate processing system.

[0007] Solutions for Solving the Problems

[0008] A substrate processing system according to one technical solution of the present disclosure includes:

[0009] A loading / unloading unit for loading / unloading a cassette containing a plurality of the substrates;

[0010] A batch processing unit for batch-processing a batch containing a plurality of substrates;

[0011] A single-wafer processing unit for processing the substrates of the batch one by one; and

[0012] An interface unit for transferring the substrates between the batch processing unit and the single-wafer processing unit,

[0013] The loading / unloading unit, the single-wafer processing unit, the interface unit, and the batch processing unit are arranged in the order of the loading / unloading unit, the single-wafer processing unit, the interface unit, and the batch processing unit,

[0014] The interface unit includes: a lot formation unit configured to form the lot; and a transfer unit configured to transfer the substrate from the single wafer processing unit to the lot formation unit and transfer the substrate from the batch processing unit to the single wafer processing unit.

[0015] Effects of the Invention

[0016] According to one aspect of the present disclosure, the substrate processing system can be miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a top view showing a substrate processing system according to an embodiment.

[0018] Figure 2 is a flowchart showing a substrate processing method according to an embodiment.

[0019] Figure 3 is showing Figure 1 a top view of an example of the lot formation unit.

[0020] Figure 4A is showing Figure 3 a side view of an example of the operation of the lot formation unit.

[0021] Figure 4B is a side view showing an example of the operation of the lot formation unit subsequent to Figure 4A ...

[0022] Figure 4C is a side view showing an example of the operation of the lot formation unit subsequent to Figure 4B ...

[0023] Figure 5 is showing Figure 1 a top view of an example of the lot release unit.

[0024] Figure 6A is showing Figure 5 a cross-sectional view of an example of the operation of the lot release unit.

[0025] Figure 6B is a cross-sectional view showing an example of the operation of the lot release unit subsequent to Figure 6A ...

[0026] Figure 6C is a cross-sectional view showing an example of the operation of the lot release unit subsequent to Figure 6B ...

[0027] Figure 7 is showing Figure 1 a side view of an example of the transfer unit of the interface unit.

[0028] Figure 8It is a side view of another example of the conveying unit.

[0029] Figure 9 It shows Figure 1 A perspective view of an example of a drying device. Detailed implementation manners

[0030] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Among them, the same or corresponding structures may be labeled with the same reference numerals in each drawing, and the description may be omitted.

[0031] As Figure 1 shown, the substrate processing system 1 includes a loading / unloading unit 2, a single-wafer processing unit 3, an interface unit 5, a batch processing unit 6, and a control unit 9. The loading / unloading unit 2 has a stage 21 for placing the cassette C. The cassette C houses a plurality of (for example, 25) substrates W and feeds them in and out relative to the loading / unloading unit 2. Inside the cassette C, the substrates W are horizontally held and held at a second pitch P2 (P2 = N × P1), which is N times the first pitch P1, in the vertical direction. N is a natural number of 2 or more, and is 2 in the present embodiment, but may also be 3 or more. The single-wafer processing unit 3 processes the substrates W one by one. The interface unit 5 transfers the substrates W between the single-wafer processing unit 3 and the batch processing unit 6. The batch processing unit 6 processes a batch L containing a plurality of (for example, 50) substrates W at the first pitch P1 in batches. One batch L includes, for example, the substrates W of N cassettes C.

[0032] The loading / unloading unit 2, the single-wafer processing unit 3, the interface unit 5, and the batch processing unit 6 are arranged in this order from the negative side of the X-axis direction toward the positive side of the X-axis direction. The substrate W is conveyed in the order of the processes A1, A2, A3, A4, A5 shown by the arrows as Figure 1 shown and returns to the loading / unloading unit 2. Since the loading / unloading unit 2 serves as both a loading unit and an unloading unit, the substrate processing system 1 can be miniaturized.

[0033] The loading / unloading unit 2 has a stage 21, and the stage 21 has a plurality of carrier plates 22. A plurality of cassettes C are placed on the plurality of carrier plates 22. In addition, the number of carrier plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0034] The loading and unloading unit 2 has a first conveying area 23, which is adjacent to the mounting table 21 and arranged on the positive X-axis side of the mounting table 21. A first conveying device 24 is provided in the first conveying area 23. The first conveying device 24 has a first conveying arm that moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The first conveying arm conveys the substrate W between the cassette C and the later-described transfer portion 25. The number of the first conveying arms can be one or more. In the latter case, the first conveying device 24 conveys multiple (for example, 5) substrates W in batches.

[0035] The loading and unloading unit 2 has a transfer portion 25, which is adjacent to the first conveying area 23 and arranged on the positive X-axis side of the first conveying area 23. The transfer portion 25 has a first transfer device 26 for temporarily storing the substrate W. The number of the first transfer devices 26 can be multiple, and multiple first transfer devices 26 can also be stacked in the vertical direction. The first transfer device 26 receives the substrate W from the first conveying device 24 and temporarily stores the substrate W until it is transferred to the later-described second conveying device 32. In addition, the first transfer device 26 receives the substrate W from the second conveying device 32 and temporarily stores the substrate W until it is transferred to the first conveying device 24.

[0036] The single-chip processing unit 3 has a second conveying area 31, which is adjacent to the transfer portion 25 and arranged on the positive X-axis side of the transfer portion 25. A second conveying device 32 is provided in the second conveying area 31. The second conveying device 32 has a second conveying arm that moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. The second conveying arm conveys the substrate between the devices adjacent to the second conveying area 31. The number of the second conveying arms can be one or more. In the latter case, the second conveying device 32 conveys multiple (for example, 5) substrates W in batches.

