Electronic equipment

Abstract

The invention provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment is used for solving the problem that the thickness space in the electronic equipment cannot meet the requirement for the minimum welding length between a reed and a metal part. The electronic equipment comprises a shell, a mainboard and a reed. The shell comprises a frame and a rear cover, and the rear cover is fixedly connected with the frame. The mainboard is arranged in the shell. The reed comprises a welding part and a contact part, the welding part is attached to the frame and is welded and fixed, and the contact part is electrically connected with the mainboard; wherein the contact part is parallel to the mainboard, an included angle alpha is formed between the welding part and the contact part, and the included angle alpha is an obtuse angle or an acute angle.

Description

An electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on January 12, 2023, with application number 202310071873.0 and invention name “An Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0003] The motherboard inside an electronic device is typically electrically connected to a metal component via a reed, which is then welded together. As electronic devices become increasingly lightweight and thin, their thickness decreases, leaving limited internal space that cannot accommodate the required welding dimensions between the reed and the metal component. Consequently, the thickness of the electronic device increases, hindering its lightweight and thinness.

[0004] Summary of the Invention

[0005] An embodiment of the present application provides an electronic device for solving the problem that the thickness space inside the electronic device cannot meet the welding length requirement between the reed and the metal part.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] An embodiment of the present application provides an electronic device comprising a housing, a mainboard, and a spring. The housing comprises a frame and a back cover, the back cover being fixedly connected to the frame. The mainboard is disposed within the housing. The spring comprises a welding portion and a contact portion, the welding portion being bonded to and welded to the frame, and the contact portion being electrically connected to the mainboard. The contact portion is parallel to the mainboard, and an angle α is formed between the welding portion and the contact portion, wherein the angle α can be either obtuse or acute.

[0008] In the electronic device provided by the embodiments of the present application, the angle formed between the soldering portion and the contact portion, and the contact portion being parallel to the mainboard, means that the soldering portion is tilted. Therefore, based on the principle that the hypotenuse of a right triangle is the longest, the length of the weld between the soldering portion and the frame can be increased without increasing the height of the soldering portion perpendicular to the mainboard. This eliminates the need to increase the thickness of the electronic device; the internal thickness can satisfy the required dimensions for the soldering between the spring and the frame.

[0009] In some embodiments of the present application, the welding portion is provided on the side of the contact portion close to the back cover. In this structure, only an inclined surface for fitting with the welding portion needs to be processed on the frame, thus reducing the processing difficulty.

[0010] In some embodiments of the present application, the angle α formed between the welding portion and the contact portion is an obtuse angle. This can prevent the welding portion from interfering with certain electronic components within the electronic device and prevent the welding portion from occupying space within the housing, thereby improving overall space utilization.

[0011] In some embodiments of the present application, the angle α is 120°, 135°, or 150°. That is, the acute angle formed between the welding portion and the plane parallel to the mainboard is 30°, 45°, or 60°. These angles are conventional processing angles, which can help reduce processing difficulty and improve processing accuracy.

[0012] In some embodiments of the present application, the length L along the direction from the contact portion to the welding portion and parallel to the welding portion, along which the welding portion and the frame are affixed and welded, is 1.0 mm ≤ L ≤ 1.2 mm. This ensures that the required weld dimensions between the welding portion and the frame are met, thereby ensuring weld strength between the two.

[0013] In some embodiments of the present application, a gap is provided between the edge of the welding portion away from the contact portion and the back cover, so as to prevent the back cover from abutting against the spring and thereby prevent the two from abutting against each other and causing damage.

[0014] In some embodiments of the present application, a gap D between an edge of the welding portion away from the contact portion and the back cover is 0.1 mm ≤ D ≤ 0.2 mm.

[0015] In some embodiments of the present application, the frame includes a metal portion and a plastic portion. The welding portion of the spring is bonded to and welded to the metal portion of the frame, while the contact portion of the spring is fixed to the plastic portion of the frame. At least one notch is formed on the outer wall of the metal portion, and a portion of the plastic portion extends into the notch. In this way, the plastic portion extending into the notch provides clearance for the antenna, ensuring a clear area for the antenna and preventing interference with the antenna signal.

