Polishing equipment

Abstract

The invention relates to the technical field of polishing, in particular to polishing equipment which comprises a working platform, a fixing plate and a mounting plate are fixedly mounted above the working platform, a suction cup is arranged on the side, away from the mounting plate, of the fixing plate, the suction cup is connected with the fixing plate through a lifting mechanism, and a guide groove is formed in the mounting plate; the number of the guide grooves is three, sliding plates are installed in the guide grooves in a sliding mode, the sliding plates are connected with the installation plate through adjusting mechanisms, a scrap removing mechanism is arranged outside the uppermost sliding plate, and a brush is fixedly installed on the side, close to the suction cup, of the sliding plate on the left side. A rotatable polishing piece is arranged on the side, close to the suction cup, of the sliding plate on the right side. According to the polishing equipment, the suction cup is arranged to suck the round crystal, so that the round crystal is arranged in a vertical state, and when the round crystal is polished, waste chips generated during polishing can fall to the position above the working platform under the action of gravity, so that the waste chips cannot be left on the surface of the round crystal.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing, and specifically to a polishing device. Background Art

[0002] A polishing machine is an electric tool used for grinding and polishing the surface of an object, and is widely used in industries such as machine tools, automobile manufacturing, shipbuilding, and furniture. Its main function is to remove the polished damage layer and achieve a reduction in surface roughness and a mirror polishing effect.

[0003] During mechanical polishing, a wafer is fixed on a polishing head through a vacuum adsorption or clamping device, and the polishing head presses the wafer against the surface of a rotating polishing pad in a horizontal posture. When polishing the wafer, the waste chips generated during polishing will adhere to the surface of the wafer, and the waste chips will cause friction to the wafer, affecting the quality of wafer polishing, resulting in excessive defects in the polished wafer and increasing the cost of wafer polishing. Summary of the Invention

[0004] The purpose of the present invention is to provide a polishing device to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A polishing device includes a working platform, an fixing plate and a mounting plate are fixedly installed above the working platform, a suction cup is arranged on one side of the fixing plate away from the mounting plate, the suction cup is connected to the fixing plate through a lifting mechanism, a guide groove is opened inside the mounting plate, the number of the guide grooves is three groups, a sliding plate is slidably installed inside the guide groove, the sliding plate is connected to the mounting plate through an adjusting mechanism, a chip removing mechanism is arranged outside the uppermost sliding plate, a brush is fixedly installed on one side of the left sliding plate close to the suction cup, and a rotatable polishing part is arranged on one side of the right sliding plate close to the suction cup.

[0006] Preferably, the lifting mechanism includes a support frame, the support frame is slidably inserted inside the fixing plate, the support frame is connected to the suction cup through a rotating structure, a push plate is slidably installed inside the support frame, the push plate is connected to the support frame through an elastic structure, an electric push rod is fixedly installed below the push plate, and the electric push rod is fixedly connected to the working platform.

[0007] Preferably, the rotating structure includes a rotating shaft and a motor, the motor is fixedly installed on one side of the support frame close to the mounting plate, the rotating shaft is fixedly installed at the output end of the motor, the rotating shaft is rotatably connected to the support frame, and the rotating shaft is fixedly connected to the suction cup.

[0008] Preferably, the elastic structure includes a column and a second spring. The column is fixedly installed inside the support frame. The column is vertically arranged. The column is slidably connected to the push plate. The second spring is movably sleeved outside the column. The second spring is fixedly connected to the push plate.

[0009] Preferably, the adjusting mechanism includes a cross bar. The cross bar is fixedly installed on the side of the mounting plate away from the fixed plate. A sleeve is slidably sleeved outside the cross bar. The sleeve is connected to the push plate through a pushing structure. Three adjusting plates are rotatably installed outside the sleeve. One ends of the three adjusting plates away from the sleeve are respectively rotatably connected to three sliding plates.

[0010] Preferably, the pushing structure includes a support rod. The support rod is fixedly installed inside the mounting plate. The support rod is vertically arranged. The support rod is slidably connected to the push plate. A slider is slidably sleeved outside the support rod. The slider is in contact and cooperation with the push plate. A push block is rotatably installed on one side of the slider close to the sleeve. One end of the push block away from the slider is rotatably connected to the sleeve. A chute is opened inside the mounting plate. The chute is slidably connected to the slider. A first spring is movably sleeved outside the support rod. The first spring is fixedly connected to the slider.

