Cleaning device for semiconductor device processing

Abstract

The invention discloses a cleaning device for semiconductor device processing, and relates to the technical field of semiconductor processing, the cleaning device comprises a machine body and a separation assembly, the separation assembly is arranged at the lower part of the machine body, and the separation assembly comprises a rotating groove, a gear ring, a driving wheel, a driving motor, a separation cylinder, a temporary storage cylinder, a communicating pipe, a chip removal hole, a collection disc and a blow-off pipe; a rotating groove is formed in the lower portion of the machine body, a gear ring is arranged in the rotating groove, a driving wheel is arranged on one side of the gear ring, a driving motor is connected to one side of the driving wheel, a separation barrel is connected to the inner side of the gear ring, a temporary storage barrel is connected to the inner side of the separation barrel, a communicating pipe is arranged in the middle of the separation barrel, and chip removal holes are formed in the side wall of the separation barrel. During use, impurities in waste liquid can be separated and recycled through the centrifugal effect, materials can be firmly clamped during use, the cleaning effect is guaranteed, cleaning liquid residues are avoided, and damage to the materials can also be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and specifically to a cleaning device for semiconductor device processing. Background Art

[0002] Semiconductors are used in fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. For example, diodes are devices made of semiconductors. After semiconductor components are produced, they need to be cleaned, such as semiconductor wafers.

[0003] However, when the existing cleaning device cleans the wafer, it is difficult to only treat the waste liquid after cleaning cleanly through filtration for reuse, and there may be a difference in the flow rate of the cleaning liquid between the edge and the center due to the wafer edge effect, resulting in inconsistent cleaning effects.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a cleaning device for semiconductor device processing is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a cleaning device for semiconductor device processing to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A cleaning device for semiconductor device processing, including a body and a separation component. The separation component is arranged at the lower part of the body. The separation component includes a rotating groove, a gear ring, a driving wheel, a driving motor, a separation cylinder, a temporary storage cylinder, a connecting pipe, a chip discharging hole, a collecting tray, and a sewage discharge pipe. A rotating groove is arranged at the lower part of the body, and a gear ring is arranged in the rotating groove. A driving wheel is arranged on one side of the gear ring, and a driving motor is connected to one side of the driving wheel. The inner side of the gear ring is connected to a separation cylinder, and the inner side of the separation cylinder is connected to a temporary storage cylinder. A connecting pipe is arranged in the middle of the separation cylinder, and a chip discharging hole is opened on the side wall of the separation cylinder. A collecting tray is arranged on one side of the separation cylinder, and a sewage discharge pipe is connected to one side of the collecting tray.

[0007] Furthermore, the gear ring meshes with the driving wheel, and the gear ring is rotationally connected to the body through the rotating groove. The connecting pipe penetrates through the lower wall of the collecting tray and is communicated with the inside of the body, and the connecting pipe penetrates through the separation cylinder and is communicated with the inside of the temporary storage cylinder through a one-way valve. Both the separation cylinder and the temporary storage cylinder are conical barrels, and the inclination of the inner wall of the temporary storage cylinder is 45°, the inclination of the side wall of the separation cylinder is 60°, and a double-headed spiral guiding groove is arranged on the inner wall of the separation cylinder.

[0008] Furthermore, a water suction pipe is arranged on one side of the body, and one end of the water suction pipe is connected to a water pump. A water delivery pipe is connected to one side of the water pump. A straight pipe is arranged in the middle of the body, and the lower end of the straight pipe is located inside the temporary storage cylinder.

[0009] Furthermore, an air extraction pipe is provided at the rear side of the fuselage, and one end of the air extraction pipe is connected to an air extractor. One side of the air extractor is connected to a heater, and one side of the heater is connected to an air supply pipe.

[0010] Furthermore, lifting rods are symmetrically connected to the upper part of the fuselage, and one end of each lifting rod is connected to a backing plate. A chute is formed in the middle of the backing plate, and telescopic rods are arranged on both sides of the backing plate. One end of each telescopic rod is connected to a push block, and an air outlet is arranged on one side of the push block. An ultrasonic emitter is connected to the lower side of the backing plate, and the air outlet is connected to the air supply pipe through a telescopic hose.

[0011] Furthermore, a cleaning component is arranged on the other side of the push block. The cleaning component includes a sleeve and valve grooves. The other side of the push block is connected to the sleeve, and valve grooves are symmetrically formed in the sleeve.

[0012] Furthermore, the cleaning component further includes a closing spring, a valve plate and a through groove. Closing springs are symmetrically connected in the valve grooves, and one end of each closing spring is connected to the valve plate. Through grooves are formed on the surface of the valve plate. The valve plate is elastically connected to the valve groove through the closing spring, and the valve plate is in snap-fit sliding connection with the sleeve through the valve groove. The valve plates are closely attached to each other.

