Integrated circuit acoustic scanning detection device and integrated circuit carrier

Through the vibration and water spray design of the integrated circuit carrier, the problem of difficulty in gas discharge in the microconcave and convex structure is solved, and high-precision acoustic scanning detection is achieved.

CN120195285BActive Publication Date: 2025-09-02ANHUI LEADER TECHNOLOGY INNOVATION DEVELOPMENT CO LTD
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Patent Information

Application Number
CN202510677720.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-05-26
Publication Date
2025-09-02
Estimated Expiration
2045-05-26

AI Technical Summary

Technical Problem

In the sound scanning detection of existing integrated circuits, air trapped in microconvex structures such as pads, traces or holes is difficult to discharge quickly, resulting in a decrease in detection accuracy.

Method used

An integrated circuit vehicle is designed, including a fixed frame and a movable frame. The movable frame drives the integrated circuit to reciprocate in a small amplitude and linear motion through a vibrating mechanism, and water is sprayed using a water jet channel to remove surface and internal bubbles.

Benefits of technology

Effectively remove gas from the surface and internal microstructure of the integrated circuit, improve detection accuracy, avoid bubbles from forming again during scanning, and ensure the accuracy of detection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to an integrated circuit acoustic scanning detection device and an integrated circuit carrier thereof, and belongs to the field of integrated circuit detection technology. The integrated circuit carrier includes a fixed frame and a movable frame, the movable frame is located inside the fixed frame and slides with the fixed frame, and one end of the movable frame is connected to a vibration mechanism that drives the movable frame to move back and forth in a straight line; the movable frame is provided with a positioning mechanism for positioning the integrated circuit, and the positioning mechanism includes a supporting surface for supporting the integrated circuit; the movable frame is provided with a plurality of water spray channels, and the water outlet direction of the water spray channel is parallel to the supporting surface and perpendicular to the straight line motion direction of the movable frame. The integrated circuit acoustic scanning detection device includes the above-mentioned integrated circuit carrier. The present invention can not only remove bubbles on the surface of the integrated circuit, but also remove gas in tiny holes inside the integrated circuit, to avoid the discharge of gas inside the integrated circuit and the generation of new bubbles during the scanning process, thereby ensuring detection accuracy.
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Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit detection, and in particular to an integrated circuit acoustic scanning detection device and an integrated circuit carrier thereof. Background Art

[0002] Ultrasonic scanning testing is a commonly used method for inspecting integrated circuits (ICs). It boasts high efficiency, the ability to accurately detect internal defects in circuit boards, and low cost. Currently, the ultrasonic scanning process typically involves placing the IC to be inspected in a carrier. This carrier, connected to the IC, is then immersed in deionized water. An ultrasonic scanner, immersed in the deionized water, then scans the IC to produce an image, from which internal defects within the circuit board can be identified. However, a common problem with ultrasonic scanning testing is that bubbles form on the IC's surface after it enters the deionized water. These bubbles interfere with the propagation of ultrasonic waves, affecting detection accuracy. Therefore, bubbles must be removed before testing.

[0003] Application number CN202210507446.8 discloses a device and method for batch ultrasonic scanning inspection of plastic-encapsulated integrated circuits. An air pump is used to blow air through an air inlet pipe into the cavity containing the plastic-encapsulated integrated circuits, causing the water surrounding the integrated circuits to flow away bubbles attached to the surface. Because bubbles form on the surface of integrated circuits due to the presence of gas in deionized water, blowing air into the deionized water increases the gas content, resulting in more bubbles on the surface of the integrated circuits during subsequent inspections.

[0004] Patent application number CN202410147728.0 discloses an integrated circuit carrier and an integrated circuit acoustic scanning detection device. By providing multiple drainage holes on the carrier surface, each bubble on the surface of the integrated circuit on the carrier surface can be drawn out of the drainage holes along with the water flow, thereby removing bubbles from various locations on the integrated circuit. One reason for bubbles forming on the surface of an integrated circuit is that when the integrated circuit is stored in air, the surface absorbs gas molecules (especially in hydrophobic areas). At the same time, microscopic uneven structures such as pads, traces, or holes trap air. When the integrated circuit is immersed in deionized water, the absorbed or trapped air becomes bubbles. However, the air in the microscopic uneven structures such as pads, traces, or holes is usually gradually discharged rather than completely discharged quickly. Although the above-mentioned detection device can remove bubbles from the surface of the integrated circuit through water flow, it cannot quickly expel the air trapped in the microscopic uneven structures such as pads, traces, or holes. During subsequent detection, if these bubbles are discharged, they will form bubbles again, affecting detection accuracy. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an integrated circuit acoustic scanning detection device and an integrated circuit carrier thereof, which can promote the rapid discharge and timely removal of air trapped in microscopic concave-convex structures such as pads, traces or holes, thereby improving the accuracy of acoustic scanning detection.

