Microstrip antenna device, navigation device and manufacturing method

Abstract

The application belongs to the field of navigation positioning, and aims to solve the problems that the current method based on stacking increases the bandwidth, which leads to the increase of the height of the antenna, and in the case of sharp change of high and low temperature, the gap between the antenna stacks changes, which produces frequency offset, and causes the rapid reduction of the antenna gain. A microstrip antenna device, a navigation device and a manufacturing method are provided. The microstrip antenna device comprises a base, a feed network and a radiation sheet. The feed network and the radiation sheet are stacked, and the feed network is connected with the radiation sheet. The radiation sheet is fixed to the base. The radiation sheet has a first surface away from the feed network. The first surface is provided with a radiation layer. The radiation layer comprises a plurality of radiation sub-layers. At least part of the radiation sub-layers are distributed around the center of the first surface. At least one radiation sub-layer is electrically connected with the feed network. The application can ensure the bandwidth of the antenna, reduce the height of the antenna, and improve the performance of the antenna.

Description

Microstrip antenna device, navigation equipment and manufacturing method Technical Field

[0001] This application belongs to the field of navigation and positioning, specifically relating to a microstrip antenna device, navigation equipment, and manufacturing method. Background Technology

[0002] Satellite navigation and positioning equipment is increasingly widely used in fields such as positioning, measurement, timing, high-precision agriculture, and intelligent transportation. Conventional microstrip antennas have relatively narrow bandwidths. To increase bandwidth, stacking is typically used. However, stacking increases antenna height, hindering its compactness. Furthermore, under drastic temperature changes, the gaps between the stacked layers can shift, causing frequency shifts and a rapid decrease in antenna gain. Summary of the Invention

[0003] The purpose of this application is to provide a microstrip antenna device, navigation equipment, and manufacturing method, which at least solves the problems that stacking increases the height of the antenna, resulting in a large antenna height, which is not conducive to the antenna's lightweight design, and that using a stacking method, under conditions of drastic high and low temperature changes, changes in the gaps between the antenna stacks cause frequency shifts, resulting in a rapid decrease in antenna gain.

[0004] In a first aspect, embodiments of this application provide a microstrip antenna device, which includes: a base, a feed network, and a radiating plate;

[0005] The power supply network is stacked on top of the radiating plate, and the power supply network is connected to the radiating plate, which is fixed to the base.

[0006] The radiating sheet has a first surface facing away from the power supply network. A radiating layer is disposed on the first surface. The radiating layer includes a plurality of radiating sub-layers. At least a portion of the plurality of radiating sub-layers are distributed at intervals around the center of the first surface.

[0007] At least one of the radiating sublayers is electrically connected to the feed network.

[0008] Optionally, the first radiating sublayer is located in the middle of the first surface, and the center of the first radiating sublayer is on the same straight line as the center of the first surface, while the remaining radiating sublayers are distributed around the first radiating sublayer at intervals.

[0009] Optionally, the shape of the projection of the first radiating sublayer onto the first surface is different from the shape of the projection of the remaining radiating sublayers onto the first surface.

[0010] Optionally, in the remaining radiative sublayers, the area of ​​the projection of each radiative sublayer onto the first surface is smaller than the area of ​​the projection of the first radiative sublayer onto the first surface.

[0011] Optionally, the first radiating sublayer is electrically connected to the feed network.

[0012] Optionally, the microstrip antenna device further includes a feed probe, and the feed network includes a circuit board and a feed line layer disposed on the circuit board;

[0013] The circuit board and the radiating sheet are stacked together. The feed line layer is located on the surface of the circuit board opposite to the radiating sheet. The first end of the feed probe is connected to the first radiating sublayer, and the second end of the feed probe is connected to the feed line layer, so that the first radiating sublayer is electrically connected to the feed network.

[0014] Optionally, the remaining radiative sublayers are centrosymmetric about the first radiative sublayer.

[0015] Optionally, the plurality of radiation layers include a first radiation sublayer, a second radiation sublayer, a third radiation sublayer, a fourth radiation sublayer, and a fifth radiation sublayer;

[0016] The first radiating sublayer is square in shape, and each corner of the first radiating sublayer is provided with a notch. At least a portion of the second radiating sublayer, at least a portion of the third radiating sublayer, at least a portion of the fourth radiating sublayer, and at least a portion of the fifth radiating sublayer are located in the four notches in sequence. An opening is provided in the middle of the first radiating sublayer, and the center of the opening is on the same straight line as the center of the first surface.

[0017] Optionally, the shapes of the second radiating sublayer, the third radiating sublayer, the fourth radiating sublayer, and the fifth radiating sublayer are all the same.

[0018] Optionally, the notch is square in shape, and the second, third, fourth and fifth radiating sublayers each include a first square frame layer, a second square frame layer, a first connecting arm layer and a second connecting arm layer.

[0019] The first square frame layer is located inside the second square frame layer, and the diagonal of the first square frame layer intersects the diagonal of the second square frame layer;

[0020] A portion of the second square frame layer is located within the notch. The second square frame layer includes a first side, a second side, a third side, and a fourth side. The first side, the second side, the third side, and the fourth side are sequentially connected and enclose a square frame structure. A portion of the first side and a portion of the second side are located within the notch, while the third side and the fourth side are located outside the notch. The first side is connected to a first extension, and the second side is connected to a second extension. Both the first extension and the second extension are located outside the notch. The first end of the first connecting arm layer is connected to the first extension, the first end of the second connecting arm layer is connected to the second extension, and the second end of the first connecting arm layer is connected to the second end of the second connecting arm layer. There is a first gap between the first connecting arm layer and the third side, and a second gap between the second connecting arm layer and the fourth side.

[0021] Optionally, the notch is square in shape, and the second, third, fourth and fifth radiating sublayers each include a first sector frame layer, a second sector frame layer and an arc-shaped connecting arm layer.

