Method and device for insulating a gas line
By using a steam conveying system with a flexible heating element and a multi-air gap insulating layer in the gas distribution plate, the problem of uneven gas distribution in the prior art is solved, and uniform gas transportation and efficient heating are achieved.
Patent Information
- Application Number
- CN202411875116.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-22
- Filing Date
- 2024-12-19
- Publication Date
- 2025-06-24
AI Technical Summary
In the manufacture of semiconductors, it is difficult for the existing gas distribution plates to effectively transport precursor and reactant gas, resulting in uneven gas distribution in the reaction chamber.
A steam delivery system including a flexible heating element and a multi-air gap insulating layer is adopted to heat the gas pipeline through the heating element, and the air gap of the insulating layer is used to improve the thermal barrier effect to ensure uniform gas transportation.
The uniform transportation and efficient heating of gas are achieved, and the uniformity and efficiency of gas distribution in reaction chambers in semiconductor manufacturing are improved.
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Figure CN120194261A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure generally relates to methods and apparatus for insulating gas pipelines. More specifically, the present invention relates to a gas pipeline having a flexible heater fixed to the gas pipeline and an insulating layer including an air gap, the insulating layer being in contact with the flexible heater. Background Art
[0002] Some reaction chambers used in semiconductor manufacturing utilize a gas distribution plate (sometimes referred to as a showerhead) to deliver various gases such as precursors and reactants to a substrate and form a film on the substrate. Conventional gas distribution plates sequentially provide precursors and reactants through a common set of through-holes in the gas distribution plate. In some cases, it may be advantageous to deliver precursors and reactants to the reaction chamber through separate plenum chambers. Summary of the Invention
[0003] Various embodiments of the present technology may provide a vapor delivery system. The vapor delivery system may include a heating element and an insulating layer surrounding a gas pipeline. The insulating layer may have an air gap and may be formed of polyetheretherketone.
[0004] According to one aspect, a vapor delivery system includes: a gas pipeline including a sidewall having an inner surface and an opposite outer surface; a metal layer surrounding the gas pipeline and including an outer-facing surface; a heating element including a first surface directly fixed to the outer-facing surface of the metal layer and an opposite second surface; and an insulating layer adjacent to the heating element, wherein the insulating layer includes a plurality of air gaps.
[0005] In one embodiment, the insulating layer includes a triply periodic minimal surface structure.
[0006] In one embodiment, the triply periodic minimal surface structure is a gyroid structure.
[0007] In one embodiment, the insulating layer is in direct contact with the heating element.
[0008] In one embodiment, the heating element is a flexible heating element.
[0009] In one embodiment, the vapor delivery system further includes a plurality of spacers disposed between the second surface of the heating element and the insulating layer.
[0010] In one embodiment, the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
[0011] In one embodiment, the metal layer includes aluminum.
[0012] In one embodiment, the insulating layer is formed of polyetheretherketone.
[0013] In another aspect, a vapor delivery system includes: a gas line including a sidewall having an inner surface and an opposite outer surface; a metal layer formed of aluminum surrounding the gas line and including an outward-facing surface; a flexible heating element including a first surface directly fixed to the outward-facing surface of the metal layer and an opposite second surface; an insulating layer adjacent to the heating element; and an air gap between the heating element and the insulating layer.
[0014] In one embodiment, the vapor delivery system further includes a plurality of spacers disposed between the second surface of the heating element and the insulating layer.
[0015] In one embodiment, the plurality of spacers are formed of silicon and have a thickness in the range of 1 mm to 3 mm.
[0016] In one embodiment, the insulating layer includes fiberglass and has a thickness in the range of 5 mm to 8 mm.
[0017] In one embodiment, the insulating layer includes a triply periodic minimal surface structure and is formed of polyetheretherketone.
[0018] In yet another aspect, a device configured to surround a gas line includes: a metal layer surrounding the gas line; a heating element directly fixed to the metal layer; a plurality of spacers disposed on the heating element, wherein the spacers have a thickness in the range of 1 mm to 3 mm; an insulating layer adjacent to the heating element and in direct contact with the spacers; and an air gap separating the heating element and the insulating layer.
[0019] In one embodiment, the plurality of spacers are formed of silicon.
[0020] In one embodiment, the insulating layer includes fiberglass and has a thickness in the range of 5 mm to 8 mm.