[0006] To solve the above problems, the present invention adopts the following technical solution: an integrated circuit carrier, comprising a fixed frame and a movable frame, wherein the movable frame is located within the fixed frame and slidably cooperates with the fixed frame, and one end of the movable frame is connected to a vibration mechanism that drives the movable frame to reciprocate linear motion;

[0007] The movable frame is provided with a positioning mechanism for positioning the integrated circuit, and the positioning mechanism includes a supporting surface for supporting the integrated circuit;

[0008] The movable frame is provided with a plurality of water spraying channels, and the water outlet directions of the water spraying channels are parallel to the supporting surface and perpendicular to the linear motion direction of the movable frame.

[0009] Furthermore, the movable frame includes a left frame beam, a front frame beam, a right frame beam and a rear frame beam connected in sequence, the front frame beam and the rear frame beam are both slidably matched with the fixed frame, and the vibration mechanism is connected to the left frame beam or the right frame beam;

[0010] The positioning mechanism includes a support groove provided on the upper surface of the left frame beam, the front frame beam, the right frame beam and the rear frame beam, and the support surface is the groove bottom of the support groove;

[0011] The upper surfaces of the front frame beam and the rear frame beam are provided with bosses, and the water spray channel is provided on the bosses;

[0012] Both ends of the inner side surface of the boss are provided with pressing mechanisms for pressing the edge of the integrated circuit.

[0013] Furthermore, the clamping mechanism includes a pressure rod, the inner side surface of the boss is provided with a horizontal sliding groove, the two ends of the pressure rod are located in the sliding groove and slide with the sliding groove; the top wall of the pressure rod is provided with a V-shaped groove, the top wall of the sliding groove is provided with a positioning groove, and the positioning groove is provided with a V-shaped block that slides with the positioning groove, and a first spring is provided between the upper end of the V-shaped block and the bottom of the positioning groove.

[0014] Furthermore, the vibration mechanism includes a piston blind hole arranged on the inner side of the fixed frame, a connecting column slidingly engaged with the piston blind hole is arranged in the piston blind hole, one end of the connecting column extends out of the piston blind hole and is fixedly connected to the movable frame, and a second spring is arranged between the other end of the connecting column and the bottom of the piston blind hole; the bottom of the piston blind hole is connected to a water inlet channel, the side wall of the piston blind hole is provided with a water outlet channel, and the water outlet channel is connected to a valve.

[0015] The integrated circuit acoustic scanning detection device comprises a water pool and an ultrasonic scanning probe. The integrated circuit carrier is arranged in the water pool, and the water spray channel is connected to a water spray power mechanism.

[0016] Furthermore, the water pool is circular, and a loading station, a bubble removal station, a scanning station and an unloading station are sequentially arranged along the circumference of the water pool, and the ultrasonic scanning probe is arranged at the scanning station; a circular track is arranged around the water pool, and a plurality of movable seats are arranged on the track, and each movable seat is provided with a lifting block, and the lifting block is connected to a lifting mechanism, and a horizontal cantilever is provided on the lifting block, and the cantilever extends above the water pool, and a vertical connecting rod is provided at the end of the cantilever, and the lower end of the connecting rod extends into the water pool, and the fixed frame is connected to the connecting rod.

[0017] Furthermore, a rotating shaft is provided on the fixed frame, and the rotating shaft is rotatably mounted on the lower end of the connecting rod. A rotating drive mechanism is provided on the cantilever, and the rotating drive mechanism is connected to the rotating shaft through a belt.

[0018] Furthermore, the plurality of water spray channels are all connected to a water main pipe, and the water main pipe is provided with a water inlet pipe, and the axial direction of the water inlet pipe is consistent with the radial direction of the rotating shaft;

[0019] The water spraying power mechanism comprises a water pump fixedly arranged in the water pool, the water pump is connected to a vertical water pipe, and the upper end of the water pipe is provided with a lifting joint connected to the water inlet pipe.

[0020] Furthermore, a water inlet notch is provided at the end of the water inlet pipe;

[0021] The lifting joint includes a lifting pipe arranged in the upper port of the water pipe and slidingly matched with the water pipe. The inner hole of the lifting pipe is composed of a connecting hole, a tapered hole and a guide hole from bottom to top. The diameter of the tapered hole decreases from bottom to top. A support frame is provided in the connecting hole, a spherical plug is provided in the tapered hole, and a third spring is provided between the spherical plug and the support frame; the diameter of the guide hole is adapted to the outer diameter of the end of the water inlet pipe.

[0022] The beneficial effects of the present invention are as follows: the present invention can fix the integrated circuit on the movable frame through a positioning mechanism, and when removing bubbles, the vibration mechanism can be used to drive the movable frame to vibrate back and forth in a small amplitude, and the movable frame drives the integrated circuit to vibrate back and forth in a linear manner. Under the action of vibration, the air trapped in microscopic concave and convex structures such as pads, traces or holes can be quickly discharged. At the same time, a water spray channel is used to spray water on the side of the integrated circuit to be scanned, and the water spray direction is parallel to the integrated circuit, so as to remove bubbles on the surface of the integrated circuit.