[0037] The single-chip processing unit 3 has, for example, a second transfer device 33, a liquid processing device 34, and a drying device 35 beside the second transfer area 31. The second transfer device 33 is adjacent to the second transfer area 31 and is disposed on the positive X-axis side of the second transfer area 31. The second transfer device 33 receives the substrate W from the second transfer device 32 and temporarily stores the substrate W until it is transferred to the interface unit 5. The liquid processing device 34 is of the single-chip type and processes the substrate W one by one with a processing liquid. There may be a plurality of processing liquids. For example, pure water such as DIW and a drying liquid with a lower surface tension than pure water are preferred. The drying liquid is preferably an alcohol such as IPA (isopropyl alcohol), for example. The drying device 35 is of the single-chip type and dries the substrate W one by one with a supercritical fluid. In addition, both the liquid processing device 34 and the drying device 35 may not be of the single-chip type. It is also possible that the liquid processing device 34 is of the single-chip type and the drying device 35 is of the batch type. The drying device 35 may dry a plurality of substrates W in batch with a supercritical fluid. The number of substrates W processed in batch by the drying device 35 may be equal to or more than the number of substrates W processed in batch by the batch processing unit 6, but may also be less than that number.

[0038] In addition, the arrangement and number of the liquid processing device 34 and the drying device 35 are not limited to Figure 1 the case. For example, the liquid processing device 34 may be disposed on both sides in the Y-axis direction of the second transfer area 31. In addition, the liquid processing devices 34 may be stacked in the Z-axis direction. The arrangement of the drying device 35 is the same as that of the liquid processing device 34. In addition, devices other than the liquid processing device 34 and the drying device 35 may also be disposed beside the second transfer area 31.

[0039] The interface unit 5 has, for example, a batch forming unit 51 and a transfer unit 52. The batch forming unit 51 holds a plurality of substrates W at a first pitch P1 to form a batch L. The transfer unit 52 transfers the substrate W from the single-chip processing unit 3 to the batch forming unit 51, and transfers the substrate W from the batch processing unit 6 to the single-chip processing unit 3.

[0040] As Figure 7 shown, the transfer unit 52 includes a first transfer robot 53 and a second transfer robot 54. The first transfer robot 53 transfers the substrate W from the single-chip processing unit 3 to the batch forming unit 51. The second transfer robot 54 transfers the substrate W from the batch processing unit 6 to the single-chip processing unit 3. In addition, as Figure 8 shown, the transfer unit 52 may also include a single transfer robot 41 that serves as both the first transfer robot 53 and the second transfer robot 54.

[0041] Since the first transfer robot 53 and the second transfer robot 54 are independently provided, the flow A1 of the substrate W from the single-wafer processing unit 3 to the batch processing unit 6 and the flow A3 of the substrate W from the batch processing unit 6 to the single-wafer processing unit 3 can be controlled separately. Therefore, the flow of the substrate W can be prevented from being stagnant at the interface unit 5, and productivity can be improved.

[0042] The batch processing section 6 has a third conveying area 61, which is adjacent to the interface section 5 and is arranged on the positive side of the interface section 5 in the X-axis direction. A third conveying device 62 is provided in the third conveying area 61. The third conveying device 62 has a third conveying arm, which moves in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction and rotates around the vertical axis. In addition, the third conveying arm may not rotate around the vertical axis. The third conveying arm conveys the substrate W between the devices adjacent to the third conveying area 61. The third conveying arm conveys the batch L in batches.

[0043] The third conveying area 61 is rectangular in a plan view, and its longitudinal direction is the X-axis direction. The batch forming unit 51 is arranged next to the short side of the third conveying area 61, and the processing tank (for example, the third rinse liquid tank 68) is arranged next to the long side of the third conveying area 61. The conveying unit 52 is arranged next to both the batch forming unit 51 and the processing tank. The conveying unit 52 is easy to access both the batch forming unit 51 and the processing tank, so as the first conveying robot 53 and the second conveying robot 54, conveying robots with a narrow movable range of the arm tip (Japanese: hand-first) can be used.

[0044] However, since the batch forming unit 51 is arranged beside the short side of the third conveying area 61, and the processing tank is arranged beside the long side of the third conveying area 61, the arrangement direction of the substrates W is different between the batch forming unit 51 and the processing tank. Therefore, the third conveying device 62 rotates around the vertical axis. By rotating the third conveying device 62, the arrangement direction of the substrates W can be changed between the X-axis direction and the Y-axis direction. In addition, when there is no need to change the arrangement direction of the substrates, the third conveying device 62 may not rotate around the vertical axis.

[0045] The batch processing section 6 includes, for example, a first chemical solution tank 63, a first rinse tank 64, a second chemical solution tank 65, a second rinse tank 66, a third chemical solution tank 67, and a third rinse tank 68 beside the third conveying region 61. The above-mentioned processing tanks are arranged along the long side of the third conveying region 61. Specifically, the first chemical solution tank 63, the first rinse tank 64, the second chemical solution tank 65, the second rinse tank 66, the third chemical solution tank 67, and the third rinse tank 68 are arranged in this order from the positive side in the X-axis direction toward the negative side in the X-axis direction.

[0046] In addition, the number of processing tanks arranged beside the third transfer area 61 is not limited to Figure 1 the number. For example, the second chemical solution tank 65 and the second rinse solution tank 66 are a set in Figure 1 but may also be multiple sets.

[0047] The first chemical solution tank 63 stores the first chemical solution for impregnating the lot L. The first chemical solution is not particularly limited. For example, it is DHF (dilute hydrofluoric acid). DHF is used to remove the native oxide film. BHF (a mixed solution of hydrofluoric acid and ammonium fluoride) may also be used instead of DHF. The first rinse solution tank 64 stores the first rinse solution for impregnating the lot L. The first rinse solution is pure water for removing the first chemical solution from the substrate W, for example, DIW (deionized water).

