A wafer multi-functional measurement and sorting device

Abstract

The present invention discloses a wafer multi-functional measurement and sorting device, comprising: a conveying platform, a double-belt conveying module, a feeding module, a first loading module, a second loading module, a centering module, a detection module and a sorting module; wherein, a pair of parallel first limiting grooves are provided on the conveying platform; the double-belt conveying module is arranged on the conveying platform; the feeding module and the double-belt conveying module are arranged adjacent to each other for providing wafers; the first loading module is connected to the feeding module for sending out the wafers in the feeding module; and is connected to the first loading module for sending the wafers to the double-belt conveying module; the centering module is arranged on the conveying platform for centering the wafers; the detection module is arranged on the conveying platform for detecting the performance of the wafers; the sorting module is connected to the detection module for storing the wafers separately. The present invention can achieve automatic and stable conveying of wafers, precise detection of various performances, and automatic sorting of qualified and unqualified wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and particularly to a wafer multi-functional measurement and sorting device. Background Art

[0002] In the process of semiconductor manufacturing, as an important basic material, the performance of wafers directly affects the quality and performance of semiconductor devices. In order to ensure that the produced semiconductor devices meet the quality standards, it is necessary to accurately measure multiple performance indicators of wafers and effectively sort qualified wafers from unqualified wafers.

[0003] Currently, there are many problems with existing wafer measurement and sorting equipment. Most enterprises still use the method of manually placing wafers one by one on the belt conveying mechanism during wafer inspection feeding, and then the belt conveying mechanism transports the wafers to each inspection position for inspection. This traditional manual feeding mode has significant defects: firstly, the manual operation efficiency is extremely low, which is difficult to meet the high-efficiency production requirements of large-scale wafer inspection and seriously restricts the overall inspection progress; secondly, during the process of manually placing wafers, it is easy to cause collisions of wafers, etc., which not only affects the inspection accuracy but may also cause wafer damage and increase production costs.

[0004] Secondly, in the process of wafer production and manufacturing, a wafer conveyor is a key device for realizing the automatic transmission of wafers. As an important transmission component of the wafer conveyor, the tension of the belt directly affects the stability and accuracy of wafer transmission. If the belt tension is insufficient, slipping is likely to occur, resulting in deviation of the wafer transmission position and even causing wafer dropping and damage; while if the tension is too large, it will increase the wear of the belt and transmission components and shorten the service life of the equipment. The existing wafer conveyor belt tensioning mechanism has problems such as inconvenient adjustment and unstable tensioning effect, and it is difficult to meet the increasingly high wafer production requirements.

[0005] In addition, a pre - centering positioning system for a semiconductor wafer testing system disclosed in a Chinese patent document with the publication number CN201859153U includes a signal sensing module, which includes a test platform, a shading photoelectric sensor, a reflective photoelectric sensor, and a stepping motor; a signal processing and operation module, which includes a signal processing module, an analog - to - digital conversion module, a microprocessor, a stepping motor driver, a solenoid valve driver, and an Ethernet interface; and a mechanical execution module, which includes a chuck, an X - direction limit sensor, a Z - direction limit sensor, a vacuum solenoid valve, and three stepping motors respectively controlling the X - direction, Z - direction, and rotational movements of the chuck. Among them, the signal sensing module is connected to the signal processing and operation module, and the signal processing and operation module is connected to the mechanical execution module. The pre - centering positioning system of the semiconductor wafer testing system in this patent can be applied to the precise centering of semiconductor wafers with various thicknesses, sizes, and weights, and has characteristics such as non - contact, fast, accurate, and flexible. However, due to the involvement of multiple intelligent modules, the cost of this device is relatively high. If a centering module with a lower cost can be developed for replacement, the overall cost of the device will be greatly reduced. Summary of the Invention

[0006] According to an embodiment of the present invention, a wafer multi - functional measurement and sorting device is provided, comprising:

[0007] A conveying platform, on which a pair of parallel first limiting grooves are provided;

[0008] A double - belt conveying module, which is arranged on the conveying platform;

[0009] A feeding module, which is arranged adjacent to the double - belt conveying module and is used to provide wafers;

[0010] A first loading module, which is connected to the feeding module and is used to send out the wafers in the feeding module;

[0011] A second loading module, which is connected to the first loading module and is used to send the wafers to the double - belt conveying module;

[0012] A centering module, which is arranged on the conveying platform and is used for centering the wafers;

[0013] A detection module (prior art), which is arranged on the conveying platform and is used to detect the performance of the wafers;

[0014] A sorting module, which is connected to the detection module and is used to separately store qualified and unqualified wafers.

[0015] Furthermore, the double - belt conveying module includes:

[0016] A pair of first conveyor belts, which are respectively slidably connected to a pair of first limiting grooves for restricting the positions of the first conveyor belts.

[0017] A pair of first driving mechanisms, which are respectively arranged at both ends of the conveying platform for driving the first conveyor belts to move.

[0018] A tensioning mechanism, which is arranged below the conveying platform and connected to the first conveyor belt for tensioning the first conveyor belt.

