Aerosol-generating device

Abstract

The embodiment of the invention provides an aerosol generating device which comprises a first conductive carrier, a first conductive part and a second conductive part are arranged on the first conductive carrier, and when an aerosol generating product is placed on the aerosol generating device, at least part of the first conductive carrier is arranged outside the aerosol generating product or inserted into the aerosol generating product; the first semiconductor component comprises an N-type semiconductor electrically connected with the first conductive part and a P-type semiconductor electrically connected with the second conductive part; the second conductive carrier is electrically connected with the N-type semiconductor and the P-type semiconductor in the first semiconductor component; the positive electrode of the power supply assembly is electrically connected with the first conductive part, and the negative electrode is electrically connected with the second conductive part; wherein the first semiconductor component is configured to transfer at least a portion of heat on the second electrically conductive carrier to the first electrically conductive carrier to heat the aerosol-generating article through the first electrically conductive carrier.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of aerosol generation for non-combustion heating, and in particular to an aerosol generation device. Background Art

[0002] During the use of tobacco products (such as cigarettes, cigars, etc.), tobacco is burned to generate tobacco smoke. People have tried to replace these tobacco-burning products by manufacturing products that release compounds without combustion.

[0003] Examples of such products are heating devices that release compounds by heating rather than burning materials. For example, the material can be an aerosol generation article containing tobacco or other non-tobacco products, and these non-tobacco products may or may not contain nicotine.

[0004] Known heating devices include heaters, and the heating devices use heaters to generate a large amount of heat to heat the tobacco products. When the heater releases heat, the heat can only be transferred from the heater to the outside. The heat transferred to the outside includes two parts: one is the heat transferred to the tobacco product, and this part of the heat is absorbed and utilized by the tobacco product, so that the tobacco product generates smoke; the other is the heat dissipated to the environment, and this part of the heat cannot be absorbed and utilized by the tobacco product and belongs to heat loss. Usually, when baking a tobacco product, the heater needs to provide 1000 J - 1400 J of heat, but the heat actually absorbed and utilized by the tobacco product is about 300 J - 350 J. It can be seen that the heat utilization rate is less than 35%, and in some cases, the utilization rate is even less than 25%. Summary of the Invention

[0005] The present application provides an aerosol generation device that can improve the energy utilization rate.

[0006] An embodiment of the present application provides an aerosol generation device, including:

[0007] A first conductive carrier, on which a first conductive part and a second conductive part are provided. When the aerosol generation article is placed in the aerosol generation device, at least a part of the first conductive carrier is arranged outside the aerosol generation article or inserted into the aerosol generation article;

[0008] A first semiconductor component, including an N-type semiconductor electrically connected to the first conductive part and a P-type semiconductor electrically connected to the second conductive part;

[0009] A second conductive carrier, electrically connecting the N-type semiconductor and the P-type semiconductor in the first semiconductor component; and

[0010] A power supply component, whose positive electrode is electrically connected to the first conductive part and whose negative electrode is electrically connected to the second conductive part;

[0011] Wherein, the first semiconductor component is configured to transfer at least part of the heat on the second conductive carrier to the first conductive carrier to heat the aerosol generating article through the first conductive carrier.

[0012] An embodiment of the present application provides an aerosol generating device, comprising:

[0013] A first conductive carrier, on which a first conductive portion and a second conductive portion are provided. When the aerosol generating article is placed on the aerosol generating device, at least a part of the first conductive carrier is arranged outside the aerosol generating article or inserted into the aerosol generating article;

[0014] A first semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion;

[0015] A second conductive carrier, electrically connected to the N-type semiconductor and the P-type semiconductor in the first semiconductor component; and

[0016] A power supply component, whose positive electrode is electrically connected to the first conductive portion and whose negative electrode is electrically connected to the second conductive portion;

[0017] Wherein, after the power supply component outputs electric power through its positive electrode and negative electrode, the temperature of the second conductive carrier first gradually decreases and then gradually increases.

[0018] An embodiment of the present application provides an aerosol generating device, comprising:

[0019] A housing;

[0020] A heat receiving end, on which a positive conductive portion and a negative conductive portion are provided;

[0021] A semiconductor component, comprising an N-type semiconductor electrically connected to the positive conductive portion and a P-type semiconductor electrically connected to the negative conductive portion;

[0022] A heat providing end, electrically connected to the N-type semiconductor and the P-type semiconductor in the semiconductor component, and the heat providing end is arranged between the housing and the heat receiving end; and

[0023] A power supply component, whose positive electrode is electrically connected to the positive conductive portion and whose negative electrode is electrically connected to the negative conductive portion;

[0024] Wherein, during at least part of the period after the power supply component outputs electric power through its positive electrode and negative electrode, the temperature of the heat providing end is lower than the temperature of the heat receiving end, and the temperature of the heat providing end is lower than the temperature of the housing.

[0025] The above aerosol generating device includes a power supply assembly, a first conductive carrier having a first conductive portion and a second conductive portion, a first semiconductor assembly having an N-type semiconductor and a P-type semiconductor, and a second conductive carrier electrically connecting the N-type semiconductor and the P-type semiconductor in the first semiconductor assembly. Among them, when the aerosol generating article is placed on the aerosol generating device, at least a part of the first conductive carrier is arranged outside the aerosol generating article or inserted into the aerosol generating article. The N-type semiconductor and the P-type semiconductor in the first semiconductor assembly are electrically connected to the first conductive portion and the second conductive portion respectively, and the first conductive portion and the second conductive portion are electrically connected to the positive electrode and the negative electrode of the power supply assembly respectively. Thus, when the power supply assembly outputs power through its positive electrode and negative electrode, the first semiconductor assembly can transfer at least part of the heat on the second conductive carrier to the first conductive carrier, so that the heat converges from the second conductive carrier to the first conductive carrier, and then heats the aerosol generating article through the first conductive carrier; this heating process is different from the situation where the heat in the traditional heating method can only diffuse to the outside. In this solution, there is also heat transferred from the outside, and the first semiconductor assembly can directly heat the aerosol generating article, so the heat utilization rate of the entire module is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not limit the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0027] Figure 1 is a schematic diagram of an aerosol generating device provided by an embodiment;

[0028] Figure 2 is a schematic diagram of the connection between a semiconductor assembly and a conductive carrier provided by an embodiment;

[0029] Figure 3 is a schematic diagram of the connection between a semiconductor assembly and a conductive carrier provided by another embodiment;

[0030] Figure 4 is a schematic diagram of the connection between a semiconductor assembly and a conductive carrier provided by still another embodiment;

[0031] Figure 5A is a schematic diagram of the temperature curve of the first conductive carrier and the ultimate heat supply end at the initial stage of the operation of the semiconductor assembly provided by an embodiment or at the initial stage of the re-operation;

[0032] Figure 5B is a schematic diagram of the temperature curve of the first conductive carrier and the ultimate heat supply end at the initial stage of the operation of the semiconductor assembly provided by another embodiment or at the initial stage of the re-operation;

[0033] Figure 6 Schematic diagram of the combination of a semiconductor component, a conductive carrier, and a heat insulator provided by an embodiment;

[0034] Figure 7 Exploded schematic diagram of a semiconductor component, a conductive carrier, and a heat insulator provided by an embodiment;

[0035] Figure 8 Exploded schematic diagram of a semiconductor component and a conductive carrier provided by an embodiment;

[0036] Figure 9 Another Figure 8 Further exploded schematic diagram;

[0037] Figure 10 Schematic diagram of a plurality of first semiconductor components connected in parallel to each other provided by an embodiment;

[0038] Figure 11 Schematic diagram of a plurality of first semiconductor components connected in series to each other provided by an embodiment;

[0039] Figure 12 Schematic diagram of the arrangement of the first semiconductor components provided by an embodiment;

[0040] Figure 13 Schematic diagram of the first semiconductor component and the second semiconductor component being axially offset from each other provided by an embodiment;

[0041] Figure 14 Schematic diagram of the first semiconductor component and the second semiconductor component being axially offset from each other and connected in series provided by an embodiment;

[0042] Figure 15 Developed schematic diagram of the first semiconductor component and the second semiconductor component being axially offset from each other and connected in series provided by an embodiment;

[0043] Figure 16 Developed three - dimensional exploded schematic diagram of the first semiconductor component and the second semiconductor component being axially offset from each other and connected in series provided by an embodiment;

[0044] Figure 17 Developed three - dimensional combined schematic diagram of the first semiconductor component and the second semiconductor component being axially offset from each other and connected in series provided by an embodiment;

[0045] Figure 18 Exploded schematic diagram of a semiconductor component, a conductive carrier, and a heat insulator provided by another embodiment;

[0046] Figure 19 Exploded schematic diagram of the first semiconductor component and the second semiconductor component connected in series provided by another embodiment;

[0047] Figure 20 is a combined schematic diagram of a first semiconductor component and a second semiconductor component provided by an embodiment, being radially staggered;

[0048] Figure 21 is an exploded schematic diagram of a first semiconductor component and a second semiconductor component provided by an embodiment, being radially staggered;

[0049] Figure 22 is Figure 21 a further exploded schematic diagram;

[0050] Figure 23 is a distribution schematic diagram of a third conductive part, a fourth conductive part, and a fifth conductive part on a second conductive carrier provided by an embodiment;

[0051] In the figure:

[0052] 1. Aerosol generating article; 11. Aerosol forming matrix;

[0053] 2. Power supply assembly; 21. Power supply; 22. Circuit board;

[0054] 3. First conductive carrier; 30. First body; 31. First conductive part; 32. Second conductive part; 321. Connection end; 322. Interdigitated electrode; 33. First insulating layer; 34. First clamping groove; 341. First groove wall; 35. Other conductive parts; 36. Accommodation cavity;

[0055] 4. First semiconductor component;

[0056] 5. Ultimate heat providing end; 51. Second conductive carrier; 510. Second body; 511. Third conductive part; 512. Second insulating layer; 513. Fourth conductive part; 514. Fifth conductive part; 515. Second clamping groove; 5151. Second groove wall; 52. Third conductive carrier;

[0057] 6. Second semiconductor component;

[0058] 71. Upper heat insulating part; 72. Lower heat insulating part;

[0059] 8. Outer shell;

[0060] 9. Support member; 91. Mounting hole. Detailed implementation manners

[0061] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a regional embodiment of the present application, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0062] The terms "first", "second", and "third" in the present application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity or order of the indicated technical features. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship or movement situation between components in a certain posture (as shown in the accompanying drawings). If this posture changes, the directional indication will also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0063] Referring to "embodiment" herein means that the features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0064] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element, or there may be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.

[0065] It can be referred to Figure 1 , an embodiment of the present application provides an aerosol generating device, which is a device that engages or interacts with an aerosol generating article 1 to form an inhalable aerosol.

[0066] As used herein, the term "aerosol-generating article" refers to an article that includes an aerosol-forming substrate 11 which, when heated, releases volatile compounds that can form an aerosol. In one embodiment, the aerosol-generating article is removably coupled to an aerosol-generating device. The article can be disposable or reusable.

[0067] The aerosol-forming substrate 11 can include a solid aerosol-forming substrate. The solid aerosol-forming substrate can include a tobacco-containing material that contains volatile tobacco flavor compounds released from the aerosol-forming substrate upon heating. The solid aerosol-forming substrate can include a non-tobacco material. The solid aerosol-forming substrate can include a tobacco-containing material and a non-tobacco material.

[0068] The aerosol-forming substrate 11 can include a liquid aerosol-forming substrate. The liquid aerosol-forming substrate can contain a liquid of a tobacco-containing substance containing volatile tobacco flavor components and can also be a liquid containing a non-tobacco substance. The liquid aerosol-forming substrate can contain water, a solvent, ethanol, a plant extract, a fragrance, a flavorant, or a vitamin mixture, etc. The fragrance can include areca nut extract, menthol, peppermint, spearmint oil, various fruit fragrance components, etc., but is not limited thereto. The flavorant can include components that can provide various scents or flavors to the user. The vitamin mixture can be a mixture mixed with at least one of vitamin A, vitamin B, vitamin C, and vitamin E, but is not limited thereto.

[0069] The aerosol-generating device can be an electrically operated device that includes a power supply assembly 2. The power supply assembly 2 includes a power supply 21 and a circuit board 22. The power supply 21 can include any suitable battery or cell. The circuit board 22 has one or more controllers that can control the power output of the power supply 21, such as controlling a sensory cue in the aerosol-generating device to generate sensory signals such as sound, light, or vibration, or controlling other operations of the aerosol-generating device.

[0070] The power supply assembly 2 can further include a positive electrode electrically connected to the positive pole of the power supply 21 and a negative electrode electrically connected to the negative pole of the power supply. Part of the power of the power supply assembly 2 can be output through the positive electrode and the negative electrode. The positive electrode and the negative electrode can be provided on the circuit board 22, or the positive electrode and the negative electrode can be electrically connected to the circuit board 22. It should be noted that in other embodiments, part of the power of the power supply assembly 2 can be directly output through the positive pole and the negative pole of the power supply 21. For the sake of convenience of expression, the power supply assembly 2 outputting power through its positive pole + and negative pole - hereinafter includes outputting power through the positive pole and the negative pole of the power supply 21, or includes outputting power through the positive electrode and the negative electrode. In other words, the positive pole + of the power supply assembly 2 hereinafter is the positive electrode or the positive pole of the power supply 21, and the negative pole - of the power supply assembly 2 is the negative electrode or the negative pole of the power supply 21.

[0071] The aerosol generating device has a heat receiving end, a semiconductor component, and a heat providing end. A positive conductive part and a negative conductive part are provided on the heat receiving end, and the positive conductive part and the negative conductive part are respectively used for electrically connecting the positive electrode + and the negative electrode - of the power supply component. The semiconductor component includes an N-type semiconductor electrically connected to the positive conductive part and a P-type semiconductor electrically connected to the negative conductive part. Both the N-type semiconductor and the P-type semiconductor in the semiconductor component are electrically connected to the heat providing end and are electrically connected to each other through the heat providing end. After the power supply component outputs electric power through its positive and negative electrodes, at least part of the heat on the heat providing end can be transferred to the heat receiving end through the semiconductor component, so that the temperature of the heat receiving end rises, and the temperature of the heat receiving end is higher than that of the heat providing end.

[0072] In one embodiment, the aerosol generating device further includes a first conductive carrier 3, a second conductive carrier 51, and a first semiconductor component 4. At least part of the heat on the second conductive carrier 51 can be transferred to the first conductive carrier 3 through the first semiconductor component 4. Thus, among the first conductive carrier 3 and the second conductive carrier 51, the first conductive carrier 3 is the heat receiving end or a component of the heat receiving end, and the second conductive carrier 51 is the heat providing end or a component of the heat providing end.

[0073] Wherein, when the aerosol generating article 1 is placed on the aerosol generating device, at least a part of the first conductive carrier 3 is arranged outside the aerosol generating article 1 or inserted into the aerosol generating article 1.

