Packaging process of mini-LED with silica gel lens

Abstract

The invention discloses a packaging process of a mini-LED with a silica gel lens, and relates to the technical field of LEDs. The preparation method specifically comprises the following steps: S1, weighing silica gel, KSF red powder, an organic silicon light diffusant and a fumed silica anti-precipitating agent, uniformly mixing, and carrying out vacuum defoaming treatment to obtain fluorescent glue; s2, after tinning on the substrate, fixing a flip chip on the surface of the solder paste by using a die bonder, cleaning, coating the surface of the flip chip with fluorescent glue, hot-pressing, cutting into units, curing and splitting to obtain a qualified product; s3, dispensing silica gel on the surface of the fluorescent layer of the qualified product, leveling at room temperature, laminating a silica gel lens in a nitrogen atmosphere, and curing to obtain a qualified product containing the lens; and S4, the qualified product containing the lens is braided and packaged, and the mini-LED lamp is obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and specifically to a packaging process for mini-LEDs with silicone lenses. Background Art

[0002] Nanocrystal self-assembly technology (NCSP) is an advanced display technology that realizes high-performance optical materials and devices through the self-assembly of nanocrystals. Currently, NCSP technology is mainly applied in the display field, especially in combination with quantum dots (QD) and KSF phosphors to improve display performance.

[0003] In Mini-backlight displays, NCSP technology is often combined with quantum dot films to form a blue light NCSP+QD film. The principle is to utilize the characteristics of quantum dots and integrate nanocrystals into the LED backlight or display layer through self-assembly technology, thereby achieving a high color gamut and high brightness. The advantages of this solution include: wide color gamut: Quantum dots can precisely control the wavelength of light, achieving high color gamuts such as DCI-P3 or Adobe RGB; high brightness: The light conversion efficiency of quantum dots is high, enhancing the display brightness; energy saving: Quantum dots can utilize the backlight more efficiently, reducing energy consumption. However, this solution also has disadvantages: high cost: Quantum dot materials (such as cadmium-based quantum dots or indium phosphide quantum dots) are expensive, increasing the overall cost.

[0004] Another application is the combination of NCSP and KSF phosphors for achieving high color gamut displays. The advantages of this solution include: relatively low cost, cadmium-free and environmentally friendly, and easy to integrate; however, KSF phosphors also have some disadvantages: poor material stability (humidity, heat, light decay), challenges in color uniformity, limited color gamut and red light efficiency, environmental and health risks, and when NSCP is cut, the KSF phosphor is exposed to the air and easily reacts with the air, affecting the reliability of the LED.

[0005] In summary, to solve the above problems, it is of great significance to provide a packaging process for mini-LEDs with good reliability. Summary of the Invention

[0006] The purpose of the present invention is to provide a packaging process for mini-LEDs with silicone lenses to solve the problems raised in the prior art.

[0007] To achieve the above purpose, the present invention provides the following technical solutions: A packaging process for mini-LEDs with silicone lenses, comprising the following steps: S1: Weigh silicone, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-precipitant, mix them evenly, and perform vacuum degassing treatment to obtain a fluorescent glue; S2: After tin - plating the substrate, use a die bonder to fix the flip - chip on the surface of the solder paste, clean it, coat the surface of the flip - chip with a fluorescent glue, perform hot - pressing, cut it into units, cure it, and perform spectroscopy to obtain qualified products; S3: Dot silicone on the surface of the fluorescent layer of the qualified product, level it at room temperature, and bond a silicone lens in a nitrogen atmosphere, then cure it to obtain a qualified product with a lens; S4: Tape and package the qualified product with a lens to obtain a mini - LED lamp.

[0008] More preferably, in step S2, the process of hot - pressing is as follows: the temperature is 60 - 70 °C, and the time is 10 - 15 min; the process of curing is as follows: the temperature is 140 - 150 °C, and the time is 1 - 1.5 h; In step S3, the process of curing is as follows: the temperature is 140 - 150 °C, and the time is 20 - 30 min.