[0048] The batch processing unit 6 has a first processing tool 71 that receives and holds the lot L from the third transfer device 62. The first processing tool 71 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically. In addition, the batch processing unit 6 has a first driving device 72 that moves the first processing tool 71 in the X-axis direction and the Z-axis direction. The first processing tool 71 holds the lot L in the first chemical solution, then holds the lot L in the first rinse solution, and then transfers the lot L to the third transfer device 62.

[0049] In addition, the number of units of the first processing tool 71 and the first driving device 72 is one in the present embodiment, but may also be multiple. In the latter case, one unit impregnates the lot L in the first chemical solution, and the other unit impregnates the lot L in the first rinse solution. In this case, the first driving device 72 only needs to move the first processing tool 71 in the Z-axis direction and may not move the first processing tool 71 in the X-axis direction.

[0050] The second chemical solution tank 65 stores the second chemical solution for impregnating the lot L. The second chemical solution is not particularly limited. For example, it is an aqueous phosphoric acid solution. The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film in the silicon oxide film and the silicon nitride film. The second rinse solution tank 66 stores the second rinse solution for impregnating the lot L. The second rinse solution is pure water for removing the second chemical solution from the substrate W, for example, DIW (deionized water).

[0051] The batch processing unit 6 has a second processing tool 73 that receives and holds the batch L from the third transfer device 62. Similar to the first processing tool 71, the second processing tool 73 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically. In addition, the batch processing unit 6 has a second driving device 74 that moves the second processing tool 73 in the Z-axis direction. The second processing tool 73 holds the batch L in the second chemical solution and then transfers the batch L to the third transfer device 62.

[0052] Similarly, the batch processing unit 6 has a third processing tool 75 that receives and holds the batch L from the third transfer device 62. Similar to the first processing tool 71, the third processing tool 75 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically. In addition, the batch processing unit 6 has a third driving device 76 that moves the third processing tool 75 in the Z-axis direction. The third processing tool 75 holds the batch L in the second rinsing liquid and then transfers the batch L to the third transfer device 62.

[0053] The third chemical solution tank 67 stores the third chemical solution for impregnating the batch L. The third chemical solution is not particularly limited. For example, it is SC1 (a mixed solution of ammonia, hydrogen peroxide, and water). SC1 is used to remove organic substances and fine particles. The third rinsing liquid tank 68 stores the third rinsing liquid for impregnating the batch L. The third rinsing liquid is pure water for removing the third chemical solution from the substrate W, for example, DIW (deionized water).

[0054] The batch processing unit 6 has a first holding tool 811 that receives and holds the batch L from the third transfer device 62. The first holding tool 811 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically. In addition, the batch processing unit 6 has a driving device 818 that moves the first holding tool 811 in the X-axis and Z-axis directions. The first holding tool 811 holds the batch L in the third chemical solution and then holds the batch L in the third rinsing liquid.

[0055] In addition, the number of units of the first holding tool 811 and the driving device 818 is one in the present embodiment, but may also be multiple. In the latter case, one unit impregnates the batch L in the third chemical solution, and the other unit impregnates the batch L in the third rinsing liquid. In this case, the driving device 818 only needs to move the first holding tool 811 in the Z-axis direction, and may not move the first holding tool 811 in the X-axis direction.

[0056] Further, the batch processing unit 6 has a second holding device 814 that receives, in a third processing liquid, a plurality of substrates W arranged at a second pitch P2 (P2 = N × P1) from the first holding device 811. The first holding device 811, the second holding device 814, and the driving device 818 form a batch release unit 81.

[0057] In addition, the types of chemical solutions used in the batch processing unit 6 are not limited to dilute hydrofluoric acid, BFH, aqueous phosphoric acid, and SC1. For example, they can also be dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), plating solutions, etc. The chemical solutions can also be for stripping treatment or plating treatment. In addition, the number of chemical solutions is not particularly limited and can also be one.

[0058] The control unit 9 is, for example, a computer and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. Programs for controlling various processes executed in the substrate processing system 1 are stored in the storage medium 92. The control unit 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. In addition, the control unit 9 includes an input interface 93 and an output interface 94. The control unit 9 receives signals from the outside using the input interface 93 and sends signals to the outside using the output interface 94.

[0059] The above programs are stored in a storage medium that can be read by a computer, for example, and are installed from this storage medium into the storage medium 92 of the control unit 9. Examples of storage media that can be read by a computer include a hard disk (HD), a floppy disk (FD), a compact disc (CD), a magneto-optical disc (MO), and a memory card. In addition, the programs can also be downloaded from a server via the Internet and installed into the storage medium 92 of the control unit 9.

[0060] Next, with reference to Figure 2 , the operation of the above substrate processing system 1, that is, the substrate processing method, will be described. Figure 2 The processing shown is performed under the control of the control unit 9.

[0061] First, the cassette C is fed into the loading / unloading unit 2 in a state of accommodating a plurality of substrates W and is placed on the placement plate 22. Inside the cassette C, the substrates W are held horizontally and are held at a second pitch P2 (P2 = N × P1) in the vertical direction. N is a natural number of 2 or more, and is 2 in this embodiment, but can also be 3 or more.

[0062] Next, the first transfer device 24 takes out the substrate W in the cassette C ( Figure 2In step S101), it is conveyed to the first transfer device 26. Subsequently, the second transfer device 32 receives the substrate W from the first transfer device 26 and conveys it to the second transfer device 33. Thereafter, the first transfer robot 53 receives the substrate W from the second transfer device 33 and conveys it to the batch forming unit 51.

[0063] Subsequently, the batch forming unit 51 holds a plurality of substrates W at a first pitch P1 (P1 = P2 / N) to form a batch L ( Figure 2 in step S102). One batch L includes, for example, substrates W in N cassettes C. The pitch of the substrates W is narrowed from the second pitch P2 to the first pitch P1, whereby the number of substrates W that can be processed in batches can be increased.

