PCBA circuit board film pasting equipment and film pasting method

Abstract

The invention belongs to the technical field of electrical elements, and particularly provides PCBA circuit board film pasting equipment and a film pasting method. The PCBA circuit board film pasting equipment comprises a film pasting device used for clamping a thermoplastic film and moving the thermoplastic film to the position above a workpiece; a flanging piece; wherein one end of the thermoplastic film moves to the flanging piece, and the flanging piece is suitable for bending the thermoplastic film in the width direction; the other end of the thermoplastic film moves to the flanging piece, and the flanging piece continues to bend the thermoplastic film; the film pasting device clamps the bent thermoplastic film and moves the bent thermoplastic film to the position above the workpiece so that the thermoplastic film can cover the surface and the two side faces of the workpiece; the thermoplastic film is bent by arranging the flanging piece, so that the thermoplastic film not only can cover the surface of the PCBA circuit board, but also can cover the two side surfaces of the PCBA circuit board; the structure effectively solves the problem that the thermoplastic film cannot completely cover the surface of the circuit board due to thermal shrinkage transition in the prior art, thereby improving the protection performance and reliability of the PCBA circuit board.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical components, specifically relates to printed circuits, and particularly relates to a PCBA circuit board film laminating device and a film laminating method. Background Art

[0002] Printed Circuit Board Assembly (PCBA) is a core component of modern electronic devices and is widely used in fields such as communication, computers, consumer electronics, and automotive electronics.

[0003] In the manufacturing process of PCBA, surface protection is a key link. To protect the circuit board from the influence of the external environment, such as dust, moisture, chemical corrosion, etc., a protective film is usually covered on the surface of PCBA. Thermoplastic film is widely used in the surface protection of PCBA due to its good flexibility, insulation property, and protective performance.

[0004] However, in practical applications, the process of laminating the thermoplastic film faces many challenges. Among them, excessive thermal shrinkage of the thermoplastic film is a common problem, resulting in the film material being unable to completely cover the surface of the PCBA, thus exposing some circuit board areas.

[0005] Therefore, how to avoid the situation that the thermoplastic film cannot completely cover the surface of the circuit board is a technical problem that urgently needs to be solved in this field.

[0006] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, the above description is not considered as information of the prior art. Summary of the Invention

[0007] The embodiments of the present disclosure at least provide a PCBA circuit board film laminating device and a film laminating method.

[0008] In a first aspect, the embodiments of the present disclosure provide a PCBA circuit board film laminating device, including: A film feeding device, which is arranged on one side of the conveyor belt and is used to convey the thermoplastic film to be laminated; A film laminating device, which is arranged above the conveyor belt and is used to clamp the thermoplastic film and move it above the workpiece; A flanging member, which is arranged on the side of the film feeding device close to the conveyor belt, and the flanging member is adapted to bend the thermoplastic film along the width direction of the thermoplastic film; Wherein, one end of the thermoplastic film moves to the flanging member, and the flanging member makes a first bend on the thermoplastic film; subsequently, the other end of the thermoplastic film moves to the flanging member, and the flanging member makes a second bend on the thermoplastic film; The film laminating device clamps the bent thermoplastic film and moves it above the workpiece to cover the thermoplastic film on the surface and both sides of the workpiece.

[0009] In an alternative embodiment, the film feeding device includes: a support frame vertically disposed on one side of the conveyor belt; An unwinding roller rotatably disposed on the side wall of the support frame, with a thermoplastic film roll sleeved on the outer wall of the unwinding roller; A winding roller rotatably disposed on the side wall of the support frame and adapted to wind the used bottom film; A positioning plate perpendicularly fixed to the side wall of the support frame and parallel to the conveyor belt; A guiding plate disposed above the positioning plate, with a gap greater than the thickness of the thermoplastic film provided between the guiding plate and the positioning plate; The flanging member is disposed on the outer side wall of the positioning plate and is on the same horizontal plane as the surface of the positioning plate; Wherein, the winding roller rotates to wind the bottom film until one end of the thermoplastic film moves above the flanging member, and the flipping member adsorbs the thermoplastic film through negative pressure to separate the thermoplastic film from the bottom film; After the thermoplastic film is separated from the bottom film, it moves towards the flanging member and protrudes from the flanging member, and the flanging member bends the end of the thermoplastic film through negative pressure suction, positive pressure blowing, and negative pressure suction in sequence.

