Compression resin seal forming device

Abstract

Provided is a compression resin seal molding apparatus. The present invention relates to a compressed resin sealing molding device for molding a sealing resin layer, which seals a component (13) disposed on a first surface (10a) of a substrate (10) having the first surface (10a) and a second surface (10b) that form a front surface and a back surface with each other, and partially covers the first surface (10a) of the substrate (10), the compressed resin seal molding device is provided with: a lower die which is in contact with a first surface (10a); and an upper mold (5) that is in contact with the second surface (10b), the lower mold being provided with: a lower mold center section (32) having a lower mold center upper surface corresponding to the lower surface of the sealing resin layer; a die-drawing part (33) which is disposed so as to surround the lower die center part (32) and which is in contact with the first surface (10a); and a passage closing member (35). A cutout is provided in a portion of the inner periphery of the die-drawing section (33), and the passage closing member (35) is disposed inside the cutout. A cavity for melting and molding a resin material is formed by the inner peripheral side surface of the rapping part (33), the side surface of the passage closing member (35) on the opposite side from the rapping part (33), and the upper surface of the center of the lower mold. The drawing part (33) is provided with a pocket part which is a concave part and used for accommodating the resin material flowing out of the cavity, and the pocket part is closer to the outer side than the cavity. The passage closing member (35) is capable of obtaining a first state in which the passage closing member (35) is lowered to allow the resin material to flow out from the cavity to the bag section, and a second state in which the passage closing member (35) is raised to prevent the resin material from flowing out from the cavity to the bag section. The passage closing member (35) has an abutting surface facing upward at a predetermined height, and when viewed from a direction perpendicular to the center front surface of the lower mold, an end portion of the abutting surface on the side closer to the cavity is positioned on the side closer to the cavity than an outer edge of a first surface (10a). In the first state, an end portion of the contact surface on the side farther from the cavity is located on the side farther from the cavity than an outer edge of the first surface (10a), and in the second state, a portion of the contact surface is in surface contact with a portion of the first surface (10a).

Description

Technical Field

[0001] The present invention relates to a compression resin sealing and forming device. Background Art

[0002] Methods and devices for sealing using compression resin are described in Japanese Unexamined Patent Application Publication No. 2014-212251 (Patent Document 1) and Japanese Unexamined Patent Application Publication No. 2014-207302 (Patent Document 2). In the methods and devices described in Patent Document 1, by using a sheet resin formed by flattening a required amount of resin so as to have a required shape-retaining property and correspond to the shape of the lower mold cavity, the resin material can be evenly supplied and filled into the entire area of the lower mold cavity. In addition, since a sheet resin of a fixed quantity and shape can be used without considering the amount of excess resin, the metering operation and adjustment operation of the amount of resin supplied into the lower mold cavity can be omitted.

[0003] In the methods and devices described in Patent Document 2, the metering operation and adjustment operation of the amount of resin supplied into the lower mold cavity can be omitted, and the package can be formed into a specified thickness.

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2014-212251

[0005] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2014-207302

[0006] In the methods and devices described in Patent Documents 1 and 2, a receiving portion is provided around the lower mold cavity, and excess resin flows into the receiving portion. However, in the methods and devices described in Patent Documents 1 and 2, there is a problem that the excess resin flowing into the receiving portion cures in a state of contacting the surface of the substrate, resulting in a state where excess resin adheres to the outer edge portion of the obtained substrate. Summary of the Invention

[0007] Therefore, an object of the present invention is to provide a compression resin sealing and forming device that can prevent a state where resin overflowing from the mold cavity adheres to the surface of the outer edge portion of the substrate.

[0008] To achieve the above object, a compression resin sealing and forming device based on the present invention is as follows. That is,

[0009] A compression resin sealing and forming device for forming a sealing resin layer to seal a component disposed on a first surface of a substrate having a first surface and a second surface that form a front surface and a back surface with each other, and for locally covering the first surface of the substrate with the sealing resin layer,

[0010] Wherein,

[0011] The compression resin sealing and forming device includes:

[0012] A lower mold that abuts against the first surface described above; and

[0013] An upper mold that abuts against the second surface described above.

[0014] The above-mentioned lower mold includes:

[0015] A central portion of the lower mold, which has an upper surface of the central portion of the lower mold corresponding to the lower surface of the above-mentioned sealing resin layer;

[0016] A mold lifting portion, which is arranged to surround the central portion of the lower mold and abuts against the first surface described above; and

[0017] A passage closing member.

[0018] A notch is provided locally on the inner periphery of the above-mentioned mold lifting portion,

[0019] The above-mentioned passage closing member is arranged inside the above-mentioned notch.

[0020] A cavity for melting and forming a resin material is formed by the inner peripheral side surface of the above-mentioned mold lifting portion, the side surface of the above-mentioned passage closing member on the side opposite to the mold lifting portion, and the upper surface of the central portion of the lower mold.

[0021] The above-mentioned mold lifting portion has a pocket portion as a concave portion for accommodating the resin material flowing out of the above-mentioned cavity on the outside of the above-mentioned cavity.

