High-speed feeding device for diode processing

By designing a high-speed feeding device including a cover wheel set, a sliding middleware and a power output mechanism, the problem of slow feeding speed in the prior art is solved, and high-speed installation and efficient processing of the patch diode are realized.

CN120184072AActive Publication Date: 2025-06-20JIANGXI DEC SEMICON CO LTD
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Patent Information

Application Number
CN202510666928.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-22
Publication Date
2025-06-20
Estimated Expiration
2045-05-22

AI Technical Summary

Technical Problem

The existing feeding devices are extremely slow during the processing of patch diodes, which seriously restricts production efficiency.

Method used

A high-speed feeding device including a bottom mounting plate, a support frame, a feeding channel, a discharge channel, a cover wheel set, a sliding middleware and a power output mechanism are designed. The tape and tape are rolled together by rotating the overlay wheel set, and the sliding middleware and the pulley combination are used to intermittently to push the top material part, push the patch diode into the tape, and drive the overlay wheel set to rotate through the power output mechanism to increase the feeding speed.

Benefits of technology

The high-speed installation of the patch diode is realized, which significantly improves the processing efficiency. Through the design of the guide frame and the restraint plate, the accurate alignment and fixation of the material tape and patch diode are ensured.

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Abstract

The invention relates to a feeding device, and provides a high-speed feeding device for diode processing, which comprises a bottom mounting plate; the support frames are uniformly mounted on the bottom mounting plate at intervals; the feeding channel is mounted on one side of the top of the supporting frame; the discharging channel is mounted on the other side of the top of the supporting frame; the guide frame is mounted on the feeding channel; the material jacking part is mounted in the supporting frame and located below the material supply channel; the pressing and covering wheel set is arranged in a gap reserved between the feeding channel and the discharging channel; the shifting wheel is coaxially mounted on one wheel of the pressing and covering wheel set; and the sliding middle piece is installed on the supporting frame, and the movable part of the sliding middle piece is connected with the material jacking piece. In the process that the adhesive tape and the material belt are rolled together by the pressing and covering wheel set, the material jacking piece is pushed through the sliding middle piece, then the patch diode located in the feeding channel is clamped into the material belt, the rotating speed of the pressing and covering wheel set is increased, and the placing speed is also increased.
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Description

Technical Field

[0001] The present invention relates to a feeding device, and more particularly to a high-speed feeding device for diode processing. Background Art

[0002] During the process of approaching the end of the production of surface mount diodes, in order to enable the surface mount diodes to better complete subsequent processing and be easily packaged after production, the surface mount diodes are placed one by one at even intervals on a tape.

[0003] As Figure 1 shown, a notch is evenly formed at intervals on the tape, and this notch can just enable the surface mount diode to be stuck in this notch. After the surface mount diode is stuck, a tape is adhered to the bottom of the surface mount diode, so that the lead part of the surface mount diode is between the tape and the tape, thereby completing the fixation of the surface mount diode. However, for the existing equipment to complete the above process, it is necessary to pick up the surface mount diodes one by one in the magazine by a gripper and then insert them into the tape, and such a feeding speed is extremely slow, seriously restricting the production efficiency. Summary of the Invention

[0004] The present invention aims to solve the technical problems existing in the above-mentioned prior art. To this end, the present invention provides a high-speed feeding device for diode processing.

[0005] To achieve the above-mentioned purpose, the present invention provides a high-speed feeding device for diode processing, comprising: a bottom mounting plate; a support frame, which is provided with a plurality of support frames evenly spaced and installed on the bottom mounting plate; a feeding channel, which is installed on one side of the top of the support frame; a discharging channel, which is installed on the other side of the top of the support frame; a first auxiliary material supply area, which is arranged on the upper part of the support frame for providing material tape; a second auxiliary material supply area, which is arranged on the lower part of the support frame for providing adhesive tape; a guide frame, which is installed on the feeding channel, and the first auxiliary material supply area is provided with a guide wheel for guiding the material tape to the guide frame, and the material tape is pulled out from the first auxiliary material supply area and passes through the guide wheel and enters the guide frame, and the material tape is guided by the guide frame and adheres to the surface of the feeding channel; a material ejecting member, which is installed inside the support frame and is located below the feeding channel; A gap is left between the feeding channel and the discharging channel; a pressing wheel group is arranged between the gap left between the feeding channel and the discharging channel; a thumb wheel is provided with a plurality of shifting teeth along the circumferential direction, and the thumb wheel is coaxially mounted on one of the wheels of the pressing wheel group; a sliding middle piece is mounted on the supporting frame, and the movable part of the sliding middle piece is connected to the ejecting member, and the shifting teeth of the thumb wheel are in cooperative contact with the sliding middle piece; the material belt and the adhesive tape are pulled through the pressing wheel group, and the pressing wheel group rotates to pull the material belt and the adhesive tape to move, and the thumb wheel follows the rotation and the shifting teeth intermittently shift the sliding middle piece, so that the ejecting member pushes the material in the feeding channel onto the material belt; a power output mechanism is arranged on the bottom mounting plate, and drives the pressing wheel groups on the supporting frames to rotate.