[0010] In an alternative embodiment, the flanging member includes: a flanging plate disposed on the outer side wall of the positioning plate; An air supply pipe extending along the length direction of the flanging plate, with a plurality of air supply holes opened on the outer wall thereof, and the air supply holes penetrate through the upper surface of the flanging plate; A first negative pressure pipe disposed outside the air supply pipe, with a plurality of first negative pressure holes opened on the outer wall thereof; A second negative pressure pipe disposed on the side of the air supply pipe away from the first negative pressure pipe, with a plurality of second negative pressure holes opened on the outer wall thereof; Wherein, the winding roller rotates to wind the bottom film until one end of the thermoplastic film moves above the second negative pressure holes, and the second negative pressure pipe sucks the thermoplastic film through negative pressure to separate it from the bottom film.

[0011] In an alternative embodiment, the air supply pipe is connected to a compressed air pump, and the air volume blown out by the air supply holes is adjustable; The first negative pressure pipe and the second negative pressure pipe are respectively connected to a negative pressure air pump; Wherein, when the first negative pressure holes adsorb the thermoplastic film through negative pressure, the air supply holes blow air outwards to make the thermoplastic film expand upwards; When the second negative pressure holes adsorb the thermoplastic film through negative pressure, the air volume blown out by the air supply holes increases.

[0012] In an alternative embodiment, the film feeding device further includes a cutting knife slidably disposed above the positioning plate, and the cutting knife is disposed on the positioning plate near the second negative pressure holes.

[0013] In an alternative embodiment, the film laminating device includes: a film laminating bracket disposed above the conveyor belt; Two manipulators, which are slidably disposed on the side wall of the film laminating bracket and are adapted to clamp and horizontally move the thermoplastic film; Infrared heating lamps, which are disposed on the side wall of the film laminating bracket and are located above the workpiece.

[0014] In an alternative embodiment, a lifting jacking device is disposed inside the conveyor belt, and the jacking device is adapted to drive the workpiece to move up and down; Wherein, after the manipulator clamps the thermoplastic film and horizontally moves it above the workpiece, the jacking device moves upward so that the thermoplastic film covers the surface and both side surfaces of the workpiece.

[0015] In an alternative embodiment, a loading box is disposed on one side of the conveyor belt, and the workpiece is placed horizontally in the loading box; A loading push block is disposed on the side of the loading box away from the conveyor belt, and the loading push block is adapted to push the workpiece in the loading box onto the conveyor belt.

[0016] In an alternative embodiment, the length of the guiding plate is greater than the length of the positioning plate; A plurality of third negative pressure holes are formed in the bottom wall of the guiding plate away from the positioning plate, and the third negative pressure holes face the bottom film; Wherein, when the winding roller stops winding, the third negative pressure holes are adapted to suck the bottom film on the bottom wall of the guiding plate by negative pressure so that it fits against the bottom wall of the guiding plate.

[0017] In an alternative embodiment, it includes: A film feeding device for feeding the thermoplastic film to be laminated; A flanging member disposed on the side of the film feeding device close to the workpiece; The flanging member includes: a flanging plate disposed on the outer side wall of the film feeding device; Air supply holes, and a plurality of the air supply holes are evenly distributed along the length direction of the flanging plate; A first negative pressure hole and a second negative pressure hole, the first negative pressure hole and the second negative pressure hole are symmetrically disposed on both sides of the air supply hole, and the first negative pressure hole is disposed on the side of the flanging member away from the film feeding device; A plurality of the first negative pressure holes and the second negative pressure holes are evenly distributed along the length direction of the flanging plate; Wherein, when the winding roller rotates to wind the bottom film until one end of the thermoplastic film moves above the second negative pressure hole, the second negative pressure tube sucks the thermoplastic film by negative pressure so that it is separated from the bottom film; After the thermoplastic film is separated from the bottom film, it moves towards the flanging member and protrudes from the flanging member, and the first negative pressure hole, the air supply hole and the second negative pressure hole work in sequence to bend the end of the thermoplastic film.