[0023] It can be seen that the present invention can not only remove bubbles on the surface of the integrated circuit, but also remove gas in the tiny holes inside the integrated circuit, avoiding the discharge of gas inside the integrated circuit and the generation of new bubbles during the scanning process, thereby ensuring detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic top view of the integrated circuit carrier of the present invention;

[0025] Figure 2 yes Figure 1 Schematic cross-sectional view of AA in the figure;

[0026] Figure 3 yes Figure 1 Schematic cross-sectional view of the middle BB;

[0027] Figure 4 yes Figure 1 Schematic cross-sectional view of CC;

[0028] Figure 5 It is a schematic front view of an embodiment of the integrated circuit acoustic scanning detection device of the present invention;

[0029] Figure 6 1 is a top view schematic diagram of another embodiment of the integrated circuit acoustic scanning detection device of the present invention;

[0030] Figure 7 yes Figure 6 Schematic cross-sectional view of the middle DD;

[0031] Figure 8 yes Figure 6 A magnified schematic diagram of part F;

[0032] Figure 9 This is a schematic diagram of the carrier when it is rotated to a vertical position at the bubble removal station;

[0033] Figure 10 yes Figure 9 A magnified schematic diagram of part E;

[0034] Reference numerals: 1—fixed frame; 2—movable frame; 21—left frame beam; 22—right frame beam; 23—front frame beam; 24—rear frame beam; 25—boss; 26—press rod; 27—slide; 28—V-shaped groove; 29—V-shaped block; 210—first spring; 3—support surface; 4—water spray channel; 5—support groove; 6—piston blind hole; 7—connecting column; 8—second spring; 9—water inlet channel; 10—water outlet channel; 11—valve; 100— Water tank; 101—ultrasound scanning probe; 102—track; 103—moving seat; 104—lifting block; 105—lifting mechanism; 106—cantilever; 107—connecting rod; 108—rotating shaft; 109—rotation driving mechanism; 110—water main pipe; 111—water inlet pipe; 112—water pump; 113—water pipe; 114—lifting pipe; 115—water inlet gap; 116—support frame; 117—spherical plug; 118—third spring. DETAILED DESCRIPTION

[0035] The present invention will be further described below with reference to the accompanying drawings and examples.

[0036] The integrated circuit carrier of the present invention is as follows Figures 1 to 4 As shown, the device comprises a fixed frame 1 and a movable frame 2. The movable frame 2 is used to position the integrated circuit. Since integrated circuits are typically rectangular, both the fixed frame 1 and the movable frame 2 are rectangular. To keep the integrated circuit secure, the movable frame 2 is provided with a positioning mechanism for positioning the integrated circuit. The positioning mechanism includes a support surface 3 for supporting the integrated circuit. The support surface 3 can be aligned with the side of the integrated circuit to provide support for the integrated circuit.

[0037] The movable frame 2 is located within the fixed frame 1 and slidably engages with the fixed frame 1. One end of the movable frame 2 is connected to a vibration mechanism that drives the movable frame 2 in reciprocating linear motion. The vibration mechanism can drive the movable frame 2 to move back and forth in a small amplitude, causing the movable frame 2 to vibrate linearly. When the integrated circuit is fixed to the movable frame 2, the vibration mechanism can drive the movable frame 2 and the integrated circuit to vibrate linearly as a whole.

[0038] The movable frame 2 is provided with a plurality of water spray channels 4, the water discharge direction of the water spray channels 4 being parallel to the support surface 3 and perpendicular to the linear motion direction of the movable frame 2. The water spray channels 4 are used to spray water to remove bubbles on the surface of the integrated circuit by the flow of water.

[0039] When the present invention is used, the integrated circuit is placed on the support surface 3 and positioned using a positioning mechanism so that the integrated circuit and the movable frame 2 become a whole. The integrated circuit and the carrier are then placed in deionized water, and bubbles are generated on the surface of the integrated circuit. The vibration mechanism can then be used to drive the movable frame 2 and the integrated circuit to vibrate back and forth in a linear manner. During the vibration of the integrated circuit, the bubbles on the surface will enter the water. Under the action of the vibration, the air trapped in the microscopic concave and convex structures such as the pads, traces, or holes can be quickly discharged, avoiding the discharge of gas inside the integrated circuit and the generation of new bubbles during subsequent scanning, thereby ensuring detection accuracy. While vibrating, the water spray channel 4 can be used to spray water on the surface of the integrated circuit to be scanned, with the water spray direction parallel to the surface of the integrated circuit to be scanned and perpendicular to the linear motion direction of the integrated circuit. Assuming the linear motion of the integrated circuit aligns with its length, the water's motion relative to the integrated circuit during vibration also aligns with its length. However, the water ejected from water jet channel 4 aligns with the width of the integrated circuit. The two water streams move perpendicularly to each other, colliding and flowing in local irregular patterns. This makes it easier for the water to enter tiny pores in the integrated circuit, while also causing slight impact on the integrated circuit and improving the vibration-induced degassing effect of the integrated circuit. Water jet channel 4 ejects water from one side of the integrated circuit, ensuring that the water flow flows from one side to the other, ensuring that bubbles are removed. However, this creates local irregular turbulence, which promotes the degassing of gases within the integrated circuit.

