Substrate processing system and substrate processing method

Abstract

The invention provides a substrate processing system and a substrate processing method capable of improving throughput. The substrate processing system includes: a feed-in and feed-out unit that feeds in and feeds out a cartridge containing a plurality of substrates; a batch processing unit; a single-sheet processing unit; a substrate transfer unit for transferring the substrate from the feeding / discharging unit to the batch processing unit and the single-sheet processing unit; and a substrate standby unit for transferring the substrate from the batch processing unit to the single-chip processing unit, the substrate standby unit including: a standby station including a first standby area on which the substrate fed from the batch processing unit is placed, and a second standby area provided so as to be aligned with the first standby area in the vertical direction, the second standby area being provided so as to be aligned with the first standby area in the vertical direction; the second standby area carries the substrate to be sent to the single-chip processing part. A first transport device that transports the plurality of substrates from the batch processing unit to the first standby area; and a first replacement device for replacing the substrate from the first standby region to a second standby region, wherein the second standby region has a first processing liquid supply unit for supplying the first processing liquid to the upper surface of the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate processing system and a substrate processing method. Background Art

[0002] There is known a substrate processing system including a batch processing unit and a single wafer processing unit (for example, refer to Patent Document 1). The batch processing unit performs batch processing for collectively processing a substrate group including a plurality of substrates. The single wafer processing unit performs single wafer processing for processing substrates one by one. In the substrate processing system, a composite process including batch processing and single wafer processing, and single wafer processing are carried out in parallel.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2023-121571 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] The present invention provides a technology capable of improving throughput.

[0008] Technical Solution for Solving the Technical Problem

[0009] A substrate processing system according to one technical solution of the present invention includes: a loading / unloading unit that loads / unloads a cassette accommodating a plurality of substrates; a batch processing unit that collectively processes the plurality of substrates; a single wafer processing unit that processes the substrates one by one; a substrate transfer unit that transfers the substrates from the loading / unloading unit to the batch processing unit and the single wafer processing unit; and a substrate standby unit that transfers the substrates from the batch processing unit to the single wafer processing unit. The substrate standby unit includes: a standby table including a first standby area and a second standby area arranged vertically with respect to the first standby area, the first standby area loading the substrates fed from the batch processing unit, and the second standby area loading the substrates to be sent to the single wafer processing unit; a first conveying device that collectively conveys the plurality of substrates from the batch processing unit to the first standby area; and a first replacement device that replaces the substrates from the first standby area to the second standby area. The second standby area has a first processing liquid supply unit that supplies a first processing liquid to the upper surface of the substrates.

[0010] Advantageous Effects of the Invention

[0011] According to the present invention, throughput can be improved. Brief Description of the Drawings

[0012] Figure 1It is a top view of a substrate processing system showing an embodiment.

[0013] Figure 2 It is a cross-sectional view showing a structure including a transfer table, a standby table, and a single-wafer processing unit.

[0014] Figure 3 It is a view showing a second standby area.

[0015] Figure 4 It is a flowchart showing a substrate processing method of an embodiment.

[0016] Figure 5 It is a top view showing the operation of a combined process.

[0017] Figure 6 It is a view showing the transfer process of a substrate in a combined process.

[0018] Figure 7 It is a top view showing the operation of a single-wafer process.

[0019] Figure 8 It is a view showing the transfer process of a substrate in a single-wafer process.

[0020] Figure 9 It is a view (1) showing the operation of replacing a substrate on the standby table.

[0021] Figure 10 It is a view (2) showing the operation of replacing a substrate on the standby table.

[0022] Figure 11 It is a view (3) showing the operation of replacing a substrate on the standby table.

[0023] Figure 12 It is a view (4) showing the operation of replacing a substrate on the standby table.

[0024] Figure 13 It is a view (5) showing the operation of replacing a substrate on the standby table.

[0025] Figure 14 It is a view (6) showing the operation of replacing a substrate on the standby table.

[0026] Figure 15 It is a view (7) showing the operation of replacing a substrate on the standby table.

[0027] Figure 16 It is a view (1) showing the operation of replacing a substrate on the transfer table.

[0028] Figure 17 It is a view (2) showing the operation of replacing a substrate on the transfer table.

[0029] Figure 18It is a diagram (3) showing the operation of replacing a substrate at the transfer station.

[0030] Figure 19 It is a diagram (4) showing the operation of replacing a substrate at the transfer station.

[0031] Figure 20 It is a diagram (5) showing the operation of replacing a substrate at the transfer station.

[0032] Figure 21 It is a diagram (6) showing the operation of replacing a substrate at the transfer station.

[0033] Figure 22 It is a diagram (7) showing the operation of replacing a substrate at the transfer station.

[0034] Figure 23 It is a diagram (8) showing the operation of replacing a substrate at the transfer station.

[0035] Figure 24 It is a diagram (9) showing the operation of replacing a substrate at the transfer station.

[0036] Explanation of reference numerals

[0037] 1 Substrate processing system

[0038] 2 Loading / unloading section

[0039] 3 Substrate transfer section

[0040] 4 Batch processing section

[0041] 5 Substrate standby section

[0042] 53 First conveying device

[0043] 54 Standby table

[0044] 54a First standby area

[0045] 54b Second standby area

[0046] 55 First replacement device

[0047] 80 Pure water supply section

[0048] 6 Single-chip processing section

[0049] C Cassette

[0050] W Substrate. Detailed implementation mode

[0051] Hereinafter, with reference to the drawings, non-limiting exemplary implementation modes of the present invention will be described. In all the drawings, the same or corresponding parts or components are labeled with the same or corresponding reference numerals, and repeated explanations are omitted.

[0052] Refer to Figure 1 and Figure 2 , the substrate processing system 1 of the embodiment will be described. Figure 1 is a top view showing the substrate processing system 1 of the embodiment. Figure 2 is a cross-sectional view showing the structure including the transfer stage 33, the standby stage 54, and the single-wafer processing unit 6.

[0053] As Figure 1 shown, the substrate processing system 1 includes a loading / unloading unit 2, a substrate transfer unit 3, a batch processing unit 4, a substrate standby unit 5, a single-wafer processing unit 6, and a control device 9.

[0054] The loading / unloading unit 2 serves as both a loading unit and an unloading unit. In this case, the substrate processing system 1 can be miniaturized. The loading / unloading unit 2 has a loading port 21, a storage stack 22, a loader 23, and a cassette transfer device 24.

[0055] The loading port 21 is arranged on the negative side in the X-axis direction of the loading / unloading unit 2. A plurality (for example, four) of loading ports 21 are arranged along the Y-axis direction. However, the number of loading ports 21 is not particularly limited. A cassette C can be placed on the loading port 21. The cassette C houses a plurality (for example, 25) of substrates W and can be fed into and out of the loading port 21. Inside the cassette C, the substrates W are held horizontally and are held at a second pitch P2 which is N times the first pitch P1 (P2 = N × P1) in the vertical direction. N is a natural number of 2 or more, and is 2 in this embodiment, but can also be 3 or more.