[0018] In an alternative embodiment, the air supply hole is communicated with the compression pump, and the air volume blown out of the air supply hole is adjustable; The first negative pressure hole and the second negative pressure hole are respectively communicated with a negative pressure air pump; Wherein, when the first negative pressure hole negatively adsorbs the thermoplastic film, the air supply hole blows air outwards to cause the thermoplastic film to expand upwards; When the second negative pressure hole negatively adsorbs the thermoplastic film, the air supply volume of the air supply hole increases.

[0019] In a second aspect, the embodiments of the present disclosure further provide a film pasting method for a film pasting device, and the film pasting method includes: After the thermoplastic film roll is installed on the unwinding roller, the bottom film is wound around the winding roller through the gap between the positioning plate and the guiding plate, the winding roller rotates to wind the bottom film, and at the same time drives the thermoplastic film to move towards the flanging member; The bottom film drives the thermoplastic film to move until one end of it is located above the flanging member, and the second negative pressure pipe negatively sucks the thermoplastic film to separate it from the bottom film; One end of the thermoplastic film moves to protrude from the flanging member, and the flanging member bends the end of the thermoplastic film in sequence through negative pressure suction, positive pressure blowing, and negative pressure suction; The other end of the thermoplastic film moves to the flanging member, and the flanging member continues to bend the thermoplastic film; The film pasting device clamps the bent thermoplastic film and moves it above the workpiece to cover the surface and both sides of the workpiece with the thermoplastic film.

[0020] The beneficial effects of the present invention are as follows: The present invention provides a PCBA circuit board film pasting device and a film pasting method. Through the setting of the flanging member, by setting the flanging member to perform a bending operation on the thermoplastic film, the thermoplastic film can not only cover the surface of the PCBA circuit board, but also cover both of its sides. The setting of the flanging member effectively solves the problem in the prior art that the thermoplastic film cannot completely cover the surface of the circuit board due to excessive heat shrinkage, ensuring that the surface and edge areas of the circuit board can be fully protected and avoiding being eroded by external environmental factors due to exposure, thereby improving the protection performance and reliability of the PCBA circuit board.

[0021] Other features and advantages of the present invention will be described in the subsequent description, and, in part, will be obvious from the description, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the description and the drawings.

[0022] To make the above objectives, features, and advantages of the present invention more obvious and understandable, specific preferred embodiments are hereby given, and in conjunction with the accompanying drawings, the following detailed description is provided. Description of the Drawings

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 A perspective view of the PCBA circuit board film laminating device provided by an embodiment of the present disclosure; Figure 2 A perspective view of the film feeding device, film laminating device and conveyor belt provided by an embodiment of the present disclosure; Figure 3 A perspective view of the film feeding device and the flanging part provided by an embodiment of the present disclosure; Figure 4 A sectional perspective view of the film feeding device and the flanging part provided by an embodiment of the present disclosure; Figure 5 A front view of the flanging part and the positioning plate provided by an embodiment of the present disclosure; Figure 6 A schematic diagram of the state where the thermoplastic film is bent provided by an embodiment of the present disclosure; Figure 7 A schematic diagram of the state before the thermoplastic film is bent and adhered to the PCBA circuit board provided by an embodiment of the present disclosure.

[0025] In the figure: 1. Film feeding device; 11. Support frame; 12. Unwinding roller; 13. Rewinding roller; 14. Positioning plate; 15. Guide plate; 16. Cutting knife; 17. Third negative pressure hole; 2. Film laminating device; 21. Film laminating bracket; 22. Manipulator; 23. Infrared heating lamp; 3. Flanging part; 30. Flanging plate; 31. Air supply pipe; 32. Air supply hole; 33. First negative pressure pipe; 34. First negative pressure hole; 35. Second negative pressure pipe; 36. Second negative pressure hole; 4. Conveyor belt; 41. Loading box; 42. Loading push block; 43. Lifting device. Specific embodiments

[0026] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions of the present invention with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0027] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component can be directly formed on the second component, or a third component can be interposed between the first component and the second component. Additionally, in the drawings, for the effective description of the technical content, the thickness of the components may be exaggerated or reduced.

