Electronic component processing equipment

Abstract

The invention discloses electronic component processing equipment which comprises a supporting box and a cleaning assembly, the cleaning assembly comprises a conveying mechanism, a fixing plate, a first motor, a supporting shell, a plurality of spraying heads, a water storage tank, a water supply pipe and a water pump, and the conveying mechanism is arranged on the supporting box; the fixing plate is mounted on the supporting box; the first motor is arranged on the fixed plate; the supporting shell is connected with the output end of the first motor, and the supporting shell is located above the supporting box. According to the electronic component processing equipment, the electronic component is adsorbed, the single face is cleaned while adsorption is conducted, after single face cleaning is conducted, the adsorption face can be converted, and then the other face is cleaned, so that the dead zone of cleaning is reduced, the cleaning quality of the electronic component is improved, and the cleaning efficiency of the electronic component is improved. And meanwhile, a rotary adsorption cleaning mode is adopted, continuous cleaning of the electronic components can be achieved, and then the cleaning efficiency of the electronic components is improved.

Description

Technical Field

[0001] This application relates to the technical field of electronic components, and particularly to an electronic component processing device. Background Art

[0002] The production process of circuit boards goes through multiple technological stages. At each stage, the circuit boards are contaminated to varying degrees. During the process of soldering electronic components, solder paste, flux, etc. are used for auxiliary soldering. After soldering, residues of flux and solder paste are generated. These residues contain organic acids and ions, etc. Among them, the organic acids will corrode the circuit board, and the presence of ions may lead to short circuits, easily causing unqualified product quality. Therefore, it is necessary to clean the residues.

[0003] The cleaning of electronic components is an important step to ensure product quality and reliability. Most traditional cleaning methods use semi-automatic cleaning equipment. The components are sent into the cleaning tank through a conveyor belt or robotic arm, and ultrasonic waves or other physical methods are used for cleaning. Although this method can also complete the cleaning of electronic components, after the electronic components are placed, they will directly contact the equipment, resulting in easy emergence of cleaning dead corners, affecting the cleaning quality of electronic components, and manual handling of electronic components is required for picking and placing, which is not convenient for continuous cleaning of electronic components. Summary of the Invention

[0004] This application aims to at least partly solve one of the technical problems in the related technologies.

[0005] To this end, one object of this application is to provide an electronic component processing device. By adsorbing and fixing the electronic components, while adsorbing, one side is cleaned. After completing the cleaning of one side, the device can convert the adsorption surface, and then clean the other side, thereby reducing the cleaning blind area and improving the cleaning quality. In addition, by adopting the cleaning method of rotational adsorption, continuous cleaning of electronic components can be realized, significantly improving the cleaning efficiency.

[0006] To achieve the above object, the first aspect embodiment of this application provides an electronic component processing device, including a support box and a cleaning component. Among them, the cleaning component includes a transmission mechanism, a fixing plate, a first motor, a support shell, a plurality of spray heads, a water storage tank, a water supply pipe, and a water pump. Among them, the transmission mechanism is arranged on the support box; the fixing plate is installed on the support box; the first motor is arranged on the fixing plate; the support shell is connected to the output end of the first motor, and the support shell is located above the support box; a plurality of the spray heads are oppositely installed on both sides of the support shell; the water storage tank is arranged on the support shell; one end of the water supply pipe is connected to the water storage tank, and the other end of the water supply pipe is connected to the support shell; the water pump is installed on the water supply pipe.

[0007] In addition, the electronic component processing equipment proposed above according to the present application may further have the following additional technical features:

[0008] In one embodiment of the present application, a filter screen is installed in the support box, and the filter screen is V-shaped.

[0009] In one embodiment of the present application, the transmission mechanism includes a support plate, an electric telescopic rod, a second motor, a first rotating shell, an adsorption pipe, a suction fan, a plurality of suction holes, a fixed box, a third motor, a second rotating shell, a transmission belt, and a blocking component. Among them, the support plate is installed on the support box; the electric telescopic rod is arranged on the support plate; the second motor is installed on the output end of the electric telescopic rod; the first rotating shell is arranged on the output end of the second motor; the suction fan is installed on the first rotating shell; one end of the adsorption pipe is connected to the first rotating shell, and the other end of the adsorption pipe is connected to the suction fan; a plurality of the suction holes are opened on the opposite side of the first rotating shell and the second rotating shell; the fixed box is arranged in the support box; the third motor is installed in the fixed box, and the output end of the third motor extends to the top of the fixed box; the second rotating shell is installed on the output end of the third motor; the transmission belt is arranged on the support box and is located below the first rotating shell; the blocking component is arranged on the first rotating shell.