[0006] As a further improvement of the scheme, the power output mechanism includes: a commutator, which is arranged on the bottom mounting plate to match the number of the support frames; a transmission shaft, which is connected in series with each of the commutators; and a drive motor, which is installed on the bottom mounting plate to drive one of the transmission shafts to rotate.

[0007] As a further improvement of the scheme, the ejecting member includes: an installation chamber, which is opened on the support frame; a movable ejecting block, which slides out of the installation chamber and passes into the feeding channel; a guide rod, which is installed in the installation chamber, and the bottom of the movable ejecting block is slidably connected to the guide rod; and a spring, which is sleeved on the guide rod to keep the top of the movable ejecting block at the bottom of the feeding channel.

[0008] As a further improvement of the scheme, it also includes: a bracket installed on the feeding channel; a rubber wheel rotatably arranged on the bracket and in rolling contact with the material on the feeding channel; and a driving motor installed on the bracket to drive the rubber wheel to rotate.

[0009] As a further improvement of the scheme, the pressing wheel group includes: roller pressing wheels, which are connected in pairs to form a group with a total of two groups, and the spacing distance between the roller pressing wheels in each group is at least greater than the material width, and the two groups of roller pressing wheels are symmetrically arranged up and down and rotatably installed on the support frame between the feeding channel and the discharging channel, and the gap between the upper and lower arranged roller pressing wheels is flush with the feeding channel, and the roller pressing wheels are provided with protruding convex teeth at intervals along the circumferential direction, and the convex teeth of the upper and lower groups of roller pressing wheels are staggered with each other; gears are coaxially installed on the roller pressing wheels and mesh with each other to keep the two groups of roller pressing wheels rotating towards each other.

[0010] As a further improvement of the scheme, it also includes: a protective ring, which is installed on the support frame and wraps the lower roller wheel in a semi-wrapped state, and the protective ring is provided with a guide channel curved toward the gap between the two groups of roller wheels to guide the tape to penetrate into the gap between the two groups of roller wheels.

[0011] As a further improvement of the scheme, the feed channel includes: a first bottom plate, fixedly mounted on one side of the top of the support frame; constraint plates, symmetrically arranged on both sides of the first bottom plate, and the opposite end faces of the two constraint plates are provided with recessed through grooves to allow the pins of the chip diode to be inserted; a top material opening allowing the top material piece to slide out is opened on the first bottom plate; one side of the constraint plate eliminates part of the through groove to form a release area that allows the chip diode to move upward under the clamping action of the two constraint plates; a blocking protrusion is arranged on the first bottom plate to limit the chip diode from moving to the area of ​​the top material opening and then stopping it.

[0012] As a further improvement of the scheme, the discharge channel includes: a second bottom plate, installed on the other side of the top of the support frame; a limit plate, symmetrically installed on the second bottom plate; an anti-detachment cover plate, jointly installed on the limit plates on both sides, and an entry channel is formed between the anti-detachment cover plate and the limit plate to allow materials, tapes and material strips to pass through.

[0013] As a further improvement of the scheme, the guide frame includes: a first bent plate, fixedly mounted on the constraint plate; a second bent plate, attached to the first bent plate and mounted on the constraint plate; the first bent plate is provided with a belt groove allowing the material belt to be inserted, and the first bent plate is provided with a notch in an area close to the release area; the notch set on the first bent plate does not exceed the width of the material belt.

[0014] As a further improvement of the scheme, the sliding middle piece includes: a fixed plate, which is covered and installed on the installation chamber; a slide rail, which is symmetrically installed on the fixed plate; a first connecting block, which is slidably installed on the slide rail and passes through the fixed plate to be connected with the movable top block; a second connecting block, which is connected to the first connecting block, and the end of the second connecting block is provided with a protruding contact portion which cooperates with the toggle teeth of the dial wheel.

[0015] The present invention brings the following effects: 1. In the process of the pressing wheel group rolling the adhesive tape and the material tape together, the present invention pushes the top material piece through the sliding middle piece every time the material tape is pulled a certain distance, thereby clamping the SMD diode in the feed channel onto the material tape, and the adhesive tape adheres to the material tape under the rolling pressure of the pressing wheel group, thereby fixing the SMD diode. As the rotation speed of the pressing wheel group increases, the placement speed of the SMD diode will also increase, thereby effectively improving the processing efficiency.