[0019] Furthermore, the tensioning mechanism includes:

[0020] A first fixing frame;

[0021] A pair of guiding shafts, whose two ends are respectively detachably connected to the first fixing frame through supports;

[0022] A sliding frame, which is slidably connected to the pair of guiding shafts and has a pair of first tensioning wheels arranged thereon;

[0023] A tension spring, one end of which is connected to the sliding frame and the other end is connected to the first fixing frame;

[0024] A second fixing frame, which is detachably connected to the first fixing frame and has a pair of second tensioning wheels arranged thereon.

[0025] Furthermore, the tensioning mechanism further includes:

[0026] A third fixing frame, which is detachably connected to the first fixing frame and has a pair of third tensioning wheels arranged thereon. The pair of third tensioning wheels correspond to the pair of first tensioning wheels one by one;

[0027] A fourth fixing frame, which is connected to the first fixing frame;

[0028] A fourth tensioning wheel, whose two ends are connected to the fourth fixing frame;

[0029] One end of the tension spring is connected to the sliding frame and the other end is connected to the fourth tensioning wheel.

[0030] Furthermore, the feeding module includes:

[0031] A material box, on which several wafer insertion slots are arranged for placing wafers. The bottom of the material box has a first opening;

[0032] A positioning fixture for positioning the material box, which has a second opening thereon. The second opening is connected to the first opening;

[0033] A linear module, whose output end is connected to the positioning fixture and can drive the positioning fixture to move up and down.

[0034] Further, a number of first positioning steps are symmetrically arranged at the front end of the positioning fixture, and a number of second positioning steps are symmetrically arranged at the rear end. The cooperation of the first positioning steps and the second positioning steps can fix the cartridge on the positioning fixture; a first detection sensor is also arranged on the positioning fixture for detecting whether the cartridge is placed on the positioning fixture.

[0035] Further, the first loading module includes:

[0036] A first fixed seat, which is arranged below the positioning fixture;

[0037] A first rotating shaft, which is rotatably arranged at one end of the first fixed seat. A first pulley is arranged at each end of the first rotating shaft, and a pair of second pulleys are rotatably arranged at the other end of the first fixed seat. The second pulleys correspond to the first pulleys;

[0038] A number of second conveyor belts, one end of each second conveyor belt is sleeved on the first pulley, and the other end is sleeved on the second pulley;

[0039] A second driving mechanism, which is connected to the first fixed seat, and its output end is connected to the first rotating shaft to drive the first rotating shaft to rotate;

[0040] A second detection sensor, which is arranged on the first fixed seat for detecting whether the wafer is in place.

[0041] Further, the second loading module includes:

[0042] A second fixed seat, which includes a first bottom plate and a pair of first support plates. The pair of first support plates are respectively fixedly connected to the first bottom plate;

[0043] A pair of avoidance grooves are arranged on the first support plate. The pair of avoidance grooves divide the first support plate into three sections, and a third detection sensor is arranged inside each section of the support plate;

[0044] A number of third pulleys are arranged along the edge of the first support plate;

[0045] A third conveyor belt is sleeved on the number of third pulleys;

[0046] A second rotating shaft, which is rotatably connected to the pair of first support plates respectively. A third pulley at the corresponding position on each first support plate is sleeved on the second rotating shaft and can rotate following the second rotating shaft;

[0047] A third driving mechanism, which is arranged between the pair of first support plates, and its output end is connected to the second rotating shaft to drive the second rotating shaft to rotate;

[0048] The first lifting mechanism is arranged below the second fixed seat, and its output end is connected to the second fixed seat, capable of driving the second fixed seat to move up and down.

[0049] Furthermore, the detection module includes: a thickness detection mechanism and a resistivity detection mechanism; the thickness detection mechanism and the resistivity detection mechanism are arranged on the conveying platform in sequence.

[0050] Furthermore, the centering module includes:

[0051] The fifth fixing frame;

[0052] The fourth driving mechanism is connected to the fifth fixing frame;

[0053] At least two first clamping components, the first clamping components are connected to the fourth driving mechanism;

[0054] At least one second clamping component, the second clamping component is connected to the fourth driving mechanism;

[0055] The first clamping components and the second clamping components are arranged in a circular sequence on the fifth fixing frame, and the fourth driving mechanism can drive the first clamping components and the second clamping components to clamp the wafer to make the wafer centered;

[0056] The first clamping component includes: a first rotating part and a first clamping part;

[0057] One end of the first rotating part is connected to the output end of the fourth driving mechanism, and the other end is connected to the first clamping part;

[0058] A rubber sleeve is sleeved on the first clamping part for clamping the wafer;

[0059] The second clamping component includes: a second rotating part, a third rotating part, a second clamping part and a spring;

[0060] One end of the second rotating part is connected to the output end of the fourth driving mechanism, and the other end is hinged to the third rotating part;

[0061] The third rotating part is connected to the second clamping part;

[0062] A rubber sleeve is sleeved on the second clamping part for clamping the wafer;

[0063] One end of the spring is connected to the second rotating part, and the other end is connected to the third rotating part, enabling the second clamping part to rotate relative to the second rotating part during the process of clamping the wafer;

[0064] The second lifting mechanism (which belongs to the prior art) is arranged below the conveying platform and can lift the wafer on the double-belt conveying module.