[0010] In one embodiment of the present application, the first rotating shell is located above the second rotating shell, and the first rotating shell and the second rotating shell partially overlap, and the structures on the first rotating shell are the same as those on the second rotating shell.

[0011] In one embodiment of the present application, the support shell is located between the first rotating shell and the second rotating shell.

[0012] In one embodiment of the present application, the blocking component includes a partition plate, a communication port, two sealing blocks, a limiting rod, and two pushing springs. Among them, the partition plate is installed in the first rotating shell; the communication port is opened on the partition plate and is located below the adsorption pipe; the two sealing blocks are relatively slidably arranged in the first rotating shell; the limiting rod is installed on the support box; one ends of the two pushing springs are respectively connected to the corresponding sealing blocks, and the other ends of the two pushing springs are connected to the partition plate.

[0013] In one embodiment of the present application, the mutually remote ends of the two sealing blocks are both triangular, and the two sealing blocks are respectively located on one side of the communication port.

[0014] Advantages of the electronic component processing equipment according to the embodiments of the present application:

[0015] By adsorbing the electronic components and cleaning one side while adsorbing, after cleaning one side, the adsorption surface can be converted, and then the other side can be cleaned, thereby reducing the cleaning blind area and improving the cleaning quality of the electronic components. At the same time, by adopting the cleaning method of rotational adsorption, continuous cleaning of the electronic components can be realized, thereby improving the cleaning efficiency of the electronic components.

[0016] Some aspects and advantages of the present application will be given in part in the following description, some will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, in which:

[0018] Figure 1 is a schematic structural diagram of an electronic component processing equipment according to an embodiment of the present application;

[0019] Figure 2 is a perspective view of a cleaning component according to an embodiment of the present application;

[0020] Figure 3 is a perspective view of a support box according to an embodiment of the present application;

[0021] Figure 4 is a partial structural schematic diagram of a support box according to an embodiment of the present application;

[0022] Figure 5 is a perspective view of an electric telescopic rod according to an embodiment of the present application;

[0023] Figure 6 is a cross-sectional view of a first rotating shell according to an embodiment of the present application.

[0024] As shown in the figure: 1. Support box; 2. Cleaning component; 21. Transmission mechanism; 211. Support plate; 212. Electric telescopic rod; 213. Second motor; 214. First rotating shell; 215. Adsorption tube; 216. Exhaust fan; 217. Exhaust hole; 218. Fixed box; 219. Third motor; 220. Second rotating shell; 221. Transmission belt; 222. Blocking component; 2221. Partition plate; 2222. Communication port; 2223. Sealing block; 2225. Limiting rod; 2226. Push spring; 22. Fixed plate; 23. First motor; 24. Support shell; 25. Spraying head; 26. Water storage tank; 27. Water supply pipe; 28. Water pump. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0026] The electronic component processing equipment according to the embodiments of the present application will be described below with reference to the accompanying drawings.

[0027] As Figures 1-6 shown, the electronic component processing equipment according to the embodiments of the present application includes a support box 1 and a cleaning assembly 2. Among them, the cleaning assembly 2 includes a transmission mechanism 21, a fixing plate 22, a first motor 23, a support shell 24, a plurality of spray heads 25, a water storage tank 26, a water supply pipe 27, and a water pump 28. Among them, the transmission mechanism 21 is arranged on the support box 1.

[0028] It should be noted that the water storage tank 26 is filled with a flushing liquid, which can flush the electronic components, and a water injection pipe is installed on the water storage tank 26, which can facilitate subsequent water replenishment into the water storage tank 26.

[0029] The fixing plate 22 is installed on the support box 1. The first motor 23 is arranged on the fixing plate 22. The support shell 24 is connected to the output end of the first motor 23, and the support shell 24 is located above the support box 1. A plurality of spray heads 25 are oppositely installed on both sides of the support shell 24, and the water storage tank 26 is arranged on the support shell 24.