[0013] Furthermore, the cleaning component further includes a slot, a cleaning head and an insertion plate. A slot is formed in the middle of the sleeve in the valve groove, and a cleaning head is connected to one end of the sleeve. Insertion plates are symmetrically connected in the cleaning head, and the insertion plates are in sliding connection with the sleeve through the slot and in snap-fit sliding connection with the valve plate through the through groove. The cleaning head is made of elastic soft silicone.

[0014] Furthermore, a sealing groove is formed in the middle of the fuselage, and a bottom plate is in snap-fit sliding connection in the sealing groove. A sealing plate is connected to one side of the bottom plate, and a material placing frame is rotatably connected to the middle of the bottom plate. A gear ring is connected to one side of the material placing frame, and a transmission wheel is arranged on one side of the gear ring. The transmission wheel is connected to a driving wheel through a reduction box. The sealing plate is in snap-fit connection with the fuselage through the sealing groove.

[0015] Furthermore, an air extraction port is formed inside the material placing frame, and an air cavity is formed on one side of the air extraction port. Pushing rods are symmetrically connected in the material placing frame, and a clamping plate is connected to one side of each pushing rod. The air extraction port is communicated with a straight pipe through the air cavity. The clamping plate is made of a flexible material.

[0016] The present invention provides a cleaning device for semiconductor device processing, which has the following beneficial effects: during use, impurities in the waste liquid can be separated by centrifugal force for recycling, and during use, the material can be firmly clamped, and the cleaning effect can be ensured, the residual cleaning liquid can be avoided, and damage to the material can also be avoided.

[0017] 1. When the present invention is in use, the waste liquid or waste gas after cleaning enters the temporary storage cylinder from the straight pipe. After dissolving into the cleaning liquid in the temporary storage cylinder, the driving motor drives the toothed ring to rotate through the driving wheel, so that the separation cylinder drives the temporary storage cylinder to rotate, causing the cleaning liquid in the temporary storage cylinder to rotate together with the temporary storage cylinder. Under the action of centrifugal force, the cleaning liquid in the temporary storage cylinder moves along the cylinder wall and flows onto the inner wall of the separation cylinder. As the separation cylinder continues to rotate, the miscellaneous impurities in the cleaning liquid move downward along the spiral diversion groove on the cylinder wall of the separation cylinder, while the clean cleaning liquid separated from the impurities can move upward along the spiral diversion groove until it overflows from the upper edge of the separation cylinder into the fuselage for recycling. As the cleaning liquid in the temporary storage cylinder decreases and the rotation causes the liquid level at the center position of the temporary storage cylinder to drop, the cleaning liquid in the fuselage will enter the temporary storage cylinder through the connecting pipe to supplement the cleaning liquid, so that the liquid level of the cleaning liquid at the center position of the temporary storage cylinder is always higher than the lower end of the straight pipe, enabling the cleaning liquid to seal the lower end of the straight pipe, ensuring that the waste gas and waste liquid can smoothly mix into the cleaning liquid in the temporary storage cylinder, preventing the waste gas from directly escaping into the fuselage. After the separated impurities move to the bottom of the separation cylinder, they can leave the separation cylinder through the chip discharge hole under the action of centrifugal force and enter the collection tray. When the cleaning is completed, the driving motor continues to operate for a period of time to ensure that all the waste liquid can flow from the temporary storage cylinder into the separation cylinder and complete the separation. After the driving motor stops, a part of the remaining cleaning liquid in the separation cylinder will directly fall into the temporary storage cylinder, and the other part of the cleaning liquid will flow down along the cylinder wall, flushing the remaining impurities at the bottom of the separation cylinder from the chip discharge hole into the collection tray. The impurities in the collection tray can be collectively discharged through the sewage pipe. The one-way valve in the connecting pipe can prevent the cleaning liquid in the temporary storage cylinder from entering the fuselage and polluting the cleaning liquid in the fuselage. In summary, during use, the waste liquid and waste gas can be directly purified, and the cleaning liquid can be recycled.