[0009] More preferably, the fluorescent glue includes silicone, KSF red powder, silicone - based light diffusing agent, and fumed silica anti - precipitation agent with a mass ratio of 100:50:1.5:1.

[0010] More preferably, the preparation method of the silicone lens includes the following steps: (1) Mix hydrogen - containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier, stir at 30 - 35 °C for 1 - 2 h, and perform vacuum degassing treatment for 20 - 30 min to obtain an optical glue; (2) Inject the optical glue into a lens mold, close the upper and lower molds, cure at 140 - 150 °C for 20 - 30 min, and demold to obtain a silicone lens.

[0011] More preferably, the optical glue includes hydrogen - containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4 - 4.5:0.002 - 0.003:0.8 - 1.

[0012] More preferably, the preparation method of the modifier includes the following steps: Add modified nano - zirconia into N,N - dimethylformamide, disperse it evenly by ultrasonic wave, add methyl methacrylate, diallyl diphenylsilane, and azobisisobutyronitrile, stir at 60 - 70 °C for 1 - 2 h, add triallyl phosphite, and continue to stir for 1 - 1.5 h, then evaporate the solvent to obtain the modifier.

[0013] More preferably, the modifier includes the following raw materials, by mass: 2 - 3 parts of modified nano - zirconia, 20 - 30 parts of N,N - dimethylformamide, 30 - 34 parts of methyl methacrylate, 2 - 4 parts of diallyl diphenylsilane, 0.05 - 0.1 part of azobisisobutyronitrile, and 1 - 2 parts of triallyl phosphite.

[0014] More preferably, the preparation method of the modified nano-zirconia includes the following steps: (1) adding nano-zirconia into 60% ethanol aqueous solution, ultrasonically dispersing evenly, adding 3-aminopropyltriethoxysilane, stirring at 40-50 °C for 3-5 h, filtering, washing, and drying to obtain amino-modified nano-zirconia; (2) adding the amino-modified nano-zirconia into deionized water, ultrasonically dispersing evenly, adding methacrylic acid and an activator, stirring at 70-80 °C for 1-2 h, filtering, washing, and drying to obtain the modified nano-zirconia.

[0015] More preferably, the amino-modified nano-zirconia comprises the following raw materials in parts by mass: 2-3 parts of nano-zirconia, 70-80 parts of 60% ethanol aqueous solution, and 2-3 parts of 3-aminopropyltriethoxysilane; The modified nano-zirconia comprises the following raw materials in parts by mass: 2-3 parts of amino-modified nano-zirconia, 40-50 parts of deionized water, 2-4 parts of methacrylic acid, and 2-3 parts of an activator.

[0016] Among them, the activator comprises 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide and N-hydroxysuccinimide with a mass ratio of 1:1-1.5.

[0017] Compared with the prior art, the beneficial effects of the present application are as follows: (1) In the original NCSP high-color gamut scheme of the present invention, a silica gel lens is added, which can prevent the oxidation caused by the exposure of the KSF phosphor to the air after NSCP cutting, thereby reducing the reliability and optical performance. On the other hand, the added silica gel lens helps to concentrate the light, thereby increasing the lighting efficiency, improving the lighting uniformity, and increasing the reliability.

[0018] (2) In the present invention, a silica gel lens is prepared by compounding a hydrogen-containing phenyl silicone resin and a vinyl phenyl silicone resin in a certain proportion and curing through hydrosilylation. The obtained silica gel lens has a good refractive index. If the proportion of the hydrogen-containing phenyl silicone resin is too small, the excessive vinyl cannot react with it, and the curing is likely to be incomplete, and the lens structure is too soft to be used; while if the proportion of the hydrogen-containing phenyl silicone resin is too large, during the curing process, it will undergo a dehydrogenation reaction with the water in the air, easily generating bubbles and reducing the performance of the silica gel lens.