[0028] The terms used herein are only for describing specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a", "an", and "the" may also be intended to include the plural forms, unless it is clearly stated otherwise in the context. The terms "comprising", "including", and "having" are inclusive, thus specifying the presence of features, steps, operations, elements, and / or components, but not precluding the presence or addition of one or more other features, steps, operations, elements, components, and / or their combinations. The method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an order of performance. Additional or alternative steps may be employed.

[0029] As used herein, phrases such as "in one embodiment", "according to one embodiment", "in some embodiments", etc. generally refer to the fact that the specific feature, structure, or characteristic after the phrase can be included in at least one embodiment of the present disclosure. Thus, a specific feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example", "exemplary", etc. are used "as an example, instance, or illustration. Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other embodiments, aspects, or designs. Instead, the use of the terms "example", "exemplary", etc. is intended to present concepts in a specific manner.

[0030] It has been found through research that the disadvantages of the prior art: In the manufacturing process of PCBA, surface protection is a key link. In order to protect the circuit board from the influence of the external environment, such as dust, moisture, chemical corrosion, etc., a protective film is usually covered on the surface of the PCBA. Thermoplastic film is widely used in the surface protection of PCBA due to its good flexibility, insulation, and protective properties.

[0031] However, in practical applications, the lamination process of the thermoplastic film faces many challenges. Among them, excessive shrinkage of the thermoplastic film when heated is a common problem, resulting in the film material being unable to completely cover the surface of the PCBA, thus exposing some circuit board areas.

[0032] Therefore, how to avoid the thermoplastic film from not completely covering the surface of the circuit board is a technical problem that urgently needs to be solved in this field.

[0033] Regarding the defects existing in the above solutions, they are all the results obtained by the inventors through practice and careful research. Therefore, the process of discovering the above problems and the solutions proposed by the present disclosure in this article for the above problems should both be the contributions made by the inventors to the present disclosure during the process of the present disclosure.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0035] The following will, with reference to the drawings, elaborate on some embodiments of the present invention. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0036] As Figures 1 to 7 shown, at least one embodiment provides a PCBA circuit board film laminating device. The PCBA circuit board film laminating device of the present invention mainly includes a film feeding device 1, a film laminating device 2, and a flanging member 3, and realizes automatic film laminating operation in combination with a conveyor belt 4. The following are the specific structures and working principles of each component: Referring to the attached Figure 3 drawings, the film feeding device 1 is arranged on one side of the conveyor belt 4 and is used for conveying the thermoplastic film to be attached; the film feeding device 1 includes: a support frame 11, which is vertically arranged on one side of the conveyor belt 4, and the support frame 11 is used for supporting the entire film feeding device 1. A unwind roller 12 is rotatably arranged on the side wall of the support frame 11, and the thermoplastic film roll is sleeved on the outer wall of the unwind roller 12; the unwind roller 12 is a driven roller. A winding roller 13 is rotatably arranged on the side wall of the support frame 11 and is adapted to wind the used bottom film; the winding roller 13 is driven by a motor to ensure the smoothness of the bottom film winding; at the same time, when the winding roller 13 rotates to wind the bottom film, the bottom film pulls the unwind roller 12 to rotate to realize synchronous unwinding. In this embodiment, for the bottom film and the thermoplastic film, when the thermoplastic film is not separated from the bottom film, the thermoplastic film is arranged below the bottom film. A positioning plate 14 is vertically fixed on the side wall of the support frame 11 and is parallel to the conveyor belt 4; the positioning plate 14 is used for guiding the conveying direction of the thermoplastic film. A guiding plate 15 is arranged above the positioning plate 14, and there is a gap greater than the thickness of the thermoplastic film between the guiding plate 15 and the positioning plate 14; the guiding plate 15 is used for guiding the conveying direction of the thermoplastic film, and at the same time, when the thermoplastic film stops moving, the guiding plate 15 can also prevent the thermoplastic film at its bottom wall from drooping downward due to gravity. A cutting knife 16 is slidably arranged above the positioning plate 14, and the cutting knife 16 is arranged on the positioning plate 14 close to the second negative pressure hole 36. The cutting knife 16 is used for cutting off the thermoplastic film after the unwinding length of the thermoplastic film is greater than the length of the workpiece.