[0065] Furthermore, the sorting module includes:

[0066] The first blanking module is arranged below the output end of the double-belt conveying module and is used for conveying wafers; the structure of the first blanking module is the same as that of the second loading module;

[0067] A pair of second blanking modules are symmetrically arranged on both sides of the first blanking module respectively and are used for conveying wafers; the structure of the second blanking module is the same as that of the first loading module.

[0068] The first blanking module conveys the qualified wafers to one of the second blanking modules and conveys the unqualified wafers to the other second blanking module;

[0069] A receiving module is further arranged at the output end of each second blanking module, and the receiving module is used for collecting wafers. The structure of the receiving module is the same as that of the feeding module.

[0070] Advantages of the present invention:

[0071] 1. Through the design of the double-belt conveying module, the position of the first conveyor belt is restricted by the first limiting groove, and combined with the innovative tensioning mechanism to ensure the tension of the conveyor belt, the stable conveying of wafers can be realized, effectively avoiding problems such as offset and jitter of wafers during the conveying process, improving the stability and reliability of wafer conveying, and thus ensuring the accuracy of subsequent detection and sorting. This tensioning mechanism solves the problems of inconvenient belt tension adjustment and unstable effect in the prior art through the elastic automatic adjustment function of the tension spring, keeps the belt tension force always within the optimal range, not only avoids the slipping phenomenon caused by insufficient tension force, but also prevents the component wear caused by excessive tension force, and prolongs the service life of the equipment.

[0072] 2. The sorting module can automatically store the qualified and unqualified wafers separately according to the detection results of the detection module, reducing manual participation, improving the automation degree and accuracy of sorting, effectively improving the production efficiency of semiconductor manufacturing, and reducing the labor cost and sorting error rate.

[0073] 3, The reasonable design of the feeding module, the first loading module and the second loading module realizes the automatic loading process of wafers from the cassette to the detection module. Each module cooperates with each other to ensure that the wafers can be conveyed to the designated position smoothly and accurately, solving the problems of low efficiency and easy collision and damage of wafers in the traditional manual loading mode, and further improving the automation level and working efficiency of the whole device.

[0074] 4. The centering module can not only quickly center the wafer but also prevent the wafer from being clamped, and reduces the overall production cost through the design of the mechanical structure.

[0075] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 It is a structural diagram of a centering module in the prior art according to an embodiment of the present invention;

[0077] Figure 2 for Figure 1 A is an enlarged view;

[0078] Figure 3 for Figure 1 B is an enlarged view;

[0079] Figure 4 for Figure 1 A top view of

[0080] Figure 5 for Figure 1 Structural diagram from another perspective;

[0081] Figure 6 is a structural schematic diagram of a tensioning mechanism according to an embodiment of the present invention;

[0082] Figure 7 for Figure 6 Front view of

[0083] Figure 8 This is a first structural diagram of the cooperation between the feeding module and the first loading module according to an embodiment of the present invention;

[0084] Figure 9 2 is a schematic structural diagram of a first loading module according to an embodiment of the present invention;

[0085] Figure 10 A second structural diagram of the cooperation between the feeding module and the first loading module according to an embodiment of the present invention;

[0086] Figure 11 This is a schematic structural diagram of a pair of first loading modules and a second loading module cooperating with each other according to an embodiment of the present invention;

[0087] Figure 12 2 is a schematic structural diagram of a second loading module according to an embodiment of the present invention;

[0088] Figure 13 A schematic diagram of the partial structure of an improved centering module according to an embodiment of the present invention;

[0089] Figure 14 A schematic structural diagram of a centering module according to an embodiment of the present invention;

[0090] Figure 15For Figure 14 Front view of

[0091] Figure 16 Schematic structural view of the centering module clamping a wafer according to an embodiment of the present invention;

[0092] Figure 17 Schematic view of the cassette being stuck between the first positioning step and the second positioning step according to an embodiment of the present invention;

[0093] Figure 18 For Figure 17 Top view of Detailed implementation manners

[0094] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings to further elaborate on the present invention.

[0095] First, a wafer multi-functional measurement and sorting device according to an embodiment of the present invention will be described in conjunction with Figures 1 - 18 which is used for wafer detection and has a wide range of application scenarios.

[0096] As Figures 1 - 18 shown, the wafer multi-functional measurement and sorting device according to an embodiment of the present invention includes:

[0097] A conveying platform 1, on which a pair of parallel first limiting grooves 11 are provided;

[0098] A double-belt conveying module 2, which is arranged on the conveying platform 1;

[0099] A feeding module 3, which is arranged adjacent to the double-belt conveying module 2 and is used to provide wafers 9;

[0100] A first loading module 4, which is connected to the feeding module 3 and is used to send out the wafers 9 in the feeding module 3;

[0101] A second loading module 5, which is connected to the first loading module 4 and is used to send the wafers 9 to the double-belt conveying module 2;

[0102] A centering module 8, which is arranged on the conveying platform 1 and is used for centering the wafers 9;

[0103] A detection module (prior art), which is arranged on the conveying platform 1 and is used to detect the performance of the wafers 9;

[0104] A sorting module 7, which is connected to the detection module and is used to separately store the qualified and unqualified wafers 9.

