Optical component forming control system based on ultrasonic vibration

By integrating heating parts and cooling parts in the optical component forming equipment and combining ultrasonic vibration, the problems of uneven heating, uneven cooling and mold adhesion are solved, and high-quality molding of optical components is achieved.

CN120196159BActive Publication Date: 2025-08-08BEIJING WEIQIAO GUOKE NEW ENERGY TECH RES INST CO LTD +1
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202510689721.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2025-08-08
Estimated Expiration
2045-05-27

AI Technical Summary

Technical Problem

The problems of uneven heating, poor blank flow, uneven cooling and easy adhesion during molding in existing optical component molding equipment affect the quality and consistency of optical components.

Method used

The optical component forming control system based on ultrasonic vibration is adopted. The driving module and the bearing module are integrated with the heating and cooling parts respectively, and combined with the ultrasonic transducer device, the temperature and pressure coupling control is realized to ensure uniform heating and uniform cooling, and to use ultrasonic vibration to promote the flow of the blank and reduce adhesion.

Benefits of technology

It improves the accuracy of the optical component forming process, ensures uniform temperatures in the heating and cooling process, improves the fluidity of the blank, reduces the adhesion phenomenon during mold extraction, and protects the surface quality of the optical component.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120196159B_ABST
    Figure CN120196159B_ABST
Patent Text Reader

Abstract

The present disclosure relates to the technical field of optical element molding control process, and discloses an optical element molding control system based on ultrasonic vibration, including an optical element molding device and a control device, wherein the optical element molding device includes: a driving module; a pressing block module, wherein the driving module is transmission-connected to the pressing block module to drive the pressing block module to move, and the pressing block module is integrated with a first heating element and a first cooling element; a supporting module, located below the pressing block module, and used to clamp the mold together with the pressing block module, and the supporting module is integrated with a second heating element and a second cooling element; an ultrasonic transducer device, which is arranged adjacent to the supporting module and is used to drive the supporting module to vibrate. The above system can improve the accuracy of the optical element molding process, ensure uniform temperature during the heating and cooling processes, improve the fluidity of the blank, and reduce the sticking phenomenon during mold removal.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical element molding control process, for example, to an optical element molding control system based on ultrasonic vibration. Background Art

[0002] Optical component molding is an advanced manufacturing process used to produce high-precision, complex-shaped optical components such as optical lenses and fiber optic connectors. Optical component molding technology first requires placing a blank into a mold. The mold is then heated to create a viscoelastic state. Pressure is then applied to the mold to force the blank into the desired shape, filling the mold cavity. After the blank cools, the desired optical component is finally obtained.

[0003] During the optical element molding process, the control accuracy of heating, press molding, cooling and demolding will directly affect the quality of the optical element. In the related art, due to the unreasonable layout of the heating elements in the optical element molding equipment, or the slow response of the control system, it is difficult to achieve uniform heating of the blank. This may cause local overheating or insufficient heating of the blank, which in turn affects the quality and consistency of the final optical element. Furthermore, during the press molding process, air entrapment is likely to occur due to the poor fluidity of the blank. In addition, due to the uneven cooling of the cooling elements in the equipment, cracks or other structural defects may occur in the optical element. During the demolding process, due to the possible adhesion between the molded optical element and the mold, the surface structure of the optical element is easily damaged.

[0004] It can be seen that the related technology has problems such as uneven heating temperature, poor fluidity of the blank, uneven temperature during the cooling process, and easy adhesion during mold removal. These problems seriously affect the quality of the final optical component. Summary of the Invention

[0005] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0006] The embodiments of the present disclosure provide an optical element molding control system based on ultrasonic vibration, which can improve the accuracy of the optical element molding process, ensure uniform temperature during heating and cooling processes, improve the fluidity of the blank, and reduce adhesion during mold removal.

[0007] The optical element molding control system based on ultrasonic vibration of the embodiment of the present disclosure includes an optical element molding device and a control device. The optical element molding device includes:

[0008] Driver module;

[0009] A pressing module, a driving module being in transmission connection with the pressing module to drive the pressing module to move, the pressing module being integrated with a first heating element and a first cooling element;

[0010] A carrying module is located below the pressing module and is used to clamp the mold together with the pressing module. The carrying module is integrated with a second heating element and a second cooling element.

[0011] An ultrasonic transducer device is disposed adjacent to the bearing module and is used to drive the bearing module to vibrate;

[0012] The control device is configured to:

[0013] After the driving module is controlled to drive the pressing block module to move toward the carrying module to contact the mold, the first heating element and the second heating element are controlled to operate;

[0014] Control the driving module to drive the pressing module to apply target pressure to the mold, and control the ultrasonic transducer device to drive the bearing module to vibrate;

[0015] Controlling the operation of the first cooling member and the second cooling member to reduce the temperature of the mold;

[0016] Control the driving module to drive the pressing module away from the bearing module, and control the ultrasonic transducer device to drive the bearing module to vibrate again

[0017] In some embodiments, the control device is configured to:

[0018] After the mold is placed on the carrier module, the driving module is controlled to drive the pressing block module to move toward the carrier module to contact the mold;

[0019] Controlling the first heating element and the second heating element to operate so that the blank in the mold enters a viscoelastic state;

[0020] Controlling the driving module to drive the pressing module to apply a target pressure to the mold, and controlling the ultrasonic transducer device to drive the bearing module to vibrate for a first preset time period, so as to deform the blank into an optical element of a specified shape;

[0021] After a first preset time period, controlling the first cooling member and the second cooling member to operate to lower the temperature of the mold so as to cool and solidify the optical element;

[0022] The driving module is controlled to drive the pressing module away from the carrying module, and the ultrasonic transducer is controlled again to drive the carrying module to vibrate and last for a second preset time to facilitate separation of the optical element from the mold, wherein the first preset time is greater than the second preset time.

[0023] In some embodiments, the ultrasonic transducer is located below the carrier module, the vibration direction of the ultrasonic transducer is parallel to the pressure direction of the driving module, and the control device is configured as follows:

[0024] After the blank in the mold enters a viscoelastic state, the driving module is controlled to drive the pressing module to apply a target pressure to the mold, and the ultrasonic transducer device is controlled to drive the bearing module to vibrate along the pressure direction for a first preset time, so that the blank is deformed into an optical element of a specified shape;

[0025] After the optical element cools and solidifies, the driving module is controlled to drive the pressing block module away from the carrying module, and the ultrasonic transducer device is controlled again to drive the carrying module to vibrate along the pressure direction and last for a second preset time to facilitate separation of the optical element from the mold.

[0026] In some embodiments, the optical element molding control system includes at least one of the following:

[0027] The vibration amplitude of the ultrasonic transducer is not less than 3 microns;

[0028] The vibration frequency of the ultrasonic transducer device is not less than 60 kHz;

[0029] The first preset duration is 30 seconds to 300 seconds;

[0030] The second preset duration is 10 seconds to 30 seconds.

[0031] In some embodiments, the ultrasonic transducer device includes a fixing seat and a piezoelectric ultrasonic transducer. The fixing seat is arranged below the supporting module, and the piezoelectric ultrasonic transducer is arranged inside the fixing seat.

[0032] In some embodiments, the pressing block module includes a pressing block for contacting the mold, a first heating element is disposed inside the pressing block, and a first cooling element is disposed above the pressing block.

[0033] In some embodiments, the first heating element includes a first electric heating tube, and the control device and the first electric heating tube are both electrically connected to an external power supply module.