[0074] It should be noted that, in one embodiment, when the aerosol generating article 1 is placed on the aerosol generating device, at least a part of the first conductive carrier 3 is arranged outside the aerosol generating article 1, including: when the aerosol generating article 1 is placed on the aerosol generating device, at least a part of the first conductive carrier 3 surrounds the circumferential periphery of the aerosol generating article 1. Based on this, as an example, reference can be made to Figure 1 , the inner wall surface of the first conductive carrier 3 defines at least part of the boundary of the accommodating cavity, and the accommodating cavity is used for accommodating at least a part of the aerosol generating article 1. Or, as an example, at least a part of the first conductive carrier 3 is configured to be tubular, and when the aerosol generating article 1 is placed on the aerosol generating device, at least a part of the aerosol generating article 1 is surrounded by the tubular first conductive carrier 3.

[0075] Preferably, when the aerosol generating article is placed on the aerosol generating device, at least a part of the first conductive carrier 3 directly contacts the side surface of the aerosol generating article 1, so as to increase the heat transfer efficiency between the first conductive carrier 3 and the side surface of the aerosol generating article 1 through direct contact, which helps to reduce losses.

[0076] In one embodiment, when the aerosol-generating article 1 is placed in the aerosol-generating device, at least a part of the first conductive carrier 3 is disposed outside the aerosol-generating article 1, including: when the aerosol-generating article is placed in the aerosol-generating device, at least a part of the first conductive carrier 3 is located axially below the aerosol-generating article 1, so as to be adjacent to the bottom of the aerosol-generating article 1. Based on this, as an example, at least a part of the first conductive carrier 3 extends radially along the aerosol-generating article 1 and can directly contact and support the bottom of the aerosol-generating article 1 when the aerosol-generating article 1 is placed in the aerosol-generating device, so as to increase the heat transfer efficiency between the first conductive carrier 3 and the bottom of the aerosol-generating article 1 through direct contact.

[0077] It should be noted that there is a gap between the surface of the first conductive carrier 3 and the surface of the aerosol-generating article 1, but the gap is filled with gas and the gap is not greater than 0.5 mm, preferably not greater than 0.15 mm, which still belongs to the "at least a part of the first conductive carrier 3 directly contacts the aerosol-generating article 1" described in the present application. In order to increase the efficiency of heat transfer through "direct contact", reduce energy loss and improve energy utilization rate.

[0078] In one embodiment, the aerosol-generating device includes an air heating element that allows air to flow through. When the aerosol-generating article is placed in the aerosol-generating device, the air heating element is disposed upstream of the aerosol-generating article. The first conductive carrier is connected to the air heating element, or the first conductive carrier is a component of the air heating element. The air heating element heats the flowing air by releasing at least part of the heat absorbed from the first conductive carrier, or the first conductive carrier can directly release heat to heat the flowing air.

[0079] In one embodiment, reference may be made to Figures 2 - 4 , a first conductive portion 31 and a second conductive portion 32 are provided on the first conductive carrier 3. The first conductive portion 31 and the second conductive portion 32 are a positive conductive portion and a negative conductive portion respectively. The positive electrode of the power supply assembly 2 is electrically connected to the first conductive portion 31, and the negative electrode is electrically connected to the second conductive portion 32.

[0080] The first semiconductor assembly 4 includes an N-type semiconductor 41 and a P-type semiconductor 42. One end of the N-type semiconductor 41 in the first semiconductor assembly 4 and one end of the P-type semiconductor 42 in the first semiconductor assembly 4 are both electrically connected to the second conductive carrier 51, and they are electrically connected to each other through the second conductive carrier 51. The other end of the N-type semiconductor 41 in the first semiconductor assembly 4 is electrically connected to the first conductive portion 31 on the first conductive carrier 3, so as to be electrically connected to the positive electrode + of the power supply assembly 2. The other end of the P-type semiconductor 42 in the first semiconductor assembly 4 is electrically connected to the second conductive portion 32 on the first conductive carrier 3, so as to be electrically connected to the negative electrode - of the power supply assembly 2.

[0081] Thus, based on the Peltier effect, the first semiconductor component 4 can transfer at least part of the heat on the second conductive carrier 51 to the first conductive carrier 3, so as to increase the temperature of the first conductive carrier 3, and then heat the aerosol generating article 1 through the first conductive carrier 3. In other words, when the first semiconductor component 4 is working, the first semiconductor component 4 can cause a temperature difference between the first conductive carrier 3 and the second conductive carrier 51, so that the temperature of the first conductive carrier 3 is higher than that of the second conductive carrier 51. Moreover, the more heat is lost from the second conductive carrier 51, the more heat is added to the first conductive carrier 3. Therefore, the second conductive carrier 51 is the heat supply end relative to the first conductive carrier 3, and the first conductive carrier 3 is the heat receiving end relative to the second conductive carrier 51. And when the first semiconductor component 4 is working, the heat in the external environment can be transferred from the second conductive carrier 51 to the first conductive carrier 3. The second conductive carrier 51 has a lower temperature relative to the first conductive carrier 3, which helps to reduce or inhibit the heat dissipation of the second conductive carrier 51 to the external environment through heat transfer, thereby greatly improving the energy utilization rate. Preferably, when the aerosol generating article 1 is placed in the aerosol generating device, there is no gap or only an air gap not greater than 0.5 mm between the first semiconductor component 3 and the aerosol generating article 1, so that the first semiconductor component 3 can directly heat the aerosol generating article 1.

[0082] After testing, by adopting the above embodiments of the present application, only about 15 J of energy is required to increase the temperature of the first conductive carrier from the ambient temperature to 250 °C within 5 s. Under the same conditions, if existing resistance heating elements, electromagnetic heating elements or infrared heating elements are used for heating, 70 - 90 J of energy is required. And by adopting the above embodiments of the present application, only 300 J - 700 J of heat is required to complete the baking of an aerosol generating article 1. Therefore, the energy and heat utilization rates are greatly improved, and the loss can be greatly reduced.

[0083] In one embodiment, reference can be made to Figure 5A , the curve located below and closer to the time axis t is the temperature curve T2 of the ultimate heat supply end 5 when the semiconductor component is working, and the curve located above and relatively far from the time axis t is the temperature curve T1 of the first conductive carrier 3 when the semiconductor component is working.

[0084] After the power supply component 2 outputs power through its positive electrode + and negative electrode -, enabling the first semiconductor component 4 to enter the working state, the temperature of the ultimate heat supply end 5 first gradually decreases and then gradually increases. The temperature of the ultimate heat supply end 5 decreases because the heat on it has been transferred. After the power supply component 2 outputs power through its positive electrode + and negative electrode -, the first conductive carrier 3 continuously heats up. The reason for the heating of the first conductive carrier 3 is that it has obtained at least part of the heat directly transferred or transferred step by step from the ultimate heat supply end 5. The heat transferred between the second conductive carrier 51 and the first conductive carrier 3 basically satisfies the Peltier formula: Q = |Πn – Πp| * I, where Q is the heat, Πn and Πp are the Peltier coefficients of the N-type semiconductor 41 and the P-type semiconductor 42 respectively, and I is the magnitude of the current output by the power supply component 2 to the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4.

[0085] When there is no other conductive carrier transferring or transferring heat to the second conductive carrier 51 through other semiconductor components, such that the second conductive carrier 51 is the ultimate heat supply end 5 of the aerosol generating device, after the power supply component 2 outputs power through its positive electrode + and negative electrode -, the temperature of the second conductive carrier 51 first gradually decreases and then gradually increases. During this process, the temperature of the second conductive carrier 51 will decrease to less than the ambient temperature T0, that is, the lowest temperature of the second conductive carrier 51 can be less than the ambient temperature T0. Then the second conductive carrier 51 gradually heats up again from its lowest temperature. Among them, the ambient temperature T0 can be the temperature on the side opposite to the first conductive carrier 3 and outside the second conductive carrier 51 when the aerosol generating device is in use.

[0086] In Figures 6 - 9 In the embodiment shown, at least a part of the first conductive carrier 3 is configured to be tubular, at least a part of the second conductive carrier 51 is configured to be tubular, the second conductive carrier 51 is arranged on the periphery of the first conductive carrier 3, and the first semiconductor component 4 is located between the first conductive carrier 3 and the second conductive carrier 51. Thus, on the one hand, the outer surface area of the second conductive carrier 51 is larger than the inner surface area of the first conductive carrier 3. The larger the outer surface area of the second conductive carrier 51, the larger the heat absorption area of the second conductive carrier 51. The inner surface area of the first conductive carrier 3 is related to the heat release area of the first conductive carrier 3. Therefore, the heat absorption area of the second conductive carrier 51 is larger than the heat release area of the first conductive carrier 3. On the other hand, after the power supply component 2 outputs power through its positive electrode + and negative electrode -, the temperature of the second conductive carrier 51 first decreases, and the lowest temperature of the second conductive carrier 51 can be reduced to less than the ambient temperature T0. The ambient temperature T0 of the second conductive carrier 51 in this embodiment is the temperature outside the second conductive carrier 51, that is, the temperature on the side opposite to the first conductive carrier 3 and outside the second conductive carrier 51.

[0087] It should be noted that, please refer to Figures 6 - 9 , when there is no other semiconductor component cascaded with the first semiconductor component 4 such that the second conductive carrier 51 is the ultimate heat providing end 5 of the aerosol generating device, the ambient temperature T0 corresponding to the second conductive carrier 51 can be or approximately be the room temperature outside the aerosol generating device, or can be 23°C ± 2°C, 25°C ± 5°C or 20°C ± 5°C. As the temperature of the second conductive carrier 51 serving as the ultimate heat providing end 5, it will first gradually decrease and then gradually increase during the operation of the semiconductor component, and the lowest temperature can be less than the room temperature.

[0088] Please refer to Figures 20 - 22 , when there is also a second semiconductor component 6 cascaded with the first semiconductor component 4 such that there is also a third conductive carrier 52 transferring heat to the second conductive carrier 51, then the second conductive carrier 51 is the intermediate heat providing end of the aerosol generating device, that is, heat can be transferred to the first conductive carrier 3 successively through the third conductive carrier 52 and the second conductive carrier 51, so that the temperature increases step by step on the third conductive carrier 51, the second conductive carrier 52 and the first conductive carrier 3. During this process, the temperature of the second conductive carrier 51 serving as the intermediate heat providing end can first gradually decrease and then gradually increase under some conditions, or the temperature of the second conductive carrier 51 serving as the intermediate heat providing end can continuously increase under some conditions, or can first remain almost unchanged and then gradually increase. Among them, when there is also a second semiconductor component 6 cascaded with the first semiconductor component 4 such that there is also a third conductive carrier 52 transferring heat to the second conductive carrier 51, between the second conductive carrier 51 and the third conductive carrier 52, the second conductive carrier 51 is the heat receiving end or a part of the heat receiving end, and the third conductive carrier 52 is the heat providing end or a part of the heat providing end.

[0089] When there is no other semiconductor component cascaded with the second semiconductor component 6 except the first semiconductor component 4 such that the third conductive carrier 62 is the ultimate heat providing end 5 of the aerosol generating device, the temperature of the third conductive carrier 52 can first gradually decrease and then gradually increase, and the lowest temperature of the third conductive carrier 52 can be less than the ambient temperature T0, and at this time the ambient temperature T0 corresponding to the third conductive carrier 52 can be or approximately be the room temperature outside the aerosol generating device, or can be 23°C ± 2°C, 25°C ± 5°C or 20°C ± 5°C.

[0090] And so on, during the operation of the semiconductor component, no matter how many levels of cascading there are, the ultimate heat providing end 5 will have a change that the temperature first gradually decreases and then gradually increases, and the lowest temperature of the ultimate heat providing end 5 can be less than the ambient temperature T0.

[0091] In one embodiment, after the power supply assembly 2 outputs power through its positive electrode + and negative electrode -, the temperature difference between the first conductive carrier 3 and the second conductive carrier 51 remains substantially unchanged. When there is a second semiconductor component 6 cascaded with the first semiconductor component 4 such that the second conductive carrier 51 becomes the intermediate heat supply end of the aerosol generating device, the temperature difference between the third conductive carrier 52 and the second conductive carrier 51 can remain substantially unchanged. Further, the temperature difference between the ultimate heat supply end 5 and the first conductive carrier 3 can remain substantially unchanged.

[0092] Before the semiconductor components in the aerosol generating device operate, the ultimate heat supply end 5 has an initial temperature, which can be the ambient temperature T0. In the initial stage when the semiconductor components in the aerosol generating device start to operate or start to operate again, after the ultimate heat supply end 5 directly transfers a part of its heat to the first conductive carrier 3 or indirectly transfers it to the first conductive carrier 3 through the intermediate heat supply end, its temperature will drop. According to the zeroth law of thermodynamics, when the temperature of the ultimate heat supply end 5 drops below the ambient temperature T0, the ultimate heat supply end 5 needs to absorb heat from the external environment it is in to increase the heat of the ultimate heat supply end 5. Then, under the action of the semiconductor components, the ultimate heat supply end 5 transfers at least part of its heat to the first conductive carrier 3 or transfers it to the first conductive carrier 3 through the intermediate heat supply end. The heat absorbed by the ultimate heat supply end 5 from the external environment it is in can slow down the rate of temperature drop of the ultimate heat supply end and reduce the amplitude of temperature drop of the ultimate heat supply end 5, which helps the first conductive carrier 3 to heat up quickly and enables the first conductive carrier 3 to heat up faster to heat the aerosol generating article 1.

[0093] Then, as the temperature of the first conductive carrier 3 continues to rise, restricted by the magnitude of the current and the temperature difference, the temperature of the ultimate heat supply end 5 will gradually rise after dropping to a certain extent. In one embodiment, reference can be made to Figure 5A , the temperature of the ultimate heat supply end 5 can gradually rise to be greater than the ambient temperature T0. After the temperature of the ultimate heat supply end 5 rises to be greater than the ambient temperature T0, the temperature of the ultimate heat supply end 5 can still continue to rise. In one embodiment, reference can be made to Figure 5B , after the power supply assembly 2 supplies power through its positive electrode + and negative electrode -, the temperature of the ultimate heat supply end 5 can always remain less than or equal to the ambient temperature T0. During the stage when the temperature of the ultimate heat supply end 5 gradually rises, the temperature difference between the ambient temperature T0 and the ultimate heat supply end 5 can gradually decrease, and the rate of decrease of the temperature difference can gradually decrease.

[0094] Without increasing the current or while maintaining the preset power output of the power supply component 2, subject to the constraint that the temperature difference between the ultimate heat supply end 5 and the first conductive carrier 3 can be basically kept unchanged, in order to make the first conductive carrier 3 have a relatively high temperature, for example, it is necessary to make the temperature of the first conductive carrier 3 reach above 150 °C, then the temperature of the ultimate heat supply end 5 or the intermediate heat supply end cannot be too low.