[0019] (3) During the preparation of the silicone lens of the present invention, a nano-zirconia modifier grafted with polymethyl methacrylate is also introduced. Polymethyl methacrylate has good transmittance, low cost, and excellent processing performance. Introducing it into the silicone lens is also beneficial to improving the dimensional accuracy and increasing the yield rate. Nano-zirconia has excellent refractive index, which helps to improve the optical performance of the silicone lens and also helps to improve the mechanical properties of the lens. By polymerizing and grafting nano-zirconia containing alkenyl groups with methyl methacrylate, the present invention also improves the dispersion of nano-zirconia in the system, thereby enhancing the comprehensive performance of the lens. And diallyldiphenylsilane and triallyl phosphite are introduced for copolymerization: introducing diallyldiphenylsilane can improve its compatibility with phenyl silicone resin, and the phenyl group can further improve the thermal stability as a rigid structure; while triallyl phosphite can increase the crosslinking degree and react with silicon hydride, and the phosphite structure therein also helps to reduce the yellowing phenomenon and improve the reliability of the silicone lens. Detailed Embodiments

[0020] Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] It should be noted that there are no special restrictions on the purchasing manufacturers of all raw materials involved in the present invention. Exemplarily, they include: nano-zirconia with a particle size of 60 - 80 nm, provided by Shanghai Yunfu Nano Technology Co., Ltd.; the CAS number of 3-aminopropyltriethoxysilane: 919-30-2; the CAS number of methacrylic acid: 79-41-4; the CAS number of methyl methacrylate: 80-62-6; the CAS number of diallyldiphenylsilane: 10519-88-7; the CAS number of triallyl phosphite: 102-84-1; hydrogen-containing phenyl silicone resin with a viscosity of 1200 - 1400, provided by Shanghai Kelaman Reagent Co., Ltd.; vinyl phenyl silicone resin with a viscosity of 8000 - 10000, provided by Shanghai Kelaman Reagent Co., Ltd.; silicone, CL1000, provided by Dow Corning Corporation; KSF red powder, LD-3 / F2, D50: 30 - 35 μm, provided by Jiangsu Brilliant Optoelectronics Co., Ltd.; silicone-based light diffusing agent: KMP-590, provided by Suzhou Bingsheng New Materials Technology Co., Ltd.; gas-phase silicon dioxide anti-settling agent: QS102, provided by Boruida (Dongguan) New Materials Co., Ltd.

[0022] Among them, in the following embodiments, parts are parts by mass, and the raw materials mentioned above and used in the following embodiments and comparative examples but not mentioned are all commercially available.

[0023] Example 1: Step 1: Preparation of modified nano-zirconia: (1) Add 2.5 parts of nano-zirconia to 75 parts of 60% ethanol aqueous solution, ultrasonically disperse evenly, add 2.5 parts of 3-aminopropyltriethoxysilane, stir at 45 °C for 4 h, filter, wash, and dry to obtain amino-modified nano-zirconia; (2) Add 2.5 parts of amino-modified nano-zirconia to 45 parts of deionized water, ultrasonically disperse evenly, add 3 parts of methacrylic acid and 2.5 parts of activator, stir at 75 °C for 1.5 h, filter, wash, and dry to obtain modified nano-zirconia; Step 2: Preparation of modifier: Add 2.5 parts of modified nano-zirconia to 25 parts of N,N-dimethylformamide, ultrasonically disperse evenly, add 32 parts of methyl methacrylate, 3 parts of diallyldiphenylsilane, 0.05 part of azobisisobutyronitrile, stir at 65 °C for 1.5 h, add 1.5 parts of triallyl phosphite, continue to stir for 1.5 h, evaporate N,N-dimethylformamide to obtain the modifier; Step 3: Preparation of silicone lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4.2:0.002:0.9, stir at 35 °C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain optical glue; (2) Inject the optical glue into the lens mold, close the upper and lower molds, cure at 145 °C for 25 min, and demold to obtain a silicone lens; Step 4: Preparation of mini-LED lamp: S1: Weigh and mix silicone, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-settling agent with a mass ratio of 100:50:1.5:1 evenly, and perform vacuum degassing treatment to obtain fluorescent glue; S2: After soldering tin on the substrate, use a die bonder to fix the flip chip on the surface of the solder paste, clean, coat the fluorescent glue on the surface of the flip chip, hot press at 65 °C for 15 min, cut into units, cure at 145 °C for 1.5 h, and perform spectroscopy to obtain qualified products; S3: Dot silicone on the surface of the qualified product fluorescent layer, level at room temperature for 4 min, in a nitrogen atmosphere, bond the silicone lens, and cure at 145 °C for 25 min to obtain a qualified product with a lens; S4: Tape and package the qualified product with a lens to obtain a mini-LED lamp.