[0011] Preferably, a shaft member is fixedly installed on the side of the polishing member away from the suction cup. The shaft member is rotatably connected to one of the sliding plates. A gear is fixedly sleeved outside the shaft member. A turntable is fixedly sleeved outside the rotating shaft. A toothed ring is fixedly installed on one side of the turntable close to the gear. The gear is meshed with the toothed ring.

[0012] Preferably, the chip removal mechanism includes two guiding members. The two guiding members are arranged in a cross shape. A connecting shaft is rotatably installed inside the two guiding members together. The connecting shaft is fixedly connected to one of the sliding plates. The two guiding members are connected to the turntable through a swinging structure. A blowing structure is arranged above the two guiding members.

[0013] Preferably, the swinging structure includes a frame. The frame is slidably connected to one of the sliding plates. A protrusion is fixedly installed on the outer surface of the turntable. The protrusion is in contact and cooperation with the frame. Two moving blocks are slidably installed inside the frame. The two moving blocks are respectively rotatably connected to the two guiding members.

[0014] Preferably, the blowing structure includes a box body. The box body is located above the two guiding members. The box body is fixedly connected to one of the sliding plates. Two discharge ports are opened below the box body. A blower is fixedly installed on one side above the box body. A partition plate is rotatably installed on the other side above the box body.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. By setting a suction cup to adsorb the wafer, the wafer is set in a vertical state. When polishing the wafer, the waste chips generated during polishing can fall above the working platform under the action of gravity, so that the waste chips will not remain on the surface of the wafer and affect the polishing effect.

[0016] 2. By setting a brush, with the cooperation of a hair dryer, the brush can clean the waste chips attached to the surface of the polished wafer. The hair dryer can further improve the chip removal effect, and the hair dryer can also cool the wafer.

[0017] 3. By setting a box body, the partition plate can rotate inside the box body. By adjusting the rotation angle of the partition plate, only the blowing mode can be set, or chemical reagents can be added. When the guiding member swings, it can play a certain guiding role for the wind, increasing the range of the wind. At the same time, the chemical reagents can be applied to the surface of the wafer to improve the polishing effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the structure from another perspective of the present invention; Figure 3 is a schematic diagram of a partial structure of the present invention; Figure 4 is of the present invention Figure 3 structural cross-sectional view; Figure 5 is a schematic diagram of a partial structure of the present invention; Figure 6 is a partial structural cross-sectional view of the present invention; Figure 7 is of the present invention Figure 6 enlarged view of part A; Figure 8 is a partial structural cross-sectional view of the present invention.

[0019] In the drawings, the list of components represented by each reference numeral is as follows: 1. Working platform; 2. Fixed plate; 3. Support frame; 4. Suction cup; 5. Rotating shaft; 6. Motor; 7. Mounting plate; 8. Slide plate; 9. Guide groove; 10. Adjusting plate; 11. Cross bar; 12. Sleeve; 13. Push block; 14. Slide block; 15. Slide groove; 16. Support rod; 17. First spring; 18. Push plate; 19. Electric push rod; 20. Column; 21. Second spring; 22. Polishing member; 23. Shaft member; 24. Gear; 25. Tooth ring; 26. Turntable; 27. Brush; 28. Guiding member; 29. Connecting shaft; 30. Moving block; 31. Frame; 32. Projection; 33. Box body; 34. Discharge port; 35. Partition plate; 36. Fan. DETAILED DESCRIPTION OF THE INVENTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1 - 8 , as shown in the figure, a polishing device includes a working platform 1. Above the working platform 1, a fixing plate 2 and a mounting plate 7 are fixedly installed. On one side of the fixing plate 2 away from the mounting plate 7, a suction cup 4 is provided. The suction cup 4 is connected to the fixing plate 2 through a lifting mechanism. A guide groove 9 is formed inside the mounting plate 7. The number of the guide grooves 9 is three groups. A slide plate 8 is slidably installed inside the guide groove 9. The slide plate 8 is connected to the mounting plate 7 through an adjusting mechanism. A chip removing mechanism is provided outside the uppermost slide plate 8. A brush 27 is fixedly installed on one side of the left slide plate 8 close to the suction cup 4, and a rotatable polishing member 22 is provided on one side of the right slide plate 8 close to the suction cup 4.