[0022] The above-mentioned passage closing member can obtain a first state in which the resin material is allowed to flow from the above-mentioned cavity to the above-mentioned pocket portion by descending and a second state in which the resin material is blocked from flowing from the above-mentioned cavity to the above-mentioned pocket portion by ascending.

[0023] The above-mentioned passage closing member has a contact surface facing upward at a predetermined height,

[0024] When observed from a direction perpendicular to the front surface of the central portion of the lower mold,

[0025] The end portion of the above-mentioned contact surface closer to the above-mentioned cavity is located closer to the cavity than the outer edge of the above-mentioned first surface,

[0026] The end portion of the above-mentioned contact surface farther from the above-mentioned cavity is located farther from the cavity than the outer edge of the above-mentioned first surface,

[0027] In the above-mentioned second state, a partial surface contact is formed between a part of the above-mentioned contact surface and a part of the above-mentioned first surface.

[0028] According to the present invention, it is possible to allow the resin overflowing from the cavity to escape to the bag portion in the first state, and then to prevent the resin from flowing out by switching to the second state, so that it is possible to prevent the state where the resin overflowing from the cavity adheres to the surface of the outer edge portion of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 1 is a conceptual diagram of a compression resin sealing and molding apparatus according to Embodiment 1 of the present invention.

[0030] Figure 2 FIG. 2 is a perspective view of a lower mold included in the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention.

[0031] Figure 3 FIG. 3 is a top view of the lower mold included in the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention.

[0032] Figure 4 FIG. 4 is a perspective view of a passage closing member included in the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention.

[0033] Figure 5 FIG. 5 is a first partial cross-sectional view of the state after the passage closing member of the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention has descended.

[0034] Figure 6 FIG. 6 is a second partial cross-sectional view of the state after the passage closing member of the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention has descended.

[0035] Figure 7 FIG. 7 is a first partial cross-sectional view of the state after the passage closing member of the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention has ascended.

[0036] Figure 8 FIG. 8 is a second partial cross-sectional view of the state after the passage closing member of the compression resin sealing and molding apparatus according to Embodiment 1 of the present invention has ascended.

[0037] Figure 9 FIG. 9 is a first explanatory view of a compression resin sealing and molding apparatus according to Embodiment 2 of the present invention.

[0038] Figure 10 FIG. 10 is a second explanatory view of a compression resin sealing and molding apparatus according to Embodiment 2 of the present invention.

[0039] Figure 11 FIG. 11 is an explanatory view of the positional relationship of a plurality of stroke amount limiting member pieces included in the compression resin sealing and molding apparatus according to Embodiment 2 of the present invention.

[0040] Figure 12It is an explanatory diagram of the positional relationship of a plurality of stroke amount limiting component pieces included in the first modification of the compression resin sealing and forming device according to Embodiment 2 of the present invention.

[0041] Figure 13 It is an explanatory diagram of the positional relationship of a plurality of stroke amount limiting component pieces included in the second modification of the compression resin sealing and forming device according to Embodiment 2 of the present invention.

[0042] Figure 14 It is a conceptual diagram of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0043] Figure 15 It is a conceptual diagram of a modification of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0044] Figure 16 It is the first explanatory diagram of the operation of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0045] Figure 17 It is the second explanatory diagram of the operation of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0046] Figure 18 It is the third explanatory diagram of the operation of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0047] Figure 19 It is the fourth explanatory diagram of the operation of the compression resin sealing and forming device according to Embodiment 3 of the present invention.

[0048] Figure 20 It is a cross-sectional view of a product obtained as a result of the operation of the compression resin sealing and forming device according to Embodiment 3 of the present invention. Detailed Embodiments

[0049] The dimensional ratios shown in the drawings are not necessarily required to faithfully reflect the actual dimensional ratios, and for the sake of convenience in explanation, the dimensional ratios may sometimes be exaggerated. In the following description, when referring to the concepts of up or down, it does not necessarily mean up or down in the absolute sense, and sometimes it means up or down relative to the illustrated posture.

[0050] (Embodiment 1)

[0051] Refer to Figures 1 to 8 The compression resin sealing and forming device according to Embodiment 1 of the present invention will be described. In Figure 1 The outline of the compression resin sealing and forming device in the present embodiment is shown.

[0052] The compression resin sealing and forming device 101 is a compression resin sealing and forming device for forming a sealing resin layer, which seals the components arranged at the first surface 10a of a substrate 10 having a first surface 10a and a second surface 10b forming the front and back surfaces with each other, and locally covers the first surface 10a of the substrate 10 with the sealing resin layer. In Figure 1 the illustration of the components arranged at the first surface 10a of the substrate 10 is omitted.