[0022] The first sector-shaped frame layer is located inside the second sector-shaped frame layer;

[0023] A portion of the second sector-shaped frame layer is located within the notch. The second sector-shaped frame layer includes a fifth side, a sixth side, and an arc-shaped side. The fifth side, the sixth side, and the arc-shaped side are sequentially connected and enclose to form a sector-shaped frame structure. A portion of the fifth side and a portion of the sixth side are located within the notch, while the arc-shaped side is located outside the notch. The fifth side is connected to a third extension, and the sixth side is connected to a fourth extension. Both the third and fourth extensions are located outside the notch. The first end of the arc-shaped connecting arm layer is connected to the third extension, and the second end of the arc-shaped connecting arm layer is connected to the fourth extension. A third gap exists between the arc-shaped connecting arm layer and the arc-shaped side.

[0024] Optionally, the first radiative sublayer is provided with a plurality of strip holes, and the plurality of strip holes are distributed at intervals around the center of the first radiative sublayer.

[0025] Optionally, a plurality of first metallized vias are provided on the first radiating sublayer, and the plurality of first metallized vias are spaced apart along the circumferential direction of the first radiating sublayer. The first metallized vias are connected to the surface of the feed network facing the radiating sheet.

[0026] Optionally, a second metallized via is provided on the radiating sheet;

[0027] In the remaining radiating sublayers, the projection of each radiating sublayer onto the first surface surrounds at least one of the second metallized vias.

[0028] Optionally, the microstrip antenna device further includes a metal connector;

[0029] The edge of the radiating sheet is connected to the base via the metal connector.

[0030] Optionally, the microstrip antenna device further includes a non-metallic connector;

[0031] The power supply network is connected to the radiating plate via the non-metallic connector.

[0032] Optionally, the base is a frame structure, the power supply network is embedded inside the base, and the radiating plate is detachably connected to the base.

[0033] Optionally, the microstrip antenna device further includes a connector;

[0034] The connector is connected to the base and is electrically connected to the power supply network.

[0035] Optionally, the microstrip antenna device operates in a frequency band covering 1.1 GHz to 1.7 GHz.

[0036] In a second aspect, embodiments of this application provide a navigation device, which includes a navigation body and a microstrip antenna device as described in any one of the first aspects above;

[0037] The microstrip antenna device is mounted on the navigation body.

[0038] Thirdly, embodiments of this application provide a manufacturing method for manufacturing a microstrip antenna device as described in any of the first aspects above, wherein the plurality of radiating sublayers include a first radiating sublayer, a first metallized via is provided on the first radiating sublayer, a second metallized via is provided on the radiating sheet, and the feed network includes a circuit board and a feed line layer disposed on the circuit board.

[0039] The manufacturing method includes:

[0040] Based on the target resonant frequency band, the parameters of the radiating sheet and the parameters of the radiating sublayer are determined;

[0041] Determine the location of the first metallized via on the first radiating sublayer and the location of the second metallized via on the radiating sheet;

[0042] Determine the linewidth and linelength of each section of microstrip line in the feed line layer on the circuit board to determine the size of the feed network;

[0043] The radiating plate, the feed network, and the base are assembled to form the microstrip antenna device.

[0044] In this embodiment, since the feed network and the radiating plate are stacked and connected, and the radiating plate is fixed to the base, it is equivalent to only stacking the feed network and the radiating plate. This results in fewer stacked components in the antenna device, leading to a smaller antenna height and promoting a lighter antenna. Furthermore, a radiating layer is provided on the first surface of the radiating plate. This radiating layer includes multiple radiating sub-layers, at least some of which are spaced apart around the center of the first surface. Therefore, it is equivalent to setting the radiating layer on the surface of the radiating plate away from the feed network. This allows the antenna to radiate signals through the radiating layer, avoiding the problem of a large antenna height caused by multiple stacked layers. It also avoids the problem of frequency shift and rapid gain reduction caused by changes in the gaps between the antenna layers under drastic temperature changes. Additionally, at least one radiating sub-layer is electrically connected to the feed network, allowing the feed network to transmit signals to the radiating sub-layer, enabling the radiating sub-layer to radiate signals. In other words, in this embodiment, by setting a radiating layer on the first surface of the radiating sheet, and having at least some of the radiating sublayers distributed at intervals around the center of the first surface, the surface of the radiating sheet can be fully utilized. This allows the radiating surface to be covered with the radiating layer as flat as possible, ensuring that the antenna bandwidth meets the requirements. Furthermore, it avoids the problem of excessive antenna height caused by using a stacked method for the antenna, and also avoids the problem of rapid antenna gain reduction caused by gap variations between multiple stacked layers. Therefore, in this embodiment, the antenna bandwidth can be ensured, the antenna height can be reduced, and the antenna performance can be improved. Attached Figure Description

[0045] Figure 1 shows an exploded view of a microstrip antenna device provided in an embodiment of this application;

[0046] Figure 2 is a schematic diagram of a microstrip antenna device provided in an embodiment of this application;

[0047] Figure 3 shows one of the schematic diagrams of a radiation sublayer on a radiation sheet provided in an embodiment of this application;

[0048] Figure 4 shows a schematic diagram of a power supply network circuit board and power supply line layer provided in an embodiment of this application;

[0049] Figure 5 shows a second schematic diagram of a radiation sublayer on a radiation sheet provided in an embodiment of this application;

[0050] Figure 6 shows a schematic diagram of a feeder line layer provided in an embodiment of this application;

[0051] Figure 7 shows a schematic diagram of a power supply probe provided in an embodiment of this application;

[0052] Figure 8 is a flowchart of a manufacturing method provided in an embodiment of this application.