[0016] 2. The through grooves arranged on the feeding channel can limit the pins on the SMD diodes, so that the SMD diodes will not slip out of the feeding channel during the transportation process; the guide frame can constrain the direction of the material belt, so that the material belt can slide more smoothly along the upper surface of the feeding channel, will not easily leave the feeding channel, and effectively align with the SMD diodes.

[0017] 3. The driving motor drives the rubber wheel to rotate so that the SMD diode in the feeding channel can continuously slide toward the top material port; the protective ring can guide and protect the tape to correctly guide the tape into the gap between the two rollers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram for reference of the prior art.

[0019] Figure 2 It is a complete schematic diagram of the present invention.

[0020] Figure 3 For the present invention Figure 2 Schematic diagram from another perspective.

[0021] Figure 4 Schematic diagram of a single support frame of the present invention.

[0022] Figure 5 For the present invention Figure 4 The schematic diagram of the first auxiliary material supply area is hidden.

[0023] Figure 6 For the present invention Figure 4 Schematic diagram of the direction of the material tape and tape.

[0024] Figure 7 It is a schematic diagram of the specific positions of the movable top block and the guide rod of the present invention.

[0025] Figure 8 It is a schematic diagram of the pressing wheel set of the present invention.

[0026] Figure 9This is the front view of the specific positions of the movable top block and the guide rod of the present invention.

[0027] Figure 10 This is a schematic diagram of the bracket, rubber wheel and drive motor of the present invention.

[0028] Figure 11 This is a schematic diagram of the first base plate and the restraint plate of the present invention.

[0029] Figure 12 This is a schematic diagram of the feeding channel of the present invention.

[0030] Figure 13 This is a schematic diagram of the discharge channel of the present invention.

[0031] Figure 14 This is a schematic diagram of the guide frame of the present invention.

[0032] Figure 15 This is a schematic diagram of the protective ring and the guide channel of the present invention.

[0033] Figure 16 This is a schematic diagram of the sliding intermediate member of the present invention.

[0034] Among them, the corresponding relationship between the reference numerals in the drawings and the names of the components is as follows: 300 - tape, 301 - surface mount diode, 302 - pin, 303 - tape, 11 - bottom mounting plate, 12 - support frame, 13 - feeding channel, 14 - discharge channel, 15 - first auxiliary material supply area, 151 - guide wheel, 16 - second auxiliary material supply area, 17 - guide frame, 18 - top material member, 19 - pressing roller group, 110 - dial, 111 - sliding intermediate member, 112 - power output mechanism, 21 - commutator, 22 - transmission shaft, 23 - drive motor, 31 - installation chamber, 32 - movable top block, 33 - guide rod, 34 - spring, 41 - rolling press wheel, 42 - convex tooth, 43 - gear, 51 - first base plate, 52 - restraint plate, 53 - through slot, 54 - top material port, 55 - blocking protrusion, 56 - release area, 61 - second base plate, 62 - limiting plate, 63 - anti - detachment cover plate, 64 - entry channel, 71 - first bending plate, 72 - second bending plate, 73 - groove, 74 - notch, 81 - protective ring, 82 - guide channel, 91 - bracket, 92 - rubber wheel, 93 - drive motor, 201 - fixing plate, 202 - slide rail, 203 - first connecting block, 204 - second connecting block, 205 - contact part. Detailed implementation manners

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. In addition, it should be noted that for the convenience of description, only parts related to the present application rather than all structures are shown in the drawings. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the protection scope of the present application.

