Pipeline heating system and waste gas treatment equipment and method

Abstract

The invention discloses a pipeline heating system and waste gas treatment equipment and method. The system comprises a pipeline assembly, and the pipeline assembly comprises a first pipeline; the first pipeline comprises a first pipe body and a second pipe body; the first pipe body and the second pipe body are arranged in a sleeved mode, and the first pipe body is located on the outer side of the second pipe body. The semiconductor refrigeration device comprises a functional structure and a power supply; the functional structure is tightly sleeved on the second pipe body; a first channel is formed between the outer side peripheral wall of the functional structure and the inner side peripheral wall of the first pipe body; the functional structure is electrically connected with the power supply, and when the functional structure is in a power-on state, the inner side peripheral wall forms a hot end, and the outer side peripheral wall forms a cold end; the temperature sensor assembly comprises a temperature sensor, and the temperature sensor is located in the corresponding second pipeline; the control device is in communication connection with each temperature sensor and the power supply; the control device is used for adjusting the current of the power supply based on the real-time temperature. Therefore, the pipeline connection mode can be simplified, and the pipeline connection complexity is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of waste gas treatment, and in particular to a pipeline heating system, a waste gas treatment device and a method. Background Art

[0002] In the semiconductor manufacturing process, various waste gases are generated. In the treatment of these waste gases, the method of wrapping a heating tape around the intake pipeline is often used. The heating method of the heating tape is the resistance wire energization heating method. There are multiple groups of heating tapes on each pipeline, and each group of heating tapes requires a heating controller.

[0003] For example, a machine has 4 or 6 intake pipelines, which requires multiple groups of heating controls. However, the installation space of the equipment is limited, the heating tape is not convenient for pipeline wrapping operation and subsequent maintenance, and the failure rate is high, and it is not convenient to find the fault source. Moreover, there are many lines, which are connected in series and parallel and cross each other, and the workload of line connection is large. In addition, the thermal energy management is ineffective, the heat conduction efficiency is low, and the energy consumption is large. Summary of the Invention

[0004] In view of this, the present application provides a pipeline heating system, a waste gas treatment device and a method, which can simplify the pipeline connection method and reduce the complexity of pipeline connection.

[0005] The technical solution of the present application is as follows:

[0006] In the first aspect, the present application provides a pipeline heating system, including:

[0007] A pipeline assembly for communicating with a reaction tank, the pipeline assembly includes a plurality of first pipelines; each of the first pipelines includes a plurality of first pipe bodies and second pipe bodies;

[0008] The first pipe body and the corresponding second pipe body are sleeved, and the first pipe body is located outside the second pipe body; wherein, the second pipe body is used for connecting with a waste gas supply device to input waste gas with a first target temperature into the reaction tank;

[0009] A thermoelectric refrigeration device, the number of which is the same as the number of the first pipe bodies or the second pipe bodies. Each thermoelectric refrigeration device includes a functional structure and a power supply; the functional structure is in a circular ring shape, and the functional structure is tightly sleeved on the outer peripheral wall of the second pipe body; a first channel is formed between the outer peripheral wall of the functional structure and the inner peripheral wall of the first pipe body, and the first channel is used for communicating with a cold source device that provides a cold source; the functional structure is electrically connected to the power supply, and when the functional structure is in an energized state, its inner peripheral wall forms a hot end and its outer peripheral wall forms a cold end;

[0010] A temperature sensor assembly includes a temperature sensor, and the number of the temperature sensors is the same as that of the first pipe body or the second pipe body; the temperature sensor is located inside the corresponding second pipeline and is used to collect the real-time temperature of the exhaust gas flowing through the inside of the second pipeline.

[0011] A control device is communicatively connected to each of the temperature sensors and the power supply; the control device is configured to adjust the magnitude of the current of the power supply based on the real-time temperature so that the real-time temperature meets a preset temperature condition.

[0012] In a possible implementation manner, the system further includes a flange sealing assembly, and a set of the flange sealing assemblies is arranged at both ends of each of the first pipe body and the second pipe body; each of the flange sealing assemblies includes:

[0013] A first flange plate, which is sleeved on the corresponding end of the first pipe body;

[0014] A second flange plate, which is sleeved on the corresponding end of the second pipe body;

[0015] The first flange plate and the second flange plate are coaxially arranged, and a second channel formed therebetween is communicated with the first channel.