[0037] Continuing to refer to the attached Figure 3, the flanging part 3 is used to bend the thermoplastic film to ensure that the thermoplastic film can cover the surface and both side surfaces of the PCBA circuit board. Its specific structure is as follows: A flanging plate 30, which is arranged on the outer side wall of the positioning plate 14 and is on the same horizontal plane as the surface of the positioning plate 14, so that the thermoplastic film separated from the bottom film can move horizontally above the flanging plate 30. An air supply pipe 31, which extends along the length direction of the flanging plate 30, and a plurality of air supply holes 32 are opened on the outer wall. The air supply holes 32 penetrate the upper surface of the flanging plate 30. And the air supply pipe 31 is communicated with a compressed air pump, and the air volume blown out by the air supply holes 32 is adjustable. A first negative pressure pipe 33, which is arranged outside the air supply pipe 31, and a plurality of first negative pressure holes 34 are opened on the outer wall. The first negative pressure holes 34 penetrate the upper surface of the flanging plate 30. A second negative pressure pipe 35, which is arranged on the side of the air supply pipe 31 away from the first negative pressure pipe 33, and a plurality of second negative pressure holes 36 are opened on the outer wall. The second negative pressure holes 36 penetrate the upper surface of the flanging plate 30. The first negative pressure pipe 33 and the second negative pressure pipe 35 are respectively communicated with a negative pressure air pump.

[0038] During operation, the winding roller 13 rotates to drive the thermoplastic film to move above the flanging part 3. The second negative pressure pipe 35 sucks the thermoplastic film through the second negative pressure holes 36 to separate the thermoplastic film from the bottom film. Subsequently, as the bottom film continues to be wound by the winding roller 13, one end of the thermoplastic film moves above the flanging plate until the outer end of the thermoplastic film protrudes from the flanging plate 30. At this time, the flanging part 3 completes the bending operation through the following steps in sequence: First, the first negative pressure holes 34 suck the thermoplastic film by negative pressure; Second, the air supply holes 32 blow air outwards to make the thermoplastic film expand upwards; Third, the second negative pressure holes 36 suck the thermoplastic film by negative pressure; Fourth, the air volume conveyed outwards by the air supply holes 32 increases to complete the bending.

[0039] Refer to the appendix Figure 2 , a film pasting device 2, which is arranged above the conveyor belt 4. The film pasting device 2 is used to paste the bent thermoplastic film on the PCBA circuit board. The film pasting device 2 includes: a film pasting support 21, which is arranged above the conveyor belt 4, and the film pasting support 21 is used to support the entire film pasting device 2. Two manipulators 22, the manipulators 22 are slidably arranged on the side wall of the film pasting support 21, and the manipulators 22 are used to clamp the bent thermoplastic film and move it above the workpiece. Infrared heating lamps 23, which are arranged on the side wall of the film pasting support 21 and are located above the workpiece. The infrared heating lamps 23 preheat the thermoplastic film before film pasting to improve its flexibility and ensure the film pasting effect.

[0040] Continue to refer to the appendix Figure 2, a lifting jacking device 43 is arranged inside the conveyor belt 4, and the jacking device 43 is adapted to drive the workpiece to move up and down; wherein, after the manipulator 22 clamps the thermoplastic film and moves horizontally above the workpiece, the jacking device 43 moves upward so that the thermoplastic film covers the surface and both side surfaces of the workpiece.

[0041] Reference appendix Figure 1 , a loading box 41 is arranged on one side of the conveyor belt 4, and the workpiece is placed horizontally in the loading box 41; a loading push block 42 is arranged on the side of the loading box 41 away from the conveyor belt 4, and the loading push block 42 is adapted to push the workpiece in the loading box 41 onto the conveyor belt 4 to realize automatic loading.