[0056] A plurality (for example, four) of storage stacks 22 are arranged along the Y-axis direction at the center in the X-axis direction of the loading / unloading unit 2. A plurality (for example, two) of storage stacks 22 are arranged along the Y-axis direction adjacent to the substrate transfer unit 3 on the positive side in the X-axis direction of the loading / unloading unit 2. The storage stacks 22 can also be arranged in multiple layers in the vertical direction. The storage stacks 22 temporarily store the cassette C containing the substrates W before the cleaning process, the cassette C from which the substrates W have been taken out and the inside has become empty, etc. In addition, the number of storage stacks 22 is not particularly limited.

[0057] The loader 23 is adjacent to the substrate transfer unit 3 and is arranged on the positive side in the X-axis direction of the loading / unloading unit 2. A cassette C can be placed on the loader 23. A lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C is provided on the loader 23. Multiple loaders 23 can also be provided. The loaders 23 can also be arranged in multiple layers in the vertical direction.

[0058] The cassette transfer device 24 transfers the cassette C between the loading port 21, the storage stack 22, and the loader 23. The cassette transfer device 24 is, for example, an articulated transfer robot.

[0059] The substrate transfer unit 3 is disposed on the positive X-axis side of the loading / unloading unit 2. The substrate transfer unit 3 transfers the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single wafer processing unit 6. The substrate transfer unit 3 includes a transfer device 31, a substrate group forming unit 32, a transfer table 33, and a second replacement device 34.

[0060] The transfer device 31 transfers the substrate W between the cassette C placed on the loader 23, the substrate group forming unit 32, and the transfer table 33. The transfer device 31 distributes the substrate W stored in the cassette C placed on the loader 23 between the third transfer area 33c of the transfer table 33 for transferring the substrate to the single wafer processing unit 6 and the substrate group forming unit 32 for transferring the substrate to the batch processing unit 4. The transfer device 31 is composed of a multi-axis (e.g., 6-axis) arm robot and has a substrate holding arm 31a at its front end. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of (e.g., 25) substrates W. The substrate holding arm 31a can take any position and posture in the three-dimensional space while holding the substrate W with the holding claws.

[0061] The substrate group forming unit 32 is disposed on the positive X-axis side of the substrate transfer unit 3. The substrate group forming unit 32 holds a plurality of substrates W at a first pitch P1 to form a substrate group L. The substrate group forming unit 32 constitutes a part of the transfer table. The substrate group forming unit 32 is an example of the fifth transfer area.

[0062] The transfer table 33 is adjacent to the single wafer processing unit 6 and is disposed on the positive Y-axis side of the substrate transfer unit 3. The transfer table 33 constitutes a part of the transfer table. As Figure 2 shown, the transfer table 33 includes a first transfer area 33a, a second transfer area 33b, a third transfer area 33c, and a fourth transfer area 33d. The first transfer area 33a, the second transfer area 33b, the third transfer area 33c, and the fourth transfer area 33d are arranged in the vertical direction.

[0063] The first transfer area 33a places the substrate W fed from the single wafer processing unit 6. The first transfer area 33a is provided for each processing unit block 60 of the single wafer processing unit 6. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the upper processing unit block 60 can reach and the second replacement device 34 can reach. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the middle processing unit block 60 can reach and the second replacement device 34 can reach. The first transfer area 33a is provided, for example, at two positions where the transfer arm 61b of the lower processing unit block 60 can reach and the second replacement device 34 can reach.

[0064] Each first transfer area 33a is configured to be able to place a first number of substrates W. The first number is, for example, the same number as the number of substrates W that can be held by the transfer arm 61b. The first number is, for example, one. The first transfer area 33a receives the substrate W from the transfer arm 61b and temporarily stores the substrate W until it is delivered to the second transfer area 33b.

[0065] The second transfer area 33b places the substrate W to be sent out to the feed-in and feed-out unit 2. The second transfer area 33b is provided at a position reachable by the transfer device 31 and the second replacement device 34. For example, three second transfer areas 33b are provided at different positions in the vertical direction.

[0066] Each second transfer area 33b is configured to be able to place a second number of substrates W. The second number is, for example, the same number as the number of substrates W stored in the cassette C. The second number is, for example, 25. The second transfer area 33b receives the substrate W from the second replacement device 34 and temporarily stores the substrate W until it is delivered to the feed-in and feed-out unit 2.

[0067] The third transfer area 33c places the substrate W fed in from the feed-in and feed-out unit 2 and also places the substrate W to be sent out to the feed-in and feed-out unit 2. The third transfer area 33c is provided at a position reachable by the transfer device 31 and the second replacement device 34. For example, one third transfer area 33c is provided.

[0068] The third transfer area 33c is configured to be able to place a third number of substrates W. The third number is, for example, the same number as the number of substrates W stored in the cassette C. The third number is, for example, 25. The third transfer area 33c receives the substrate W from the transfer device 31 and temporarily stores the substrate W until it is delivered to the fourth transfer area 33d. The third transfer area 33c receives the substrate W from the second replacement device 34 and temporarily stores the substrate W until it is delivered to the feed-in and feed-out unit 2.

[0069] The fourth transfer area 33d places the substrate W to be sent out to the single-chip processing unit 6 and also places the substrate W fed in from the single-chip processing unit 6. The fourth transfer area 33d is provided for each processing unit block 60 of the single-chip processing unit 6. For example, two fourth transfer areas 33d are provided at positions reachable by the transfer arm 61b of the upper processing unit block 60 and the second replacement device 34. For example, two fourth transfer areas 33d are provided at positions reachable by the transfer arm 61b of the middle processing unit block 60 and the second replacement device 34. For example, two fourth transfer areas 33d are provided at positions reachable by the transfer arm 61b of the lower processing unit block 60 and the second replacement device 34.

[0070] Each fourth transfer area 33d is configured to be able to place the fourth number of substrates W. The fourth number is, for example, the same number as the number of substrates W that can be held by the transfer arm 61b. The fourth number is, for example, one. The fourth transfer area 33d receives the substrate W from the second replacement device 34 and temporarily stores the substrate W until it is delivered to the single wafer processing unit 6. The fourth transfer area 33d receives the substrate W from the transfer arm 61b and temporarily stores the substrate W until it is delivered to the third transfer area 33c.