[0105] Preferably, as Figure 1As shown, in this embodiment, two feeding modules 3 and two first loading modules 4 are selected and symmetrically arranged on both sides of the second loading module 5 respectively. One of the two feeding modules 3 and one of the two first loading modules 4 are in standby.

[0106] Further, as Figures 1 - 2 , 5 shown, in this embodiment, the double-belt conveying module 2 includes:

[0107] A pair of first conveyor belts 21, and the pair of first conveyor belts 21 are respectively slidably connected with a pair of first limiting grooves 11. The first limiting grooves 11 are used to limit the position of the first conveyor belts 21;

[0108] A pair of first driving mechanisms 22, and the pair of first driving mechanisms 22 are respectively arranged at both ends of the conveying platform 1 and used to drive the first conveyor belts 21 to move;

[0109] A tensioning mechanism 23, and the tensioning mechanism 23 is arranged below the conveying platform 1 and connected with the first conveyor belts 21 to tension the first conveyor belts 21.

[0110] Further, as Figures 6 - 7 shown, in this embodiment, the tensioning mechanism 23 includes:

[0111] A first fixing frame 231, and the first fixing frame 231 is arranged below the conveying platform 1 and fixedly connected with the conveying platform 1;

[0112] A pair of guide shafts 232, and both ends of the pair of guide shafts 232 are detachably connected with the first fixing frame 231 through supports 2321;

[0113] A sliding frame 233, and the sliding frame 233 is slidably connected with the pair of guide shafts 232. A pair of first tensioning wheels 2331 are arranged on the sliding frame 233;

[0114] A tension spring 234, one end of the tension spring 234 is connected with the sliding frame 233, and the other end is connected with the first fixing frame 231;

[0115] A second fixing frame 235, and the second fixing frame 235 is detachably connected with the first fixing frame 231. A pair of second tensioning wheels 2351 are arranged on the second fixing frame 235.

[0116] Further, as Figures 6 - 7 shown, in this embodiment, the tensioning mechanism 23 further includes:

[0117] A third fixing frame 236, and the third fixing frame 236 is detachably connected with the first fixing frame 231. A pair of third tensioning wheels 2361 are arranged on the third fixing frame 236, and the pair of third tensioning wheels 2361 correspond to the pair of first tensioning wheels 2331 one by one;

[0118] The fourth fixing bracket 237 is connected to the first fixing bracket 231;

[0119] The fourth tensioning wheel 2371, both ends of the fourth tensioning wheel 2371 are connected to the fourth fixing bracket 237;

[0120] One end of the tension spring 234 is connected to the sliding bracket 233, and the other end is connected to the fourth tensioning wheel 2371.

[0121] Through the elastic action of the tension spring 234, the position of the sliding bracket 233 can be automatically adjusted, and then the tension of the first tensioning wheel 2331, the second tensioning wheel 2351, the third tensioning wheel 2361 and the fourth tensioning wheel 2371 on the first conveyor belt 21 can be adjusted, ensuring that the first conveyor belt 21 always maintains an appropriate tension level, avoiding affecting the transportation of the wafer 9 due to the slack of the conveyor belt. The design of this tensioning mechanism 23 solves the problems of inconvenient belt tension adjustment and unstable effect in the prior art. Through the elastic automatic adjustment of the tension spring 234, the tension can be adjusted in real time according to the actual state of the belt, so that the belt tension always remains within the optimal range.

[0122] Furthermore, as shown in Figure 2 、 8 、10, 17~18, in this embodiment, the feeding module 3 includes:

[0123] The cassette 31, several insertion slots 311 are provided on the cassette 31, the insertion slots 311 are used to place the wafers 9, and multiple wafers 9 can be placed in each cassette 31; a first opening 312 is provided at the bottom of the cassette 31;

[0124] The positioning fixture 32 (belonging to the conventional technology), the positioning fixture 32 is used for positioning the cassette 31, a second opening 321 is provided on the positioning fixture 32, and the second opening 321 is connected to the first opening 312; the first feeding module 4 is arranged below the second opening 321, and the settings of the first opening 312 and the second opening 321 avoid interference between the first feeding module 4 and the positioning fixture 32 or the cassette 31;

[0125] The linear module 33, the output end of the linear module 33 is connected to the positioning fixture 32, and can drive the positioning fixture 32 to move up and down.

[0126] First, place the cassette 31 containing the wafers 9 on the positioning fixture 32, the linear module 33 drives the positioning fixture 32 to descend until the lowermost wafer 9 in the cassette 31 contacts the first feeding module 4, the linear module 33 stops, and the first feeding module 4 uses friction to send out the wafer 9.

[0127] Furthermore, as shown in Figure 8 、 17As shown in FIGS. 18, in this embodiment, a number of first positioning steps 322 are symmetrically arranged at the front end of the positioning fixture 32, and a number of second positioning steps 323 are symmetrically arranged at the rear end. The cooperation of the first positioning steps 322 and the second positioning steps 323 can fix the cartridge 31 on the positioning fixture 32. Multiple first positioning steps 322 and multiple second positioning steps 323 are provided to accommodate various models of cartridges 31. A first detection sensor 34 is also provided on the positioning fixture 32 to detect whether the cartridge 31 is placed on the positioning fixture 32.

