Image combination method and system for LED sorting

Abstract

The invention provides an image combining method and system for LED sorting. The method comprises the steps that a scanning image file of an LED wafer is obtained through a sorting machine, and a spot measurement image file of the LED wafer is obtained through a spot measurement machine; comparing the two values, and judging the scanning yield of the LED wafer; setting a scanning yield critical value, and when the scanning yield is smaller than the scanning yield critical value, performing secondary image combination on the scanning image file and the spot measurement image file by using a secondary image combination method, including: selecting a reference point grain coordinate in the spot measurement image file; calculating the distance from the reference point crystal grain coordinate to the blank terrain by taking the reference point crystal grain coordinate as a central point, and generating an updated point measurement drawing file; in the scanning image file, blank terrains are scanned, reference point crystal grain coordinates in the scanning image file are reversely deduced according to the distance between the reference point crystal grain coordinates in the point measurement image file and the blank terrains, and an updated scanning image file is generated; combining the two pictures to obtain a combined picture file; and judging whether image combination succeeds based on the combined image file. According to the LED wafer sorting device, secondary sorting can be carried out on the LED wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of LED production and manufacturing, and particularly relates to a method and system for LED sorting and image synthesis. Background Art

[0002] A light-emitting diode (LED) is a semiconductor electronic component that can emit light. This electronic component first appeared in 1962. In the early days, it could only emit low-intensity red light. Later, versions of other monochromatic lights were developed. Today, the light it can emit has covered visible light, infrared, and ultraviolet light, and the brightness has also been increased to a quite high level. Its uses have also changed from being used as indicator lights, display boards, etc. at the beginning; with the continuous progress of technology, light-emitting diodes have been widely used in displays, TV backlights, decoration, and lighting. In the LED semiconductor chip manufacturing industry, as the production capacity demand increases, the number of required sorters is also increasing day by day. During production, many problems often occur and need to be re-scanned to continue the operation. After the machine is re-scanned, due to the too low scanning yield, the machine cannot automatically synthesize images, and manual image synthesis by personnel is required.

[0003] In the prior art, the specific process of LED chip sorting is as follows: First, the wafer is scanned to determine the position information of each chip, and the LED chips on the wafer are tested to generate a test document; then the sorter scans the wafer to generate a scanning document, and finally the scanning document and the test document are combined to obtain a sorting document according to requirements, and the LED chips are sorted into bins.

[0004] However, the prior art has the following defects and deficiencies:

[0005] 1) After the machine is scanned for the second time, the scanning yield is low, and some machines cannot automatically synthesize images, affecting the automation production efficiency of the machine;

[0006] 2) There are many machines, and the number of times of manual image synthesis by personnel after the required second scan is also large, increasing the labor cost. If the personnel do not process it in time, it will affect the production capacity utilization of the machine;

[0007] 3) The number of times of manual image synthesis by personnel is large, increasing the risk of image synthesis errors. Summary of the Invention

[0008] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a method for LED sorting and image synthesis, aiming to solve the technical problems in the prior art that after the machine is scanned for the second time, the scanning yield is low, some machines cannot automatically synthesize images, affecting the automation production efficiency of the machine; there are many machines, and the number of times of manual image synthesis by personnel after the required second scan is also large, increasing the labor cost. If the personnel do not process it in time, it will affect the production capacity utilization of the machine; the number of times of manual image synthesis by personnel is large, increasing the risk of image synthesis errors.