[0071] The second replacement device 34 can reach the first transfer area 33a, the second transfer area 33b, the third transfer area 33c, and the fourth transfer area 33d. The second replacement device 34 can be configured to be able to move in the vertical direction. The second replacement device 34 replaces the substrate W from the first transfer area 33a to the second transfer area 33b. The second replacement device 34 replaces the substrate W from the third transfer area 33c to the fourth transfer area 33d. The second replacement device 34 replaces the substrate W from the fourth transfer area 33d to the third transfer area 33c. The second replacement device 34 can replace the substrates W one by one, or can replace a plurality of substrates W together. In the latter case, the second replacement device 34 conveys a plurality of (for example, two) substrates W together.

[0072] The batch processing unit 4 is arranged on the positive side of the X-axis direction of the substrate transfer unit 3. That is, the loading / unloading unit 2, the substrate transfer unit 3, and the batch processing unit 4 are arranged in order from the negative side of the X-axis direction toward the positive side of the X-axis direction. The batch processing unit processes a substrate group L including a plurality of (for example, 50 or 100) substrates W at a first pitch P1. One substrate group L is composed of substrates W in M cassettes C, for example. M is a natural number of 2 or more. M can be the same natural number as N, or can be a natural number different from N. The batch processing unit 4 includes a chemical liquid tank 41, a rinse liquid tank 42, a first substrate group transfer device 43, a processing tool 44, and a driving device 45.

[0073] The chemical liquid tank 41 and the rinse liquid tank 42 are arranged along the X-axis direction. For example, the chemical liquid tank 41 and the rinse liquid tank 42 are arranged in order from the positive side of the X-axis direction toward the negative side of the X-axis direction. The chemical liquid tank 41 and the rinse liquid tank 42 are also collectively referred to as processing tanks. The number of the chemical liquid tank 41 and the rinse liquid tank 42 is not limited to Figure 1 . For example, the chemical liquid tank 41 and the rinse liquid tank 42 are a group in Figure 1 , but can also be multiple groups.

[0074] The liquid medicine tank 41 stores the liquid medicine for immersing the substrate group L. The liquid medicine is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film among the silicon oxide film and the silicon nitride film. The liquid medicine is not limited to the aqueous phosphoric acid solution. For example, it may also be DHF (dilute hydrofluoric acid), BHF (a mixed solution of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixed solution of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixed solution of ammonia, hydrogen peroxide, and water), SC2 (a mixed solution of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixed solution of tetramethylammonium hydroxide and water), plating solution, etc. The liquid medicine can be for stripping treatment or plating treatment. The number of the liquid medicines is not particularly limited and may be plural.

[0075] The first rinse liquid tank 42 stores the first rinse liquid for immersing the substrate group L. The first rinse liquid is pure water for removing the liquid medicine from the substrate W and is, for example, DIW (deionized water).

[0076] The first substrate group transfer device 43 has a guide rail 43a and a transfer arm 43b. The guide rail 43a is arranged at a position on the negative side in the Y-axis direction relative to the processing tank. The guide rail 43a extends in the horizontal direction (X-axis direction) from the substrate transfer portion 3 to the batch processing portion 4. The transfer arm 43b moves in the horizontal direction (X-axis direction) along the guide rail 43a. The transfer arm 43b can move in the vertical direction and can also rotate around the vertical axis. The transfer arm 43b transfers the substrate group L together between the substrate transfer portion 3 and the batch processing portion 4.

[0077] The processing tool 44 receives the substrate group L from the transfer arm 43b and holds the substrate group L. The processing tool 44 holds a plurality of substrates W at a first pitch P1 in the Y-axis direction and holds each of the plurality of substrates W vertically.

[0078] The driving device 45 moves the processing tool 44 in the X-axis direction and the Z-axis direction. The processing tool 44 immerses the substrate group L in the liquid medicine stored in the liquid medicine tank 41, and then immerses the substrate group L in the first rinse liquid stored in the first rinse liquid tank 42, and then delivers the substrate group L to the first substrate group transfer device 43.

[0079] The number of units of the processing tool 44 and the driving device 45 is one in the present embodiment, but may also be plural. In the latter case, one unit immerses the substrate group L in the liquid medicine stored in the liquid medicine tank 41, and the other unit immerses the substrate group L in the first rinse liquid stored in the first rinse liquid tank 42. In this case, the driving device 45 only needs to move the processing tool 44 in the Z-axis direction and may not move the processing tool 44 in the X-axis direction.

[0080] The substrate standby unit 5 is disposed on the positive Y-axis side of the batch processing unit 4. The substrate standby unit 5 conveys the substrate W between the batch processing unit 4 and the single wafer processing unit 6. The substrate standby unit 5 includes an immersion tank 51, a second substrate group conveying device 52, a first conveying device 53, a standby table 54, and a first replacement device 55.

[0081] The immersion tank 51 is disposed outside the movement range of the transfer arm 43b. For example, the immersion tank 51 is disposed at a position offset in the positive Y-axis direction relative to the processing tank. The immersion tank 51 stores the second rinsing liquid for immersing the substrate group L. The second rinsing liquid is, for example, DIW (deionized water). The substrate W is held in the second rinsing liquid until it is lifted from the second rinsing liquid by the first conveying device 53. Since the substrate W is below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrate W, and collapse of the uneven pattern of the substrate W can be prevented.

[0082] The second substrate group conveying device 52 includes a Y-axis driving device 52a, a Z-axis driving device 52b, and a transfer arm 52c.

[0083] The Y-axis driving device 52a is disposed on the positive X-axis side of the substrate standby unit 5. The Y-axis driving device 52a extends in the horizontal direction (Y-axis direction) from the substrate standby unit 5 toward the batch processing unit 4. The Y-axis driving device 52a moves the Z-axis driving device 52b and the transfer arm 52c in the Y-axis direction. The Y-axis driving device 52a may include a ball screw.

[0084] The Z-axis driving device 52b is movably mounted on the Y-axis driving device 52a. The Z-axis driving device 52b moves the transfer arm 52c in the Z-axis direction. The Z-axis driving device 52b may include a ball screw.

[0085] The transfer arm 52c is movably mounted on the Z-axis driving device 52b. The transfer arm 52c receives the substrate group L from the transfer arm 43b and holds the substrate group L. The transfer arm 52c holds a plurality of substrates W at a first pitch P1 in the Y-axis direction, and holds each of the plurality of substrates W in the vertical direction. The transfer arm 52c moves in the Y-axis direction and the Z-axis direction by the Y-axis driving device 52a and the Z-axis driving device 52b. The transfer arm 52c can move to a plurality of positions including a transfer position, an immersion position, and a standby position.

[0086] The transfer position is a position where the substrate group L is transferred between the transfer arm 43b and the transfer arm 52c. The transfer position is a position on the negative Y-axis side and the positive Z-axis side.

[0087] The immersion position is a position where the substrate group L is immersed in the immersion tank 51. The immersion position is a position on the positive Y-axis side and the negative Z-axis side relative to the transfer position.