[0016] In a possible implementation manner, when each of the first pipelines includes a plurality of the first pipe bodies and the second pipe bodies, the plurality of first pipe bodies are connected in sequence, the plurality of corresponding second pipe bodies are connected in sequence, and any two adjacent first channels and second channels are communicated.

[0017] In a second aspect, the present application further provides an exhaust gas treatment device, including the pipeline heating system described in the above embodiment.

[0018] In a possible implementation manner, the device further includes:

[0019] A reaction tank, which is communicated with the pipeline assembly;

[0020] A water tank, which is connected to the reaction tank;

[0021] A scrubbing tower, which is connected to the water tank;

[0022] A water spraying device, which is arranged on the pipelines between the water tank and the reaction tank and between the water tank and the scrubbing tower;

[0023] An acid discharge pipeline, which is connected to the scrubbing tower and is used to discharge the exhaust gas meeting the second target temperature;

[0024] Each of the first channels is further communicated with the acid discharge pipeline so that the cold source after heat exchange is input into the acid discharge pipeline.

[0025] In a possible implementation, the device further includes:

[0026] A cold source device, connected to each of the first channels; the cold source device further includes an electric control valve, and the electric control valve is communicatively connected to the control device;

[0027] The control device is further configured to adjust the opening of the electric valve body to a target opening according to the preset second target temperature; wherein, there is a one-to-one correspondence between the second target temperature and the target opening.

[0028] In a possible implementation, a connecting pipe is provided on the top cover structure of the reaction tank, and the number of the connecting pipes is the same as the number of the first pipes; in each of the first pipes, one of the second pipe bodies located at the end is hermetically docked with the corresponding connecting pipe.

[0029] In a possible implementation, the cold source device further includes a flow sensor and a pressure sensor; the flow sensor and the pressure sensor are respectively communicatively connected to the control device, and are respectively configured to collect the real-time flow information and real-time pressure information of the cold source;

[0030] The control device is further configured to adjust the opening of the electric valve body based on the flow information and / or the pressure information, so that the real-time flow and the real-time pressure meet the preset conditions.

[0031] In a third aspect, the present application further provides an exhaust gas temperature regulation method, which is applied to a control device in an exhaust gas treatment device; the exhaust gas treatment device further includes: a reaction tank, a pipeline assembly, a semiconductor refrigeration device, and a temperature sensor assembly; the reaction tank is communicated with the pipeline assembly, and the semiconductor refrigeration device is arranged in the pipeline assembly; the method includes:

[0032] Each temperature sensor in the temperature sensor assembly detects the temperature information of the exhaust gas in the corresponding pipeline in real time;

[0033] The control device determines whether the real-time temperature meets the preset temperature condition; wherein, the preset temperature is the first target temperature for matching the exhaust gas input into the reaction tank;

[0034] If not, the control device adjusts the magnitude of the current of the power supply in the semiconductor refrigeration device to make the real-time temperature meet the preset temperature condition.

[0035] In a possible implementation, the device further includes a refrigeration device and an acid discharge pipeline, the refrigeration device is connected to the semiconductor refrigeration device, and each of the first channels is further communicated with the acid discharge pipeline; the method further includes:

[0036] The control device adjusts the opening degree of the electric valve body to a target opening degree according to a preset second target temperature; wherein, there is a one-to-one correspondence between the second target temperature and the target opening degree.

[0037] The embodiments of the present application have the following beneficial effects:

[0038] By adopting the semi - conductor refrigeration device method and standardizing the pipeline connection method, the pipeline connection and heating connection work are simplified, the energy of the cold end is fully utilized, the heat conduction efficiency of the hot end is improved, and the purpose of energy conservation is achieved. According to the actual situation of the application, the system can give subsequent improvement measures and automatically increase the temperature according to the setting to meet the requirements of extending the maintenance cycle. Brief Description of the Drawings

[0039] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the protection scope of the present application. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0040] Figure 1 Shows an overall schematic diagram of an exhaust gas treatment device according to an embodiment of the present application;

[0041] Figure 2 Shows an overall schematic diagram of a pipeline heating system according to an embodiment of the present application;

[0042] Figure 3 Shows an overall schematic diagram of a semi - conductor refrigeration device of a pipeline heating system according to an embodiment of the present application;

[0043] Figure 4 Shows an overall schematic diagram of a pipeline component of a pipeline heating system according to an embodiment of the present application;

[0044] Figure 5 Shows an overall flowchart of a pipeline heating method according to an embodiment of the present application;

[0045] Figure 6 Shows a logic diagram of the heating process of a pipeline heating system according to an embodiment of the present application.