[0064] Subsequently, the third transfer device 62 receives the batch L from the batch forming unit 51 and conveys it to the first processing tool 71. In the middle of the conveyance, the third transfer device 62 rotates about the vertical axis to change the arrangement direction of the plurality of substrates W from the X-axis direction to the Y-axis direction.

[0065] Subsequently, the first processing tool 71 descends from above the first chemical solution tank 63, immerses the batch L in the first chemical solution, and performs the first chemical solution treatment ( Figure 2 in step S103). Thereafter, the first processing tool 71 ascends to lift the batch L from the first chemical solution, and then moves in the X-axis direction toward above the first rinse solution tank 64.

[0066] Subsequently, the first processing tool 71 descends from above the first rinse solution tank 64, immerses the batch L in the first rinse solution, and performs the first rinse solution treatment ( Figure 2 in step S104). Thereafter, the first processing tool 71 ascends to lift the batch L from the first rinse solution. Subsequently, the third transfer device 62 receives the batch L from the first processing tool 71 and conveys it to the second processing tool 73.

[0067] Subsequently, the second processing tool 73 descends from above the second chemical solution tank 65, immerses the batch L in the second chemical solution, and performs the second chemical solution treatment ( Figure 2 in step S105). Thereafter, the second processing tool 73 ascends to lift the batch L from the second chemical solution. Subsequently, the third transfer device 62 receives the batch L from the second processing tool 73 and conveys it to the third processing tool 75.

[0068] Subsequently, the third processing tool 75 descends from above the second rinse solution tank 66, immerses the batch L in the second rinse solution, and performs the second rinse solution treatment ( Figure 2 in step S106). Thereafter, the third processing tool 75 ascends to lift the batch L from the second rinse solution. Subsequently, the third transfer device 62 receives the batch L from the third processing tool 75 and conveys it to the first holding tool 811.

[0069] Next, the first holding device 811 descends from above the third chemical solution tank 67, immerses the lot L in the third chemical solution, and performs the third chemical solution treatment ( Figure 2 S107). After that, the first holding device 811 ascends to lift the lot L from the third chemical solution, and then moves in the X-axis direction toward above the third rinsing liquid tank 68.

[0070] Next, the first holding device 811 descends from above the third rinsing liquid tank 68, immerses the lot L in the third rinsing liquid, and performs the third rinsing liquid treatment ( Figure 2 S108).

[0071] In addition, in the middle of the descent, the first holding device 811 transfers a part of the lot L to the second holding device 814, and widens the pitch of the substrates W from the first pitch P1 to the second pitch P2 ( Figure 2 S109). The second holding device 814 holds a plurality of substrates W at the second pitch P2, and the first holding device 811 also holds a plurality of substrates W at the second pitch P2. In addition, the first holding device 811 holds the substrates W transferred to the second holding device 814 and the substrates W that are not transferred to the second holding device 814 and continue to be held in an alternating manner. That is, the substrates W as a part of the lot L and the remaining substrates W of the lot L are alternately arranged repeatedly to form the lot L.

[0072] Next, the second transfer robot 54 transfers the substrates W held separately in the first holding device 811 and the second holding device 814 in the third rinsing liquid to the single-piece processing unit 3. Since the pitch of the substrates W is wide, interference between the substrates W and the second transfer robot 54 can be prevented. In addition, the pitch of the substrates W when forming the lot L can be narrowed, and the number of substrates W that can be processed in batches can be increased. The second transfer robot 54 transfers the substrates W one by one to the liquid processing device 34 of the single-piece processing unit 3.

[0073] Next, the liquid processing device 34 processes the substrates W one by one with a liquid ( Figure 2 S110). There may be a plurality of liquids. For example, pure water such as DIW, and a drying liquid with a lower surface tension than pure water is preferable. The drying liquid is preferably an alcohol such as IPA (isopropyl alcohol). The liquid processing device 34 supplies pure water and the drying liquid to the upper surface of the substrate W in this order to form a liquid film of the drying liquid.

[0074] Next, the second transfer device 32 receives the substrate W from the liquid processing device 34 and horizontally holds the substrate W with the liquid film of the drying liquid facing upward. The second transfer device 32 transfers the substrate W from the liquid processing device 34 to the drying device 35.

[0075] Next, the drying device 35 uses the supercritical fluid to dry the substrates W piece by piece ( Figure 2 The drying liquid can be replaced by the supercritical fluid, and the collapse of the concave-convex pattern of the substrate W caused by the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, in order to miniaturize the pressure-resistant container, batch processing is not performed, but single-chip processing is performed.

[0076] like Figure 9 As shown, the drying device 35 includes a pressure-resistant container 351, a movable tray 353, and a supply port 356. The pressure-resistant container 351 has a feed port 352 for feeding in and out the substrate W. The movable tray 353 has a cover 354 for opening and closing the feed port 352 and a holding portion 355 for holding the substrate W horizontally. When the cover 354 closes the feed port 352, the holding portion 355 holds the substrate W horizontally inside the pressure-resistant container 351. A concave-convex pattern is pre-formed on the upper surface of the substrate W, and the liquid film of the drying liquid covers the concave-convex pattern. The supply port 356 supplies a supercritical fluid such as carbon dioxide to the inside of the pressure-resistant container 351. In addition, the number and position of the supply ports 356 are not limited to. Figure 9 The single-wafer drying device 35 uses a supercritical fluid to dry the substrates W with the liquid film formed thereon one by one.

[0077] In addition, the drying device 35 is a single-chip type in this embodiment, but as mentioned above, it can also be a batch type. The batch type drying device 35 uses a supercritical fluid to batch-dry a plurality of substrates W on which a liquid film is formed. The single-chip drying device 35 has one holding portion 355, while the batch type drying device 35 has a plurality of holding portions 355.