[0088] The standby position is the position where the transfer arm 52c stands by when the substrate set L is not being transferred and when the substrate set L is not being immersed in the immersion tank 51. The standby position is directly below the transfer position (negative side in the Z-axis direction) and is a position that does not obstruct the movement of the transfer arm 43b. In this case, the transfer arm 52c can move to the transfer position only by moving upward (positive side in the Z-axis direction), so the throughput is improved. The standby position can also be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated when the first substrate set transfer device 43 operates from adhering to the transfer arm 52c. The standby position can also be a position directly above the immersion position (positive side in the Z-axis direction). In this way, by setting the standby position to a position different from the transfer position, it is possible to prevent contact between the transfer arm 43b and the transfer arm 52c.

[0089] During the operation of the first substrate set transfer device 43, the second substrate set transfer device 52 moves the transfer arm 52c to the immersion position or the standby position. Thereby, contact between the transfer arm 43b and the transfer arm 52c can be prevented.

[0090] The first transfer device 53 transfers a plurality (for example, two) of substrates W together between the transfer arm 52c at the immersion position and the first standby area 54a of the standby table 54. At this time, the time required for transferring the substrates W is shortened. As a result, the throughput is improved. The first transfer device 53 is composed of a multi-axis (for example, 6-axis) arm robot and has a transfer arm 53a at its front end. The transfer arm 53a has holding claws (not shown) that can hold a plurality (for example, two) of substrates W. The transfer arm 53a can take any position and posture in a three-dimensional space while holding the substrates W with the holding claws. In addition, the immersion tank 51 is arranged outside the movement range of the transfer arm 43b. Therefore, the transfer arm 43b and the transfer arm 53a do not interfere with each other. Thereby, it is possible to make the first substrate set transfer device 43 and the first transfer device 53 operate independently of each other's working states. Therefore, the first substrate set transfer device 43 and the first transfer device 53 can be made to operate at any timing, so the time required for transferring the substrates W can be shortened. As a result, the throughput is improved.

[0091] The standby table 54 is adjacent to the single-chip processing unit 6 and is arranged on the negative side in the X-axis direction of the substrate standby unit 5. The standby table 54 receives the substrates W from the first transfer device 53 and temporarily stores the substrates W until they are transferred to the single-chip processing unit 6. That is, the substrates W taken out from the immersion tank 51 are placed on the standby table 54. The substrates W placed on the standby table 54 are preferably in a state where their surfaces are wetted with the second rinsing liquid, for example. In this case, the surface tension of the second rinsing liquid does not act on the substrates W, and collapse of the concavo-convex patterns of the substrates W can be suppressed.

[0092] As Figure 2As shown, the standby stage 54 has a first standby area 54a and a second standby area 54b. The first standby area 54a and the second standby area 54b are arranged vertically.

[0093] The first standby area 54a mounts the substrate W fed from the batch processing unit 4. The first standby area 54a is set at a position reachable by the first transfer device 53 and the first replacement device 55. For example, two first standby areas 54a are provided at different positions in the vertical direction.

[0094] Each first standby area 54a is configured to be able to mount the fifth number of substrates W. The fifth number is, for example, one. The first standby area 54a receives the substrate W from the first transfer device 53 and temporarily stores the substrate W until it is delivered to the second standby area 54b.

[0095] The second standby area 54b mounts the substrate W to be sent to the single-chip processing unit 6. The second standby area 54b is provided for each processing unit block 60 of the single-chip processing unit 6. For example, two second standby areas 54b are provided at positions reachable by the transfer arm 61b of the upper processing unit block 60 and the first replacement device 55. For example, two second standby areas 54b are provided at positions reachable by the transfer arm 61b of the middle processing unit block 60 and the first replacement device 55. For example, two second standby areas 54b are provided at positions reachable by the transfer arm 61b of the lower processing unit block 60 and the first replacement device 55.

[0096] Each second standby area 54b is configured to be able to mount the sixth number of substrates W. The sixth number is, for example, one. The second standby area 54b receives the substrate W from the first replacement device 55 and temporarily stores the substrate W until it is delivered to the single-chip processing unit 6.

[0097] The first replacement device 55 can reach the first standby area 54a and the second standby area 54b. The first replacement device 55 can be configured to be movable in the vertical direction. The first replacement device 55 replaces the substrate W from the first standby area 54a to the second standby area 54b. The first replacement device 55 can replace the substrates W one by one, or can replace multiple substrates W together. In the latter case, the first replacement device 55 conveys multiple (for example, two) substrates W together.

[0098] The single-chip processing unit 6 is disposed on the negative side in the X-axis direction of the substrate standby unit 5 and on the positive side in the Y-axis direction of the loading / unloading unit 2, the substrate transfer unit 3, and the batch processing unit 4. The single-chip processing unit 6 processes the substrates W one by one. The single-chip processing unit 6 has processing unit blocks 60 arranged in three layers vertically. In this case, single-chip processing of a plurality of substrates W can be performed simultaneously, so the throughput is increased. Each processing unit block 60 includes a second transfer device 61, a liquid processing device 62, and an avoidance table 64.

[0099] The second transfer device 61 transfers the substrate W between the standby table 54, the liquid processing device 62, the avoidance table 64, and the transfer table 33. The second transfer device 61 can be configured to transfer the substrate W from the second standby area 54b of the standby table 54 to the liquid processing device 62. The second transfer device 61 can be configured to transfer the substrate W from the liquid processing device 62 to the first transfer area 33a of the transfer table 33 when the processing of the substrate W is a composite process. The second transfer device 61 can be configured to transfer the substrate W from the liquid processing device 62 to the fourth transfer area 33d of the transfer table 33 when the processing of the substrate W is a single-chip process. The second transfer device 61 can be configured to transfer the substrate W being transferred to the avoidance table 64 when the liquid processing device 62 becomes unusable during the transfer of the substrate W from the substrate standby unit 5 to the liquid processing device 62. The second transfer device 61 can be configured to transfer the substrate W from the avoidance table 64 to the usable liquid processing device 62 when at least one of the three liquid processing devices 62 becomes usable after the substrate W is transferred to the avoidance table 64.

[0100] The second transfer device 61 has a guide rail 61a and a transfer arm 61b. The guide rail 61a is disposed on the negative side in the Y-axis direction of the single-chip processing unit 6. The guide rail 61a extends in the horizontal direction (X-axis direction) in the single-chip processing unit 6. The transfer arm 61b moves in the horizontal direction (X-axis direction) and the vertical direction along the guide rail 61a and rotates about the vertical axis. The number of transfer arms 61b can be one or more. In the latter case, the second transfer device 61 transfers a plurality of (for example, five) substrates W together.