[0034] In some embodiments, there are multiple first electric heating tubes, and the pressing block has a first end surface for contacting the mold;

[0035] A first number of first electric heating tubes is used as a first electric heating tube group, and a second number of first electric heating tubes is used as a second electric heating tube group, wherein the first number is greater than the second number;

[0036] The first electric heating tubes in the first electric heating tube group are arranged in a direction parallel to the first end surface, and the first electric heating tubes in the second electric heating tube group are arranged in a direction parallel to the first end surface;

[0037] In a direction perpendicular to the first end surface, the second electric heating tube assembly is closer to the first end surface than the first electric heating tube assembly;

[0038] The symmetric center of the area occupied by the first electric heating tube group is aligned with the symmetric center of the area occupied by the second electric heating tube group.

[0039] In some embodiments, the first cooling member includes a first water cooling module, the first water cooling module is in communication with an external water pump module, and the control device is electrically connected to the water pump module.

[0040] In some embodiments, the carrying module includes a carrying block for contacting the mold, and the second heating element is disposed inside the carrying block.

[0041] In some embodiments, the second heating element includes a second electric heating tube, and the control device and the second heating element are both electrically connected to an external power supply module.

[0042] In some embodiments, there are multiple second electric heating tubes, and the bearing block has a second end surface for contacting the mold;

[0043] The third number of the second electric heating tubes is used as a third electric heating tube group, and the fourth number of the second electric heating tubes is used as a fourth electric heating tube group, wherein the third number is greater than the fourth number;

[0044] The second electric heating tubes in the third electric heating tube group are arranged in a direction parallel to the second end surface, and the second electric heating tubes in the fourth electric heating tube group are all arranged in a direction parallel to the second end surface;

[0045] In a direction perpendicular to the second end surface, the fourth electric heating tube group is closer to the second end surface than the third electric heating tube group;

[0046] The symmetric center of the area occupied by the third electric heating tube group is aligned with the symmetric center of the area occupied by the fourth electric heating tube group.

[0047] In some embodiments, the second cooling member includes a second water cooling module, which is disposed below the supporting block; the second water cooling modules are connected to an external water pump module, and the control device is electrically connected to the water pump module.

[0048] In some embodiments, the second cooling member includes a liquid nitrogen injection module; the liquid nitrogen injection module is connected to an external liquid nitrogen drive module, and the control device is electrically connected to the liquid nitrogen drive module; the liquid nitrogen injection module has multiple nozzles, and the multiple nozzles are arranged at intervals along the periphery of the supporting block.

[0049] In some embodiments, the optical element molding control system further includes a sealed cabin and a vacuum gauge, the pressing block module and the carrying module are both disposed inside the sealed cabin, a portion of the vacuum gauge is disposed inside the sealed cabin to measure the air pressure inside the sealed cabin, the sealed cabin is communicated with an external vacuum pump, and the control device is electrically connected to the vacuum pump and the vacuum gauge;

[0050] The control device is configured to: after the mold is placed on the carrier module, suck the air in the sealed cabin through a vacuum pump according to the air pressure in the cabin, so that the air pressure in the cabin is maintained in a preset air pressure range.

[0051] In some embodiments, the drive module includes a motor, an electric cylinder, a transmission shaft assembly and a support, and the transmission shaft assembly is integrated with a pressure sensor;

[0052] The electric cylinder is fixed to the support, the motor is connected to one end of the transmission shaft group through the electric cylinder, and the other end of the transmission shaft group is connected to the pressing block module.

[0053] In some embodiments, the transmission shaft assembly is provided with a linkage plate, and the support includes a support column, a support plate, and a guide column;

[0054] The support plate is fixed to the support column, and the electric cylinder is fixed to the support plate;

[0055] The guide column is parallel to the transmission shaft group, the guide column is fixedly connected to the linkage plate, and the guide column is slidably arranged on the support plate.

[0056] The optical element forming control system based on ultrasonic vibration provided by the embodiments of the present disclosure can achieve the following technical effects:

[0057] In the optical element molding control system based on temperature-pressure coupling control provided by the disclosed embodiments, the pressing block module and the supporting module in the optical element molding equipment are integrated with a first heating element and a second heating element, respectively. Because the pressing block module and the supporting module can jointly clamp the mold, during operation, the first heating element and the second heating element simultaneously heat the mold from two directions through the pressing block module and the supporting module, respectively, resulting in more uniform heating of the blank in the mold and improved heating efficiency.

[0058] Furthermore, the pressing block module and the carrier module are each integrated with a first cooling element and a second cooling element. During the cooling phase, these elements first cool the pressing block module and the carrier module, and then simultaneously cool the mold from two directions through the pressing block module and the carrier module. This design ensures a smoother and more uniform cooling rate for the molded optical component, reducing the risk of optical defects.

[0059] The control device controls the drive module to dynamically adjust the movement of the pressure block module to maintain a constant pressure output. This not only ensures the consistency of the optical component shape, but also optimizes the internal stress distribution of the optical component and reduces quality issues caused by pressure fluctuations.

[0060] Furthermore, the optical element molding equipment is equipped with an ultrasonic transducer. While the pressing module is stably applying the target pressure to the mold, the ultrasonic transducer synchronously drives the mold on the carrier module to vibrate. When the mold vibrates, the viscosity of the blank is reduced, which promotes the flow of the blank in the cavity of the mold, allowing the blank to quickly fill the microstructure of the cavity, reducing air entrapment, and making the shape of the optical element more accurate. After the optical element in the mold cools and solidifies, the ultrasonic transducer drives the mold on the carrier module to vibrate again. When the mold vibrates, the adhesion between the optical element and the mold is broken, reducing the demolding resistance between the optical element and the mold, reducing the adhesion phenomenon when removing the mold, facilitating the removal of the optical element from the mold, and protecting the surface quality of the optical element.

[0061] The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0063] Figure 1 1 is a schematic structural diagram of an optical element molding control system based on temperature-pressure coupling control provided by an embodiment of the present disclosure;

[0064] Figure 2 is a schematic diagram of a portion of the structure of an optical element molding device provided by an embodiment of the present disclosure;

[0065] Figure 3 is a schematic diagram of a briquetting module provided by an embodiment of the present disclosure;

[0066] Figure 4 1 is a schematic diagram of the assembly of the carrier module and the ultrasonic transducer device provided in an embodiment of the present disclosure;

[0067] Figure 5 The embodiment of the present disclosure provides Figure 4 A cross-sectional view at point A;

[0068] Figure 6 This is a schematic diagram of a portion of the structure of a drive module provided by an embodiment of the present disclosure;

[0069] Figure 7 This is a simplified connection diagram of an optical element molding control system based on temperature-pressure coupling control and auxiliary equipment provided by an embodiment of the present disclosure;

[0070] Figure 8 It is a schematic diagram of a control device provided by an embodiment of the present disclosure.