[0030] It should be noted that the installation length of the plurality of spray heads 25 is the same as the overlapping length of the first rotating shell 214 and the second rotating shell 220, so that the plurality of spray heads 25 can spray water upward and downward simultaneously, and thus the electronic components on the first rotating shell 214 and the second rotating shell 220 can be cleaned simultaneously.

[0031] One end of the water supply pipe 27 is connected to the water storage tank 26, and the other end of the water supply pipe 27 is connected to the support shell 24. The water pump 28 is installed on the water supply pipe 27.

[0032] It should be noted that a brush is installed on the support shell 24, which can brush the electronic components when the electronic components rotate, so as to improve the cleaning effect of the electronic components.

[0033] Specifically, after processing the electronic components, it is necessary to clean the electronic components to ensure the quality of the electronic components.

[0034] When it is necessary to clean electronic components, first place the electronic components on the transmission mechanism 21, use the transmission mechanism 21 to transmit the electronic components. While transmitting the electronic components, control the operation of the water pump 28 through the control switch, so that the water pump 28 extracts the water in the water storage tank 26 through the water supply pipe 27, and conveys the water into the support shell 24, and finally sprays out from the multiple spray heads 25. The water sprayed out from the multiple spray heads 25 can wash the electronic components on one side of the spray heads 25.

[0035] In an embodiment of the present application, as Figure 3 shown, a filter screen is installed in the support box 1, and the filter screen is V-shaped.

[0036] It should be noted that after the water sprayed out from the spray heads 25 washes the electronic components, the water with the impurities washed off will enter the support box 1, and the filter screen in the support box 1 can filter the impurities in the water. The water entering the support box 1 can be recycled into the water storage tank 26 after a certain period of precipitation or filtration.

[0037] In an embodiment of the present application, as Figures 3-6 shown, the transmission mechanism 21 includes a support plate 211, an electric telescopic rod 212, a second motor 213, a first rotating shell 214, an adsorption pipe 215, a suction fan 216, a plurality of suction holes 217, a fixed box 218, a third motor 219, a second rotating shell 220, a transmission belt 221 and a blocking component 222. Among them, the support plate 211 is installed on the support box 1.

[0038] It should be noted that when the plurality of suction holes 217 are in use, not all of them need to be opened. Control valves are installed in the suction holes 217. According to the shape and size of the electronic components, the control valves on the corresponding suction holes 217 can be opened. When adsorbing the electronic components, place the electronic components above the corresponding suction holes 217. In this way, when adsorbing the electronic components, it can be avoided that a large number of suction holes 217 are all in the open state, resulting in insufficient adsorption force for the electronic components.

[0039] The electric telescopic rod 212 is arranged on the support plate 211. The second motor 213 is installed on the output end of the electric telescopic rod 212. The first rotating shell 214 is arranged on the output end of the second motor 213. The suction fan 216 is installed on the first rotating shell 214.

[0040] It should be noted that when the second rotating shell 220 and the first rotating shell 214 adsorb and clean the electronic components, the second rotating shell 220 and the first rotating shell 214 drive the electronic components to rotate 2 - 3 circles.

[0041] One end of the adsorption tube 215 is connected to the first rotating shell 214, and the other end of the adsorption tube 215 is connected to the exhaust fan 216. A plurality of air extraction holes 217 are formed on the opposite sides of the first rotating shell 214 and the second rotating shell 220. The fixed box 218 is arranged in the support box 1.

[0042] It should be noted that the fixed box 218 seals the third motor 219 to prevent the third motor 219 from contacting water during use, which may affect the service life of the third motor 219.

[0043] The third motor 219 is installed in the fixed box 218, and the output end of the third motor 219 extends to the top of the fixed box 218. The second rotating shell 220 is installed on the output end of the third motor 219. The transmission belt 221 is arranged on the support box 1 and is located below the first rotating shell 214. The blocking member 222 is arranged on the first rotating shell 214.