[0101] Three liquid processing devices 62 are arranged along the X-axis direction. Each liquid processing device 62 is of the single-chip type and processes the substrates W one by one with a processing liquid. The processing liquid can be of multiple types. For example, it can be pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid can be an alcohol such as IPA (isopropyl alcohol), for example.

[0102] The avoidance stage 64 mounts the substrate W sent out from the substrate standby unit 5. The avoidance stage 64 is provided at a position reachable by the second transfer device 61. The avoidance stage 64 is provided, for example, on the opposite side (negative side in the Y-axis direction) of the liquid processing device 62 with the second transfer device 61 interposed therebetween. The avoidance stage 64 can be configured to be able to mount one substrate W, or can also be configured to be able to mount a plurality of substrates W. During the process of transferring the substrate W from the substrate standby unit 5 to the liquid processing device 62, when the liquid processing device 62 becomes unusable, the avoidance stage 64 temporarily stores the substrate W.

[0103] In the present embodiment, the single wafer processing unit 6 has a plurality of processing unit blocks 60 with the same structure, but the single wafer processing unit 6 may also have processing unit blocks 60 with different structures. For example, the single wafer processing unit 6 may also have a processing unit block 60 that includes a drying device in addition to the liquid processing device 62. The drying device is of a single wafer type, and dries the substrate W one by one using a supercritical fluid. In the present embodiment, the processing unit blocks 60 are arranged in three layers vertically, but the number of the processing unit blocks 60 is not limited.

[0104] The control device 9 is a computer, for example, and includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as a memory. Programs for controlling various processes executed in the substrate processing system 1 are stored in the recording medium 92. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside using the input interface 93 and sends signals to the outside using the output interface 94.

[0105] The above programs are stored, for example, in a computer-readable recording medium and are installed from this recording medium into the recording medium 92 of the control device 9. Examples of the computer-readable recording medium include a hard disk (HD), a floppy disk (FD), an optical disk (CD), a magneto-optical disk (MO), a memory card, and the like. In addition, the programs can also be downloaded from a server via the Internet and installed into the recording medium 92 of the control device 9.

[0106] The control device 9 is configured to be able to control the transfer device 31 based on information associated with the cassette C fed into the loading / unloading unit 2, so as to transfer the plurality of substrates W stored in the cassette C to either the substrate group forming unit 32 or the transfer stage 33. This information may include the substrate type. For example, when the substrate type is a product substrate, the control device 9 controls the transfer device 31 to transfer the substrates W stored in the cassette C to the substrate group forming unit 32. For example, when the substrate type is a dummy substrate, the control device 9 controls the transfer device 31 to transfer the substrates W stored in the cassette C to the transfer stage 33.

[0107] (Detailed Structure of the Second Standby Area)

[0108] Refer to Figure 3 to describe the detailed structure of the second standby area 54b. Figure 3 It is a diagram showing the second standby area 54b. Figure 3 (a) of Figure 3 (b) of Figure 3 (b) of Figure 3 corresponds to a cross-sectional view along the B-B line in (a) of

[0109] As shown in Figure 3 (a) of Figure 3 and (b) of Figure 3 in (a), the pure water supply unit 80 is omitted.

[0110] The liquid receiving part 73 has a bottom plate 71 and a wall part 72. The bottom plate 71 has a disk-like shape. The wall part 72 is provided annularly on the bottom plate 71. The pins 74 are provided on the bottom plate 71. In the present embodiment, the number of pins 74 is three, but it may be four or more. The three pins 74 are arranged to form an equilateral triangle in plan view. The surface of each pin 74 including the upper end is horizontal. The upper ends of the respective pins 74 are located above the upper end of the wall part 72. In plan view, the center of the equilateral triangle formed by the three pins 74 substantially coincides with the center of the disk-like bottom plate 71. The pins 74 support the substrate W from below above the bottom plate 71.

[0111] The pure water supply unit 80 has a nozzle 81, a pure water supply pipeline 82, and a return pipeline 83. The pure water supply pipeline 82 is connected to the nozzle 81. The nozzle 81 ejects the pure water supplied through the pure water supply pipeline 82. A branch point 85 is provided in the pure water supply pipeline 82, and the return pipeline 83 is connected to the branch point 85. Even during the period when pure water is not ejected from the nozzle 81, the pure water circulates in the portion of the pure water supply pipeline 82 upstream of the branch point 85 and in the return pipeline 83. The pure water supply unit 80 configured in this way supplies pure water to the upper surface of the substrate W. The pure water supply unit 80 is an example of the first processing liquid supply unit, and the pure water is an example of the first processing liquid.

[0112] The second standby area 54b includes a structure that holds the substrate W horizontally in a state of being in contact with pure water.

[0113] Regarding the avoidance table 64, it may also have a pure water supply unit, a liquid receiving part, and three or more pins in the same manner as the second standby area 54b. The pure water supply unit is an example of the second processing liquid supply unit, and the pure water is an example of the second processing liquid.

[0114] As described above, the substrate processing system 1 of the embodiment includes a loading / unloading unit 2, a substrate transfer unit 3, a batch processing unit 4, a substrate standby unit 5, and a single wafer processing unit 6. The substrate standby unit 5 includes a standby table 54, a first transfer device 53, and a first replacement device 55. The standby table 54 includes a first standby area 54a and a second standby area 54b. The first standby area 54a mounts the substrate W fed from the batch processing unit 4. The second standby area 54b is arranged relative to the first standby area 54a in the vertical direction and mounts the substrate W to be sent to the single wafer processing unit 6. The second standby area 54b has a pure water supply unit 80 that supplies a first processing liquid to the upper surface of the substrate W. The first transfer device 53 transfers a plurality of substrates W from the batch processing unit 4 to the first standby area 54a at once. The first replacement device 55 replaces the substrate W from the first standby area 54a to the second standby area 54b. In this case, the time required to transfer the substrate W from the batch processing unit 4 to the single wafer processing unit 6 can be shortened. As a result, the throughput is improved.

[0115] (Operation of the substrate processing system)

[0116] (Overall operation)

[0117] Refer to Figures 4 to 8 , and the operation of the substrate processing system 1 of the embodiment, that is, the substrate processing method will be described. Figure 4 is a flowchart showing the substrate processing method of the embodiment. Figure 5 is a top view showing the operation of the composite processing. Figure 6 is a diagram showing the transfer process of the substrate W in the composite processing. Figure 7 is a top view showing the operation of the single wafer processing. Figure 8 is a diagram showing the transfer process of the substrate W in the single wafer processing. Figure 4 The processing shown is implemented under the control of the control device 9.

[0118] First, the cassette C is fed into the loading / unloading unit 2 in a state of accommodating a plurality of substrates W and is mounted on the load port 21. Inside the cassette C, the substrates W are held horizontally and are held at a second pitch P2 (P2 = N × P1) in the vertical direction. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0119] Next, the cassette transfer device 24 transfers the cassette C from the load port 21 to the loader 23 ( Figure 5 arrow F1 of Figure 7 arrow G1 of). When the cassette C is transferred to the loader 23, the lid of the cassette C is opened by the lid opening / closing mechanism.