[0071] The description of the accompanying figures is as follows:

[0072] 100 optical component molding equipment;

[0073] 1 driver module;

[0074] 11 pressure sensor, 12 motor, 13 electric cylinder, 14 transmission shaft assembly, 15 support, 16 vacuum gauge;

[0075] 2. Block module;

[0076] 21 first heating element, 211 first electric heating tube, 22 first cooling element, 221 first water cooling module, 23 first temperature sensor, 24 pressing block, 241 first end surface;

[0077] 3 bearing modules;

[0078] 31 second heating element, 311 second electric heating tube, 32 second cooling element, 321 second water cooling module, 322 liquid nitrogen injection module, 3221 nozzle, 3222 main line, 33 second temperature sensor, 34 bearing block, 341 second end surface;

[0079] 4. Ultrasonic transducer device;

[0080] 41 fixing seat, 42 piezoelectric ultrasonic transducer;

[0081] 5 sealed cabins;

[0082] 51 cabin door, 52 observation window, 53 vacuum valve, 54 nitrogen valve, 55 cooling water interface;

[0083] 6 bellows;

[0084] 200 control equipment, 300 vacuum pump;

[0085] 400 power module, 500 water pump module, 600 liquid nitrogen drive module. DETAILED DESCRIPTION

[0086] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0087] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0088] Unless otherwise stated, the term "plurality" means two or more.

[0089] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0090] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0091] The term "correspondence" may refer to an association relationship or a binding relationship. The correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

[0092] The embodiment of the present disclosure provides an optical element molding control system based on temperature-pressure coupling control, which can be used to manufacture optical elements. The materials of the optical elements can be glass, ceramics, thermoplastic materials, thermosetting materials, etc. Figures 1 to 6 As shown, the optical element molding control system includes an optical element molding device 100 and a control device 200. The control device 200 can be electrically connected to some electrical components and some auxiliary devices in the optical element molding device 100 to control the optical element molding device 100 to complete the molding process of the blank.

[0093] In an embodiment of the present disclosure, an optical element molding device 100 includes a driving module 1, a pressing module 2, a supporting module 3, and an ultrasonic transducer 4. The driving module 1 can drive the pressing module 2 to move, so that the pressing module 2 is close to or away from the supporting module 3. The supporting module 3 is used to support the mold. When the pressing module 2 is close to the supporting module 3, the pressing module 2 can clamp the mold together with the supporting module 3. Here, the mold cavity is used to load the blank. The ultrasonic transducer 4 can drive the mold to vibrate, promoting the flow of the blank in the cavity of the mold.

[0094] The drive module 1 is electrically connected to the control device 200, which can control the drive module 1 to drive the pressing module 2 toward or away from the carrier module 3. When the pressing module 2 contacts the mold, the control device 200 controls the drive module 1 to adjust the movement of the pressing module 2 so that the pressing module 2 can stably apply the target pressure to the mold.

[0095] The drive module 1 is in transmission connection with the pressing module 2, and the drive module 1 can drive the pressing module 2 to move. The pressing module 2 is integrated with a first heating element 21 and a first cooling element 22. The first heating element 21 and the first cooling element 22 can be directly or indirectly electrically connected to the control device 200, and the control device 200 controls the operation of the first heating element 21 and the first cooling element 22.

[0096] The supporting module 3 is located below the pressing block module 2. The supporting module 3 is integrated with a second heating element 31 and a second cooling element 32. The second heating element 31 and the second cooling element 32 can be electrically connected to the control device 200 directly or indirectly. The control device 200 can control the second heating element 31 and the second cooling element 32 to work.

[0097] The ultrasonic transducer 4 is disposed adjacent to the carrier module 3 . The ultrasonic transducer 4 can drive the carrier module 3 to vibrate, thereby driving the mold on the carrier module 3 to vibrate and promoting the flow of the blank in the cavity of the mold.

[0098] The control device 200 can control the optical element molding device 100 to complete the molding process of the blank. The control device 200 is configured to: after controlling the driving module 1 to drive the pressing block module 2 to move toward the supporting module 3 to contact the mold, control the first heating element 21 and the second heating element 31 to work; control the driving module 1 to drive the pressing block module 2 to apply the target pressure to the mold, and control the ultrasonic transducer device 4 to drive the supporting module 3 to vibrate; control the first cooling element 22 and the second cooling element 32 to work to reduce the temperature of the mold; control the driving module 1 to drive the pressing block module 2 away from the supporting module 3, and control the ultrasonic transducer device 4 to drive the supporting module 3 to vibrate again.

[0099] Optionally, the compression molding process may include the following steps:

[0100] (1) The blank is placed into the cavity of the mold, and then the mold is placed on the supporting module 3 of the optical element molding equipment 100.

[0101] (2) After the mold is placed on the carrier module 3 , the control device 200 controls the driving module 1 to drive the pressing module 2 to move toward the carrier module 3 to contact the mold.

[0102] (3) The control device 200 controls the first heating element 21 and the second heating element 31 to operate so that the blank in the mold enters a viscoelastic state.

[0103] The control device 200 controls the operation of the first heating element 21 and the second heating element 31, causing them to heat the pressing module 2 and the supporting module 3, respectively. Because the pressing module 2 and the supporting module 3 now jointly clamp the mold, the first heating element 21 and the second heating element 31 simultaneously heat the mold from two directions, respectively, through the pressing module 2 and the supporting module 3. When the temperature in the mold reaches the blank's transformation temperature (e.g., 600°C to 750°C), the blank in the mold enters a viscoelastic state.

[0104] (4) The control device 200 controls the driving module 1 to drive the pressing module 2 to apply a target pressure to the mold, and controls the ultrasonic transducer 4 to drive the supporting module 3 to vibrate for a first preset time, so that the blank is deformed into an optical element of a specified shape.

[0105] The control device 200 can control the pressing module 2 to move toward the supporting module 3, so that the blank of the mold is gradually deformed into an optical element of a specified shape. When the pressure applied by the pressing module 2 to the mold reaches the target pressure, the control device 200 controls the driving module 1 to dynamically adjust the moving stroke of the pressing module 2, so that the pressing module 2 stably applies the target pressure to the mold for a first preset time. At the same time, the control device 200 controls the ultrasonic transducer device 4 to drive the supporting module 3 to vibrate, thereby driving the mold on the supporting module 3 to vibrate, and the vibration process of the ultrasonic transducer device 4 lasts for a first preset time. Within the first preset time, when the mold vibrates, the viscosity of the blank will be reduced, and the blank will be promoted to flow in the cavity of the mold, so that the blank can quickly fill the microstructure of the cavity (such as V-grooves, pyramid array lights), reduce air entrapment, and make the shape of the optical element more accurate.

[0106] In this step, the target pressure, the first preset duration, the vibration amplitude of the ultrasonic transducer 4, and the vibration frequency of the ultrasonic transducer 4 can be determined based on the specific type of the blank. For example, the first preset duration can be between 30 seconds and 300 seconds; the vibration amplitude of the ultrasonic transducer 4 can be no less than 3 microns; and the vibration frequency of the ultrasonic transducer 4 can be no less than 60 kHz.

[0107] (5) After the first preset time period, the control device 200 controls the first cooling member 22 and the second cooling member 32 to operate, thereby lowering the temperature of the mold so as to cool and solidify the optical element.

[0108] The control device 200 controls the operation of the first cooling member 22 and the second cooling member 32, so that the first cooling member 22 and the second cooling member 32 can cool the pressing block module 2 and the supporting module 3, and then cool the mold from two directions at the same time through the pressing block module 2 and the supporting module 3, so that the optical elements in the mold are cooled and solidified.

[0109] (6) The control device 200 controls the driving module 1 to drive the pressing module 2 away from the supporting module 3, and controls the ultrasonic transducer 4 to drive the supporting module 3 to vibrate for a second preset time period, so as to facilitate the separation of the optical element from the mold.