[0016] In some embodiments of the present application, the frame further includes a reinforcement block embedded within the plastic portion. The reinforcement block is used to strengthen the notch on the metal portion. The reinforcement block is positioned corresponding to the notch and embedded within the plastic portion to enhance the strength of the notch on the metal portion, thereby improving the overall strength of the frame.

[0017] In some embodiments of the present application, the vertical projection of the reinforcement block on the back cover overlaps at least partially with the vertical projection of the spring on the back cover. That is, the electrical connection between the mainboard and the metal part overlaps with the area where the reinforcement block is located, so the spring can also be placed in this area.

[0018] In some embodiments of the present application, the reinforcement block is disposed on the side of the spring away from the back cover. Since the welding portion of the spring is tilted, the spring can be moved toward the back cover, reducing the distance between the spring and the back cover. This increases the thickness of the spring away from the back cover, further increasing the thickness of the reinforcement block and further improving the strength of the midframe.

[0019] In some embodiments of the present application, the reinforcement block is arranged on the side of the spring sheet close to the back cover. The reinforcement block is arranged between the spring sheet and the back cover to prevent the welding part of the spring sheet from abutting against the back cover, which is conducive to protecting the components.

[0020] In some embodiments of the present application, the reinforcement block is made of metal material. Since metal material has high strength, it can improve the overall strength of the frame.

[0021] In some embodiments of the present application, the electronic device further includes a spring, one end of which is fixed to the mainboard and the other end of which abuts the contact portion. In other words, the spring is used to electrically connect the mainboard and the spring, thereby forming a complete circuit between the mainboard, the metal portion, and the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a structural diagram of an electronic device provided in an embodiment of the present application;

[0023] FIG2 is an exploded view of an electronic device provided in an embodiment of the present application;

[0024] FIG3 is a structural diagram of a frame provided in an embodiment of the present application;

[0025] FIG4 is an exploded view of a frame provided in an embodiment of the present application;

[0026] FIG5 is a partial cross-sectional view of a connection structure between a spring, a frame, and a mainboard provided in an embodiment of the present application;

[0027] FIG6 is a partial cross-sectional view of another connection structure between a spring, a frame, and a main board provided in an embodiment of the present application;

[0028] FIG7 is a partial cross-sectional view of another connection structure between a spring, a frame, and a mainboard provided in an embodiment of the present application;

[0029] FIG8 is an exploded view of another electronic device provided in an embodiment of the present application;

[0030] FIG9 is a structural diagram of the reed of the electronic device provided in FIG8 ;

[0031] FIG10 is a partial cross-sectional view of the connection structure between the spring, the frame, and the main board provided in FIG9 ;

[0032] FIG11 is a schematic diagram of a right triangle constructed by the reeds provided in FIG9 ;

[0033] FIG12 is a partial cross-sectional view of the connection structure between the spring, the frame and the back cover provided in FIG10 ;

[0034] FIG13 is a structural diagram of the frame of the electronic device provided in FIG8 ;

[0035] FIG14 is an enlarged view of the structure of area A in FIG13 ;

[0036] FIG15 is a cross-sectional view of another connection structure between a frame, a spring, and a main board provided in an embodiment of the present application;

[0037] FIG16 is a cross-sectional view of another connection structure between the frame, the spring and the main board provided in an embodiment of the present application.

[0038] Figure numerals: 10-electronic device; 100-display module; 110-transparent cover; 120-display screen; 200-housing; 210-back cover; 220-frame; 221-metal part; 221a-notch; 222-plastic part; 223-reinforcement block; 224-accommodation groove; 224a-first part; 224b-second part; 230-middle plate; 300-main board; 310-spring; 400-spring; 410-welding area; 420-abutment area; 430-welding part; 440-contact part. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0040] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.

[0041] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0042] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0043] An embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other type of electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For ease of description, the following examples are all based on the example of a mobile phone as the electronic device.