[0120] Next, the control device 9 controls each part of the substrate processing system 1 to perform Figure 4The processing shown. The control device 9 controls each part of the substrate processing system 1 so that whenever a cassette C is placed on the loader 23, the following Figure 4 processing shown is performed.

[0121] First, when the cassette C is conveyed to the loader 23, the control device 9 determines which of the composite processing and single-piece processing is to be performed on the plurality of substrates W accommodated in the cassette C based on the information associated with the cassette C ( Figure 4 S101).

[0122] In Figure 4 S101, when it is determined that composite processing is to be performed, the control device 9 controls each part of the substrate processing system 1 to convey the substrates W accommodated in the cassette C to the batch processing unit 4 ( Figure 4 S102). Specifically, the transfer device 31 receives the substrates W accommodated in the cassette C and conveys them to the substrate group forming unit 32 ( Figure 5 arrow F2). Next, the substrate group forming unit 32 holds a plurality of substrates W at the first pitch P1 (P1 = P2 / N) to form a substrate group L. One substrate group L is composed of the substrates W of, for example, M cassettes C. Since the pitch of the substrates W is narrowed from the second pitch P2 to the first pitch P1, the number of substrates W that can be processed together can be increased. Next, the first substrate group conveying device 43 receives the substrate group L from the substrate group forming unit 32 and conveys it to the processing tool 44 ( Figure 5 arrow F3).

[0123] Next, the processing tool 44 descends from above the liquid medicine tank 41, immerses the substrate group L in the liquid medicine, and performs liquid medicine processing ( Figure 4 S103). After that, the processing tool 44 rises to lift the substrate group L out of the liquid medicine, and then moves horizontally (negative X-axis direction) toward above the rinsing liquid tank 42 ( Figure 5 arrow F4).

[0124] Next, the processing tool 44 descends from above the rinsing liquid tank 42, immerses the substrate group L in the first rinsing liquid, and performs rinsing liquid processing ( Figure 4 S103). After that, the processing tool 44 rises to lift the substrate group L out of the first rinsing liquid. Next, the first substrate group conveying device 43 receives the substrate group L from the processing tool 44 and transfers it to the second substrate group conveying device 52.

[0125] Next, the conveying arm 52c of the second substrate group conveying device 52 moves horizontally (positive Y-axis direction), descends from above the immersion tank 51, and immerses the substrate group L in the second rinsing liquid ( Figure 4 S104, Figure 5arrow F5). The multiple substrates W of the substrate group L are held in the second rinsing liquid until they are lifted from the second rinsing liquid by the first transfer device 53. Since the substrate W is below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern of the substrate W can be prevented.

[0126] Next, the first transfer device 53 transfers the substrate W of the substrate group L held in the second rinsing liquid by the transfer arm 52c to the standby table 54 ( Figure 5 arrow F6). The first transfer device 53 transfers multiple (for example, two) substrates W to the first standby area 54a of the standby table 54 ( Figure 6 ).

[0127] Next, the first replacement device 55 transfers the substrate W placed on the first standby area 54a to the second standby area 54b provided corresponding to the upper layer, middle layer, and lower layer respectively ( Figure 6 ). The first replacement device 55 can replace the substrates W one by one or replace multiple substrates W together. In the latter case, the first replacement device 55 transfers multiple (for example, two) substrates W together.

[0128] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the second standby area 54b of the standby table 54 and transfers it to the liquid processing device 62 ( Figure 5 arrow F7, Figure 6 ).

[0129] Next, in each processing unit block 60, the liquid processing device 62 processes the substrate W one by one with a liquid ( Figure 4 S105). There can be multiple types of liquids. For example, it can be pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid can be an alcohol such as IPA, for example. The liquid processing device 62 sequentially supplies pure water and the drying liquid to the upper surface of the substrate W to form a liquid film of the drying liquid. The liquid processing device 62 rotates the substrate W and removes the drying liquid from the upper surface of the substrate W by spin drying that uses centrifugal force to fling off the drying liquid from the substrate W.

[0130] In the present embodiment, the liquid treatment device 62 dries the substrate W by spin drying, but the drying method is not particularly limited. The drying method can be any method as long as it can suppress the collapse of the concave-convex pattern of the substrate W, for example, it can be supercritical drying, scan drying or hydrophobic drying. In supercritical drying, the drying liquid can be replaced by a supercritical fluid, which can suppress the collapse of the concave-convex pattern of the substrate W caused by the surface tension of the drying liquid. In the sweep drying, the supply position of the drying liquid is moved from the center of the substrate W toward the periphery of the substrate W while the substrate W is rotated, and the liquid film is thrown off from the substrate W by centrifugal force. Sweeping drying can also move the supply position of a drying gas such as N2 gas from the center of the substrate W toward the periphery of the substrate W in a manner following the supply position of the drying liquid.

[0131] Next, in each processing unit block 60, the second transport device 61 receives the substrate W from the liquid processing device 62 and transports it to the first transfer area 33a ( Figure 5 Arrow F8, Figure 6 ).

[0132] The second transport device 61 may also transport the substrate W being transported to the avoidance stage 64 ( Figure 5 The second conveying device 61 may also convey the substrate W from the avoidance platform 64 to the liquid processing device 62 in a usable state when at least one of the three liquid processing devices 62 becomes usable after conveying the substrate W to the avoidance platform 64 ( Figure 5 The second conveying device 61 receives the substrate W from the liquid processing device 62 and conveys it to the first transfer area 33a ( Figure 5 arrow F13).

[0133] Next, the second replacement device 34 transports the substrate W placed in the first transfer area 33a respectively arranged corresponding to the upper, middle and lower processing unit blocks 60 to the second transfer area 33b ( Figure 6 ). The second replacement device 34 can replace the substrates W one by one, or can replace a plurality of substrates W at once. In the latter case, the second replacement device 34 transports a plurality of (for example, two) substrates W at a time.

[0134] Next, the transfer device 31 receives the substrate W from the second transfer area 33b of the transfer station 33 and stores it in the cassette C placed on the loader 23 ( Figure 4 S106, Figure 5 Arrow F9, Figure 6 ).

[0135] Next, the cassette transfer device 24 transfers the cassette C from the loader 23 to the loading port 21 ( Figure 5 in the direction of arrow F10). The cassette C transferred to the loading port 21 is sent out from the loading / unloading unit 2 while accommodating a plurality of substrates W. The cassette transfer device 24 may also transfer the cassette C from the loader 23 to the storage stack 22 and temporarily store it in the storage stack 22.