[0110] After the optical element in the mold cools and solidifies, the control device 200 controls the ultrasonic transducer 4 to vibrate the carrier module 3, thereby causing the mold on the carrier module 3 to vibrate. The vibration of the ultrasonic transducer 4 continues for a second preset duration. During this second preset duration, the vibration of the mold breaks the adhesion between the optical element and the mold, reducing the resistance to demolding between the optical element and the mold, and reducing adhesion during mold removal, facilitating the removal of the optical element from the mold and protecting the surface quality of the optical element.

[0111] In this step, the specific values of the second preset duration, the vibration amplitude of the ultrasonic transducer 4, and the vibration frequency of the ultrasonic transducer 4 can be determined according to the specific type of the blank. For example, the second preset duration can be between 10 seconds and 30 seconds; the vibration amplitude of the ultrasonic transducer 4 can be no less than 3 microns; and the vibration frequency of the ultrasonic transducer 4 can be no less than 60 kHz.

[0112] (7) Remove the mold and take out the optical element from the mold.

[0113] It is understood that after the pressing module 2 is separated from the carrier module 3, the mold is no longer clamped, and thus the mold can be directly removed from the carrier module 3. Furthermore, after the mold continues to vibrate for the second predetermined time, the demolding resistance between the optical element and the mold is reduced, so that the optical element can be smoothly removed from the mold.

[0114] In the optical element molding control system based on temperature-pressure coupling control provided by the embodiments of the present disclosure, the pressing module 2 and the supporting module 3 in the optical element molding apparatus 100 are respectively integrated with a first heating element 21 and a second heating element 31. Because the pressing module 2 and the supporting module 3 can jointly clamp the mold, during operation, the first heating element 21 and the second heating element 31 simultaneously heat the mold from two directions through the pressing module 2 and the supporting module 3, respectively, so that the blank in the mold is heated more evenly and the heating efficiency is improved.

[0115] Furthermore, the pressing module 2 and the carrier module 3 are each integrated with a first cooling element 22 and a second cooling element 32. During the cooling phase, the first cooling element 22 and the second cooling element 32 first cool the pressing module 2 and the carrier module 3, and then simultaneously cool the mold from two directions through the pressing module 2 and the carrier module 3. This design ensures a more gradual and uniform cooling rate for the molded optical component, thereby reducing the risk of defects in the optical component.

[0116] The control device 200 controls the drive module 1 to dynamically adjust the travel of the pressure block module 2, thereby maintaining a constant pressure output. This not only ensures the consistency of the optical component's shape, but also optimizes the stress distribution within the optical component, reducing quality issues caused by pressure fluctuations.

[0117] Furthermore, the optical element molding equipment 100 is equipped with an ultrasonic transducer 4. In the process of the pressing module 2 stably applying the target pressure to the mold, the ultrasonic transducer 4 synchronously drives the mold on the supporting module 3 to vibrate. When the mold vibrates, the viscosity of the blank is reduced, and the blank is promoted to flow in the cavity of the mold, so that the blank can quickly fill the microstructure of the cavity, reduce the air entrapment phenomenon, and also make the shape of the optical element more accurate. After the optical element in the mold is cooled and solidified, the ultrasonic transducer 4 drives the mold on the supporting module 3 to vibrate again. When the mold vibrates, the adhesion between the optical element and the mold is broken, the demolding resistance between the optical element and the mold is reduced, and the adhesion phenomenon during mold removal is reduced, which facilitates the removal of the optical element from the mold and protects the surface quality of the optical element.

[0118] In some embodiments, the ultrasonic transducer 4 is located below the carrier module 3, and the vibration direction of the ultrasonic transducer 4 is parallel to the pressure direction of the drive module 1. The control device 200 is configured to: after the blank in the mold enters the viscoelastic state, control the drive module 1 to drive the pressing block module 2 to apply a target pressure to the mold, control the ultrasonic transducer 4 to drive the carrier module 3 to vibrate along the pressure direction and continue for a first preset time, so that the blank is deformed into an optical element of a specified shape. After the optical element cools and solidifies, control the drive module 1 to drive the pressing block module 2 away from the carrier module 3, and again control the ultrasonic transducer 4 to drive the carrier module 3 to vibrate along the pressure direction and continue for a second preset time, so as to facilitate the separation of the optical element from the mold.

[0119] When the blank enters the viscoelastic state, the viscosity of the blank can be effectively reduced by vibrating the supporting module 3 along the compressive direction. Setting the vibration direction of the ultrasonic transducer 4 to be parallel to the compressive direction of the driving module 1 helps to optimize the pressure transmission path in the blank and ensure that the pressure distribution is more uniform during the entire pressurization process. This not only helps to form an optical element with accurate shape, but also improves the internal stress distribution of the optical element and reduces quality problems caused by uneven pressure. After the optical element cools and solidifies, the ultrasonic transducer 4 is used again to drive the supporting module 3 to vibrate, which can help break the adhesion between the optical element and the mold and reduce the demolding resistance. Since the vibration direction is parallel to the compressive direction, this can more effectively act on the separation process of the optical element and the mold contact surface, reduce the risk of damage during mold removal, and protect the surface quality of the optical element.

[0120] In some embodiments, the ultrasonic transducer device 4 includes a fixing seat 41 and a piezoelectric ultrasonic transducer 42 . The fixing seat 41 is disposed below the supporting module 3 , and the piezoelectric ultrasonic transducer 42 is disposed inside the fixing seat 41 .

[0121] In some embodiments, the driving module 1 is integrated with a pressure sensor 11, which is electrically connected to the control device 200 and is used to detect the output pressure of the driving module 1. The pressing module 2 is integrated with a first temperature sensor 23, which is electrically connected to the control device 200 and is used to detect a first temperature of the pressing module 2. The carrier module 3 is integrated with a second temperature sensor 33, which is electrically connected to the control device 200 and is used to detect a second temperature of the carrier module 3.

[0122] The control device 200 can control the driving module 1 to drive the pressing module 2 to move toward or away from the carrying module 3. When the pressing module 2 contacts the mold, the control device 200 can control the driving module 1 to adjust the movement stroke of the pressing module 2 according to the output pressure, so that the pressing module 2 can apply the target pressure to the mold and maintain the first preset time. The control device 200 can adjust the working parameters of the first heating element 21 according to the first temperature, and adjust the working parameters of the first cooling element 22 according to the first temperature. The control device 200 can adjust the working parameters of the second heating element 31 according to the second temperature, and adjust the working parameters of the second cooling element 32 according to the second temperature.

[0123] The control device 200 can control the optical element molding device 100 to complete the molding process of the blank. The molding process may include the following steps:

[0124] (1) The blank is placed into the cavity of the mold, and then the mold is placed on the supporting module 3 of the optical element molding equipment 100.

[0125] (2) After the mold is placed on the carrier module 3 , the control device 200 controls the driving module 1 to drive the pressing module 2 to move toward the carrier module 3 to contact the mold.

[0126] (3) The control device 200 adjusts the working parameters of the first heating element 21 and the working parameters of the second heating element 31 according to the first temperature and the second temperature, respectively, so that the blank in the mold enters a viscoelastic state.

[0127] By adjusting the operating parameters of the first and second heating elements 21 and 31, the control device 200 can cause the first and second heating elements 21 and 31 to heat the pressing module 2 and the supporting module 3, respectively. Because the pressing module 2 and the supporting module 3 now jointly clamp the mold, the first and second heating elements 21 and 31 simultaneously heat the mold from two directions, respectively, through the pressing module 2 and the supporting module 3. When the temperature in the mold reaches the blank's transformation temperature (e.g., 600°C to 750°C), the blank in the mold enters a viscoelastic state.