[0128] Further, as Figure 2 、 8 ~9 show, in this embodiment, the first loading module 4 includes:

[0129] A first fixed seat 41, the first fixed seat 41 is arranged below the positioning fixture 32;

[0130] A first rotating shaft 42, the first rotating shaft 42 is rotatably arranged at one end of the first fixed seat 41. A first pulley 421 is arranged at each end of the first rotating shaft 42. A pair of second pulleys 411 are rotatably arranged at the other end of the first fixed seat 41. The second pulleys 411 correspond to the first pulleys 421;

[0131] A number of second conveyor belts 43, one end of the second conveyor belt 43 is sleeved on the first pulley 421, and the other end is sleeved on the second pulley 411;

[0132] A second driving mechanism 44, the second driving mechanism 44 is connected to the first fixed seat 41, and its output end is connected to the first rotating shaft 42, which can drive the first rotating shaft 42 to rotate. The first rotating shaft 42 drives the second conveyor belt 43 to move through the first pulleys 421 at both ends;

[0133] A second detection sensor 45, the second detection sensor 45 is arranged on the first fixed seat 41 to detect whether the wafer 9 is in place; when the second detection sensor 45 detects that the wafer 9 is in place, the second driving mechanism 44 drives the second conveyor belt 43 to send the wafer 9 out from the bottom of the cartridge 31.

[0134] Further, as Figures 11 - 12 shown, in this embodiment, the second loading module 5 includes:

[0135] A second fixed seat 51, the second fixed seat 51 includes a first bottom plate 511 and a pair of first support plates 512, and the pair of first support plates 512 are respectively fixedly connected to the first bottom plate 511;

[0136] A pair of avoidance grooves 5121 are provided on the first support plate 512. The avoidance grooves 5121 are used to prevent interference between the first support plate 512 and the first conveyor belt 21 during the upward movement of the second fixed seat 51. The pair of avoidance grooves 5121 divide the first support plate 512 into three segments, namely, left, middle, and right segments. The left and right ends are symmetrically arranged relative to the middle segment, and the middle segment faces the pair of first conveyor belts 21. The wafer 9 can enter the middle segment from the left segment or the right segment and then enter the first conveyor belt 21. A third detection sensor 58 is provided inside each segment of the support plate, and the third detection sensor 58 is used to detect the position of the wafer 9.

[0137] A number of third pulleys 53 are arranged along the edge of the first support plate 512. Among them, one third pulley 53 is provided on each side of the top of the avoidance groove 5121, and one third pulley 53 is provided below.

[0138] A third conveyor belt 54 is sleeved on the number of third pulleys 53, and the third conveyor belt 54 is used to convey the wafer 9.

[0139] Setting a number of third pulleys 53 enables connecting the number of third pulleys 53 on one side of the corresponding first support plate 512 with only one belt.

[0140] A second rotating shaft 55 is rotatably connected to the pair of first support plates 512 respectively. One third pulley 53 at the corresponding position on each first support plate 512 is sleeved on the second rotating shaft 55 and can rotate following the second rotating shaft 55.

[0141] A third driving mechanism 56 is arranged between the pair of first support plates 512. Its output end is connected to the second rotating shaft 55 and can drive the second rotating shaft 55 to rotate. The second rotating shaft 55 drives the third conveyor belt 54 to move through the third pulleys 53 at both ends.

[0142] A first lifting mechanism 57 is arranged below the second fixed seat 51. Its output end is connected to the second fixed seat 51 and can drive the second fixed seat 51 to move up and down. In the initial state, the top of the third conveyor belt 54 is higher than the first conveyor belt 21 to prevent interference between the wafer 9 and the first conveyor belt 21 during the process of the wafer 9 being conveyed from the first conveyor belt 21 to the second conveyor belt 43. When the wafer 9 moves to the center of the middle segment of the first support plate 512, the third driving mechanism 56 stops, and the first lifting mechanism 57 drives the second fixed seat 51 to descend until the wafer 9 contacts the first conveyor belt 21, and then the first conveyor belt 21 conveys the wafer 9 to the next station.

[0143] Preferably, in this embodiment, the first lifting mechanism 57 is preferably a cylinder or an electric cylinder.

[0144] Further, in this embodiment, the first driving mechanism 22, the second driving mechanism 44, and the third driving mechanism 56 all use a servo motor and a timing belt for power transmission, which belongs to conventional technical means.

[0145] Further, as Figure 1 shown, in this embodiment, the detection module includes: a thickness detection mechanism 61 (prior art) and a resistivity detection mechanism 62 (prior art); the thickness detection mechanism 61 and the resistivity detection mechanism 62 are arranged on the conveying platform 1 in sequence.