[0040] The present invention can not only remove bubbles on the surface of the integrated circuit, but also remove gas in tiny holes inside the integrated circuit, thus avoiding the discharge of gas inside the integrated circuit and the generation of new bubbles during the scanning process, thereby ensuring detection accuracy.

[0041] The movable frame 2 of the present invention comprises a left frame beam 21, a front frame beam 23, a right frame beam 22 and a rear frame beam 24 connected in sequence, and the left frame beam 21, the front frame beam 23, the right frame beam 22 and the rear frame beam 24 enclose a rectangular cavity. The front frame beam 23 and the rear frame beam 24 are both slidably matched with the fixed frame 1, so that the movable frame 2 can slide left and right. The vibration mechanism is connected to the left frame beam 21 or the right frame beam 22 to drive the movable frame 2 to move linearly left and right. The left, right, front and rear frames are respectively Figure 1 The orientations shown are for reference only and are adjusted adaptively when the view direction changes.

[0042] The positioning mechanism includes support grooves 5 provided on the upper surfaces of the left frame beam 21, the front frame beam 23, the right frame beam 22, and the rear frame beam 24. The support surface 3 forms the bottom of the support grooves 5. The left frame beam 21, the front frame beam 23, the right frame beam 22, and the rear frame beam 24 form a cavity, with the support grooves 5 located around the perimeter of the cavity. The bottom of the support grooves 5 extends into the cavity, supporting the four sides of the integrated circuit (IC) respectively by the bottoms of the four support grooves 5. Once the IC is placed in the support grooves 5, it is completely covered.

[0043] The upper surfaces of the front frame beam 23 and the rear frame beam 24 are provided with bosses 25, and the water spraying channels 4 are provided on the bosses 25. A plurality of water spraying channels 4 can be provided, and the plurality of water spraying channels 4 spray water simultaneously to remove bubbles from the entire upper surface of the integrated circuit.

[0044] To improve the stability of the IC's positioning, clamping mechanisms are located on both ends of the inner side of boss 25, which faces the cavity. These clamping mechanisms are used to compress the IC's edges. After the IC is placed in support slot 5, the clamping mechanisms are used to hold it in place, preventing it from vibrating and swaying or falling out of support slot 5 during scanning. The clamping mechanisms hold the IC's edges in place without interfering with ultrasonic scanning.

[0045] In the present invention, the clamping mechanism includes a pressure rod 26. The inner side surface of the boss 25 is provided with a horizontal slide groove 27. The two ends of the pressure rod 26 are located in the slide groove 27 and slide in engagement with the slide groove 27. The top wall of the pressure rod 26 is provided with a V-shaped groove 28. The top wall of the slide groove 27 is provided with a positioning groove. The positioning groove is provided with a V-shaped block 29 that slides in engagement with the positioning groove. A first spring 210 is provided between the upper end of the V-shaped block 29 and the bottom of the positioning groove. When no integrated circuit is placed in the support groove 5, the pressure rod 26 is located outside the support groove 5. The depth of the support groove 5 is consistent with the thickness of the integrated circuit. After the integrated circuit is placed in the support groove 5, the pressure rod 26 can be slid to the top of the support groove 5, and the lower surface of the pressure rod 26 can compress the integrated circuit. During the sliding process of the pressure rod 26, the pressure rod 26 squeezes the V-shaped block 29, causing the V-shaped block 29 to move upward and the first spring 210 to be compressed; when the V-shaped groove 28 of the pressure rod 26 moves to the bottom of the V-shaped block 29, the first spring 210 extends, pushing the V-shaped block 29 into the V-shaped groove 28, thereby limiting the pressure rod 26.