[0078] In addition, the drying device 35 of the present embodiment uses a supercritical fluid to dry the substrate W, but the drying method is not particularly limited. The drying method can be any method as long as it can suppress the collapse of the concave-convex pattern of the substrate W, for example, it can also be spin drying, scanning drying or hydrophobic drying (Japanese: hydrophobic drying). Spin drying rotates the substrate W and uses centrifugal force to throw the liquid film off the substrate W. Scanning drying rotates the substrate W while moving the supply position of the drying liquid from the center of the substrate W toward the periphery of the substrate W, and uses centrifugal force to throw the liquid film off the substrate W. Scanning drying can also move the supply position of a drying gas such as N2 gas from the center of the substrate W toward the periphery of the substrate W in a manner following the supply position of the drying liquid.

[0079] Thereafter, the second transport device 32 receives the substrate W from the drying device 35 and transports the substrate W to the first transport device 26 .

[0080] Next, the first transport device 24 receives the substrate W from the first conveyor device 26 and stores it in the cassette C (Figure 2 (S112). The cassette C is sent out from the loading and unloading unit 2 while accommodating a plurality of substrates W.

[0081] Next, with reference to Figure 3 , Figure 4A , Figure 4B and Figure 4C , the lot forming unit 51 will be described. In addition, depending on the occupied space in the drawings, the number of substrate W sheets is shown as less than the actual number. The number of the first holding grooves 513, the number of the second holding grooves 516, and the number of the through grooves 517 are the same.

[0082] The lot forming unit 51 includes a first holding device 511. As Figure 4C shown, the first holding device 511 holds a plurality of (for example, 50 sheets, only 12 sheets out of 50 are shown in Figure 4C ) substrates W in the X-axis direction at a first pitch P1 to form a lot L. As Figure 3 shown, the first holding device 511 includes a plurality of first arms 512. The number of the first arms 512 is not limited to the number shown in the drawing.

[0083] The plurality of first arms 512 all extend in the X-axis direction and have first holding grooves 513 arranged at the first pitch P1 in the X-axis direction. The outer periphery of the substrate W is inserted into the first holding grooves 513, and the first holding grooves 513 hold the outer periphery of the substrate W. The plurality of first arms 512 hold the respective outer peripheries of a plurality of substrates W at intervals in the circumferential direction.

[0084] In addition, the lot forming unit 51 includes a second holding device 514. As Figure 4B shown, the second holding device 514 holds a plurality of (for example, 25 sheets, only 6 sheets out of 25 are shown in Figure 4B ) substrates W in the X-axis direction at a second pitch P2. As Figure 3 shown, the second holding device 514 includes a plurality of second arms 515. The number of the second arms 515 is not limited to the number shown in the drawing.

[0085] The plurality of second arms 515 all extend in the X-axis direction and have second holding grooves 516 arranged at the second pitch P2 in the X-axis direction. The outer periphery of the substrate W is inserted into the second holding grooves 516, and the second holding grooves 516 hold the outer periphery of the substrate W. The plurality of second arms 515 hold the respective outer peripheries of a plurality of substrates W at intervals in the circumferential direction.

[0086] In addition, the plurality of second arms 515 also have insertion slots 517 arranged at a second pitch P2 in the X-axis direction. The outer periphery of the substrate W is also inserted into the insertion slots 517, but the insertion slots 517 do not hold the outer periphery of the substrate W and allow the substrate W to pass through. The insertion slots 517 and the second holding slots 516 are alternately arranged in the X-axis direction. The insertion slots 517 and the second holding slots 516 are arranged at the same X-axis direction position as any one of the plurality of first holding slots 513.

[0087] Moreover, the lot forming unit 51 has a driving device 518 that moves the first holding tool 511 up and down relative to the second holding tool 514. The first holding tool 511 is moved up and down between a retracted position below the second holding tool 514 (see Figure 4B ) and a lot forming position above the second holding tool 514 (see Figure 4C ).

[0088] Next, referring again to Figure 4A , Figure 4B and Figure 4C , the operation of the lot forming unit 51 will be described.

[0089] First, as shown in Figure 4A , the first holding tool 511 stops at a receiving position below the second holding tool 514. Here, the receiving position may be set between the retracted position and the lot forming position, or may be set at a position above the second holding tool 514. The first transfer robot 53 inserts a plurality of substrates W (for example, 5 substrates, only 2 of the 5 substrates are shown in Figure 4A ) into the insertion slots 517 of the second holding tool 514 and transfers them to the first holding tool 511. This operation is repeated multiple times, and the first holding tool 511 holds a plurality of (for example, 25 substrates, only 6 of the 25 substrates are shown in Figure 4A ) substrates W at the second pitch P2. In addition, the first transfer robot 53 may also insert the substrates W one by one into the insertion slots 517 of the second holding tool 514 and transfer them to the first holding tool 511.

[0090] Next, as shown in Figure 4B , in order to prevent direct interference between the substrate W and the first transfer arm 531 of the first transfer robot 53, the first holding tool 511 descends from the receiving position to the retracted position. Then, the first transfer robot 53 inserts a plurality of substrates W (for example, 5 substrates, only 2 of the 5 substrates are shown in Figure 4B ) into the second holding slots 516 of the second holding tool 514 and transfers them to the second holding tool 514. This operation is repeated multiple times, and the second holding tool 514 holds a plurality of (for example, 25 substrates, in Figure 4AOnly six of the 25 substrates W are illustrated, and the substrate W is held at the second pitch P2. In addition, the first transfer robot 53 may also insert the substrates W one by one into the second holding grooves 516 of the second holding device 514 and transfer them to the second holding device 514.

[0091] Next, as Figure 4C shown, the first holding device 511 rises from the retracted position to the batch formation position. On the way, the first holding device 511 receives the substrate W from the second holding device 514 using the empty first holding groove 513 and combines it with the substrate W originally held, thereby forming a batch L.