[0136] In Figure 4 S101, when it is determined that single-wafer processing is to be performed, the control device 9 controls each part of the substrate processing system 1 to transfer the substrate W accommodated in the cassette C to the single-wafer processing unit 6 ( Figure 4 in S107). Specifically, the transfer device 31 receives the substrate W accommodated in the cassette C and transfers it to the third transfer area 33c of the transfer table 33 ( Figure 7 in the direction of arrow G2, Figure 8 ).

[0137] Next, the second replacement device 34 transfers the substrate W placed on the third transfer area 33c to the fourth transfer areas 33d provided corresponding to the upper layer, middle layer, and lower layer respectively ( Figure 8 ). The second replacement device 34 can replace the substrates W one by one or replace a plurality of substrates W together. In the latter case, the second replacement device 34 transfers a plurality of (for example, two) substrates W together.

[0138] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the fourth transfer area 33d of the transfer table 33 and transfers it to the liquid processing device 62 ( Figure 7 in the direction of arrow G3, Figure 8 ).

[0139] Next, similar to Figure 4 S105, in each processing unit module 60, the liquid processing device 62 processes the substrates W one by one with liquid ( Figure 4 in S108).

[0140] Next, in each processing unit block 60, the second transfer device 61 receives the substrate W from the liquid processing device 62 and transfers it to the fourth transfer area 33d of the transfer table 33 ( Figure 7 in the direction of arrow G4, Figure 8 ).

[0141] Next, the second replacement device 34 transfers the substrate W placed on the fourth transfer areas 33d provided corresponding to the upper layer, middle layer, and lower layer processing unit blocks 60 respectively, to the third transfer area 33c ( Figure 8)。The second replacement device 34 can replace the substrates W one by one, or can replace a plurality of substrates W together. In the latter case, the second replacement device 34 conveys a plurality (for example, two) of substrates W together.

[0142] Next, the transfer device 31 receives the substrate W from the third transfer area 33c of the transfer table 33 and stores it in the cassette C placed on the loader 23 ( Figure 4 of S109, Figure 7 arrow G5 of, Figure 8 ).

[0143] Next, the cassette transfer device 24 transfers the cassette C from the loader 23 to the loading port 21 ( Figure 7 arrow G6 of). The cassette C transferred to the loading port 21 is sent out from the loading / unloading unit 2 in a state where a plurality of substrates W are stored. The cassette transfer device 24 can also transfer the cassette C from the loader 23 to the storage stack 22 and temporarily store it in the storage stack 22.

[0144] (Operation of the first replacement device)

[0145] Referring to Figures 9 to 15 , as an example of the operation of the first replacement device 55, the operation of the first replacement device 55 for replacing the substrate W from the first standby area 54a of the standby table 54 to the second standby area 54b will be described. Figures 9 to 15 is a diagram showing the operation of replacing the substrate W on the standby table 54. In Figures 9 to 15 , it is described that the first replacement device 55 has an upper arm 55a and a lower arm 55b, and the substrate W is replaced using the upper arm 55a and the lower arm 55b.

[0146] First, as Figure 9 shown, using the first transfer device 53, the substrates W are fed one by one into each of the two first standby areas 54a. Each substrate W is, for example, a substrate processed by the batch processing unit 4.

[0147] Next, as Figure 10 shown, the first replacement device 55 inserts the upper arm 55a into one of the first standby areas 54a and receives the substrate W placed on one of the first standby areas 54a. In addition, the first replacement device 55 inserts the lower arm 55b into the other first standby area 54a and receives the substrate W placed on the other first standby area 54a.

[0148] Next, as Figure 11 shown, the first replacement device 55 withdraws the upper arm 55a holding the substrate W from one of the first standby areas 54a, and withdraws the lower arm 55b holding the substrate W from the other first standby area 54a. Thus, the substrates W are taken out from one and the other first standby areas 54a simultaneously.

[0149] Next, as Figure 12 shown, the first replacement device 55 descends to the same height as one of the second standby areas 54b provided corresponding to the lower processing unit block 60, inserts the lower arm 55b into one of the second standby areas 54b, and delivers the substrate W to one of the second standby areas 54b. Thus, a substrate W is fed into one of the second standby areas 54b provided corresponding to the lower processing unit block 60.

[0150] Next, as Figure 13 shown, the first replacement device 55 withdraws the lower arm 55b from one of the second standby areas 54b.

[0151] Next, as Figure 14 shown, the first replacement device 55 ascends to the same height as the other second standby area 54b provided corresponding to the lower processing unit block 60, inserts the upper arm 55a into the other second standby area 54b, and delivers the substrate W to the other second standby area 54b. Thus, the substrate W is fed into the other second standby area 54b provided corresponding to the lower processing unit block 60.

[0152] Next, as Figure 15 shown, the first replacement device 55 withdraws the upper arm 55a from the other second standby area 54b.

[0153] Through the above, two substrates W are replaced from the first standby area 54a to the second standby area 54b together. At this time, the time required for transporting the substrate W is shortened. As a result, the throughput is improved.

[0154] In addition, the case of replacing the substrate W from the first transfer area 33a of the transfer table 33 to the second transfer area 33b by the second replacement device 34 may be the same. Further, the first replacement device 55 may also deliver the substrate W held by the upper arm 55a and the substrate W held by the lower arm 55b to the second standby area 54b provided corresponding to other processing unit blocks 60.

[0155] (Operation of the second replacement device)

[0156] Referring to Figures 16 to 24 , as an example of the operation of the second replacement device 34, the operation of the second replacement device 34 for replacing the substrate W from the first transfer area 33a of the transfer table 33 to the second transfer area 33b will be described. Figures 16 to 24 is a diagram showing the operation of replacing the substrate W on the transfer table 33. In Figures 16 to 24 , the case where the second replacement device 34 has an arm 34a and uses the arm 34a to replace the substrate W is described.

[0157] First, as Figure 16As shown, using the second conveying device 61, a substrate W is fed into the first transfer area 33a provided corresponding to the processing unit block 60 in the middle layer and the first transfer area 33a provided corresponding to the processing unit block 60 in the lower layer, respectively. Each substrate W is, for example, a substrate processed by the single-chip processing unit 6.

[0158] Next, as Figure 17 shown, the second replacement device 34 inserts the arm 34a into the first transfer area 33a provided corresponding to the processing unit block 60 in the lower layer and receives the substrate W placed on the first transfer area 33a.

[0159] Next, as Figure 18 shown, the second replacement device 34 withdraws the arm 34a holding the substrate W from the first transfer area 33a. Thus, the substrate W is taken out from the first transfer area 33a.

[0160] Next, as Figure 19 shown, the second replacement device 34 rises to the same height as one of the three second transfer areas 33b, inserts the arm 34a into the second transfer area 33b, and delivers the substrate W to the second transfer area 33b. Thus, the first substrate W is fed into the second transfer area 33b.