[0009] To achieve the above object, the present invention is implemented by the following technical solutions:

[0010] An LED sorting and combined graph method, comprising the following steps:

[0011] Scan the LED wafer by a sorter to obtain a scanned document of the LED wafer, and test the LED wafer by a probe machine to obtain a probe test document of the LED wafer;

[0012] Compare the scanned document with the probe test document, and judge the scanning yield of the LED wafer by the sorter;

[0013] Set a scanning yield threshold. When the scanning yield of the LED wafer is less than the scanning yield threshold, use the secondary combined graph method to perform secondary combination of the scanned document and the probe test document;

[0014] The step of using the secondary combined graph method to perform secondary combination of the scanned document and the probe test document specifically includes:

[0015] Randomly select the reference point die coordinates in the LED wafer reflected by the probe test document;

[0016] Taking the reference point die coordinates as the center point, calculate the distance from the reference point die coordinates to each blank terrain, and then generate an updated probe test document;

[0017] Scan the blank terrain in the LED wafer reflected by the scanned document, and based on the distance from the reference point die coordinates in the probe test document to each blank terrain, inversely deduce the reference point die coordinates in the scanned document, and then generate an updated scanned document;

[0018] Merge the updated probe test document and the updated scanned document to obtain a combined document;

[0019] Judge whether the combined graph is successful based on the combined document.

[0020] According to one aspect of the above technical solution, the step of scanning the LED wafer by a sorter to obtain a scanned document of the LED wafer, and testing the LED wafer by a probe machine to obtain a probe test document of the LED wafer specifically includes:

[0021] Scan the LED wafer by a sorter to obtain the pick-and-place die coordinates-grade data text on the LED wafer;

[0022] Reflect the die state on the LED wafer in real time through the pick-and-place die coordinates-grade data text, and generate a scanned document based on the die state on the LED wafer;

[0023] Test the electrical parameters and coordinate positions of each die of the LED wafer through a probe machine;

[0024] Output the electrical parameters and coordinate positions of each die of the LED wafer to the sorter for reading to generate a probe document.

[0025] According to one aspect of the above technical solution, comparing the scanned document with the probe document, and judging the scanning yield of the LED wafer by the sorter. The specific steps include:

[0026] In the scanned document, count the number of dies with the die status of not picked to obtain scanning data;

[0027] In the probe document, count the number of dies with electrical parameters to obtain probe data;

[0028] Compare the scanning data with the probe data to obtain the scanning yield.

[0029] According to one aspect of the above technical solution, when the scanning yield of the LED wafer is greater than the scanning yield critical value, perform a single image combination of the scanned document and the probe document using the general image combination method. The specific steps include:

[0030] In the probe document, select mark points, where the mark points are composed of multiple dies with special appearances;

[0031] Take a randomly selected die with a special appearance in the mark point as the reference point, and take the remaining dies with special appearances in the mark point as verification points;

[0032] Scan the LED wafer through the sorter. When the scanning yield is greater than 95%, synchronize the coordinates of the reference point in the probe document to the scanned document, and perform image combination of the scanned document and the probe document to synchronize the verification points in the probe document to the scanned document;

[0033] After the image combination is completed, verify the positions of the reference point and its adjacent verification points in the scanned document.

[0034] According to one aspect of the above technical solution, in the probe document, the blank terrain is a pattern generated at the adjacent positions of the coordinates of the picked and unpicked dies, as well as the Mark point pattern.

[0035] According to one aspect of the above technical solution, in the LED wafer reflected in the scanned document, scan the blank topography, and based on the distances from the reference point die coordinates in the probe document to each blank topography, reverse-deduce the reference point die coordinates in the scanned document, and then generate an updated scanned document. The specific steps include:

[0036] In the LED wafer reflected in the scanned document, scan any blank topography and correspond this blank topography to the corresponding blank topography in the probe document;

[0037] Obtain the distance from the corresponding blank topography in the probe document to the reference point die coordinates in the probe document, and based on this distance in the scanned document, calculate the reference point die coordinates in the scanned document from the blank topography;

[0038] According to the distances from the reference point die coordinates to the remaining blank topographies in the probe document, in the scanned document, with the reference point die coordinates as the base point, synchronously find out the remaining blank topographies, and then construct an updated scanned document.