[0046] The vibration mechanism can adopt the existing technology. Since the vehicle is immersed in water as a whole, the commonly used vibration mechanism uses a motor as the power, and the motor is difficult to operate normally underwater. As a preferred embodiment of the present invention, the vibration mechanism includes a piston blind hole 6 arranged on the inner side of the fixed frame 1, and the piston blind hole 6 is arranged on the inner side of the boss 25. A connecting column 7 that slides with the piston blind hole 6 is provided in the piston blind hole 6. One end of the connecting column 7 extends out of the piston blind hole 6 and is fixedly connected to the movable frame 2. A second spring 8 is provided between the other end of the connecting column 7 and the bottom of the piston blind hole 6. One end of the second spring 8 is fixedly connected to the connecting column 7, and the other end is fixedly connected to the bottom of the piston blind hole 6. The bottom of the piston blind hole 6 is connected to a water inlet channel 9, and the side wall of the piston blind hole 6 is provided with a water outlet channel 10. The water outlet channel 10 is connected to a valve 11. The valve 11 can adopt a high-speed switching valve, which can be opened and closed at a high frequency.

[0047] The vibration mechanism of the present invention operates as follows: water is supplied to the water inlet channel 9 at a constant speed, and valve 11 is alternately opened and closed. When valve 11 is closed, water enters the piston blind hole 6, pushing the connecting column 7 to slide toward the outside of the piston blind hole 6. The second spring 8 is compressed, generating elastic force, and the water pressure gradually increases. When the connecting column 7 slides, it can drive the movable frame 2 to move linearly. When valve 11 is opened, the water in the piston blind hole 6 is rapidly discharged, the second spring 8 gradually extends, and the water pressure gradually decreases. The second spring 8 drives the connecting column 7 toward the bottom of the piston blind hole 6, and the connecting column 7 drives the movable frame 2 to move linearly in the opposite direction. Repeating the above process can make the connecting column 7 slide back and forth continuously, driving the movable frame 2 to vibrate back and forth linearly.

[0048] The vibration mechanism of the present invention adopts hydraulic power as the power, and can directly utilize the deionized water used in the detection, which is convenient to implement.

[0049] The integrated circuit acoustic scanning detection device of the present invention is as follows Figure 5 As shown, it includes a water pool 100 and an ultrasonic scanning probe 101. The water pool 100 has a certain depth of deionized water. Figures 1 to 4 In the shown integrated circuit carrier, the water spray channel 4 is connected to a water spray power mechanism for delivering water to the water spray channel 4 .

[0050] Specifically, the integrated circuit acoustic scanning detection device of the present invention has two embodiments, one of which is as follows: Figures 6 to 10As shown, the integrated circuit carrier can be naturally placed in the water pool 100, always in a horizontal position. During testing, after the integrated circuit is fixed to the integrated circuit carrier, the integrated circuit carrier and the integrated circuit are manually lowered into the water pool 100, ensuring that the deionized water submerges the integrated circuit and that the integrated circuit is located below the ultrasonic scanning probe 101. The water spraying mechanism can be a pump, fixedly installed inside or outside the water pool 100. The pump can be connected to the water spray channel 4 via a hose, capable of transporting deionized water from the water pool 100 to the water spray channel 4. When removing bubbles, the integrated circuit is in a horizontal position, the water spray channel 4 is located above the integrated circuit, and the water spray channel 4 sprays water horizontally.

[0051] The above embodiment is a relatively conventional embodiment, which has the following shortcomings:

[0052] 1. The steps of fixing the integrated circuit to the carrier, removing bubbles, ultrasonic scanning inspection, and removing the inspected integrated circuit from the carrier cannot be performed simultaneously, resulting in low inspection efficiency. This makes it only suitable for small-batch inspection and difficult to quickly conduct large-scale inspection.

[0053] 2. The solder mask (green oil), silicone resin coating or some plastic components on the integrated circuit are usually hydrophobic and difficult to wet quickly. Gas is easily retained in the gaps and forms bubbles. If the integrated circuit is placed in deionized water and the bubbles are removed immediately, it is difficult to ensure the bubble removal effect.

[0054] In order to improve the detection efficiency, the bubble removal operation is performed after the integrated circuit is fully soaked. The integrated circuit acoustic scanning detection device of the present invention can also adopt the following implementation methods:

[0055] The water tank 100 is circular, with a loading station, a bubble removal station, a scanning station, and an unloading station arranged sequentially along its circumference. The ultrasonic scanning probe 101 is located in the scanning station. The loading station, bubble removal station, scanning station, and unloading station sequentially secure the integrated circuit to the carrier, remove bubbles, perform ultrasonic scanning inspection, and remove the inspected integrated circuit from the carrier. These four stations can operate simultaneously, improving inspection efficiency.

[0056] A circular track 102 is provided around the pool 100. Two tracks 102 can be provided, and the centers of the two circular tracks coincide. A plurality of movable seats 103 are provided on the track 102. The movable seats 103 slide with the track 102, and the movable seats 103 are provided with a running mechanism for driving the movable seats 103 to move. The running mechanism can be a motor, and a gear is provided on the rotating shaft of the motor. A circular rack is provided between the two circular tracks, and the rack is engaged with the gear. When the motor drives the gear to rotate, the gear moves along the rack, thereby driving the entire movable seat 103 to slide along the track 102. There can be four movable seats 103, and each workstation has a movable seat 103.