[0095] Therefore, in one embodiment, multiple sets of semiconductor components can be cascaded with each other, and one or more intermediate heat supply ends can be used to gradually transfer or transfer heat to the first conductive carrier 3, so that the temperature between the ultimate heat supply end 5 and the first conductive carrier 3 increases step by step through one or more intermediate heat supply ends, so that the intermediate heat supply end adjacent to the first conductive carrier 3, such as the second conductive carrier 51, has a relatively high temperature, so as to increase the rising speed of the temperature of the first conductive carrier 3 and increase the temperature of the first conductive carrier 3, so that the temperature of the first conductive carrier 3 can quickly reach above 150 °C, for example, the first conductive carrier 3 can be heated to 250 °C within 5S. By arranging one or more intermediate heat supply ends cascaded with the ultimate heat supply end between the ultimate heat supply end 5 and the first conductive carrier 3, not only can the heating speed and temperature of the first conductive carrier 3 be increased, but also the ultimate heat supply end 5 can be kept at a relatively low temperature, which helps to further reduce the loss. When the temperature of the ultimate heat supply end 5 is less than or equal to the ambient temperature T0, the loss will be further reduced.

[0096] In one embodiment, the ultimate heat supply end 5 has a relatively large heat absorption area. The larger the heat absorption area of the ultimate heat supply end 5, the more heat it absorbs from the external environment per unit time, and the more heat it can transfer to the intermediate heat supply end or the first conductive carrier 3 per unit time.

[0097] In the initial stage when the semiconductor component in the aerosol generating device starts to operate or starts to operate again, a part of the heat transferred from the ultimate heat supply end 5 to the intermediate heat supply end or to the first conductive carrier 3 comes from itself, so its own temperature will drop. Another part of the heat comes from the heat it absorbs from the surrounding external environment. Therefore, the amount of heat absorbed by the ultimate heat supply end 5 can affect the heating rate and temperature of the first conductive carrier 3. To increase the heat absorption rate of the ultimate heat supply end 5 and the heating rate of the first conductive carrier 3 for heating the aerosol generating article 1, it is selected that the heat absorption area of the ultimate heat supply end 5 is larger than the heat release area of the first conductive carrier 3. Among them, the heat absorption area of the ultimate heat supply end 5 is mainly the heat exchange area between the ultimate heat supply end 5 and the surrounding external environment, or mainly the area where the ultimate heat supply end 5 absorbs heat from the surrounding external environment. The heat release area of the first conductive carrier 3 is mainly the heat exchange area between the first conductive carrier 3 and the aerosol generating article 1, or mainly the area where the first conductive carrier 3 releases heat towards the aerosol generating article 1.

[0098] In one embodiment, at least a part of the ultimate heat supply end 5 forms the outer shell of the aerosol generating device, thus being exposed to the air outside the aerosol generating device. For example, when the second conductive carrier 51 is the ultimate heat supply end 5 of the aerosol generating device, at least a part of the second conductive carrier 51 forms the outer shell of the aerosol generating device, thus being exposed to the air outside the aerosol generating device; or for example, when the second conductive carrier 51 is the intermediate heat supply end of the aerosol generating device and the third conductive carrier 52 is the ultimate heat supply end 5 of the aerosol generating device, then at least a part of the third conductive carrier 52 forms the outer shell of the aerosol generating device, thus being exposed to the air outside the aerosol generating device.

[0099] By exposing at least a part of the ultimate heat supply end 5 to the air outside the aerosol generating device, the ultimate heat supply end 5 directly absorbs the heat of the air outside the aerosol generating device and transfers at least part of the heat it has to the first conductive carrier 3, causing the temperature of the first conductive carrier 3 to rise, which is beneficial to increasing the temperature of the ultimate heat supply end 5 and the heating rate of the first conductive carrier 3.

[0100] In this embodiment, the air outside the aerosol generating device can be the surrounding external environment where the ultimate heat supply end 5 is located, and the temperature of the air outside the aerosol generating device can be the ambient temperature T0 of the ultimate heat supply end 5.

[0101] In one embodiment, reference can be made to Figure 1, the ultimate heat provider 5 is disposed inside the housing 8 of the aerosol generating device, and the ultimate heat provider 5 is in direct contact with the housing 5 of the aerosol generating device. Thus, the ultimate heat provider 5 can absorb the heat of the housing 8 of the aerosol generating device and absorb the heat of the air outside the aerosol generating device through the housing 8. At the same time, the ultimate heat provider 5 can transfer at least part of the heat it already has to the first conductive carrier 3, causing the temperature of the first conductive carrier 3 to rise. For example, when the second conductive carrier 51 is the ultimate heat provider 5 of the aerosol generating device, at least a part of the second conductive carrier 51 can be in direct contact with the housing 8 of the aerosol generating device; or for example, when the second conductive carrier 51 is the intermediate heat provider of the aerosol generating device and the third electrical carrier 52 is the ultimate heat provider 5 of the aerosol generating device, then at least a part of the third conductive carrier 52 can be in direct contact with the housing of the aerosol generating device.

[0102] In this embodiment, the external environment of the ultimate heat provider 5 includes the housing 8, and the temperature of the housing 8 can be the ambient temperature T0 of the ultimate heat provider 5. During at least part of the period after the power supply assembly 2 outputs electricity through its positive electrode + and negative electrode -, the temperature of the ultimate heat provider 5 can be lower than the temperature of the housing 8. Under some conditions, for example, when the mutually cascaded semiconductor components are started simultaneously, the temperature of the intermediate heat provider can also be lower than the temperature of the housing 8.

[0103] In one embodiment, a heat conducting member is provided inside the aerosol generating device. The heat conducting member is connected between the ultimate heat provider 5 and the housing 8 of the aerosol generating device, such that the ultimate heat provider 5 and the housing 8 of the aerosol generating device are in indirect contact through the heat conducting member. For example, when the second conductive carrier 51 is the ultimate heat provider 5 of the aerosol generating device, at least a part of the second conductive carrier 51 is in indirect contact with the housing 8 of the aerosol generating device through the heat conducting member; or for example, when the second conductive carrier 51 is the intermediate heat provider of the aerosol generating device and the third electrical carrier 52 is the ultimate heat provider 5 of the aerosol generating device, then at least a part of the third conductive carrier 52 is in indirect contact with the housing 8 of the aerosol generating device through the heat conducting member.

[0104] The ultimate heat provider 5 can absorb the heat of the heat conducting member and can indirectly absorb the heat of the housing 8 through the heat conducting member.

[0105] Among them, the material of the heat conducting member includes a good heat conducting material, and the good heat conducting material is a material with a thermal conductivity greater than or equal to 10 W / (m·k) at 23°C and 50% relative humidity, or the good heat conducting material includes but is not limited to: at least one or more of metal, graphite, graphene, diamond, silicon carbide, aluminum nitride or heat conducting polymer. Among them, the metal includes but is not limited to: one or more of silver, copper, gold, aluminum, tungsten, zinc, molybdenum, nickel, iron, platinum, ferrite, alloy or stainless steel, and the heat conducting polymer includes but is not limited to: heat conducting silica gel or heat conducting silicone grease.

[0106] The heat conducting member may include a heat conducting coating on the surface of the ultimate heat providing end 5. The heat conducting member may include a bracket for holding or supporting the ultimate heat providing end 5. The heat conducting member may form at least a part of the external environment where the ultimate heat providing end 5 is located. During the operation of the semiconductor component, the temperature of the ultimate heat providing end 5 can be reduced to less than the temperature of the heat conducting member. There may be a large contact area between the heat conducting member and the ultimate heat providing end 5, and the larger this contact area, the more conducive it is for the ultimate heat providing end 5 to absorb heat from the surrounding external environment.

[0107] The heat conducting member may be connected to the structural members in the aerosol generating device. The structural members may be brackets for supporting or holding the power supply 21 (such as a battery or a battery cell), the structural members may be brackets for supporting or holding the circuit board 22, and the structural members may be brackets for supporting or holding components in the aerosol generating device such as an airflow detector, an LED lamp, a motor, a buzzer, a switch, a display or a sensor.

[0108] There may be a large contact area between the heat conducting member and the housing 8 and / or between the heat conducting member and the structural members in the aerosol generating device. The larger this contact area, the more conducive it is for the heat conducting member to absorb heat from the surrounding external environment. The surface area of the heat conducting member or the contact area between the heat conducting member and the housing 8 and / or between the heat conducting member and the structural members in the aerosol generating device may constitute the extended heat absorption area of the ultimate heat providing end 5.

[0109] In the embodiment including the heat conducting member, the external environment of the ultimate heat providing end 5 includes the heat conducting member, and the temperature of the heat conducting member may be the ambient temperature T0 of the ultimate heat providing end 5.

[0110] In one embodiment, there is a structural member inside the aerosol generating device, and at least a part of the ultimate heat providing end 5 forms the structural member, so that the ultimate heat providing end 5 can connect or support components such as a power source, a circuit board, an air flow detector, an LED lamp, a motor, a buzzer, a switch, a display or a sensor inside the aerosol generating device. For example, when the second conductive carrier 51 is the ultimate heat providing end 5 of the aerosol generating device, at least a part of the second conductive carrier 51 forms the structural member; or for example, when the second conductive carrier 51 is the intermediate heat providing end of the aerosol generating device and the third conductive carrier 52 is the ultimate heat providing end 5 of the aerosol generating device, at least a part of the third conductive carrier 52 forms the structural member.

[0111] The structural member can have a relatively large surface area, and the surface area of the structural member or the contact area between the structural member and the housing 8 can constitute the heat absorption area extended to the outside of the ultimate heat providing end 5.

[0112] In one embodiment, there is a structural member inside the aerosol generating device, and the ultimate heat providing end 5 is in direct or indirect contact with the structural member. The indirect contact between the ultimate heat providing end 5 and the structural member includes that the ultimate heat providing end 5 contacts the structural member through the housing 8 of the aerosol generating device or through a heat conducting member. When the ultimate heat providing end 5 is in direct contact with the structural member, they can be closely attached or closely adjacent to each other, and the two can have a relatively large contact area.

[0113] In the embodiment including the structural member, the external environment of the ultimate heat providing end 5 includes the structural member, and the temperature of the structural member can be the ambient temperature T0 of the ultimate heat providing end 5.

[0114] To increase the heat absorption rate of the ultimate heat providing end 5, the material of the ultimate heat providing end 5 may include a material with good thermal conductivity. The side of the ultimate heat providing end 5 or the intermediate heat providing end facing away from the aerosol generating article 1, or the side facing away from the intermediate heat providing end closer to the first conductive carrier 3, or the side facing away from the first conductive carrier 3, may have a rough surface to reduce its reflection of infrared rays in the surrounding external environment, thereby increasing its ability to obtain heat from the surrounding environment. Specifically, the surface roughness of the ultimate heat providing end 5 or the intermediate heat providing end on the side facing away from the aerosol generating article 1, or the side facing away from the intermediate heat providing end closer to the first conductive carrier 3, or the side facing away from the first conductive carrier 3, may be between 0.4 μm and 10 μm. For example, the roughness Ra2 of the surface (or the second side) of the second conductive carrier 51 facing away from the aerosol generating article 1 may satisfy: 0.4 μm ≤ Ra2 ≤ 10 μm, the roughness Ra4 of the surface of the third conductive carrier 52 facing away from the aerosol generating article 1 may satisfy: 0.4 μm ≤ Ra4 ≤ 10 μm, and the roughness Ra6 of the surface of the first conductive carrier 3 facing away from the aerosol generating article 1 may satisfy: 0.4 μm ≤ Ra6 ≤ 10 μm.

[0115] To increase the rate at which the first conductive carrier 3 heats the aerosol generating article 1, the material of the first conductive carrier 3 may include a material with good thermal conductivity, or the surface of the first conductive carrier 3 facing the aerosol generating article 1 may have a coating of a material with good thermal conductivity. The side of the first conductive carrier 3 or the intermediate heat providing end facing the aerosol generating article 1 may have a rough surface to increase its emissivity, thereby enhancing the ability of the first conductive carrier 3 to heat the aerosol generating article 1. Specifically, the surface roughness of the side of the first conductive carrier 3 or the intermediate heat providing end facing the aerosol generating article 1 may be between 0.4 μm and 10 μm. For example, the roughness Ra1 of the surface of the first conductive carrier 3 facing the aerosol generating article may satisfy: 0.4 μm ≤ Ra1 ≤ 10 μm, the roughness Ra3 of the surface (or the first side) of the second conductive carrier 51 facing the aerosol generating article may satisfy: 0.4 μm ≤ Ra3 ≤ 10 μm, and the roughness Ra5 of the surface of the third conductive carrier 52 facing the aerosol generating article may satisfy: 0.4 μm ≤ Ra5 ≤ 10 μm.

[0116] According to the Peltier formula, by increasing the magnitude of the current output by the power supply component 2 to the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4, the amount of heat transferred between the first conductive carrier 3 and the second conductive carrier 51 and the temperature difference between the two can be increased, and the temperature of the first conductive carrier 3 can be increased. Similarly, by increasing the magnitude of the output current of the power supply component 2 to one or more semiconductor components, the amount of heat transferred between the ultimate heat supply end 5 and the first conductive carrier 3 and the temperature difference between the two can be increased, and the temperature of the first conductive carrier 3 can be increased. Therefore, by controlling or adjusting the magnitude of the output current of the power supply component 2 to one or more semiconductor components, the temperature difference between the ultimate heat supply end 5 and the first conductive carrier 3 can be controlled or regulated, and the temperature of the first conductive carrier 3 can be controlled or regulated.

[0117] Based on this, the aerosol generating device may further include a temperature detector. There may be one or more temperature detectors for detecting the temperature of the first conductive carrier 3, the ultimate heat supply end 5, and / or the intermediate heat supply end, and the controller can regulate the magnitude of the output current of the power supply component 2 to one or more semiconductor components based on the temperature feedback provided by the temperature detector.

[0118] In one embodiment, referring to FIG. 5, when the power supply component 2 outputs power to the semiconductor component through its positive electrode + and negative electrode -, the temperature of the first conductive carrier 3 continuously increases. Among them, the initial temperature at which the temperature of the first conductive carrier 3 continuously increases may be the ambient temperature T0, and the initial temperature at which the temperature of the first conductive carrier 3 continuously increases may be the same as the initial temperature of the ultimate heat supply end 5. Alternatively, the initial temperature at which the temperature of the first conductive carrier 3 continuously increases may be the remaining temperature on the first conductive carrier 3 that has not dissipated after the power supply component 2 last output power to the semiconductor component through its positive electrode + and negative electrode -, so that the initial temperature at which the temperature of the first conductive carrier 3 continuously increases may be greater than the ambient temperature T0 or greater than the initial temperature of the ultimate heat supply end 5.

[0119] In one embodiment, reference may be made to Figure 2 , the first conductive carrier 3 includes a first body 30, and the first body 30 is a first conductive body, that is, the material of the first body 30 includes a conductive material. Among them, the first conductive body constitutes one of the first conductive part 31 or the second conductive part 32, and the other of the first conductive part 31 or the second conductive part 32 is made of other conductive materials, and the first conductive part 31 and the second conductive part 32 are electrically connected to the positive electrode + and the negative electrode - of the power supply component 2 respectively and are spaced apart from each other.

