Epoxy resin composition, preparation method thereof and electrical insulation part

Abstract

The invention provides an epoxy resin composition, a preparation method thereof and an electrical insulator, and relates to the technical field of epoxy resin. The epoxy resin composition provided by the invention comprises the epoxy resin, the aromatic amine curing agent, the boron trifluoride complex accelerant, the polyhydric alcohol and the filler, the gelation time of the epoxy resin composition is reasonable under different temperature conditions (80 / 140 DEG C), and relatively long tank storage time can be realized. The glass transition temperature of the epoxy resin composition is higher than that of the anhydride curing agent, so that the epoxy resin composition has higher heat resistance. The toughness of the epoxy resin composition is further improved by adding the toughening agent.

Description

Technical Field

[0001] The present application relates to the technical field of epoxy resins, and in particular to an epoxy resin composition and a preparation method thereof and an electrical insulating component. Background Art

[0002] The formula composition of the electrical insulation material epoxy resin composition suitable for automatic pressure gel injection technology (APG) process production mainly includes bisphenol A epoxy resin, toughened modified anhydride curing agent, silica filler and accelerator for adjusting the curing process time. However, due to the increasingly stringent regulatory framework for chemicals, some anhydrides have been listed on the SVHC (Substances of Very High Concern) candidate list stipulated in the EU Regulation "Registration, Evaluation, Authorization and Restriction of Chemicals" (REACH). It is very likely that these substances will be banned in recent years, so the demand for non-anhydride curing agents will become more and more urgent.

[0003] Aliphatic or alicyclic amine curing agents can also be used to cure epoxy resins, but they are too reactive to be well used in electrical casting or encapsulation. There are two reasons for this: first, the reaction speed of epoxy resins with aliphatic or alicyclic amine curing agents is generally fast, which cannot meet the requirements of APG for tank storage time; second, the reaction exotherm is huge, which can cause the mechanical properties of thermosetting materials to deteriorate, or even cause thermal decomposition of thermosetting materials. Summary of the invention

[0004] The purpose of the present application is to provide an epoxy resin composition, a preparation method thereof and an electrical insulating part, in order to solve the problem that the existing epoxy resin composition using aliphatic or alicyclic amine curing agents has a tank storage time that does not meet the APG process requirements and has reduced strength and toughness.

[0005] To achieve the above objectives, the present application provides an epoxy resin composition, the raw materials of which, by mass, include: 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6-0.8 parts of boron trifluoride complex accelerator, 7-12.5 parts of polyol and 200-240 parts of filler.

[0006] In some embodiments, the epoxy resin composition is characterized in that its raw materials, measured in parts by mass, include: 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6 parts of boron trifluoride complex accelerator, 7 parts of polyol and 200-240 parts of filler.

[0007] In some embodiments, the raw materials further include, by weight, 0-12 parts of a toughening agent.

[0008] In some embodiments, the epoxy resin includes any one of glycidyl ether epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, alicyclic epoxy resins, multi-functional special epoxy resins, and hydrogenated bisphenol A epoxy resins;

[0009] Optionally, the aromatic amine curing agent includes diethyltoluenediamine.

[0010] In some embodiments, the boron trifluoride complex promoter includes at least one of boron trifluoride ethyl ether, boron trifluoride benzylamine, boron trifluoride isopropylamine, and boron trifluoride monoethylamine.

[0011] In some embodiments, the polyol includes polyether polyol.

[0012] In some embodiments, the filler includes silica powder;

[0013] Optionally, the D50 of the silica powder is 20 - 30 μm.

[0014] In some embodiments, the toughening agent includes nano core-shell rubber epoxy resin;

[0015] Optionally, the core of the nano core-shell rubber includes any one of styrene-butadiene rubber, butadiene rubber, silicone rubber, and acrylate rubber, and the shell of the nano core-shell rubber includes polymethyl methacrylate;

[0016] Optionally, the particle size of the nano core-shell rubber is 100 nm - 200 nm.

[0017] This application also provides a preparation method of the above epoxy resin composition, including:

[0018] Disperse the boron trifluoride complex promoter into the epoxy resin at 100 - 130 °C. After the boron trifluoride complex promoter is completely melted into the epoxy resin, let it cool to room temperature;

[0019] Mix the epoxy resin added with the boron trifluoride complex promoter, the aromatic amine curing agent, the polyol, and the filler evenly in proportion to obtain the epoxy resin composition.

