Implantable medical device and processing method of implantable medical device

Abstract

The invention provides implantable medical equipment and a processing method of the implantable medical equipment. The implantable medical equipment comprises a shell, a heat source, a first heat conduction coating and a functional coating, the first heat conduction coating and the functional coating are respectively coated outside the shell; the shell is used for being implanted between a first target object and a second target object, and the heat dissipation capacity of the first target object is higher than that of the second target object; the heat source is located on the side, facing the second target object, of the shell; the first heat conduction coating is located on the side, facing the first target object, of the shell, and the functional coating wraps the area, except the area covered by the first heat conduction coating, of the shell; the functional coating is configured to conduct heat generated by the heat source to the first heat conduction coating and / or delay conduction of the heat generated by the heat source to the second target object.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and particularly to an implantable medical device and a processing method thereof. Background Art

[0002] Implantable medical devices can be used to monitor the condition of patients and provide treatment. Implantable medical devices include rechargeable power sources, which can extend the service life of the medical device to weeks, months or even years compared with non-rechargeable devices. The rechargeable power sources of some implantable medical devices can be charged by an external charging device. Since the rechargeable power source is implanted into the body together with the implantable medical device, and the external charging device is located outside the body, this charging process is called transcutaneous energy transfer. In some embodiments, transcutaneous energy transfer can be achieved through inductive coupling between a transmitting coil in the external charging device and a receiving coil in the implantable medical device. With such a configuration, the external charging device can charge without physically connecting to the rechargeable power source in the implantable medical device.

[0003] However, the method of achieving transcutaneous energy transfer through coil inductive coupling will generate a certain amount of heat. Since the implantable medical device is adjacent to the tissue, it may cause harm to the patient when the surface temperature of the implantable medical device rises. Summary of the Invention

[0004] The purpose of the present invention is to provide an implantable medical device and a processing method thereof to solve the problem that harm may be caused when the surface temperature of the implantable medical device rises.

[0005] To solve the above technical problems, the present invention provides an implantable medical device, which includes: a housing, a heat source, a first heat-conducting coating, and a functional coating; the first heat-conducting coating and the functional coating are respectively coated outside the housing;

[0006] The housing is used to be implanted between a first target object and a second target object, where the heat dissipation ability of the first target object is higher than that of the second target object; the heat source is located on the side of the housing facing the second target object; the first heat-conducting coating is located on the side of the housing facing the first target object, and the functional coating covers the area of the housing except the area covered by the first heat-conducting coating;

[0007] The functional coating is configured to conduct the heat generated by the heat source to the first heat-conducting coating and / or delay the heat generated by the heat source from being conducted to the second target object.

[0008] Optionally, the functional coating includes a second heat-conducting coating; the heat-conducting coefficient of the first heat-conducting coating is 1 W / (m·K) to 3 W / (m·K); the heat-conducting coefficient of the second heat-conducting coating is 1 W / (m·K) to 3 W / (m·K).

[0009] Optionally, the functional coating includes a heat-insulating coating.

[0010] Optionally, the heat-conducting coefficient of the heat-insulating coating is not greater than 0.2 W / (m·K).

[0011] Optionally, the functional coating includes a heat-insulating coating and a heat-storing coating; the heat-storing coating is located on the side of the housing facing the second target object and at least covers the heat source; the heat-insulating coating covers the area of the housing except for the areas covered by the first heat-conducting coating and the heat-storing coating.

[0012] Optionally, the heat-conducting coefficient of the heat-insulating coating is not greater than 0.2 W / (m·K); the specific heat capacity of the heat-storing coating is 0.6 J / (g·°C) to 0.9 J / (g·°C), and the heat-conducting coefficient of the heat-storing coating is less than 1 W / (m·K).

[0013] Optionally, the housing is a metal housing.