[0128] (4) The control device 200 controls the driving module 1 to drive the pressing module 2 to apply a target pressure to the mold, and controls the ultrasonic transducer 4 to drive the supporting module 3 to vibrate for a first preset time, so that the blank is deformed into an optical element of a specified shape.

[0129] (5) The control device 200 adjusts the working parameters of the first cooling member 22 and the working parameters of the second cooling member 32 according to the first temperature and the second temperature, respectively, to reduce the temperature of the mold so that the optical element is cooled and solidified.

[0130] The control device 200 adjusts the working parameters of the first cooling member 22 and the working parameters of the second cooling member 32. The first cooling member 22 and the second cooling member 32 first cool the pressing block module 2 and the supporting module 3, and then cools the mold from two directions at the same time through the pressing block module 2 and the supporting module 3, so that the optical elements in the mold are cooled and solidified.

[0131] (6) The control device 200 controls the driving module 1 to drive the pressing module 2 away from the supporting module 3, and controls the ultrasonic transducer 4 to drive the supporting module 3 to vibrate for a second preset time period, so as to facilitate the separation of the optical element from the mold.

[0132] (7) Remove the mold and take out the optical element from the mold.

[0133] The pressing module 2 and the supporting module 3 are respectively equipped with a first temperature sensor 23 and a second temperature sensor 33, which enable them to accurately detect the first temperature of the pressing module 2 and the second temperature of the supporting module 3. Based on the real-time feedback data from the first temperature sensor 23 and the second temperature sensor 33, the operating parameters of the first heating element 21 and the second heating element 31 are dynamically adjusted during the heating phase; during the cooling phase, the operating parameters of the first cooling element 22 and the second cooling element 32 are adjusted to ensure more precise temperature control during the heating and cooling processes. The control device 200 can control the driving module 1 to dynamically adjust the movement stroke of the pressing module 2 based on the real-time data provided by the pressure sensor 11, thereby maintaining a constant pressure output. This not only ensures the consistency of the shape of the optical element, but also optimizes the internal stress distribution of the optical element and reduces quality problems caused by pressure fluctuations. By integrating the first heating element 21, the first cooling element 22 and the first temperature sensor 23 into the pressing module 2, and integrating the second heating element 31, the second cooling element 32 and the second temperature sensor 33 into the supporting module 3, not only can the equipment structure be simplified and the spatial layout optimized, but also motion interference problems can be avoided. This design significantly improves the overall performance and reliability of the system.

[0134] In some embodiments, the control device 200 is configured to: adjust the operating parameters of the first heating element 21 according to the first temperature, and adjust the operating parameters of the second heating element 31 according to the second temperature, so that the first temperature and the second temperature are maintained in a preset temperature range, thereby causing the blank in the mold to enter a viscoelastic state. Control the drive module 1 to drive the pressing block module 2 to move toward the carrier module 3 until the output pressure reaches the preset pressure range, and then control the drive module 1 to dynamically adjust the movement stroke of the pressing block module 2 according to the output pressure. At the same time, control the ultrasonic transducer 4 to drive the carrier module 3 to vibrate so that the blank is deformed into an optical element of a specified shape. After a first preset time, control the first heating element 21 and the second heating element 31 to stop working, adjust the operating parameters of the first cooling element 22 according to the first temperature, and adjust the operating parameters of the second cooling element 32 according to the second temperature, so that the first temperature and the second temperature are reduced to the target temperature, thereby cooling and solidifying the optical element. Control the drive module 1 to drive the pressing block module 2 away from the carrier module 3, and again control the ultrasonic transducer 4 to drive the carrier module 3 to vibrate and continue for a second preset time to facilitate separation of the optical element from the mold.

[0135] In the embodiment of the present disclosure, the preset temperature range can be determined according to the blank transformation temperature. When the first temperature and the second temperature are maintained in the preset temperature range, the temperature in the mold can reach the blank transformation temperature.

[0136] In the embodiment of the present disclosure, the preset pressure interval can be determined according to the target pressure. When the output pressure of the driving module 1 is maintained in the preset pressure interval, the pressing module 2 can stably apply the target pressure to the mold.

[0137] In the embodiment of the present disclosure, the target temperature may be an ambient temperature or a preset default temperature. When the first temperature and the second temperature are reduced to the target temperature, it should be ensured that the optical element is completely cured.

[0138] In some embodiments, combined Figures 1 to 7 As shown, the optical element molding control system also includes a sealed cabin 5 and a vacuum gauge 16. The pressing module 2 and the carrier module 3 are both disposed within the sealed cabin 5. A portion of the vacuum gauge 16 is disposed within the sealed cabin 5 to measure the air pressure within the sealed cabin 5. The sealed cabin 5 is in communication with an external vacuum pump 300, and the control device 200 is electrically connected to the vacuum pump 300 and the vacuum gauge 16.

[0139] In the process where the control device 200 can control the optical element molding device 100 to complete the molding of the blank, it is necessary to open the hatch 51 of the sealed cabin 5 and place the mold on the carrier module 3 of the optical element molding device 100. After the mold is placed on the carrier module 3, the control device 200 sucks the air in the sealed cabin 5 through the vacuum pump 300 according to the air pressure in the cabin, so that the air pressure in the cabin is maintained in the preset air pressure range. When the air pressure in the cabin is maintained in the preset air pressure range, the control device 200 controls the drive module 1 to drive the pressure block module 2 to move toward the carrier module 3 to contact the mold, and then executes subsequent steps. Here, the sealed cabin 5 provides an environment close to vacuum. Completing the molding process of the blank in such an environment can reduce the gas content in the blank, thereby reducing the amount of bubbles and surface defects in the optical element, and improving the quality of the final molded optical element.

[0140] In some embodiments, the drive module 1 includes a motor 12, an electric cylinder 13, a drive shaft assembly 14, and a support 15. The drive shaft assembly 14 is integrated with a pressure sensor 11. The electric cylinder 13 is fixed to the support 15. The motor 12 is connected to one end of the drive shaft assembly 14 via the electric cylinder 13. The other end of the drive shaft assembly 14 is connected to the pressing module 2. The motor 12 is electrically connected to a control device 200. The control device 200 can control the motor 12 to output rotational motion. The electric cylinder 13 can convert the rotational motion of the motor 12 into linear motion, thereby driving the drive shaft assembly 14 along its axial direction. The drive shaft assembly 14 drives the pressing module 2 toward or away from the carrier module 3.

[0141] In some embodiments, the pressing block module 2 includes a pressing block 24 for contacting the mold, the first heating element 21 is disposed inside the pressing block 24 , and the first cooling element 22 is disposed above the pressing block 24 .

[0142] Placing the first heating element 21 inside the pressing block 24 directly heats the pressing block 24, achieving rapid and uniform heat transfer through direct contact between the pressing block 24 and the mold. This ensures that the blank quickly enters a viscoelastic state, facilitating the smooth progress of the subsequent molding process. The design of the first cooling element 22 above the pressing block 24 allows for rapid reduction of the temperature of the pressing block 24 when necessary, indirectly cooling the mold and the optical elements therein through heat conduction, helping to control the cooling rate and reduce stress concentration or cracks caused by excessive temperature differences.

[0143] In some embodiments, the carrier module 3 includes a carrier block 34 for contacting the mold, and the second heating element 31 is disposed within the carrier block 34. Placing the second heating element 31 within the carrier block 34 directly heats the carrier block 34, achieving rapid and uniform heat transfer through direct contact between the carrier block 34 and the mold. This ensures that the blank quickly reaches a viscoelastic state, facilitating the molding process.