[0092] One batch L includes, for example, the substrates W of N cassettes C. Among them, one batch L may include the substrates W of one cassette C or may include the substrates W of three or more cassettes C. One batch L only needs to include a plurality of substrates W at the first pitch P1.

[0093] The batch formation unit 51 may also have a third holding device (not shown). Similar to the second holding device 514, the third holding device holds a plurality of substrates W at the second pitch P2 and transfers the held substrates W to the first holding device 511. Since the first holding device 511 receives the substrates W not only from the second holding device 514 but also from the third holding device, the ratio N of the first pitch P1 to the second pitch P2 can be increased, and the number of substrates W that can be processed in batches can be increased.

[0094] Next, with reference to Figure 5 , Figure 6A , Figure 6B and Figure 6C , the batch release unit 81 will be described. In addition, depending on the occupied space in the drawings, the number of substrates W is illustrated as less than the actual number. The same applies to the number of the first holding grooves 813, the number of the second holding grooves 816, and the number of the through grooves 817.

[0095] The batch release unit 81 has a first holding device 811. As Figure 6A shown, the first holding device 811 holds a plurality of (for example, 50, and only 12 of the 50 are illustrated in Figure 6A ) substrates W in the Y-axis direction at the first pitch P1. As Figure 5 shown, the first holding device 811 has a plurality of first arms 812. The number of the first arms 812 is not limited to the illustrated number.

[0096] A plurality of first arms 812 all extend in the Y-axis direction and have first holding grooves 813 arranged at a first pitch P1 in the Y-axis direction. The outer periphery of the substrate W is inserted into the first holding grooves 813, and the first holding grooves 813 hold the outer periphery of the substrate W. The plurality of first arms 812 hold the respective outer peripheries of a plurality of substrates W at intervals in the circumferential direction.

[0097] In addition, the batch release unit 81 has a second holding device 814. As Figure 6B shown, the second holding device 814 holds a plurality of (for example, 25 pieces, only 6 pieces of the 25 pieces are shown in Figure 6B ) substrates W at a second pitch P2 in the Y-axis direction. As Figure 5 shown, the second holding device 814 has a plurality of second arms 815. The number of the second arms 815 is not limited to the number shown in the figure.

[0098] The plurality of second arms 815 all extend in the Y-axis direction and have second holding grooves 816 arranged at a second pitch P2 in the Y-axis direction. The outer periphery of the substrate W is inserted into the second holding grooves 816, and the second holding grooves 816 hold the outer periphery of the substrate W. The plurality of second arms 815 hold the respective outer peripheries of a plurality of substrates W at intervals in the circumferential direction.

[0099] In addition, the plurality of second arms 815 also have through grooves 817 arranged at a second pitch P2 in the Y-axis direction. The outer periphery of the substrate W is also inserted into the through grooves 817, but the through grooves 817 do not hold the outer periphery of the substrate W but allow the substrate W to pass through. The through grooves 817 and the second holding grooves 816 are alternately arranged in the Y-axis direction. The through grooves 817 and the second holding grooves 816 are arranged at the same Y-axis direction position as any one of the plurality of first holding grooves 813.

[0100] Moreover, the batch release unit 81 has a driving device 818, and the driving device 818 moves the first holding device 811 up and down relative to the second holding device 814. The first holding device 811 is moved up and down between a descent start position (refer to Figure 6A ) above the second holding device 814 and a descent end position (refer to Figure 6B ) below the second holding device 814.

[0101] Next, referring to Figure 6A , Figure 6B and Figure 6C again, the operation of the batch release unit 81 will be described.

[0102] First, as Figure 6A shown, the first holding device 811 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction at the descent start position. The first holding device 811 holds each of the plurality of substrates W vertically. The descent start position is set above the third rinse liquid tank 68.

[0103] Next, as Figure 6B shown, the first holding device 811 descends in order to transfer a part of the lot L to the second holding device 814. The second holding device 814 receives a plurality of substrates W arranged at the second pitch P2 from the first holding device 811 in the third rinsing liquid. The first holding device 811 holds the plurality of substrates W that have passed through the through slots 817 of the second holding device 814 at the second pitch P2 at the descending end position.

[0104] As a result, the plurality of substrates W are separately held in the first holding device 811 and the second holding device 814 in the third rinsing liquid. The second holding device 814 holds the plurality of substrates W at the second pitch P2 at a position above the first holding device 811. Similarly, the first holding device 811 holds the plurality of substrates W at the second pitch P2. The plurality of substrates W are held vertically respectively.

[0105] Next, as Figure 6B shown, the second transfer robot 54 receives the substrate W from the second holding device 814, takes out the substrate W one by one from the third rinsing liquid, and transfers it to the single-piece processing unit 3. Since the substrates W are held at the second pitch P2, interference between the substrate W and the second transfer arm 541 of the second transfer robot 54 can be prevented. In addition, the second transfer robot 54 may also take out the substrates W in multiple pieces from the third rinsing liquid. This taking-out is repeated until all the substrates W are taken out from the second holding device 814.

[0106] Next, as Figure 6C shown, the first holding device 811 ascends in order to transfer the substrate W to the second transfer robot 54. The first holding device 811 stops at a position slightly below the second holding device 814, but may also stop at a position above the second holding device 814. As long as the substrate W remains immersed in the third rinsing liquid.

[0107] Next, as Figure 6C shown, the second transfer robot 54 receives the substrate W from the first holding device 811, takes out the substrate W one by one from the third rinsing liquid, and transfers it to the single-piece processing unit 3. Since the substrates W are held at the second pitch P2, interference between the substrate W and the second transfer arm 541 of the second transfer robot 54 can be prevented. In addition, the second transfer robot 54 may also take out the substrates W in multiple pieces from the third rinsing liquid. This taking-out is repeated until all the substrates W are taken out from the first holding device 811.