[0036] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0037] The present invention specifically discloses a high-speed feeding device for diode processing, as Figures 2 - 16 shown, including: a bottom mounting plate 11 and a support frame 12. There are multiple support frames 12. In this embodiment, three support frames 12 are taken as an example. The three support frames 12 are evenly spaced and installed on the bottom mounting plate 11. Each support frame 12 has the following layout: a feeding channel 13 is installed on one side of the top of the support frame 12. The chip diode 301 to be processed is conveyed from the feeding channel 13. It should be noted that the feeding channel 13 can be set for a relatively long distance and is connected to the device for conveying the chip diode 301 at the end, so as to continuously receive the chip diode 301. An outlet channel 14 is installed on the other side of the top of the support frame 12. The processed chip diode 301 is discharged through this outlet channel 14. The tape 300 required for the processing of the chip diode 301 is placed on the first auxiliary material supply area 15. The first auxiliary material supply area 15 is arranged on the upper part of the support frame 12. The rolled tape 300 is installed on the first auxiliary material supply area 15, while the tape 303 is placed on the second auxiliary material supply area 16. The second auxiliary material supply area 16 is arranged on the lower part of the support frame 12. A guiding frame 17 is installed on the feeding channel 13. A guiding wheel 151 for guiding the tape 300 to the guiding frame 17 is provided on the first auxiliary material supply area 15. The tape 300 is pulled out from the first auxiliary material supply area 15, passes through the guiding wheel 151, and then enters the guiding frame 17. The tape 300 is guided by the guiding frame 17 and slides on the surface of the feeding channel 13. Under the action of the guiding wheel 151, when the tape 300 pulled out from the first auxiliary material supply area 15 directly enters the guiding frame 17, it will not be bent, and can have a good curved movement route and will not get stuck at the turning point; A material ejecting member 18 is installed inside the support frame 12. The material ejecting member 18 is located below the feed channel 13. A gap is left between the feed channel 13 and the discharge channel 14. A pressing wheel group 19 is installed in the gap. A thumbwheel 110 is installed on the shaft at the lower part of the pressing wheel group 19. The thumbwheel 110 is provided with a plurality of shifting teeth along the circumferential direction. A sliding middle piece 111 is installed on the support frame 12. The movable part of the sliding middle piece 111 is connected to the material ejecting member 18. The shifting teeth of the thumbwheel 110 are in contact with the sliding middle piece 111. A power output mechanism 112 is arranged on the bottom mounting plate 11, and drives the pressing wheel groups 19 on the plurality of support frames 12 to rotate.

[0038] Specifically, the material belt 300 is first pulled out from the first auxiliary material supply area 15 and passed through the guide wheel 151, and then passed through the guide frame 17, so that the material belt 300 slides on the supply channel 13, and the material belt 300 is continuously pulled through the gap of the pressing wheel group 19. At the same time, the adhesive tape 303 is pulled from the second auxiliary material supply area 16 through the pressing wheel group 19, and the adhesive side of the adhesive tape 303 is in contact with the bottom of the material belt 300 and passes through the pressing wheel group 19 together. Under the rolling pressure of the pressing wheel group 19, the two will be pressed together, and as the pressing wheel group 19 rotates, the material belt 300 and the adhesive tape 303 are pulled to move, and the dial wheel 110 will also rotate accordingly, and the teeth will be moved while the dial wheel 110 rotates. The sliding middle piece 111 is intermittently toggled, and the sliding middle piece 111 lifts up the ejecting piece 18, thereby pushing the SMD diode 301 in the feeding channel 13 into the placement opening on the material belt 300. After the toggling teeth lose contact with the sliding middle piece 111, the ejecting piece 18 falls down, and the next SMD diode 301 moves forward. As the toggling teeth lift up the sliding middle piece 111 again, the ejecting piece 18 will push the SMD diode 301 in the feeding channel 13 into the placement opening on the material belt 300 again. Therefore, as the rotation speed of the pressing wheel assembly 19 increases, the speed at which the ejecting piece 18 pushes the SMD diode 301 into the material belt 300 will also increase.

[0039] In the process of the pressing wheel group 19 rolling the adhesive tape 303 and the material tape 300 together, the present invention pushes the top material piece 18 through the sliding middle piece 111 every time the material tape 300 is pulled a certain distance, thereby inserting the SMD diode 301 in the feeding channel 13 onto the material tape 300, and the adhesive tape 303 adheres to the material tape 300 under the rolling pressure of the pressing wheel group 19, thereby fixing the SMD diode 301. As the rotation speed of the pressing wheel group 19 increases, the placement speed of the SMD diode 301 will also increase, thereby effectively improving the processing efficiency.

[0040] Reference Figures 2 - 4As shown, the power output mechanism 112 includes: three groups of commutators 21 are arranged on the bottom mounting plate 11 according to the number of support frames 12, each group has three commutators 21, one of the commutators 21 is connected to the pressure wheel group 19 on the support frame 12, and the three groups of commutators 21 are connected together through a transmission shaft 22 and are connected laterally, so as to realize connecting the three groups of commutators 21 in series. At this time, a driving motor 23 is installed on the bottom mounting plate 11. After the driving motor 23 drives one group of commutators 21 through the transmission shaft 22, the three groups of commutators 21 can work together, so that all the pressure wheel groups 19 can rotate together at the same time.