[0053] The compression resin sealing and forming device 101 includes a lower mold 3 that abuts against the first surface 10a and an upper mold 5 that abuts against the second surface 10b. In Figure 2 the case where only the lower mold 3 is taken out is shown. In Figure 3 the top view of the lower mold 3 is shown. The lower mold 3 includes a lower mold central portion 32, a mold lifting portion 33, and a passage closing member 35. The lower mold central portion 32 has a lower mold central upper surface 32a corresponding to the lower surface of the sealing resin layer. The mold lifting portion 33 is arranged to surround the lower mold central portion 32 and abuts against the first surface 10a.

[0054] As Figure 1 shown, the upper mold 5 includes an upper mold base portion 51 and an upper mold block 52. The upper mold block 52 is fixed to the lower side of the upper mold base portion 51. The upper mold block 52 has a contact surface 52a facing downward. The lower mold 3 includes a lower mold base portion 31, a stroke amount limiting member 34, and an elastic body 37. The mold lifting portion 33 has a through hole 7. The stroke amount limiting member 34 is inserted into the through hole 7. The stroke amount limiting member 34 will be described in detail below.

[0055] As Figure 2 and Figure 3 shown, a notch is locally provided on the inner circumference of the mold lifting portion 33. The passage closing member 35 is arranged inside the notch. A cavity 2 is formed by the inner circumferential side surface 33b of the mold lifting portion 33, the side surface of the passage closing member 35 opposite to the mold lifting portion 33, and the lower mold central upper surface 32a. The cavity 2 is a space for melting and forming the resin material. The mold lifting portion 33 has a pocket portion 36 as a recess for accommodating the resin material flowing out from the cavity 2 at a position outside the cavity 2.

[0056] The passage closing member 35 can obtain a first state in which the resin material is allowed to flow from the cavity 2 to the pocket portion 36 by descending and a second state in which the resin material is blocked from flowing from the cavity 2 to the pocket portion 36 by ascending. In Figure 4In [the figure], a case where only the passage closing member 35 is taken out is shown. The passage closing member 35 has an abutting surface 35a facing upward at a predetermined height. The passage closing member 35 also has surfaces 35b, 35c, and 35d. The surface 35b is a surface facing upward at a position lower than the abutting surface 35a. The surface 35c is a side surface that contacts the mold releasing portion 33. The surface 35d is an upper surface of the protruding portion extending left and right.

[0057] In Figure 5 a cross section of the passage closing member 35 and its vicinity is shown. In Figure 6 In Figure 5 a cross section observed in the direction of arrow 91 in [the figure] is shown. An elastomer 38 is interposed between the passage closing member 35 and the mold releasing portion 33. In the example shown here, the elastomer 38 is provided on the surface 35d of the protruding portion. The elastomer 38 can be, for example, a spring. The passage closing member 35 is urged downward by the elastomer 38. A ejector pin 39 is disposed below the passage closing member 35. In Figure 6 the state shown, that is, in the state where the ejector pin 39 does not push up the passage closing member 35, due to the action of the elastomer 38, the passage closing member 35 is in a lowered state.

[0058] Figures 5 to 6 This represents the state where the passage closing member 35 is lowered, which corresponds to the above-mentioned "first state". In Figure 5 the passage 6 is opened. The resin material overflowing from the cavity 2 can flow through the passage 6 as shown by arrow 92 and flow toward the pocket portion 36.

[0059] On the other hand, in Figure 7 and Figure 8 the above-mentioned "second state", that is, the state where the passage closing member 35 is raised, is shown. In Figure 7 the abutting surface 35a of the passage closing member 35 abuts against the substrate 10. In this state, the passage 6 is blocked. In this state, the surface 35b forms a part of the bottom surface of the pocket portion 36. As Figure 8 shown, the ejector pin 39 pushes up the passage closing member 35 in the direction of arrow 93. At this time, the ejector pin 39 pushes up the passage closing member 35 against the downward force applied to the passage closing member 35 by the elastomer 38. As a result, as Figure 8 shown, the abutting surface 35a of the passage closing member 35 and the upper surface 33a of the mold releasing portion 33 are located on the same plane.

[0060] When viewed from a direction perpendicular to the central front surface 32a of the lower mold, the end portion of the abutting surface 35a on the side approaching the cavity 2 is located closer to the cavity 2 than the outer edge of the first surface 10a, and the end portion of the abutting surface 35a on the side away from the cavity 2 is located farther from the cavity 2 than the outer edge of the first surface 10a. This means that when viewed from a direction perpendicular to the first surface 10a, the abutting surface 35a straddles the outer edge of the first surface 10a in such a positional relationship. That is, in the above-described second state, as Figure 7 shown, a partial surface contact is formed between a part of the abutting surface 35a and a part of the first surface 10a.

[0061] In the present embodiment, in the first state, the resin overflowing from the cavity 2 can escape to the bag portion 36, and then the outflow of the resin is blocked by switching to the second state. In this way, it is possible to clearly distinguish between the resin that should be cured while maintaining the existing state in the cavity 2 and the unnecessary resin that has overflowed. In the second state, as Figure 7 shown, since the abutting surface 35a of the passage closing member 35 abuts against the first surface 10a of the substrate 10, it is possible to prevent the state where the resin overflowing from the cavity 2 adheres to the surface of the outer edge portion of the substrate. In the present embodiment, it is also possible to prevent the situation where the resin flows out in a state more than necessary. In addition, for the portion where the abutting surface 35a abuts against the first surface 10a of the substrate 10, even among the first surfaces 10a, it is preferably set not in the region where the sealing resin is formed, but in the so-called ear portion outside the region where the sealing resin is formed.