[0024] Example 2: Step 1: Preparation of modified nano-zirconia: (1) Add 2.5 parts of nano-zirconia to 75 parts of 60% ethanol aqueous solution, ultrasonically disperse evenly, add 2.5 parts of 3-aminopropyltriethoxysilane, stir at 45 °C for 4 h, filter, wash, and dry to obtain amino-modified nano-zirconia; (2) Add 2.5 parts of amino-modified nano-zirconia into 45 parts of deionized water and disperse evenly by ultrasonic treatment. Then add 3 parts of methacrylic acid and 2.5 parts of activator, stir at 75 °C for 1.5 h, filter, wash, and dry to obtain modified nano-zirconia. Step 2: Preparation of modifier: Add 2.5 parts of modified nano-zirconia into 25 parts of N,N-dimethylformamide and disperse evenly by ultrasonic treatment. Then add 32 parts of methyl methacrylate, 3 parts of diallyldiphenylsilane, and 0.05 part of azobisisobutyronitrile, stir at 65 °C for 1.5 h, add 1.5 parts of triallyl phosphite, and continue to stir for 1.5 h. Evaporate N,N-dimethylformamide to obtain the modifier. Step 3: Preparation of silica gel lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4.5:0.003:1, stir at 35 °C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain optical glue. (2) Inject the optical glue into a lens mold, close the upper and lower molds, cure at 150 °C for 20 min, and demold to obtain a silica gel lens. Step 4: Preparation of mini-LED lamp: S1: Weigh silica gel, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-settling agent with a mass ratio of 100:50:1.5:1, mix evenly, and perform vacuum degassing treatment to obtain fluorescent glue. S2: After soldering tin on the substrate, use a die bonder to fix the flip chip on the surface of the solder paste, clean, coat the fluorescent glue on the surface of the flip chip, perform hot pressing at 65 °C for 15 min, cut into units, cure at 145 °C for 1.5 h, and perform spectroscopy to obtain qualified products. S3: Dot silica gel on the surface of the qualified product fluorescent layer, level at room temperature for 4 min, bond the silica gel lens in a nitrogen atmosphere, and cure at 145 °C for 25 min to obtain a qualified product with a lens. S4: Tape and package the qualified product with a lens to obtain a mini-LED lamp.

[0025] Example 3: Step 1: Preparation of modified nano-zirconia: (1) Add 2.5 parts of nano-zirconia into 75 parts of 60% ethanol aqueous solution and disperse evenly by ultrasonic treatment. Then add 2.5 parts of 3-aminopropyltriethoxysilane, stir at 45 °C for 4 h, filter, wash, and dry to obtain amino-modified nano-zirconia. (2) Add 2.5 parts of amino-modified nano-zirconia into 45 parts of deionized water and disperse evenly by ultrasonic treatment. Then add 3 parts of methacrylic acid and 2.5 parts of activator, stir at 75 °C for 1.5 h, filter, wash, and dry to obtain modified nano-zirconia. Step 2: Preparation of modifier: Add 2.5 parts of modified nano-zirconia into 25 parts of N,N-dimethylformamide, disperse evenly by ultrasonic wave, then add 32 parts of methyl methacrylate, 3 parts of diallyl diphenyl silane, and 0.05 part of azodiisobutyronitrile. Stir at 65°C for 1.5 h, add 1.5 parts of triallyl phosphite, continue stirring for 1.5 h, and evaporate N,N-dimethylformamide to obtain the modifier; Step 3: Preparation of silica gel lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4:0.002:0.8, stir at 35°C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain optical glue; (2) Inject the optical glue into the lens mold, close the upper and lower molds, cure at 140°C for 30 min, and demold to obtain the silica gel lens; Step 4: Preparation of mini-LED lamp: S1: Weigh silica gel, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-settling agent with a mass ratio of 100:50:1.5:1, mix evenly, and perform vacuum degassing treatment to obtain fluorescent glue; S2: After soldering tin on the substrate, use a die bonder to fix the flip chip on the surface of the solder paste, clean it, coat the fluorescent glue on the surface of the flip chip, perform hot pressing at 65°C for 15 min, cut into units, cure at 145°C for 1.5 h, and perform spectroscopy to obtain qualified products; S3: Dot silica gel on the surface of the qualified product's fluorescent layer, level at room temperature for 4 min, bond the silica gel lens in a nitrogen atmosphere, and cure at 145°C for 25 min to obtain a qualified product with a lens; S4: Tape and package the qualified product with a lens to obtain a mini-LED lamp.