[0018] 2. When cleaning the wafer, the water pump can suck the cleaning liquid from the lower part of the fuselage into the water supply pipe through the suction pipe, and then send it to the sleeve through the hose. The lifting rod drives the backing plate to descend, so that the sleeve can drive the cleaning head to approach the wafer. After the cleaning head presses on the wafer, the cleaning head drives the plug board to move in the slot, which can make the plug board drive the valve plate to slide in the valve slot, opening the sleeve, and the cleaning liquid can be sprayed onto the wafer. By controlling the descending distance of the backing plate, the moving distance of the plug board can be controlled, and then the flow rate in the sleeve can be controlled through the valve plate. As the water pump sucks the cleaning liquid, the air pressure in the lower part of the fuselage drops, and the air in the air chamber can be pumped out through the straight pipe, creating a negative pressure in the air chamber. The wafer is adsorbed in the material placement frame through the air suction port to prevent the wafer from moving during cleaning, which may lead to unsatisfactory cleaning effect. As the water pump continues to operate, the cleaning liquid on the wafer will be sucked into the air chamber through the air suction port and then enter the straight pipe. Start the drive motor, and the drive motor can make the drive wheel drive the transmission wheel to rotate slowly through the reduction gearbox, and then drive the material placement plate to drive the wafer to rotate on the bottom plate through the toothed ring. At the same time, the telescopic rod drives the push block to move, so that the sleeve can move from the center of the backing plate to the edge in the chute, thereby comprehensively cleaning the wafer. While ensuring consistent cleaning effect, most of the cleaning waste liquid can also be scraped off from the wafer. The material of the cleaning head can avoid damaging the wafer. At the same time, start the air extractor, pump out the air in the lower part of the fuselage through the suction pipe, heat it through the heater, and then send it into the air outlet through the air supply pipe to blow the wafer surface, blowing off the residual cleaning liquid to avoid damage to the wafer caused by the residual cleaning liquid on the wafer surface. The operation of the air extractor can not only enhance the adsorption effect of the wafer but also accelerate the extraction of the waste liquid in the material placement frame. In summary, when cleaning the wafer, it can be comprehensively cleaned, ensuring consistent cleaning effect and avoiding wafer damage caused by residual cleaning liquid.

[0019] 3. When cleaning other semiconductor devices, the present invention can emit ultrasonic waves to the semiconductor device through an ultrasonic transmitter. At the same time, the air extractor operates to extract the air at the lower part of the fuselage through the extraction pipe and then send it into the air outlet through the supply pipe. The telescopic rod drives the air outlet to move in the sliding groove through the push block, so that impurities, dust, etc. on the semiconductor device can be blown away. If it is necessary to remove the excess solder paste on the device, just turn on the heater to melt it for easy blowing. After the air at the lower part of the fuselage is extracted, a negative pressure will be generated inside the lower part of the fuselage, and the air in the air cavity will be extracted into the temporary storage cylinder through the straight pipe. The impurities, dust, etc. blown from the device can enter the temporary storage cylinder from the air cavity and the straight pipe through the air extraction port and dissolve into the cleaning liquid. When placing the device, place the device in the middle of the material placing frame and synchronously start the opposing push rods, so that the clamping plates can approach the device synchronously until the device is firmly clamped. The flexible material of the clamping plates can avoid damaging the device. When placing the wafer, just place it in the center of the material placing frame. After the materials are placed, slide the bottom plate into the fuselage through the sealing groove and make the sealing plate engage with the fuselage through the sealing groove, then the sealing of the fuselage can be completed, making the fuselage in a sealed state to prevent external air from entering. In summary, during use, the placement of materials can be conveniently completed, and other non-wafer devices can be cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic exploded perspective sectional view of the separation component of a cleaning device for semiconductor device processing according to the present invention;

[0021] Figure 2 is a schematic overall sectional perspective view of a cleaning device for semiconductor device processing according to the present invention;

[0022] Figure 3 is a schematic overall perspective view of a cleaning device for semiconductor device processing according to the present invention;

[0023] Figure 4 is a schematic exploded perspective sectional view of the backing plate of a cleaning device for semiconductor device processing according to the present invention;

[0024] Figure 5 is a schematic exploded perspective sectional view of the cleaning component of a cleaning device for semiconductor device processing according to the present invention;

[0025] Figure 6 is a schematic exploded perspective sectional view of the material placing frame of a cleaning device for semiconductor device processing according to the present invention.

[0026] In the figure: 1, fuselage; 2, separation component; 201, rotating groove; 202, gear ring; 203, driving wheel; 204, driving motor; 205, separation cylinder; 206, temporary storage cylinder; 207, connecting pipe; 208, chip discharging hole; 209, collection tray; 210, sewage discharge pipe; 3, water suction pipe; 4, water pump; 5, water supply pipe; 6, straight pipe; 7, air suction pipe; 8, air extractor; 9, heater; 10, air supply pipe; 11, lifting rod; 12, backing plate; 13, sliding groove; 14, telescopic rod; 15, pushing block; 16, air outlet; 17, ultrasonic transmitter; 18, cleaning component; 1801, sleeve; 1802, valve groove; 1803, closing spring; 1804, valve plate; 1805, through groove; 1806, slot; 1807, cleaning head; 1808, inserting plate; 19, sealing groove; 20, bottom plate; 21, sealing plate; 22, material placing frame; 23, gear ring; 24, transmission wheel; 25, air suction port; 26, air cavity; 27, pushing rod; 28, clamping plate. Specific implementation manner

[0027] Please refer to Figures 1 to 6 As shown in the figure, the present invention provides a technical solution: a cleaning device for semiconductor device processing, including a fuselage 1 and a separation component 2. The separation component 2 is arranged below the fuselage 1. The separation component 2 includes a rotating groove 201, a gear ring 202, a driving wheel 203, a driving motor 204, a separation cylinder 205, a temporary storage cylinder 206, a connecting pipe 207, a chip discharging hole 208, a collection tray 209 and a sewage discharge pipe 210. A rotating groove 201 is arranged below the fuselage 1, and a gear ring 202 is arranged in the rotating groove 201. A driving wheel 203 is arranged on one side of the gear ring 202, and a driving motor 204 is connected to one side of the driving wheel 203. The inner side of the gear ring 202 is connected to a separation cylinder 205, and the inner side of the separation cylinder 205 is connected to a temporary storage cylinder 206. A connecting pipe 207 is arranged in the middle of the separation cylinder 205, and a chip discharging hole 208 is formed in the side wall of the separation cylinder 205. A collection tray 209 is arranged on one side of the separation cylinder 205, and a sewage discharge pipe 210 is connected to one side of the collection tray 209.