[0020] This application also provides an electrical insulating part prepared by using the above epoxy resin composition.

[0021] Compared with the prior art, the beneficial effects of this application include:

[0022] The epoxy resin composition provided by this application includes an epoxy resin, an aromatic amine curing agent, a boron trifluoride complex promoter, a polyol, and a filler. The gel time of this epoxy resin composition is reasonable under different temperature conditions (80 / 140 degrees), and a relatively long pot life can be achieved. The curing reaction between the aromatic amine curing agent and the epoxy resin has the disadvantages of a long curing time and poor toughness of the cured product. The epoxy resin composition of this application shortens the high-temperature curing time of the material through the combination of a certain proportion of the boron trifluoride complex promoter and the polyol, and can also maintain a certain low-temperature storage time. If too much boron trifluoride complex promoter is added, the reaction rate is fast, but the low-temperature storage time is short; if too little is added, the high-temperature reaction is slow, which affects the processing and molding time of the product; the addition of the polyol plays a role in regulating the high-temperature reactivity of the boron trifluoride complex promoter and maintaining the low-temperature storage property; however, adding too much polyol will reduce the glass transition temperature of the material. The glass transition temperature of the epoxy resin composition of this application is higher than that of the anhydride curing agent, making the epoxy resin composition of this application have higher heat resistance. Further, the toughness of the epoxy resin composition is improved by adding a toughening agent. Detailed Embodiments

[0023] As used herein, the terms:

[0024] "Prepared from" is synonymous with "comprising". The terms "comprising", "including", "having", "containing" or any other variation thereof as used herein are intended to cover non-exclusive inclusion. For example, a composition, step, method, article, or apparatus that comprises the listed elements is not necessarily limited to those elements, but may include other elements not expressly listed or elements inherent to such composition, step, method, article, or apparatus.

[0025] When an equivalent, concentration, or other value or parameter is expressed as a range, a preferred range, or a range defined by a series of upper preferred values and lower preferred values, this should be understood to specifically disclose all ranges formed by any pairing of any range upper limit or preferred value with any range lower limit or preferred value, whether or not the ranges are separately disclosed. For example, when the range "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2", "1 to 2 and 4 to 5", "1 to 3 and 5", etc. When a numerical range is described herein, unless otherwise specified, the range is intended to include its end values and all integers and fractions within the range.

[0026] In these examples, unless otherwise specified, the parts and percentages are by mass.

[0027] "Parts by mass" refers to the basic measurement unit representing the mass ratio relationship of multiple components. 1 part can represent any unit mass, such as 1 g or 2.689 g, etc. If we say that the mass of component A is a parts by mass and the mass of component B is b parts by mass, it means the mass ratio of component A to component B is a:b. Or it means the mass of component A is aK and the mass of component B is bK (K is any number representing a multiple factor). It should not be misunderstood that, different from the number of parts by mass, the sum of the parts by mass of all components is not limited to 100 parts.

[0028] "And / or" is used to indicate that either one or both of the described situations may occur. For example, A and / or B includes (A and B) and (A or B).

[0029] The present application provides an epoxy resin composition. Based on parts by mass, its raw materials include: 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6 - 0.8 parts of boron trifluoride complex accelerator, 7 - 12.5 parts of polyol, and 200 - 240 parts of filler.

[0030] Among them, the number of parts by mass of the boron trifluoride complex accelerator can be, for example, 0.6 part, 0.7 part, 0.8 part, or any value between 0.6 - 0.8 parts; the number of parts by mass of the polyol can be, for example, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 12.5 parts, or any value between 7 - 12.5 parts; the number of parts by mass of the filler can be, for example, 200 parts, 205 parts, 210 parts, 215 parts, 220 parts, 230 parts, 235 parts, 240 parts, or any value between 200 - 240 parts.