[0053] Figure label:

[0054] 001: Metal connector; 002: Non-metallic connector; 003: Connector; 10: Base; 20: Power supply network; 21: Circuit board; 22: Power supply line layer; 30: Radiation sheet; 301: First surface; 302: Second metallized via; 40: Radiation layer; 411: First radiation sublayer; 412: Second radiation sublayer; 413: Third radiation sublayer; 414: Fourth radiation sublayer; 415: Fifth radiation sublayer; 4111: Notch; 4112: Opening; 4113: Strip hole; 4114: First metallized via; 4121: First directional frame layer; 4122: Second square frame layer ; 4123: First connecting arm layer; 4124: Second connecting arm layer; 4131: First sector frame layer; 4132: Second sector frame layer; 4133: Arc-shaped connecting arm layer; 41221: First side; 41222: Second side; 41223: Third side; 41224: Fourth side; 41225: First extension; 41226: Second extension; 41321: Fifth side; 41322: Sixth side; 41323: Arc-shaped side; 41324: Third extension; 41325: Fourth extension; 50: Feed probe; 51: First column; 52: Second column. Detailed Implementation

[0055] The terms "first," "second," and "pronounced" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0056] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0057] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] As shown in Figures 1 to 7, the microstrip antenna device includes: a base 10, a feed network 20, and a radiating plate 30.

[0059] The power supply network 20 and the radiating sheet 30 are stacked and connected, and the radiating sheet 30 is fixed to the base 10. The radiating sheet 30 has a first surface 301 facing away from the power supply network 20. A radiating layer 40 is disposed on the first surface 301. The radiating layer 40 includes a plurality of radiating sub-layers. At least some of the radiating sub-layers are distributed at intervals around the center of the first surface 301. At least one radiating sub-layer is electrically connected to the power supply network 20.

[0060] In this embodiment, since the feed network 20 and the radiating plate 30 are stacked and connected, and the radiating plate 30 is fixed to the base 10, it is equivalent to only stacking the feed network 20 and the radiating plate 30. This results in fewer stacked components in the antenna device, leading to a smaller antenna height and promoting antenna compactness. Furthermore, a radiating layer 40 is provided on the first surface 301 of the radiating plate 30. The radiating layer 40 includes multiple radiating sub-layers, at least some of which are spaced around the center of the first surface 301. Therefore, it is equivalent to setting the radiating layer 40 on the surface of the radiating plate 30 away from the feed network 20. This allows the antenna to radiate signals through the radiating layer 40, avoiding the problem of a large antenna height caused by multiple stacked layers. It also avoids the problem of rapid antenna gain reduction due to frequency shift caused by changes in the gaps between the antenna layers under drastic temperature changes. Furthermore, at least one radiating sublayer is electrically connected to the feed network 20, allowing the feed network 20 to transmit signals to the radiating sublayer, enabling it to radiate signals. That is, in this embodiment, by providing a radiating layer 40 on the first surface 301 of the radiating sheet 30, and by distributing at least a portion of the multiple radiating sublayers around the center of the first surface 301 at intervals, the surface of the radiating sheet 30 can be fully utilized. This allows the radiating layer 40 to be laid as flat as possible on the radiating surface, ensuring that the antenna bandwidth meets requirements. It also avoids the problem of excessive antenna height caused by using a stacked method for the antenna, and further avoids the problem of rapid antenna gain reduction due to gap variations between multiple stacked layers. In other words, this embodiment ensures antenna bandwidth while reducing antenna height and improving antenna performance.

[0061] It should be noted that, in the embodiments of this application, the radiating sheet 30 can be a printed circuit board (PCB), and a copper layer is provided on the first surface 301 of the radiating sheet 30, the copper layer forming the radiating layer 40, and the surface opposite to the first surface 301 is not provided with a copper layer covering the surface.

[0062] In addition, in this embodiment, the radiating layer 40 can be formed of copper. Of course, the radiating layer 40 can also be formed of other metals, such as silver. This embodiment does not limit the specific metals used in this application.

[0063] Furthermore, in this embodiment, the microstrip antenna device operates in a frequency band covering 1.1 GHz to 1.7 GHz. That is, the microstrip antenna device provided in this embodiment has a relatively large operating frequency range, thus meeting more requirements and facilitating the expansion of its application scope.

[0064] In some embodiments, the first radiating sublayer 411 is located in the center of the first surface 301, and the center of the first radiating sublayer 411 is collinear with the center of the first surface 301. The remaining radiating sublayers are distributed around the first radiating sublayer 411 at intervals. This arrangement allows for gaps between adjacent radiating sublayers and between the remaining radiating sublayers and the first radiating sublayer 411, enabling the remaining radiating sublayers to couple with the first radiating sublayer 411. This allows multiple radiating sublayers and the first radiating sublayer 411 to jointly radiate signals, improving radiation efficiency. Furthermore, by aligning the center of the first radiating sublayer 411 with the center of the first surface 301 and distributing the remaining radiating sublayers around it at intervals, the utilization rate of the first surface 301 can be increased, allowing for the arrangement of more radiating sublayers on the first surface 301, which also helps improve the radiation efficiency of the microstrip antenna device.

[0065] Furthermore, in some embodiments, the shape of the projection of the first radiating sublayer 411 onto the first surface 301 is different from the shape of the projections of the other radiating sublayers onto the first surface 301. This arrangement allows for different shapes of the radiating sublayers on the first surface 301, which helps improve the radiation efficiency of the microstrip antenna device.

[0066] It should be noted that the shapes of the radiating sublayers other than the first radiating sublayer 411 can be the same or different. This application does not limit the shape of the radiating sublayers.

[0067] In some embodiments, the projected area of ​​each of the remaining radiating sublayers on the first surface 301 is smaller than the projected area of ​​the first radiating sublayer 411 on the first surface 301. This arrangement effectively places a larger radiating sublayer in the center of the first surface 301, with smaller radiating sublayers surrounding the larger one, thereby improving the radiation efficiency of the multiple radiating sublayers.

[0068] In some embodiments, the first radiating sublayer 411 is electrically connected to the feed network 20. With this configuration, once the feed network 20 transmits a signal to the first radiating sublayer 411, the first radiating sublayer 411 can couple with the other radiating sublayers, allowing the other radiating sublayers to also radiate signals, thereby improving the radiation efficiency of the microstrip antenna device.