[0044] It should be noted that when the output end of the electric telescopic rod 212 moves downward, the first motor 23 drives the support shell 24 to rotate, so that the support shell 24 is no longer located between the first rotating shell 214 and the second rotating shell 220. When the output end of the electric telescopic rod 212 resets, the first motor 23 drives the support shell 24 to reset.

[0045] Specifically, when processing electronic components, it is necessary to convey the electronic components.

[0046] First, place the electronic components to be cleaned on the second rotating shell 220. After placement, control the third motor 219 and the exhaust fan 216 to operate. When the exhaust fan 216 operates, it cooperates with the adsorption tube 215 to extract the air inside the second rotating shell 220, creating a negative pressure inside the second rotating shell 220. Then, through the air extraction holes 217, the electronic components placed on the surface of the second rotating shell 220 are adsorbed and fixed, improving the stability of the electronic components on the surface of the second rotating shell 220. After that, drive the second rotating shell 220 to rotate through the output end of the third motor 219. The rotation of the second rotating shell 220 will drive the electronic components to rotate. While the electronic components are rotating, the water sprayed by the spray head 25 cleans the top surface of the electronic components. After cleaning the top surface of the electronic components, when the second rotating shell 220 drives the electronic components to rotate to below the first rotating shell 214, at this time, drive the second motor 213 to move downward through the output end of the electric telescopic rod 212. The downward movement of the second motor 213 will drive the first rotating shell 214 to move downward. At this time, the first rotating shell 214 adsorbs the electronic components, and the second rotating shell 220 no longer adsorbs the electronic components. Then control the output end of the electric telescopic rod 212 to reset. After that, control the output end of the second motor 213 to drive the first rotating shell 214 to rotate, so that the first rotating shell 214 drives the electronic components to rotate, and then the bottom surface of the electronic components can be cleaned by the water sprayed by the spray head 25.

[0047] In an embodiment of the present application, as Figure 3 shown, the first rotating shell 214 is located above the second rotating shell 220, and the first rotating shell 214 and the second rotating shell 220 partially overlap. The structure on the first rotating shell 214 is the same as the structure on the second rotating shell 220.

[0048] It should be noted that the overlapping part of the first rotating shell 214 and the second rotating shell 220 can complete the exchange of the electronic components, so that the electronic components are transferred from the second rotating shell 220 to the first rotating shell 214.

[0049] In an embodiment of the present application, as Figure 1 shown, the support shell 24 is located between the first rotating shell 214 and the second rotating shell 220.

[0050] In an embodiment of the present application, as Figure 6 shown, the blocking component 222 includes a partition plate 2221, a communication port 2222, two sealing blocks 2223, a limiting rod 2225 and two pushing springs 2226. Among them, the partition plate 2221 is installed inside the first rotating shell 214. The communication port 2222 is opened on the partition plate 2221, and the communication port 2222 is located below the adsorption tube 215.

[0051] It should be noted that the partition plate 2221 divides the first rotating shell 214 into two separate spaces, and the two separate spaces are interconnected through the communication port 2222.

[0052] Two sealing blocks 2223 are arranged to slide relative to each other inside the first rotating shell 214, and the limiting rod 2225 is installed on the support box 1.

[0053] It should be noted that in the initial state, the sealing block 2223 is not inside the communication port 2222. When the sealing block 2223 moves towards the communication port 2222, the sealing block 2223 seals the communication port 2222.

[0054] One end of each of the two pushing springs 2226 is connected to the corresponding sealing block 2223, and the other ends of the two pushing springs 2226 are connected to the partition plate 2221.

[0055] Specifically, when continuous cleaning of multiple electronic components is required, after the second rotating shell 220 cleans one side of the electronic components, when the first rotating shell 214 continues to clean the other side of the electronic components, electronic components can be continuously placed on the second rotating shell 220. After the first rotating shell 214 finishes cleaning the electronic components, first rotate the cleaned electronic components above the conveyor belt 221, and then drive the first rotating shell 214 to drive the sealing block 2223 to move downward. After the sealing block 2223 contacts the limiting rod 2225, the limiting rod 2225 squeezes the sealing block 2223, so that the sealing block 2223 moves towards the communication port 2222 and seals the communication port 2222. At this time, the area of the first rotating shell 214 above the conveyor belt 221 loses adsorption force, and the other area can adsorb the electronic components to be cleaned on the second rotating shell 220, realizing the continuity of cleaning of multiple electronic components.