[0041] Reference Figure 5 , Figure 7 , Figure 9 and Figure 10 As shown, the ejector 18 includes: an installation chamber 31 is opened on the support frame 12, a movable ejector block 32 is slidably installed in the installation chamber 31, the top of the movable ejector block 32 slides into the feeding channel 13, a guide rod 33 is fixedly installed in the installation chamber 31, the bottom of the movable ejector block 32 is slidably connected to the guide rod 33, and a spring 34 is sleeved on the guide rod 33. The function of the spring 34 is to keep the top of the movable ejector block 32 at the bottom of the feeding channel 13.

[0042] Specifically, the movable top block 32 is connected to the sliding middle piece 111, and the pressing wheel group 19 will rotate with the thumbwheel 110 during its rotation. The driving teeth on the thumbwheel 110 will drive the sliding middle piece 111, thereby causing the movable top block 32 to lift up the SMD diode 301 in the feeding channel 13, and the lifted SMD diode 301 will just be stuck on the material belt 300. After the driving teeth and the sliding middle piece 111 are out of contact, the movable top block 32 returns to its original position, and the next SMD diode 301 will move forward and come to the top of the movable top block 32 again. During the continuous rotation of the pressing wheel group 19, the material belt 300 and the adhesive tape 303 will be continuously pulled to move, and the thumbwheel 110 will intermittently lift up the movable top block 32, thereby sticking the SMD diode 301 in the feeding channel 13 to the material belt 300.

[0043] It should be noted that the material strip 300 will be pulled and moved during the rotation of the pressing wheel group 19. Therefore, in order to ensure that the movable top block 32 and the thumbwheel 110 can effectively cooperate to insert the patch diode 301 into the material strip 300, the gap between the multiple toggle teeth provided on the thumbwheel 110 needs to be adjusted to maintain a consistent distance with the gap between the holes provided on the material strip 300 under actual use conditions. The specific adjustment is as follows: when the pressing wheel group 19 clamps the material strip 300 and rotates and pulls it forward for a fixed distance, the thumbwheel 110 rotates accordingly, and the toggle teeth provided on the thumbwheel 110 will also swing accordingly for a distance. During the swinging process, the end of the toggle teeth contacts the movable top block 32 and lifts the movable top block 32. After the single toggle tooth contacts the movable top block 32 to reach the limit contact angle, the movable top block 32 is at the limit height. At this time, the patch diode 301 is moved by the movable top block 32. The material strip 300 is in a lifted state, and the holes on the material strip 300 are aligned just above the movable top block 32 under the rotation and pulling of the pressing wheel group 19; that is to say, while the pressing wheel group 19 pulls the material strip 300 to move, the toggle teeth arranged at intervals on the dial wheel 110 also push the movable top block 32 upward at the same time. When the material strip 300 is pulled to move so that the holes on the material strip 300 are aligned just with the movable top block 32, the movable top block 32 is also pushed to the highest point by the toggle teeth at this time, and the chip diode 301 can be just inserted into the material strip 300. At the same time, the contact between the toggle teeth and the movable top block 32 reaches the limit contact angle. After the dial wheel 110 continues to rotate, the toggle teeth and the movable top block 32 are disengaged, and the movable top block 32 returns to its original position until the next toggle tooth lifts the movable top block 32, thereby realizing effective cooperation between the dial wheel 110 and the movable top block 32.

[0044] Reference Figure 4 and Figure 10 As shown, it also includes: a bracket 91 fixedly installed on the feeding channel 13, a rubber wheel 92 rotatably set on the bracket 91, and rolling contact with the SMD diode 301 on the feeding channel 13, so that when the rubber wheel 92 rotates, the SMD diode 301 in the feeding channel 13 can actively slide to the area of ​​the top material piece 18, and a driving motor 93 is installed on the bracket 91 to drive the rubber wheel 92 to rotate.