[0022] In the initial state, the suction cup 4 is located above the working platform 1. The suction cup 4 adsorbs the wafer to be polished. The lifting mechanism drives the wafer to move upward through the suction cup 4. At the same time, under the action of the adjusting mechanism, the adjusting mechanism drives the slide plate 8 to move inside the guide groove 9 towards the suction cup 4. The suction cup 4 drives the wafer to rotate. When the wafer rotates clockwise, the polishing member 22 polishes the surface of the wafer. Under the action of gravity, the waste chips generated during polishing can fall onto the surface of the working platform 1. Further, when the wafer rotates, the waste chips can be thrown out by centrifugal force. The brush 27 can clean the surface of the polished wafer and remove the waste chips attached to the surface of the wafer. The chip removing mechanism further improves the chip removing effect.

[0023] The lifting mechanism includes a support frame 3. The support frame 3 is slidably inserted inside the fixing plate 2. The support frame 3 is connected to the suction cup 4 through a rotating structure. A push plate 18 is slidably installed inside the support frame 3. The push plate 18 is connected to the support frame 3 through an elastic structure. An electric push rod 19 is fixedly installed below the push plate 18. The electric push rod 19 is fixedly connected to the working platform 1.

[0024] The rotating structure includes a rotating shaft 5 and a motor 6. The motor 6 is fixedly installed on one side of the support frame 3 close to the mounting plate 7. The rotating shaft 5 is fixedly installed at the output end of the motor 6. The rotating shaft 5 is rotatably connected to the support frame 3. The rotating shaft 5 is fixedly connected to the suction cup 4.

[0025] The elastic structure includes a column 20 and a second spring 21. The column 20 is fixedly installed inside the support frame 3. The column 20 is vertically arranged. The column 20 is slidably connected to the push plate 18. The second spring 21 is movably sleeved outside the column 20. The second spring 21 is fixedly connected to the push plate 18.

[0026] The adjusting mechanism includes a cross bar 11. The cross bar 11 is fixedly installed on the side of the mounting plate 7 away from the fixed plate 2. A sleeve 12 is slidably sleeved outside the cross bar 11. The sleeve 12 is connected to the push plate 18 through a pushing structure. Three adjusting plates 10 are rotatably installed outside the sleeve 12. One ends of the three adjusting plates 10 away from the sleeve 12 are respectively rotatably connected to the three sliding plates 8.

[0027] The pushing structure includes a support rod 16. The support rod 16 is fixedly installed inside the mounting plate 7. The support rod 16 is vertically arranged. The support rod 16 is slidably connected to the push plate 18. A slider 14 is slidably sleeved outside the support rod 16. The slider 14 is in contact and cooperation with the push plate 18. A push block 13 is rotatably installed on one side of the slider 14 close to the sleeve 12. One end of the push block 13 away from the slider 14 is rotatably connected to the sleeve 12. A chute 15 is opened inside the mounting plate 7. The chute 15 is slidably connected to the slider 14. A first spring 17 is movably sleeved outside the support rod 16. The first spring 17 is fixedly connected to the slider 14.

[0028] Specifically, connect the electric push rod 19 to an external power source. Under the action of the working platform 1, the electric push rod 19 drives the push plate 18 to move upward. In the initial state, the push plate 18 does not contact the slider 14. Under the action of the second spring 21, the push plate 18 drives the support frame 3 to move upward inside the fixed plate 2. When the push plate 18 contacts the slider 14, the push plate 18 drives the slider 14 to move upward. Under the action of the support rod 16, the first spring 17 deforms under force. At this time, the slider 14 slides inside the chute 15. When the support frame 3 stops moving, the push plate 18 slides outside the column 20. At this time, the second spring 21 is compressed under force.