[0039] According to one aspect of the above technical solution, the specific steps for determining whether the map combination is successful based on the combined document include:

[0040] Check whether there are duplicate coordinates in the combined document;

[0041] If the number of the duplicate coordinates is greater than or equal to 10, start the alarm module;

[0042] If the number of the duplicate coordinates is less than 10, determine that the map combination is successful and continue the operation.

[0043] According to one aspect of the above technical solution, the duplicate coordinates are the coordinates of the die that have been picked in the probe document but are shown as not picked in the combined document, and the coordinates of the die that are shown as not picked in the probe document but there is no die at this position in the combined document.

[0044] The present invention also provides an LED sorting and map combination system, including:

[0045] An acquisition module: used to scan an LED wafer through a sorter to obtain a scanned document of the LED wafer, and test the LED wafer through a probe machine to obtain a probe document of the LED wafer;

[0046] A judgment module: used to compare the scanned document with the probe document, and judge the scanning yield rate of the LED wafer through the sorter;

[0047] Combined Map Module: Used to set the critical value of the scanning yield. When the scanning yield of the LED wafer is less than the critical value of the scanning yield, the second combined map method is used to perform a second combination of the scanning document and the point measurement document;

[0048] The combined map module includes:

[0049] Selection Unit: Used to randomly select the reference point die coordinates in the LED wafer reflected by the point measurement document;

[0050] Calculation Unit: Used to calculate the distance from the reference point die coordinates to each blank terrain with the reference point die coordinates as the center point, and then generate an updated point measurement document;

[0051] Inference Unit: Used to scan the blank terrain in the LED wafer reflected by the scanning document, and based on the distance from the reference point die coordinates in the point measurement document to each blank terrain, inversely deduce the reference point die coordinates in the scanning document, and then generate an updated scanning document;

[0052] Merge Unit: Used to merge the updated point measurement document and the updated scanning document to obtain a combined document;

[0053] Judgment Unit: Used to judge whether the combination of maps is successful based on the combined document.

[0054] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0055] By obtaining the scanning document and the point measurement document, the scanning yield of the LED wafer can be obtained through comparison. If the scanning yield is greater than a preset critical value of the scanning yield, the combination of maps can be carried out according to the normal process. If the scanning yield is less than the critical value of the scanning yield, it is impossible to combine the maps according to the normal process. It is necessary to use a random die in the point measurement document as the reference point die and calculate the distance from the reference point die to the die that has been picked or the blank terrain generated by the marked point pattern, and then generate an updated point measurement document; then scan the blank terrain in the scanning document, and inversely deduce the reference point die coordinates in the scanning document to obtain an updated scanning document, and merge the two to obtain a combined document. The combined document reflects the difference between the scanning document and the point measurement document, and a difference threshold can be set to determine whether the combination of maps is successful. In this way, the second automatic combination of the point measurement document and the scanning document is realized. This solution has a high degree of automation, does not require multiple manual combinations by personnel, and avoids the risk of errors caused by manual combination of maps. Description of the Drawings

[0056] Figure 1 It is a flowchart of the method for combining and selecting LEDs in the first embodiment of the present invention;

[0057] Figure 2For Figure 1 The specific flowchart of step S30 in

[0058] Figure 3 For Figure 1 The structural block diagram of step S30 in

[0059] Figure 4 The structural block diagram of the LED sorting and combining system in the second embodiment of the present invention;

[0060] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific Embodiments

[0061] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0062] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0064] Please refer to Figures 1 to 3 , which shows a method for sorting and combining LEDs in the first embodiment of the present invention, characterized by including the following steps:

[0065] S10. Scan the LED wafer by a sorting machine to obtain a scanned document of the LED wafer, and test the LED wafer by a probe machine to obtain a probe test document of the LED wafer;

[0066] S20. Compare the scanned document with the probe test document, and judge the scanning yield rate of the LED wafer by the sorting machine;