[0046] Icons: 1. Pipeline component; 101. First pipeline; 1011. First pipe body; 1012. Second pipe body; 2. Reaction tank; 3. Functional structure; 301. Hot end; 302. Hot end; 4. Temperature sensor; 5. First flange; 6. Second flange; 7. Water tank; 8. Scrubbing tower; 9. Water spray device; 10. Acid discharge pipeline; 11. Cold source device. Detailed Embodiments

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0048] The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the detailed description of the embodiments of the present application provided herein is not intended to limit the scope of the claimed present application, but is merely representative of selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0049] In the following, the terms "including", "having" and their cognates that may be used in various embodiments of the present application are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or precluding the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0050] In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments of the present application belong. The terms (such as those defined in a general use dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or being overly formal, unless clearly defined in the various embodiments of the present application.

[0052] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0053] Embodiment 1

[0054] Reference Figures 1 to 5, an embodiment of the present application provides a pipeline heating system, including: a pipeline assembly 1, a semiconductor refrigeration device, a temperature sensor assembly, and a control device. The pipeline assembly 1 is used to communicate with a reaction tank 2. The pipeline assembly 1 includes a plurality of first pipelines 101; each first pipeline 101 includes a plurality of first pipe bodies 1011 and second pipe bodies 1012. The first pipe body 1011 and the corresponding second pipe body 1012 are sleeved, and the first pipe body 1011 is located outside the second pipe body 1012; wherein, the second pipe body 1012 is used to connect with an exhaust gas supply device to input exhaust gas with a first target temperature into the reaction tank 2. The number of semiconductor refrigeration devices is the same as the number of the first pipe bodies 1011 or the second pipe bodies 1012. Each semiconductor refrigeration device includes a functional structure 3 and a power supply; the functional structure 3 is annular, and the functional structure 3 is tightly sleeved on the outer peripheral wall of the second pipe body 1012; a first channel is formed between the outer peripheral wall of the functional structure 3 and the inner peripheral wall of the first pipe body 1011, and the first channel is used to communicate with a cold source device 11 that provides a cold source; the functional structure 3 is electrically connected to the power supply, and when the functional structure 3 is in an energized state, its inner peripheral wall forms a hot end 301, and its outer peripheral wall forms a cold end 302.

[0055] The temperature sensor assembly includes a temperature sensor 4, and the number of temperature sensors 4 is the same as the number of the first pipe bodies 1011 or the second pipe bodies 1012; the temperature sensor 4 is located inside the corresponding second pipeline 1012 and is used to collect the real-time temperature of the exhaust gas flowing through the inside of the second pipeline 1012. The control device is communicatively connected to each temperature sensor 4 and the power supply; the control device is used to adjust the magnitude of the current of the power supply based on the real-time temperature so that the real-time temperature meets the preset temperature condition.

[0056] In a semiconductor waste gas treatment device, when the first pipeline 101 of the pipeline assembly 1 is actually applied, the first pipe body 1011 and the second pipe body 1012 can be made of materials with high temperature resistance and corrosion resistance, such as special alloy materials. Taking the Metal-Etch process of the semiconductor process as an example, the exhaust gas supply device transports the exhaust gas to the second pipe body 1012. Since some process gases (such as Alcl3 need to be maintained at about 170 degrees) require a specific temperature, the semiconductor refrigeration device comes into play at this time. The functional structure 3 of the semiconductor refrigeration device is made into an annular shape with a suitable semiconductor material and is tightly sleeved outside the second pipe body 1012. The power supply provides electrical energy for the functional structure 3. When current passes through, the inner peripheral wall of the functional structure 3 forms a hot end 301 to heat the exhaust gas in the second pipe body 1012 to make it reach the first target temperature. The temperature sensor 4 is installed inside the second pipeline 1012 to collect the exhaust gas temperature in real time and transmit the data to the control device. The control device adjusts the magnitude of the power supply current according to the difference between the real-time temperature and the preset temperature to achieve precise control of the exhaust gas temperature.