[0014] To solve the above technical problems, the present invention also provides a processing method for an implantable medical device, which includes:

[0015] Depositing a heat-insulating coating material on the outer surface of the housing through a chemical vapor deposition process to form a heat-insulating coating;

[0016] Removing the heat-insulating coating corresponding to the functional area of the housing through a laser etching process to expose the part of the housing corresponding to the functional area;

[0017] Covering a mask corresponding to the functional area on the heat-insulating coating;

[0018] Spraying a heat-conducting coating material or a heat-storing coating material on the part of the housing corresponding to the functional area through an ultrasonic spraying process to form a first heat-conducting coating or a heat-storing coating;

[0019] Removing the mask.

[0020] Optionally, before depositing the heat-insulating coating material on the outer surface of the housing through a chemical vapor deposition process to form a heat-insulating coating, the processing method for the implantable medical device further includes treating the outer surface of the housing through a plasma treatment process.

[0021] Optionally, the functional area includes a heat-conducting area and a heat-storing area located on opposite sides of the housing; the processing method for the implantable medical device further includes:

[0022] After covering a mask corresponding to the heat conduction region on the heat insulation coating, a heat conduction coating material is sprayed on the part of the housing corresponding to the heat conduction region through an ultrasonic spraying process to form the first heat conduction coating; and

[0023] After covering a mask corresponding to the heat storage region on the heat insulation coating, a heat storage coating material is sprayed on the part of the housing corresponding to the heat storage region through an ultrasonic spraying process to form the heat storage coating.

[0024] In summary, in the implantable medical device and the processing method of the implantable medical device provided by the present invention, the implantable medical device includes a housing, a heat source, a first heat conduction coating, and a functional coating; the first heat conduction coating and the functional coating are respectively coated outside the housing; the housing is used for being implanted between a first target object and a second target object, wherein the heat dissipation ability of the first target object is higher than that of the second target object; the heat source is located on one side of the housing facing the second target object; the first heat conduction coating is located on one side of the housing facing the first target object, and the functional coating covers the region of the housing except for the region covered by the first heat conduction coating; the functional coating is configured to conduct the heat generated by the heat source to the first heat conduction coating and / or delay the heat generated by the heat source from being conducted to the second target object.

[0025] With such a configuration, through the setting of the functional coating, the heat source can form a heat conduction path with both the first target object and the second target object at the same time, and the heat can be distributed more evenly on the outer surface of the entire implantable medical device, avoiding local heat accumulation; in addition, through the setting of the functional coating, the heat generated by the heat source can also be conducted to the first heat conduction coating, and then conducted to the first target object with a higher heat dissipation ability, effectively utilizing the higher heat dissipation ability of the first target object for heat dissipation, delaying and reducing the heat generated by the heat source from being conducted to the second target object with a lower heat dissipation ability, so as to reduce the harm caused by heat accumulation in the second target object. Description of the Drawings

[0026] Those of ordinary skill in the art will understand that the provided drawings are used to better understand the present invention and do not constitute any limitation to the scope of the present invention. Among them:

[0027] Figure 1 is a schematic diagram of the application scenario of the implantable medical device according to an embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of the first preferred example of the implantable medical device according to an embodiment of the present invention;

[0029] Figure 3 It is a schematic diagram of the second preferred example of the implantable medical device according to an embodiment of the present invention;

[0030] Figure 4 It is a schematic diagram of the third preferred example of the implantable medical device according to an embodiment of the present invention;

[0031] Figure 5 It is a schematic diagram of providing a housing in the manufacturing method of the implantable medical device according to an embodiment of the present invention;

[0032] Figure 6 It is a schematic diagram after coating a heat insulation coating on the housing in the manufacturing method of the implantable medical device according to an embodiment of the present invention;

[0033] Figure 7 It is a schematic diagram of laser etching to expose the functional area in the manufacturing method of the implantable medical device according to an embodiment of the present invention;

[0034] Figure 8 It is a schematic diagram of covering a mask on the heat insulation coating in the manufacturing method of the implantable medical device according to an embodiment of the present invention;

[0035] Figure 9 It is a schematic diagram of ultrasonic spraying to form a first heat conductive coating or a heat storage coating in the manufacturing method of the implantable medical device according to an embodiment of the present invention;

[0036] Figure 10 It is a schematic diagram after removing the mask in the manufacturing method of the implantable medical device according to an embodiment of the present invention.