[0031] The epoxy resin composition provided by the present application includes epoxy resin, aromatic amine curing agent, boron trifluoride complex accelerator, polyol, and filler. The gel time of this epoxy resin composition is reasonable under different temperature conditions (80 / 140 degrees), and a relatively long pot life can be achieved. There are disadvantages in the curing reaction between the aromatic amine curing agent and the epoxy resin, such as a long curing time and poor toughness of the cured product. The epoxy resin composition of the present application shortens the high-temperature curing time of the material through the combination of a certain proportion of boron trifluoride complex accelerator and polyol, and can also maintain a certain low-temperature storage time. If too much boron trifluoride complex accelerator is added, the reaction rate is fast but the low-temperature storage time is short; if too little is added, the high-temperature reaction is slow, affecting the processing and molding time of the product; the addition of polyol plays a role in regulating the high-temperature reactivity of the boron trifluoride complex accelerator and maintaining the low-temperature storage property; however, if too much polyol is added, the glass transition temperature of the material will be reduced. The glass transition temperature of the epoxy resin composition of the present application is higher than that of the anhydride curing agent, making the epoxy resin composition of the present application have higher heat resistance.

[0032] In some embodiments, an epoxy resin composition, characterized in that, based on parts by mass of raw materials, it includes: 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6 part of boron trifluoride complex accelerator, 7 parts of polyol, and 200 - 240 parts of filler.

[0033] In some embodiments, the epoxy resin includes any one of glycidyl ether epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, alicyclic epoxy resins, multi-functional special epoxy resins, and hydrogenated bisphenol A epoxy resins.

[0034] Among them, glycidyl ether epoxy resins are the most common type, usually prepared by reacting polyhydric phenols (such as bisphenol A, bisphenol F, or bisphenol S) with epichlorohydrin. Glycidyl ether epoxy resins contain glycidyl ether structures, and the most representative among them is bisphenol A type epoxy resin. Other main varieties include tetrabromobisphenol A diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, etc.

[0035] Glycidyl ester epoxy resins are obtained by reacting dibasic or polybasic carboxylic acids with epichlorohydrin and removing hydrogen chloride. Such resins usually have good weather resistance. The reaction activity of such epoxy resins is relatively high, and the gel time is only about half of that of bisphenol A type epoxy resins. The bonding strength of such resins is high, and the cured material has excellent mechanical properties.

[0036] Glycidyl amine epoxy resins are products of the reaction of polyamines with epichlorohydrin. Such resins perform excellently in terms of heat resistance and mechanical properties. Such epoxy resins have multiple functional groups, which increases the crosslinking density. Due to the high crosslinking and the presence of aromatic rings in their molecular structure, the heat resistance of such epoxy resins is better than that of general epoxy resins.

[0037] Alicyclic epoxy resins are synthesized from alicyclic compounds, with good stability, high safety performance, and excellent performance at high temperatures. The epoxy groups of alicyclic epoxy resins are directly connected to the alicyclic ring. After curing, the crosslinking density is large, and it has a tight rigid structure, so the heat resistance temperature is high. Since the molecular structure does not contain benzene rings, alicyclic epoxy resins have good weather resistance and anti-yellowing performance. Epichlorohydrin is not used in the synthesis process, so it does not contain by-products such as chloride ions and sodium ions, and has better dielectric properties. The viscosity of alicyclic epoxy resins is relatively small, which is convenient for casting and potting operations, and has good processability.

[0038] Multi-functional special epoxy resins are a type of epoxy resins with multiple reactive functional groups, usually used to improve the performance and adaptability of materials. Multi-functional special epoxy resins have a relatively high crosslinking density after curing, which enables them to maintain excellent mechanical properties and insulation properties at high temperatures.

[0039] Hydrogenated bisphenol A epoxy resin is a special epoxy resin, which can be produced by the addition reaction of bisphenol A epoxy resin with hydrogen under the action of a catalyst. Hydrogenated bisphenol A epoxy resin has good weather resistance, chemical resistance, electrical insulation and other properties.

[0040] In some embodiments, the aromatic amine curing agent includes diethyltoluenediamine.

[0041] Among them, diethyltoluenediamine is a liquid, low-viscosity, low-toxic aromatic amine curing agent with a fast reaction rate, hydrolysis resistance and heat resistance, which can improve the strength and hydrolysis resistance of products.

[0042] In some embodiments, the boron trifluoride complex promoter includes at least one of boron trifluoride ethyl ether, boron trifluoride benzylamine, boron trifluoride isopropylamine, and boron trifluoride monoethylamine. For example, the boron trifluoride series complexes produced by Rugao Chemical Reagent Factory Co., Ltd.