[0057] The waste gas transportation function is realized through the pipeline component 1. The semiconductor refrigeration device can effectively heat the waste gas, which is more energy-efficient than the traditional heating method. The temperature sensor 4 and the control device cooperate with each other to monitor and adjust the waste gas temperature in real time, ensuring that the waste gas enters the reaction tank 2 at an appropriate temperature, improving the stability and efficiency of waste gas treatment, avoiding problems such as premature condensation of the process and pipeline blockage caused by abnormal temperature, and extending the cleaning cycle of the pipeline.

[0058] In some embodiments, the system further includes a flange sealing assembly. A set of flange sealing assemblies are provided at both ends of each first pipe body and second pipe body; each flange sealing assembly includes: a first flange 5 and a second flange 6. The first flange 5 is sleeved on the corresponding end of the first pipe body 1011, and the second flange 6 is sleeved on the corresponding end of the second pipe body 1012. The first flange 5 and the second flange 6 are coaxially arranged, and the second channel formed between the two is communicated with the first channel.

[0059] In the actual installation process, the first flange 5 and the second flange 6 are made of metal materials, such as stainless steel, to ensure their strength and sealing performance. A groove structure for a fluororubber sealing ring is machined on the mating surface of the first flange 5 and the second flange 6, and the fluororubber sealing ring is embedded in the groove during installation. When the first pipe body 1011 and the second pipe body 1012 are connected, the first flange 5 and the second flange 6 are fastened by bolts to make them coaxially arranged and achieve a tight connection. At this time, the first channel and the second channel are communicated, providing a continuous channel for the circulation of the cold source, ensuring the sealing performance of each connection part, and preventing the leakage of the cold source.

[0060] The setting of the flange sealing assembly ensures the sealing performance of the pipeline connection, prevents the leakage of waste gas and the loss of the cold source, and improves the safety and stability of the system. At the same time, the design of the communication between the second channel 1011 and the first channel enables the cold source to flow smoothly in the entire pipeline system, optimizing the utilization efficiency of the cold source and further improving the performance of the system.

[0061] In some embodiments, when each first pipeline 101 includes a plurality of first pipe bodies 1011 and second pipe bodies 1012, the plurality of first pipe bodies 1011 are connected in sequence, the plurality of corresponding second pipe bodies 1012 are connected in sequence, and any two adjacent first channels and second channels are communicated.

[0062] In a large-scale semiconductor waste gas treatment device, the first pipeline 101 may be composed of multiple first pipe bodies 1011 and second pipe bodies 1012. During installation, the multiple first pipe bodies 1011 are sequentially connected in order by welding or flange connection to ensure the sealing performance and strength of the connection part; similarly, the multiple second pipe bodies 1012 are also connected in order in the same way. For adjacent first channels and second channels, a communication structure is provided at the connection part, such as connecting with a transition pipe fitting, so that the cold source can flow smoothly in the entire pipeline system, ensuring the continuity of the cold source channel. This enables the entire pipeline system to form a complete cold source circulation path, ensuring that the cold source can evenly cool the cold ends of each semiconductor refrigeration device, improving the utilization efficiency of the cold source, and further ensuring the heating effect of the hot end of the semiconductor refrigeration device, so that the waste gas can maintain a stable temperature during long-distance transportation, enhancing the performance of the entire pipeline heating system.

[0063] Embodiment 2

[0064] Reference Figures 1 to 5 , The embodiment of the present application further provides a waste gas treatment device, including the pipeline heating system of Embodiment 1. It can ensure that the waste gas reaches an appropriate temperature before entering the reaction tank, which helps to improve the efficiency and quality of waste gas treatment and ensure the stable operation of the entire waste gas treatment device.

[0065] In some embodiments, the waste gas treatment device further includes: a reaction tank 2, a water tank 7, a scrubbing tower 8, a water spray device 9, and an acid discharge pipeline 10. The reaction tank 2 is connected to the pipeline assembly 1; the water tank 7 is connected to the reaction tank 2, the scrubbing tower 8 is connected to the water tank 7, and the water spray device 9 is arranged on the pipelines between the water tank 7 and the reaction tank 2, and between the water tank 7 and the scrubbing tower 8. The acid discharge pipeline 10 is connected to the scrubbing tower 8 for discharging the waste gas that meets the second target temperature. Each first channel 101 is also connected to the acid discharge pipeline 10 so that the cold source after heat exchange is input into the acid discharge pipeline 10.