[0067] S30. Set the critical value of the scanning yield. When the scanning yield of the LED wafer is less than the critical value of the scanning yield, the scanning document and the point measurement document are secondarily combined using the secondary combination method;

[0068] The step of secondarily combining the scanning document and the point measurement document using the secondary combination method specifically includes:

[0069] S31. Randomly select the reference point die coordinates in the LED wafer reflected by the point measurement document;

[0070] S32. Taking the reference point die coordinates as the center point, calculate the distances from the reference point die coordinates to each blank terrain, and then generate an updated point measurement document;

[0071] S33. Scan the blank terrain in the LED wafer reflected by the scanning document, and based on the distances from the reference point die coordinates in the point measurement document to each blank terrain, inversely deduce the reference point die coordinates in the scanning document, and then generate an updated scanning document;

[0072] S34. Combine the updated point measurement document and the updated scanning document to obtain a combined document;

[0073] S35. Based on the combined document, determine whether the combination is successful.

[0074] It can be understood that in the present invention, by obtaining the scanning document and the point measurement document, the scanning yield of the LED wafer can be obtained through comparison. If the scanning yield is greater than a preset critical value of the scanning yield, the combination can be carried out according to the normal process. If the scanning yield is less than the critical value of the scanning yield, the combination cannot be carried out according to the normal process. It is necessary to take a random die in the point measurement document as the reference point die, and calculate the distances from the reference point die to the die that has been picked out or the blank terrain generated by the marked point pattern, and then generate an updated point measurement document; then scan the blank terrain in the scanning document, and inversely deduce the reference point die coordinates in the scanning document to obtain an updated scanning document, and combine the two to obtain a combined document. The combined document reflects the differences between the scanning document and the point measurement document. A difference threshold can be set to determine whether the combination is successful. In this way, the secondary automatic combination of the point measurement document and the scanning document is realized. This solution has a high degree of automation, does not require multiple manual combinations by personnel, and avoids the risk of errors caused by manual combination.

[0075] Specifically, in this embodiment, the steps of scanning the LED wafer by a sorter to obtain the scanning document of the LED wafer and testing the LED wafer by a prober to obtain the point measurement document of the LED wafer specifically include:

[0076] Scan the LED wafer using a sorter to obtain the coordinate-grade data text of the die to be picked on the LED wafer;

[0077] Reflect the die state on the LED wafer in real time through the coordinate-grade data text of the die to be picked. Based on the die state on the LED wafer, generate a scanned document;

[0078] Test the electrical parameters and coordinate positions of each die on the LED wafer using a probe station;

[0079] Output the electrical parameters and coordinate positions of each die on the LED wafer to the sorter for reading to generate a probe document.

[0080] It can be understood that the coordinate-grade data text of the die to be picked records the die condition (not picked or picked). During the picking process, this data is updated in real time. One die changes at a time (from not picked to picked). The scanned document determines the position of the die by scanning the die, and the probe document determines the position of the die by where the electrical parameters are located because the die itself has electrical parameters.

[0081] Further, compare the scanned document with the probe document, and judge the scan yield of the LED wafer through the sorter. The specific steps include:

[0082] In the scanned document, count the number of dies with the die state of not picked to obtain scan data;

[0083] In the probe document, count the number of dies with electrical parameters to obtain probe data;

[0084] Compare the scan data with the probe data to obtain the scan yield.

[0085] When the scan yield of the LED wafer is greater than the scan yield critical value, perform a single map synthesis on the scanned document and the probe document using the general map synthesis method. The specific steps include:

[0086] In the probe document, select mark points, where the mark points are composed of multiple dies with special appearances;

[0087] Take a randomly selected die with a special appearance in the mark point as the reference point, and take the remaining dies with special appearances in the mark point as verification points;

[0088] Scan the LED wafer using a sorter. When the scanning yield is greater than 95%, synchronize the coordinates of the reference points in the point measurement map file to the scanning map file, and combine the scanning map file with the point measurement map file to synchronize the verification points in the point measurement map file to the scanning map file;

[0089] After the map combination is completed, verify the positions of the reference points and their adjacent verification points in the scanning map file.