[0028] Please refer to Figures 1 to 3, the toothed ring 202 meshes with the driving wheel 203, and the toothed ring 202 is rotatably connected to the fuselage 1 through the rotating groove 201. The communicating pipe 207 penetrates through the lower wall of the collecting tray 209 and communicates with the inside of the fuselage 1, and the communicating pipe 207 penetrates through the separating cylinder 205 and is internally communicated with the temporary storage cylinder 206 through a one-way valve. The separating cylinder 205 and the temporary storage cylinder 206 are both conical barrels, and the inner wall inclination of the temporary storage cylinder 206 is 45°. The side wall inclination of the separating cylinder 205 is 60°, and a double-headed spiral guide groove is provided on the inner wall of the separating cylinder 205. A water suction pipe 3 is provided on one side of the fuselage 1, and one end of the water suction pipe 3 is connected to a water pump 4. A water supply pipe 5 is connected to one side of the water pump 4. A straight pipe 6 is provided in the middle of the fuselage 1, and the lower end of the straight pipe 6 is located inside the temporary storage cylinder 206. An air suction pipe 7 is provided at the rear of the fuselage 1, and one end of the air suction pipe 7 is connected to an air extractor 8. A heater 9 is connected to one side of the air extractor 8, and an air supply pipe 10 is connected to one side of the heater 9;

[0029] The specific operation is as follows. When in use, the waste liquid or waste gas after cleaning enters the temporary storage cylinder 206 from the straight pipe 6. After dissolving into the cleaning liquid in the temporary storage cylinder 206, the driving motor 204 drives the gear ring 202 to rotate through the driving wheel 203, so that the separation cylinder 205 drives the temporary storage cylinder 206 to rotate, causing the cleaning liquid in the temporary storage cylinder 206 to rotate together with the temporary storage cylinder 206. Under the action of centrifugal force, the cleaning liquid in the temporary storage cylinder 206 moves along the cylinder wall and flows onto the inner wall of the separation cylinder 205. As the separation cylinder 205 continues to rotate, the mixed impurities in the cleaning liquid move downward along the spiral diversion groove on the cylinder wall of the separation cylinder 205, while the clean cleaning liquid separated from the impurities can move upward along the spiral diversion groove until it overflows from the upper edge of the separation cylinder 205 into the fuselage 1 for recycling. As the cleaning liquid in the temporary storage cylinder 206 decreases and the rotation causes the liquid level at the center position of the temporary storage cylinder 206 to drop, the cleaning liquid in the fuselage 1 will enter the temporary storage cylinder 206 through the connecting pipe 207 to supplement the cleaning liquid, so that the liquid level of the cleaning liquid at the center position of the temporary storage cylinder 206 is always higher than the lower end of the straight pipe 6, enabling the cleaning liquid to seal the lower end of the straight pipe 6 and ensuring that the waste gas and waste liquid can smoothly mix into the cleaning liquid in the temporary storage cylinder 206, preventing the waste gas from directly escaping into the fuselage 1. After the separated impurities move to the bottom of the separation cylinder 205, they can leave the separation cylinder 205 through the chip discharge hole 208 under the action of centrifugal force and enter the collection tray 209. When the cleaning is completed, the driving motor 204 continues to operate for a period of time to ensure that all the waste liquid can flow from the temporary storage cylinder 206 into the separation cylinder 205 and complete the separation. After the driving motor 204 stops, a part of the remaining cleaning liquid in the separation cylinder 205 will directly fall into the temporary storage cylinder 206, and the other part of the cleaning liquid will flow down along the cylinder wall, flushing the remaining impurities at the bottom of the separation cylinder 205 from the chip discharge hole 208 into the collection tray 209. The impurities in the collection tray 209 can be collectively discharged through the sewage discharge pipe 210. The one-way valve in the connecting pipe 207 can prevent the cleaning liquid in the temporary storage cylinder 206 from entering the fuselage 1 and polluting the cleaning liquid in the fuselage 1. In summary, when in use, the waste liquid and waste gas can be directly purified, and the cleaning liquid can be recycled.