[0037] In the drawings:

[0038] 11 - Implantable medical device; 12 - Lead wire; 13 - Implant electrode; 14 - External charging device; 140 - Transmitting coil; 21 - First target object; 22 - Second target object; 30 - Housing; 31 - Heat source; 40 - First heat conductive coating; 50 - Functional coating; 51 - Second heat conductive coating; 52 - Heat insulation coating; 53 - Heat storage coating; 60 - Mask. Detailed implementation manners

[0039] To make the objectives, advantages and features of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that the drawings are all in very simplified forms and not drawn to scale, and are only used to facilitate and clearly assist in explaining the objectives of the embodiments of the present invention. In addition, the structures shown in the drawings are often a part of the actual structures. In particular, the emphases to be shown in each drawing are different, and sometimes different scales are used.

[0040] As used in the present invention, the singular forms "a", "an", "one" and "the" include plural referents, the term "or" is generally used in the sense of including "and / or", the term "several" is generally used in the sense of including "at least one", the term "at least two" is generally used in the sense of including "two or more", in addition, the terms "first", "second", "third" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. "One end" and "the other end", as well as "proximal end" and "distal end" generally refer to two corresponding parts, which include not only the endpoints. In addition, as used in the present invention, "mounted", "connected", "coupled", an element "disposed" on another element should be understood in a broad sense, generally only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the two elements can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate element, rather than being construed as indicating or implying the spatial position relationship between the two elements, that is, an element can be in any position such as inside, outside, above, below or on one side of another element, unless otherwise expressly specified. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upward direction facing the top of the corresponding figure and the downward or downward direction facing the bottom of the corresponding figure.

[0041] The object of the present invention is to provide an implantable medical device and a processing method thereof to solve the problem that harm may be caused when the surface temperature of the implantable medical device rises. The following is described with reference to the accompanying drawings.

[0042] Please refer to Figure 1 , which shows an application scenario of an implantable medical device. The implantable medical device 11 is, for example, an implantable nerve stimulator, which extends and is connected to an implant electrode 13 on a patient's head through a lead 12 and is used to perform nerve stimulation treatment on the patient through the implant electrode 13. Its application scenario can be used, for example, to relieve other symptoms such as Parkinson's disease or chronic pain. The implant electrode 13 can enter the target tissue for electrical stimulation such as the brain, spinal cord or dorsal root through a suitable site, so as to achieve an effective treatment effect. Further, a rechargeable power source (not shown, for example, a rechargeable battery) and a receiving coil (not shown) are built into the implantable medical device 11. It can be understood that the rechargeable power source of the implantable medical device 11 can be wirelessly charged through the transmitting coil 140 of the external charging device 14. It should be noted that Figure 1The illustrated implantable medical device 11 is only an example of an application scenario and is not a limitation on the implantable medical device 11. The implantable medical device 11 is not limited to being an implantable nerve stimulator. In some other embodiments, the implantable medical device 11 can also be other types of medical devices.