[0026] Comparative Example 1: Based on Example 1, without adding the modifier, and the rest of the processes remain unchanged. The details are as follows: Step 1: Preparation of silica gel lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, and platinum catalyst with a mass ratio of 3:4.2:0.002, stir at 35°C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain optical glue; (2) Inject the optical glue into the lens mold, close the upper and lower molds, cure at 145°C for 25 min, and demold to obtain the silica gel lens; Step 2: Preparation of mini-LED lamp: S1: Weigh silica gel, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-settling agent with a mass ratio of 100:50:1.5:1, mix evenly, and perform vacuum degassing treatment to obtain fluorescent glue; S2: After tin - plating the substrate, use a die bonder to fix the flip - chip on the surface of the solder paste, clean it, coat the surface of the flip - chip with fluorescent glue, hot - press at 65 °C for 15 min, cut it into units, cure at 145 °C for 1.5 h, and perform spectroscopy to obtain qualified products; S3: Dot silicone on the surface of the qualified product's fluorescent layer, level it at room temperature for 4 min, and bond a silicone lens in a nitrogen atmosphere, then cure at 145 °C for 25 min to obtain a qualified product with a lens; S4: Tape and package the qualified product with a lens to obtain a mini - LED lamp.

[0027] Comparative Example 2: Based on Example 1, the addition ratios of the hydrogen - containing phenyl silicone resin and vinyl phenyl silicone resin are exchanged, and the rest of the processes remain unchanged. Specifically as follows: Step 1: Preparation of modified nano - zirconia: (1) Add 2.5 parts of nano - zirconia to 75 parts of 60% ethanol aqueous solution, ultrasonically disperse it evenly, add 2.5 parts of 3 - aminopropyltriethoxysilane, stir at 45 °C for 4 h, filter, wash, and dry to obtain amino - modified nano - zirconia; (2) Add 2.5 parts of amino - modified nano - zirconia to 45 parts of deionized water, ultrasonically disperse it evenly, add 3 parts of methacrylic acid and 2.5 parts of activator, stir at 75 °C for 1.5 h, filter, wash, and dry to obtain modified nano - zirconia; Step 2: Preparation of the modifier: Add 2.5 parts of modified nano - zirconia to 25 parts of N,N - dimethylformamide, ultrasonically disperse it evenly, add 32 parts of methyl methacrylate, 3 parts of diallyldiphenylsilane, 0.05 part of azobisisobutyronitrile, stir at 65 °C for 1.5 h, add 1.5 parts of triallyl phosphite, continue to stir for 1.5 h, and evaporate N,N - dimethylformamide to obtain the modifier; Step 3: Preparation of the silicone lens: (1) Mix the hydrogen - containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 4.2:3:0.002:0.9, stir at 35 °C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain an optical glue; (2) Inject the optical glue into a lens mold, close the upper and lower molds, cure at 145 °C for 25 min, and demold to obtain a silicone lens; Step 4: Preparation of the mini - LED lamp: S1: Weigh and mix silicone, KSF red powder, organosilicon light - diffusing agent, and fumed silica anti - precipitation agent with a mass ratio of 100:50:1.5:1 evenly, and perform vacuum degassing treatment to obtain fluorescent glue; S2: After tin - plating the substrate, use a die bonder to fix the flip - chip on the surface of the solder paste, clean it, coat the surface of the flip - chip with fluorescent glue, hot - press at 65 °C for 15 min, cut it into units, cure at 145 °C for 1.5 h, and perform spectroscopy to obtain qualified products; S3: Dot silicone on the surface of the qualified fluorescent layer, level it at room temperature for 4 min, bond the silicone lens under a nitrogen atmosphere, and cure it at 145 °C for 25 min to obtain a qualified product with a lens. S4: Tape and package the qualified product with a lens to obtain a mini-LED lamp.