[0030] Please refer to Figures 1 to 6, on the upper part of the fuselage 1, lifting rods 11 are symmetrically connected, and one end of each lifting rod 11 is connected to a backing plate 12. A chute 13 is provided in the middle of the backing plate 12, and telescopic rods 14 are arranged on both sides of the backing plate 12. One end of each telescopic rod 14 is connected to a push block 15, and an air outlet 16 is arranged on one side of the push block 15. A ultrasonic transmitter 17 is connected to the lower side of the backing plate 12. The air outlet 16 is connected to the air supply pipe 10 through a telescopic hose. A cleaning component 18 is arranged on the other side of the push block 15. The cleaning component 18 includes a sleeve 1801 and a valve groove 1802. The other side of the push block 15 is connected to the sleeve 1801, and valve grooves 1802 are symmetrically provided in the sleeve 1801. The cleaning component 18 further includes a closing spring 1803, a valve plate 1804 and a through groove 1805. Closing springs 1803 are symmetrically connected in the valve grooves 1802, and one end of each closing spring 1803 is connected to a valve plate 1804. A through groove 1805 is provided on the surface of the valve plate 1804. The valve plate 1804 is elastically connected to the valve groove 1802 through the closing spring 1803, and the valve plate 1804 is in snap-fit sliding connection with the sleeve 1801 through the valve groove 1802. The valve plates 1804 are closely attached to each other. The cleaning component 18 further includes a slot 1806, a cleaning head 1807 and an insertion plate 1808. A slot 1806 is provided in the middle of the sleeve 1801 in the valve groove 1802, and a cleaning head 1807 is connected to one end of the sleeve 1801. Insertion plates 1808 are symmetrically connected in the cleaning head 1807, and the insertion plates 1808 are in sliding connection with the sleeve 1801 through the slot 1806, and the insertion plates 1808 are in snap-fit sliding connection with the valve plate 1804 through the through groove 1805. The cleaning head 1807 is made of elastic soft silicone. A sealing groove 19 is provided in the middle of the fuselage 1, and a bottom plate 20 is in snap-fit sliding connection in the sealing groove 19. A sealing plate 21 is connected to one side of the bottom plate 20, and a material placing frame 22 is rotatably connected to the middle of the bottom plate 20. A gear ring 23 is connected to one side of the material placing frame 22, and a transmission wheel 24 is arranged on one side of the gear ring 23. The transmission wheel 24 is connected to the driving wheel 203 through a reduction box. The sealing plate 21 is in snap-fit connection with the fuselage 1 through the sealing groove 19. An air extraction port 25 is provided inside the material placing frame 22, and an air cavity 26 is provided on one side of the air extraction port 25. Push rods 27 are symmetrically connected in the material placing frame 22, and a clamping plate 28 is connected to one side of each push rod 27. The air extraction port 25 is connected to the straight pipe 6 through the air cavity 26. The clamping plate 28 is made of a flexible material;

[0031] The specific operation is as follows. When cleaning the wafer, the water pump 4 can draw the cleaning liquid from the lower part of the fuselage 1 into the water supply pipe 5 through the suction pipe 3, and then send it to the sleeve 1801 through the hose. The lifting rod 11 drives the backing plate 12 to descend, so that the sleeve 1801 can drive the cleaning head 1807 close to the wafer. After the cleaning head 1807 presses on the wafer, the cleaning head 1807 drives the plug board 1808 to move in the slot 1806, so that the plug board 1808 can drive the valve plate 1804 to slide in the valve groove 1802, opening the sleeve 1801, and the cleaning liquid can be sprayed onto the wafer. By controlling the descending distance of the backing plate 12, the moving distance of the plug board 1808 can be controlled, and then the flow