[0069] In some embodiments, as shown in FIG1, the microstrip antenna device may further include a feed probe 50, and the feed network 20 includes a circuit board 21 and a feed line layer 22 disposed on the circuit board 21; the circuit board 21 and the radiating sheet 30 are stacked, and the feed line layer 22 is located on the surface of the circuit board 21 away from the radiating sheet 30. The first end of the feed probe 50 is connected to the first radiating sub-layer 411, and the second end of the feed probe 50 is connected to the feed line layer 22, so that the first radiating sub-layer 411 is electrically connected to the feed network 20.

[0070] Because the circuit board 21 and the radiating sheet 30 are stacked, the feed line layer 22 can be disposed on the surface of the circuit board 21 facing away from the radiating sheet 30, and the first radiating sublayer 411 can be disposed on the surface of the radiating sheet 30 facing away from the circuit board 21. This allows for through-holes to be provided on both the circuit board 21 and the feed sheet, enabling the feed probe 50 to pass through both the through-holes on the circuit board 21 and the radiating sheet 30. The first end of the feed probe 50 is electrically connected to the first radiating sublayer 411, and the second end is electrically connected to the feed line layer 22, thus achieving an electrical connection between the first radiating sublayer 411 and the feed network 20. In other words, by providing the feed probe 50, the electrical connection between the first radiating sublayer 411 and the feed network 20 can be easily achieved, thereby enabling the microstrip antenna device to radiate signals with circular polarization.

[0071] It should be noted that, in this embodiment of the application, as shown in FIG7, the power supply probe 50 may include a first column 51 and a second column 52. One end of the first column 51 is connected to one end of the second column 52, and the diameter of the first column 51 is larger than the diameter of the second column 52. A first through hole is provided on the radiating sheet 30, the first through hole penetrates the radiating sheet 30, the first column 51 passes through the first through hole and is electrically connected to the first radiating sublayer 411, and a second through hole is provided on the circuit board 21 of the power supply network 20. The second column 52 passes through the second through hole and is electrically connected to the power supply line layer 22, so that the first radiating sublayer 411 is electrically connected to the power supply network 20. The first column 51 and the first radiating sublayer 411 can be soldered together, and the second column 52 and the power supply line layer 22 can be soldered together.

[0072] Of course, in this embodiment, the feed probe 50 can also have other structures. For example, the feed probe 50 can also include only one pillar. In this case, the pillar passes through the first through-hole on the radiating sheet 30 and is electrically connected to the first radiating sub-layer 411, and the main body passes through the second through-hole on the circuit board 21 and is electrically connected to the feed line layer 22. As another example, the feed probe 50 can also include a first pillar 51, a second pillar 52, and a third pillar, connected sequentially. The first pillar 51 is electrically connected to the first radiating sub-layer 411, and the third pillar is electrically connected to the feed line layer 22. The diameters of the first pillar 51, the second pillar 52, and the third pillar are different from each other. The specific structure of the feed probe 50 is not limited in this embodiment.

[0073] Furthermore, in this embodiment, the number of feed probes 50 can be set according to actual needs. For example, the number of feed probes 50 may be 2, or even 4. This embodiment does not limit the number of feed probes 50. The number of feed probes 50 can be determined based on the number of output terminals of the feed line layer 22, i.e., the number of feed probes 50 is the same as the number of output terminals of the feed line layer 22. For example, when the number of output terminals of the feed line layer 22 is 4, the number of feed probes 50 is 4, and one end of each feed probe 50 is electrically connected to one output terminal of the feed line layer 22.

[0074] In addition, in this embodiment, the feed line layer 22 can be formed of copper. Of course, the feed line layer 22 can also be formed of other metals, such as silver. This embodiment does not limit the specific metals used in this application.

[0075] Furthermore, in this embodiment, the specific form of the feed line layer 22 can be set according to actual needs, and the traces in the feed line layer 22 can be configured with four output terminals and one input terminal. One output terminal is electrically connected to the first radiating sublayer 411 through a feed probe 50, so that the feed line layer 22 is electrically connected to the first radiating sublayer 411. For example, as shown in Figure 4, the form of the feed line layer 22 can be as shown in Figure 4, and the circuit corresponding to the feed line layer 22 can be as shown in Figure 6.

[0076] In addition, when the feed line layer 22 has 4 output terminals, the phase difference between the 4 output terminals can be 0°, 90°, 180° and 270° respectively.

[0077] In addition, in some embodiments, the remaining radiating sublayers are centrally symmetric about the first radiating sublayer 411. This arrangement ensures that the remaining radiating sublayers are coupled to the first radiating sublayer 411, and that the remaining radiating sublayers are centrally symmetric about the first radiating sublayer 411, thereby facilitating the radiation of signals by the multiple radiating sublayers and thus improving the radiation efficiency of the microstrip antenna device.

[0078] In some embodiments, as shown in FIG3, the plurality of radiation layers 40 may include a first radiation sublayer 411, a second radiation sublayer 412, a third radiation sublayer 413, a fourth radiation sublayer 414, and a fifth radiation sublayer 415; the first radiation sublayer 411 is square in shape, and a notch 4111 is provided at each corner of the first radiation sublayer 411; at least a portion of the second radiation sublayer 412, at least a portion of the third radiation sublayer 413, at least a portion of the fourth radiation sublayer 414, and at least a portion of the fifth radiation sublayer 415 are located in the four notches 4111 in sequence; an opening 4112 is provided in the middle of the first radiation sublayer 411, and the center of the opening 4112 is on the same straight line as the center of the first surface 301.

[0079] Since each foot position of the first radiating sublayer 411 has a notch 4111, a portion of the second radiating sublayer 412, at least a portion of the third radiating sublayer 413, at least a portion of the fourth radiating sublayer 414, and at least a portion of the fifth radiating sublayer 415 can be located sequentially in the four notches 4111. This makes the distance between the second radiating sublayer 412 and the first radiating sublayer 411 relatively close, and it is equivalent to making the overlap between the first radiating sublayer 411 and the second radiating sublayer 412 more, so that the first radiating sublayer 411 and the second radiating sublayer 412 are coupled. Similarly, the first radiating sublayer 411 is also coupled with the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 respectively. Thus, when the first radiating sublayer 411 receives a signal and radiates it, it is convenient for the second radiating sublayer 412, the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 to radiate the signal.