[0044] Please refer to Figures 1 and 2. Figure 1 is a structural diagram of an electronic device 10 provided in an embodiment of the present application, and Figure 2 is an exploded view of the electronic device 10 provided in an embodiment of the present application. As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone and can be approximately rectangular. The electronic device 10 can include a display module 100, a housing 200, a mainboard 300, and an antenna (not shown).

[0045] It should be understood that FIG1 and FIG2 merely schematically illustrate some components included in the electronic device 10 , and the actual shape, actual size, actual position and actual structure of these components are not limited by FIG1 and FIG2 .

[0046] The above-mentioned display module 100 is used to display images, videos, etc. The display module 100 may include a translucent cover plate 110 and a display screen 120 (English name: panel, also called display panel), and the translucent cover plate 110 and the display screen 120 are stacked. The material of the translucent cover plate 110 includes but is not limited to glass. For example, the translucent cover plate 110 can adopt an ordinary translucent cover plate 110 to protect the display screen 120 to avoid damage to the display screen 120 due to external force collision, and can play a dust-proof role. A translucent cover plate 110 with a touch function can also be used to enable the electronic device 10 to have a touch function, thereby making it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the translucent cover plate 110.

[0047] Furthermore, the display screen 120 may be a flexible display screen or a rigid display screen. For example, the display screen 120 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0048] The housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a back cover 210 and a frame 220. The back cover 210 is located on the side of the display screen 120 away from the transparent cover plate 110, and is stacked with the transparent cover plate 110 and the display screen 120 and spaced apart. The frame 220 is located between the transparent cover plate 110 and the back cover 210. The frame 220 is fixed to the back cover 210. For example, the frame 220 can be fixed to the back cover 210 by bonding, threading, welding, snapping, etc. The frame 220 can also be an integrally formed structure with the back cover 210, that is, the frame 220 and the back cover 210 are a single structural unit. The transparent cover plate 110 can be fixed to the frame 220 by gluing, so that the transparent cover plate 110, the back cover 210, and the frame 220 enclose an internal storage space of the electronic device 10. The electronic components, such as the motherboard 300 and the camera module, are all disposed within this internal storage space.

[0049] In some embodiments, the housing 200 may further include a middle plate 230, which is disposed in the internal accommodating space and is located on the side of the display screen 120 away from the light-transmitting cover plate 110. The middle plate 230 is fixedly connected to the frame 220 to form the middle frame of the electronic device 10. For example, the middle plate 230 and the frame 220 may be fixedly connected by gluing, threading, welding, snapping, etc. The middle plate 230 and the frame 220 may also be an integrally molded structure, that is, the two are a single structural component. The middle plate 230 divides the internal accommodating space into two independent spaces, one of which is located between the light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located in this space. The other part is located between the middle plate 230 and the back cover 210, and the main board 300 is disposed in this space.

[0050] The motherboard 300 is used to house the electronic components within the electronic device 10 and to achieve electrical connections between the electronic components. For example, the electronic components may be a control chip (e.g., a system on chip (SOC)), a graphics processing unit (GPU), a universal flash storage (UFS), an earpiece, and a flash module.

[0051] In addition, the main board 300 may be fixed to the middle board 230 by gluing, welding, clamping or bolting. Therefore, the present application does not impose any special limitation on the fixing method of the main board 300.

[0052] The antenna is used to receive or transmit signals for the electronic device 10. The antenna may include a communication antenna, a Bluetooth antenna, a WiFi antenna, a GPS antenna, etc. Furthermore, the antenna may be disposed inside the housing 200 or on the frame 220, i.e., the frame 220 antenna.

[0053] When the antenna is arranged on the frame 220, the antenna and the mainboard 300 are electrically connected to each other to form a closed loop. Please refer to Figures 3 and 4. Figure 3 is a structural diagram of the frame 220 provided in an embodiment of the present application, and Figure 4 is an exploded view of the frame 220 provided in an embodiment of the present application. The frame 220 may include a metal portion 221 and a plastic portion 222. For example, the plastic portion 222 may be arranged on the inner side of the metal portion 221. At least one notch 221a is formed on the outer wall of the metal portion 221. The notch 221a is arranged in a one-to-one correspondence with the antenna. A portion of the plastic portion 222 is filled in the notch 221a. The signal emitted by the antenna can diffuse outward through the notch 221a, thereby preventing the metal portion 221 from affecting the transmission or reception of the signal.