[0045] Reference Figure 5 , Figure 6 and Figure 8As shown in the figure, the pressing and covering wheel set 19 includes: roller pressing wheels 41 that are connected in pairs at intervals to form a total of two groups. The interval distance between the two roller pressing wheels 41 in each group is at least greater than the width of the surface-mounted diode 301, so that the roller pressing wheels 41 will not press the surface-mounted diode 301 during rotation. The two groups of roller pressing wheels 41 are symmetrically arranged up and down and are rotatably installed on the support frame 12 between the feeding channel 13 and the discharging channel 14. The gap between the roller pressing wheels 41 arranged up and down is flush with the feeding channel 13. The roller pressing wheels 41 are provided with protruding convex teeth 42 at circumferential intervals, and the convex teeth 42 of the two groups of roller pressing wheels 41 arranged up and down are staggered from each other. During use, the tape 300 and the adhesive tape 303 are inserted into the gap between the two groups of roller pressing wheels 41. Then, the two side edges of the tape 300 and the adhesive tape 303 at this time will be clamped by the two groups of roller pressing wheels 41 arranged up and down, and the two will be adhered together under the rolling of the convex teeth 42. The pins 302 of the surface-mounted diodes 301 stuck on the tape 300 will be wrapped between the tape 300 and the adhesive tape 303. As the roller pressing wheels 41 rotate, the tape 300, the adhesive tape 303, and the surface-mounted diodes 301 that have been fixed pass through the gap of the roller pressing wheels 41 and finally enter the discharging channel 14 and are discharged. Among them, in order to ensure that the two groups of roller pressing wheels 41 can rotate stably in opposite directions, gears 43 are coaxially installed on the roller pressing wheels 41 and mesh with each other to keep the two groups of roller pressing wheels 41 rotating in opposite directions, so as to ensure that the two groups of roller pressing wheels 41 can rotate stably in opposite directions.

[0046] Referring to Figure 7 and Figure 15 As shown in the figure, it further includes: a protective ring 81 fixedly installed on the support frame 12. The protective ring 81 wraps the lower roller pressing wheels 41 in a semi-wrapped state. Among them, the height of the top of the protective ring 81 is lower than the height of the channel opening of the feeding channel 13. The purpose of doing this is to avoid interference of the protective ring 81 with the passing tape 300. The protective ring 81 is provided with a guiding channel 82 that bends towards the gap between the two groups of roller pressing wheels 41. After the adhesive tape 303 is pulled out from the second auxiliary material supply area 16, it can pass through the guiding channel 82 to better let the adhesive tape 303 pass into the gap between the two groups of roller pressing wheels 41, and at the same time, it can also avoid the tape 303 from breaking due to friction between the roller pressing wheels 41 and the adhesive tape 303.

[0047] Referring to Figure 6 、 Figures 10 - 12As shown in the figure, the feeding channel 13 includes: a first bottom plate 51 fixedly installed on one side of the top of the support frame 12. On the first bottom plate 51, restraint plates 52 are symmetrically installed. The tape 300 slides centered on the surfaces of the two restraint plates 52 under the action of the guiding frame 17. There is a gap between the two restraint plates 52 that allows the surface-mount diode 301 to pass through. And the opposite end faces of the two restraint plates 52 are provided with recessed passing grooves 53. After the surface-mount diode 301 is in the gap between the two restraint plates 52, the leads 302 of the surface-mount diode 301 will be placed into the passing grooves 53. In this way, when the surface-mount diode 301 slides on the two restraint plates 52, the passing grooves 53 restrict the leads 302 so that the surface-mount diode 301 will not break away from the restraint plates 52. A top material port 54 is opened on the first bottom plate 51 to allow the movable top block 32 to slide out. And the movable top block 32 is in the gap between the two restraint plates 52. After the surface-mount diode 301 slides above the movable top block 32, the movable top block 32 moves upward. Since the passing grooves 53 restrict the leads 302, it cannot move upward. At this time, the passing grooves 53 in the area of the restraint plate 52 close to the movable top block 32 need to be eliminated to form a release area 56 that allows the surface-mount diode 301 to move upward under the clamping action of the two restraint plates 52. In this way, the movable top block 32 can lift the surface-mount diode 301 upward and thus clamp it on the tape 300 that slides on the surface of the restraint plate 52. Among them, a blocking protrusion 55 in a raised shape is provided at the end of the first bottom plate 51. The function of the blocking protrusion 55 is to limit the movement of the surface-mount diode 301 to stop moving after reaching the area of the top material port 54. In this way, it can ensure that the movable top block 32 can lift the surface-mount diode 301 every time, and also prevent the surface-mount diode 301 from sliding beyond the working area of the movable top block 32.

[0048] Refer to Figure 6 and Figure 13 As shown in the figure, the discharging channel 14 includes: a second bottom plate 61 installed on the other side of the top of the support frame 12. A certain gap is left between the first bottom plate 51 and the second bottom plate 61 for installing the pressing wheel group 19. Limiting plates 62 are symmetrically installed on the second bottom plate 61. Anti-detachment cover plates 63 are jointly installed on the two limiting plates 62 on both sides. An access channel 64 that allows the surface-mount diode 301, the tape 303, and the tape 300 to pass through is formed between the anti-detachment cover plates 63 and the limiting plates 62. Specifically, after the tape 303, the tape 300, and the surface-mount diode 301 are connected together by being rolled by the pressing wheel group 19, they are then stuffed into the access channel 64 and discharged to a specified position under the guidance of the access channel 64 to avoid accumulation.