rate in the sleeve 1801 can be controlled through the valve plate 1804. As the water pump 4 draws the cleaning liquid, the air pressure in the lower part of the fuselage 1 drops, and the air in the air chamber 26 can be drawn out through the straight pipe 6, creating a negative pressure in the air chamber 26. The wafer is adsorbed in the placement frame 22 through the air extraction port 25 to prevent the wafer from moving during cleaning and resulting in an unsatisfactory cleaning effect. As the water pump 4 continues to operate, the cleaning liquid on the wafer will be drawn into the air chamber 26 through the air extraction port 25 and then into the straight pipe 6. Start the drive motor 204, and the drive motor 204 can make the drive wheel 203 drive the transmission wheel 24 to rotate slowly through the reduction gearbox, and then make the placement disk drive the wafer to rotate on the bottom plate 20 through the gear ring 202. At the same time, the telescopic rod 14 drives the push block 15 to move, so that the sleeve 1801 can move from the center of the backing plate 12 to the edge in the sliding groove 13, thereby comprehensively cleaning the wafer, ensuring consistent cleaning effects and scraping off most of the cleaning waste liquid from the wafer. The material of the cleaning head 1807 can avoid damaging the wafer. At the same time, start the air extractor 8 to draw the air in the lower part of the fuselage 1 through the suction pipe 7, heat it through the heater 9 and then send it into the air outlet 16 through the air supply pipe 10 to blow on the surface of the wafer to blow off the residual cleaning liquid and prevent the cleaning liquid from remaining on the wafer surface and causing damage to the wafer. The operation of the air extractor 8 can strengthen the adsorption effect of the wafer and accelerate the extraction of the waste liquid in the placement frame 22. In summary, when cleaning the wafer, it can be comprehensively cleaned, ensuring consistent cleaning effects and avoiding wafer damage caused by residual cleaning liquid. When cleaning other semiconductor devices, the ultrasonic emitter 17 can emit ultrasonic waves to the semiconductor devices. At the same time, the air extractor 8 operates to draw the air in the lower part of the fuselage 1 through the suction pipe 7 and then send it into the air outlet 16 through the air supply pipe 10. The telescopic rod 14 drives the air outlet 16 to move in the sliding groove 13 through the push block 15, and the impurities, dust, etc. on the semiconductor devices can be blown off. If it is necessary to remove the excess solder paste on the device, just turn on the heater 9 to melt it for easy blowing. After the air in the lower part of the fuselage 1 is drawn out, a negative pressure will be generated in the lower part of the fuselage 1, and the air in the air chamber 26 will be drawn into the temporary storage cylinder 206 through the straight pipe 6. The impurities, dust, etc. blown off from the device can enter the temporary storage cylinder 206 through the air extraction port 25 from the air chamber 26 and the straight pipe 6 and dissolve into the cleaning liquid. When placing the device,Place the device in the middle of the material placement frame 22 and synchronously start the opposing push rods 27, then the clamping plates 28 can be made to approach the device synchronously until the device is firmly clamped. The flexible material of the clamping plates 28 can avoid damaging the device. When placing a wafer, simply place it in the center of the material placement frame 22. After the material placement is completed, slide the bottom plate 20 into the fuselage 1 through the sealing groove 19 and make the sealing plate 21 engage with the fuselage 1 through the sealing groove 19, then the closure of the fuselage 1 can be completed, putting the fuselage 1 in a sealed state to prevent external air from entering. In summary, during use, the placement of materials can be conveniently completed, and other non-wafer devices can be cleaned.