[0120] Specifically, reference may be made to Figure 2, the first conductive carrier 3 includes a first insulating layer 33. The first insulating layer 33 is disposed between the first conductive portion 31 and the second conductive portion 32, such that the first conductive portion 31 and the second conductive portion 32 are insulated and spaced apart from each other. More specifically, in one example, a partial surface of the first conductive body is covered by the first insulating layer 33, and the partial surface is exposed to form one of the first conductive portion 31 or the second conductive portion 32. The other of the first conductive portion 31 or the second conductive portion 32 may be a conductive element such as a conductive metal part, a conductive layer, or a conductive wire. The conductive element can be held on the first conductive body by means such as embedding, pasting, coating, printing, physical deposition, chemical deposition, electro-deposition, particle injection, ion sputtering, plating, or winding, and there is a first insulating layer 33 between the conductive element and the first conductive body. The first insulating layer 33 can be formed by high-temperature oxidation of the surface of the first conductive body, and the first insulating layer 33 can be combined on the surface of the first conductive body by means such as pasting, coating, printing, physical deposition, chemical deposition, electro-deposition, particle injection, ion sputtering, or plating. The first insulating layer 33 has a relatively small thickness to reduce the thermal resistance between the first conductive portion 31 and the second conductive portion 32. For example, the thickness of the first insulating layer 33 can be less than 0.5 mm, and the thickness of the first insulating layer 33 can be less than the thickness of the first conductive body. The first conductive body can support the first insulating layer 33, the first conductive portion 31, and the second conductive portion 32.

[0121] In one embodiment, reference may be made to Figure 3 , the first conductive carrier includes a first body 30, and the first body 30 is the first conductive body. The first conductive portion 31 and the second conductive portion 32 are arranged on the first conductive body at intervals, and are both insulated and connected to the first conductive body. For example, the first conductive carrier 3 further includes a first insulating layer 33. The first insulating layer 33 is disposed on the first conductive body, and then the first conductive portion 31 and the second conductive portion 32 are disposed on the first insulating layer 33 to be insulated and spaced apart from the first conductive body through the first insulating layer 33, and at the same time, the first conductive portion 31 and the second conductive portion 32 are spaced apart from each other.

[0122] In an embodiment where the first conductive carrier 3 includes a first conductive body, the first conductive body may be a metal, such as aluminum, aluminum alloy, titanium alloy, or stainless steel, etc. Preferably, the first conductive body is a metal in good heat-conducting materials. Therefore, the thickness of the first conductive body can be less than or equal to 2.5 mm. For example, the thickness of the first conductive body can be approximately 0.2 mm, 0.3 mm, 0.6 mm, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, or 1.8 mm. According to the formula: Q = CMΔT, where Q is the heat, C is the specific heat capacity, M is the mass, and ΔT is the temperature change. By making the first conductive body or the first conductive carrier 3 have a relatively small thickness to reduce the mass M of the first conductive carrier 3, thereby reducing the loss of the first conductive carrier 3, which helps to improve the heat utilization rate.

[0123] In one embodiment, reference may be made to Figure 4 , the first conductive carrier 3 includes a first body 30, the first body 30 is a first insulating body, and the first conductive portion 31 and the second conductive portion 32 are arranged on the first insulating body at intervals. Preferably, the first insulating body is an insulating material in a good heat-conducting material. For example, the first insulating body may be alumina, aluminum nitride, cobalt oxide, silicon dioxide, thermal conductive silicone, or thermal conductive silicone grease, etc.

[0124] In one embodiment, the first conductive carrier 3 includes a flexible printed circuit board (FPC, Flexible Printed Circuit). The flexible printed circuit board includes an insulating material and a conductor combined with the insulating material. Part of the conductors in the flexible printed circuit board form the first conductive portion 31, and part of the conductors form the second conductive portion 32. The first conductive portion 31 and the second conductive portion 32 are insulated and spaced on the flexible printed circuit board. The insulating material in the flexible printed circuit board may be an insulating film material. For example, the insulating material may include polyimide and / or polyester materials. The conductor in the flexible printed circuit board may be copper foil, and may be formed on or combined with the film material by means of electro-deposition or plating, etc. The flexible printed circuit board may be a single-layer flexible printed circuit board, or may be a multi-layer flexible printed circuit board. The thickness of the flexible printed circuit board may be between 0.02 mm and 0.5 mm. For example, it may be about 0.05 mm, or may be about 0.1 mm, etc.

[0125] In one embodiment, the first conductive carrier 3 includes a first body 30. The first body 30 may be a first conductive body or may be a first insulating body. The first conductive portion 31 and / or the second conductive portion 32 contact the surface of the first body 30 or are embedded in the first body 30 for setting.

[0126] As an example, the first body 30 has good surface consistency, so that when the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are electrically connected to the first conductive portion 31 and / or the second conductive portion 32, there is no need to be embedded in the first body 30.

[0127] As an example, the first body 30 has a groove, at least a part of the first conductive part 31 and / or the second conductive part 32 can be disposed in the groove, and the thickness of the first conductive part 31 and / or the second conductive part 32 can be substantially equal to the depth of the groove, so that after the first conductive part 31 and / or the second conductive part 32 are embedded in the groove, at least a part of the surface of the first conductive part 31 and / or the second conductive part 32 can be flush with the surface of the first body 30, thereby enabling the first conductive carrier 3 to have good surface consistency. When the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are electrically connected to the first conductive part 31 and / or the second conductive part 32, there is no need to be embedded into the first body 30.

[0128] As an example, the first body 30 has a groove, at least a part of the first conductive part 31 and / or the second conductive part 32 can be disposed in the groove, and the thickness of the first conductive part 31 and / or the second conductive part 32 is less than the depth of the groove, so that after the first conductive part 31 and / or the second conductive part 32 are embedded in the groove, a stepped structure is formed between the first conductive part 31 and / or the second conductive part 32 and the surface of the first body 30, and at least a part of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 needs to be electrically connected to the first conductive part 31 and / or the second conductive part 32 by being embedded into the groove.

[0129] In one embodiment, reference may be made to Figure 2 , the second conductive carrier 51 includes a second body 510, and the second body 510 is a second conductive body, that is, the material of the second body 510 includes a conductive material. The second conductive body is electrically connected to both the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4, so that the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are electrically connected to each other through the second conductive body.

[0130] In one embodiment, reference may be made to Figure 4, the second conductive carrier 51 includes a second body 510, a second insulating layer 512, and a third conductive portion 511. The second body 510 is a second conductive body, and the second insulating layer 512 is disposed between the second conductive body and the third conductive portion 511 to insulate and space the second conductive body and the third conductive portion 511. The third conductive portion 511 can be a conductive metal part, a conductive layer, a conductive wire, etc. The third conductive portion can be disposed adjacent to the second conductive body by means of embedding, pasting, coating, printing, physical deposition, chemical deposition, electro-deposition, particle injection, ion sputtering, plating, or winding, etc., and is spaced from the second conductive body by the second insulating layer 512. The second insulating layer 512 can be combined on the surface of the second conductive body by means of pasting, coating, printing, physical deposition, chemical deposition, electro-deposition, particle injection, ion sputtering, or plating, etc. The second conductive body can support the second insulating layer 512 and the third conductive portion 511.

[0131] The third conductive portion 511 is electrically connected to both the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4, so that the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are electrically connected to each other through the third conductive portion 511.

[0132] In one embodiment, reference may be made to Figure 3 , the second conductive carrier 51 includes a second body 510 and a third conductive portion. The second body 510 is a second insulating body, and the third conductive portion 511 is disposed on the second insulating body. The third conductive portion 511 is electrically connected to both the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4, so that the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are electrically connected to each other through the third conductive portion 511.

[0133] In an embodiment where the second conductive carrier 51 includes a second body 510, the second body includes a good heat-conducting material.

[0134] In one embodiment, the second conductive carrier 51 includes a flexible circuit board, and the N-type semiconductor 41 and the P-type semiconductor 42 of the first semiconductor component 4 are electrically connected to the flexible circuit board in the second conductive carrier 51. For example, the flexible circuit board in the second conductive carrier 51 includes an insulating material and a conductor combined on the insulating material, and at least a part of the conductor forms the third conductive portion 511.

[0135] In one embodiment, the second conductive carrier 51 includes a second body 510. The second body 510 can be a second conductive body or can be a second insulating body, and the third conductive portion 511 contacts the surface of the second body 510 or is embedded in the second body 510.

[0136] In one embodiment, reference may be made to Figures 7 - 9, one or more first clamping grooves 34 are provided on the first conductive carrier 3 and / or the second conductive carrier 51. The first clamping grooves 34 are used to fix the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4, so that the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 can be held on the first conductive carrier 3 and / or the second conductive carrier 51.

[0137] Specifically, in one example, reference may be made to Figure 7 and Figure 8 , the end portions of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are embedded in the first clamping groove 34, and the remaining portions of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are located outside the first clamping groove 34, so as to reduce the depth of the first clamping groove 34 and the mass of the first conductive carrier 3 and / or the second conductive carrier 51, thereby reducing losses and improving energy utilization efficiency. Further, only one end of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 is embedded in the first clamping groove 34 for fixation.

[0138] In one example, the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are fixed at different positions in the same first clamping groove 34, or the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are fixed in different first clamping grooves 34.

[0139] When there are multiple first semiconductor components 4, the N-type semiconductors 41 in different first semiconductor components 4 can be fixed at different positions in the same first clamping groove 34, the P-type semiconductors 42 in different first semiconductor components 4 can be fixed at different positions in the same first clamping groove 34, the N-type semiconductor 41 and the P-type semiconductor 42 fixed at different positions in the same first clamping groove 34 can respectively belong to different first semiconductor components 4, at least two of the multiple N-type semiconductors 41 fixed in different first clamping grooves 34 can respectively belong to different first semiconductor components 4, or at least two of the multiple P-type semiconductors 42 fixed in different first clamping grooves 34 can respectively belong to different first semiconductor components 4.

[0140] Please refer to Figure 13, when the aerosol generating device further includes a second semiconductor component 6, and the first semiconductor component 4 and the second semiconductor component 6 are axially offset with respect to the aerosol generating article 1, and when the second semiconductor component 6 is fixedly connected to the first conductive carrier 3 and / or the second conductive carrier 51, the N-type semiconductor 41 in the first semiconductor component 4 and the N-type semiconductor 61 in the second semiconductor component 6 can be fixed at different positions in the same first clamping groove 34, and the P-type semiconductor 42 in the first semiconductor component 4 and the P-type semiconductor 62 in the second semiconductor component 6 can be fixed at different positions in the same first clamping groove 34. The N-type semiconductor and the P-type semiconductor fixed at different positions in the same first clamping groove 34 can belong to the first semiconductor component 4 and the second semiconductor component 6 respectively. At least two of the multiple N-type semiconductors fixed in different first clamping grooves 34 can belong to the first semiconductor component 4 and the second semiconductor component 6 respectively. At least two of the multiple P-type semiconductors fixed in different first clamping grooves 34 can belong to the first semiconductor component 4 and the second semiconductor component 6 respectively. At least two of the multiple P-type semiconductors fixed in different first clamping grooves 34 can belong to the first semiconductor component 4 and the second semiconductor component 6 respectively.

[0141] Wherein, in one embodiment, the first semiconductor component 4 and the second semiconductor component 6 being axially offset with respect to the aerosol generating article 1 includes: the first semiconductor component 4 and the second semiconductor component 6 are completely axially offset with respect to the aerosol generating article, as can be Figure 13 shown.

[0142] In one embodiment, the first semiconductor component 4 and the second semiconductor component 6 are axially staggered in the aerosol-generating article 1, which includes: the first semiconductor component 4 and the second semiconductor component 6 are partially axially staggered in the aerosol-generating article 1, such that the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are arranged in a similar interlocking pattern with the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6. For example, a part of the N-type semiconductor 61 in the second semiconductor component 6 is located between the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4; or for example, a part of the P-type semiconductor 62 in the second semiconductor component 6 is located between the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4; or for example, a part of the P-type semiconductor 62 in the second semiconductor component 6 is located between the N-type semiconductor 61 in the second semiconductor component 6 and the P-type semiconductor 42 in the first semiconductor component 4; or for example, a part of the P-type semiconductor 62 in the second semiconductor component 6 is located between the N-type semiconductor 61 in the second semiconductor component 6 and the N-type semiconductor 41 in the first semiconductor component 4; or for example, a part of the N-type semiconductor 61 in the second semiconductor component 6 is located between the P-type semiconductor 62 in the second semiconductor component 6 and the N-type semiconductor 41 in the first semiconductor component 4.

[0143] In one example, reference may be made to Figure 7 When the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are fixed in the first clamping groove 34, the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 remain electrically connected to the first conductive carrier 3, or the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 remain electrically connected to the second conductive carrier 51. Thus, while the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are fixed by being embedded in the first clamping groove 34, the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 can remain electrically connected to the first conductive carrier 3 and / or the second conductive carrier 51.

[0144] When the aerosol-generating device further has a second semiconductor component 6, and the first semiconductor component 4 and the second semiconductor component 6 are axially staggered in the aerosol-generating article 1, and at the same time when the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 are fixed in the first clamping groove 34, reference may be made to Figure 13 The N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 remain electrically connected to the first conductive carrier 3, or the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 remain electrically connected to the second conductive carrier 51.

[0145] In one example, reference may be made toFigures 7 - 9 The first clamping groove 34 includes a first groove wall 341 extending radially. The N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are spaced apart from each other along the circumferential direction of the aerosol generating article 1 through the first groove wall 341.

[0146] When the aerosol generating device further has a second semiconductor component 6, and the first semiconductor component 4 and the second semiconductor component 6 are arranged offset in the axial direction of the aerosol generating article 1, reference may be made to Figure 13 wherein the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 may be spaced apart from each other along the circumferential direction of the aerosol generating article 1.

[0147] In one embodiment, reference may be made to Figure 12 、 Figures 15 - 19 The N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are fixedly and spaced apart from each other on the first conductive carrier 3 and / or the second conductive carrier 51 by welding. Based on this, the first clamping groove 34 may not be provided on the first conductive carrier 3 and / or the second conductive carrier 51.

[0148] In one example, one end of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 is fixedly connected to the first conductive carrier 3 by welding, and the opposite end is fixed by being embedded in the first clamping groove 34 on the second conductive carrier 51. Alternatively, one end of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 is fixedly connected to the second conductive carrier 51 by welding, and the opposite end is fixed by being embedded in the first clamping groove 34 on the first conductive carrier 3.

[0149] In one example, reference may be made to Figure 12 、 Figures 15 - 19 The opposite ends of the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are fixedly connected to the first conductive carrier 3 and the second conductive carrier 51 respectively by welding.