[0066] The reaction tank 2 is made of heat-resistant and corrosion-resistant materials, and corresponding reaction structures are set inside according to different waste gas treatment processes. The water tank 7 is used to store washing water, can be made of stainless steel, and is equipped with a liquid level sensor and a water replenishing device to ensure stable water level. Inside the washing tower 8, structures such as a packing layer are set to enhance the washing effect of the waste gas. The water spray device 9 selects appropriate nozzles and is installed on the corresponding pipeline, and is powered by a water pump to evenly spray water inside the reaction tank 2 and the washing tower 8. The acid discharge pipeline 10 is made of acid-resistant materials, such as fiberglass. During the operation of the equipment, the cold source after heat exchange enters the acid discharge pipeline 10 through the first channel 101 to cool and dehumidify the waste gas inside the acid discharge pipeline 10, ensuring that the discharged waste gas meets the second target temperature. For example, during the treatment of semiconductor waste gas, the waste gas enters the reaction tank 2 through the pipeline heating system for reaction, and the reacted waste gas is sequentially washed and purified by the water tank 7 and the washing tower 8, and finally discharged through the acid discharge pipeline 10. In the acid discharge pipeline 10, the cold source further processes the waste gas.

[0067] In some embodiments, the equipment further includes: a cold source device 11, and the cold source device 11 is connected to each first channel 101. The cold source device 11 further includes an electric control valve, and the electric control valve is communicatively connected to the control device. The control device is further configured to adjust the opening of the electric valve body to a target opening according to a preset second target temperature; wherein, there is a one-to-one correspondence between the second target temperature and the target opening.

[0068] The cold source device 11 uses a nitrogen supply system as the cold source. Nitrogen has the advantages of stable chemical properties and low cost. The electric control valve selects a high-precision electric butterfly valve and is installed on the connecting pipeline between the cold source device 11 and the first channel 101. The control device calculates the corresponding target opening of the electric control valve according to the preset second target temperature through an internal control algorithm, and sends a control signal to the electric control valve. During the operation of the equipment, the control device continuously monitors the temperature of the waste gas inside the acid discharge pipeline 10 and adjusts the opening of the electric control valve in real time to ensure that the waste gas temperature always meets the second target temperature.

[0069] The cooperation of the electric control valve and the control device realizes the precise control of the cold source flow rate, adjusts the cold source supply amount in real time according to the temperature of the waste gas inside the acid discharge pipeline 10, ensures that the discharged waste gas meets the second target temperature, further improves the stability and reliability of the waste gas treatment equipment, and at the same time optimizes the utilization efficiency of the cold source to achieve the purpose of energy saving.

[0070] Further, the correspondence between the second target temperature and the target opening is:

[0071] At a set temperature of 120 degrees, the opening of the nitrogen control valve is 30%;

[0072] At a set temperature of 150 degrees, the opening of the nitrogen gas regulating valve is 50%;

[0073] At a set temperature of 180 degrees, the opening of the nitrogen gas regulating valve is 80%.

[0074] According to the above corresponding relationship, the nitrogen gas volume can be controlled according to the control situation of the heater. The more heat taken away by the cold end 302, the easier it is for the hot end 301 to heat up. When the nitrogen gas pressure is reported high, the opening of the nitrogen gas regulating valve is 0; according to the acid discharge temperature, the amount of cold nitrogen gas flowing into the acid discharge pipe 10 is adjusted to ensure that no condensate is generated at the plant service pipeline end of the treated waste gas.

[0075] In some embodiments, connection pipes are provided on the top cover structure of the reaction tank 2, and the number of connection pipes is the same as the number of the first pipes 101; in each first pipe 101, one second pipe body 1012 located at the end is hermetically docked with the corresponding connection pipe.