[0029] At the same time, the slider 14 pushes the push block 13 to rotate. The push block 13 pushes the sleeve 12 to move away from the mounting plate 7 outside the cross bar 11. When the sleeve 12 moves, it can drive the adjusting plate 10 to rotate. The adjusting plate 10 pulls the sliding plate 8 to move toward the suction cup 4 inside the guide groove 9.

[0030] When the suction cup 4 and the wafer stop moving, connect the motor 6 to an external power source. The motor 6 drives the suction cup 4 to rotate through the rotating shaft 5, so as to provide power for the rotation of the wafer.

[0031] On the side of the polishing part 22 away from the suction cup 4, a shaft part 23 is fixedly installed. The shaft part 23 is rotationally connected to one set of slide plates 8. An external fixed sleeve of the shaft part 23 is provided with a gear 24. An external fixed sleeve of the rotating shaft 5 is provided with a turntable 26. On the side of the turntable 26 close to the gear 24, a toothed ring 25 is fixedly installed. The gear 24 meshes with the toothed ring 25.

[0032] Specifically, when the slide plate 8 moves towards the suction cup 4, it can drive the gear 24 to move synchronously, so that the gear 24 can mesh with the toothed ring 25. When the rotating shaft 5 rotates, it can drive the turntable 26 to move synchronously. The turntable 26 drives the toothed ring 25 to rotate. The gear 24 drives the polishing part 22 to rotate through the shaft part 23. When the polishing part 22 rotates, it can polish the wafer.

[0033] The chip removal mechanism includes two sets of guiding parts 28. The two sets of guiding parts 28 are arranged crosswise. A connecting shaft 29 is jointly and rotationally installed inside the two sets of guiding parts 28. The connecting shaft 29 is fixedly connected to one set of slide plates 8. The two sets of guiding parts 28 are connected to the turntable 26 through a swinging structure. Above the two sets of guiding parts 28, a blowing structure is provided.

[0034] The swinging structure includes a frame 31. The frame 31 is slidably connected to one set of slide plates 8. A protrusion 32 is fixedly installed on the outer surface of the turntable 26. The protrusion 32 is in contact and cooperation with the frame 31. Two moving blocks 30 are slidably installed inside the frame 31. The two moving blocks 30 are respectively rotationally connected to the two sets of guiding parts 28.

[0035] The blowing structure includes a box body 33. The box body 33 is located above the two sets of guiding parts 28. The box body 33 is fixedly connected to one set of slide plates 8. Two discharge ports 34 are opened below the box body 33. A blower 36 is fixedly installed on one side above the box body 33. A partition plate 35 is rotationally installed on the other side above the box body 33.

[0036] Specifically, when the turntable 26 rotates, it drives the protrusion 32 to rotate synchronously. When the protrusion 32 rotates, it contacts and pushes the frame 31 to move upward. Under the action of the connecting shaft 29, when the frame 31 moves upward, it drives the guiding part 28 to rotate around the connecting shaft 29 through the moving block 30. At this time, the angle between the two sets of guiding parts 28 becomes smaller. When the frame 31 moves downward, the angle between the two sets of guiding parts 28 increases. When the guiding part 28 swings around the connecting shaft 29, it can contact the surface of the wafer and scrape the surface of the wafer.

[0037] Under the action of the box body 33, the fan 36 pumps the external air into the interior of the box body 33 and discharges it through the discharge port 34. The air can move along the guiding member 28, enabling the air to swing on the surface of the wafer, blowing away the waste chips and dust adhering to the surface of the wafer, and being able to cool the wafer. When the guiding member 28 swings, it can increase the range of air blowing.

[0038] Furthermore, by adjusting the partition plate 35, when only air needs to be blown, the partition plate 35 rotates to the horizontal state, and the air can only be discharged through the discharge port 34 after entering the interior of the box body 33. When it is necessary to apply a chemical reagent to the surface of the wafer, the partition plate 35 is rotated to the vertical state. It should be noted that the partition plate 35 is adsorbed to the box body 33 by a magnet. At this time, the air can only be discharged from the left discharge port 34 after entering the interior of the box body 33. A bottle containing the chemical reagent is inserted into the interior of the box body 33, and the chemical reagent can flow out from the right discharge port 34. The guiding member 28 can apply the chemical reagent to the surface of the wafer, improving the polishing effect of the wafer.