[0043] Please refer to Figure 2 , which shows a demonstration example of the implantation environment of the implantable medical device 11. After the implantable medical device 11 is implanted, one side is adjacent to the first target object 21, and the other side is adjacent to the second target object 22, and the characteristics of the first target object 21 and the second target object 22 are often different. In a preferred example, the implantable medical device 11 is configured to be flat. The first target object 21 adjacent to its inner side (relative to the human body) is muscle tissue, and the second target object 22 adjacent to its outer side (relative to the human body) is adipose tissue. Relatively speaking, the muscle tissue of the first target object 21 has a relatively high thermal conductivity coefficient by itself, and because blood vessels are distributed inside it, the blood flow in the blood vessels can further improve the heat dissipation ability of the muscle tissue. While the adipose tissue of the second target object 22 has a relatively low thermal conductivity coefficient by itself, and heat is likely to accumulate, resulting in a risk of scalding. Further, considering the transmission efficiency of wireless charging, the receiving coil of the implantable medical device 11 is often arranged at a position close to the outer side, that is, the heat source is close to the adipose tissue of the second target object 22. Due to the relatively low heat dissipation ability of the adipose tissue of the second target object 22, heat is more likely to locally accumulate on the side of the second target object 22, which further increases the risk of scalding.

[0044] Based on the above research, an embodiment of the present invention provides an implantable medical device 11, which includes: a housing 30, a heat source 31, a first heat-conducting coating 40, and a functional coating 50; the first heat-conducting coating 40 and the functional coating 50 are respectively coated outside the housing 30; the housing 30 is used to be implanted between a first target object 21 and a second target object 22, wherein the heat dissipation capacity of the first target object 21 is higher than that of the second target object 22; the heat source 31 is located on the side of the housing 30 facing the second target object 22; the first heat-conducting coating 40 is located on the side of the housing 30 facing the first target object 21, and the functional coating 50 covers the area of the housing 30 except the area covered by the first heat-conducting coating 40; the functional coating 50 is configured to conduct the heat generated by the heat source 31 to the first heat-conducting coating 40 and / or delay the heat generated by the heat source 31 from being conducted to the second target object 22. It should be noted that the heat source 31 here may include, for example, the receiving coil of the implantable medical device 11, or other electronic components (such as built-in chips) inside the implantable medical device 11. The heat source 31 may be in close contact with the housing 30 or may be spaced apart from the housing 30 by a certain distance. This embodiment is not limited thereto.

[0045] With such a configuration, through the setting of the functional coating 50, the heat source 31 can form a heat conduction path with both the first target object 21 and the second target object 22 at the same time, and the heat can be more evenly distributed on the outer surface of the entire implantable medical device 11, avoiding local heat accumulation; in addition, through the setting of the functional coating 50, the heat generated by the heat source 31 can also be conducted to the first heat-conducting coating 40, and then conducted to the first target object 21 with a higher heat dissipation capacity, effectively utilizing the higher heat dissipation capacity of the first target object 21 for heat dissipation, delaying and reducing the heat generated by the heat source 31 from being conducted to the second target object 22 with a lower heat dissipation capacity, so as to reduce the harm caused by heat accumulation in the second target object 22.

[0046] Please continue to refer to Figure 2 , in one embodiment, the functional coating 50 includes a second heat-conducting coating 51, which covers the area of the housing 30 except the area covered by the first heat-conducting coating 40, that is to say, the entire outer surface of the housing 30 is covered by the first heat-conducting coating 40 and the second heat-conducting coating 51. With such a configuration, the first heat-conducting coating 40 and the second heat-conducting coating 51 form a continuous heat conduction path, and the heat generated by the heat source 31 can be absorbed and conducted by the first heat-conducting coating 40 and the second heat-conducting coating 51 and evenly distributed. The setting of the first heat-conducting coating 40 and the second heat-conducting coating 51 avoids the direct contact between the heat source 31 and the second target object 22 through the housing 30 and reduces heat accumulation.

[0047] Due to the good heat conduction characteristics of the first heat conduction coating 40 and the second heat conduction coating 51, the heat generated by the heat source 31 can be evenly distributed over the surfaces of the entire first heat conduction coating 40 and the second heat conduction coating 51, further reducing the surface temperature of the housing 30. At the same time, the surfaces of the first heat conduction coating 40 and the second heat conduction coating 51 are in full contact with human tissues (including the first target object 21 and the second target object 22). In particular, a good heat conduction link can be established with the first target object 21, taking advantage of the good heat dissipation ability of the first target object 21 to dissipate the heat to the human body, without causing a significant increase in the temperature of the tissues around the implantable medical device 11, achieving the purpose of reducing the highest surface temperature of the implantable medical device 11 and reducing the risk of being charged and thermally burned. Of course, at this time, since the second heat conduction coating 51 is in contact with the second target object 22, although the heat dissipation ability of the second target object 22 is not strong, a small part of the heat can still be dissipated using the second target object 22.