[0076] The flow sensor is an electromagnetic flowmeter, installed on the pipeline connecting the cold source device 11 and the first channel to collect the flow information of the cold source in real time; the pressure sensor is a high-precision pressure transmitter, also installed on this pipeline to collect the pressure information of the cold source. The flow sensor and the pressure sensor transmit the collected data to the control device. The control device calculates the opening adjustment value of the electric control valve through a control algorithm according to the preset flow and pressure conditions, and sends a control signal to the electric control valve. For example, when the cold source flow is too low, the control device increases the opening of the electric control valve to increase the cold source flow; when the pressure is too high, the control device decreases the opening of the electric control valve to reduce the cold source pressure. During the operation of the equipment, the control device continuously monitors the flow and pressure information of the cold source and dynamically adjusts the opening of the electric control valve to ensure the stable operation of the cold source system.

[0077] The settings of the flow sensor and the pressure sensor enable the control device to grasp the state of the cold source in real time. By adjusting the opening of the electric control valve, the flow and pressure of the cold source are ensured to be within an appropriate range, improving the stability and reliability of the cold source system, and thus ensuring the normal operation of the entire waste gas treatment equipment and avoiding problems such as a decline in the waste gas treatment effect caused by abnormal cold source.

[0078] In some embodiments, the flow sensor and the pressure sensor are respectively communicatively connected to the control device and are respectively used to collect the real-time flow information and real-time pressure information of the cold source;

[0079] The control device is also used to adjust the opening of the electric valve body based on the flow information and / or pressure information so that the real-time flow and real-time pressure meet the preset conditions.

[0080] By adjusting the opening degree of the electric control valve, the flow rate and pressure of the cold source are ensured to be within a suitable range, improving the stability and reliability of the cold source device 11, and further ensuring the normal operation of the entire waste gas treatment equipment, and avoiding problems such as the decline of the waste gas treatment effect caused by the abnormality of the cold source.

[0081] Embodiment III

[0082] Reference Figures 1 to 5 , this embodiment of the present application also provides a waste gas temperature adjustment method, which is applied to a control device in a waste gas treatment equipment; the waste gas treatment equipment further includes: a reaction tank 2, a pipeline assembly 1, a semiconductor refrigeration device, and a temperature sensor assembly; the reaction tank 2 is communicated with the pipeline assembly 1, and the semiconductor refrigeration device is arranged in the pipeline assembly 1; the method includes:

[0083] Step S10, each temperature sensor 4 in the temperature sensor assembly detects the temperature information of the waste gas in the corresponding pipeline in real time;

[0084] Step S20, the control device determines whether the real-time temperature meets the preset temperature condition; wherein, the preset temperature is the first target temperature for matching the waste gas input into the reaction tank.

[0085] Step S30, if not satisfied, the control device adjusts the magnitude of the current of the power supply in the semiconductor refrigeration device to make the real-time temperature meet the preset temperature condition.

[0086] During the operation of the waste gas treatment equipment, the temperature sensor 4 continuously collects the temperature information of the waste gas in the corresponding pipeline and transmits the data to the control device in real time. After receiving the temperature data, the control device compares it with the preset first target temperature. For example, in the semiconductor manufacturing process, if the waste gas needs to reach 170 degrees to enter the reaction tank, when the control device determines that the real-time temperature is lower than 170 degrees, according to the preset control algorithm, the current of the power supply of the semiconductor refrigeration device is increased, so that more heat is generated at the hot end of the semiconductor refrigeration device to increase the waste gas temperature; when the real-time temperature is higher than 170 degrees, the power supply current is reduced to reduce the heat output at the hot end 301 and lower the waste gas temperature. The control device continuously cycles the above process to ensure that the waste gas temperature always meets the preset temperature condition.

[0087] This method realizes the automatic adjustment of the waste gas temperature, ensures that the waste gas enters the reaction tank 2 at a suitable temperature, improves the accuracy and stability of the waste gas treatment, avoids the process problems caused by temperature fluctuations, extends the cleaning cycle of the pipeline, and also improves the operation efficiency of the entire waste gas treatment equipment.

[0088] In some embodiments, the refrigeration device 11 is connected to the semiconductor refrigeration device, and each first channel is also communicated with the acid discharge pipeline 10; the method further includes:

[0089] The control device adjusts the opening degree of the electric valve body to the target opening degree according to the preset second target temperature; wherein, there is a one-to-one correspondence between the second target temperature and the target opening degree.

[0090] This correspondence is as follows:

[0091] At a set temperature of 120 degrees, the opening degree of the nitrogen regulating valve is 30%;

[0092] At a set temperature of 150 degrees, the opening degree of the nitrogen regulating valve is 50%;

[0093] At a set temperature of 180 degrees, the opening degree of the nitrogen regulating valve is 80%.