[0042] In order to prevent the thermoplastic film from sagging downward under the action of gravity, the length of the guiding plate 15 is greater than the length of the positioning plate 14; a plurality of third negative pressure holes 17 are formed in the bottom wall of the guiding plate 15 away from the positioning plate 14, and the third negative pressure holes 17 face the bottom film; the third negative pressure holes 17 are communicated with a negative pressure pump; wherein, when the winding roller 13 stops winding, the third negative pressure holes 17 are adapted to suck the bottom film on the bottom wall of the guiding plate 15 by negative pressure so that it fits with the bottom wall of the guiding plate 15. When the winding roller 13 stops winding, the third negative pressure holes 17 can keep the thermoplastic film on the bottom wall of the guiding plate 15 flat, preventing the thermoplastic film from sagging downward under the action of gravity and wearing against the edge sharp corners of the positioning plate 14.

[0043] Reference appendix Figure 3 , at least one embodiment provides a circuit board film feeding device, including: a film feeding device 1 for feeding the thermoplastic film to be attached; a flanging member 3 arranged on the side of the film feeding device 1 close to the workpiece; the flanging member 3 includes: a flanging plate 30 arranged on the outer side wall of the film feeding device 1; air supply holes 32, a plurality of the air supply holes 32 are evenly distributed along the length direction of the flanging plate 30; first negative pressure holes 34 and second negative pressure holes 36, the first negative pressure holes 34 and the second negative pressure holes 36 are symmetrically arranged on both sides of the air supply holes 32, and the first negative pressure holes 34 are arranged on the side of the flanging member 3 away from the film feeding device 1; a plurality of the first negative pressure holes 34 and the second negative pressure holes 36 are evenly distributed along the length direction of the flanging plate 30; wherein, when the winding roller 13 rotates to wind the bottom film until one end of the thermoplastic film moves above the second negative pressure hole 36, the second negative pressure pipe 35 sucks the thermoplastic film by negative pressure to separate it from the bottom film; after the thermoplastic film is separated from the bottom film, it moves towards the flanging member 3 and protrudes from the flanging member 3, and the first negative pressure holes 34, the air supply holes 32 and the second negative pressure holes 36 work in sequence to bend the end of the thermoplastic film.

[0044] At least one embodiment provides a film sticking method for a film sticking device, and the film sticking method includes: After the thermoplastic film roll is installed on the unwind roller 12, the bottom film is wound around the wind-up roller 13 through the gap between the positioning plate 14 and the guiding plate 15. The wind-up roller 13 rotates to wind up the bottom film, and at the same time drives the thermoplastic film to move towards the flanging member 3; the bottom film drives the thermoplastic film to move until one end of it is located above the flanging member 3, and the second negative pressure pipe 35 sucks the thermoplastic film under negative pressure to separate it from the bottom film; one end of the thermoplastic film moves to protrude from the flanging member 3, and the flanging member 3 bends the end of the thermoplastic film in sequence through negative pressure suction, positive pressure blowing, and negative pressure suction; the other end of the thermoplastic film moves to the flanging member 3, and the flanging member 3 continues to bend the thermoplastic film; the film laminating device 2 clamps the bent thermoplastic film and moves it above the workpiece to cover the thermoplastic film on the surface and both sides of the workpiece.

[0045] In the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, terms such as "first", "second", and other numerical terms used herein do not imply an order or sequence unless clearly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or section discussed above may be referred to as the second element, component, region, layer, or section.

[0047] Based on the above inspiration from the ideal embodiments of the present invention, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A PCBA circuit board film laminating device, characterized in that Comprising: A film feeding device (1), which is arranged on one side of the conveyor belt (4) and is used for conveying the thermoplastic film to be attached; A film laminating device (2), which is arranged above the conveyor belt (4) and is used for clamping the thermoplastic film and moving it above the workpiece; A flanging member (3), which is arranged on the side of the film feeding device (1) close to the conveyor belt (4), and the flanging member (3) is adapted to bend the thermoplastic film along the width direction of the thermoplastic film; Wherein, one end of the thermoplastic film moves to the flanging member (3), and the flanging member (3) makes a first bend on the thermoplastic film; subsequently, the other end of the thermoplastic film moves to the flanging member (3), and the flanging member (3) makes a second bend on the thermoplastic film; The film laminating device (2) clamps the bent thermoplastic film and moves it above the workpiece to cover the surface and both sides of the workpiece with the thermoplastic film.