[0032] In summary, for the cleaning device used in the processing of semiconductor devices, during use, first place the semiconductor device into the material placement frame. When placing non-wafer devices, place the device in the middle of the material placement frame 22, and synchronously start the opposing push rods 27, then the clamping plates 28 can approach the device synchronously until the device is firmly clamped. The flexible material of the clamping plates 28 can prevent damage to the device. When placing wafers, just place them in the center of the material placement frame 22. After the materials are placed, slide the bottom plate 20 into the fuselage 1 through the sealing groove 19, and make the sealing plate 21 engage with the fuselage 1 through the sealing groove 19, then the closure of the fuselage 1 can be completed, making the fuselage 1 in a sealed state to prevent external air from entering. When cleaning wafers, the water pump 4 can draw the cleaning liquid from the lower part of the fuselage 1 into the water supply pipe 5 through the water suction pipe 3, and then send it to the sleeve 1801 through the hose. The lifting rod 11 drives the backing plate 12 to descend, then the sleeve 1801 can drive the cleaning head 1807 to approach the wafer. After the cleaning head 1807 presses on the wafer, the cleaning head 1807 drives the plug board 1808 to move in the slot 1806, then the plug board 1808 can drive the valve plate 1804 to slide in the valve groove 1802 to open the sleeve 1801, and the cleaning liquid can be sprayed onto the wafer. By controlling the descending distance of the backing plate 12, the moving distance of the plug board 1808 can be controlled, and further the flow rate in the sleeve 1801 can be controlled through the valve plate 1804. As the water pump 4 draws the cleaning liquid, the air pressure in the lower part of the fuselage 1 drops, then the air in the air chamber 26 can be drawn out through the straight pipe 6, creating a negative pressure in the air chamber 26, and the wafer can be adsorbed in the material placement frame 22 through the air suction port 25 to prevent the wafer from moving during cleaning and resulting in an unsatisfactory cleaning effect. As the water pump 4 continues to operate, the cleaning liquid on the wafer will be drawn into the air chamber 26 through the air suction port 25 and then into the straight pipe 6. Start the drive motor 204, and the drive motor 204 can make the drive wheel 203 drive the transmission wheel 24 to rotate slowly through the speed reducer, and then make the material placement disk drive the wafer to rotate on the bottom plate 20 through the toothed ring 202. At the same time, the telescopic rod 14 drives the push block 15 to move, then the sleeve 1801 can move from the center of the backing plate 12 to the edge in the sliding groove 13, so as to clean the wafer comprehensively. While ensuring consistent cleaning effect, most of the cleaning waste liquid can also be scraped off from the wafer. The material of the cleaning head 1807 can prevent damage to the wafer. At the same time, start the air extractor 8, draw the air in the lower part of the fuselage 1 out through the air suction pipe 7, heat it through the heater 9 and then send it into the air outlet 16 through the air supply pipe 10 to blow the wafer surface and blow off the residual cleaning liquid to prevent the cleaning liquid from remaining on the wafer surface and causing wafer damage. The operation of the air extractor 8 can strengthen the adsorption effect of the wafer and also accelerate the extraction of the waste liquid in the material placement frame 22. When cleaning other semiconductor devices, ultrasonic waves can be emitted to the semiconductor devices through the ultrasonic emitter 17, and at the same time the air extractor 8 operates, draw the air in the lower part of the fuselage 1 out through the air suction pipe 7 and then send it into the air outlet 16 through the air supply pipe 10.The telescopic rod 14 drives the air outlet 16 to move in the chute 13 through the push block 15, so as to blow off impurities, dust, etc. on the semiconductor device. If it is necessary to remove the excess solder paste on the device, just turn on the heater 9 to melt it for easy blowing. After the air at the lower part of the fuselage 1 is extracted, a negative pressure will be generated inside the lower part of the fuselage 1, and the air in the air chamber 26 will be drawn into the temporary storage cylinder 206 through the straight pipe 6. The impurities, dust, etc. blown off from the device can enter the temporary storage cylinder 206 from the air chamber 26 and the straight pipe 6 through the air extraction port 25 and dissolve into the cleaning liquid. After cleaning, the waste liquid or waste gas enters the temporary storage cylinder 206 from the straight pipe 6 and dissolves into the cleaning liquid in the temporary storage cylinder 206. Then, the drive motor 204 drives the toothed ring 202 to rotate through the drive wheel 203, so that the separation cylinder 205 drives the temporary storage cylinder 206 to rotate, making the cleaning liquid in the temporary storage cylinder 206 rotate along with the temporary storage cylinder 206. Under the action of centrifugal force, the cleaning liquid in the temporary storage cylinder 206 moves along the cylinder wall and flows to the inner wall of the separation cylinder 205. As the separation cylinder 205 continues to rotate, the impurities mixed in the cleaning liquid move downward along the spiral diversion groove on the cylinder wall of the separation cylinder 205, while the clean cleaning liquid separated from the impurities can move upward along the spiral diversion groove until it overflows from the upper edge of the separation cylinder 205 into the fuselage 1 for recycling. As the cleaning liquid in the temporary storage cylinder 206 decreases and the rotation causes the liquid level at the center of the temporary storage cylinder 206 to drop, the cleaning liquid in the fuselage 1 will enter the temporary storage cylinder 206 through the connecting pipe 207 to supplement the cleaning liquid, so that the liquid level of the cleaning liquid at the center of the temporary storage cylinder 206 is always higher than the lower end of the straight pipe 6, enabling the cleaning liquid to seal the lower end of the straight pipe 6 and ensuring that the waste gas and waste liquid can smoothly mix into the cleaning liquid in the temporary storage cylinder 206, preventing the waste gas from directly escaping into the fuselage 1. After the separated impurities move to the bottom of the separation cylinder 205, they can leave the separation cylinder 205 through the chip discharge hole 208 under the action of centrifugal force and enter the collection tray 209. When the cleaning is completed, the drive motor 204 continues to operate for a period of time to ensure that all the waste liquid can flow from the temporary storage cylinder 206 into the separation cylinder 205 and complete the separation. After the drive motor 204 stops, a part of the remaining cleaning liquid in the separation cylinder 205 will directly fall into the temporary storage cylinder 206, and the other part of the cleaning liquid will flow down along the cylinder wall, flushing the remaining impurities at the bottom of the separation cylinder 205 from the chip discharge hole 208 into the collection tray 209. The impurities in the collection tray 209 can be collectively discharged through the sewage pipe 210. The one-way valve in the connecting pipe 207 can prevent the cleaning liquid in the temporary storage cylinder 206 from entering the fuselage 1 and polluting the cleaning liquid in the fuselage 1.,