[0094] The control device calculates the target opening degree of the electric regulating valve according to the preset second target temperature of the waste gas in the acid discharge pipeline 10 and in combination with the pre-set correspondence between the second target temperature and the target opening degree of the electric regulating valve. For example, if the preset temperature of the waste gas in the acid discharge pipeline 10 is 28 degrees, when the control device detects that the temperature of the waste gas in the acid discharge pipeline 10 is higher than 28 degrees, according to the correspondence, it increases the opening degree of the electric regulating valve, increases the cold source flow rate, and cools the waste gas in the acid discharge pipeline; when the temperature is lower than 28 degrees, it reduces the opening degree of the electric regulating valve and reduces the cold source flow rate. The control device continuously monitors the temperature of the waste gas in the acid discharge pipeline 10 and adjusts the opening degree of the electric regulating valve in real time to ensure that the waste gas temperature is stable at the second target temperature.

[0095] By adjusting the opening degree of the electric regulating valve to control the cold source flow rate, the precise control of the waste gas temperature in the acid discharge pipeline 10 is achieved, ensuring that no condensate is generated at the end of the plant service pipeline for the treated waste gas, improving the reliability of the waste gas treatment equipment, avoiding problems such as blockage of the plant service pipeline caused by condensate, and optimizing the entire waste gas treatment process.

[0096] In some embodiments, referring to Figure 6 , multiple temperature sensors 4 jointly use a PID controller to achieve temperature control. The control method can automatically raise or lower the temperature according to the negative pressure situation (between the highest temperature and the lowest temperature), or can control the temperature with a fixed set value.

[0097] Different PID parameter values are used in different temperature ranges to achieve rapid temperature response, and can also achieve purposes such as extending the PM cycle of the pipeline and energy conservation.

[0098] Between 120 degrees and 150 degrees, P = 3.6, I = 400, D = 0;

[0099] Between 150 degrees and 190 degrees, P = 1.7, I = 600, D = 0.

[0100] It can be understood that the device in this embodiment corresponds to the method in the above embodiment, and the optional items in the above embodiment are equally applicable to this embodiment, so they will not be described repeatedly here.

[0101] The present application also provides a computer device. Exemplarily, the computer device includes a processor and a memory. Among them, the memory stores a computer program, and the processor executes the above method or the functions of each module in the above device by running the computer program.

[0102] Among them, the processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including at least one of a central processing unit (CPU), a graphics processing unit (GPU), a network processor (NP), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc., and can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application.

[0103] The memory can be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. Among them, the memory is used to store the computer program, and the processor can execute the computer program correspondingly after receiving the execution instruction.

[0104] The present application also provides a computer-readable storage medium for storing the computer program used in the above computer device. For example, the computer-readable storage medium can include, but is not limited to: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disc that can store program codes.

[0105] In several embodiments provided in this application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and structural diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of this application. In this regard, each block in the flowchart or block diagram can represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the blocks can occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the structural diagram and / or flowchart, as well as the combination of blocks in the structural diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0106] In addition, in each embodiment of this application, the various functional modules or units can be integrated together to form an independent part, or each module can exist alone, or two or more modules can be integrated to form an independent part.

[0107] If the above functions are implemented in the form of software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of this application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0108] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of changes or substitutions, which should all be covered by the protection scope of this application.

Claims

1. A pipeline heating system, characterized in that: include: A pipeline assembly, used for communicating with the reaction tank, the pipeline assembly includes a plurality of first pipelines; each of the first pipelines includes a plurality of first pipe bodies and second pipe bodies; The first tube body is arranged to be telescoped with the corresponding second tube body, and the first tube body is located outside the second tube body; wherein the second tube body is used to be connected to an exhaust gas supply device to input exhaust gas with a first target temperature into the reaction tank; Semiconductor refrigeration devices, the number of which is the same as the number of the first tube body or the second tube body, each of which includes a functional structure and a power supply; the functional structure is annular, and the functional structure is tightly sleeved on the outer peripheral wall of the second tube body; a first channel is formed between the outer peripheral wall of the functional structure and the inner peripheral wall of the first tube body, and the first channel is used to communicate with a cold source device providing a cold source; the functional structure is electrically connected to the power supply, and when the functional structure is powered on, its inner peripheral wall forms a hot end, and its outer peripheral wall forms a cold end; A temperature sensor assembly, comprising temperature sensors, the number of which is the same as the number of the first pipe body or the second pipe body; the temperature sensor is located inside the corresponding second pipe and is used to collect the real-time temperature of the exhaust gas flowing through the second pipe; A control device is communicatively connected with each of the temperature sensors and the power supply; the control device is used to adjust the current of the power supply based on the real-time temperature so that the real-time temperature meets a preset temperature condition.