[0039] Working principle: In the initial state, the suction cup 4 is located above the working platform 1, and the suction cup 4 adsorbs the wafer to be polished. Connect the electric push rod 19 to an external power source. Under the action of the working platform 1, the electric push rod 19 drives the push plate 18 to move upward. In the initial state, the push plate 18 does not contact the slider 14. Under the action of the second spring 21, the push plate 18 drives the support frame 3 to move upward inside the fixed plate 2. When the push plate 18 contacts the slider 14, the push plate 18 drives the slider 14 to move upward. Under the action of the support rod 16, the first spring 17 deforms under force. At this time, the slider 14 slides inside the chute 15. When the support frame 3 stops moving, the push plate 18 slides outside the column 20, and at this time, the second spring 21 is compressed under force.

[0040] At the same time, the slider 14 pushes the push block 13 to rotate, and the push block 13 pushes the sleeve 12 to move away from the mounting plate 7 outside the cross bar 11. When the sleeve 12 moves, it can drive the adjusting plate 10 to rotate, and the adjusting plate 10 pulls the sliding plate 8 to move toward the suction cup 4 inside the guide groove 9.

[0041] When the suction cup 4 and the wafer stop moving, connect the motor 6 to an external power source. The motor 6 drives the suction cup 4 to rotate through the rotating shaft 5, and the suction cup 4 drives the wafer to rotate. When the wafer rotates clockwise, the rotating shaft 5 can drive the turntable 26 to move synchronously during rotation. The turntable 26 drives the toothed ring 25 to rotate, and the gear 24 drives the polishing member 22 to rotate through the shaft member 23. When the polishing member 22 rotates, it can polish the wafer.

[0042] When the turntable 26 rotates, it drives the protrusion 32 to rotate synchronously. When the protrusion 32 rotates, it contacts the frame 31 and pushes the frame 31 to move upward. Under the action of the connecting shaft 29, when the frame 31 moves upward, it drives the guide member 28 to rotate around the connecting shaft 29 through the moving block 30. At this time, the angle between the two guide members 28 becomes smaller. When the frame 31 moves downward, the angle between the two guide members 28 increases. Under the action of the box body 33, the air blower 36 pumps the external air into the interior of the box body 33 and discharges it through the discharge port 34. The air can move along the guide member 28.

[0043] When only air needs to be blown, the partition 35 rotates to the horizontal state, and the air can only be discharged through the discharge port 34 after entering the interior of the box body 33. When it is necessary to apply the chemical reagent on the surface of the wafer, the partition 35 is rotated to the vertical state. It should be noted that the partition 35 is adsorbed to the box body 33 by a magnet. At this time, the air can only be discharged from the left discharge port 34 after entering the interior of the box body 33. The bottle containing the chemical reagent is inserted into the interior of the box body 33, and the chemical reagent can flow out from the right discharge port 34. The guide member 28 can apply the chemical reagent on the surface of the wafer, improving the polishing effect of the wafer.

[0044] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0045] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polishing device, comprising a working platform (1), characterized in that: A fixing plate (2) and a mounting plate (7) are fixedly mounted above the working platform (1); a suction cup (4) is arranged on a side of the fixing plate (2) away from the mounting plate (7); the suction cup (4) is connected to the fixing plate (2) via a lifting mechanism; a guide groove (9) is provided inside the mounting plate (7); the guide grooves (9) are provided in three groups; a slide plate (8) is slidably mounted inside the guide groove (9); the slide plate (8) is connected to the mounting plate (7) via an adjusting mechanism; a chip removal mechanism is arranged on the outside of the topmost slide plate (8); a brush (27) is fixedly mounted on a side of the left slide plate (8) close to the suction cup (4); and a rotatable polishing member (22) is arranged on a side of the right slide plate (8) close to the suction cup (4).

2. A polishing device according to claim 1, characterized in that: The lifting mechanism comprises a support frame (3), the support frame (3) is slidably inserted into the interior of the fixed plate (2), the support frame (3) is connected to the suction cup (4) via a rotating structure, a push plate (18) is slidably installed inside the support frame (3), the push plate (18) is connected to the support frame (3) via an elastic structure, an electric push rod (19) is fixedly installed below the push plate (18), and the electric push rod (19) is fixedly connected to the working platform (1).