[0021] In one embodiment, the insulating layer includes a triply periodic minimal surface structure and is formed of polyetheretherketone.
[0022] In one embodiment, the metal layer includes aluminum.
[0023] In one embodiment, the air gap is 1 mm to 3 mm. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] A more complete understanding of the present technology can be obtained by reference to the detailed description when considered in conjunction with the following illustrative drawings. In the following drawings, like reference numerals refer to like elements and steps throughout the drawings.
[0025] Figure 1 A system according to an embodiment of the present technology is representatively shown;
[0026] Figure 2is a first cross-sectional view of a vapor delivery system according to an embodiment of the present technology;
[0027] Figure 3 is a second cross-sectional view of a vapor delivery system according to an embodiment of the present technology; and
[0028] Figure 4 is a perspective view of a spiral structure according to an embodiment of the present technology. Detailed Description
[0029] The present technology can be described in terms of functional block components and various processing steps. Such functional blocks can be implemented by any number of components configured to perform the specified functions and achieve various results. For example, the present technology can use various gas pipelines, valves, controllers, pressure controllers, reaction chambers, containers, and temperature sensors.
[0030] Referring to Figure 1 , exemplary system 100 can include a reactor 105 configured to perform a process on an object to be processed, such as a substrate 120 (e.g., a wafer). For example, reactor 105 can be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processes on the object to be processed. In some embodiments, reactor 105 can be configured to perform a moving function, a vacuum sealing function, a heating function, an exhaust function, and / or other functions on the object to be processed such that the object is processed in the reactor. In some embodiments, reactor 105 can be a reactor in which an atomic layer deposition (ALD) or chemical vapor deposition (CVD) process is performed.
[0031] In various embodiments, system 100 can further include a substrate mounting unit disposed within reactor 105. The substrate mounting unit can include a pedestal 115 for supporting substrate 120 and a heater (not shown) for heating the substrate supported by pedestal 115. The heater can be embedded within pedestal 115. The substrate mounting unit can further include a base 135 that supports pedestal 115. For loading / unloading the substrate, the substrate mounting unit can be configured to be vertically movable by connection to a drive unit (not shown).
[0032] In various embodiments, system 100 can further include a gas distribution system 125 (i.e., a showerhead) for delivering vapor into reactor 105. In an exemplary embodiment, gas distribution system 125 is disposed above pedestal 115.
[0033] In various embodiments, system 100 can further include a delivery system 130 configured to deliver a gas or vapor from container 110 to reactor 105. For example, delivery system 130 can be coupled to container 110 at a first end and to reactor 105 at a second end. Container 110 can be configured to contain a solid or liquid chemical substance that is converted into vapor.
[0034] In various embodiments, with reference to Figures 2 - 4 , the delivery system 130 can include a gas line 200. The gas line 200 can be configured to facilitate vapor flow. The gas line 200 can be formed of a metal such as stainless steel or any other suitable metal and can be of any suitable size. For example, the gas line 200 can have a diameter in the range of 0.25 inches to 1 inch. In various embodiments, the gas line 200 can include any number of connectors and gas line portions coupled by the connectors. Additionally, the delivery system 130 can include any number of valves to control the flow rate and / or pressure of the vapor in the delivery system 130.
[0035] In various embodiments, the delivery system 130 can further include a metal layer 205 configured to surround the gas line 200. For example, in an exemplary embodiment, the metal layer 205 includes a first portion 300 and a second portion 305, and the second portion 305 surrounds the gas line 200 and is in direct contact with the gas line 200. For example, the first and second portions 300, 305 can include cuts corresponding to the size and shape of the gas line 200 such that the first and second portions 300, 305 mate with the gas line 200. Additionally, the first and second portions 300, 305 can be in direct contact with each other at a seam 310 formed by the edges of the first and second portions 300, 305. The metal layer 205 can be formed of a thermally conductive metal, such as aluminum.
[0036] In various embodiments, the delivery system 130 can further include a heating element 210 configured to heat the metal layer 205 and the gas line 200. For example, the heating element 210 can be fixed to the outer-facing surface 315 of the metal layer 205. In various embodiments, the heating element 210 can include a resistive heating element or any other suitable type of heating element. The heating element can be fixed to the metal layer 205 with an adhesive. In some embodiments, the heating element 210 can completely surround the metal layer 205. In other embodiments, the heating element 210 can be fixed only to a portion of the outer-facing surface of the metal layer 205. In various embodiments, the heating element 210 can be a flexible heating element. For example, the heating element 210 can be formed of a flexible material, such as a thermoplastic or any other suitable flexible heat-resistant material.