[0146] Further, as Figures 13 - 16 shown, in this embodiment, the centering module 8 includes:

[0147] A fifth fixing frame 81, and the fifth fixing frame 81 is fixedly connected to the conveying platform 1;

[0148] A fourth driving mechanism 82 (belonging to conventional technical means), and the fourth driving mechanism 82 is connected to the fifth fixing frame 81;

[0149] At least two first clamping components 83, and the first clamping components 83 are connected to the fourth driving mechanism 82;

[0150] At least one second clamping component 84, and the second clamping component 84 is connected to the fourth driving mechanism 82;

[0151] The first clamping components 83 and the second clamping components 84 are arranged annularly on the fifth fixing frame 81 in sequence, and the fourth driving mechanism 82 can drive the first clamping components 83 and the second clamping components 84 to clamp the wafer 9 to center the wafer 9;

[0152] The first clamping component 83 includes: a first rotating member 831 and a first clamping member 832;

[0153] One end of the first rotating member 831 is connected to the output end of the fourth driving mechanism 82, and the other end is connected to the first clamping member 832;

[0154] A rubber sleeve is sleeved on the first clamping member 832 for clamping the wafer 9;

[0155] The second clamping component 84 includes: a second rotating member 841, a third rotating member 842, a second clamping member 843, and a spring 844;

[0156] One end of the second rotating member 841 is connected to the output end of the fourth driving mechanism 82, and the other end is hinged to the third rotating member 842;

[0157] The third rotating member 842 is connected to the second clamping member 843;

[0158] A rubber sleeve is sleeved on the second clamping member 843 for clamping the wafer 9;

[0159] One end of the spring 844 is connected to the second rotating member 841 , and the other end is connected to the third rotating member 842 , so that the second clamping member 843 can rotate relative to the second rotating member 841 when clamping the wafer 9 ;

[0160] The second lifting mechanism (belonging to the existing technology) is arranged below the conveying platform 1 and can lift the wafer 9 on the double-belt conveyor module 2.

[0161] Further, if Figure 16 As shown, in this embodiment, a rubber sleeve is provided on the second clamping member of the first clamping member to prevent the wafer 9 from being clamped.

[0162] Further, if Figure 14 As shown, in this embodiment, the fourth driving mechanism 82 includes: a servo motor 821, a transmission assembly 822 and a plurality of transmission shafts 823;

[0163] The servo motor 821 is mounted on the fifth fixing frame 81, and its output end is connected to the input end of the transmission assembly 822;

[0164] The output end of the transmission assembly 822 is connected to the input end of a plurality of transmission shafts 823, and can drive the transmission shafts 823 to rotate;

[0165] A plurality of transmission shafts 823 are rotatably disposed on the fifth fixing frame 81 , and output ends thereof are connected to the first clamping assembly 83 or the second clamping assembly 84 to drive the corresponding first clamping assembly 83 or the second clamping assembly 84 to rotate.

[0166] Further, if Figure 14 As shown, in this embodiment, the transmission assembly 822 includes:

[0167] A first synchronous wheel 8221 is sleeved on the output shaft of the servo motor 821;

[0168] A second synchronous wheel 8222 is sleeved on one of the transmission shafts 823;

[0169] A first synchronous belt 8223 , one end of which is engaged with the first synchronous wheel 8221 , and the other end of which is engaged with the second synchronous wheel 8222 ;

[0170] A plurality of third synchronous wheels 8224, wherein the plurality of third synchronous wheels 8224 are respectively sleeved on the transmission shaft 823;

[0171] The second synchronous belt 8225 is engaged with a plurality of third synchronous wheels 8224 respectively.

[0172] Further, if Figure 13 、 15As shown, in this embodiment, the second lifting mechanism 85 includes a lifting cylinder 851 and a lifting plate 852. The lifting plate 852 is connected to the output end of the lifting cylinder 851 and can drive the lifting plate 852 to move up and down. Preferably, the lifting plate 852 is a vacuum suction cup with a plurality of vacuum suction holes provided on the vacuum suction cup. The lower ends of the vacuum suction holes are connected to the vacuum generator via vacuum tubes. When the lifting plate 852 drives the wafer 9 to move up and down, the lifting plate 852 absorbs the wafer 9 to prevent the wafer 9 from slipping between the lifting plate 852 and the wafer 9.

[0173] After the first conveyor belt 21 delivers wafer 9 to the top of the second lifting mechanism 85 and stops, the lifting cylinder 851 activates, driving the lifting plate 852 upward. The lifting plate 852 then absorbs and steadily lifts wafer 9 to a height between the first clamping assembly 83 and the second clamping assembly 84, and the air in the suction hole is released. At this point, the servo motor 821 begins operating, its output shaft driving the first synchronous pulley 8221 to rotate. The first synchronous pulley 8221 transmits power to the second synchronous pulley 8222 via the first synchronous belt 8223, which in turn rotates the connected drive shaft 823. Simultaneously, the second synchronous belt 8225, driven by the transmission of the third synchronous pulleys 8224, drives the other drive shafts 823 to rotate synchronously.

[0174] When each drive shaft 823 rotates, it drives the first clamping assembly 83 and the second clamping assembly 84 to move synchronously. Driven by the first rotating member 831, the first clamping member 832 of the first clamping assembly 83 clamps one side of the wafer 9 using a rubber sleeve. Driven by the second rotating member 841 and the third rotating member 842, the second clamping member 843 of the second clamping assembly 84 approaches the wafer 9. After contacting the wafer 9, the spring 844 causes the second clamping member 843 to rotate relative to the third rotating member 842, adaptively conforming to the surface of the wafer 9 of varying shapes and clamping the other side of the wafer 9 using the rubber sleeve. Multiple first clamping assemblies 83 and second clamping assemblies 844 work together from different directions to achieve precise centering of various wafer types. The centering module 8 achieves both rapid centering of the wafer 9 and prevention of wafer 9 damage, while also reducing overall production costs through mechanical design.