2. The PCBA circuit board film laminating device according to claim 1, characterized in that The film feeding device (1) includes: a support frame (11), which is vertically arranged on one side of the conveyor belt (4); A film unwinding roller (12), which is rotatably arranged on the side wall of the support frame (11), and the thermoplastic film roll is sleeved on the outer wall of the film unwinding roller (12); A film winding roller (13), which is rotatably arranged on the side wall of the support frame (11) and is adapted to wind the used bottom film; A positioning plate (14), which is vertically fixed on the side wall of the support frame (11) and is parallel to the conveyor belt (4); A guiding plate (15), which is arranged above the positioning plate (14), and there is a gap greater than the thickness of the thermoplastic film between the guiding plate (15) and the positioning plate (14); The flanging member (3) is arranged on the outer side wall of the positioning plate (14) and is on the same horizontal plane as the surface of the positioning plate (14); Wherein, the film winding roller (13) rotates to wind the bottom film until one end of the thermoplastic film moves above the flanging member (3), and the flipping member adsorbs the thermoplastic film through negative pressure to separate the thermoplastic film from the bottom film; After the thermoplastic film is separated from the bottom film, it moves towards the flanging member (3) and protrudes from the flanging member (3). The flanging member (3) completes the bending of the end of the thermoplastic film in sequence by means of negative pressure suction, positive pressure blowing, and negative pressure suction.

3. The PCBA circuit board film laminating device according to claim 2, characterized in that The flanging member (3) includes: a flanging plate (30), which is arranged on the outer side wall of the positioning plate (14); An air supply pipe (31), which extends along the length direction of the flanging plate (30), and a plurality of air supply holes (32) are opened on the outer wall of the air supply pipe (31), and the air supply holes (32) penetrate the upper surface of the flanging plate (30); A first negative pressure pipe (33), which is arranged on the outer side of the air supply pipe (31), and a plurality of first negative pressure holes (34) are opened on the outer wall of the first negative pressure pipe (33); A second negative pressure pipe (35), which is arranged on the side of the air supply pipe (31) away from the first negative pressure pipe (33), and a plurality of second negative pressure holes (36) are opened on the outer wall of the second negative pressure pipe (35); Wherein, the film winding roller (13) rotates to wind the bottom film until one end of the thermoplastic film moves above the second negative pressure hole (36), and the second negative pressure pipe (35) sucks the thermoplastic film through negative pressure to separate it from the bottom film.

4. The PCBA circuit board film laminating device according to claim 3, characterized in that The air supply duct (31) is communicated with a compressed air pump, and the air volume blown out from the air supply holes (32) is adjustable; The first negative pressure pipe (33) and the second negative pressure pipe (35) are respectively communicated with a negative pressure air pump; Wherein, when the first negative pressure hole (34) adsorbs the thermoplastic film by negative pressure, the air supply holes (32) blow air outwards to make the thermoplastic film expand upwards; When the second negative pressure hole (36) adsorbs the thermoplastic film by negative pressure, the air supply volume of the air supply holes (32) increases.

5. The PCBA circuit board film pasting device according to claim 3, characterized in that The film feeding device (1) further includes a cutting knife (16), which is slidably arranged above the positioning plate (14), and the cutting knife (16) is arranged at the positioning plate (14) close to the second negative pressure hole (36).

6. The PCBA circuit board film pasting device according to claim 1, characterized in that The film pasting device (2) includes: a film pasting bracket (21), which is arranged above the conveyor belt (4); Two manipulators (22), the manipulators (22) are slidably arranged on the side wall of the film pasting bracket (21), and are adapted to clamp and horizontally move the thermoplastic film; An infrared heating lamp (23), which is arranged on the side wall of the film pasting bracket (21) and is located above the workpiece.