[0028] Comparative Example 3: Based on Example 1, only methyl methacrylate was added during the preparation of the modifier, and the rest of the processes remained unchanged. The details are as follows: Step 1: Preparation of modified nano-zirconia: (1) Add 2.5 parts of nano-zirconia to 75 parts of 60% ethanol aqueous solution, ultrasonically disperse it evenly, add 2.5 parts of 3-aminopropyltriethoxysilane, stir at 45 °C for 4 h, filter, wash, and dry to obtain amino-modified nano-zirconia. (2) Add 2.5 parts of amino-modified nano-zirconia to 45 parts of deionized water, ultrasonically disperse it evenly, add 3 parts of methacrylic acid and 2.5 parts of activator, stir at 75 °C for 1.5 h, filter, wash, and dry to obtain modified nano-zirconia. Step 2: Preparation of the modifier: Add 2.5 parts of modified nano-zirconia to 25 parts of N,N-dimethylformamide, ultrasonically disperse it evenly, add 36.5, stir at 65 °C for 3 h, evaporate N,N-dimethylformamide to obtain the modifier. Step 3: Preparation of the silicone lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4.2:0.002:0.9, stir at 35 °C for 1.5 h, and perform vacuum degassing treatment for 25 min to obtain an optical adhesive. (2) Inject the optical adhesive into the lens mold, close the upper and lower molds, cure at 145 °C for 25 min, and demold to obtain a silicone lens. Step 4: Preparation of the mini-LED lamp: S1: Weigh and mix silicone, KSF red powder, organosilicon light diffusing agent, and gas-phase silica anti-settling agent with a mass ratio of 100:50:1.5:1 evenly, and perform vacuum degassing treatment to obtain a fluorescent adhesive. S2: After tinning on the substrate, use a die bonder to fix the flip chip on the surface of the solder paste, clean it, coat the fluorescent adhesive on the surface of the flip chip, perform hot pressing at 65 °C for 15 min, cut it into units, cure at 145 °C for 1.5 h, and perform spectral analysis to obtain qualified products. S3: Dot silicone on the surface of the qualified fluorescent layer, level it at room temperature for 4 min, bond the silicone lens under a nitrogen atmosphere, and cure it at 145 °C for 25 min to obtain a qualified product with a lens. S4: Tape and package the qualified product with a lens to obtain a mini-LED lamp.