[0175] After the centering is completed, the lifting plate 852 absorbs the wafer 9 again, the first clamping assembly 83 and the second clamping assembly 84 release the wafer 9, and the lifting cylinder 851 drives the lifting plate 852 to move downward, so that the centered wafer 9 returns to the first conveyor belt 21.

[0176] Further, if Figure 3 As shown, in this embodiment, the sorting module 7 includes:

[0177] The first blanking module 71 is arranged below the output end of the double-belt conveying module 2 and is used for conveying the wafers 9; the structure of the first blanking module 71 is the same as that of the second loading module 5;

[0178] A pair of second blanking modules 72 are symmetrically arranged on both sides of the first blanking module 71 respectively and are used for conveying the wafers 9; the structure of the second blanking module 72 is the same as that of the first loading module 4.

[0179] The first blanking module 71 conveys the qualified wafers 9 to one of the second blanking modules 72 and conveys the unqualified wafers 9 to the other second blanking module 72;

[0180] A receiving module 73 is further arranged at the output end of each second blanking module 72. The receiving module 73 is used for collecting the wafers 9, and the structure of the receiving module 73 is the same as that of the feeding module 3.

[0181] Working principle:

[0182] First, the wafers 9 to be detected are inserted into the insertion slots 311 of the cartridge 31 one by one, and then the cartridge 31 is placed on the positioning fixture 32 for positioning. The first detection sensor 34 is triggered, and the linear module 33 drives the positioning fixture 32 to descend until the wafer 9 at the lowermost end of the cartridge 31 contacts the second conveyor belt 43. The second detection sensor 45 is triggered, and the second driving mechanism 44 drives the second conveyor belt 43 to convey the wafer 9 from the cartridge 31 to the second loading module 5; the third driving mechanism 56 moves to drive the third conveyor belt 54 to convey the wafer 9 above the first conveyor belt 21, and the first lifting mechanism 57 drives the second fixed seat 51 to descend, so that the wafer 9 falls onto the pair of first conveyor belts 21; then, the first conveyor belt 21 conveys the wafer 9 to the centering module 8 for centering. After centering, the first conveyor belt 21 continues to drive the wafer 9 to the thickness detection station and the resistivity detection station for detection, and then conveys the wafer 9 to the first blanking module 71. The first blanking module 71 separates the qualified and unqualified wafers 9 and conveys them to the corresponding second blanking modules 72. The second blanking modules 72 then convey the wafers 9 into the cartridge 31 of the receiving module 73.

[0183] As above, referring to Figures 1 - 18 The wafer multi-functional measurement and sorting device according to the embodiment of the present invention is described. It can achieve automatic and stable conveying of wafers, precise detection of various performances, and automatic sorting of qualified and unqualified wafers; at the same time, through the innovative design of the tensioning mechanism, the problems of inconvenient belt tension adjustment and unstable effect are solved, and the production efficiency and product quality of semiconductor manufacturing are improved; the centering module can not only quickly center the wafer but also prevent the wafer from being scratched, and the overall production cost is reduced through the design of the mechanical structure.

[0184] It should be noted that in this specification, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising the element.

[0185] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present invention. After those skilled in the art have read the above content, various modifications and alternatives to the present invention will be obvious. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims

1. A multifunctional wafer measuring and sorting device, characterized in that: Include: A conveying platform, wherein a pair of parallel first limiting grooves are provided on the conveying platform; A double-belt conveyor module, the double-belt conveyor module is arranged on the conveying platform; A feeding module, the feeding module and the double-belt conveyor module are arranged adjacent to each other and are used to provide wafers; a first loading module, connected to the feeding module, for delivering wafers from the feeding module; A second loading module, connected to the first loading module, is used to deliver the wafers to the double-belt conveyor module; a centering module, the centering module being arranged on the conveying platform and being used for centering the wafer; A detection module, disposed on the conveying platform and configured to detect the performance of the wafer; A sorting module, which is connected to the detection module and is used to store qualified and unqualified wafers separately; The double-belt conveyor module comprises: a pair of first conveyor belts, wherein the pair of first conveyor belts are slidably connected to the pair of first limiting grooves respectively, and the first limiting grooves are used to limit the position of the first conveyor belts; a pair of first driving mechanisms, the pair of first driving mechanisms being respectively arranged at two ends of the conveying platform and being used for driving the first conveying belt to move; A tensioning mechanism, the tensioning mechanism being arranged below the conveying platform and connected to the first conveyor belt, and being used for tensioning the first conveyor belt; The feeding module comprises: A material box is provided with a plurality of material insertion slots for placing wafers; a first opening is provided at the bottom of the material box; A positioning jig, the positioning jig is used to position the material box, the positioning jig is provided with a second opening, and the second opening is connected to the first opening; A linear module, the output end of which is connected to the positioning fixture and can drive the positioning fixture to move up and down; The tensioning mechanism comprises: a first fixing frame; a pair of guide shafts, with both ends of the pair of guide shafts being detachably connected to the first fixing frame via supports; a sliding frame, the sliding frame being slidably connected to the pair of guide shafts, and the sliding frame being provided with a pair of first tensioning wheels; a tension spring, one end of which is connected to the sliding frame, and the other end of which is connected to the first fixed frame; a second fixing frame, the second fixing frame being detachably connected to the first fixing frame, and the second fixing frame being provided with a pair of second tensioning wheels; The tensioning mechanism further comprises: a third fixing frame, the third fixing frame being detachably connected to the first fixing frame, the third fixing frame being provided with a pair of third tensioning wheels, the pair of third tensioning wheels corresponding one-to-one to the pair of first tensioning wheels; a fourth fixing frame connected to the first fixing frame; a fourth tensioning wheel, both ends of which are connected to the fourth fixing frame; One end of the tension spring is connected to the sliding frame, and the other end is connected to the fourth tensioning wheel.