[0080] It should be noted that there is a gap between the second radiating sublayer 412 and the first radiating sublayer 411, a gap between the third radiating sublayer 413 and the first radiating sublayer 411, a gap between the fourth radiating sublayer 414 and the first radiating sublayer 411, and a gap between the fifth radiating sublayer 415 and the first radiating sublayer 411.

[0081] In addition, in some embodiments, the shapes of the second radiating sublayer 412, the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 are all identical. This arrangement means that when the second radiating sublayer 412, the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 are coupled to the first radiating sublayer 411 and radiate signals, they radiate signals through the same structure, which improves the beam-switching symmetry of the microstrip antenna device.

[0082] In some embodiments, as shown in FIG3, the notch 4111 is square in shape. The second radiating sublayer 412, the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 each include a first square frame layer, a second square frame layer 4122, a first connecting arm layer 4123, and a second connecting arm layer 4124. The first square frame layer is located inside the second square frame layer 4122, and the diagonal of the first square frame layer intersects the diagonal of the second square frame layer 4122. Part of the second square frame layer 4122 is located in the notch 4111. The second square frame layer 4122 includes a first side 41221, a second side 41222, a third side 41223, and a fourth side 41224. The first side 41221, the second side 41222, the third side 41223, and the fourth side 41224 are connected sequentially and enclose to form a square. The frame structure has a portion of the first side 41221 and a portion of the second side 41222 located in the notch 4111, and the third side 41223 and the fourth side 41224 located outside the notch 4111. The first side 41221 is connected to a first extension 41225, and the second side 41222 is connected to a second extension 41226. Both the first extension 41225 and the second extension 41226 are located outside the notch 4111. The first end of the first connecting arm layer 4123 is connected to the first extension 41225, the first end of the second connecting arm layer 4124 is connected to the second extension 41226, and the second end of the first connecting arm layer 4123 is connected to the second end of the second connecting arm layer 4124. There is a first gap between the first connecting arm layer 4123 and the third side 41223, and a second gap between the second connecting arm layer 4124 and the fourth side 41224. This configuration can improve the radiation efficiency of the microstrip antenna device.

[0083] It should be noted that there is a gap between the first side 41221 and the first radiating sublayer 411, and there is a gap between the second side 41222 and the second radiating sublayer 412.

[0084] In some embodiments, as shown in FIG5, the notch 4111 is square in shape. The second radiating sublayer 412, the third radiating sublayer 413, the fourth radiating sublayer 414, and the fifth radiating sublayer 415 each include a first sector-shaped frame layer 4131, a second sector-shaped frame layer 4132, and an arc-shaped connecting arm layer 4133. The first sector-shaped frame layer 4131 is located inside the second sector-shaped frame layer 4132. Part of the second sector-shaped frame layer 4132 is located in the notch 4111. The second sector-shaped frame layer 4132 includes a fifth side 41321, a sixth side 41322, and an arc-shaped side 41323, which are arranged sequentially. The components are connected and enclosed to form a fan-shaped frame structure. Part of the fifth side 41321 and part of the sixth side 41322 are located within the notch 4111, while the arc-shaped side 41323 is located outside the notch 4111. The fifth side 41321 is connected to a third extension 41324, and the sixth side 41322 is connected to a fourth extension 41325. Both the third extension 41324 and the fourth extension 41325 are located outside the notch 4111. The first end of the arc-shaped connecting arm layer 4133 is connected to the third extension 41324, and the second end of the arc-shaped connecting arm layer 4133 is connected to the fourth extension 41325. A third gap exists between the arc-shaped connecting arm layer 4133 and the arc-shaped side 41323. This arrangement improves the radiation efficiency of the microstrip antenna device.

[0085] It should be noted that there is a gap between the fifth side 41321 and the first radiative sublayer 411, and there is a gap between the sixth side 41322 and the first radiative sublayer 411.

[0086] In addition, in some embodiments, a plurality of strip holes 4113 are provided on the first radiating sublayer 411, and the plurality of strip holes 4113 are distributed at intervals around the center of the first radiating sublayer 411.

[0087] It should be noted that the multiple strip holes 4113 can be evenly distributed around the center of the first radiating sublayer 411. Furthermore, the number of strip holes 4113 can be set according to actual needs; for example, the number of strip holes 4113 can be 4; or, for example, the number of strip holes 4113 can be 8. The specific number of strip holes 4113 is not limited in this embodiment. Additionally, when the first radiating sublayer 4111 is square and the number of strip holes 4113 is 4, one strip hole 4113 corresponds to one side of the first radiating sublayer 4111.

[0088] In some embodiments, as shown in FIG3 or FIG5, a plurality of first metallized vias 4114 may be provided on the first radiating sublayer 411. The plurality of first metallized vias 4114 are spaced apart along the circumferential direction of the first radiating sublayer 4111, and the first metallized vias 4114 are connected to the surface of the feed network 20 facing the radiating sheet 30. By providing the first metallized vias 4114, the first radiating sublayer 411 can be connected to the surface of the feed network 20 facing the radiating sheet 30.

[0089] It should be noted that when the power supply network 20 includes a circuit board 21 and a power supply line layer 22, the first metallized via 4114 is connected to the surface of the circuit board 21 facing the radiating plate 30. The circuit board 21 has two opposing surfaces. The power supply line layer 22 is disposed on one surface, and a copper layer is disposed on the other surface, covering the other surface. The power supply line layer 22 is disposed on the surface of the circuit board 21 facing away from the radiating plate 30, while the copper layer is disposed on the surface of the circuit board 21 facing the radiating plate 30.

[0090] Furthermore, in this embodiment, the number of first metallized vias 4114 can be set according to actual needs. For example, the number of first metallized vias 4114 may be 4, or for another example, the number of first metallized vias 4114 may be 6. This embodiment does not limit the number of vias in this regard.

[0091] In some embodiments, as shown in FIG3, a second metallized via 302 may be provided on the radiating sheet 30; in the remaining radiating sublayers, the projection of each radiating sublayer on the first surface 301 surrounds at least one second metallized via 302.