[0048] Optionally, the thermal conductivity of the first heat conduction coating 40 is 1 W / (m·K) to 3 W / (m·K); the thermal conductivity of the second heat conduction coating 51 is 1 W / (m·K) to 3 W / (m·K). Optionally, the first heat conduction coating 40 and the second heat conduction coating 51 have a relatively high specific heat capacity, such that the first heat conduction coating 40 and the second heat conduction coating 51 will not cause a significant increase in temperature after absorbing heat. Combining with the relatively high thermal conductivity, the heat can be evenly distributed over the entire first heat conduction coating 40 and the second heat conduction coating 51 more quickly, and then conducted to the first target object 21. Preferably, the specific heat capacity of the first heat conduction coating 40 is 0.6 J / (g·°C) to 0.9 J / (g·°C); the specific heat capacity of the second heat conduction coating 51 is 0.6 J / (g·°C) to 0.9 J / (g·°C).

[0049] Furthermore, the housing 30 is a metal housing with a thickness of 0.2 mm to 0.3 mm. Adapted to the thickness of the housing 30, the thicknesses of the first heat conduction coating 40 and the second heat conduction coating 51 are not less than 20 μm. It should be noted that here the housing 30 is a metal housing, but the housing 30 should be regarded as part of the heat source 31. Although the housing 30 itself has a relatively high heat conduction ability, it should be regarded as part of the object of the heat source 31 to be protected. Therefore, using the first heat conduction coating 40 and the second heat conduction coating 51 to cover the entire housing 30 is equivalent to first isolating the heat source 31 from human tissues, and then using the relatively high heat conduction ability and relatively high specific heat capacity of the first heat conduction coating 40 and the second heat conduction coating 51 to evenly distribute the heat and keep the temperature of the entire outer surface of the implantable medical device 11 relatively uniform, and then conduct it to the first target object 21.

[0050] In an exemplary embodiment, the first heat-conducting coating 40 and the second heat-conducting coating 51 can be integrally formed, and they can be exactly the same in terms of material and coating thickness. Of course, in some other embodiments, the first heat-conducting coating 40 and the second heat-conducting coating 51 can also be different in terms of material and coating thickness, and they can also be separately coated and formed. Optionally, the materials of the first heat-conducting coating 40 and the second heat-conducting coating 51 can be, for example, Teflon, PEEK, or bioceramics, etc. The first heat-conducting coating 40 and the second heat-conducting coating 51 can be coated on the outer surface of the housing 30 by, for example, an ultrasonic spraying process.

[0051] Please refer to Figure 3 , in another embodiment, the functional coating 50 includes a heat-insulating coating 52 that covers the area of the housing 30 except for the area covered by the first heat-conducting coating 40.

[0052] With such a configuration, on the one hand, the housing 30 forms a heat-conducting path with the first target object 21 through the first heat-conducting coating 40, which is equivalent to conducting the heat generated by the heat source 31 to the first heat-conducting coating 40. On the other hand, the area of the housing 30 except for the area covered by the first heat-conducting coating 40 is covered by the heat-insulating coating 52, and the heat generated by the heat source 31 is blocked by the heat-insulating coating 52 and can only be guided to the first heat-conducting coating 40 through the housing 30, which is equivalent to hindering or delaying the heat conduction from the heat source 31 to the second target object 22 and reducing the risk of the second target object 22 being scalded by the heat source 31.