2. The multifunctional wafer measuring and sorting device according to claim 1, wherein: The positioning jig is symmetrically provided with a plurality of first positioning steps at the front end and a symmetrically provided with a plurality of second positioning steps at the rear end. The first positioning steps and the second positioning steps cooperate to fix the material box on the positioning jig; the positioning jig is also provided with a first detection sensor for detecting whether the material box is placed on the positioning jig.

3. The multifunctional wafer measuring and sorting device according to claim 1, wherein: The first loading module comprises: a first fixing seat, the first fixing seat being arranged below the positioning jig; a first rotating shaft, the first rotating shaft being rotatably disposed at one end of the first fixed seat, a first pulley being disposed at each end of the first rotating shaft, and a pair of second pulleys being rotatably disposed at the other end of the first fixed seat, the second pulleys corresponding to the first pulley; a plurality of second conveyor belts, wherein one end of the second conveyor belt is sleeved on the first pulley and the other end is sleeved on the second pulley; a second driving mechanism, the second driving mechanism being connected to the first fixing seat, and having an output end connected to the first rotating shaft, capable of driving the first rotating shaft to rotate; The second detection sensor is arranged on the first fixing seat and is used to detect whether the wafer is in place.

4. The wafer multifunctional measurement and sorting device according to claim 1, wherein: The second loading module comprises: a second fixing base, the second fixing base comprising a first bottom plate and a pair of first support plates, the pair of first support plates being fixedly connected to the first bottom plate respectively; A pair of avoidance grooves are provided on the first support plate, and the pair of avoidance grooves divide the first support plate into three sections, and a third detection sensor is provided on the inner side of each support plate; A plurality of third pulleys are arranged along the edge of the first support plate; A third conveyor belt is sleeved on the plurality of third pulleys; a second rotating shaft, the second rotating shaft being rotatably connected to a pair of the first supporting plates respectively, a third pulley at a corresponding position on each first supporting plate being sleeved on the second rotating shaft and being capable of rotating along with the second rotating shaft; a third driving mechanism, the third driving mechanism being disposed between the pair of first support plates, the output end of the third driving mechanism being connected to the second rotating shaft and capable of driving the second rotating shaft to rotate; The first lifting mechanism is arranged below the second fixing seat, and the output end of the first lifting mechanism is connected to the second fixing seat, and can drive the second fixing seat to move up and down.

5. The multifunctional wafer measuring and sorting device according to claim 1, wherein: The detection module includes: a thickness detection mechanism and a resistivity detection mechanism; the thickness detection mechanism and the resistivity detection mechanism are sequentially arranged on the conveying platform.

6. The multifunctional wafer measuring and sorting device according to claim 1, wherein: The centering module comprises: Fifth fixed frame; a fourth driving mechanism connected to the fifth fixing frame; at least two first clamping assemblies, wherein the first clamping assemblies are connected to the fourth driving mechanism; at least one second clamping assembly, wherein the second clamping assembly is connected to the fourth drive mechanism; The first clamping assembly and the second clamping assembly are sequentially arranged in a ring on the fifth fixing frame, and the fourth driving mechanism can drive the first clamping assembly and the second clamping assembly to clamp the wafer so as to center the wafer; The first clamping assembly comprises: a first rotating member and a first clamping member; One end of the first rotating member is connected to the output end of the fourth driving mechanism, and the other end is connected to the first clamping member; The first clamping member is provided with a rubber sleeve for clamping the wafer; The second clamping assembly comprises: a second rotating member, a third rotating member, a second clamping member and a spring; One end of the second rotating member is connected to the output end of the fourth driving mechanism, and the other end is hinged to the third rotating member; A third rotating member is connected to the second clamping member; The second clamping member is provided with a rubber sleeve for clamping the wafer; One end of the spring is connected to the second rotating member, and the other end is connected to the third rotating member, so that the second clamping member can rotate relative to the second rotating member during the process of clamping the wafer; The second lifting mechanism is arranged below the conveying platform and can lift the wafers on the double-belt conveying module.

7. The multifunctional wafer measuring and sorting device according to claim 1, wherein: The sorting module comprises: a first unloading module, which is arranged below the output end of the double-belt conveyor module and is used to convey the wafers; a pair of second unloading modules, the pair of second unloading modules being respectively arranged on both sides of the first unloading module for conveying wafers; The output end of each second unloading module is further provided with a receiving module, and the receiving module is used to collect wafers.

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