[0054] It is understandable that the positional relationship between the above-mentioned plastic part 222 and the metal part 221 is only one possible application scenario. In other scenarios, the metal part 221 can also be set on the inner side of the plastic part 222. Therefore, this application does not make any special limitations on this.

[0055] In addition, the above-mentioned antenna is arranged on the metal part 221, and a spring 400 is welded on the metal part 221. A spring 310 is fixedly connected to the mainboard 300. By abutting the spring 310 and the spring 400, the mainboard 300 and the metal part 221 can be electrically connected, thereby realizing the electrical connection between the mainboard 300 and the antenna.

[0056] For example, please refer to Figure 5, which is a partial cross-sectional view of a connection structure between a spring 400, the frame 220, and the mainboard 300, provided in an embodiment of the present application. The spring 400 can be a flat plate structure that can be attached to the metal portion 221 in a direction parallel to the middle plate 230 or the mainboard 300. The spring 310 abuts the surface of the spring 400 facing the rear cover 210, thereby forming a closed circuit between the mainboard 300, the metal portion 221, and the antenna.

[0057] Alternatively, please refer to Figure 6, which is a partial cross-sectional view of another embodiment of the present application, illustrating the connection structure between the spring 400, the frame 220, and the motherboard 300. The flat spring 400 can also be attached to the inner wall of the metal portion 221 perpendicular to the motherboard 300, with the spring 310 abutting the surface of the spring 400 away from the metal portion 221, thereby forming a closed circuit between the motherboard 300, the metal portion 221, and the antenna.

[0058] Please refer to Figure 7, which is a partial cross-sectional view of another embodiment of the present application illustrating the connection structure between the spring 400, the frame 220, and the mainboard 300. The spring 400 may also have an L-shaped structure. The L-shaped spring 400 may include a welding area 410 and an abutment area 420. The welding area 410 and the abutment area 420 are disposed perpendicular to each other and are integrally formed, i.e., they form a single structural component. The welding area 410 is welded to the inner wall of the metal portion 221 perpendicular to the mainboard 300, while the abutment area 420 is fixedly connected to the plastic portion 222 parallel to the mainboard 300. For example, the plastic portion 222 and the abutment area 420 may be fixedly connected by gluing. The spring 310 abuts the surface of the abutment area 420 facing away from the plastic portion 222, thereby forming a closed circuit between the mainboard 300, the metal portion 221, and the antenna.

[0059] However, to meet strength requirements when welding the reed 400 to the metal portion 221, a minimum welding length is required. Furthermore, since electronic devices 10 (e.g., mobile phones) are now required to be thinner and lighter, this welding requirement cannot be met.

[0060] Specifically, when the flat-plate spring 400 is arranged in a direction perpendicular to the mainboard 300, or an L-shaped spring 400 is used, the thickness space inside the shell 200 cannot meet the minimum welding length requirement for spot welding the spring 400 and the metal part 221, thereby reducing the reliability of the electrical connection.

[0061] When the flat-plate reed 400 is arranged in a direction parallel to the mainboard 300, or the L-shaped reed 400 is moved away from the back cover 210, the clearance area of ​​the antenna arranged on the side of the reed 400 away from the back cover 210 will be reduced, affecting the performance of the antenna.

[0062] To solve the above technical problems, please refer to Figure 8, which is an exploded view of another electronic device 10 provided in an embodiment of the present application. The electronic device 10 may include the above-mentioned display module 100, a housing 200, a mainboard 300, and a reed 400. Please refer to Figures 9 and 10, Figure 9 is a structural diagram of the reed 400 of the electronic device 10 provided in Figure 8, and Figure 10 is a partial cross-sectional view of the connection structure between the reed 400 and the frame 220 and the mainboard 300 provided in Figure 9. The reed 400 may include a welding portion 430 and a contact portion 440, the welding portion 430 is attached to the metal portion 221 and welded and fixed, the contact portion 440 may be fixed to the plastic portion 222 by gluing, and the contact portion 440 abuts against the above-mentioned spring 310, so that the contact portion 440 is electrically connected to the mainboard 300.