[0057] Each movable seat 103 is provided with a lifting block 104, and the lifting block 104 is connected to a lifting mechanism 105. The lifting mechanism 105 can be a cylinder, a linear motor, etc., or a motor-driven screw nut mechanism, and existing technology can be used.

[0058] Lifting block 104 is equipped with a horizontal cantilever 106 that extends above pool 100. A vertical connecting rod 107 is provided at the end of cantilever 106, the lower end of which extends into pool 100. Fixed frame 1 is connected to connecting rod 107. When lifting mechanism 105 drives lifting block 104 up and down, lifting block 104 drives cantilever 106, connecting rod 107, and fixed frame 1 up and down synchronously. During this process, the carrier can be moved above the level of deionized water or immersed in deionized water.

[0059] The specific use process of this integrated circuit acoustic scanning detection device is as follows: at the loading station, the lifting mechanism 105 drives the lifting block 104 to move to a high position, and the carrier is above the liquid surface of the deionized water. The integrated circuit can be manually fixed to the carrier, and then the lifting mechanism 105 drives the lifting block 104 to move downward to a low position, and the carrier and the integrated circuit are immersed in the deionized water. Then the movable seat 103 drives the carrier and the integrated circuit to move to the bubble removal station for bubble removal, and then the movable seat 103 moves to the scanning station, and the ultrasonic scanning probe 101 scans the upper surface of the integrated circuit. Finally, the movable seat 103 drives the carrier and the integrated circuit to the unloading station, and the lifting mechanism 105 drives the lifting block 104 to move to a high position, and the integrated circuit after detection can be removed manually.

[0060] Repeating the above process can realize the inspection of multiple integrated circuits. Each station can perform the corresponding operation simultaneously without interfering with each other, thus improving the inspection efficiency.

[0061] When removing bubbles, the integrated circuit can be in a horizontal state, and the water spray channel 4 sprays water horizontally. In order to promote the upward movement of bubbles on the surface of the integrated circuit and thus quickly detach from the integrated circuit, the present invention can rotate the carrier and the integrated circuit to a vertical position when removing bubbles. The water spray channel 4 is on the lower side of the carrier. The water spray channel 4 can spray water upward, which is conducive to removing bubbles on the surface of the integrated circuit more quickly.

[0062] Specifically, a rotating shaft 108 is provided on the fixed frame 1 and is rotatably mounted on the lower end of the connecting rod 107. A gate-shaped bracket can be provided at the lower end of the connecting rod 107, and the rotating shaft 108 is rotatably mounted on the gate-shaped bracket. A rotation drive mechanism 109 is provided on the cantilever 106 and is connected to the rotating shaft 108 via a belt. The rotation drive mechanism 109 can use a servo motor to accurately control the rotation angle.

[0063] When the carrier and integrated circuit are moved to the debubble station, the rotary drive mechanism 109 rotates the shaft 108 90 degrees, rotating the carrier and integrated circuit from a horizontal position to a vertical position. The water spray channel 4 is located on the lower side of the carrier. The vibration mechanism then drives the movable frame 2 and the integrated circuit to continuously vibrate linearly. At the same time, the water spray channel 4 sprays water upward, driving bubbles on the surface of the integrated circuit to flow upward. After the bubble removal is completed, the rotary drive mechanism 109 rotates the shaft 108 90 degrees, and the carrier and integrated circuit return to a horizontal position.

[0064] In this embodiment, the water jet mechanism can be fixed to the fixed frame 1, with a water pipe provided at the inlet of the water jet mechanism, which extends into deionized water. However, this increases the weight of the fixed frame 1, requiring higher strength for the cantilever 106 and connecting rod 107. Moreover, since multiple vehicles are used simultaneously, each vehicle requires a water jet mechanism, which increases the number of water jet mechanisms and increases equipment costs.

[0065] To reduce equipment costs and facilitate water supply to the water spray channels 4, the multiple water spray channels 4 in this embodiment are all connected to a water main pipe 110. This main pipe 110 is equipped with a water inlet pipe 111. The axial direction of the main pipe 110 aligns with the axial direction of the rotating shaft 108, and the axial direction of the water inlet pipe 111 aligns with the radial direction of the rotating shaft 108. When the vehicle is horizontal, the water inlet pipe 111 is also horizontal. When the vehicle is rotated to a vertical position, the water inlet pipe 111 is vertical and located below the main pipe 110.

[0066] The water jet mechanism includes a water pump 112 connected to a vertical water pipe 113. The upper end of the water pipe 113 is provided with a lifting joint that connects to the water inlet pipe 111. The water pump 112 can be fixed inside or outside the pool 100, with its inlet communicating with the pool 100 and its outlet connected to the water pipe 113. The water pipe 113 is located inside the pool 100 and below the bubble removal station.