[0090] It can be understood that the critical value of the scanning yield can be determined as 95% here. The mark points are composed of some special grains, which look different from the normal grains. Find a unique grain within the mark points, and there is only one such grain on the entire wafer. Teach the characteristic grain (so that the machine can automatically find and identify this characteristic grain later). Since the position of the origin (0, 0 point) is fixed during the point measurement test, the coordinates of the characteristic grain within the mark points are fixed coordinates and do not change. Set the coordinates of this characteristic grain as the reference point; set the verification coordinates. Select the coordinates of the grains around the mark points as the verification coordinates. Since the coordinates of the mark points are fixed, the coordinates of the normal grains around them are also fixed. Set the coordinates of the normal grains at fixed positions around the mark points as the verification coordinates (such as the upper left corner, lower right corner, etc.). After the sorting and scanning of the wafer are completed and the scanning yield is calculated to be greater than 95%, the machine will automatically find the characteristic point grains. After finding them, assign the reference point coordinates to this grain, and the machine will start automatic map combination. After the map combination is completed, it will verify the coordinates. If the verification is successful, the machine will automatically start the operation. If it is not successful, the machine will report an error and the operator needs to confirm.

[0091] Specifically, in the point measurement map file, the blank terrain is a pattern generated at the adjacent positions of the coordinates of the picked and unpicked grains, as well as the mark point pattern.

[0092] Furthermore, in the LED wafer reflected in the scanning map file, scan the blank terrain, and based on the distances from the reference point grain coordinates in the point measurement map file to each blank terrain, reverse-calculate the reference point grain coordinates in the scanning map file, and then generate an updated scanning map file. The specific steps include:

[0093] In the LED wafer reflected in the scanning map file, scan any blank terrain and correspond this blank terrain to the corresponding blank terrain in the point measurement map file;

[0094] Obtain the distance from the corresponding blank terrain in the point measurement map file to the reference point grain coordinates in the point measurement map file, and based on this distance in the scanning map file, calculate the reference point grain coordinates in the scanning map file from the blank terrain;

[0095] According to the point measurement map file, based on the distances from the reference point die coordinates to the remaining blank terrains, in the scan map file, using the reference point die coordinates as the base point, synchronously find the remaining blank terrains, and then construct the updated scan map file.

[0096] It can be understood that in the point measurement map file, the distances from the reference point die coordinates to each blank terrain are calculated; therefore, in the scan map file, if a blank terrain is scanned, the reference point die coordinates in the scan map file can be deduced from one of the blank terrains, and then the distances to other blank terrains are verified through the reference point die coordinates to check if they are consistent with those in the point measurement map file, so as to construct the updated scan map file.

[0097] Furthermore, the specific steps for determining whether the map combination is successful based on the combined map file include:

[0098] Check whether there are duplicate coordinates in the combined map file;

[0099] If the number of the duplicate coordinates is greater than or equal to 10, start the alarm module;

[0100] If the number of the duplicate coordinates is less than 10, determine that the map combination is successful and continue the operation.

[0101] The duplicate coordinates are the coordinates of the die that has been picked in the point measurement map file but not picked in the combined map file, and the coordinates of the die that has not been picked in the point measurement map file but there is no die at this position in the combined map file.

[0102] It can be understood that if the number of the duplicate coordinates is greater than or equal to 10, alarm and stop the machine, waiting for personnel to confirm; if the number of the duplicate coordinates is less than 10, determine that the map combination is successful and continue the operation.

[0103] In summary, the LED sorting and map combination method in the above embodiments of the present invention can realize the secondary automatic map combination of the point measurement map file and the scan map file. This solution has a high degree of automation, does not require multiple manual map combinations by personnel, and avoids the risk of errors caused by manual map combination.