[0063] In addition, the above-mentioned contact portion 440 is arranged parallel to the main board 300, and an angle α is formed between the welding portion 430 and the contact portion 440. The angle α is an obtuse angle or an acute angle, that is, the welding portion 430 of the spring 400 forms an angle with the main board 300, that is, it is arranged at an angle.

[0064] Furthermore, the reed 400 can be made of copper, which has good electrical conductivity and can therefore improve the reliability of the electrical connection between the mainboard 300 and the metal portion 221. Alternatively, the reed 400 can also be made of other metal materials with good electrical conductivity, and this application does not impose any particular limitation thereto.

[0065] Furthermore, the reed 400 may be formed by bending a flat plate-shaped substrate to form the welding portion 430 and the contact portion 440 , and the angle α may be formed between the welding portion 430 and the contact portion 440 .

[0066] In this way, since the welding part 430 is set at an angle, on the one hand, it is beneficial to ensure that the minimum welding length requirement of spot welding can be met when the welding part 430 is welded to the metal part 221; on the other hand, there is no need to increase the thickness of the electronic device 10, that is, by increasing the thickness space inside the shell 200, to meet the strength requirement of spot welding, which is beneficial to the lightweight and thinning of the electronic device 10.

[0067] Specifically, a right triangle can be constructed. Refer to FIG11 , which is a schematic diagram of the right triangle constructed by the reed 400 shown in FIG9 . Edge AB of the welding portion 430 serves as the hypotenuse of the right triangle. The welding portion 430 is away from vertex A of the contact portion 440, and the perpendicular line to the plane where the contact portion 440 lies (with its foot at C) serves as one right-angled side AC. The line connecting the intersection (point B) of the contact portion 440 and the welding portion 430 and the foot of the perpendicular line serves as another right-angled side BC, thereby forming a right triangle.

[0068] As can be seen from Figure 11, the larger the right-angled side AC, the greater the thickness space required for the electronic device 10, that is, the greater the thickness of the electronic device 10. According to the principle that the hypotenuse of a right triangle is the longest, when the length of the right-angled side AC remains unchanged, the length of the hypotenuse AB can be increased by reducing the angle ABC. In other words, without increasing the thickness of the electronic device 10, the length of the welding portion 430 can be increased by simply increasing the angle α between the welding portion 430 and the contact portion 440. This ensures that the minimum welding length requirement between the welding portion 430 and the metal portion 221 is met while ensuring the lightness and thinness of the electronic device 10.

[0069] Moreover, the smaller the thickness space of the electronic device 10 (i.e., the smaller the right-angle side AC), the longer the welding portion 430 (i.e., the hypotenuse AB) can be increased by increasing the angle α, thereby ensuring the welding strength between the reed 400 and the metal portion 221 while being more conducive to the thinning of the electronic device 10.

[0070] It is understood that when angle α is obtuse, increasing angle α can increase the length of weld portion 430. When angle α is acute, the smaller angle α is, the longer weld portion 430 can be extended. The principle is the same as above, and therefore, will not be repeated.

[0071] In some embodiments, when the angle α is an acute angle, the soldering portion 430 needs to extend toward the interior of the housing 200 in a direction parallel to the mainboard 300. This is to avoid interference between the soldering portion 430 and other electronic components within the electronic device 10 (e.g., the mainboard 300 and the spring clip 310 fixed to the mainboard 300), thereby affecting the spatial layout.

[0072] Therefore, in the reed 400 provided in the present application, the angle α formed between the welding portion 430 and the contact portion 440 is an obtuse angle. For example, the angle α can be 95°, 100°, 110°, 120°, 130°, 135°, 140°, 150°, 160°, 170°, 175°, etc.