[0033] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A cleaning device for semiconductor device processing, characterized in that: The invention comprises a machine body (1) and a separation assembly (2), wherein the separation assembly (2) is arranged at the lower part of the machine body (1), and the separation assembly (2) comprises a rotating groove (201), a gear ring (202), a driving wheel (203), a driving motor (204), a separation cylinder (205), a temporary storage cylinder (206), a connecting pipe (207), a chip removal hole (208), a collection plate (209) and a sewage discharge pipe (210), wherein the rotating groove (201) is arranged at the lower part of the machine body (1), and a gear ring (202) is arranged in the rotating groove (201), and the gear ring (202) is arranged in the rotating groove (201). A driving wheel (203) is provided on one side of the gear ring (202), and a driving motor (204) is connected to one side of the driving wheel (203); a separation cylinder (205) is connected to the inner side of the gear ring (202), and a temporary storage cylinder (206) is connected to the inner side of the separation cylinder (205); a connecting pipe (207) is provided in the middle of the separation cylinder (205), and a chip removal hole (208) is opened on the side wall of the separation cylinder (205); a collection tray (209) is provided on one side of the separation cylinder (205), and a sewage discharge pipe (210) is connected to one side of the collection tray (209).

2. A cleaning device for semiconductor device processing according to claim 1, characterized in that: The gear ring (202) is meshed with the driving wheel (203), and the gear ring (202) is rotatably connected to the body (1) through the rotating groove (201); the connecting pipe (207) penetrates the lower wall of the collecting plate (209) and is connected to the inside of the body (1); the connecting pipe (207) penetrates the separation cylinder (205) and is connected to the inside of the temporary storage cylinder (206) through a one-way valve; the separation cylinder (205) and the temporary storage cylinder (206) are both conical barrels, and the inner wall of the temporary storage cylinder (206) is inclined at 45°, the side wall of the separation cylinder (205) is inclined at 60°, and a double-headed spiral guide groove is provided on the inner wall of the separation cylinder (205).

3. A cleaning device for semiconductor device processing according to claim 1, characterized in that: A water extraction pipe (3) is provided on one side of the machine body (1), and one end of the water extraction pipe (3) is connected to a water pump (4), and one side of the water pump (4) is connected to a water supply pipe (5). A straight pipe (6) is provided in the middle of the machine body (1), and the lower end of the straight pipe (6) is located inside the temporary storage cylinder (206).

4. A cleaning device for semiconductor device processing according to claim 1, characterized in that: An exhaust pipe (7) is provided on the rear side of the machine body (1), and one end of the exhaust pipe (7) is connected to an exhaust machine (8), one side of the exhaust machine (8) is connected to a heater (9), and one side of the heater (9) is connected to an air supply pipe (10).

5. A cleaning device for semiconductor device processing according to claim 4, characterized in that: The upper part of the fuselage (1) is symmetrically connected to a lifting rod (11), and one end of the lifting rod (11) is connected to a pad (12), a sliding groove (13) is provided in the middle of the pad (12), and telescopic rods (14) are arranged on both sides of the pad (12), one end of the telescopic rod (14) is connected to a push block (15), and one side of the push block (15) is provided with an air outlet (16), the lower side of the pad (12) is connected to an ultrasonic transmitter (17), and the air outlet (16) is connected to the air supply pipe (10) through a telescopic hose.

6. A cleaning device for semiconductor device processing according to claim 5, characterized in that: A cleaning assembly (18) is provided on the other side of the push block (15), and the cleaning assembly (18) comprises a sleeve (1801) and a valve groove (1802). The other side of the push block (15) is connected to the sleeve (1801), and the valve groove (1802) is symmetrically provided in the sleeve (1801).

7. A cleaning device for semiconductor device processing according to claim 6, characterized in that: The cleaning component (18) also includes a closing spring (1803), a valve plate (1804) and a through groove (1805); the closing spring (1803) is symmetrically connected inside the valve groove (1802), and one end of the closing spring (1803) is connected to the valve plate (1804); a through groove (1805) is provided on the surface of the valve plate (1804); the valve plate (1804) is elastically connected to the valve groove (1802) through the closing spring (1803), and the valve plate (1804) is slidably connected to the sleeve (1801) through the valve groove (1802), and the valve plates (1804) are tightly fitted to each other.

8. A cleaning device for semiconductor device processing according to claim 7, characterized in that: The cleaning assembly (18) further comprises a slot (1806), a cleaning head (1807) and an insert plate (1808); the sleeve (1801) is provided with a slot (1806) in the middle of the valve slot (1802), and one end of the sleeve (1801) is connected to the cleaning head (1807); the insert plate (1808) is symmetrically connected inside the cleaning head (1807), and the insert plate (1808) is slidably connected to the sleeve (1801) via the slot (1806), and the insert plate (1808) is slidably connected to the valve plate (1804) via the through slot (1805); the cleaning head (1807) is made of elastic soft silicone.

9. A cleaning device for semiconductor device processing according to claim 3, characterized in that: A sealing groove (19) is provided in the middle of the machine body (1), and a bottom plate (20) is slidably engaged in the sealing groove (19), a sealing plate (21) is connected to one side of the bottom plate (20), and a material placement frame (22) is rotatably connected to the middle of the bottom plate (20), a gear ring (23) is connected to one side of the material placement frame (22), and a transmission wheel (24) is provided on one side of the gear ring (23), the transmission wheel (24) is connected to the driving wheel (203) through a reduction gear box, and the sealing plate (21) is engaged and connected to the machine body (1) through the sealing groove (19).

10. A cleaning device for semiconductor device processing according to claim 9, characterized in that: An air suction port (25) is provided inside the material placement frame (22), and an air cavity (26) is provided on one side of the air suction port (25). A push rod (27) is symmetrically connected inside the material placement frame (22), and a clamping plate (28) is connected on one side of the push rod (27). The air suction port (25) is connected to the straight pipe (6) through the air cavity (26), and the clamping plate (28) is made of a flexible material.

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