[0092] It should be noted that the second metallized via 302 can be connected to the surface of the feed network 20 facing the radiating sheet 30. Furthermore, the number of second metallized vias 302 is equal to the number of the remaining radiating sublayers (excluding the first radiating sublayer 411) in the plurality of radiating sublayers. Of course, the number of second metallized vias 302 can also be greater than the number of the remaining radiating sublayers (excluding the first radiating sublayer 411). This embodiment of the present application does not limit this aspect.

[0093] In some embodiments, the base 10 has a frame structure, the power supply network 20 is embedded inside the base 10, and the radiating sheet 30 is detachably connected to the base 10.

[0094] Because the base 10 has a frame structure, it provides a receiving space, allowing the feed network 20 to be embedded inside the base 10 during the assembly of the microstrip antenna device. This ensures the feed network 20 is located within the receiving space of the base 10, after which the radiating plate 30 is connected to the base 10. Furthermore, the radiating plate 30 is detachably connected to the base 10, facilitating its removal or replacement.

[0095] It should be noted that there may be a gap between the power supply network 20 and the base 10. Of course, the power supply network 20 may also be in contact with the base 10. This embodiment of the application does not limit this.

[0096] In some embodiments, as shown in FIG1, the microstrip antenna device may also include a metal connector 001; the edge of the radiating plate 30 is connected to the base 10 via the metal connector 001. This arrangement ensures a secure connection between the radiating plate 30 and the base 10.

[0097] It should be noted that the metal connector 001 can be a metal bolt, or it can be a metal pin. The specific type of the metal connector 001 is not limited in this embodiment.

[0098] In addition, the edge of the radiating sheet 30 can be provided with a connecting hole, and the base 10 is provided with a corresponding threaded hole or through hole, so that the metal connector 001 can pass through the connecting hole and be embedded in the threaded hole or through hole to realize the connection between the radiating sheet 30 and the base 10.

[0099] Furthermore, the number of metal connectors 001 can be set according to actual needs. For example, the number of metal connectors 001 may be 8, or the number of metal connectors 001 may be 6. This application does not limit the specific number of metal connectors 001 in this regard.

[0100] In addition, in this embodiment of the application, the base 10 may be formed of metal, that is, the base 10 is a metal base 10.

[0101] In some embodiments, as shown in FIG1, the microstrip antenna device may also include a non-metallic connector 002; the feed network 20 and the radiating plate 30 are connected via the non-metallic connector 002. By providing the non-metallic connector 002, the feed network 20 and the radiating plate 30 can be securely connected, avoiding the possibility of separation between the feed network 20 and the radiating plate 30.

[0102] It should be noted that non-metallic connectors 002 may include, but are not limited to, bolts, pins, etc.

[0103] In some embodiments, as shown in FIG1, the microstrip antenna device may further include a connector 003; the connector 003 is connected to the base 10 and electrically connected to the feed network 20. With this configuration, the connector 003 can be connected to the component to be connected, thereby transmitting the signal to the feed network 20 through the connector 003, and then the feed network 20 transmits the signal to the radiating sheet 30 and the radiating layer 40, so that the radiating layer 40 radiates the signal.

[0104] It should be noted that the power supply network 20 may have an input terminal, and the connector 003 is electrically connected to the input terminal of the power supply network 20.

[0105] This application provides a navigation device, which includes a navigation body and a microstrip antenna device according to any of the first aspects described above; the microstrip antenna device is mounted on the navigation body.

[0106] This application provides a manufacturing method for fabricating a microstrip antenna device as described in any of the above embodiments. Multiple radiating sublayers include a first radiating sublayer with a first metallized via on it, and a second metallized via on the radiating sheet. The feed network includes a circuit board and a feed line layer disposed on the circuit board. As shown in FIG8, the manufacturing method includes:

[0107] Step 801: Determine the parameters of the radiating sheet and the parameters of the radiating sublayer based on the target resonant frequency band.

[0108] Among them, the height of the radiating sheet and the size of the radiating sublayer on the radiating sheet have a significant impact on the resonant frequency of the antenna, while other components have a smaller impact on the resonant frequency of the antenna. Therefore, it is necessary to determine the parameters of the radiating sheet and the radiating sublayer based on the target resonant frequency band.

[0109] The parameters of the radiating sheet can be its height, and the parameters of the radiating sublayer can be its size, such as its area and shape.

[0110] In addition, simulation testing software can be used to determine the parameters of the radiating sheet and the radiating sublayer. Specifically, after determining the target resonant frequency band, the parameters of the radiating sheet and the radiating sublayer can be determined using simulation testing software.

[0111] For example, if the target resonant frequency band is the band covering 1.1 GHz to 1.7 GHz, then based on the target frequency band, the height of the radiating sheet, the area and shape of the radiating sublayer, etc., can be determined using simulation testing software.

[0112] Step 802: Determine the gap between the radiating sublayers, the location of the first metallized via on the first radiating sublayer, and the location of the second metallized via on the radiating sheet.

[0113] The first and second metallized vias affect the resonance intensity of the antenna, and the resonance intensity of the antenna is mainly determined by the gap between the radiating sublayers, the position of the first metallized via, and the position of the second metallized via. Therefore, the gap between the radiating sublayers, the position of the first metallized via on the first radiating sublayer, and the position of the second metallized via on the radiating sheet can be determined so that the efficiency of the antenna in the target resonant frequency band is greater than the target threshold.

[0114] Specifically, after determining the target resonant frequency band, once the parameters of the radiating sheet and the radiating sublayer are determined, the resonant frequency of the antenna can be simulated through simulation testing. The gap between the radiating sublayers, the position of the first metallized via on the first radiating sublayer, and the position of the second metallized via on the radiating sheet can be adjusted in real time until the efficiency of the antenna's resonant frequency in the target resonant frequency band is greater than the target threshold. At this point, the gap between the radiating sublayers, the position of the first metallized via on the first radiating sublayer, and the position of the second metallized via on the radiating sheet can be determined.