[0062] In addition, in Figure 4 a perspective view of the passage closing member 35 is shown, but Figure 4 the shape shown is only an example. The passage closing member 35 only needs to have the function of allowing the resin material to escape to the bag portion 36 in the first state and blocking the outflow of the resin material in the second state, and the shape of the passage closing member 35 is not limited to Figure 4 the shape shown.

[0063] In addition, in the present embodiment, as an example, as Figure 3 shown, more precisely, the passage closing member 35 is an aggregate of a plurality of passage closing member pieces. In the example shown here, the passage closing member 35 includes 4 passage closing member pieces. Preferably, as shown in the present embodiment, the passage closing member 35 includes a plurality of passage closing member pieces, and the plurality of passage closing member pieces are symmetrically arranged along the first side and the second side that face each other in the cavity. By adopting this structure, the resin overflowing from the cavity 2 can be discharged in parallel from a plurality of portions, so that the overflowing resin can be discharged efficiently. In Figure 3In [the figure], the cavity 2 is shown as a horizontally long rectangular depression. The left side of this rectangle is the first side, and the right side is the second side. The first side and the second side can also be assigned the other way around. In any case, the first side is a short side, and the second side is also a short side. Preferably, as shown in this embodiment, the cavity 2 has two long sides parallel to each other and two short sides parallel to each other, and both the above-mentioned first side and the above-mentioned second side are short sides. By adopting this structure, in the shape of the cavity 2, passages for discharging the resin are provided at the two relatively distant short sides respectively, so that the resin overflowing from the cavity 2 can be discharged efficiently.

[0064] (Second object)

[0065] According to the methods and apparatuses described in Patent Documents 1 and 2, it is considered that the thickness of the resin layer in the obtained product can be made the desired thickness. However, generally, there are deviations in the thickness of the substrate. The thickness of the obtained product is the sum of the thickness of the substrate and the thickness of the resin layer. Therefore, even if the thickness of the resin layer can be achieved with good precision, since the deviation of the product thickness also includes the component caused by the deviation of the substrate thickness, the deviation cannot be sufficiently suppressed.

[0066] Therefore, hereinafter, a compression resin sealing and forming apparatus that can suppress the deviation of the thickness of the obtained product even when there is a deviation in the thickness of the substrate will be set as the second object and studied.

[0067] (Embodiment 2)

[0068] Refer to Figures 9 to 13 The compression resin sealing and forming apparatus in Embodiment 2 based on the present invention will be described.

[0069] In Figure 9 It is shown that in this embodiment, the resin sheet 11 is disposed in the cavity 2 of the compression resin sealing and forming apparatus, and the lower mold 3 is relatively close to the upper mold 5 to a certain extent. Here, as an example, the lower mold 3 is raised as shown by the arrow 94. The upper surface 33a of the mold lifting portion 33 has already abutted against the first surface 10a of the substrate 10. The second surface 10b of the substrate 10 abuts against the abutting surface 52a of the upper mold block 52. A stroke amount limiting member 34 is fixed on the upper surface of the lower mold base 31. The stroke amount limiting member 34 is a rod-shaped member having a predetermined length. The upper part of the stroke amount limiting member 34 is inserted into the through hole 7 provided at the mold lifting portion 33.

[0070] An elastic body 37 is interposed between the mold lifting portion 33 and the lower mold base 31. The elastic body 37 can be, for example, a spring. As Figure 9As shown, after the mold lifting portion 33 comes into contact with the substrate 10, the lower mold base portion 31 continues to rise. The rising of the lower mold base portion 31 continues while compressing the elastomer 37. The lower mold central portion 32 is fixed to the upper side of the lower mold base portion 31, so the lower mold central portion 32 also rises together with the lower mold base portion 31. When the rising of the lower mold base portion 31 progresses to a certain extent, as Figure 10 shown, the upper end of the stroke amount limiting member 34 protrudes from the through hole 7 and comes into contact with the contact surface 52a of the upper mold block 52. The stroke amount limiting member 34 is a member having a predetermined length and sufficient rigidity, so the lower mold base portion 31 cannot rise further. Since the height difference between the upper end of the stroke amount limiting member 34 and the upper surface 32a of the lower mold center is maintained in a predetermined state, the upper surface 32a of the lower mold center stops at a position a predetermined distance from the contact surface 52a of the upper mold block 52.