[0037] In various embodiments, the delivery system 130 may further include a plurality of spacers 230 configured to form an air gap 225. The plurality of spacers 230 may be fixed to or otherwise disposed on the heating element 210. In some cases, the plurality of spacers 230 may be integrated with the heating element 210. For example, the plurality of spacers 230 may be formed or fixed to a surface of the heating element 210 that is opposite the side fixed or adhered to the metal layer 205. The plurality of spacers 230 may be formed of silicon and may have a thickness in the range of 1 mm to 3 mm.
[0038] In various embodiments, the delivery system 130 may further include an insulating layer 215 adjacent to the heating element 210. In some embodiments, the insulating layer 215 may be disposed on the plurality of spacers 230. In such a case, an air gap 225 is formed between the heating element 210 and the insulating layer 215. In other embodiments that do not include the plurality of spacers 230, the insulating layer 215 may be in direct contact with the heating element 210. In various embodiments, the insulating layer 215 may surround the heating element 210 and the metal layer 205 to provide a thermal barrier for the heating element 210 and the metal layer 205. In some embodiments, the insulating layer 215 may include a fiberglass material.
[0039] In other embodiments, the insulating layer 215 may include a thermoplastic material such as polyetheretherketone (PEEK).
[0040] In various embodiments, the insulating layer 215 may include a plurality of air cavities. For example, the insulating layer 215 may include a 3D lattice structure 400 that includes a first inflated chamber 600 and a second inflated chamber 605. The 3D lattice structure may be a triply periodic minimal surface structure such as a helical structure or any other structure having two or more independent inflated chambers.
[0041] A continuous internal wall 705 separates the first inflated chamber 600 from the second inflated chamber 605. In other words, the first inflated chamber 600 is isolated from the second inflated chamber 605 by the continuous internal wall 705. The insulating layer 215 may further include an outer surface wall (not shown) that surrounds or otherwise defines the first and second inflated chambers 600, 605.
[0042] In various embodiments, the first inflated chamber 600 may include a first plurality of continuous interconnected channels 601 that form a first volume. The first plurality of channels 601 may be branched (i.e., non-linear), such that two or more channels 601 may be connected at a first node. Similarly, the second inflated chamber 605 may include a second plurality of continuous interconnected channels 606 that form a second volume. The second plurality of channels 606 may be branched, such that two or more channels 606 may be connected at a second node.
[0043] In various embodiments, the first plurality of channels 600 are wound together with the second plurality of channels 606.
[0044] In various embodiments, the insulating layer 215 may be formed of a thermoplastic material by additive manufacturing (i.e., 3D printing) or any other suitable method.
[0045] In various embodiments, reference Figure 1 and Figure 2 , the system 100 may further include a temperature sensor 220, such as a thermocouple, configured to measure the temperature of the delivery system 130, particularly the temperature of the gas line 200. For example, the temperature sensor 220 may be directly fixed to the outer surface of the gas line 200 or the metal layer 205. In other cases, the temperature sensor 220 may be embedded within the metal layer 205. The temperature sensor 220 may generate a signal corresponding to the temperature of the gas line 200.
[0046] In various embodiments, the system 100 may further include a controller (not shown) configured to control a valve (not shown) disposed within the delivery system 130. The controller may operate the valve according to a desired pulse scheme to facilitate the flow of vapor from the container 110 to the reactor 105. In various embodiments, the controller may control the temperature of the heating element 210 based on the measured temperature of the gas line 200. For example, the controller may receive a signal from the temperature sensor and may then increase or decrease the temperature of the heating element 210 based on the desired temperature of the gas line 200.
[0047] In the foregoing description, the technology has been described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrative of the technology and its best mode and are not intended to limit the scope of the technology in any way. Indeed, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the method and system may not have been described in detail. Additionally, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or steps between the various elements. There may be many alternative or additional functional relationships or physical connections in the actual system.