[0043] Among them, boron trifluoride ethyl ether is a complex formed by boron trifluoride and ethyl ether, which has a tetrahedral structure, and the boron atom is bonded to the oxygen atom of ethyl ether through a coordination bond. Boron trifluoride ethyl ether is a strong Lewis acid and can be used as a source of boron trifluoride, which is widely used in organic synthesis, especially in reactions that require Lewis acid catalysis.

[0044] Among them, boron trifluoride benzylamine is a complex formed by boron trifluoride and benzylamine, boron trifluoride isopropylamine is a complex formed by boron trifluoride and isopropylamine, and boron trifluoride monoethylamine is a complex formed by boron trifluoride and monoethylamine.

[0045] In some embodiments, the polyol includes polyether polyol.

[0046] Among them, polyether polyol is formed by ring-opening polymerization of low molecular weight polyols, polyamines or compounds containing active hydrogen as initiators with alkylene oxides (such as ethylene oxide, propylene oxide, etc.) under the action of a catalyst. The molecular structure of polyether polyol contains ether bonds and multiple hydroxyl groups, and is usually prepared by the copolymerization reaction of ethylene oxide and propylene oxide. As the molecular weight of polyether polyol increases, the viscosity will increase. It has good chemical stability, is not easy to react with chemicals such as acids and alkalis, and at the same time has good water resistance and heat resistance.

[0047] In some embodiments, the filler includes silica powder;

[0048] Optionally, the D50 of the silica powder is 20-30um.

[0049] Silica powder is a kind of silica powder material obtained by processing natural quartz (SiO2) or fused quartz (non-crystalline SiO2 obtained by high-temperature melting and cooling of natural quartz) through a series of processes. It has the characteristics of being non-toxic, odorless, and pollution-free, as well as excellent properties such as high heat resistance, high insulation, low linear expansion coefficient, and good thermal conductivity. The classification of silica powder includes fused silica powder, crystalline silica powder, reactive silica powder, cristobalite silica powder, etc.

[0050] In some embodiments, based on mass parts, the raw materials further include: 0 - 12 parts of a toughening agent, for example, it can be 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts or any value between 0 - 12 parts.

[0051] The epoxy resin composition provided by this application further improves the toughness of the epoxy resin composition by adding a toughening agent.

[0052] In some embodiments, the toughening agent includes nano core-shell rubber epoxy resin, which is composed of a nano core-shell rubber emulsion and epoxy resin.

[0053] Among them, the nano core-shell rubber emulsion is a nano-level composite emulsion material with a core-shell structure, and its core and shell are composed of different components. The preparation of core-shell rubber usually adopts the seed emulsion polymerization method to form a core-shell structure through staged polymerization. Mix the emulsifier, initiator, and core monomer, and form a core emulsion through pre-emulsification and polymerization reaction. On the basis of the core emulsion, add the shell monomer and initiator to complete the shell layer polymerization.

[0054] Optionally, the core of the nano core-shell rubber includes any one of styrene-butadiene rubber, butadiene rubber, silicone rubber, and acrylate rubber, and the shell of the nano core-shell rubber includes polymethyl methacrylate.

[0055] Optionally, the particle size of the nano core-shell rubber is 100nm - 200nm, for example, it can be 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm or any value between 100nm - 200nm.

[0056] This application also provides a preparation method of the above epoxy resin composition, including:

[0057] Disperse the boron trifluoride complex promoter into the epoxy resin under the condition of 100 - 130 degrees. After the boron trifluoride complex promoter is completely melted into the epoxy resin, let it cool to room temperature.

[0058] The epoxy resin, aromatic amine curing agent, polyol and filler added with a boron trifluoride complex promoter are mixed evenly in proportion to obtain the epoxy resin composition.

[0059] Among them, the dispersion temperature of the boron trifluoride complex promoter can be, for example, 100 °C, 105 °C, 110 °C, 115 °C, 120 °C, 125 °C, 130 °C or any value between 100 - 130 °C.

[0060] This application also provides an electrical insulating part, which is prepared by using the above-mentioned epoxy resin composition.

[0061] The implementation scheme of this application will be described in detail below in combination with specific embodiments. However, those skilled in the art will understand that the following embodiments are only used to illustrate this application and should not be regarded as limiting the scope of this application. For those not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. For reagents or instruments whose manufacturers are not specified, they are all conventional products that can be obtained through commercial purchase.

[0062] Description of substances used in the following examples and comparative examples:

[0063] CYD-127E: Bisphenol A epoxy resin, epoxy equivalent 180 - 186, purchased from: Baling Petrochemical Co., Ltd., Sinopec Group.