[0071] In this embodiment, the compression resin sealing forming apparatus can be expressed as follows. The compression resin sealing forming apparatus is a compression resin sealing forming apparatus for forming a sealing resin layer, which seals a component disposed on the first surface 10a of a substrate 10 having a first surface and a second surface that form a front surface and a back surface with each other, and locally covers the first surface 10a of the substrate 10 with the sealing resin layer. The compression resin sealing forming apparatus includes: a lower mold 3 that comes into contact with the first surface 10a; and an upper mold 5 that comes into contact with the second surface 10b. The lower mold 3 includes: a lower mold base portion 31; a lower mold central portion 32 having an upper surface 32a of the lower mold center corresponding to the lower surface of the sealing resin layer; a mold lifting portion 33 configured to surround the lower mold central portion 32 and come into contact with the first surface 10a; and a stroke amount limiting member 34 fixed to the lower mold base portion 31 and protruding with respect to the lower mold base portion 31. A cavity 2 for melting and forming a resin material is formed by the inner peripheral surface 33b of the mold lifting portion 33 and the upper surface 32a of the lower mold center. The mold lifting portion 33 is supported by the lower mold base portion 31 via an elastomer 37. The stroke amount limiting member 34 restricts the distance between the contact surface 52a of the upper mold 5, which is the surface in contact with the second surface 10b, and the upper surface 32a of the lower mold center to be not less than a predetermined value by coming into contact with the upper mold 5.

[0072] In addition, the stroke amount limiting member 34 is not limited to being a single member. In the example shown here, the stroke amount limiting member 34 includes a plurality of stroke amount limiting member pieces. The plurality of stroke amount limiting member pieces are as shown in Figure 11The arrangement is shown using a top view. That is, a plurality of stroke amount limiting member pieces are arranged to surround the cavity 2. In this example, when the lower die 3 is viewed from above, the lower die 3 is rectangular, and four stroke amount limiting member pieces are arranged at equal intervals along each of the two long sides. That is, a total of eight stroke amount limiting member pieces are arranged. The number and the arrangement method of the stroke amount limiting member pieces are not limited to this. For example, it may be the number and the arrangement method as shown in Figure 12 , Figure 13 .

[0073] In the present embodiment, due to the action of the stroke amount limiting member 34, the distance between the abutting surface 52a of the upper die 5 and the upper surface 32a at the center of the lower die is restricted so as not to be less than a predetermined value. Therefore, it is possible to make the overall thickness of the product, which is the sum of the thickness of the substrate 10 and the thickness of the sealing resin, constant. In the present embodiment, even if there is a deviation in the thickness of the substrate 10, the thickness of the sealing resin is naturally adjusted. As a result, it is possible to make the overall thickness of the obtained product constant.

[0074] The mold lifting portion 3 and the stroke amount limiting member 34 can be displaced respectively. When the desired product thickness is changed, it can be dealt with by replacing the stroke amount limiting member 34 with a stroke amount limiting member 34 of a different length.

[0075] Preferably, as shown in the present embodiment, the stroke amount limiting member 34 includes a plurality of stroke amount limiting member pieces, and the plurality of stroke amount limiting member pieces are arranged to surround the cavity 2. By adopting this structure, it is possible to stably control the positional relationship between the lower die base portion 31 and the mold lifting portion 33 and between the lower die central portion 32 and the mold lifting portion 33.

[0076] In addition, the structure described in Embodiment 2 can also be applied to the compression resin sealing forming device in Embodiment 1.

[0077] That is, preferably, in the compression resin sealing forming device of Embodiment 1, the lower die 3 includes: a lower die base portion 31; and a stroke amount limiting member 34 that is fixed to the lower die base portion 31 and projects from the lower die base portion 31. In the lower die 3, the mold lifting portion 33 is supported by the lower die base portion 31 via an elastic body 37, and the stroke amount limiting member 34 restricts the distance between the surface of the upper die 5 that abuts against the second surface 10b and the upper surface 32a at the center of the lower die so as not to be less than a predetermined value. By adopting this structure, the effects described in Embodiments 1 and 2 can be obtained together.

[0078] Further, preferably in this compression resin sealing and molding apparatus, the stroke amount limiting member 34 includes a plurality of stroke amount limiting member pieces, and the plurality of stroke amount limiting member pieces are configured to surround the cavity 2. By adopting this structure, it is possible to stably control the positional relationship between the lower die base portion 31 and the mold lifting portion 33 and between the central portion 32 of the lower die and the mold lifting portion 33.

[0079] (Embodiment 3)

[0080] Refer to Figure 14 The compression resin sealing and molding apparatus according to Embodiment 3 of the present invention will be described. In Figure 14 it shows the outline of the compression resin sealing and molding apparatus 102 in this embodiment. The basic structure of the compression resin sealing and molding apparatus 102 is the same as the structure described in Embodiment 1.

[0081] In the compression resin sealing and molding apparatus 102, the surface of the upper die 5 facing the cavity 2 is covered with the release sheet 62. That is, the abutting surface 52a of the upper die 5 is covered with the release sheet 62.

[0082] In this embodiment, the effects described in Embodiment 1 can also be obtained.

[0083] Further, in this embodiment, the resin material overflowing from the cavity 2 does not directly contact the abutting surface 52a of the upper die 5, but contacts the release sheet 62. The resin material that has formed contact with the release sheet 62 can be easily detached from the release sheet 62. Therefore, it is possible to prevent the situation where the overflowing resin material adheres to the upper die 5 and remains.