[0048] The technology has been described with reference to specific exemplary embodiments. However, various modifications and changes can be made without departing from the scope of the technology. The specification and drawings are to be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the technology. Accordingly, the scope of the technology should be determined by the general embodiments described and their legal equivalents, rather than solely by the specific examples given above. For example, the steps recited in any method or process embodiment can be executed in any order, unless otherwise explicitly specified, and are not limited to the explicit order presented in the specific examples. Additionally, the components and / or elements recited in any device embodiment can be assembled in various arrangements or otherwise operably configured to produce substantially the same result as the technology, and are thus not limited to the specific configurations recited in the specific examples.
[0049] Benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution to occur or become more pronounced should not be construed as a critical, essential, or necessary feature or component.
[0050] The term "comprising," "including," or any variant thereof is intended to refer to non-exclusive inclusion, such that a process, method, article, composition, or apparatus that comprises a list of elements does not include only those elements but may also include other elements not expressly listed or inherent to such process, method, article, composition, or apparatus. Other combinations and / or modifications of the above-described structures, arrangements, applications, proportions, elements, materials, or components used in the practice of the technology, except those not specifically recited, may be varied or otherwise specially adapted to particular environments, manufacturing specifications, design parameters, or other operational requirements without departing from its general principles.
[0051] The technology has been described above with reference to exemplary embodiments. However, changes and modifications can be made to the exemplary embodiments without departing from the scope of the technology. These and other changes or modifications are intended to be included within the scope of the technology, as set forth in the following claims.
Claims
1. A steam delivery system comprising: a gas line comprising a sidewall including an interior surface and an opposing exterior surface; a metal layer surrounding the gas line and including an outwardly facing surface; a heating element including a first surface secured directly to the outwardly facing surface of the metal layer and an opposing second surface; as well as An insulating layer is adjacent to the heating element, wherein the insulating layer includes a plurality of air gaps.
2. The vapor delivery system of claim 1, wherein: The insulating layer includes a three-periodic minimal surface structure.
3. The vapor delivery system of claim 1, wherein: The three-periodic minimal surface structure is a spiral structure.
4. The vapor delivery system of claim 1, wherein: The insulating layer is in direct contact with the heating element.
5. The vapor delivery system of claim 1, wherein: The heating element is a flexible heating element.
6. The vapor delivery system of claim 1, further comprising a plurality of spacers disposed between the second surface of the heating element and the insulating layer.
7. The vapor delivery system of claim 6, wherein: The plurality of spacers are formed of silicon and have a thickness ranging from 1 mm to 3 mm.
8. The vapor delivery system of claim 1, wherein: The metal layer includes aluminum.
9. The vapor delivery system of claim 1, wherein: The insulating layer is formed of polyetheretherketone.
10. A steam delivery system comprising: a gas line comprising a sidewall including an interior surface and an opposing exterior surface; a metal layer formed of aluminum surrounding the gas line and including an outwardly facing surface; a flexible heating element comprising a first surface secured directly to the outwardly facing surface of the metal layer and an opposing second surface; Insulation adjacent to the heating element; as well as The air gap between the heating element and the insulation.
11. The vapor delivery system of claim 10, further comprising a plurality of spacers disposed between the second surface of the heating element and the insulating layer.
12. The vapor delivery system of claim 10, wherein: The plurality of spacers are formed of silicon and have a thickness ranging from 1 mm to 3 mm.
13. The vapor delivery system of claim 10, wherein: The insulating layer comprises glass fibres and has a thickness in the range of 5 mm to 8 mm.
14. The vapor delivery system of claim 10, wherein: The insulating layer includes a three-periodic minimal surface structure and is formed of polyetheretherketone.
15. A device configured to surround a gas pipeline, comprising: The metal layer surrounding the gas line; A heating element fixed directly to the metal layer; a plurality of spacers disposed on the heating element, wherein the spacers have a thickness in a range of 1 mm to 3 mm; an insulating layer adjacent to the heating element and in direct contact with the spacer; as well as The air gap that separates the heating element from the insulation.
16. The device according to claim 15, wherein: The plurality of spacers are formed of silicon.
17. The device according to claim 15, wherein: The insulating layer comprises glass fibres and has a thickness in the range of 5 mm to 8 mm.
18. The device according to claim 15, wherein: The insulating layer includes a three-periodic minimal surface structure and is formed of polyetheretherketone.
19. The device according to claim 15, wherein: The metal layer includes aluminum.
20. The device according to claim 15, wherein: The air gap is 1 mm to 3 mm.