[0144] In some embodiments, combined Figures 1 to 7 As shown, the first heating element 21 includes a first electric heating tube 211, and the second heating element 31 includes a second electric heating tube 311. The control device 200, the first electric heating tube 211, and the second heating element 31 are all electrically connected to an external power supply module 400. The control device 200 is configured to send a first control instruction to the power supply module 400 based on the first temperature and the second temperature, instructing the power supply module 400 to adjust the heating power of the first electric heating tube 211 and the heating power of the second electric heating tube 311 so that the first temperature and the second temperature are maintained within a preset temperature range, thereby causing the blank in the mold to enter a viscoelastic state.

[0145] The control device 200, in conjunction with the power module 400, can send a first control instruction to the power module 400 based on the real-time monitored first and second temperatures to precisely adjust the heating power of the first and second electric heating tubes 211 and 311. This feedback-based control system enables high-precision temperature control, ensuring that the blank uniformly and accurately reaches its viscoelastic state.

[0146] In some embodiments, there are multiple first electric heating tubes 211, and the pressing block 24 has a first end surface 241 for contacting the mold. The first number of first electric heating tubes 211 is referred to as a first electric heating tube group, and the second number of first electric heating tubes 211 is referred to as a second electric heating tube group, where the first number is greater than the second number. Each first electric heating tube 211 in the first electric heating tube group is arranged parallel to the first end surface 241, and each first electric heating tube 211 in the second electric heating tube group is arranged parallel to the first end surface 241. In a direction perpendicular to the first end surface 241, the second electric heating tube group is closer to the first end surface 241 than the first electric heating tube group. The center of symmetry of the area occupied by the first electric heating tube group is aligned with the center of symmetry of the area occupied by the second electric heating tube group. The values of the first and second numbers can be determined based on actual design requirements. For example, the first number is 4 and the second number is 2.

[0147] In the disclosed embodiment, different regions within the compact 24 have different distances from the mold, resulting in different heat conduction paths. Specifically, the region near the first end face 241 is in direct contact with the mold, making it easier for heat to be transferred to the mold. Therefore, reducing the number of first electric heating tubes 211 in this region can avoid local overheating. The region away from the first end face 241 is farther from the mold and suffers from greater heat loss. By increasing the number of first electric heating tubes 211 in this region, energy attenuation during the heat transfer process can be compensated. Therefore, by limiting the direction perpendicular to the first end face 241, the second electric heating tube group containing fewer first electric heating tubes 211 is closer to the first end face 241 than the first electric heating tube group containing more first electric heating tubes 211, thereby ensuring a more balanced temperature distribution within the overall compact 24. Furthermore, the centers of symmetry of the distribution areas of the first and second electric heating tube groups are aligned, meaning that the heat output is symmetrically distributed around a geometric center. This symmetrical structure helps to form a more uniform and symmetrical temperature field. Through the above design, the temperature of each position of the first end surface 241 can be made more uniform, so that the mold can obtain consistent heat input conditions during the heating stage, thereby ensuring that the overall time for the blank to enter the viscoelastic state is consistent and the deformation behavior is consistent.

[0148] In some embodiments, a plurality of first electric heating tubes 211 are disposed around the first temperature sensor 23 , which can make the temperature detected by the first temperature sensor 23 more accurate.

[0149] In some embodiments, there are multiple second electric heating tubes 311, and the support block 34 has a second end surface 341 for contacting the mold. A third number of second electric heating tubes 311 is defined as a third electric heating tube group, and a fourth number of second electric heating tubes 311 is defined as a fourth electric heating tube group, where the third number is greater than the fourth number. Each second electric heating tube 311 in the third electric heating tube group is arranged parallel to the second end surface 341, and each second electric heating tube 311 in the fourth electric heating tube group is arranged parallel to the second end surface 341. In a direction perpendicular to the second end surface 341, the fourth electric heating tube group is closer to the second end surface 341 than the third electric heating tube group. The center of symmetry of the area occupied by the third electric heating tube group is aligned with the center of symmetry of the area occupied by the fourth electric heating tube group. The values of the third and fourth numbers can be determined based on actual design requirements. For example, the third number can be 4 and the fourth number can be 2.

[0150] In the disclosed embodiment, different regions within the support block 34 have different distances from the mold, resulting in different heat conduction paths. Specifically, the region near the second end face 341 is in direct contact with the mold, making heat transfer to the mold easier. Therefore, reducing the number of second electric heating tubes 311 in this region can avoid local overheating. Regions farther from the second end face 341 are farther from the mold and experience greater heat loss. By increasing the number of second electric heating tubes 311 in this region, energy attenuation during heat transfer can be compensated. Therefore, by limiting the direction perpendicular to the second end face 341, the fourth electric heating tube group containing fewer second electric heating tubes 311 is closer to the first end face 241 than the third electric heating tube group containing more second electric heating tubes 311, ensuring a more balanced temperature distribution within the entire support block 34. Furthermore, the centers of symmetry of the distribution areas of the first and second electric heating tube groups are aligned, meaning that the heat output is symmetrically distributed around a geometric center. This symmetrical structure helps to form a more uniform and symmetrical temperature field. Through the above design, the temperature of each position of the second end surface 341 can be made more uniform, so that the mold can obtain consistent heat input conditions during the heating stage, thereby ensuring that the overall time for the blank to enter the viscoelastic state is consistent and the deformation behavior is consistent.

[0151] In some embodiments, a plurality of second electric heating tubes 311 are disposed around the second temperature sensor 33 , which can make the temperature detected by the second temperature sensor 33 more accurate.

[0152] In some embodiments, combined Figures 1 to 7As shown, the first cooling element 22 includes a first water-cooling module 221, and the second cooling element 32 includes a second water-cooling module 321. The first water-cooling module 221 and the second water-cooling module 321 are both in communication with an external water pump module 500, and the control device 200 is electrically connected to the water pump module 500. The control device 200 is configured to send a second control instruction to the water pump module 500 based on the first temperature and the second temperature, instructing the water pump module 500 to adjust the flow rate of cooling water in the first water-cooling module 221 and the second water-cooling module 321, so that the first temperature and the second temperature are reduced to the target temperature according to the preset cooling rate, thereby reducing the temperature of the mold and cooling and solidifying the optical element.

[0153] By monitoring the first and second temperatures in real time, the control device 200 can send corresponding control instructions based on the actual temperatures to adjust the operating parameters of the water pump module 500, thereby precisely regulating the flow rate of cooling water in the first and second water cooling modules 221 and 321. This ensures that the mold and the optical components within it cool at a preset rate. The slow and even cooling process helps reduce thermal stress in the optical components and prevent defects such as cracks and deformation caused by rapid cooling.

[0154] In some embodiments, when the second cooling element 32 includes a second water-cooling module 321, the second water-cooling module 321 is disposed below the carrier block 34. The design of the second cooling element 32 below the carrier block 34 allows the temperature of the carrier block 34 to be quickly reduced when needed, indirectly cooling the mold and the optical elements therein through heat conduction, helping to control the cooling rate and reduce stress concentration or cracks caused by excessive temperature differences.