[0150] Similarly, when the aerosol generating device further has a second semiconductor component 6, and the first semiconductor component 2 and the second semiconductor component 6 are arranged offset in the axial direction of the aerosol generating article 1, the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 may be fixedly and spaced apart from each other on the first conductive carrier 3 and / or the second conductive carrier 51 by welding.

[0151] In one embodiment, the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 can be first soldered onto the sheet-shaped first conductive carrier 3, and then the first conductive carrier 3 can be curled into a tubular shape. Then, the sheet-shaped second conductive carrier 51 can be wound around the periphery of a plurality of first semiconductor components 4, and the third conductive portion 511 or the second conductive body on the second conductive carrier 51 can be electrically connected to the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 by soldering. The opposite sides of the second conductive carrier 51 are in contact with each other or close to each other, so that the second conductive carrier 51 is curled into a tubular shape. In this embodiment, it is preferred that both the first conductive carrier 3 and the second conductive carrier 51 are flexible circuit boards, so that both the first conductive carrier 3 and the second conductive carrier 51 have good flexibility and can be curled.

[0152] It should be noted that in other embodiments, the second conductive carrier 51 can be manufactured into a tubular shape before being disposed around the first conductive carrier 3. For example, it can be manufactured into a metal tube having a second insulating layer 512 and a third conductor portion 511 on its surface, or a tubular body having a third conductor portion 511 on its surface but with the second body being an insulating material.

[0153] It should be noted that in other embodiments, the second conductive carrier 51 can be manufactured into a tubular shape before being soldered and connected to the first semiconductor component 4. For example, it can be manufactured into a metal tube having a first insulating layer 33, a first conductive portion 31, and a second conductive portion 32 on its surface, or a tubular body having a first conductive portion 31 and a second conductive portion 32 on its surface but with the first body being an insulating material.

[0154] In one embodiment, please refer to Figures 7 - 22 , there are a plurality of first semiconductor components 4. The plurality of first semiconductor components 4 can be disposed between the first conductive carrier 3 and the second conductive carrier 51. The plurality of first semiconductor components 4 can be electrically connected to the same first conductive carrier 3. The plurality of first semiconductor components 4 can be electrically connected to the same second conductive carrier 51. The plurality of first semiconductor components 4 can be respectively electrically connected to different first conductive carriers 3. The plurality of first semiconductor components 4 can be respectively electrically connected to different second conductive carriers 51.

[0155] As an example, please refer to Figure 11 and Figure 15 , there are a plurality of first semiconductor components 4, among which at least two first semiconductor components 4 are connected in series.

[0156] Specifically, there are also other conductive parts 35 on a first conductive carrier 3, and the positions of the other conductive parts 35 are different from those of the first conductive part 31 and the second conductive part 32. There may be one or more other conductive parts 35. The other conductive parts 35 are insulated and spaced from the first conductive part 31 and the second conductive part 32. When there are multiple other conductive parts 35, the multiple other conductive parts 35 may be insulated and spaced from each other. The other conductive parts 35 may be conductive elements such as conductive metal parts, conductive layers, or conductive wires. At least one first semiconductor component 4 may be electrically connected between the other conductive part 35 and the first conductive part 31 and / or the second conductive part 32.

[0157] Alternatively, there are multiple first conductive carriers 3. The first conductive part 31 and the second conductive part 32 may be located on different first conductive carriers 3, or the first conductive part 31 and the second conductive part 32 may be located at different positions on the same first conductive carrier 3. There are other conductive parts 35 on at least one first conductive carrier 3, and the positions of the other conductive parts 35 are different from those of the first conductive part 31 and the second conductive part 32, and are insulated and spaced from both the first conductive part 31 and the second conductive part 32. There may be multiple other conductive parts 35. At least two other conductive parts 35 may be respectively provided on different first conductive carriers 3, or at least two other conductive parts 35 may be respectively provided at different positions on the same first conductive carrier 3.

[0158] Among them, the other conductive part 35 may become a constituent part of the corresponding first conductive carrier 3 in the same way as the first conductive part 31 or the second conductive part 32.

[0159] There are multiple third conductive parts 511 that are insulated and spaced from each other on a second conductive carrier 51. Alternatively, there are multiple second conductive carriers 51, and each second conductive carrier 51 has at least one third conductive part 511.

[0160] More specifically, reference may be made to Figure 11 , in two first semiconductor components 4 connected in series, the N-type semiconductor 41 in the first first semiconductor component 4 is electrically connected to the first conductive part 31, and the P-type semiconductor 42 in the first first semiconductor component 4 is electrically connected to the N-type semiconductor 41 in the second first semiconductor component 4 through an other conductive part 35, while the P-type semiconductor 42 in the second first semiconductor component 4 is electrically connected to the second conductive part 32, or the P-type semiconductor 42 in the second first semiconductor component 4 is electrically connected to the N-type semiconductor 41 in the third first semiconductor component 4 through another other conductive part 35.

[0161] Meanwhile, the N-type semiconductor 41 and the P-type semiconductor 42 in the first first semiconductor component 4 are electrically connected through the same third conductive part 511 or the same second conductive carrier 51, and the N-type semiconductor 41 and the P-type semiconductor 42 in the second first semiconductor component 4 are electrically connected through another third conductive part 511 or another second conductive carrier 51. It should be noted that the third conductive part 511 or the second conductive carrier 51 electrically connected to the first first semiconductor component 4 is different from the third conductive part 511 or the second conductive carrier 51 electrically connected to the second first semiconductor component 4. Thus, at least two first semiconductor components 4 are connected in series with each other.

[0162] As an example, reference can be made to Figures 7 - 10 and Figure 12 , where there are multiple first semiconductor components 4, and at least two of the first semiconductor components 4 are connected in parallel.

[0163] Specifically, there can be multiple first conductive parts 31 and / or multiple second conductive parts 32 on the same first conductive carrier 3. Alternatively, there can be multiple first conductive carriers 3, with one or more first conductive parts 31 on some of the first conductive carriers 3 and one or more second conductive parts 32 on some of the first conductive carriers 3, so that there are multiple first conductive parts 31 or second conductive parts 32.

[0164] At least two of the multiple first conductive parts 31 can be electrically connected to each other. At least two of the multiple second conductive parts 32 can be electrically connected to each other. Based on this, reference can be made to Figure 9 , where the first conductive part 31 or the second conductive part 32 includes a connection end 321 and a plurality of finger electrodes 322 extending from the connection end 321. The connection end of the first conductive part is electrically connected to the positive electrode of the power supply component, and the plurality of finger electrodes of the first conductive part are respectively electrically connected to different N-type semiconductors. The connection end 321 of the second conductive part 32 is electrically connected to the negative electrode of the power supply component 2, and the plurality of finger electrodes 322 of the second conductive part 32 are respectively electrically connected to different P-type semiconductors 42.

[0165] Among the two first semiconductor components 4 connected in parallel: the N-type semiconductors 41 in the first first semiconductor component 4 and the N-type semiconductors 41 in the second first semiconductor component 4 can both be directly electrically connected to the same first conductive part 31; the P-type semiconductors 42 in the first first semiconductor component 4 and the P-type semiconductors 42 in the second first semiconductor component 4 can both be directly electrically connected to the same second conductive part 32; the N-type semiconductors 41 in the first first semiconductor component 4 and the N-type semiconductors 41 in the second first semiconductor component 4 can be respectively directly electrically connected to different first conductive parts 31 or interdigital electrodes; the P-type semiconductors 42 in the first first semiconductor component 4 and the P-type semiconductors 42 in the second first semiconductor component 4 can be respectively directly electrically connected to different second conductive parts 32 or interdigital electrodes 322.

[0166] There can be one and only one third conductive part 511 on the second conductive carrier 51, or the second conductive carrier 51 includes a second conductive body, and the third conductive part 511 or the second conductive body is electrically connected to the N-type semiconductors 41 and P-type semiconductors 42 in multiple first semiconductor components 4 connected in parallel at the same time. Or, there are multiple third conductive parts 511 on the second conductive carrier 51, or there are multiple second conductive carriers 51, and each second conductive carrier 51 has at least one third conductive part 511, so that there are multiple third conductive parts 511, and the multiple first semiconductor components 4 connected in parallel are respectively electrically connected to different third conductive parts 511; for example, the N-type semiconductor 41 and the P-type semiconductor 42 in the first first semiconductor component 4 are electrically connected to a third semiconductor 511 at the same time, and the N-type semiconductor 41 and the P-type semiconductor 42 in the second first semiconductor component 4 are electrically connected to another third semiconductor 511 at the same time, and these two third semiconductors 511 are not the same. Thus, at least two first semiconductor components 4 are connected in parallel.

[0167] In Figure 8 and Figure 9 In the illustrated embodiment, a plurality of first clamping grooves 34 are provided on the first conductive carrier 3, and the plurality of first clamping grooves 34 are distributed along the circumferential direction of the aerosol generating article 1. The second conductive part 32 has a plurality of interdigital electrodes 322, and the interdigital electrodes 322 are embedded and fixed in the corresponding first clamping grooves 34. And the second conductive part 32 is tightly connected to the first body 30 through the cooperation between the interdigital electrodes 322 and the first clamping grooves 34. The first body 30 can be a first conductive body or a first insulating body. The first conductive part 31 can be a component of the first body 30 and exposed outside the first insulating layer 33, or the first conductive part 31 can be provided on the first insulating layer 33 or on the first insulating body.

[0168] As an example, the first semiconductor component 4 has a plurality of them, and among them, some of the first semiconductor components 4 are connected in series with each other, and some of the first semiconductor components 4 are connected in parallel with each other.

[0169] In one embodiment, please refer to Figures 7 - 9 and Figures 15 - 17 , at least a part of the first conductive carrier 3 is configured to be tubular, and at least a part of the boundary of the accommodation cavity 36 is defined by the tubular first conductive carrier 3. Thus, a plurality of first semiconductor components 4 can be electrically connected to the same first conductive carrier 3, and a plurality of first semiconductor components 4 can be arranged around the same first conductive carrier 3.

[0170] As an example, please refer to Figure 9 , the N-type semiconductors 41 in a plurality of first semiconductor components 4 and the P-type semiconductors 42 in a plurality of first semiconductor components 4 are alternately arranged in a ring shape, so that the ring formed by the alternate arrangement of the N-type semiconductors 41 and the P-type semiconductors 42 in a plurality of first semiconductor components 4 can surround the first conductive carrier 3 and the accommodation cavity 36.

[0171] Based on this, in one embodiment, the first conductive carrier 3 can simultaneously have a plurality of first conductive portions 31 and a plurality of second conductive portions 32. The plurality of first conductive portions 31 and the plurality of second conductive portions 32 are alternately arranged and arranged in a ring shape surrounding the accommodation cavity 36. The ring formed by the alternate arrangement of the N-type semiconductors 41 and the P-type semiconductors 42 in a plurality of first semiconductor components 4 can surround the outside of the ring formed by the alternate arrangement of the plurality of first conductive portions 31 and the plurality of second conductive portions 32. Moreover, the N-type semiconductors 41 in a plurality of first semiconductor components 4 can be electrically connected to the plurality of first conductive portions 31 one-to-one, and the P-type semiconductors 42 in a plurality of first semiconductor components 4 can be electrically connected to the plurality of second conductive portions 32 one-to-one. When the N-type semiconductor 41 and the P-type semiconductor 42 in the same first semiconductor component 4 are electrically connected to each other through the second conductive carrier 51, then the plurality of first semiconductor components 4 are connected in parallel with each other.

[0172] In one embodiment, reference can be made to Figure 11 and Figure 15, on the first conductive carrier 3, there is a first conductive part 31, a second conductive part 32 and a plurality of other conductive parts 35. The plurality of other conductive parts 35 are arranged between the first conductive part 31 and the second conductive part 32, and a first conductive part 31, a second conductive part 32 and a plurality of other conductive parts 35 can be arranged in a circumferential direction of the first conductive carrier 3 to form a ring surrounding the accommodation cavity 36. A ring formed by alternating arrangement of N-type semiconductors 41 and P-type semiconductors 42 in a plurality of first semiconductor components 4 can surround the outside of the ring formed by the arrangement of the first conductive part 31, the second conductive part 32 and the plurality of other conductive parts 35. The N-type semiconductor 41 in one first semiconductor component 4 is electrically connected to the first conductive part 31, the P-type semiconductor 42 in another first semiconductor component 4 is electrically connected to the second conductive part 32, and the remaining N-type semiconductors 41 and P-type semiconductors 42 in the plurality of first semiconductor components 4 are respectively electrically connected to different other conductive parts 35. And in two adjacent first semiconductor components 4, the N-type semiconductor 41 of one first semiconductor component 4 and the P-type semiconductor 42 of another first semiconductor component 4 are electrically connected through the same other conductive part 35. When the N-type semiconductor 41 and the P-type semiconductor 42 in the same first semiconductor component 4 are electrically connected to each other through the corresponding second conductive carrier 51 or the third conductive part 511, then the plurality of first semiconductor components 4 are connected in series.

[0173] As an example, please refer to Figure 12 , there are a plurality of first semiconductor components 4. The N-type semiconductors 41 in the plurality of first semiconductor components 4 are arranged in a ring, and the P-type semiconductors 42 in the plurality of first semiconductor components 4 are arranged in a ring. The ring arranged by the N-type semiconductors 41 and the ring arranged by the P-type semiconductors 42 are arranged in a staggered manner in the axial direction of the aerosol generating article 1. Both the ring arranged by the N-type semiconductors 41 and the ring arranged by the P-type semiconductors 42 can surround the first conductive carrier 3 and the accommodation cavity 36.

[0174] In some embodiments, a plurality of first conductive portions and a plurality of second conductive portions may be simultaneously provided on the first conductive carrier. The plurality of first conductive portions are arranged in a ring shape, and the plurality of second conductive portions are arranged in a ring shape. The rings formed by the arrangement of the first conductive portions and the rings formed by the arrangement of the second conductive portions are offset in the axial direction of the aerosol-generating article. The ring formed by the arrangement of the N-type semiconductors in the plurality of first semiconductor components may surround the ring formed by the arrangement of the plurality of first conductive portions, and the N-type semiconductors in the plurality of first semiconductor components may be electrically connected to the plurality of first conductive portions one-to-one. The ring formed by the arrangement of the P-type semiconductors in the plurality of first semiconductor components may surround the ring formed by the arrangement of the plurality of second conductive portions, and the P-type semiconductors in the plurality of first semiconductor components may be electrically connected to the plurality of second conductive portions one-to-one. When the N-type semiconductor and the P-type semiconductor in the same first semiconductor component are electrically connected to each other through the second conductive carrier, the plurality of first semiconductor components are connected in parallel.