2. The pipe heating system according to claim 1, characterized in that: The system further includes a flange sealing assembly, and a set of flange sealing assemblies is disposed at both ends of each of the first pipe body and the second pipe body; each of the flange sealing assemblies includes: A first flange, wherein the first flange is sleeved on a corresponding end of the first tube body; a second flange, wherein the second flange is sleeved on a corresponding end of the second tube body; The first flange and the second flange are coaxially arranged, and a second channel formed therebetween is communicated with the first channel.

3. The pipe heating system according to claim 2, characterized in that: When each of the first pipes includes a plurality of the first tube bodies and the second tube bodies, the plurality of the first tube bodies are connected in sequence, the plurality of corresponding second tube bodies are connected in sequence, and any two adjacent first channels are connected to the second channels.

4. A waste gas treatment device, characterized in that: The invention comprises a pipe heating system as claimed in any one of claims 1 to 3.

5. The exhaust gas treatment equipment according to claim 4, characterized in that: The device also includes: A reaction tank, connected to the pipeline assembly; A water tank connected to the reaction tank; A washing tower connected to the water tank; A water spray device is arranged on the pipeline between the water tank and the reaction tank, and between the water tank and the washing tower; an acid discharge pipeline connected to the washing tower and used for discharging waste gas meeting a second target temperature; Each of the first channels is also connected to the acid discharge pipeline so that the cold source after heat exchange is input into the acid discharge pipeline.

6. The exhaust gas treatment equipment according to claim 5, characterized in that: The device also includes: A cold source device connected to each of the first channels; the cold source device further comprises an electric regulating valve, and the electric regulating valve is communicatively connected to the control device; The control device is also used to adjust the opening of the electric valve body to a target opening according to the preset second target temperature; wherein the second target temperature and the target opening have a one-to-one correspondence.

7. The exhaust gas treatment equipment according to claim 4, characterized in that: The top cover structure of the reaction tank is provided with connecting pipes, and the number of the connecting pipes is the same as the number of the first pipes; in each of the first pipes, one of the second tube bodies located at the end is sealed and docked with the corresponding connecting pipe.

8. The exhaust gas treatment equipment according to claim 5, characterized in that: The cold source device further includes a flow sensor and a pressure sensor; the flow sensor and the pressure sensor are respectively connected to the control device for communication, and are respectively used to collect real-time flow information and real-time pressure information of the cold source; The control device is also used to adjust the opening of the electric valve body based on the flow information and / or the pressure information so that the real-time flow and the real-time pressure meet preset conditions.

9. A method for regulating exhaust gas temperature, characterized in that: Control devices used in exhaust gas treatment equipment; The waste gas treatment equipment further comprises: a reaction tank, a pipeline assembly, a semiconductor refrigeration device, and a temperature sensor assembly; the reaction tank is connected to the pipeline assembly, and the semiconductor refrigeration device is arranged in the pipeline assembly; the method comprises: Each temperature sensor in the temperature sensor assembly detects the temperature information of the exhaust gas in the corresponding pipeline in real time; The control device determines whether the real-time temperature meets a preset temperature condition; wherein the preset temperature is a first target temperature matching the exhaust gas input into the reaction tank; If not, the control device adjusts the current of the power supply in the semiconductor refrigeration device so that the real-time temperature meets the preset temperature condition.

10. The exhaust gas temperature adjustment method according to claim 9, characterized in that: The device further comprises a refrigeration device and an acid discharge pipeline, wherein the refrigeration device is connected to the semiconductor refrigeration device, and each of the first channels is also connected to the acid discharge pipeline; the method further comprises: The control device adjusts the opening of the electric valve body to a target opening according to a preset second target temperature; wherein the second target temperature and the target opening have a one-to-one correspondence.

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