[0155] In some embodiments, combined Figures 1 to 7 As shown, the second cooling element 32 includes a liquid nitrogen injection module 322, which is in communication with an external liquid nitrogen driving module 600. The control device 200 is electrically connected to the liquid nitrogen driving module 600. The control device 200 is configured to send a third control instruction to the liquid nitrogen driving module 600 based on the second temperature, instructing the liquid nitrogen driving module 600 to adjust the flow rate of liquid nitrogen in the liquid nitrogen injection module 322 so that the second temperature is reduced to the target temperature at a preset cooling rate, thereby reducing the temperature of the mold and cooling and solidifying the optical element.

[0156] In the disclosed embodiment, a liquid nitrogen injection module 322 is used as the second cooling element 32, and nitrogen cooling is applied only after the optical element molding process is completed. This design cleverly utilizes the efficient cooling capacity of liquid nitrogen while ensuring that the cooling medium does not adversely affect the quality of the final product. Specifically, after the optical element is molded and achieves the desired shape and structure, the control device 200 sends a precise third control instruction to the liquid nitrogen drive module 600 based on the real-time temperature of the carrier module 3 (i.e., the second temperature). This enables the liquid nitrogen injection module 322 to adjust the liquid nitrogen flow rate according to a preset cooling rate, effectively reducing the temperature of the mold and the optical element therein, promoting rapid and uniform cooling and solidification of the optical element. Because the liquid nitrogen is introduced after the optical element has been finalized and acts directly on the mold exterior rather than the interior, it ensures that the nitrogen creates a cooling environment only around the mold surface and does not penetrate into the interior of the optical element. This means that the presence and use of nitrogen will not interfere with or change the properties of the blank itself, nor will it leave any residue inside the optical element or cause other potential quality issues.

[0157] In some embodiments, the liquid nitrogen spray module 322 includes multiple nozzles 3221 spaced apart along the periphery of the carrier block 34. Because the multiple nozzles 3221 are arranged in a ring around the carrier block 34, liquid nitrogen can be sprayed simultaneously from multiple directions onto the carrier block 34 and the surrounding mold surface, avoiding large local temperature differences and uneven cooling. This helps to quickly and evenly cool the entire carrier block 34, thereby driving the temperature field of the mold and the optical elements therein to a uniform level, reducing defects such as thermal stress and cracks caused by uneven cooling.

[0158] In some embodiments, the liquid nitrogen spray module 322 includes a main line 3222 that communicates with an external liquid nitrogen drive module 600. The main line 3222 is disposed around the carrier block 34. A plurality of nozzles 3221 are disposed on the main line 3222 and spaced apart along the extension direction of the main line 3222, thereby achieving a plurality of nozzles 3221 spaced apart along the periphery of the carrier block 34.

[0159] In some embodiments, the sealed cabin 5 is provided with an observation window 52 , through which the user can view the interior of the sealed cabin 5 .

[0160] In some embodiments, the sealed cabin 5 is provided with a vacuum valve 53 , and the sealed cabin 5 is connected to the external vacuum pump 300 through the vacuum valve 53 .

[0161] In some embodiments, the sealed cabin 5 is provided with a nitrogen valve 54 , and the liquid nitrogen injection module 322 is connected to the external liquid nitrogen driving module 600 through the nitrogen valve 54 .

[0162] In some embodiments, the sealed cabin 5 is provided with a cooling water interface 55 , and the first water cooling module 221 and the second water cooling module 321 can be connected to the external water pump module 500 through the cooling water interface 55 .

[0163] In some embodiments, the transmission shaft assembly 14 is disposed in the sealed cabin 5, and the end of the transmission shaft assembly 14 located in the sealed cabin 5 is fixedly connected to the first cooling member 22. A bellows 6 is provided at the connection between the transmission shaft assembly 14 and the sealed cabin 5 to form a seal therebetween, thereby ensuring the vacuum level of the sealed cabin 5.

[0164] Combine Figure 8 As shown, the control device 200 provided in the embodiment of the present disclosure includes a processor 201 and a memory 202. Optionally, the device 200 may also include a communication interface 203 and a bus 204. The processor 201, communication interface 203, and memory 202 may communicate with each other via the bus 204. The communication interface 203 may be used for information transmission. The processor 201 may invoke logic instructions stored in the memory 202 to control the optical element molding apparatus 100 to complete the blank molding process.

[0165] In addition, the logic instructions in the memory 202 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product.

[0166] Memory 202, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods of the embodiments of the present disclosure. Processor 201 executes the program instructions / modules stored in memory 202 to perform functional applications and data processing, specifically controlling optical element molding apparatus 100 to complete the blank molding process.

[0167] The memory 202 may include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function; the data storage area may store data generated based on the use of the terminal device. Furthermore, the memory 202 may include a high-speed random access memory and a non-volatile memory.

[0168] The embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions. The control device 200 controls the optical element molding device 100 to complete the molding process of the blank by executing the instructions.

[0169] The technical solutions of the embodiments of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes one or more instructions for causing a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in the embodiments of the present disclosure. The aforementioned storage medium may be a non-transitory storage medium, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, among other media capable of storing program code.

[0170] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. Moreover, the terms used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, the singular forms "a", "an" and "the" are intended to also include the plural forms unless the context clearly indicates otherwise. Similarly, the term "and / or" as used in this application means any and all possible combinations of one or more of the associated listings. In addition, when used in this application, the term "comprise" and its variations "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In the absence of further restrictions, an element defined by the sentence "comprising a..." does not exclude the presence of other identical elements in the process, method or device that includes the element. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments can be referenced to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can be referred to the description of the method part.

[0171] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software may depend on the specific application and design constraints of the technical solution. The technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. The technicians will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0172] In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices and equipment) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units may be merely a logical functional division. In actual implementation, other divisions may be used, such as combining or integrating multiple units or components into another system, or omitting or disabling some features. Furthermore, the couplings or direct couplings or communication connections shown or discussed may be through interfaces, indirect couplings or communication connections between devices or units, and may be electrical, mechanical, or other forms. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of these units may be selected to implement the embodiments according to actual needs. Furthermore, the functional units in the disclosed embodiments may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit.

[0173] The flowcharts and block diagrams in the accompanying drawings show the possible implementation architectures, functions and operations of the systems, methods and computer program products according to the embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of the code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical functions. In some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different boxes can also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, which can depend on the functions involved. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. An optical element forming control system based on ultrasonic vibration, characterized in that: The optical element molding device (100) comprises an optical element molding device (100) and a control device (200), wherein the optical element molding device (100) comprises: Drive module (1); A pressing module (2), wherein the driving module (1) is in transmission connection with the pressing module (2) to drive the pressing module (2) to move, and the pressing module (2) is integrated with a first heating element (21) and a first cooling element (22); A bearing module (3) is located below the pressing module (2) and is used to clamp the mold together with the pressing module (2). The bearing module (3) is integrated with a second heating element (31) and a second cooling element (32); An ultrasonic transducer device (4) is disposed adjacent to the bearing module (3) and is used to drive the bearing module (3) to vibrate; The control device (200) is configured to: After controlling the driving module (1) to drive the pressing module (2) to move toward the carrying module (3) to contact the mold, controlling the first heating element (21) and the second heating element (31) to operate; Controlling the driving module (1) to drive the pressing module (2) to apply target pressure to the mold, and controlling the ultrasonic transducer device (4) to drive the bearing module (3) to vibrate; Controlling the first cooling member (22) and the second cooling member (32) to cool the pressing block module (2) and the bearing module (3), thereby cooling the mold from two directions simultaneously through the pressing block module (2) and the bearing module (3); The driving module (1) is controlled to drive the pressing module (2) away from the bearing module (3), and the ultrasonic transducer device (4) is controlled again to drive the bearing module (3) to vibrate.