[0064] DETDA: Diethyltoluenediamine, purchased from: Zhangjiagang Yarui Chemical Co., Ltd.

[0065] BF3-MEA: Boron trifluoride monoethylamine, purchased from: Rugao Chemical Reagent Factory Co., Ltd.

[0066] PPG400: Polyether polyol, purchased from: Jiangsu Haian Petrochemical Factory, hydroxyl value 255 - 312 mgKOH / g, molecular weight 360 - 440, acid value ≤ 0.5 mgKOH / g.

[0067] DC1265: Silica powder, purchased from: Jiangsu Lianrui New Materials Co., Ltd.

[0068] MX125: Nano core-shell rubber toughening agent, purchased from: Dalian Liansheng New Materials Group Co., Ltd.

[0069] Example 1

[0070] Example 1 provides an epoxy resin composition, and its raw materials are in parts by mass, including: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.8 part of boron trifluoride complex promoter BF3-MEA, 12.5 parts of polyether polyol PPG400 and 204.7 parts of filler DC1265.

[0071] Example 1 also provides a method for preparing an epoxy resin composition, including:

[0072] First, disperse the boron trifluoride complex accelerator in bisphenol A epoxy resin at 100 °C. After the boron trifluoride complex accelerator is completely melted, let it cool to room temperature.

[0073] Second, mix the bisphenol A epoxy resin added with the boron trifluoride complex accelerator, DETDA, polyether polyol, and filler evenly in proportion to obtain the epoxy resin composition of Example 1.

[0074] Example 2

[0075] Example 2 provides an epoxy resin composition, and its raw materials are in parts by mass, including: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.6 part of boron trifluoride complex accelerator BF3-MEA, 7 parts of polyether polyol PPG400, and 216.5 parts of filler DC1265.

[0076] The preparation method of the epoxy resin composition of Example 2 is the same as that of Example 1 and will not be elaborated here.

[0077] Example 3

[0078] Example 3 provides an epoxy resin composition, and its raw materials are in parts by mass, including: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.6 part of boron trifluoride complex accelerator BF3-MEA, 7 parts of polyether polyol PPG400, 216.5 parts of filler DC1265, and 12 parts of toughening agent MX125.

[0079] Example 3 also provides a method for preparing an epoxy resin composition, including:

[0080] First, disperse the boron trifluoride complex accelerator in bisphenol A epoxy resin at 100 °C. After the boron trifluoride complex accelerator is completely melted, let it cool to room temperature.

[0081] Second, mix CYD-127E, DETDA, PPG400, MX125, and DC1265 added with the boron trifluoride complex accelerator evenly in proportion to obtain the epoxy resin composition of Example 3.

[0082] Example 4

[0083] Example 4 provides an epoxy resin composition. Based on mass parts, its raw materials include: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.6 part of boron trifluoride complex accelerator BF3-MEA, 7 parts of polyether polyol PPG400, 236.5 parts of filler DC1265, and 12 parts of toughening agent MX125.

[0084] The preparation method of the epoxy resin composition of Example 4 is the same as that of Example 3, and will not be elaborated here.

[0085] Comparative Example 1

[0086] The epoxy resin composition of Comparative Example 1 is the solution of Example 1b in the prior art CN107636039A.

[0087] Comparative Example 2

[0088] The epoxy resin composition of Comparative Example 2 is the solution of Comparative Example 5b in the prior art CN107636039A.

[0089] Comparative Example 3

[0090] Comparative Example 3 provides an epoxy resin composition. Based on mass parts, its raw materials include: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 1.4 parts of boron trifluoride complex accelerator BF3-MEA, 15 parts of polyether polyol PPG400, and 190 parts of filler DC1265.

[0091] Comparative Example 4

[0092] Comparative Example 4 provides an epoxy resin composition. Based on mass parts, its raw materials include: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.3 part of boron trifluoride complex accelerator BF3-MEA, and 196.5 parts of filler DC1265.

[0093] Comparative Example 5

[0094] Comparative Example 5 provides an epoxy resin composition. Based on mass parts, its raw materials include: 100 parts of bisphenol A epoxy resin CYD-127E, 24 parts of aromatic amine curing agent DETDA, 0.6 part of boron trifluoride complex accelerator BF3-MEA, 15 parts of polyether polyol PPG400, and 190 parts of filler DC1265.