[0104] Please refer to Figure 4 , which shows the LED sorting and map combination system in the second embodiment of the present invention, including:

[0105] Acquisition module 11: used to scan the LED wafer through a sorter to obtain the scan map file of the LED wafer, and test the LED wafer through a probe station to obtain the point measurement map file of the LED wafer;

[0106] Judgment module 12: used to compare the scan map file with the point measurement map file, and judge the scan yield of the LED wafer through the sorter;

[0107] Composite Map Module 13: It is used to set the critical value of the scanning yield. When the scanning yield of the LED wafer is less than the critical value of the scanning yield, the secondary composite map method is used to perform a secondary composite map on the scanning document and the point measurement document;

[0108] The composite map module includes:

[0109] Selection Unit 131: It is used to randomly select the reference point die coordinates in the LED wafer reflected by the point measurement document;

[0110] Calculation Unit 132: It is used to take the reference point die coordinates as the center point, calculate the distances from the reference point die coordinates to each blank terrain, and then generate an updated point measurement document;

[0111] Inference Unit 133: It is used to scan the blank terrain in the LED wafer reflected by the scanning document, and based on the distances from the reference point die coordinates in the point measurement document to each blank terrain, inversely deduce the reference point die coordinates in the scanning document, and then generate an updated scanning document;

[0112] Merging Unit 134: It is used to merge the updated point measurement document and the updated scanning document to obtain a combined document;

[0113] Judgment Unit 135: It is used to judge whether the composite map is successful based on the combined document.

[0114] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0115] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A method for selecting and combining LEDs, characterized in that: The steps include: Scanning the LED wafer by a sorting machine to obtain a scanned image file of the LED wafer, and testing the LED wafer by a spot measuring machine to obtain a spot measuring image file of the LED wafer; Comparing the scanned image file with the point measurement image file, and determining the scanning yield of the LED wafer by the sorting machine; A scanning yield critical value is set, and when the scanning yield of the LED wafer is less than the scanning yield critical value, a secondary combination method is used to perform a secondary combination of the scanning image file and the point measurement image file; The second combination method is used to combine the scanned image file and the point measurement image file for the second time, and the specific steps include: Randomly select the reference point grain coordinates in the LED wafer reflected by the point measurement image file; Taking the reference point grain coordinate as the center point, calculating the distance from the reference point grain coordinate to each blank terrain, and then generating an updated point measurement map file; Scanning blank terrain in the LED wafer reflected by the scanning image, and inferring the reference point grain coordinates in the scanning image according to the distance from the reference point grain coordinates in the point measurement image to each blank terrain, thereby generating an updated scanning image; Merging the updated point measurement image file and the updated scan image file to obtain a combined image file; Based on the combined image files, it is determined whether the image merging is successful.

2. The LED selection and combination method according to claim 1, characterized in that: The steps of scanning the LED wafer by a sorting machine to obtain a scanned image file of the LED wafer, and testing the LED wafer by a spot measuring machine to obtain a spot measuring image file of the LED wafer include: Scanning the LED wafer by a sorting machine to obtain the coordinate-grade data text of the grains to be picked on the LED wafer; The grain coordinate-grade data text to be picked reflects the grain status on the LED wafer in real time, and generates a scanned image file based on the grain status on the LED wafer; Testing the electrical parameters and coordinate positions of each grain of the LED wafer by a spot measuring machine; The electrical parameters and coordinate positions of each crystal grain of the LED wafer are output to the sorting machine for reading to generate a point measurement document.

3. The LED selection and combination method according to claim 2, characterized in that: The scanning image file is compared with the point measurement image file, and the scanning yield rate of the LED wafer is determined by the sorting machine, and the specific steps include: In the scanned image, the number of the grains in the grain state of not being picked is counted to obtain scanned data; In the spot measurement image file, the number of grains with electrical parameters is counted to obtain spot measurement data; The scanning data is compared with the point measurement data to obtain the scanning yield.