[0029] Comparative Example 4: Based on Example 1, triallyl phosphite was not added during the preparation of the modifier, and the rest of the process remained unchanged. The specific steps are as follows: Step 1: Preparation of modified nano-zirconia: (1) Add 2.5 parts of nano-zirconia to 75 parts of 60% ethanol aqueous solution and disperse it evenly by ultrasonic treatment. Then add 2.5 parts of 3-aminopropyltriethoxysilane and stir at 45°C for 4 hours. Filter, wash, and dry to obtain amino-modified nano-zirconia; (2) Add 2.5 parts of amino-modified nano-zirconia to 45 parts of deionized water and disperse it evenly by ultrasonic treatment. Then add 3 parts of methacrylic acid and 2.5 parts of activator, and stir at 75°C for 1.5 hours. Filter, wash, and dry to obtain modified nano-zirconia; Step 2: Preparation of the modifier: Add 2.5 parts of modified nano-zirconia to 25 parts of N,N-dimethylformamide and disperse it evenly by ultrasonic treatment. Then add 33.5 parts of methyl methacrylate, 3 parts of diallyldiphenylsilane, and 0.05 part of azobisisobutyronitrile, and stir at 65°C for 3 hours. Evaporate N,N-dimethylformamide to obtain the modifier; Step 3: Preparation of the silicone lens: (1) Mix hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst, and modifier with a mass ratio of 3:4.2:0.002:0.9 and stir at 35°C for 1.5 hours, then perform vacuum degassing treatment for 25 minutes to obtain the optical adhesive; (2) Inject the optical adhesive into the lens mold, close the upper and lower molds, cure at 145°C for 25 minutes, and demold to obtain the silicone lens; Step 4: Preparation of the mini-LED lamp: S1: Weigh and mix silicone, KSF red powder, organosilicon light diffusing agent, and fumed silica anti-settling agent with a mass ratio of 100:50:1.5:1 evenly, and perform vacuum degassing treatment to obtain the fluorescent adhesive; S2: After soldering tin on the substrate, use a die bonder to fix the flip chip on the surface of the solder paste, clean it, coat the fluorescent adhesive on the surface of the flip chip, perform hot pressing at 65°C for 15 minutes, cut it into units, cure at 145°C for 1.5 hours, and perform spectral analysis to obtain qualified products; S3: Dot silicone on the surface of the qualified product's fluorescent layer, level it at room temperature for 4 minutes, and bond the silicone lens in a nitrogen atmosphere, then cure at 145°C for 25 minutes to obtain a qualified product with a lens; S4: Tape and package the qualified product with a lens to obtain the mini-LED lamp.

[0030] Performance test: (1) The refractive index of the silicone lenses in each example and comparative example was measured using an Abbe refractometer, and the experimental data are shown in Table 1; (2) The silicone lenses prepared in each example and comparative example were taken, and under a nitrogen atmosphere, the temperature was gradually increased from 25 °C to 700 °C at a rate of 10 °C / min, and thermogravimetric analysis was performed using a thermogravimetric analyzer to measure the decomposition temperature, and the experimental data are shown in Table 1.

[0031] Table 1 Project Refractive index Decomposition temperature / °C Example 1 1.572 522 Example 2 1.568 510 Example 3 1.568 516 Comparative Example 1 1.510 442 Comparative Example 2 1.517 458 Comparative Example 3 1.542 468 Comparative Example 4 1.565 482 Conclusion: As can be seen from Table 1, in Comparative Example 1, without adding a modifier, the refractive index was significantly lower than that of Example 1, and the thermal stability decreased to a certain extent; in Comparative Example 2, the addition ratios of the hydrogen-containing phenyl silicone resin and the vinyl phenyl silicone resin were exchanged, and the hydrogen in the hydrogen-containing phenyl silicone resin could not be cross-linked and underwent a dehydrogenation reaction with water in the air, easily generating bubbles, resulting in a decrease in refractive index and a decrease in thermal stability; in Comparative Example 3, only methyl methacrylate was added during the preparation of the modifier for polymerization, lacking a benzene group, resulting in a decrease in compatibility, a decrease in thermal stability, and a decrease in refractive index; in Comparative Example 4, triallyl phosphite was not added during the preparation of the modifier for polymerization, resulting in a decrease in cross-linkability and thermal stability inferior to that of Example 1.

[0032] In summary, in the present invention, a nano-zirconia modifier grafted with polymethyl methacrylate is further introduced during the preparation of the silicone lens, successfully providing a packaging process for a mini-LED with a silicone lens, having good reliability, good refractive index of the prepared silicone lens, and good thermal stability.