[0115] It should be noted that the target threshold can be set according to actual needs, for example, the target threshold is 85%, or for another example, the target threshold is 90%.

[0116] Step 803: Determine the linewidth and linelength of each microstrip line in the feeder layer on the circuit board to determine the size of the feeder network.

[0117] The process involves determining the center frequency of the feed network based on the target resonant frequency band, then determining the thickness and dielectric constant of the circuit board. The feed line layer has input and output terminals, both matched with a 50Ω impedance. Subsequently, the initial values ​​of the linewidth and length for each microstrip line segment can be determined. Finally, the actual linewidth and length of each microstrip line segment are determined using simulation testing software.

[0118] For example, assuming the center frequency of the feeder network is set at 1.4 GHz, the thickness of the feeder network circuit board is 0.762 mm, and the frequency sweep range is 1.1 GHz to 1.7 GHz, combining the feeder network structure diagram shown in Figure 4 and the feeder network impedance diagram shown in Figure 6, we can see that:

[0119] The input signal at port 1 is split into four paths by a Wilkins power divider. Resistor R is an absorption resistor, increasing port isolation and reducing antenna cross-polarization. The two output signals from the Wilkins power divider are phased by a 180° phase shifter to produce a 180° phase difference. These two signals are then split by the Wilkins power divider into four signals of 180° and 360°. After passing through 90° phase shifters, these signals produce four signals with phase differences of 0°, 90°, 180°, and 270° respectively.

[0120] The initial values ​​of the impedance, line width, and line length of the feeder network are as follows:

[0121] λg = 126.74 mm;

[0122] Z1 = 70.71Ω, microstrip linewidth 0.86mm;

[0123] Z2 = 63Ω, microstrip linewidth 1.08mm;

[0124] Z3 = 81Ω, microstrip linewidth 0.63mm;

[0125] Z0 = Z4 = 50Ω, microstrip linewidth 1.63mm.

[0126] The actual linewidth and length of each microstrip line were obtained after optimization using simulation testing software.

[0127] Step 804: Assemble the radiating sheet, feed network, and base to form a microstrip antenna device.

[0128] Once the parameters of the radiating plate and the dimensions of the feed network are determined, the radiating plate and the feed network can be stacked and connected, and the radiating plate can be connected to the base to form a microstrip antenna device.

[0129] In addition, when the feed probe includes a first column and a second column, the diameter of the second column can be adjusted so that the antenna resonance is within the target frequency band.

[0130] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0131] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A microstrip antenna device, characterized in that, The microstrip antenna device includes: a base (10), a feed network (20), and a radiating plate (30); the feed network (20) and the radiating plate (30) are stacked and connected, and the radiating plate (30) is fixed to the base (10); the radiating plate (30) has a first surface (301) facing away from the feed network (20), and a radiating layer (40) is disposed on the first surface (301), the radiating layer (40) including a plurality of radiating elements. The plurality of radiating sublayers are distributed at intervals around the center of the first surface (301); wherein at least one of the radiating sublayers is electrically connected to the feed network (20); the plurality of radiating layers (40) include a first radiating sublayer (411), a second radiating sublayer (412), a third radiating sublayer (413), a fourth radiating sublayer (414), and a fifth radiating sublayer (415); the first radiating sublayer (411) is square in shape, and a notch (4111) is provided at each corner of the first radiating sublayer (411), at least a portion of the second radiating sublayer (412), at least a portion of the third radiating sublayer (413), at least a portion of the fourth radiating sublayer (414), and at least a portion of the fifth radiating sublayer (415) are located sequentially in the four notches (4111); an opening (4112) is provided in the middle of the first radiating sublayer (411), and the center of the opening (4112) is on the same straight line as the center of the first surface (301); the first radiating sublayer (411) is square in shape, and at least a portion of the second radiating sublayer (412), the third radiating sublayer (413), the fourth radiating sublayer (414), and the fifth radiating sublayer (415) are located in the four notches (4111); an opening (4112) is provided in the middle of the first radiating sublayer (411), and the center of the opening (4112) is on the same straight line as the center of the first surface (301); the first radiating sublayer (411) is square in shape, and at least a portion of the second radiating sublayer (412), the third radiating sublayer (413), the fourth radiating sublayer (414), and the fifth The first radiating sublayer (411) is provided with a plurality of strip holes (4113), and the plurality of strip holes (4113) are distributed at intervals around the center of the first radiating sublayer (411); the first radiating sublayer (411) is provided with a plurality of first metallized vias (4114), the plurality of first metallized vias (4114) are distributed at intervals along the circumferential direction of the first radiating sublayer (411), and the first metallized vias (4114) are connected to the surface of the feed network (20) facing the radiating sheet (30).

2. The microstrip antenna device according to claim 1, characterized in that, The first radiating sublayer (411) of the plurality of radiating sublayers is located in the middle of the first surface (301), and the center of the first radiating sublayer (411) is on the same straight line as the center of the first surface (301). The remaining radiating sublayers are distributed around the first radiating sublayer (411) at intervals.

3. The microstrip antenna device according to claim 2, characterized in that, The shape of the projection of the first radiating sublayer (411) onto the first surface (301) is different from the shape of the projection of the remaining radiating sublayers onto the first surface (301).

4. The microstrip antenna device according to claim 2, characterized in that, In the remaining radiating sublayers, the area of ​​the projection of each radiating sublayer onto the first surface (301) is smaller than the area of ​​the projection of the first radiating sublayer (411) onto the first surface (301).

5. The microstrip antenna device according to claim 4, characterized in that, The first radiating sublayer (411) is electrically connected to the feed network (20).

6. The microstrip antenna device according to claim 5, characterized in that, The microstrip antenna device further includes a feed probe (50), and the feed network (20) includes a circuit board (21) and a feed line layer (22) disposed on the circuit board (21); the circuit board (21) and the radiating sheet (30) are stacked, and the feed line layer (22) is located on the surface of the circuit board (21) away from the radiating sheet (30). The first end of the feed probe (50) is connected to the first radiating sublayer (411), and the second end of the feed probe (50) is connected to the feed line layer (22) so that the first radiating sublayer (411) is electrically connected to the feed network (20).