4. The LED selection and combination method according to claim 1, characterized in that: When the scanning yield of the LED wafer is greater than the scanning yield critical value, the scanning image file and the point measurement image file are combined once using a general combination method, and the specific steps include: In the point measurement image file, a mark point is selected, wherein the mark point is composed of a plurality of grains with special appearance; A random grain with special appearance in the mark point is used as the reference point, and the other grains with special appearance in the mark point are used as verification points; Scanning the LED wafer by a sorting machine, when the scanning yield is greater than 95%, synchronizing the coordinates of the reference points in the point measurement image file to the scanning image file, and combining the scanning image file with the point measurement image file to synchronize the verification points in the point measurement image file to the scanning image file; After the merging is completed, the positions of the reference points and their adjacent verification points are verified in the scanned image.

5. The LED selection and combination method according to claim 1, characterized in that: In the point measurement map file, the blank terrain is a graph generated by the coordinates of the picked-up grains and the unpicked-up grains at adjacent positions, as well as a marking point graph.

6. The LED selection and combination method according to claim 1, characterized in that: In the LED wafer reflected in the scanning image, a blank terrain is scanned, and according to the distance from the reference point grain coordinates in the point measurement image to each blank terrain, the reference point grain coordinates in the scanning image are inferred, and then an updated scanning image is generated. The specific steps include: Scan any blank terrain in the LED wafer reflected in the scanning image file, and make the blank terrain correspond to the corresponding blank terrain in the point measurement image file; Obtaining the distance from the corresponding blank terrain in the point measurement map file to the reference point grain coordinates in the point measurement map file, and calculating the reference point grain coordinates in the scanned map file from the blank terrain based on the distance in the scanned map file; According to the distance from the reference point grain coordinates to the remaining blank terrain in the point measurement drawing, the reference point grain coordinates are used as the base point in the scanned drawing to synchronously find the remaining blank terrain, thereby constructing an updated scanned drawing.

7. The LED selection and combination method according to claim 1, characterized in that: The specific steps of judging whether the combined image is successful based on the combined image files include: Checking whether there are duplicate coordinates in the combined image file; If the number of repeated coordinates is greater than or equal to 10, the alarm module is activated; If the number of repeated coordinates is less than 10, it is determined that the merge is successful and the operation continues.

8. The LED selection and combination method according to claim 7, characterized in that: The repeated coordinates are the coordinates of the picked grains shown in the spot measurement drawing but the unpicked grains shown in the combined drawing, and the coordinates of the unpicked grains shown in the spot measurement drawing but the grains do not exist at that position in the combined drawing.

9. A LED selection and combination system, characterized in that: include: Acquisition module: used for scanning the LED wafer through the sorting machine to obtain the scanned image file of the LED wafer, and testing the LED wafer through the spot measuring machine to obtain the spot measuring image file of the LED wafer; A judgment module: used for comparing the scanning image file with the point measurement image file, and judging the scanning yield rate of the LED wafer through the sorting machine; A combination module is used to set a scan yield critical value. When the scan yield of the LED wafer is less than the scan yield critical value, a secondary combination method is used to combine the scanned image file with the point measurement image file; The image merging module comprises: A selection unit: used for randomly selecting the reference point grain coordinates in the LED wafer reflected in the point measurement image file; A calculation unit: used to calculate the distance from the reference point grain coordinates to each blank terrain with the reference point grain coordinates as the center point, and then generate an updated point measurement map file; An inference unit is used to scan blank terrain in the LED wafer reflected in the scanned image file, and infer the reference point grain coordinates in the scanned image file according to the distance from the reference point grain coordinates in the point measurement image file to each blank terrain, thereby generating an updated scanned image file; A merging unit: used for merging the updated point measurement image file and the updated scanned image file to obtain a combined image file; A judging unit is used to judge whether the combined image is successful based on the combined image files.

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