[0049] Refer to Figure 6 and Figure 14As shown, the guide frame 17 includes: a first bent plate 71 fixedly mounted on the constraint plate 52, the first bent plate 71 is in an L-shaped shape, and the corner is an arc-shaped bend, the second bent plate 72 is attached to the first bent plate 71 and then installed on the constraint plate 52, the first bent plate 71 is provided with a belt groove 73 for allowing the material belt 300 to be placed, the belt groove 73 is opened along the curved surface of the first bent plate 71, the material belt 300 is pulled out and inserted into the belt groove 73, and moves along the belt groove 73, and finally passes through the bottom of the first bent plate 71 along the surface of the constraint plate 52, so as to constrain the material belt 300 between the two constraint plates 52 The surface of the material strip 300 is centered and slides in the middle so that the material strip 300 and the SMD diode 301 can be accurately aligned. In order to prevent the upwardly pushed SMD diode 301 from being interfered by the first bent plate 71, a notch 74 is opened on the first bent plate 71 to allow the SMD diode 301 to pass through, and the width of the notch 74 must not exceed the width of the material strip 300. It is best to press down both sides of the material strip 300. In this way, when the SMD diode 301 is pushed upward, the material strip 300 in this area will not move upward with it, so that the SMD diode 301 can be stuck on the material strip 300.

[0050] Reference Figure 5 , Figure 6 and Figure 16 As shown, the sliding middle piece 111 includes: a fixed plate 201 covering and installed in the installation chamber 31, and a slide rail 202 is symmetrically installed on the fixed plate 201. A first connecting block 203 is slidably installed between the two slide rails 202. The first connecting block 203 slides up and down on the fixed plate 201, and the first connecting block 203 passes through the fixed plate 201 and is connected to the movable top block 32. The second connecting block 204 is connected to the first connecting block 203, and the second connecting block 204 extends toward the direction of the dial wheel 110, and is provided with a protruding contact portion 205 at the end to cooperate with the dial tooth of the dial wheel 110. Under the action of the slide rail 202, the dial wheel 110 dials the first connecting block 203, the second connecting block 204 and the movable top block 32, and the lifting process will be smoother and less likely to get stuck.

[0051] The above-mentioned embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person skilled in the art, several modifications, improvements and substitutions can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A high-speed feeding device for diode processing, comprising: Bottom mounting plate (11); A support frame (12) having a plurality of members which are evenly spaced and mounted on the bottom mounting plate (11); a material supply channel (13) mounted on one side of the top of the support frame (12); a material discharge channel (14) mounted on the other side of the top of the support frame (12); a first auxiliary material supply area (15) disposed on the upper part of the support frame (12) for providing a material tape (300); and a second auxiliary material supply area (16) disposed on the lower part of the support frame (12) for providing an adhesive tape (303); characterized in that it also includes: A guide frame (17) is mounted on the material supply channel (13); a guide wheel (151) is provided on the first auxiliary material supply area (15) for guiding the material belt (300) to the guide frame (17); the material belt (300) is pulled out from the first auxiliary material supply area (15) and passes through the guide wheel (151) and then enters the guide frame (17); the material belt (300) is guided by the guide frame (17) to adhere to the surface of the material supply channel (13); a material ejecting member (18) is mounted inside the support frame (12) and below the material supply channel (13); a gap is left between the material supply channel (13) and the material discharge channel (14); a pressing wheel group (19) is arranged between the gap left between the material supply channel (13) and the material discharge channel (14); a thumbwheel (110) is provided with a plurality of thumbwheel teeth along the circumferential direction; the thumbwheel (110) is coaxially mounted on the support frame (12 ... On one of the wheels of the pressing wheel group (19); a sliding middle piece (111) is installed on the support frame (12), the movable part of the sliding middle piece (111) is connected to the pushing piece (18), and the toggle teeth of the thumbwheel (110) are in contact with the sliding middle piece (111); the material belt (300) and the adhesive tape (303) are pulled through the pressing wheel group (19), the pressing wheel group (19) rotates to pull the material belt (300) and the adhesive tape (303) to move, and the thumbwheel (110) rotates and the toggle teeth intermittently toggle the sliding middle piece (111), thereby causing the pushing piece (18) to push the material in the feeding channel (13) onto the material belt (300); a power output mechanism (112) is arranged on the bottom mounting plate (11) and drives the pressing wheel groups (19) on the support frame (12) to rotate.