3. A polishing device according to claim 2, characterized in that: The rotating structure comprises a rotating shaft (5) and a motor (6); the motor (6) is fixedly mounted on a side of the support frame (3) close to the mounting plate (7); the rotating shaft (5) is fixedly mounted on an output end of the motor (6); the rotating shaft (5) is rotatably connected to the support frame (3); and the rotating shaft (5) is fixedly connected to the suction cup (4).

4. A polishing device according to claim 2, characterized in that: The elastic structure comprises a column (20) and a second spring (21); the column (20) is fixedly mounted inside the support frame (3); the column (20) is arranged in a vertical position; the column (20) and the push plate (18) are slidably connected; the second spring (21) is movably sleeved outside the column (20); and the second spring (21) and the push plate (18) are fixedly connected.

5. A polishing device according to claim 2, characterized in that: The adjustment mechanism comprises a cross bar (11), wherein the cross bar (11) is fixedly mounted on a side of the mounting plate (7) away from the fixed plate (2), the outer sliding sleeve of the cross bar (11) is provided with a sleeve (12), the sleeve (12) is connected to a push plate (18) via a pushing structure, and three groups of adjustment plates (10) are rotatably mounted on the outer side of the sleeve (12), and the ends of the three groups of adjustment plates (10) away from the sleeve (12) are rotatably connected to the three groups of slide plates (8) respectively.

6. A polishing device according to claim 5, characterized in that: The pushing structure comprises a support rod (16), wherein the support rod (16) is fixedly mounted inside the mounting plate (7), the support rod (16) is arranged in a vertical shape, the support rod (16) and the push plate (18) are slidably connected, the outer sliding sleeve of the support rod (16) is provided with a slider (14), the slider (14) and the push plate (18) are in contact and fit, a push block (13) is rotatably mounted on a side of the slider (14) close to the sleeve (12), the end of the push block (13) away from the slider (14) is rotatably connected to the sleeve (12), a slide groove (15) is provided inside the mounting plate (7), the slide groove (15) and the slider (14) are slidably connected, the outer movable sleeve of the support rod (16) is provided with a No. 1 spring (17), and the No. 1 spring (17) and the slider (14) are fixedly connected.

7. A polishing device according to claim 3, characterized in that: A shaft member (23) is fixedly mounted on a side of the polishing member (22) away from the suction cup (4); the shaft member (23) is rotatably connected to one of the sets of slide plates (8); an external fixed sleeve of the shaft member (23) is provided with a gear (24); an external fixed sleeve of the rotating shaft (5) is provided with a rotating disk (26); a gear ring (25) is fixedly mounted on a side of the rotating disk (26) close to the gear (24); the gear (24) and the gear ring (25) are meshed.

8. A polishing device according to claim 7, characterized in that: The chip removal mechanism comprises two groups of guide members (28), the two groups of guide members (28) are arranged crosswise, a connecting shaft (29) is installed inside the two groups of guide members (28) for common rotation, the connecting shaft (29) is fixedly connected to one group of slide plates (8), the two groups of guide members (28) are connected to the turntable (26) via a swing structure, and a blowing structure is arranged above the two groups of guide members (28).

9. A polishing device according to claim 8, characterized in that: The swing structure comprises a frame (31), the frame (31) is slidably connected to one group of slide plates (8), a protrusion (32) is fixedly mounted on the outer surface of the turntable (26), the protrusion (32) is in contact with the frame (31), and two groups of moving blocks (30) are slidably mounted inside the frame (31), and the two groups of moving blocks (30) are rotatably connected to the two groups of guide members (28) respectively.

10. A polishing device according to claim 8, characterized in that: The blowing structure comprises a box body (33), the box body (33) is located above the two groups of guide members (28), the box body (33) is fixedly connected to one group of slide plates (8), two groups of discharge ports (34) are provided below the box body (33), a fan (36) is fixedly mounted on one side above the box body (33), and a partition plate (35) is rotatably mounted on the other side above the box body (33).

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