[0084] In addition, a structure such as the compression resin sealing and molding apparatus 103 shown in Figure 15 can also be adopted. In the compression resin sealing and molding apparatus 103, the surface of the upper die 5 facing the cavity 2, that is, the abutting surface 52a, is covered with the release sheet 62, and the surface of the lower die 3 facing the upper die 5, that is, the upper surface 33a, and the inner surface of the cavity 2 are covered with the release sheet 61. By adopting this structure, it is also possible to prevent the situation where the overflowing resin material adheres not only to the upper die 5 but also to the lower die 3 and remains.

[0085] Refer to Figures 16 to 20 The operation of the compression resin sealing and molding apparatus 103 will be described. In Figures 16 to 19 the shape of the passage closing member 35 is simplified and shown. Actually, the passage closing member 35 can be the shape described in Embodiment 1. In addition, for the bag portion 36, the illustration is omitted, but near the outside of the passage 6, a bag portion 36 having the structure described in Embodiment 1 can be provided.

[0086] First, as Figure 16As shown, the substrate 10 is clamped by the upper mold 5 and the mold lifting portion 33. Although in Figure 16 it is represented by the cross-section passing through the passage 6, the passage 6 can be seen. Instead, the state where the upper surface 33a of the mold lifting portion 33 abuts against the first surface 10a of the substrate 10 cannot be seen. However, actually, at the portion of the outer edge of the substrate 10 that does not overlap with the passage 6, the upper surface 33a of the mold lifting portion 33 abuts against the lower surface of the substrate 10. That is, the substrate 10 is clamped by the abutting surface 52a of the upper mold 5 and the upper surface 33a of the mold lifting portion 33.

[0087] In addition, to be exact, since the release sheets 61 and 62 are interposed, the abutting surface 52a of the upper mold 5 and the upper surface 33a of the mold lifting portion 33 do not directly contact the substrate 10. However, when discussing which component abuts against the substrate 10, the existence of the release sheets 61 and 62 is ignored.

[0088] A component 13 is mounted on the lower surface of the substrate 10. The component 13 can be an electronic component. A resin sheet 11 is disposed in the cavity 2. At this moment, the resin sheet 11 may not be melted. At this moment, the passage 6 is open. The component 13 abuts against the resin sheet 11.

[0089] As Figure 17 shown, the passage closing member 35 is raised to close the passage 6. In this state, pressurization and heating are performed. The resin sheet 11 melts to become resin 11e. The lower mold base 31 is raised. As the lower mold base 31 is raised, the lower mold central portion 32 is raised. The resin 11e enters the gaps between the components 13. The resin 11e abuts against the first surface 10a of the substrate 10.

[0090] Next, as Figure 18 shown, the passage closing member 35 is lowered. As a result, the passage 6 is opened, and the melted resin 11e flows out of the cavity 2 through the passage 6. In Figure 18 the illustration of the bag portion 36 is omitted, but the melted resin 11e may flow into the bag portion 36.

[0091] After discharging the excess resin 11e, as Figure 19 shown, the passage closing member 35 is raised to close the passage 6. Thus, the resin 11e sealed at the first surface 10a of the substrate 10 for sealing the component 13 and the excess resin 11e that has overflowed to the outside of the substrate 10 are separated.

[0092] Next, the upper mold 5 is separated from the lower mold 3. Thus, the product as Figure 20 shown can be taken out. This product includes the substrate 10, the component 13, and the sealing resin 14. The sealing resin 14 adheres to the first surface 10a of the substrate 10. The component 13 is sealed by the sealing resin 14. InFigure 19 In this case, although there is excess resin 11e that has overflowed to the outside of the substrate 10, due to the action of the release sheets 61 and 62, the excess resin 11e does not adhere to the upper mold 5 and the lower mold 3 and can be easily removed.

[0093] In addition, the above-described embodiments may be appropriately combined and employed.

[0094] In addition, each aspect in the above-described embodiments disclosed this time is an example and not a limiting content. The scope of the present invention is shown by the claims and includes all changes within the meaning equivalent to the claims and within the scope.

[0095] (Supplementary Note)

[0096] (Supplementary Note 1)

[0097] A compression resin sealing and forming device for forming by sealing a resin layer, which seals a component disposed on the first surface of a substrate having a first surface and a second surface that form a front surface and a back surface with each other, and the sealing resin layer partially covers the first surface of the substrate.

[0098] Among them,

[0099] The above compression resin sealing and forming device includes:

[0100] A lower mold that abuts against the first surface; and

[0101] An upper mold that abuts against the second surface.

[0102] The above lower mold includes:

[0103] A central portion of the lower mold, the central portion of the lower mold having an upper surface of the central portion of the lower mold corresponding to the lower surface of the sealing resin layer; and

[0104] A mold lifting portion that is configured to surround the central portion of the lower mold and abuts against the first surface; and

[0105] A passage closing member.