[0053] In Figure 3 the illustrated embodiment, the material, structure, and function of the first heat-conducting coating 40 can refer to Figure 2 the illustrated embodiment. The housing 30 is also preferably a metal housing so that the heat generated by the heat source 31 can be conducted to the first heat-conducting coating 40 more quickly. Optionally, the thermal conductivity of the heat-insulating coating 52 is not greater than 0.2 W / (m·K). The material of the heat-insulating coating 52 is preferably parylene.

[0054] Please refer to Figure 4 , in another embodiment, the functional coating 50 includes a heat-insulating coating 52 and a heat storage coating 53; the heat storage coating 53 is located on the side of the housing 30 facing the second target object 22 and covers at least the heat source 31; the heat-insulating coating 52 covers the area of the housing 30 except for the areas covered by the first heat-conducting coating 40 and the heat storage coating 53.

[0055] Configured in this way, the housing 30 forms a heat conduction path with the first target object 21 through the first heat conduction coating 40, and the housing 30 also forms a heat conduction path with the second target object 22 through the heat storage coating 53. On one side of the first heat conduction coating 40, similar to the foregoing solution, by utilizing the relatively high heat dissipation capacity of the first target object 21, the heat emitted by the heat source 31 can be conducted to the first target object 21 relatively quickly through the housing 30 and the first heat conduction coating 40 and dissipated into the human body. On the side of the heat storage coating 53, the heat emitted by the heat source 31 can be stored and dissipated into the human body relatively slowly through the second target object 22. Except for the areas covered by the first heat conduction coating 40 and the heat storage coating 53, the remaining outer surface of the housing 30 is covered by the heat insulation coating 52, reducing or avoiding direct contact between the housing 30 and human tissues, and reducing the risk of local burns caused by direct contact between the housing 30 and certain tissues at undesired positions.

[0056] This embodiment makes full use of the heat dissipation capacity characteristics of the first target object 21 and the second target object 22, customizes different heat dissipation mechanisms, and while ensuring thermal safety, can further accelerate the heat dissipation of the implantable medical device 11.

[0057] In Figure 4 In the illustrated embodiment, the housing 30 is a metal housing with a thickness of 0.2 mm to 0.3 mm. The thermal conductivity of the first heat conduction coating 40 is preferably 1 W / (m·K) to 3 W / (m·K). Its material can be selected, for example, from Teflon or bioceramics. The thermal conductivity of the heat insulation coating 52 is preferably not greater than 0.2 W / (m·K), and its material can be selected, for example, from parylene. The specific heat capacity of the heat storage coating 53 is preferably 0.6 J / (g·°C) to 0.9 J / (g·°C). Further, the thermal conductivity of the heat storage coating 53 is preferably less than 1 W / (m·K) so that the heat storage coating 53 can conduct heat to the second target object 22 relatively slowly. The material of the heat storage coating 53 can be selected, for example, from Teflon or PEEK. Furthermore, considering that the function of the heat storage coating 53 is to store heat and delay heat conduction, its thickness should be relatively thicker than that of the first heat conduction coating 40. In a demonstration example, the thickness of the heat storage coating 53 is 50 μm to 100 μm. And at this time, the thickness of the first heat conduction coating 40 can be configured to be 20 μm to 50 μm. The thickness of the heat insulation coating 52 can be selected to be 20 μm to 100 μm.

[0058] Based on the implantable medical device 11 described above, especially as Figure 3 and Figure 4 shown in the embodiment, there are two different coatings in one direction of the housing 30, which poses certain challenges in the forming process. For this reason, please refer to Figures 5 to 10 This embodiment of the present invention also provides a processing method for an implantable medical device, which includes:

[0059] Step S1: Deposit the thermal insulation coating material on the outer surface of the housing 30 through chemical vapor deposition process to form the thermal insulation coating 52, as Figure 5 and Figure 6 shown.