[0073] Furthermore, to facilitate processing of the reed 400, the angle α can be a commonly used integer, such as 120°, 135°, or 150°. That is, the angles ABC are 60°, 45°, and 30°. This facilitates processing by using commonly used processing parameters and improves processing accuracy.

[0074] Please refer to Figure 12, which is a partial cross-sectional view of the connection structure between the spring 400, the frame 220, and the back cover 210 shown in Figure 10. To ensure the reliability of the weld between the welding portion 430 and the metal portion 221, the length L along which the welding portion 430 (i.e., the hypotenuse AB shown in Figure 11) is affixed and fixed to the metal portion 221, along the direction from the contact portion 440 toward the welding portion 430 and parallel to the welding portion 430, is affixed and fixed to the metal portion 221. Since the minimum weld length between the welding portion 430 and the metal portion 221 is 1 mm, the weld strength is guaranteed. Therefore, L ≥ 1 mm, thereby ensuring the weld strength between the welding portion 430 and the metal portion 221. For example, the length L can be 1 mm, 1.05 mm, 1.08 mm, 1.1 mm, 1.13 mm, 1.15 mm, 1.18 mm, 1.2 mm, 2 mm, or 3 mm, etc. In this way, the welding reliability between the welding portion 430 and the metal portion 221 can be met without increasing the thickness of the electronic device 10 .

[0075] Furthermore, to further enhance the reliability of the overall structure, a gap is provided between the edge of the welding portion 430 away from the contact portion 440 and the back cover 210. This prevents the welding portion 430 and the back cover 210 from abutting against each other, thereby preventing interference between the two and affecting the structural strength, thereby improving the reliability of the overall structure.

[0076] For example, the gap D between the edge of the welding portion 430 away from the contact portion 440 and the back cover 210 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.17 mm, 0.19 mm, 0.2 mm, 0.5 mm, or 1 mm, etc. This can prevent the welding portion 430 of the reed 400 from abutting against the back cover 210, thereby ensuring the reliability of the overall structure.

[0077] In this regard, please refer to Figures 13 and 14. Figure 13 is a structural diagram of the frame 220 of the electronic device 10 shown in Figure 8, and Figure 14 is an enlarged structural diagram of area A in Figure 13. The frame 220 may be provided with a receiving slot 224 for accommodating the reed 400. Specifically, the receiving slot 224 includes a first portion 224a and a second portion 224b, with the first portion 224a located on the metal portion 221 and the second portion 224b located on the plastic portion 222. A beveled surface is formed within the first portion 224a, parallel to the welding portion 430. The welding portion 430 is bonded to the beveled surface and secured by spot welding. The bottom of the second portion 224b is parallel to the mainboard 300, and the contact portion 440 is disposed within the second portion 224b and secured to the second portion 224b by adhesive. Thus, a receiving groove 224 for receiving the reed 400 can be formed on the frame 220 , and the reed 400 on the mainboard 300 can abut against the contact portion 440 , thereby forming a closed loop between the mainboard 300 , the metal portion 221 and the antenna.

[0078] Furthermore, the welding portion 430 extends in a direction away from the mainboard 300 , which can avoid the welding portion 430 from abutting or colliding with the spring 310 or other components on the mainboard 300 , thereby improving the space utilization inside the housing 200 .

[0079] In addition, the reed 400 may be provided with one or more reeds, and the specific number may be determined according to the actual situation and specific requirements of the electronic device 10, and therefore, this application does not impose any special limitation thereto.

[0080] Furthermore, the metal portion 221 is provided with multiple notches 221a, which are filled with plastic 222 to allow the antenna's signals to propagate outward. To enhance the strength of the notches 221a on the metal portion 221, see Figure 15 , which is a cross-sectional view of another embodiment of the present application, illustrating the connection structure between the frame 220, the spring 400, and the mainboard 300. This frame 220 also includes a reinforcing block 223.

[0081] Specifically, the reinforcement block 223 can be made of metal material, embedded in the plastic portion 222, and disposed in an area of ​​the plastic portion 222 corresponding to the notch 221a on the metal portion 221, thereby compensating for the strength of the notch 221a and improving the overall strength of the frame 220.