[0033] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging process for mini-LED with silicone lens, characterized in that: The following steps are involved: S1: Weigh silica gel, KSF red powder, silicone light diffuser, and fumed silica anti-precipitation agent, mix them evenly, and perform vacuum degassing to obtain fluorescent glue; S2: After the substrate is tinned, a die bonding machine is used to fix the flip chip on the surface of the solder paste, clean it, apply fluorescent glue on the surface of the flip chip, heat press it, cut it into units, cure it, and split it to obtain qualified products; S3: Apply silica gel on the surface of the fluorescent layer of the qualified product, level it at room temperature, attach the silica gel lens under nitrogen atmosphere, and cure it to obtain a qualified product containing a lens; S4: Tape and package the qualified products containing lenses to obtain mini-LED lamps.

2. The packaging process of a mini-LED with a silicone lens according to claim 1, characterized in that: In step S2, the hot pressing process is as follows: the temperature is 60-70°C and the time is 10-15 minutes, and the curing process is as follows: the temperature is 140-150°C and the time is 1-1.5 hours; In step S3, the curing process is as follows: the temperature is 140-150° C. and the time is 20-30 min.

3. The packaging process of a mini-LED with a silicone lens according to claim 1, characterized in that: The fluorescent glue includes silica gel, KSF red powder, silicone light diffuser, and fumed silica anti-precipitation agent in a mass ratio of 100:50:1.5:

1.

4. The packaging process of a mini-LED with a silicone lens according to claim 1, characterized in that: The preparation method of the silicone lens comprises the following steps: (1) mixing hydrogenated phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst and modifier, stirring at 30-35° C. for 1-2 hours, and vacuum degassing for 20-30 minutes to obtain optical glue; (2) Inject the optical glue into the lens mold, close the upper and lower films, cure at 140-150°C for 20-30 minutes, and demold to obtain a silicone lens.

5. The packaging process of a mini-LED with a silicone lens according to claim 4, characterized in that: The optical adhesive comprises hydrogen-containing phenyl silicone resin, vinyl phenyl silicone resin, platinum catalyst and modifier in a mass ratio of 3:4-4.5:0.002-0.003:0.8-1.

6. The packaging process of a mini-LED with a silicone lens according to claim 4, characterized in that: The preparation method of the modifier comprises the following steps: adding modified nano zirconium oxide to N,N-dimethylformamide for uniform ultrasonic dispersion, adding methyl methacrylate, diallyl diphenyl silane and azobisisobutyronitrile, stirring at 60-70°C for 1-2h, adding tripropylene phosphite, continuing stirring for 1-1.5h, and evaporating the solvent to obtain the modifier.

7. The packaging process of a mini-LED with a silicone lens according to claim 6, characterized in that: The modifier comprises the following raw materials, calculated by mass: 2-3 parts of modified nano zirconium oxide, 20-30 parts of N,N-dimethylformamide, 30-34 parts of methyl methacrylate, 2-4 parts of diallyldiphenylsilane, 0.05-0.1 parts of azobisisobutyronitrile, and 1-2 parts of tripropylene phosphite.

8. The packaging process of a mini-LED with a silicone lens according to claim 6, characterized in that: The preparation method of the modified nano zirconium oxide comprises the following steps: (1) adding nano zirconium oxide to a 60% ethanol aqueous solution and uniformly dispersing it by ultrasonication, adding 3-aminopropyltriethoxysilane, stirring at 40-50° C. for 3-5 hours, filtering, washing, and drying to obtain amino-modified nano zirconium oxide; (2) Add amino-modified nano-zirconia into deionized water and disperse it evenly by ultrasonication, add methacrylic acid and an activator, stir at 70-80°C for 1-2 hours, filter, wash, and dry to obtain modified nano-zirconia.

9. The packaging process of a mini-LED with a silicone lens according to claim 8, characterized in that: The amino-modified nano zirconium oxide comprises the following raw materials, calculated by mass: 2-3 parts of nano zirconium oxide, 70-80 parts of 60% ethanol aqueous solution, and 2-3 parts of 3-aminopropyltriethoxysilane; The modified nano zirconium oxide comprises the following raw materials, calculated by weight: 2-3 parts of amino-modified nano zirconium oxide, 40-50 parts of deionized water, 2-4 parts of methacrylic acid, and 2-3 parts of an activator.