[0175] In some embodiments, reference may be made to Figure 12 , the first conductive portion 31 on the first conductive carrier 3 may be configured as a ring or an arc extending along the circumferential direction of the aerosol-generating article 1. The ring formed by the arrangement of the N-type semiconductors 41 in the plurality of first semiconductor components 4 may surround the ring or arc formed by the extension of the first conductive portion 31, and the N-type semiconductors 41 in the plurality of first semiconductor components 4 may be electrically connected to the first conductive portion 31 simultaneously. The second conductive portion 32 on the first conductive carrier 3 may be configured as a ring or an arc extending along the circumferential direction of the aerosol-generating article 1. The ring formed by the arrangement of the P-type semiconductors 42 in the plurality of first semiconductor components 4 may surround the ring or arc formed by the extension of the second conductive portion 32, and the P-type semiconductors 42 in the plurality of first semiconductor components 4 may be electrically connected to the second conductive portion 32 simultaneously. When the N-type semiconductor 41 and the P-type semiconductor 42 in the same first semiconductor component 4 are electrically connected to each other through the second conductive carrier 51, the plurality of first semiconductor components 4 are connected in parallel.

[0176] In one embodiment, please refer to Figures 7 - 22 , at least a part of the second conductive carrier 51 is configured as a tube, and the second conductive carrier 51 surrounds the first conductive carrier 3. The first semiconductor component 4 is disposed between the first conductive carrier 3 and the second conductive carrier 51.

[0177] When the semiconductor component is operating, the temperature on the first conductive carrier 3 is higher than the temperature on the second conductive carrier 51. In order to prevent the heat on the first conductive carrier 3 from flowing to the second conductive carrier 52 through heat conduction, the first conductive carrier 3 and the second conductive carrier 51 are spaced apart from each other.

[0178] Please refer to Figure 18 and Figure 19, a support member 9 can be provided between the first conductive carrier 3 and the second conductive carrier 51.

[0179] The support member 9 can have a mounting hole 91, and the N-type semiconductor 41 and / or P-type semiconductor 42 in the first semiconductor component 4 can be located in the mounting hole 91, so as to be held between the first conductive carrier 3 and the second conductive carrier 51. Among them, the N-type semiconductor 41 and P-type semiconductor 42 in the first semiconductor component 4 can be arranged at different positions in the same mounting hole 91, or can be arranged in different mounting holes 91, or only one of them is arranged in the mounting hole 91.

[0180] The support member 9 can contact the first conductive carrier 3 and / or the second conductive carrier 51. There can be a gap between the support member 9 and the first conductive carrier 3 and / or the second conductive carrier 51.

[0181] The material of the support member 9 includes a heat-insulating material, and the heat-insulating material refers to a material whose thermal conductivity is less than 40 W / (m·K) or less than 10 W / (m·K) at 23 °C and 50% relative humidity. Suitable heat-insulating materials include, but are not limited to: at least one of PAEK-based materials, PI materials or PBI materials, where PAEK-based materials include PEEK, PEKK, PEKEKK or PEK materials. Or suitable heat-insulating materials include, but are not limited to: aerogel, glass fiber, glass felt, ceramic, silica, alumina, carbon and ore, or any combination thereof.

[0182] It should be noted that the support member 9 is optional rather than mandatory.

[0183] There can be a sealed air cavity between the first conductive carrier 3 and the second conductive carrier 51. By sealing the air cavity, air convection is reduced, thereby increasing the heat-insulating effect between the first conductive carrier 3 and the second conductive carrier 51. Specifically, the gas in the air cavity forms a heat-insulating layer between the first conductive carrier 3 and the second conductive carrier 51. For example, the air cavity can be a negative pressure cavity to make the heat-insulating effect between the first conductive carrier 3 and the second conductive carrier 51 better.

[0184] Please refer to Figure 7 , Figure 18 and Figure 20 , the aerosol generating device includes an upper heat-insulating member 71, and the upper heat-insulating member 61 covers one end of the first conductive carrier 3 to prevent the heat on the first conductive carrier 3 from escaping from this end, which helps to reduce heat loss and improve heat utilization efficiency. When both the first conductive carrier 3 and the second conductive carrier 51 are substantially tubular, the upper heat-insulating member 71 can extend radially along the aerosol generating article 1 and be connected to the second conductive carrier 51.

[0185] Please refer to Figure 7 ,Figure 18 and Figure 20 The aerosol generating device includes a lower heat insulator 72 which covers the other end of the first conductive carrier 3 to prevent heat on the first conductive carrier 3 from escaping from this other end, contributing to reducing heat loss and improving heat utilization efficiency. When both the first conductive carrier 3 and the second conductive carrier 51 are substantially tubular, the lower heat insulator 72 can extend radially along the aerosol generating article 1 and is connected to the second conductive carrier 51.

[0186] Please refer to Figure 7 、 Figure 18 and Figure 20 The aerosol generating device further includes an upper heat insulator 71 and a lower heat insulator 72. The upper heat insulator 71 is sealingly connected to one end of the first conductive carrier 3 and one end of the second conductive carrier 51, and the lower heat insulator 72 is sealingly connected to the other end of the first conductive carrier 3 and the other end of the second conductive carrier 51, so that a sealed air cavity can be formed between the spaced-apart first conductive carrier 3 and the second conductive carrier 51. A part of the upper heat insulator 71 and / or the lower heat insulator 72 can extend axially into the space between the first conductive carrier 3 and the second conductive carrier 51.

[0187] In one embodiment, please refer to Figures 13 - 22 The aerosol generating device further has a second semiconductor assembly 6. The second semiconductor assembly 6 includes an N-type semiconductor 61 and a P-type semiconductor 62. The N-type semiconductor 61 in the second semiconductor assembly 6 can be made of the same material as the N-type semiconductor 41 in the first semiconductor assembly 4, and the P-type semiconductor 62 in the second semiconductor assembly 6 can be made of the same material as the P-type semiconductor 42 in the first semiconductor assembly 4. The semiconductors in the second semiconductor assembly 6 can contain the same components as the corresponding semiconductors in the first semiconductor assembly 4, for example, they can both contain one or more of bismuth telluride, skutterudite, magnesium antimonide, lead telluride, etc.

[0188] The N-type semiconductor 61 in the second semiconductor assembly 6 is electrically connected to the positive electrode + of the power supply assembly 2, and the P-type semiconductor 62 in the second semiconductor assembly 6 is electrically connected to the negative electrode - of the power supply assembly 2. The electrical connection between the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor assembly 6 and the power supply assembly 2 can be a direct electrical connection or an indirect electrical connection. The N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor assembly 6 are electrically connected to each other.

[0189] In one embodiment, please refer to Figure 13, the first semiconductor component 4 and the second semiconductor component 6 are arranged axially offset in the aerosol-generating article 1. Based on this, the second semiconductor component 6 can be arranged between the first conductive carrier 3 and the second conductive carrier 51; the second semiconductor component 6 can be electrically connected to the first semiconductor component 4 on the same first conductive carrier 3; the second semiconductor component 6 can be electrically connected to the first semiconductor component 4 on the same second conductive carrier 51; the second semiconductor component 6 can be electrically connected to the first semiconductor component 4 to different first conductive carriers 3 respectively; the second semiconductor component 6 can be electrically connected to the first semiconductor component 4 to different second conductive carriers 51 respectively.

[0190] As an example, reference can be made to Figure 13 , the second semiconductor component 6 is connected in parallel with the first semiconductor component 4 between the first conductive carrier 3 and the second conductive carrier 51.

[0191] For example, the first conductive part 31 is simultaneously connected to the N-type semiconductor 41 in the first semiconductor component 4 and the N-type semiconductor 61 in the second semiconductor component 6, so that the N-type semiconductor 61 in the second semiconductor component 6 is directly electrically connected to the positive electrode + of the power supply component 2; the second conductive part 32 is simultaneously connected to the P-type semiconductor 42 in the first semiconductor component 4 and the P-type semiconductor 62 in the second semiconductor component 6, so that the P-type semiconductor 62 in the second semiconductor component 6 is directly electrically connected to the negative electrode - of the power supply component 2.

[0192] At the same time, the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 can be electrically connected to each other through the second conductive carrier 51; specifically, the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 and the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 can be electrically connected to the same third conductive part 511 or the same second conductive body; or, the third conductive part 511 or the second conductive body that electrically connects the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 and the third conductive part 511 or the second conductive body that electrically connects the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 are two different third conductive parts 511 or second conductive bodies.

[0193] As an example, reference can be made to Figures 14 - 17 , the second semiconductor component 6 is connected in series with the first semiconductor component 4 between the first conductive carrier 3 and the second conductive carrier 51.

[0194] For example, the P-type semiconductor 62 of the second semiconductor component 6 is electrically connected to the N-type semiconductor 41 in the first semiconductor component 4. Specifically, the first conductive carrier 3 has a first conductive portion 31, a second conductive portion 32, and one or more other conductive portions 35. The P-type semiconductor 62 of the second semiconductor component 6 is electrically connected to the N-type semiconductor 41 in the first semiconductor component 4 through one other conductive portion 35. The N-type semiconductor 61 of the second semiconductor component 6 is directly electrically connected to the first conductive portion 31 or indirectly electrically connected to the first conductive portion 31 through other semiconductor components. The P-type semiconductor 42 of the first semiconductor component 4 is directly electrically connected to the second conductive portion 32 or indirectly electrically connected to the second conductive portion 32 through other semiconductor components.

[0195] For example, the N-type semiconductor 61 of the second semiconductor component 6 is electrically connected to the P-type semiconductor 42 in the first semiconductor component 4. Specifically, the first conductive carrier 3 has a first conductive portion 31, a second conductive portion 32, and one or more other conductive portions 35. The N-type semiconductor 61 of the second semiconductor component 6 is electrically connected to the P-type semiconductor 42 in the first semiconductor component 4 through one other conductive portion 35. The P-type semiconductor 62 of the second semiconductor component 6 is directly electrically connected to the second conductive portion 32 or indirectly electrically connected to the second conductive portion 32 through other semiconductor components. The N-type semiconductor 41 of the first semiconductor component 4 is directly electrically connected to the first conductive portion 31 or indirectly electrically connected to the first conductive portion 31 through other semiconductor components.

[0196] As an example, there are a plurality of second semiconductor components 6 between the first conductive carrier 3 and the second conductive carrier 51, and the plurality of second semiconductor components 6 are connected in series. The way the plurality of second semiconductor components 6 are connected in series is the same as the way the plurality of first semiconductor components 4 are connected in series, which will not be elaborated here.

[0197] As an example, there are a plurality of second semiconductor components 6 between the first conductive carrier 3 and the second conductive carrier 51, and the plurality of second semiconductor components 6 are connected in parallel. The way the plurality of second semiconductor components 6 are connected in parallel is the same as the way the plurality of first semiconductor components 4 are connected in parallel, which will not be elaborated here.

[0198] As an example, there are a plurality of second semiconductor components 6 between the first conductive carrier 3 and the second conductive carrier 51, and some of the second semiconductor components 6 are connected in parallel while some are connected in series.

[0199] In one embodiment, reference may be made to Figures 20 - 22 , the first semiconductor component 4 and the second semiconductor component 6 are arranged offset in the radial direction of the aerosol generating article 1. The first semiconductor component 4 and the second semiconductor component 6 can form a cascade in the radial direction of the aerosol generating article 1, so that the heat of the ultimate heat providing end 5 can be gradually transferred or transferred to the first conductive carrier 3.

[0200] Specifically, reference may be made to Figures 20 - 22 that the aerosol generating device further includes a third conductive carrier 52. A fourth conductive portion 513 and a fifth conductive portion 514 are provided on the second conductive carrier 51. The N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are respectively connected to the fourth conductive portion 513 and the fifth conductive portion 514, and the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are electrically connected through the third conductive carrier 52. The positive electrode + in the power supply component 2 is electrically connected to the fourth conductive portion 513, and the negative electrode - is electrically connected to the fifth conductive portion 514. Thus, when the power supply component 2 outputs power through its positive electrode + and negative electrode -, the first semiconductor component 4 and the second semiconductor component 6 operate, and heat is gradually transferred or transferred from the third conductive carrier 52 to the first conductive carrier 3 through the second conductive carrier 52, so that the temperature gradually increases on the third conductive carrier 52, the second conductive carrier 51, and the first conductive carrier 3.

[0201] As an example, reference may be made to Figures 20 - 22 that in the radial direction of the aerosol generating article 1, the second conductive carrier 51 is disposed between the first conductive carrier 3 and the third conductive carrier 52. In the radial direction of the aerosol generating article 1, the second semiconductor component 6 is disposed between the second conductive carrier 51 and the third conductive carrier 52.

[0202] As an example, reference may be made to Figures 20 - 22 that one or more second clamping grooves 515 are provided on the second conductive carrier 51 and / or the third conductive carrier 52. The second clamping grooves 515 are used to fix the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6, so that the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 are kept connected to the second conductive carrier 51 and / or the third conductive carrier 52.

[0203] As an example, reference may be made to Figures 20 - 22 that the ends of the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 are embedded in the second clamping grooves 515.

[0204] As an example, reference may be made to Figures 20 - 22 that the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are fixed at different positions in the same second clamping groove 515; or the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are fixed in different second clamping grooves 515.

[0205] As an example, reference may be made to Figures 20 - 22When the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 are fixed in the second clamping groove 515, the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 remain electrically connected to the second conductive carrier 51, or the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 remain electrically connected to the third conductive carrier 52.

[0206] As an example, reference may be made to Figures 20 - 22 The second clamping groove 515 includes a second groove wall 5151 extending radially. The N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are spaced apart from each other along the circumferential direction of the aerosol generating article 1 by the second groove wall 5151.

[0207] It should be noted that the manner in which the N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 are connected to the second conductive carrier 51 and / or the third conductive carrier 52 through the second clamping groove 515 can be the same as the manner in which the N-type semiconductor 41 and / or the P-type semiconductor 42 in the first semiconductor component 4 are connected to the second conductive carrier 3 and / or the first conductive carrier 51 through the first clamping groove 34. The N-type semiconductor 61 and / or the P-type semiconductor 62 in the second semiconductor component 6 can be held with only one end embedded in the second clamping groove 515.

[0208] As an example, the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 are fixed to the second conductive carrier 51 and / or the third conductive carrier 52 at intervals by welding. Based on this, the second clamping groove 515 may not be provided on the second conductive carrier 51 and / or the third conductive carrier 52. For example, one end of the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 is fixed to the third conductive carrier 52 by welding, and the opposite end is embedded in the second clamping groove 515 on the second conductive carrier 51 for holding. Or for example, one end of the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 is fixed to the third conductive carrier 52 by welding, and the opposite end is fixed to the second conductive carrier 51 by welding. Or for example, one end of the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6 is held in the second clamping groove 515 on the third conductive carrier 52, and the opposite end is fixed to the third conductive carrier 52 by welding.

[0209] As an example, the second conductive carrier 51 includes a second conductive body, and the second conductive body constitutes one of the fourth conductive portion 513 or the fifth conductive portion 514.

[0210] For example, the second conductive carrier 51 further includes a second insulating layer 512. The second insulating layer 512 only covers a partial surface of the second conductive body. A part of the second conductive body exposed outside the second insulating layer 512 locally forms one of a fourth conductive portion 513 or a fifth conductive portion 514, and the other of the fourth conductive portion 513 or the fifth conductive portion 514 can be disposed on or formed on the second insulating layer 512. Thus, the fourth conductive portion 513 and the fifth conductive portion 514 are insulated from each other with a gap therebetween.