[0060] Step S2: Remove the thermal insulation coating 52 of the housing 30 corresponding to the functional area through laser etching process, exposing the part of the housing 30 corresponding to the functional area, as Figure 7 shown. It should be noted that the functional area here refers to the heat conduction area where the first heat conduction coating 40 needs to be coated, or the heat storage area where the heat storage coating 53 needs to be coated. If corresponding to the Figure 3 embodiment shown, only the heat conduction area needs to be etched on the side corresponding to the first target object 21. And for the Figure 4 embodiment shown, it is necessary to etch the heat conduction area on the side corresponding to the first target object 21, and etch the heat storage area on the side corresponding to the second target object 22.

[0061] Step S3: Cover the mask plate 60 corresponding to the functional area on the thermal insulation coating 52, as Figure 8 shown.

[0062] Step S4: Spray the heat conduction coating material or heat storage coating material on the part of the housing 30 corresponding to the functional area through ultrasonic spraying process to form the first heat conduction coating 40 or heat storage coating 53, as Figure 9 shown. It should be understood that on the side corresponding to the first target object 21, the functional area is the heat conduction area. At this time, after setting the mask plate 60 in step S3, the heat conduction coating material is sprayed. On the side corresponding to the second target object 22, the functional area is the heat storage area. At this time, after setting the mask plate 60 in step S3, the heat storage coating material is sprayed. Further, corresponding to the Figure 4 embodiment shown, the functional area includes the heat conduction area and the heat storage area located on the opposite sides of the housing 30. At this time, steps S3 and S4 specifically include: after covering the mask plate 60 corresponding to the heat conduction area on the thermal insulation coating, spraying the heat conduction coating material on the part of the housing 30 corresponding to the heat conduction area through ultrasonic spraying process to form the first heat conduction coating 40; and after covering the mask plate 60 corresponding to the heat storage area on the thermal insulation coating, spraying the heat storage coating material on the part of the housing 30 corresponding to the heat storage area through ultrasonic spraying process to form the heat storage coating 53. Further, if corresponding to the Figure 3 embodiment shown, only the heat conduction coating material needs to be sprayed on the side corresponding to the first target object 21 to form the first heat conduction coating 40.

[0063] Step S5: Remove the mask 60, as Figure 10 shown, and the implantable medical device 11 with the composite coating is obtained.

[0064] Preferably, before depositing the heat-insulating coating material on the outer surface of the housing 30 by chemical vapor deposition process to form the heat-insulating coating 52 in step S1, the processing method of the implantable medical device further includes:

[0065] Step S0: Treat the outer surface of the housing 30 by plasma treatment process. The plasma treatment process can enhance the surface activity to facilitate chemical vapor deposition. The plasma treatment process can use at least one of nitrogen, helium, and air.

[0066] The processing method of the implantable medical device provided in this embodiment solves the process application problem of compounding different coatings on the same surface of the housing 30, enables the coating material to be applied to the surfaces of various regular or irregular housings, and plays the correct functions in their respective functional areas, which is beneficial to fully exert the characteristics of various coating materials.

[0067] In summary, in the implantable medical device and the processing method of the implantable medical device provided by the present invention, the implantable medical device includes a housing, a heat source, a first heat-conducting coating, and a functional coating; the first heat-conducting coating and the functional coating are respectively coated outside the housing; the housing is used to be implanted between a first target object and a second target object, wherein the heat dissipation ability of the first target object is higher than that of the second target object; the heat source is located on the side of the housing facing the second target object; the first heat-conducting coating is located on the side of the housing facing the first target object, and the functional coating covers the area of the housing except the area covered by the first heat-conducting coating; the functional coating is configured to conduct the heat generated by the heat source to the first heat-conducting coating and / or delay the heat generated by the heat source from being conducted to the second target object. With such a configuration, through the setting of the functional coating, the heat source can form a heat conduction path with the first target object and the second target object at the same time, and the heat can be distributed more evenly on the outer surface of the entire implantable medical device, avoiding local heat accumulation; in addition, through the setting of the functional coating, the heat generated by the heat source can also be conducted to the first heat-conducting coating, and then conducted to the first target object with a higher heat dissipation ability, effectively using the higher heat dissipation ability of the first target object for heat dissipation, delaying and reducing the heat generated by the heat source from being conducted to the second target object with a lower heat dissipation ability, so as to reduce the harm caused by heat accumulation in the second target object.