[0108] As described above, the substrate W is held in the third rinsing liquid until it is taken out of the third rinsing liquid by the second transfer robot 54. Since the substrate W is located at a position below the liquid surface of the third rinsing liquid, the surface tension of the third rinsing liquid does not act on the substrate W, and the collapse of the concavo-convex pattern of the substrate W can be prevented.

[0109] The batch release unit 81 may also have a third holding device (not shown). Similar to the second holding device 814, the third holding device receives a plurality of substrates W arranged at the second pitch P2 from the first holding device 811 in the third rinsing liquid. Since the first holding device 811 transfers the substrate W not only to the second holding device 814 but also to the third holding device, the ratio N of the first pitch P1 to the second pitch P2 can be increased.

[0110] In addition, in order to miniaturize the batch processing unit 6, the batch release unit 81 is provided in the third rinsing liquid tank 68, but it may also be provided in a dedicated processing tank. Similar to the third rinsing liquid tank 68, it is preferable that this processing tank is used to store pure water. If pure water is used, the aging of the second transfer arm 541 of the second transfer robot 54 can be suppressed. In addition, as long as the aging of the second transfer arm 541 can be suppressed, the batch release unit 81 may also be provided in a chemical solution tank.

[0111] Next, with reference to Figure 7 , the first transfer robot 53 and the second transfer robot 54 will be described. In addition, according to the occupied space of the drawings, the number of the first transfer arms 531 of the first transfer robot 53 is shown to be less than the actual number.

[0112] The first transfer robot 53 transfers the substrate W from the single-chip processing unit 3 to the batch forming unit 51 of the interface unit 5. After the substrate W is formed into a batch L by the batch forming unit 51, it is transferred from the batch forming unit 51 to the batch processing unit 6.

[0113] The first transfer robot 53 is, for example, a six-axis robot and has six rotation axes R1, R2, R3, R4, R5, and R6. In addition, the first transfer robot 53 may also be a seven-axis robot. Furthermore, the first transfer robot 53 may also be a multi-joint robot or an orthogonal robot, etc. The orthogonal robot may also have a rotation axis.

[0114] The first transfer robot 53 has a first transfer arm 531 at the tip of its arm. The first transfer arm 531 is used to hold the substrate W. The thickness of the first transfer arm 531 is set to be able to insert the first transfer arm 531 between the substrates W arranged at the second pitch P2. A plurality of first transfer arms 531 may also be provided so as to be able to transfer a plurality of (for example, five, only two of the five are shown in Figure 7 ) substrates W in batches.

[0115] The second transfer robot 54 transfers the substrate W from the batch processing unit 6 to the single wafer processing unit 3. For example, the second transfer robot 54 transfers the substrate W from the third rinse liquid tank 68 to the liquid processing device 34. For the transfer of the substrate W from the third rinse liquid tank 68 to the liquid processing device 34, the second transfer robot 54 is used, and the second transfer device 32 is not used. Thus, it is possible to prevent the second transfer device 32 from being wetted by the third rinse liquid. In addition, the transfer source is appropriately selected according to the structure of the batch processing unit 6. Similarly, the transfer destination is appropriately selected according to the structure of the single wafer processing unit 3.

[0116] The second transfer robot 54 is configured in the same manner as the first transfer robot 53 and has a second transfer arm 541 at the tip of its arm. The second transfer arm 541 is used to hold the substrate W. The thickness of the second transfer arm 541 is set to be able to insert the second transfer arm 541 between the substrates W arranged at the second pitch P2. The second transfer arm 541 is provided with only one for transferring the substrates W one by one, but may also be provided with a plurality of them so as to be able to transfer a plurality of substrates W in batches.

[0117] Since the second transfer arm 541 takes out the substrate W from the third rinse liquid, it is wetted by the third rinse liquid. In order to prevent the third rinse liquid from dripping from the second transfer arm 541 to its wrist, the second transfer robot 54 is suspended from the top 55 of the interface unit 5. On the other hand, the first transfer robot 53 is provided on the floor 56 of the interface unit 5.

[0118] Alternatively, the configurations of the second transfer robot 54 and the first transfer robot 53 may be reversed, that is, the first transfer robot 53 may be suspended from the top 55, and the second transfer robot 54 may be provided on the floor 56. In this case, it is possible to prevent the third rinse liquid adhering to the second transfer arm 541 from dripping onto the first transfer robot 53. The first transfer robot 53 can always transfer the substrate W in a dry state.

[0119] In addition, for the first transfer robot 53 and the second transfer robot 54, both of them may be suspended from the top 55, or both of them may be provided on the floor 56. In addition, one or more of the first transfer robot 53 and the second transfer robot 54 may be provided on the side wall. The side wall is arranged between the top 55 and the floor 56, different from the top 55 and the floor 56, and the side wall is arranged vertically. The top 55 and the floor 56 are arranged horizontally.

[0120] Alternatively, during the conveyance of the substrate W by the second conveyance arm 541, high-humidity gas may be supplied to the substrate W for the purpose of preventing the drying of the substrate W. Alternatively, a gas nozzle for blowing off droplets adhering to the second conveyance arm 541 may be provided in the second conveyance robot 54. Further alternatively, a water receiving tray for collecting droplets dripping from the second conveyance arm 541 toward its wrist may be provided in the second conveyance robot 54. The droplets are droplets condensed from the third rinsing liquid or high-humidity gas.

[0121] As described above, embodiments of the substrate processing system and the substrate processing method of the present disclosure have been described, but the present disclosure is not limited to the above-described embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope recited in the claims. These are of course also within the technical scope of the present disclosure.

[0122] For example, in the above-described embodiment and the above-described modification, the cassette C stores the substrates W at the second pitch P2 inside thereof, but may store them at a pitch other than the second pitch P2, and may store them at a pitch narrower than the second pitch P2 (for example, the first pitch P1) or at a pitch wider than the second pitch P2. If the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the first conveyance robot 53 and the second conveyance robot 54 can be suppressed.