[0211] As an example, the second conductive carrier 51 includes a second conductive body. The fourth conductive portion 513 and the fifth conductive portion 514 are arranged on the second conductive body at intervals, and both are insulated and connected to the second conductive body.

[0212] For example, the second conductive carrier 51 further includes a second insulating layer 512. The second insulating layer 512 covers or is formed on the surface of the second conductive carrier. The fourth conductive portion 513 and the fifth conductive portion 514 are arranged on the second insulating layer 512 at intervals, so that the fourth conductive portion 513, the fifth conductive portion 514, and the second conductive body are insulated from each other with a gap therebetween in pairs.

[0213] Or for example, an insulating layer is provided on a partial surface of the fourth conductive portion 513 and / or the fifth conductive portion 514, and the fourth conductive portion 513 and / or the fifth conductive portion 514 are connected to the second conductive body through this insulating layer.

[0214] As an example, the second conductive carrier 51 includes a second insulating body. The fourth conductive portion 513 and the fifth conductive portion 514 are arranged on the second insulating body at intervals.

[0215] As an example, reference can be made to Figure 23 , the second conductive carrier 51 has a first side and a second side disposed opposite to each other. A third conductive portion 511 is provided on the first side, and the third conductive portion 511 is electrically connected to both the N-type semiconductor 41 and the P-type semiconductor 42 in the first semiconductor component 4 at the same time; the fourth conductive portion 513 and the fifth conductive portion 514 are provided on the second side. The first side of the second conductive carrier 51 can face the first conductive carrier 3, and the second side of the second conductive carrier 51 can face the third conductive carrier 52.

[0216] The fourth conductive portion 513, the fifth conductive portion 514, and the third conductive portion 511 can be located at different positions on the same second conductive carrier 51. One of the fourth conductive portion 513 or the fifth conductive portion 514 can be electrically connected to the third conductive portion 511, or one of the fourth conductive portion 513 and the fifth conductive portion 514 and the third conductive portion 511 can be simultaneously a constituent part of the second conductive body. The fourth conductive portion 513, the fifth conductive portion 514, and the third conductive portion 511 can be insulated from each other with a gap therebetween in pairs.

[0217] As an example, the material of the third conductive carrier 52 includes a material with good thermal conductivity.

[0218] As an example, the third conductive carrier 52 includes a third conductive body, and the third conductive body is electrically connected to the N-type semiconductor 61 and the P-type semiconductor 62 in the second semiconductor component 6.

[0219] As an example, the third conductive carrier 52 includes a third insulating body and a sixth conductive portion, the sixth conductive portion is disposed on the third insulating body, and the sixth conductive portion is connected to the N-type semiconductor 61 and the P-type semiconductor 62 of the second semiconductor component 6.

[0220] As an example, the third conductive carrier 52 includes a third conductive body, a third insulating layer, and a sixth conductive portion. The third insulating layer is disposed on or formed on the third conductive body, and the sixth conductive portion is disposed on or formed on the third insulating layer, so that the sixth conductive portion is insulated from the third conductive body at an interval. Wherein, the sixth conductive portion is connected to the N-type semiconductor 61 and the P-type semiconductor 62 of the second semiconductor component 6.

[0221] There may be multiple second semiconductor components 6.

[0222] In one embodiment, multiple second semiconductor components 6 may be connected in series with each other between the second conductive carrier 51 and the third conductive carrier 52, and the way of their series connection may be the same as the way of the series connection of the multiple first semiconductor components 4 between the first conductive carrier 3 and the second conductive carrier 51, which will not be elaborated here.

[0223] In one embodiment, multiple second semiconductor components 6 may be connected in parallel with each other between the second conductive carrier 51 and the third conductive carrier 52, and the way of their parallel connection may be the same as the way of the parallel connection of the multiple first semiconductor components 4 between the first conductive carrier 3 and the second conductive carrier 51.

[0224] For example, there may be multiple fourth conductive portions 513 and / or multiple fifth conductive portions 514 on the same second conductive carrier 51. Or, there may be multiple second conductive carriers 51, some of the second conductive carriers 51 have one or more fourth conductive portions 513, and some of the second conductive carriers 51 have one or more fifth conductive portions 514, so that there are multiple fourth conductive portions 513 or fifth conductive portions 514. At least two of the multiple fourth conductive portions 513 may be electrically connected to each other. At least two of the multiple fifth conductive portions 514 may be electrically connected to each other. Based on this, reference may be made to Figure 22, the fourth conductive part 513 or the fifth conductive part 514 includes a connection end 5141 and a plurality of interdigital electrodes 5142 extending from the connection end 5141. The connection end of the fourth conductive part is electrically connected to the positive electrode of the power supply component, and the plurality of interdigital electrodes of the fourth conductive part are respectively electrically connected to different N-type semiconductors 61. The connection end 5141 of the fifth conductive part 514 is electrically connected to the negative electrode of the power supply component 2, and the plurality of interdigital electrodes 5142 of the fifth conductive part 514 are respectively electrically connected to different P-type semiconductors 62.

[0225] In one embodiment, among the plurality of second semiconductor components 6, some of the second semiconductor components 6 are connected in series with each other between the second conductive carrier 51 and the third conductive carrier 52, and some of the second semiconductor components 6 are connected in parallel with each other between the second conductive carrier 51 and the third conductive carrier 52.

[0226] As an example, by arranging the conductive parts or conductive lines on the first conductive carrier 3, the second conductive carrier 51, and / or the third conductive carrier 52, one or more first semiconductor components 4 located between the first conductive carrier 3 and the second conductive carrier 51 are connected in series with one or more second semiconductor components 6 located between the third conductive carrier 52 and the second conductive carrier 51; or one or more first semiconductor components 4 located between the first conductive carrier 3 and the second conductive carrier 51 are connected in parallel with one or more second semiconductor components 6 located between the third conductive carrier 52 and the second conductive carrier 51; or some of the first semiconductor components 4 located between the first conductive carrier 3 and the second conductive carrier 51 are connected in series with one or more second semiconductor components 6 located between the third conductive carrier 52 and the second conductive carrier 51, and at the same time, some of the first semiconductor components 4 located between the first conductive carrier 3 and the second conductive carrier 51 are connected in parallel with one or more second semiconductor components 6 located between the third conductive carrier 52 and the second conductive carrier 51.

[0227] As an example, the plurality of second semiconductor components 6 located between the third conductive carrier 52 and the second conductive carrier 51 and the plurality of first semiconductor components 4 located between the first conductive carrier 3 and the second conductive carrier 51 have the same or different arrangement manners.

[0228] As an example, the temperature difference between the second conductive carrier 51 and the third conductive carrier 52 is greater than or equal to the temperature difference between the first conductive carrier 3 and the second conductive carrier 51. Or, the temperature difference between the second conductive carrier 51 and the third conductive carrier 52 is less than the temperature difference between the first conductive carrier 3 and the second conductive carrier 51.

[0229] As an example, reference may be made to Figures 20 - 22, the second conductive carrier 51 and the third conductive carrier 52 are spaced apart from each other, and there may be a sealed air cavity therebetween.

[0230] As an example, reference may be made to Figures 20 - 22 , the upper heat insulating member 71 covering the end of the first conductive carrier 3 extends radially along the aerosol generating article 1, so as to cover the end of the second conductive carrier 51 and connect to the third conductive carrier 52 or cover the end of the third conductive carrier 52.

[0231] The lower heat insulating member 72 covering the other end of the first conductive carrier 3 may extend radially along the aerosol generating article 1, so as to cover the other end of the second conductive carrier 51 and connect to the third conductive carrier 52 or cover the other end of the third conductive carrier 52.

[0232] The upper heat insulating member 71 is sealingly connected to the first conductive carrier 3, the second conductive carrier 51 and the third conductive carrier 52, and the lower heat insulating member 72 is sealingly connected to the first conductive carrier 3, the second conductive carrier 51 and the third conductive carrier 52, so that there is a sealed air cavity between the second conductive carrier 51 and the third conductive carrier 52, and there is a sealed air cavity between the second conductive carrier 51 and the first conductive carrier 3.

[0233] It should be noted that in other embodiments, a first upper heat insulating member may be used to cover the end of the first conductive carrier and connect to the end of the second conductive carrier, a first lower heat insulating member may be used to cover the other end of the first conductive carrier and connect to the other end of the second conductive carrier, and a sealed air cavity may be formed between the second conductive carrier and the first conductive carrier through the first upper heat insulating member and the first lower heat insulating member; then, a second upper heat insulating member may be used to cover the end of the second conductive carrier and connect to the end of the third conductive carrier, a second lower heat insulating member may be used to cover the other end of the second conductive carrier and connect to the other end of the third conductive carrier, and a sealed air cavity may be formed between the second conductive carrier and the third conductive carrier through the second upper heat insulating member and the second lower heat insulating member.

[0234] For any of the above embodiments, the current flowing through the first semiconductor component 4 and the current flowing through the second semiconductor component 6 may be the same in magnitude, or may be different in magnitude. For any of the above embodiments, the ability of the first semiconductor component 4 to transfer or transfer heat and the ability of the second semiconductor component 6 to transfer or transfer heat may be the same, or may be different.

[0235] For any of the above embodiments, the N-type semiconductor may be configured in a ring shape, a flat plate shape, a column shape, an arc shape or a fan shape. The shape of the N-type semiconductor may be substantially the same as the shape of the P-type semiconductor.

[0236] For any of the above embodiments, in the first semiconductor component 4, the distance between the N-type semiconductor electrically connected to one end of the first conductive carrier 3 and the one electrically connected to one end of the second conductive carrier 51 may be between 0.3 mm and 3 mm, for example, it may be about 0.8 mm; the size of the P-type semiconductor may be the same as that of the corresponding N-type semiconductor, and of course, it may also be different.

[0237] The size of the N-type semiconductor in the second semiconductor component 6 may be the same as that of the N-type semiconductor in the first semiconductor component 4, and of course, it may also be different; the size of the P-type semiconductor in the second semiconductor component 6 may be the same as that of the P-type semiconductor in the first semiconductor component 4, and of course, it may also be different.

[0238] For any of the above embodiments, the total number of semiconductor components between the first conductive carrier 3 and the second conductive carrier 51 may be 1 - 50, for example, it may be 16 - 36. The total number of semiconductor components between the second conductive carrier 51 and the third conductive carrier 52 may be 1 - 50, for example, it may be 16 - 36.

[0239] In some embodiments, a first semiconductor component 4 only has one N-type semiconductor 41 and one P-type semiconductor 42, and the N-type semiconductor 41 and the P-type semiconductor 42 in one first semiconductor component 4 are electrically connected to each other. In some other embodiments, a first semiconductor component has one N-type semiconductor and multiple P-type semiconductors, and the only one N-type semiconductor is electrically connected to multiple P-type semiconductors at the same time. In some other embodiments, a first semiconductor component has multiple N-type semiconductors and one P-type semiconductor, and the only one P-type semiconductor is electrically connected to multiple N-type semiconductors at the same time. In some other embodiments, the numbers of the N-type semiconductor and the P-type semiconductor in one first semiconductor component are different.

[0240] The above aerosol generating device includes a power supply component, a first conductive carrier having a first conductive portion and a second conductive portion, a first semiconductor component having an N-type semiconductor and a P-type semiconductor, and a second conductive carrier electrically connected to both the N-type semiconductor and the P-type semiconductor in the first semiconductor component. Among them, when the aerosol generating article is placed in the aerosol generating device, at least a part of the first conductive carrier is arranged outside the aerosol generating article or inserted into the inside of the aerosol generating article. The N-type semiconductor and the P-type semiconductor in the first semiconductor component are electrically connected to the first conductive portion and the second conductive portion respectively, and the first conductive portion and the second conductive portion are electrically connected to the positive electrode and the negative electrode of the power supply component respectively. Thus, when the power supply component outputs power through its positive electrode and negative electrode, the first semiconductor component can transfer at least part of the heat on the second conductive carrier to the first conductive carrier, so that the heat converges from the second conductive carrier to the first conductive carrier, and then heats the aerosol generating article through the first conductive carrier; this heating process is different from the situation where heat can only diffuse to the outside in the traditional heating method. In this solution, there is also heat transferred from the outside, and the first semiconductor component can directly heat the aerosol generating article, so the heat utilization rate of the entire module is greatly improved.

[0241] It should be noted that the description and drawings of the present application give preferred embodiments of the present application, but are not limited to the embodiments described in this specification. Further, for those of ordinary skill in the art, improvements or changes can be made according to the above description, and all such improvements and changes should fall within the protection scope of the appended claims of the present application.

Claims

1. An aerosol generating device, characterized in that, Comprising: A first conductive carrier, on which a first conductive portion and a second conductive portion are provided. When the aerosol-generating article is placed in the aerosol-generating device, at least a part of the first conductive carrier is arranged outside the aerosol-generating article or inserted into the interior of the aerosol-generating article; A first semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion; A second conductive carrier, electrically connecting the N-type semiconductor and the P-type semiconductor in the first semiconductor component; And A power supply component, whose positive electrode is electrically connected to the first conductive portion and whose negative electrode is electrically connected to the second conductive portion; Wherein, the first semiconductor component is configured to transfer at least part of the heat on the second conductive carrier to the first conductive carrier, so as to heat the aerosol-generating article through the first conductive carrier.

2. The aerosol generating device according to claim 1, wherein At least a part of the first conductive carrier is in direct contact with the aerosol-generating article; or The inner wall surface of the first conductive carrier defines at least part of the boundary of the accommodating cavity for accommodating at least a part of the aerosol-generating article.

3. The aerosol generating device according to claim 1, wherein The first conductive carrier includes a first conductive body, and the first conductive body constitutes one of the first conductive portion or the second conductive portion.

4. The aerosol generating device according to claim 3, wherein, The first conductive carrier includes a first insulating layer, and the first insulating layer is provided between the first conductive portion and the second conductive portion.

5. The aerosol generating device according to claim 1, characterized in that, The first conductive carrier includes a first conductive body, the first conductive portion and the second conductive portion are arranged on the first conductive body at intervals, and are both insulated and connected to the first conductive body.

6. The aerosol generating device according to claim 1, characterized in that, The first conductive carrier includes a first insulating body, and the first conductive portion and the second conductive portion are arranged on the first insulating body at intervals.

7. The aerosol generating device according to claim 1, characterized in that, The first conductive carrier includes a flexible circuit board, and part of the conductors in the flexible circuit board constitute the first conductive portion, and part of the conductors constitute the second conductive portion.

8. The aerosol generating device according to claim 1, wherein, The first conductive carrier includes a body, and the first conductive portion and / or the second conductive portion contact the surface of the body or are embedded in the body.

9. The aerosol generating device according to claim 1, wherein, One or more first clamping grooves are provided on the first conductive carrier and / or the second conductive carrier, and the first clamping grooves are used to fix the N-type semiconductor and / or the P-type semiconductor in the first semiconductor component.