[0161] Next, as Figure 20 shown, the second replacement device 34 withdraws the arm 34a from the second transfer area 33b.

[0162] Next, as Figure 21 shown, the second replacement device 34 rises to the same height as the first transfer area 33a provided corresponding to the processing unit block 60 in the middle layer, inserts the arm 34a into the first transfer area 33a, and receives the substrate W placed on the first transfer area 33a.

[0163] Next, as Figure 22 shown, the second replacement device 34 withdraws the arm 34a holding the substrate W from the first transfer area 33a. Thus, the substrate W is taken out from the first transfer area 33a.

[0164] Next, as Figure 23 shown, the second replacement device 34 descends to the same height as the second transfer area 33b into which the first substrate W has been fed, inserts the arm 34a into the second transfer area 33b, and delivers the substrate W to the second transfer area 33b. Thus, the second substrate W is fed into the second transfer area 33b.

[0165] Next, as Figure 24 shown, the second replacement device 34 withdraws the arm 34a from the second transfer area 33b.

[0166] Through the above, the substrate W is replaced from the first transfer area 33a to the second transfer area 33b. In addition, when a predetermined number (e.g., 25) of substrates W are fed into the second transfer area 33b, the transfer device 31 transfers the predetermined number of substrates W from the second transfer area 33b to the cassette C placed on the loader 23 all at once.

[0167] In addition, the case of replacing the substrate W from the first transfer area 33a provided corresponding to the upper processing unit block 60 to the second transfer area 33b may be the same.

[0168] In the substrate processing method of the embodiment described above, the first transfer device 53 transfers a plurality of substrates W from the batch processing unit 4 to the first standby area 54a all at once. Next, the first replacement device 55 replaces the substrate W from the first standby area 54a to the second standby area 54b. Next, the pure water supply unit 80 supplies pure water to the upper surface of the substrate W placed in the second standby area 54b to form a liquid film on the upper surface of the substrate W. Next, the second transfer device 61 transfers the substrate W with the liquid film formed thereon from the second standby area 54b to the single wafer processing unit 6. In this case, the time required to transfer the substrate W from the batch processing unit 4 to the single wafer processing unit 6 is shortened. As a result, the throughput is increased.

[0169] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The above embodiments can be omitted, replaced, and changed in various ways without departing from the scope and gist of the invention.

Claims

1. A substrate processing system, characterized in that: include: A feeding and discharging unit for feeding and discharging a box containing a plurality of substrates; A batch processing unit, which processes a plurality of the substrates at once; A single-wafer processing unit processes the substrates one by one; A substrate transfer unit, which transfers the substrate from the feeding and unloading unit to the batch processing unit and the single-wafer processing unit; and a substrate standby unit that transfers the substrate from the batch processing unit to the single-wafer processing unit, The substrate standby unit comprises: A standby station including a first standby area and a second standby area arranged in a vertical direction relative to the first standby area, the first standby area placing the substrate sent in from the batch processing unit, and the second standby area placing the substrate to be sent out to the single-wafer processing unit; a first conveying device that conveys the plurality of substrates from the batch processing section to the first standby area at a time; and a first replacement device, which replaces the substrate from the first standby area to the second standby area, The second standby area includes a first processing liquid supply unit that supplies a first processing liquid to the upper surface of the substrate.

2. The substrate processing system according to claim 1, characterized in that: The substrate transfer unit comprises: A transfer stage, comprising a first transfer area and a second transfer area arranged in a vertical direction relative to the first transfer area, the first transfer area being used to load the substrate sent in from the single-wafer processing unit, and the second transfer area being used to load the substrate to be sent out to the feeding and discharging unit; A second replacement device that replaces the substrate from the first transfer area to the second transfer area; and A transfer device is used to transfer the substrate from the second transfer area to the feeding and unloading part.

3. The substrate processing system according to claim 2, characterized in that: The single-chip processing unit comprises: a liquid processing device for processing the substrates one by one; and A second transport device transports the substrate from the liquid processing device to the first transfer area.

4. The substrate processing system according to claim 3, characterized in that: The single-wafer processing section includes an escape platform, which is provided at a position accessible by the second conveying device and is provided to carry the substrate sent out from the substrate standby section. The second transport device transports the substrate being transported to the escape stage when the liquid processing device becomes unusable during the transport of the substrate from the substrate standby section to the liquid processing device.

5. The substrate processing system according to claim 4, characterized in that: The avoidance stage includes a second processing liquid supplying portion for supplying a second processing liquid to the upper surface of the substrate.

6. The substrate processing system according to any one of claims 3 to 5, characterized in that: A plurality of the liquid processing devices are arranged side by side in the vertical direction.

7. The substrate processing system according to claim 2, characterized in that: The transfer platform comprises: A third transfer area on which the substrate fed from the feeding and unfeeding section is placed; and a fourth transfer area for placing the substrate to be sent to the single-wafer processing unit, The transfer device is configured to be able to transfer the substrate from the feeding and unfeeding section to the third transfer area. The second replacement device is configured to be able to replace the substrate from the third transfer area to the fourth transfer area.

8. The substrate processing system according to claim 7, characterized in that: The transfer stage includes a fifth transfer area for placing the substrate to be sent to the batch processing unit. The transfer device is configured to be able to transfer the substrate from the carrying-in / out section to the fifth transfer area.

9. The substrate processing system according to claim 8, characterized in that: The transfer device is configured to be able to transfer the plurality of substrates stored in the cassette to the third transfer area or the fifth transfer area based on information associated with the cassette sent into the carry-in / out unit.

10. The substrate processing system according to claim 2, characterized in that: The transfer device is configured to be able to transport a plurality of the substrates at a time.

11. The substrate processing system according to claim 1, characterized in that: The first replacement device is configured to be able to transport a plurality of the substrates at a time.

12. A substrate processing method, characterized in that: The substrate processing method is a substrate processing method in a substrate processing system, The substrate processing system comprises: A feeding and discharging unit for feeding and discharging a box containing a plurality of substrates; A batch processing unit, which processes a plurality of the substrates at once; A single-wafer processing unit processes the substrates one by one; a substrate transfer unit that transfers the substrate from the transfer unit to the batch processing unit and the single-wafer processing unit; and a substrate standby unit that transfers the substrate from the batch processing unit to the single-wafer processing unit, The substrate standby section includes a first standby area and a second standby area arranged side by side in a vertical direction. The substrate processing method comprises: The step of transporting the plurality of substrates from the batch processing unit to the first standby area at once; The step of replacing the substrate from the first standby area to the second standby area; supplying a first processing liquid to an upper surface of the substrate placed in the second standby area to form a liquid film on the upper surface; and A step of transporting the substrate on which the liquid film is formed from the second standby area to the single-wafer processing section.

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