[0106] A notch is provided locally on the inner periphery of the mold lifting portion.

[0107] The passage closing member is disposed inside the notch.

[0108] A cavity for melting and forming a resin material is formed by the inner peripheral side surface of the mold lifting portion, the side surface of the passage closing member opposite to the mold lifting portion, and the upper surface of the central portion of the lower mold.

[0109] The above-mentioned mold-lifting portion has a pocket portion as a recess that accommodates the resin material flowing out of the above-mentioned cavity on the outer side of the above-mentioned cavity.

[0110] The above-mentioned passage closing member can obtain a first state in which the resin material is allowed to flow out from the above-mentioned cavity to the above-mentioned pocket portion by descending and a second state in which the resin material is prevented from flowing out from the above-mentioned cavity to the above-mentioned pocket portion by ascending.

[0111] The above-mentioned passage closing member has a contact surface facing upward at a predetermined height.

[0112] When viewed from a direction perpendicular to the center front of the above-mentioned lower mold,

[0113] The end portion of the above-mentioned contact surface closer to the above-mentioned cavity is located closer to the above-mentioned cavity than the outer edge of the above-mentioned first surface.

[0114] The end portion of the above-mentioned contact surface farther from the above-mentioned cavity is located farther from the above-mentioned cavity than the outer edge of the above-mentioned first surface.

[0115] In the above-mentioned second state, a part of the above-mentioned contact surface and a part of the above-mentioned first surface form a surface contact.

[0116] (Supplementary Note 2)

[0117] Based on the compression resin sealing molding device described in Supplementary Note 1,

[0118] The above-mentioned passage closing member includes a plurality of passage closing member pieces.

[0119] The above-mentioned plurality of passage closing member pieces are symmetrically arranged along the first side and the second side of the above-mentioned cavity that face each other.

[0120] (Supplementary Note 3)

[0121] Based on the compression resin sealing molding device described in Supplementary Note 2,

[0122] The above-mentioned cavity has two long sides parallel to each other and two short sides parallel to each other.

[0123] Both the above-mentioned first side and the above-mentioned second side are short sides.

[0124] (Supplementary Note 4)

[0125] Based on the compression resin sealing molding device described in any one of Supplementary Notes 1 to 3,

[0126] The above-mentioned lower mold includes:

[0127] A lower mold base; and

[0128] A stroke amount limiting member that is fixed to the above-mentioned lower mold base and protrudes with respect to the above-mentioned lower mold base.

[0129] The above-mentioned mold lifting part is supported by the above-mentioned lower mold base via an elastic body.

[0130] The above-mentioned stroke amount limiting member restricts the distance between the surface of the upper mold that abuts against the second surface and the upper surface at the center of the lower mold to be not less than a predetermined value by abutting against the upper mold.

[0131] (Supplementary Note 5)

[0132] Based on the compression resin sealing and forming device described in Supplementary Note 4,

[0133] The above-mentioned stroke amount limiting member includes a plurality of stroke amount limiting member pieces.

[0134] The above-mentioned plurality of stroke amount limiting member pieces are arranged to surround the above-mentioned cavity.

[0135] (Supplementary Note 6)

[0136] A compression resin sealing and forming device for forming a sealing resin layer to seal a component disposed on the first surface of a substrate having a first surface and a second surface that form a front surface and a back surface with each other, and for locally covering the first surface of the substrate with the sealing resin layer.

[0137] Wherein,

[0138] The above-mentioned compression resin sealing and forming device includes:

[0139] A lower mold that abuts against the first surface; and

[0140] An upper mold that abuts against the second surface.

[0141] The above-mentioned lower mold includes:

[0142] A lower mold base;

[0143] A lower mold central part having an upper surface at the center of the lower mold corresponding to the lower surface of the above-mentioned sealing resin layer;

[0144] A mold lifting part that is arranged to surround the above-mentioned lower mold central part and abuts against the first surface; and

[0145] A stroke amount limiting member that is fixed to the above-mentioned lower mold base and protrudes relative to the above-mentioned lower mold base.

[0146] A cavity for melting and forming a resin material is formed by the inner peripheral side surface of the above-mentioned mold lifting part and the upper surface at the center of the lower mold.

[0147] The above-mentioned mold lifting part is supported by the above-mentioned lower mold base via an elastic body.

[0148] The above-mentioned stroke amount limiting member restricts the distance between the surface of the upper die that abuts against the second surface and the upper surface at the center of the lower die to be not less than a predetermined value by abutting against the upper die.

[0149] (Supplementary Note 7)

[0150] Based on the compression resin sealing and forming device described in Supplementary Note 6,

[0151] The above-mentioned stroke amount limiting member includes a plurality of stroke amount limiting member pieces,

[0152] The above-mentioned plurality of stroke amount limiting member pieces are arranged to surround the cavity.

[0153] (Supplementary Note 8)

[0154] Based on the compression resin sealing and forming device described in any one of Supplementary Notes 1 to 7,

[0155] The surface of the upper die facing the cavity side is covered with a release sheet.