2. The optical element molding control system according to claim 1, characterized in that: The control device (200) is configured to: After the mold is placed on the carrier module (3), the driving module (1) is controlled to drive the pressing block module (2) to move toward the carrier module (3) to contact the mold; Controlling the operation of the first heating element (21) and the second heating element (31) to make the blank in the mold enter a viscoelastic state; Controlling the driving module (1) to drive the pressing module (2) to apply a target pressure to the mold, and controlling the ultrasonic transducer device (4) to drive the bearing module (3) to vibrate for a first preset time period, so as to deform the blank into an optical element of a specified shape; After a first preset time, the first cooling member (22) and the second cooling member (32) are controlled to cool the pressing block module (2) and the carrying module (3), so as to cool the mold from two directions simultaneously through the pressing block module (2) and the carrying module (3), so as to cool and solidify the optical element; The driving module (1) is controlled to drive the pressing module (2) away from the carrying module (3), and the ultrasonic transducer device (4) is controlled again to drive the carrying module (3) to vibrate and continue for a second preset time length, so as to facilitate separation of the optical element from the mold, and the first preset time length is greater than the second preset time length.

3. The optical element molding control system according to claim 2, characterized in that: The ultrasonic transducer (4) is located below the bearing module (3), the vibration direction of the ultrasonic transducer (4) is parallel to the pressure direction of the driving module (1), and the control device (200) is configured as follows: After the blank in the mold enters a viscoelastic state, the driving module (1) is controlled to drive the pressing module (2) to apply a target pressure to the mold, and the ultrasonic transducer device (4) is controlled to drive the bearing module (3) to vibrate along the pressure direction for a first preset time, so that the blank is deformed into an optical element of a specified shape; After the optical element is cooled and solidified, the driving module (1) is controlled to drive the pressing block module (2) away from the supporting module (3), and the ultrasonic transducer device (4) is controlled again to drive the supporting module (3) to vibrate along the pressure direction and continue for a second preset time, so as to facilitate the separation of the optical element from the mold.

4. The optical element molding control system according to claim 1, wherein: Include at least one of the following: The vibration amplitude of the ultrasonic transducer (4) is not less than 3 micrometers; The vibration frequency of the ultrasonic transducer (4) is not less than 60 kHz; The first preset duration is 30 seconds to 300 seconds; The second preset duration is 10 seconds to 30 seconds.

5. The optical element molding control system according to claim 1, characterized in that: The ultrasonic transducer device (4) comprises a fixing seat (41) and a piezoelectric ultrasonic transducer (42). The fixing seat (41) is arranged below the bearing module (3), and the piezoelectric ultrasonic transducer (42) is arranged inside the fixing seat (41).

6. The optical element molding control system according to claim 1, characterized in that: The pressing block module (2) comprises a pressing block (24) for contacting the mold, a first heating element (21) is arranged inside the pressing block (24), and a first cooling element (22) is arranged above the pressing block (24).

7. The optical element molding control system according to claim 6, characterized in that: The first heating element (21) includes a first electric heating tube (211), and the control device (200) and the first electric heating tube (211) are both electrically connected to an external power supply module (400).

8. The optical element molding control system according to claim 7, characterized in that: There are multiple first electric heating tubes (211), and the pressing block (24) has a first end surface (241) for contacting the mold; A first number of first electric heating tubes (211) is used as a first electric heating tube group, and a second number of first electric heating tubes (211) is used as a second electric heating tube group, wherein the first number is greater than the second number; Each first electric heating tube (211) in the first electric heating tube group is arranged in a direction parallel to the first end surface (241), and each first electric heating tube (211) in the second electric heating tube group is arranged in a direction parallel to the first end surface (241); In a direction perpendicular to the first end surface (241), the second electric heating tube assembly is closer to the first end surface (241) than the first electric heating tube assembly; The symmetric center of the area occupied by the first electric heating tube group is aligned with the symmetric center of the area occupied by the second electric heating tube group.

9. The optical element molding control system according to claim 6, characterized in that: The first cooling member (22) includes a first water cooling module (221), the first water cooling module (221) is in communication with an external water pump module (500), and the control device (200) is electrically connected to the water pump module (500).

10. The optical element molding control system according to claim 1, wherein: The bearing module (3) comprises a bearing block (34) for contacting the mold, and the second heating element (31) is arranged inside the bearing block (34).

11. The optical element molding control system according to claim 10, characterized in that: The second heating element (31) includes a second electric heating tube (311), and the control device (200) and the second heating element (31) are both electrically connected to an external power supply module (400).

12. The optical element molding control system according to claim 11, characterized in that: There are multiple second electric heating tubes (311), and the bearing block (34) has a second end surface (341) for contacting the mold; A third number of second electric heating tubes (311) is used as a third electric heating tube group, and a fourth number of second electric heating tubes (311) is used as a fourth electric heating tube group, wherein the third number is greater than the fourth number; Each second electric heating tube (311) in the third electric heating tube group is arranged in a direction parallel to the second end surface (341), and each second electric heating tube (311) in the fourth electric heating tube group is arranged in a direction parallel to the second end surface (341); In a direction perpendicular to the second end surface (341), the fourth electric heating tube group is closer to the second end surface (341) than the third electric heating tube group; The symmetric center of the area occupied by the third electric heating tube group is aligned with the symmetric center of the area occupied by the fourth electric heating tube group.

13. The optical element molding control system according to claim 10, wherein: The second cooling member (32) includes a second water-cooling module (321), and the second water-cooling module (321) is arranged below the bearing block (34); The second water cooling modules (321) are both in communication with an external water pump module (500), and the control device (200) is electrically connected to the water pump module (500).

14. The optical element molding control system according to claim 10, wherein: The second cooling member (32) includes a liquid nitrogen spray module (322); The liquid nitrogen injection module (322) is in communication with an external liquid nitrogen drive module (600), and the control device (200) is electrically connected to the liquid nitrogen drive module (600); The liquid nitrogen spray module (322) has a plurality of nozzles (3221), and the plurality of nozzles (3221) are arranged at intervals along the outer periphery of the carrier block (34).

15. The optical element molding control system according to claim 1, wherein: It also includes a sealed cabin (5) and a vacuum gauge (16); The pressing block module (2) and the carrying module (3) are both arranged inside the sealed cabin (5), a portion of the vacuum gauge (16) is arranged inside the sealed cabin (5) to measure the air pressure inside the sealed cabin (5), the sealed cabin (5) is communicated with an external vacuum pump (300), and the control device (200) is electrically connected to the vacuum pump (300) and the vacuum gauge (16); The control device (200) is configured to: after the mold is placed on the carrier module (3), suck the air in the sealed cabin (5) through the vacuum pump (300) according to the air pressure in the cabin, so that the air pressure in the cabin is maintained in a preset air pressure range.

16. The optical element molding control system according to claim 1, wherein: The driving module (1) includes a motor (12), an electric cylinder (13), a transmission shaft assembly (14) and a support (15), wherein the transmission shaft assembly (14) is integrated with a pressure sensor (11); The electric cylinder (13) is fixed to the support (15), the motor (12) is connected to one end of the transmission shaft group (14) through the electric cylinder (13), and the other end of the transmission shaft group (14) is connected to the pressing block module (2).

Citation Information

Patent Citations

  • Ultrasonic vibration-assisted method for precise mould pressing and shaping

    CN102173563A

  • Laboratory apparatus and method for handling laboratory samples

    CN103857464A