7. The microstrip antenna device according to claim 2, characterized in that, The remaining radiative sublayers are centrosymmetric about the first radiative sublayer (411).

8. The microstrip antenna device according to claim 7, characterized in that, The shapes of the second radiating sublayer (412), the third radiating sublayer (413), the fourth radiating sublayer (414), and the fifth radiating sublayer (415) are all the same.

9. The microstrip antenna device according to claim 8, characterized in that, The notch (4111) is square in shape. The second radiating sublayer (412), the third radiating sublayer (413), the fourth radiating sublayer (414), and the fifth radiating sublayer (415) each include a first square frame layer, a second square frame layer (4122), a first connecting arm layer (4123), and a second connecting arm layer (4124). The first square frame layer is located inside the second square frame layer (4122), and the diagonal of the first square frame layer is parallel to the second square frame layer (4122). The diagonals intersect; a portion of the second square frame layer (4122) is located in the notch (4111), the second square frame layer (4122) includes a first side (41221), a second side (41222), a third side (41223), and a fourth side (41224), the first side (41221), the second side (41222), the third side (41223), and the fourth side (41224) are connected in sequence and enclose to form a square frame structure, a portion of the first side (41221) intersects the diagonals; a portion of the second square frame layer (41222) is located in the notch (4111), the second square frame layer (41222) includes a first side (41221), a second side (41222), a third side (41223), and a ... located in the notch (4111), the second square frame layer (41222) includes a first side (41221), a second side (41222), a third side (41223), and a fourth side (41224) are located in the notch (4111), the second square frame layer (4122) includes a first side (41221), a second side (41222), a third side (41223), and a fourth side (41224) are located in the notch (41224), the second square frame layer 221) and part of the second side (41222) are located in the notch (4111), the third side (41223) and the fourth side (41224) are located outside the notch (4111), the first side (41221) is connected to a first extension (41225), the second side (41222) is connected to a second extension (41226), and both the first extension (41225) and the second extension (41226) are located outside the notch (4111). The first end of the first connecting arm layer (4123) is connected to the first extension (41225), the first end of the second connecting arm layer (4124) is connected to the second extension (41226), the second end of the first connecting arm layer (4123) is connected to the second end of the second connecting arm layer (4124), there is a first gap between the first connecting arm layer (4123) and the third side (41223), and there is a second gap between the second connecting arm layer (4124) and the fourth side (41224).

10. The microstrip antenna device according to claim 8, characterized in that, The notch (4111) is square in shape. The second radiating sublayer (412), the third radiating sublayer (413), the fourth radiating sublayer (414), and the fifth radiating sublayer (415) each include a first fan-shaped frame layer (4131), a second fan-shaped frame layer (4132), and an arc-shaped connecting arm layer (4133). The first fan-shaped frame layer (4131) is located inside the second fan-shaped frame layer (4132). Part of the second fan-shaped frame layer (4132) is located in the notch (4111). The second fan-shaped frame layer (4132) includes a fifth side (41321), a sixth side (41322), and an arc-shaped side (41323). The fifth side (41321), the sixth side (41322), and the arc-shaped side (41323) are connected in sequence and enclose to form a fan-shaped frame structure. The structure includes a portion of the fifth side (41321) and a portion of the sixth side (41322) located within the notch (4111), and an arc-shaped side (41323) located outside the notch (4111). The fifth side (41321) is connected to a third extension (41324), and the sixth side (41322) is connected to a fourth extension (41325). Both the third extension (41324) and the fourth extension (41325) are located outside the notch (4111). The first end of the arc-shaped connecting arm layer (4133) is connected to the third extension (41324), and the second end of the arc-shaped connecting arm layer (4133) is connected to the fourth extension (41325). A third gap exists between the arc-shaped connecting arm layer (4133) and the arc-shaped side (41323).

11. The microstrip antenna device according to claim 2, characterized in that, The radiating sheet (30) is provided with a second metallized via (302); in the remaining radiating sublayers, the projection of each radiating sublayer onto the first surface (301) surrounds at least one second metallized via (302).

12. The microstrip antenna device according to claim 1, characterized in that, The microstrip antenna device also includes a metal connector (001); the edge of the radiating plate (30) is connected to the base (10) via the metal connector (001).

13. The microstrip antenna device according to claim 1, characterized in that, The microstrip antenna device further includes a non-metallic connector (002); the feed network (20) and the radiating plate (30) are connected through the non-metallic connector (002).

14. The microstrip antenna device according to claim 1, characterized in that, The base (10) is a frame structure, the power supply network (20) is embedded inside the base (10), and the radiating plate (30) is detachably connected to the base (10).

15. The microstrip antenna device according to claim 14, characterized in that, The microstrip antenna device further includes a connector (003); the connector (003) is connected to the base (10) and is electrically connected to the feed network (20).

16. The microstrip antenna device according to any one of claims 1-15, characterized in that, The microstrip antenna device operates in a frequency band covering 1.1 GHz to 1.7 GHz.

17. A navigation device, characterized in that, The navigation device includes a navigation body and a microstrip antenna device according to any one of claims 1-15; the microstrip antenna device is mounted on the navigation body.

18. A method of manufacturing, characterized in that, For fabricating a microstrip antenna device according to any one of claims 1-15, the plurality of radiating sublayers include a first radiating sublayer, the first radiating sublayer being provided with a first metallized via, the radiating sheet being provided with a second metallized via, and the feed network including a circuit board and a feed line layer disposed on the circuit board; The fabrication method includes: determining the parameters of the radiating sheet and the parameters of the radiating sublayer based on the target resonant frequency band; determining the position of the first metallized via on the first radiating sublayer and the position of the second metallized via on the radiating sheet; determining the linewidth and linelength of each microstrip line in the feed line layer on the circuit board to determine the size of the feed network; and assembling the radiating sheet, the feed network, and the base to form the microstrip antenna device.

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