[0095] The performance test results of the epoxy resin compositions of Examples 1 to 4 and Comparative Examples 3 to 5 are shown in Table 1.

[0096] Performance test results of the epoxy resin compositions of each example and comparative example in Table 1

[0097]

[0098]

[0099]

[0100] As can be seen from Table 1, the gel time of the epoxy resin composition provided in this application is reasonable under different temperature conditions (80 / 140 °C), and a longer pot life can be achieved. In Examples 1 to 4, the high-temperature curing time of the material is shortened by the combination of a certain proportion of boron trifluoride complex promoter and polyol, and at the same time, a certain low-temperature storage time can be maintained. If too much boron trifluoride complex promoter is added, the reaction rate is fast, but the low-temperature storage time is short (Comparative Example 3); if too little is added, the high-temperature reaction is slow, which affects the processing and molding time of the product (Comparative Example 4); the addition of polyol plays a role in regulating the high-temperature reactivity of the boron trifluoride complex promoter and maintaining the low-temperature storage property; however, adding too much polyol will reduce the glass transition temperature of the material, such as Comparative Example 3 and Comparative Example 5. The glass transition temperature of the epoxy resin composition is higher than that of the anhydride curing agent, making the epoxy resin composition of this application have higher heat resistance. Further, the toughness of the epoxy resin composition is improved by adding a toughening agent, such as Example 3 and Example 4.

[0101] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing examples, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of each example of this application.

[0102] In addition, those skilled in the art can understand that although some of the examples herein include certain features included in other examples but not other features, the combination of the features of different examples means that it is within the scope of this application and forms different examples. For example, in the above claims, any one of the claimed examples can be used in any combination. The information disclosed in this background art section is only intended to deepen the understanding of the overall background art of this application, and should not be regarded as admitting or implying in any form that this information constitutes prior art known to those skilled in the art.

Claims

1. An epoxy resin composition, characterized in that The raw materials thereof include, by weight, 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6-0.8 parts of boron trifluoride complex accelerator, 7-12.5 parts of polyol and 200-240 parts of filler.

2. The epoxy resin composition according to claim 1, characterized in that The raw materials thereof include, by weight, 100 parts of epoxy resin, 24 parts of aromatic amine curing agent, 0.6 parts of boron trifluoride complex accelerator, 7 parts of polyol and 200-240 parts of filler.

3. The epoxy resin composition according to claim 1 or 2, characterized in that The raw materials thereof also include, by weight, 0-12 parts of a toughening agent.

4. The epoxy resin composition according to claim 1, characterized in that The epoxy resin includes any one of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, alicyclic epoxy resin, multifunctional special epoxy resin, and hydrogenated bisphenol A epoxy resin; Optionally, the aromatic amine curing agent includes diethyltoluenediamine.

5. The epoxy resin composition according to claim 1, characterized in that The boron trifluoride complex promoter includes at least one of boron trifluoride ethyl ether, boron trifluoride benzylamine, boron trifluoride isopropylamine and boron trifluoride monoethylamine.

6. The epoxy resin composition according to claim 1, characterized in that The polyols include polyether polyols.

7. The epoxy resin composition according to claim 1, characterized in that The filler includes silicon powder; Optionally, the D50 of the silicon micropowder is 20-30 um.

8. The epoxy resin composition according to claim 3, characterized in that The toughening agent includes nano core-shell rubber epoxy resin; Optionally, the core of the nano core-shell rubber includes any one of styrene-butadiene rubber, butadiene rubber, silicone rubber and acrylate rubber, and the shell of the nano core-shell rubber includes polymethyl methacrylate; Optionally, the particle size of the nano core-shell rubber is 100nm-200nm.

9. A method for preparing the epoxy resin composition according to any one of claims 1 to 8, characterized in that: include: Disperse the boron trifluoride complex accelerator into the epoxy resin at 100-130 degrees, and after the boron trifluoride complex accelerator is completely dissolved into the epoxy resin, place it to cool to room temperature; The epoxy resin to which the boron trifluoride complex accelerator is added, the aromatic amine curing agent, the polyol and the filler are uniformly mixed according to a certain proportion to obtain the epoxy resin composition.

10. An electrical insulating member, characterized in that: The method is prepared using the epoxy resin composition according to any one of claims 1 to 8.

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