[0156] Explanation of reference numerals:

[0157] 2... cavity; 3... lower die; 5... upper die; 6... passage; 7... through hole; 10... substrate; 10a... first surface; 10b... second surface; 11... resin sheet; 11e... resin; 13... component; 14... sealing resin; 21... lower die; 22... upper die; 31... lower die base; 32... lower die central part; 32a... upper surface at the center of the lower die; 33... mold lifting part; 33a... upper surface (of the mold lifting part); 33b... inner peripheral side surface (of the mold lifting part); 34... stroke amount limiting member; 35... passage closing member; 35a... abutting surface (of the passage closing member); 35b, 35c, 35d... surfaces; 36... pocket part; 37, 38... elastomer; 39... ejector pin; 51... upper die base; 52... upper die block; 52a... abutting surface (of the upper die); 61, 62... release sheet; 91, 93, 94... arrow; 101, 102, 103... compression resin sealing and forming device.

Claims

1. A compression resin sealing and forming device for forming a sealing resin layer to seal a component disposed on the first surface of a substrate having a first surface and a second surface that form a front surface and a back surface with each other, and to locally cover the first surface of the substrate with the sealing resin layer. Wherein, The compression resin sealing and forming device includes: A lower mold that abuts against the first surface; and An upper mold that abuts against the second surface. The lower mold includes: A central portion of the lower mold, which has an upper surface of the central portion of the lower mold corresponding to the lower surface of the sealing resin layer; A mold lifting portion that is configured to surround the central portion of the lower mold and abuts against the first surface; and A passage closing member. A notch is locally provided on the inner periphery of the mold lifting portion. The passage closing member is disposed inside the notch. A cavity for melting and forming a resin material is formed by the inner peripheral side surface of the mold lifting portion, the side surface of the passage closing member opposite to the mold lifting portion, and the upper surface of the central portion of the lower mold. The mold lifting portion has a pocket portion as a recess for receiving the resin material flowing out from the cavity at a position outside the cavity. The passage closing member can obtain a first state in which the resin material is allowed to flow out from the cavity to the pocket portion by descending and a second state in which the resin material is blocked from flowing out from the cavity to the pocket portion by ascending. The passage closing member has a contact surface facing upward at a predetermined height. When viewed from a direction perpendicular to the front surface of the central portion of the lower mold, The end of the contact surface closer to the cavity is located closer to the cavity than the outer edge of the first surface. The end of the contact surface farther from the cavity is located farther from the cavity than the outer edge of the first surface. In the second state, a partial surface contact is formed between a part of the contact surface and a part of the first surface.

2. The compression resin sealing and forming device according to claim 1, wherein The passage closing member includes a plurality of passage closing member pieces. The plurality of passage closing member pieces are symmetrically disposed along the first side and the second side of the cavity that face each other.

3. The compression resin sealing and forming device according to claim 2, wherein The cavity has two long sides parallel to each other and two short sides parallel to each other. Both the first side and the second side are short sides.

4. The compression resin sealing and forming device according to any one of claims 1 to 3, wherein The lower mold includes: A base portion of the lower mold; and A stroke amount limiting member that is fixed to the base portion of the lower mold and protrudes relative to the base portion of the lower mold. The mold lifting portion is supported by the base portion of the lower mold via an elastic body. The stroke amount limiting member restricts the distance between the surface of the upper mold that abuts against the second surface and the upper surface of the central portion of the lower mold to not be less than a predetermined value by abutting against the upper mold.

5. The compression resin sealing and forming device according to claim 4, wherein The stroke amount limiting member includes a plurality of stroke amount limiting member pieces. The plurality of stroke amount limiting member pieces are configured to surround the cavity.

6. A compression resin sealing and forming device for forming a sealing resin layer to seal a component disposed on the first surface of a substrate having a first surface and a second surface that form a front surface and a back surface with each other, and for locally covering the first surface of the substrate with the sealing resin layer. Wherein, the compression resin sealing and forming device includes: a lower mold that abuts against the first surface; and an upper mold that abuts against the second surface. The lower mold includes: a lower mold base; a lower mold central portion having a lower mold central upper surface corresponding to the lower surface of the sealing resin layer; a mold lifting portion configured to surround the lower mold central portion and abut against the first surface; and a stroke amount limiting member fixed to the lower mold base and protruding relative to the lower mold base. A cavity for melting and forming a resin material is formed by the inner peripheral side surface of the mold lifting portion and the lower mold central upper surface. The mold lifting portion is supported by the lower mold base via an elastic body. The stroke amount limiting member restricts the distance between the surface of the upper mold that abuts against the second surface and the lower mold central upper surface to be not less than a predetermined value by abutting against the upper mold.

7. The compression resin sealing and forming device according to claim 6, wherein the stroke amount limiting member includes a plurality of stroke amount limiting member pieces. The plurality of stroke amount limiting member pieces are configured to surround the cavity.

8. The compression resin sealing and forming device according to any one of claims 1 to 7, wherein the surface of the upper mold facing the cavity side is covered with a release sheet.

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