[0068] It should be noted that the above-mentioned several embodiments can be combined with each other. The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the art of the present invention based on the above disclosure belong to the protection scope of the present invention.

Claims

1. An implantable medical device, characterized in that, Comprising: A housing, a heat source, a first heat-conducting coating, and a functional coating; The first heat-conducting coating and the functional coating are respectively coated outside the housing; The housing is used to be implanted between a first target object and a second target object, wherein the heat dissipation capacity of the first target object is higher than that of the second target object; the heat source is located on the side of the housing facing the second target object; the first heat-conducting coating is located on the side of the housing facing the first target object, and the functional coating covers the area of the housing except the area covered by the first heat-conducting coating; The functional coating is configured to conduct the heat generated by the heat source to the first heat-conducting coating and / or delay the heat generated by the heat source from being conducted to the second target object.

2. The implantable medical device according to claim 1, wherein The functional coating includes a second heat-conducting coating; The thermal conductivity of the first heat-conducting coating is 1 W / (m·K) to 3 W / (m·K); the thermal conductivity of the second heat-conducting coating is 1 W / (m·K) to 3 W / (m·K).

3. The implantable medical device according to claim 1, wherein The functional coating includes a heat-insulating coating.

4. The implantable medical device according to claim 3, characterized in that, The thermal conductivity of the heat-insulating coating is not greater than 0.2 W / (m·K).

5. The implantable medical device according to claim 1, characterized in that, The functional coating includes a heat-insulating coating and a heat-storing coating; the heat-storing coating is located on the side of the housing facing the second target object and at least covers the heat source; the heat-insulating coating covers the area of the housing except the areas covered by the first heat-conducting coating and the heat-storing coating.

6. The implantable medical device according to claim 5, wherein The thermal conductivity of the heat-insulating coating is not greater than 0.2 W / (m·K); the specific heat capacity of the heat-storing coating is 0.6 J / (g·℃) to 0.9 J / (g·℃), and the thermal conductivity of the heat-storing coating is less than 1 W / (m·K).

7. The implantable medical device according to claim 1, wherein, The housing is a metal housing.

8. A processing method for an implantable medical device, characterized in that, Comprising: Depositing a heat-insulating coating material on the outer surface of the housing by chemical vapor deposition to form a heat-insulating coating; Removing the heat-insulating coating corresponding to the functional area of the housing by laser etching to expose the part of the housing corresponding to the functional area; Covering a mask corresponding to the functional area on the heat-insulating coating; Spraying a heat-conducting coating material or a heat-storing coating material on the part of the housing corresponding to the functional area by ultrasonic spraying to form a first heat-conducting coating or a heat-storing coating; Removing the mask.

9. The processing method of the implantable medical device according to claim 8, characterized in that, Before depositing a heat-insulating coating material on the outer surface of the housing by chemical vapor deposition to form a heat-insulating coating, the processing method of the implantable medical device further includes treating the outer surface of the housing by plasma treatment.

10. The processing method of the implantable medical device according to claim 8, wherein, The functional area includes a heat-conducting area and a heat-storing area located on opposite sides of the housing; The processing method of the implantable medical device further includes: After covering a mask corresponding to the heat-conducting area on the heat-insulating coating, spraying a heat-conducting coating material on the part of the housing corresponding to the heat-conducting area by ultrasonic spraying to form the first heat-conducting coating; and After covering a mask corresponding to the heat-storing area on the heat-insulating coating, spraying a heat-storing coating material on the part of the housing corresponding to the heat-storing area by ultrasonic spraying to form the heat-storing coating.

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