[0082] For example, the reinforcing block 223 can be made of iron. Since iron has a high hardness, it can supplement the strength of the notch 221a of the metal portion 221, thereby improving the overall strength of the frame 220. In addition, the reinforcing block 223 can also be made of other metal materials with higher hardness, and therefore, this application does not impose any special restrictions on this.

[0083] In some embodiments, the vertical projection of the reed 400 on the back cover 210 at least partially overlaps with the vertical projection of the reinforcement block on the back cover 210. That is, the electrical connection points between the mainboard 300 and the metal portion 221 overlap, and the reed 400 can overlap with the reinforcement block 223 along a plane parallel to the back cover 210.

[0084] For example, please continue to refer to Figure 15. The above-mentioned reinforcement block 223 can be arranged on the side of the reed 400 away from the back cover 210. Since the welding portion 430 of the above-mentioned reed 400 is arranged at an angle, the distance between the contact portion 440 of the reed 400 and the back cover 210 can be reduced, and the thickness space of the reed 400 away from the back cover 210 can be increased, so that the thickness of the reinforcement block 223 can be increased to further enhance the strength of the reinforcement block 223 itself, thereby helping to enhance the overall strength of the middle frame.

[0085] Alternatively, please refer to Figure 16, which is a cross-sectional view of another embodiment of the present application showing a connection structure between the frame 220, the spring 400, and the mainboard 300. The reinforcing block 223 can also be disposed on the side of the spring 400 close to the back cover 210, that is, the reinforcing block 223 is disposed between the spring 400 and the back cover 210. In this way, since the reinforcing block 223 is disposed between the spring 400 and the back cover 210, the distance between the edge of the welding portion 430 of the spring 400 away from the contact portion 440 and the back cover 210 is increased, further ensuring that the welding portion 430 of the spring 400 does not abut against the back cover 210, thereby avoiding interference between the spring 400 and the back cover 210 and helping to protect the components intact.

[0086] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0087] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: The housing comprises a frame and a back cover, wherein the back cover is fixedly connected to the frame; a mainboard, disposed in the housing; The spring includes a welding portion and a contact portion, wherein the welding portion is attached to the frame and welded to fix, and the contact portion is electrically connected to the mainboard; wherein the contact portion is parallel to the mainboard, and an angle α is formed between the welding portion and the contact portion, and the angle α is an obtuse angle or an acute angle.

2. The electronic device according to claim 1, wherein The welding portion is arranged on a side of the contact portion close to the rear cover.

3. The electronic device according to claim 1 or 2, characterized in that: An included angle α formed between the welding portion and the contact portion is an obtuse angle.

4. The electronic device according to claim 3, wherein: The angle α is 120°, 135° or 150°.

5. The electronic device according to any one of claims 1 to 4, characterized in that: Along the direction from the contact portion to the welding portion and parallel to the welding portion, the length of the welding portion and the frame being attached and welded and fixed is L, and L is ≥ 1 mm.

6. The electronic device according to any one of claims 1 to 5, characterized in that: A gap is formed between an edge of the welding portion away from the contact portion and the back cover.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The frame includes a metal part and a plastic part, the welding part is attached to the metal part and welded and fixed, the contact part is fixed on the plastic part, at least one notch is formed on the outer wall of the metal part, and a part of the plastic part extends into the notch.

8. The electronic device according to claim 7, wherein: The frame further includes a reinforcement block embedded in the plastic portion and used to reinforce the strength of the notch.

9. The electronic device according to claim 8, wherein: The vertical projection of the reinforcing block on the back cover overlaps with at least a portion of the vertical projection of the spring on the back cover.

10. The electronic device according to claim 8 or 9, characterized in that: The reinforcement block is arranged on a side of the spring away from the rear cover.

11. The electronic device according to claim 8 or 9, characterized in that: The reinforcement block is arranged on a side of the spring sheet close to the rear cover.

12. The electronic device according to any one of claims 8 to 11, characterized in that: The reinforcement block is made of metal material.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The electronic device further comprises a spring, one end of which is fixed on the mainboard, and the other end of which abuts against the contact portion.

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