7. The PCBA circuit board film pasting device according to claim 6, characterized in that A lifting jacking device (43) is arranged in the conveyor belt (4), and the jacking device (43) is adapted to drive the workpiece to move up and down; Wherein, after the manipulator (22) clamps the thermoplastic film and horizontally moves it above the workpiece, the jacking device (43) moves upwards to make the thermoplastic film cover the surface and both side surfaces of the workpiece.

8. The PCBA circuit board film pasting device according to claim 1, characterized in that A loading box (41) is arranged on one side of the conveyor belt (4), and the workpiece is placed horizontally in the loading box (41); A loading push block (42) is arranged on the side of the loading box (41) away from the conveyor belt (4), and the loading push block (42) is adapted to push the workpiece in the loading box (41) onto the conveyor belt (4).

9. The PCBA circuit board film pasting device according to claim 2, characterized in that The length of the guiding plate (15) is greater than the length of the positioning plate (14); A plurality of third negative pressure holes (17) are formed in the bottom wall of the guiding plate (15) away from the positioning plate (14), and the third negative pressure holes (17) face the bottom film; Wherein, when the winding roller (13) stops winding, the third negative pressure holes (17) are adapted to suck the bottom film on the bottom wall of the guiding plate (15) by negative pressure to make it fit with the bottom wall of the guiding plate (15).

10. A circuit board film feeding device, characterized in that, Comprising: A film feeding device (1), which is used for conveying the thermoplastic film to be pasted; A flanging member (3), which is arranged on the side of the film feeding device (1) close to the workpiece; The flanging member (3) includes: a flanging plate (30), which is arranged on the outer side wall of the film feeding device (1); Air supply holes (32), and a plurality of the air supply holes (32) are evenly distributed along the length direction of the flanging plate (30); The first negative pressure hole (34) and the second negative pressure hole (36), the first negative pressure hole (34) and the second negative pressure hole (36) are symmetrically arranged on both sides of the air supply hole (32), and the first negative pressure hole (34) is arranged on the side of the flanging member (3) away from the film feeding device (1); A plurality of the first negative pressure holes (34) and the second negative pressure holes (36) are evenly distributed along the length direction of the flanging plate (30); Wherein, the winding roller (13) rotates to wind the bottom film until one end of the thermoplastic film moves above the second negative pressure hole (36), and the second negative pressure pipe (35) sucks the thermoplastic film under negative pressure to separate it from the bottom film; After the thermoplastic film is separated from the bottom film, it moves towards the flanging member (3) and protrudes from the flanging member (3). The first negative pressure hole (34), the air supply hole (32) and the second negative pressure hole (36) work in sequence to bend the end of the thermoplastic film.

11. The circuit board film feeding device according to claim 10, wherein The air supply hole (32) is communicated with a compression pump, and the air volume blown out by the air supply hole (32) is adjustable; The first negative pressure hole (34) and the second negative pressure hole (36) are respectively communicated with a negative pressure air pump; Wherein, when the first negative pressure hole (34) sucks the thermoplastic film under negative pressure, the air supply hole (32) blows air outwards to make the thermoplastic film expand upwards; When the second negative pressure hole (36) sucks the thermoplastic film under negative pressure, the air volume blown out by the air supply hole (32) increases.

12. A film - pasting method of a film - pasting device, characterized in that, Using the PCBA circuit board film sticking device according to any one of claims 1-9, the film sticking method includes: After the thermoplastic film roll is installed on the unwinding roller (12), the bottom film is wound on the winding roller (13) through the gap between the positioning plate (14) and the guiding plate (15). The winding roller (13) rotates to wind the bottom film, and at the same time drives the thermoplastic film to move towards the flanging member (3); The bottom film drives the thermoplastic film to move until one end of it is located above the flanging member (3), and the second negative pressure pipe (35) sucks the thermoplastic film under negative pressure to separate it from the bottom film; One end of the thermoplastic film moves to protrude from the flanging member (3), and the flanging member (3) bends the end of the thermoplastic film by negative pressure suction, positive pressure blowing, and negative pressure suction in sequence; The other end of the thermoplastic film moves to the flanging member (3), and the flanging member (3) continues to bend the thermoplastic film; The film sticking device (2) clamps the bent thermoplastic film and moves it above the workpiece to cover the surface and both sides of the workpiece with the thermoplastic film.

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