[0123] In the above-described embodiment and the above-described modification, the batch formation unit 51 narrows the pitch of the substrates W when forming the batch L, but may not narrow it. For example, when the number of substrates W stored in the cassette C is less than the maximum number of substrates that can be stored in the cassette C, the batch formation unit 51 may not narrow the pitch of the substrates W. In short, if the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2, interference between the substrates W and the first conveyance robot 53 and the second conveyance robot 54 can be suppressed.

[0124] In the above-described embodiment and the above-described modification, the batch release unit 81 widens the pitch of the substrates W from the first pitch P1 to the second pitch P2 in a bulk processing liquid larger than the substrates W, but may also widen the pitch of the substrates W from the first pitch P1 to the second pitch P2 in a mist-like processing liquid. Even if the processing liquid is in a mist state, since drying of the substrates W can be prevented, collapse of the uneven patterns on the substrates W can be suppressed.

[0125] In the above-described embodiment and the above-described modification, as Figure 7 shown, the conveyance unit 52 includes the first conveyance robot 53 and the second conveyance robot 54, but may also, as Figure 8 shown, include one conveyance robot 41. The conveyance robot 41 serves as both the first conveyance robot 53 and the second conveyance robot 54.

[0126] The transfer robot 41 has the first transfer arm 531 of the first transfer robot 53 and the second transfer arm 541 of the second transfer robot 54. The first transfer arm 531 and the second transfer arm 541 are respectively installed at the top of the arm of the transfer robot 41. The transfer robot 41 uses the first transfer arm 531 to transfer the substrate W from the single-piece processing unit 3 to the batch forming unit 51, and uses the second transfer arm 541 to transfer the substrate W from the batch processing unit 6 to the single-piece processing unit 3.

[0127] As Figure 8 shown, in order to make the first transfer arm 531 and the second transfer arm 541 move independently, the transfer robot 41 further has a moving mechanism 411 that relatively moves the second transfer arm 541 with respect to the first transfer arm 531. The moving mechanism 411 is provided, for example, at the top of the arm of the transfer robot 41. In Figure 8 this case, the moving mechanism 411 moves the second transfer arm 541 with respect to the top of the arm of the transfer robot 41, but it is also possible to move the first transfer arm 531 with respect to the top of the arm of the transfer robot 41.

[0128] As Figure 8 shown, the transfer robot 41 can be suspended from the top 55, can be provided on the ground 56, or can also be provided on the side wall.

[0129] In the above-described embodiment and the above-described modification, the batch processing unit 6 has the batch release unit 81, but it is also possible not to have at least a part of the batch release unit 81. Specifically, it is also possible not to have the second holding device 814. The loading / unloading unit 2, the single-piece processing unit 3, the interface unit 5, and the batch processing unit 6 are arranged in this order. If the interface unit 5 has the batch forming unit 51 and the transfer unit 52, then as described above, the transfer path of the substrate W can be ensured, and the substrate processing system 1 can be miniaturized. This is because the loading / unloading unit 2 serves as both a loading unit and an unloading unit.

[0130] In the above-described embodiment and the above-described modification, the single-piece processing unit 3 has both the liquid processing device 34 and the drying device 35, but it is also possible to have only the drying device 35. In this case, it is also possible that the transfer unit 52 directly transfers the substrate W to the drying device 35, or it is also possible that the transfer unit 52 transfers the substrate W to the second transfer device 33, and the second transfer device 32 transfers the substrate W received from the second transfer device 33 to the drying device 35. In addition, in this case, it is also possible that, with the lid 354 of the drying device 35 open and the holding unit 355 holding the substrate W ( Figure 9 the state shown), the drying liquid is supplied to the upper surface of the substrate W to form a liquid film of the drying liquid on the substrate W.

Claims

1. A substrate processing system, wherein, The substrate processing system includes: A loading / unloading unit for loading / unloading a cassette containing a plurality of substrates; A batch processing unit for batch-processing a batch containing a plurality of the substrates; A single-substrate processing unit for processing the substrates of the batch one by one; And An interface unit for transferring the substrates between the batch processing unit and the single-substrate processing unit, wherein the batch processing unit includes a processing tank that stores a processing liquid for impregnating the batch, the interface unit includes a transfer unit that takes out the substrate from the processing tank and transfers it to the single-substrate processing unit, and the single-substrate processing unit includes a liquid processing device that supplies liquid to the substrates one by one.

2. A substrate processing system, wherein, The substrate processing system includes: A loading / unloading unit for loading / unloading a cassette containing a plurality of substrates; A batch processing unit for batch-processing a batch containing a plurality of the substrates; A single-substrate processing unit for processing the substrates of the batch one by one; And An interface unit for transferring the substrates between the batch processing unit and the single-substrate processing unit, wherein the batch processing unit includes a processing tank that stores a processing liquid for impregnating the batch, the interface unit includes a transfer unit that takes out the substrate from the processing tank and transfers it to the single-substrate processing unit, and the single-substrate processing unit includes a drying device that supplies the liquid and the supercritical fluid to the substrates one by one in the order of the liquid and the supercritical fluid.

3. The substrate processing system according to claim 2, wherein, The single-substrate processing unit includes: a transfer device that receives the substrate from the transfer unit; and a conveying device that conveys the substrate from the transfer device to the drying device.

4. The substrate processing system according to claim 2, wherein, The transfer unit takes out the substrate in a state where a rinsing liquid is stored in the processing tank of the batch processing unit, maintains the substrate in a wet state, and transfers the substrate.

5. The substrate processing system according to any one of claims 1 to 3, wherein, The transfer unit includes a transfer arm that holds the substrate and supplies high-humidity gas to the substrate.

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