10. The aerosol generating device according to claim 9, wherein The ends of the N-type semiconductor and / or the P-type semiconductor in the first semiconductor component are embedded in the first clamping grooves.

11. The aerosol generating device according to claim 9, wherein, The N-type semiconductor and the P-type semiconductor in the first semiconductor component are fixed at different positions in the same first clamping groove; or The N-type semiconductor and the P-type semiconductor in the first semiconductor component are fixed in different first clamping grooves.

12. The aerosol generating device according to claim 9, characterized in that, When the N-type semiconductor and / or the P-type semiconductor in the first semiconductor component are fixed in the first clamping grooves, the N-type semiconductor and / or the P-type semiconductor in the first semiconductor component remain electrically connected to the first conductive carrier, or the N-type semiconductor and / or the P-type semiconductor in the first semiconductor component remain electrically connected to the second conductive carrier.

13. The aerosol generating device according to claim 9, characterized in that, The first clamping groove includes a first groove wall extending radially, and the N-type semiconductor and the P-type semiconductor in the first semiconductor component are spaced apart along the circumferential direction of the aerosol generating article through the first groove wall.

14. The aerosol generating device according to claim 1, wherein The N-type semiconductor and the P-type semiconductor in the first semiconductor component are fixedly spaced apart from each other on the first conductive carrier and / or the second conductive carrier by welding.

15. The aerosol generating device according to claim 1, wherein, The material of the first conductive carrier and / or the second conductive carrier includes metal, graphite, graphene, diamond, silicon carbide, aluminum nitride or a thermally conductive polymer; or The thermal conductivity of the material of the first conductive carrier and / or the second conductive carrier is greater than or equal to 10 W / (m·k).

16. The aerosol generating device according to claim 1, characterized in that, The surface of the first conductive carrier facing the aerosol generating article is rough; or The surface of the second conductive carrier facing away from the aerosol generating article is rough.

17. The aerosol generating device according to claim 16, wherein, The surface roughness Ra1 of the surface of the first conductive carrier facing the aerosol generating article satisfies: 0.4 μm ≤ Ra1 ≤ 10 μm; or The surface roughness Ra2 of the surface of the second conductive carrier facing away from the aerosol generating article satisfies: 0.4 μm ≤ Ra2 ≤ 10 μm.

18. The aerosol generating device according to claim 1, characterized in that, The second conductive carrier includes a second conductive body, and the second conductive body is electrically connected to the N-type semiconductor and the P-type semiconductor in the first semiconductor component.

19. The aerosol generating device according to claim 1, wherein, The second conductive carrier includes a second conductive body, a second insulating layer and a third conductive part, the second insulating layer is arranged between the second conductive body and the third conductive part, and the third conductive part is electrically connected to the N-type semiconductor and the P-type semiconductor of the first semiconductor component; or The second conductive carrier includes a second insulating body and a third conductive part, the third conductive part is arranged on the second insulating body, and the third conductive part is electrically connected to the N-type semiconductor and the P-type semiconductor of the first semiconductor component.

20. The aerosol generating device according to claim 1, characterized in that, The second conductive carrier includes a flexible circuit board, and the N-type semiconductor and the P-type semiconductor of the first semiconductor component are electrically connected to the flexible circuit board.

21. The aerosol generating device according to claim 1, wherein, At least a part of the second conductive carrier forms the housing of the aerosol generating device; or The second conductive carrier is in direct contact with the housing of the aerosol generating device or in indirect contact through a heat conducting member.

22. The aerosol generating device according to claim 1, wherein, There is a structural member in the aerosol generating device, and at least a part of the second conductive carrier forms the structural member; or The second conductive carrier is in direct contact or indirect contact with the structural member.

23. The aerosol generating device according to claim 1, characterized in that, The aerosol generating device further includes a second semiconductor component, the second semiconductor component includes an N-type semiconductor electrically connected to the positive electrode of the power supply component and a P-type semiconductor electrically connected to the negative electrode of the power supply component, and the N-type semiconductor and the P-type semiconductor in the second semiconductor component are electrically connected.

24. The aerosol generating device according to claim 23, characterized in that, The first conductive part is simultaneously connected to the N-type semiconductor in the first semiconductor component and the N-type semiconductor in the second semiconductor component.

25. The aerosol generating device according to claim 23, wherein The second conductive part is simultaneously connected to the P-type semiconductor in the first semiconductor component and the P-type semiconductor in the second semiconductor component.

26. The aerosol generating device according to claim 23, wherein, The P-type semiconductor of the second semiconductor component is electrically connected to the N-type semiconductor in the first semiconductor component, or the N-type semiconductor of the second semiconductor component is electrically connected to the P-type semiconductor in the first semiconductor component.

27. The aerosol generating device according to claim 23, characterized in that, The first semiconductor component and the second semiconductor component are arranged offset in the axial direction of the aerosol-generating article.

28. The aerosol generating device according to claim 23, wherein, The first semiconductor component and the second semiconductor component are arranged offset in the radial direction of the aerosol-generating article.

29. The aerosol generating device according to claim 28, wherein, The aerosol-generating device further includes a third conductive carrier, and a fourth conductive portion and a fifth conductive portion are provided on the second conductive carrier; The N-type semiconductor and the P-type semiconductor in the second semiconductor component are respectively connected to the fourth conductive portion and the fifth conductive portion, and the N-type semiconductor and the P-type semiconductor in the second semiconductor component are electrically connected through the third conductive carrier; The positive electrode in the power supply component is electrically connected to the fourth conductive portion, and the negative electrode is electrically connected to the fifth conductive portion.

30. The aerosol generating device according to claim 28, wherein In the radial direction of the aerosol-generating article, the second conductive carrier is arranged between the first conductive carrier and the third conductive carrier.

31. The aerosol generating device according to claim 29, wherein, One or more second clamping grooves are provided on the second conductive carrier and / or the third conductive carrier, and the second clamping grooves are used to fix the N-type semiconductor and / or the P-type semiconductor in the second semiconductor component.

32. The aerosol generating device according to claim 31, characterized in that, The ends of the N-type semiconductor and / or the P-type semiconductor in the second semiconductor component are embedded in the second clamping grooves.

33. The aerosol generating device according to claim 31, characterized in that, The N-type semiconductor and the P-type semiconductor in the second semiconductor component are fixed at different positions in the same second clamping groove; or The N-type semiconductor and the P-type semiconductor in the second semiconductor component are fixed in different second clamping grooves.

34. The aerosol generating device according to claim 31, wherein, When the N-type semiconductor and / or the P-type semiconductor in the second semiconductor component are fixed in the second clamping groove, the N-type semiconductor and / or the P-type semiconductor in the second semiconductor component remain electrically connected to the second conductive carrier, or the N-type semiconductor and / or the P-type semiconductor in the second semiconductor component remain electrically connected to the third conductive carrier.

35. The aerosol generating device according to claim 31, wherein, The second clamping groove includes a second groove wall extending radially, and the N-type semiconductor and the P-type semiconductor in the second semiconductor component are arranged at intervals along the circumferential direction of the aerosol-generating article through the second groove wall.

36. The aerosol generating device according to claim 31, wherein, The N-type semiconductor and the P-type semiconductor in the second semiconductor component are fixed to the second conductive carrier and / or the third conductive carrier at intervals by welding.

37. The aerosol generating device according to claim 29, wherein, The material of the third conductive carrier includes metal, graphite, graphene, diamond, silicon carbide, aluminum nitride or a thermally conductive polymer; or The thermal conductivity of the material of the third conductive carrier is greater than or equal to 10 W / (m·k).

38. The aerosol generating device according to claim 29, wherein, The surface of the second conductive carrier facing the aerosol-generating article is rough; or The surface of the third conductive carrier facing away from the aerosol-generating article is rough.

39. The aerosol generating device according to claim 29, wherein, The surface roughness Ra3 of the surface of the second conductive carrier facing the aerosol-generating article satisfies: 0.4 μm ≤ Ra3 ≤ 10 μm; or The roughness Ra4 of the surface of the third conductive carrier facing away from the aerosol generating article satisfies: 0.4 μm≤Ra4≤10 μm.

40. The aerosol generating device according to claim 29, wherein, The third conductive carrier comprises a third conductive body, and the third conductive body electrically connects the N-type semiconductor and the P-type semiconductor in the second semiconductor component; or The third conductive carrier includes a third insulating body and a sixth conductive portion, wherein the sixth conductive portion is disposed on the third insulating body and connects the N-type semiconductor and the P-type semiconductor of the second semiconductor component.

41. The aerosol generating device according to claim 29, wherein, At least part of the third conductive carrier forms a housing of the aerosol generating device; or The third conductive carrier is in direct contact with the housing of the aerosol generating device or is in indirect contact with the housing through a heat conducting member; or The aerosol generating device has a structural component therein, and at least a portion of the third conductive carrier forms the structural component; or The aerosol generating device has a structural component therein, and the third conductive carrier is in direct or indirect contact with the structural component.

42. The aerosol generating device according to claim 28, characterized in that, The second conductive carrier includes a second conductive body, and the second conductive body constitutes one of the fourth conductive portion or the fifth conductive portion.

43. The aerosol generating device according to claim 42, characterized in that, The second conductive carrier includes a second insulating layer disposed between the fourth conductive portion and the fifth conductive portion.

44. The aerosol generating device according to claim 28, characterized in that, The second conductive carrier includes a second conductive body, and the fourth conductive portion and the fifth conductive portion are arranged on the second conductive body at intervals and are both insulated and connected to the second conductive body.

45. The aerosol generating device according to claim 28, characterized in that, The second conductive carrier includes a second insulating body, and the fourth conductive portion and the fifth conductive portion are arranged on the second insulating body at intervals.

46. The aerosol generating device according to claim 28, characterized in that, The second conductive carrier has a first side and a second side disposed opposite to each other, the first side has a third conductive portion, and the third conductive portion is electrically connected to both the N-type semiconductor and the P-type semiconductor in the first semiconductor component; The fourth conductive portion and the fifth conductive portion are disposed on the second side.

47. The aerosol generating device according to claim 46, characterized in that, One of the fourth conductive portion or the third conductive portion is electrically connected to the third conductive portion.

48. The aerosol generating device according to claim 1, wherein, The first semiconductor components include a plurality of N-type semiconductors in the plurality of the first semiconductor components and a plurality of P-type semiconductors in the plurality of the first semiconductor components are alternately arranged in a ring shape; or The first conductive carrier has a plurality of first conductive parts and a plurality of second conductive parts, and the plurality of first conductive parts and the plurality of second conductive parts are alternately arranged and arranged in a ring shape; or The first conductive portion or the second conductive portion includes a connecting end and a plurality of interdigital electrodes extending from the connecting end.

49. The aerosol generating device according to claim 1, characterized in that, There are a plurality of the first semiconductor components, the N-type semiconductors in the plurality of the first semiconductor components are arranged in a ring shape, the P-type semiconductors in the plurality of the first semiconductor components are arranged in a ring shape, and the ring shape in which the N-type semiconductors are arranged and the ring shape in which the P-type semiconductors are arranged are staggered in the axial direction of the aerosol generating article; or The first conductive carrier has a plurality of first conductive portions and a plurality of second conductive portions. The plurality of first conductive portions are arranged in a ring shape, and the plurality of second conductive portions are arranged in a ring shape. The rings formed by the arrangement of the first conductive portions and the rings formed by the arrangement of the second conductive portions are offset in the axial direction of the aerosol-generating article.

50. The aerosol generating device according to claim 1, characterized in that, At least a part of the first conductive carrier is configured to be tubular, at least a part of the second conductive carrier is configured to be tubular, the second conductive carrier is disposed outside the first conductive carrier, and the first semiconductor assembly is located between the first conductive carrier and the second conductive carrier.

51. The aerosol generating device according to claim 1, wherein, The aerosol-generating device includes an upper heat-insulating member and / or a lower heat-insulating member; The upper heat-insulating member covers one end of the first conductive carrier, and the lower heat-insulating member covers the other end of the first conductive carrier.

52. The aerosol generating device according to claim 1, characterized in that, The first conductive carrier and the second conductive carrier are spaced apart, and there is a sealed air cavity between the first conductive carrier and the second conductive carrier.

53. The aerosol generating device according to claim 1, characterized in that, After the power supply assembly outputs power through its positive and negative electrodes, the temperature of the second conductive carrier first gradually decreases and then gradually increases.

54. The aerosol generating device according to claim 53, characterized in that, After the power supply assembly outputs power through its positive and negative electrodes, the lowest temperature of the second conductive carrier is lower than the ambient temperature.

55. The aerosol generating device according to claim 1, characterized in that, After the power supply assembly outputs power through its positive and negative electrodes, the first conductive carrier continuously heats up.

56. The aerosol generating device according to claim 1, characterized in that, After the power supply assembly outputs power through its positive and negative electrodes, the temperature difference between the first conductive carrier and the second conductive carrier remains basically unchanged.

57. The aerosol generating device according to claim 1, characterized in that, The heat absorption area of the second conductive carrier is larger than the heat release area of the first conductive carrier.

58. The aerosol generating device according to claim 1, wherein, A temperature detector is connected to the first conductive carrier and / or the second conductive carrier.

59. The aerosol generating device according to any one of claims 1 to 58, characterized in that, Both the N-type semiconductor and the P-type semiconductor are configured to be ring-shaped, flat-plate-shaped, column-shaped, arc-shaped or fan-shaped.

60. An aerosol generating device, characterized in that, Comprising: A first conductive carrier, on which a first conductive portion and a second conductive portion are provided. When the aerosol-generating article is placed in the aerosol-generating device, at least a part of the first conductive carrier is arranged outside the aerosol-generating article or inserted into the aerosol-generating article; A first semiconductor assembly, including an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion; A second conductive carrier, electrically connected to the N-type semiconductor and the P-type semiconductor in the first semiconductor assembly; and A power supply assembly, whose positive electrode is electrically connected to the first conductive portion and whose negative electrode is electrically connected to the second conductive portion; Wherein, after the power supply assembly outputs power through its positive and negative electrodes, the temperature of the second conductive carrier first gradually decreases and then gradually increases.

61. An aerosol generating device, characterized in that, Comprising: A housing; A heat receiving end, on which a positive conductive portion and a negative conductive portion are provided; A semiconductor assembly, including an N-type semiconductor electrically connected to the positive conductive portion and a P-type semiconductor electrically connected to the negative conductive portion; A heat providing end, electrically connected to the N-type semiconductor and the P-type semiconductor in the semiconductor assembly, and the heat providing end is disposed between the housing and the heat receiving end; And A power supply assembly, whose positive electrode is electrically connected to the positive conductive portion and whose negative electrode is electrically connected to the negative conductive portion; Wherein, during at least part of the period after the power supply component outputs power through its positive and negative electrodes, the temperature of the heat providing end is lower than the temperature of the heat receiving end, and the temperature of the heat providing end is lower than the temperature of the housing.

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