[0056] In an embodiment of the present application, as Figure 6 shown, the mutually remote ends of the two sealing blocks 2223 are both triangular, and the two sealing blocks 2223 are respectively located on one side of the communication port 2222.

[0057] It should be noted that one end of the two sealing blocks 2223 is triangular. When the first rotating shell 214 drives the two sealing blocks 2223 to move downward, if the sealing block 2223 is squeezed by the limiting rod 2225, due to the fact that one end of the sealing block 2223 is triangular, the sealing block 2223 will move towards the first rotating shell 214.

[0058] In summary, the electronic component processing equipment according to the embodiments of the present application adsorbs electronic components, and while adsorbing, cleans one side. After cleaning one side, the adsorption surface can be converted, and then the other side can be cleaned, thereby reducing the cleaning blind area and improving the cleaning quality of the electronic components. At the same time, the cleaning method of rotating adsorption is adopted, which can realize continuous cleaning of the electronic components, thereby improving the cleaning efficiency of the electronic components.

[0059] In the description of this specification, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0060] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0061] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. An electronic component processing equipment, characterized in that: It includes a support box and a cleaning assembly, wherein: The cleaning assembly includes a transmission mechanism, a fixing plate, a first motor, a supporting shell, a plurality of spray heads, a water storage tank, a water supply pipe and a water pump, wherein: The transmission mechanism is arranged on the support box; The fixing plate is mounted on the supporting box; The first motor is arranged on the fixing plate; The support shell is connected to the output end of the first motor, and the support shell is located above the support box; A plurality of the spray heads are relatively mounted on two sides of the support shell; The water storage tank is arranged on the supporting shell; One end of the water supply pipe is connected to the water storage tank, and the other end of the water supply pipe is connected to the support shell; The water pump is installed on the water supply pipe.

2. The electronic component processing equipment according to claim 1, characterized in that: A filter screen is installed in the support box, and the filter screen is V-shaped.

3. The electronic component processing equipment according to claim 1, characterized in that: The transmission mechanism includes a support plate, an electric telescopic rod, a second motor, a first rotating shell, an adsorption tube, an exhaust fan, a plurality of exhaust holes, a fixing box, a third motor, a second rotating shell, a transmission belt and a blocking component, wherein: The support plate is mounted on the support box; The electric telescopic rod is arranged on the support plate; The second motor is mounted on the output end of the electric telescopic rod; The first rotating shell is arranged on the output end of the second motor; The exhaust fan is mounted on the first rotating shell; One end of the adsorption tube is connected to the first rotating shell, and the other end of the adsorption tube is connected to the exhaust fan; The plurality of air extraction holes are provided on opposite sides of the first rotating shell and the second rotating shell; The fixing box is arranged in the supporting box; The third motor is installed in the fixed box, and the output end of the third motor extends to the top of the fixed box; The second rotating shell is mounted on the output end of the third motor; The transmission belt is arranged on the support box, and the transmission belt is located below the first rotating shell; The blocking component is arranged on the first rotating shell.

4. The electronic component processing equipment according to claim 3, characterized in that: The first rotating shell is located above the second rotating shell, and the first rotating shell and the second rotating shell partially overlap, and the structure on the first rotating shell is the same as the structure on the second rotating shell.

5. The electronic component processing equipment according to claim 3, characterized in that: The supporting shell is located between the first rotating shell and the second rotating shell.

6. The electronic component processing equipment according to claim 3, characterized in that: The blocking component includes a partition plate, a communication port, two sealing blocks, a limit rod and two push springs, wherein: The partition plate is installed in the first rotating shell; The communication port is opened on the partition plate, and the communication port is located below the adsorption tube; The two sealing blocks are relatively slidably arranged in the first rotating shell; The limiting rod is installed on the supporting box; One end of the two push springs is connected to the corresponding sealing blocks respectively, and the other ends of the two push springs are connected to the partition plate.

7. The electronic component processing equipment according to claim 6, characterized in that: The ends of the two sealing blocks that are away from each other are both triangular, and the two sealing blocks are respectively located on one side of the communication port.

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