[0067] When the carrier and integrated circuit move to the debubbling station, they rotate to a vertical position. Water inlet pipe 111 is now located above water delivery pipe 113, coaxial with the latter. The lifting joint moves upward, connecting water inlet pipe 111 with water delivery pipe 113. Driven by water pump 112, deionized water from reservoir 100 enters water inlet pipe 111, then passes through the lifting joint into water delivery pipe 113, and is then delivered to each water spray channel 4 through main water delivery pipe 110. After debubbling is complete, the lifting joint moves downward, disengaging from water inlet pipe 111, without affecting the return of water inlet pipe 111 to its horizontal position with the carrier.

[0068] In order to automatically drive the lifting joint up and down by using the power of water flow, a water inlet notch 115 is provided at the end of the water inlet pipe 111 of the present invention. The water inlet notch 115 can be any shape such as a rectangular notch, a semicircular notch, etc.

[0069] The lifting joint includes a lifting pipe 114 that is arranged in the upper end of the water pipe 113 and slides with the water pipe 113. The inner hole of the lifting pipe 114 is a connecting hole, a tapered hole and a guide hole from bottom to top. The connecting hole is connected to the water pump 112. The diameter of the tapered hole decreases from bottom to top. The diameter of the upper end of the connecting hole is the same as the diameter of the lower end of the tapered hole. The diameter of the upper end of the tapered hole is the same as the diameter of the guide hole. The diameter of the guide hole is adapted to the outer diameter of the water inlet pipe 111 to ensure that the water inlet pipe 111 can extend into the guide hole. A support frame 116 is fixedly arranged in the connecting hole. The support frame 116 can be a cross. A spherical plug 117 is arranged in the tapered hole. The spherical plug 117 can close the tapered hole. A third spring 118 is arranged between the spherical plug 117 and the support frame 116. The third spring 118 is in a compressed state and has a certain elastic force. The elastic force can press the spherical plug 117 tightly.

[0070] When the water inlet pipe 111 rotates to a vertical state, the water pump 112 is started, and deionized water enters the water pipe 113 and the lifting pipe 114. At this time, since the tapered hole of the lifting pipe 114 is blocked by the spherical plug 117, the water in the water pipe 113 and the lifting pipe 114 cannot be discharged, so it will push the lifting pipe 114 to move upward, causing the water inlet pipe 111 to enter the lifting pipe 114. When the water inlet pipe 111 contacts the spherical plug 117, the spherical plug 117 will stop moving upward, but the water pressure in the lifting pipe 114 is greater than the friction between the lifting pipe 114 and the water pipe 113. Therefore, the lifting pipe 114 will continue to move upward, that is, the tapered hole moves upward, causing the spherical plug 117 to separate from the tapered hole wall, the third spring 118 is further compressed, the elastic force increases, the tapered hole opens, and the water in the lifting pipe 114 can enter the water inlet pipe 111 through the water inlet notch 115. By controlling the water delivery pressure of water pump 112, the water pressure within lift pipe 114 remains stable. The water pressure on lift pipe 114 and the increased elastic force of the compressed third spring 118 are balanced, thereby maintaining a stable height of lift pipe 114 and ensuring stable connection with water inlet pipe 111. After the bubbles are removed, water pump 112 stops delivering water to water pipe 113, third spring 118 returns to its original position, and spherical plug 117 closes the tapered hole again. Water pump 112 is then used to pump out the undivided water in water pipe 113. Under the action of external water pressure, lift pipe 114 moves downward, allowing it to separate from water inlet pipe 111. Water pump 112 can be a plunger pump, gear pump, or the like, capable of both forward and reverse rotation.

[0071] The lifting butt joint of the present invention can realize automatic lifting without the need for additional power equipment, thereby reducing energy consumption and simplifying the structure.

[0072] The vibrating mechanism's water inlet channel 9 can also employ the same water inlet structure as the water spray channel 4. Specifically, the water inlet channel 9 is connected to a water inlet pipe. When the carrier and integrated circuit are horizontal, the water inlet pipe is horizontal; when the carrier and integrated circuit are rotated to a vertical position, the water inlet pipe is vertical. A water supply mechanism similar to the lift pipe 114 and water pipe 113 is provided within the water pool 100 below the debubbling station.