2. The high-speed feeding device for diode processing according to claim 1, wherein The power output mechanism (112) comprises: a commutator (21) arranged on the bottom mounting plate (11) in a quantity matching the number of the support frames (12); a transmission shaft (22) connected in series with each of the commutators (21); and a drive motor (23) mounted on the bottom mounting plate (11) to drive one of the transmission shafts (22) to rotate.

3. The high-speed feeding device for diode processing according to claim 2, wherein The ejector member (18) includes: an installation chamber (31) opened on the support frame (12); a movable ejector block (32) that slides out of the installation chamber (31) into the feeding channel (13); a guide rod (33) installed in the installation chamber (31), with the bottom of the movable ejector block (32) slidably connected to the guide rod (33); a spring (34) sleeved on the guide rod (33) to keep the top of the movable ejector block (32) at the bottom of the feeding channel (13).

4. The high-speed feeding device for diode processing according to claim 3, wherein It further includes: a bracket (91) installed on the feeding channel (13); a rubber wheel (92) rotatably arranged on the bracket (91) and in rolling contact with the material on the feeding channel (13); a driving motor (93) installed on the bracket (91) for driving the rubber wheel (92) to rotate.

5. The high-speed feeding device for diode processing according to claim 4, wherein The pressing wheel set (19) includes: roller pressing wheels (41), which are connected in pairs at intervals to form two groups in total. The interval distance between the roller pressing wheels (41) in each group is at least greater than the width of the material. Two groups of the roller pressing wheels (41) are symmetrically arranged up and down and rotatably installed on the support frame (12) between the feeding channel (13) and the discharging channel (14). The gap between the roller pressing wheels (41) arranged up and down is flush with the feeding channel (13). The roller pressing wheels (41) are circumferentially provided with protruding convex teeth (42) at intervals, and the convex teeth (42) of the two groups of roller pressing wheels (41) arranged up and down are staggered from each other; gears (43) coaxially installed on the roller pressing wheels (41) and meshing with each other to keep the two groups of roller pressing wheels (41) rotating towards each other.

6. The high-speed feeding device for diode processing according to claim 5, wherein It further includes: a protective ring (81) installed on the support frame (12) and wrapping the lower roller pressing wheels (41) in a semi-wrapped state. The protective ring (81) is provided with a guiding channel (82) bent towards the gap between the two groups of roller pressing wheels (41) to guide the tape (303) into the gap between the two groups of roller pressing wheels (41).

7. The high-speed feeding device for diode processing according to claim 6, wherein The feeding channel (13) includes: a first bottom plate (51) fixedly installed on one side of the top of the support frame (12); restraining plates (52) symmetrically arranged on both sides of the first bottom plate (51). The opposite end faces of the two restraining plates (52) are provided with recessed passing grooves (53) to allow the pins (302) of the patch diode (301) to be inserted; a top ejection port (54) is opened on the first bottom plate (51) to allow the ejector member (18) to slide out; a release area (56) is formed by removing part of the passing groove (53) on one side of the restraining plate (52) to allow the patch diode (301) to move upward under the clamping action of the two restraining plates (52); a blocking convex portion (55) is provided on the first bottom plate (51) to limit the movement of the patch diode (301) to stop after reaching the area of the top ejection port (54).

8. The high-speed feeding device for diode processing according to claim 7, wherein The discharge channel (14) comprises: a second bottom plate (61) mounted on the other side of the top of the support frame (12); a limit plate (62) symmetrically mounted on the second bottom plate (61); and an anti-slip cover plate (63) mounted on the limit plates (62) on both sides, wherein an entry channel (64) is formed between the anti-slip cover plate (63) and the limit plate (62) to allow the material, the adhesive tape (303) and the material belt (300) to pass through.

9. The high-speed feeding device for diode processing according to claim 8, wherein The first bent plate (71) is fixedly mounted on the constraint plate (52); the second bent plate (72) is mounted on the constraint plate (52) after being attached to the first bent plate (71); the first bent plate (71) is provided with a belt groove (73) for allowing the material belt (300) to be inserted, and the first bent plate (71) is provided with a notch (74) in an area close to the release area (56); the notch (74) provided on the first bent plate (71) does not exceed the width of the material belt (300).

10. The high-speed feeding device for diode processing according to claim 9, wherein The sliding intermediate member (111) comprises: a fixed plate (201) mounted to cover the mounting chamber (31); a slide rail (202) symmetrically mounted on the fixed plate (201); a first connecting block (203) slidably mounted on the slide rail (202) and passing through the fixed plate (201) to be connected to the movable top block (32); and a second connecting block (204) connected to the first connecting block (203), wherein a protruding contact portion (205) is provided at the end of the second connecting block (204) to cooperate with the toggle teeth of the dial wheel (110).

Citation Information

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