[0073] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An integrated circuit carrier, characterized in that: It comprises a fixed frame (1) and a movable frame (2), wherein the movable frame (2) is located inside the fixed frame (1) and is in sliding engagement with the fixed frame (1), and one end of the movable frame (2) is connected to a vibration mechanism for driving the movable frame (2) to reciprocate linear motion; The movable frame (2) is provided with a positioning mechanism for positioning the integrated circuit, and the positioning mechanism includes a supporting surface (3) for supporting the integrated circuit; The movable frame (2) comprises a left frame beam (21), a front frame beam (23), a right frame beam (22) and a rear frame beam (24) connected in sequence, the front frame beam (23) and the rear frame beam (24) both slidingly cooperate with the fixed frame (1), and the vibration mechanism is connected to the left frame beam (21) or the right frame beam (22); the positioning mechanism comprises a support groove (5) provided on the upper surfaces of the left frame beam (21), the front frame beam (23), the right frame beam (22) and the rear frame beam (24), and the support surface (3) is the bottom of the support groove (5); A plurality of water spray channels (4) are provided on the movable frame (2), and the water outlet direction of the water spray channels (4) is parallel to the support surface (3) and perpendicular to the linear motion direction of the movable frame (2); The upper surfaces of the front frame beam (23) and the rear frame beam (24) are provided with bosses (25), and the water spray channel (4) is provided on the bosses (25); The vibration mechanism comprises a piston blind hole (6) arranged inside the fixed frame (1); a connecting column (7) is arranged in the piston blind hole (6) and is slidably matched with the piston blind hole (6); one end of the connecting column (7) extends out of the piston blind hole (6) and is fixedly connected to the movable frame (2); a second spring (8) is arranged between the other end of the connecting column (7) and the bottom of the piston blind hole (6); the bottom of the piston blind hole (6) is connected to a water inlet channel (9); the side wall of the piston blind hole (6) is provided with a water outlet channel (10); and the water outlet channel (10) is connected to a valve (11).

2. The integrated circuit carrier according to claim 1, wherein: Both ends of the inner side surface of the boss (25) are provided with a clamping mechanism for clamping the edge of the integrated circuit.

3. The integrated circuit carrier according to claim 2, wherein: The clamping mechanism includes a pressure rod (26), the inner side surface of the boss (25) is provided with a horizontal slide groove (27), the two ends of the pressure rod (26) are located in the slide groove (27) and slide in cooperation with the slide groove (27); the top wall of the pressure rod (26) is provided with a V-shaped groove (28), the top wall of the slide groove (27) is provided with a positioning groove, and a V-shaped block (29) is provided in the positioning groove and slides in cooperation with the positioning groove, and a first spring (210) is provided between the upper end of the V-shaped block (29) and the bottom of the positioning groove.

4. An integrated circuit acoustic scanning detection device, comprising a water pool (100) and an ultrasonic scanning probe (101), characterized in that: The integrated circuit carrier according to claim 1 is arranged in the water pool (100), and the water spray channel (4) is connected to a water spray power mechanism.

5. The integrated circuit acoustic scanning detection device according to claim 4, wherein: The water pool (100) is circular, and a loading station, a bubble removal station, a scanning station and an unloading station are sequentially arranged along the circumference of the water pool (100), and the ultrasonic scanning probe (101) is arranged at the scanning station; a circular track (102) is arranged around the water pool (100), a plurality of movable seats (103) are arranged on the track (102), and each movable seat (103) is provided with a lifting block (104), the lifting block (104) is connected to a lifting mechanism (105), and a horizontal cantilever (106) is provided on the lifting block (104), the cantilever (106) extends above the water pool (100), and a vertical connecting rod (107) is provided at the end of the cantilever (106), the lower end of the connecting rod (107) extends into the water pool (100), and the fixed frame (1) is connected to the connecting rod (107).

6. The integrated circuit acoustic scanning detection device according to claim 5, wherein: The fixed frame (1) is provided with a rotating shaft (108), and the rotating shaft (108) is rotatably mounted on the lower end of the connecting rod (107). The cantilever (106) is provided with a rotating drive mechanism (109), and the rotating drive mechanism (109) is connected to the rotating shaft (108) via a belt.

7. The integrated circuit acoustic scanning detection device according to claim 6, wherein: The plurality of water spray channels (4) are all connected to a water main pipe (110), and a water inlet pipe (111) is provided on the water main pipe (110), wherein the axial direction of the water inlet pipe (111) is consistent with the radial direction of the rotating shaft (108); The water spraying power mechanism comprises a water pump (112), the water pump (112) is connected to a vertical water delivery pipe (113), and the upper end of the water delivery pipe (113) is provided with a lifting joint that is connected to the water inlet pipe (111).

8. The integrated circuit acoustic scanning detection device according to claim 7, wherein: The end of the water inlet pipe (111) is provided with a water inlet notch (115); The lifting joint comprises a lifting pipe (114) disposed in the upper end of the water pipe (113) and slidingly engaged with the water pipe (113); the inner hole of the lifting pipe (114) is composed of a connecting hole, a tapered hole, and a guide hole from bottom to top, the diameter of the tapered hole decreasing from bottom to top; a support frame (116) is disposed in the connecting hole; a spherical plug (117) is disposed in the tapered hole; a third spring (118) is disposed between the spherical plug (117) and the supporting frame (116); and the diameter of the guide hole is adapted to the outer diameter of the end of the water inlet pipe (111).

Citation Information

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