Stamping die, stamping equipment and manufacturing method of stamping die material

Abstract

The invention relates to a stamping die, stamping equipment and a manufacturing method of a stamping die material, the stamping die comprises a first die body and a second die body, and the first die body and the second die body are stacked along a preset direction and are used for accommodating a battery pole piece; wherein at least one of the first mold body and the second mold body comprises a base material layer, a first film layer and a second film layer, the periphery of the base material layer is coated with the first film layer, the periphery of the first film layer is coated with the second film layer, and the hardness of the second film layer is smaller than that of the first film layer. The first die body and the second die body can conduct punch forming on the battery pole piece in the containing groove, and through mutual cooperation of the first film layer and the second film layer, the first die body and / or the second die body can give consideration to the high hardness and the good punching effect on the battery pole piece at the same time, and the punching quality is effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of stamping dies, and particularly to a stamping die, a stamping device, and a manufacturing method of a stamping die material. Background Art

[0002] A fuel cell is a device that directly converts the chemical energy of a fuel into electrical energy. It has the advantages of high energy conversion efficiency, environmental friendliness, and low operating temperature, and is a clean energy technology with great development prospects. A fuel cell is composed of multiple single cells stacked together, and a single cell usually includes a cathode plate and an anode plate. During the production process, it is necessary to stamp and form the cathode plate and the anode plate. In the stamping and forming process of the cathode plate and the anode plate, a high surface finish of the electrode plate is required. Therefore, higher requirements are imposed on the stamping quality.

[0003] Based on this, when the current ordinary stamping and forming device stamps and forms the electrode plate, it is easy to scratch the surface of the electrode plate, affecting the final forming quality of the electrode plate. Summary of the Invention

[0004] Based on this, it is necessary to provide a stamping die, a stamping device, and a manufacturing method of a stamping die material for the problem that when stamping and forming an electrode plate, it is easy to scratch the surface of the electrode plate, affecting the final forming quality of the electrode plate.

[0005] In a first aspect, the present application provides a stamping die for stamping and forming a battery electrode plate. The stamping die includes a first die body and a second die body, and the first die body and the second die body are stacked along a preset direction for accommodating the battery electrode plate.

[0006] Wherein, at least one of the first die body and the second die body includes a base material layer, a first film layer, and a second film layer. The first film layer covers the outer periphery of the base material layer, and the second film layer covers the outer periphery of the first film layer, and the hardness of the second film layer is less than the hardness of the first film layer.

[0007] Thus, through the above structure, during the stamping process of the battery electrode plate, the first film layer and the second film layer on the first die body and / or the second die body cooperate with each other, and on the basis of considering the surface hardness of the first die body and / or the second die body, the lubrication and anti-friction effects of the first die body and / or the second die body can be improved, the service life of the stamping die can be extended, and the stamping and forming quality can be improved.

[0008] According to one or more embodiments, the first film layer includes a titanium nitride film layer.

[0009] Through the above structure, the titanium nitride film layer can effectively reduce the probability of oxidation on the surface of the first die body and / or the second die body, and can effectively improve the surface hardness of the first die body and / or the second die body, thus extending the service life of the stamping die.

[0010] According to one or more embodiments, the second film layer includes a soft metal film layer.

[0011] Through the above structure, the soft metal film layer has good lubrication and anti-friction effects. Cooperating with the titanium nitride film layer, a composite metal film layer can be formed, which can effectively improve the forming quality of the battery electrode sheet and reduce costs while significantly increasing the hardness and service life.

[0012] According to one or more embodiments, the thickness range of the first film layer is 4μm to 20μm.

[0013] Therefore, during the formation of the first film layer, making the thickness of the first film layer within the above range can effectively reduce the probability of oxidation on the surface of the first die body and / or the second die body, and can effectively improve the surface hardness of the first die body and / or the second die body, thus extending the service life of the stamping die.

[0014] According to one or more embodiments, the thickness range of the second film layer is 4μm to 20μm.

[0015] Therefore, during the formation of the second film layer, making the thickness of the second film layer within the above range can effectively improve the lubrication and anti-friction effects of the first die body and / or the second die body, and improve the forming quality of the battery electrode sheet.

[0016] According to one or more embodiments, the material of the substrate layer includes one or more of 45# steel, Cr12MoV die steel, SKD11 die steel, DC53 die steel, SKH-9 die steel, Q235 die steel, SKH51 die steel, P20 die steel, YXM1 die steel, SLD die steel, and V4 die steel.

[0017] Through the above structure, the substrate layer can provide a support basis for the subsequent attachment of the first film layer and the second film layer, and together with the first film layer and the second film layer, form the first die body and / or the second die body with a multi-layer structure, enabling the first die body and / or the second die body to have both a relatively large surface hardness and good lubrication and anti-friction effects.

[0018] According to one or more embodiments, the stamping die also includes a first mold assembly and a second mold assembly, the first mold assembly is arranged on a side of the first mold body away from the second mold body along the preset direction, and the second mold assembly is arranged on a side of the second mold body away from the first mold body along the preset direction, and the first mold assembly and the second mold assembly are used to provide a pressing force along the preset direction to bring the first mold body and the second mold body closer to each other.

[0019] In this way, the first mold assembly and the second mold assembly can provide external force to the first mold body and the second mold body along a preset direction, so that the first mold body and the second mold body can more stably limit and fix the battery electrode located therebetween, so that the battery electrode can be smoothly formed.

[0020] According to one or more embodiments, the first mold assembly includes a first mold base and a first mold plate that are connected to each other, and a first limiting groove for accommodating the first mold body is formed on a surface of the first mold plate that is away from the first mold base.

[0021] Therefore, through the above structure, on the one hand, the first mold base and the first mold plate can be disassembled and assembled more conveniently, and the relative positions of the structures can be better adjusted; on the other hand, the first limiting groove can limit the first mold body, so that the position of the first mold body is more stable, thereby making the force on the first mold body more uniform and stable.

[0022] According to one or more embodiments, the second mold assembly includes a second mold base and a second mold plate that are connected to each other, and a second limiting groove for accommodating the second mold body is formed on a surface of the second mold plate that is away from the second mold base.

[0023] Therefore, through the above structure, on the one hand, the second mold base and the second mold plate can be disassembled and assembled more conveniently, and the relative positions of the structures can be better adjusted; on the other hand, the second limiting groove can limit the second mold body, making the position of the second mold body more stable, so that the force on the second mold body is more uniform and stable.

[0024] In a second aspect, the present application also provides a stamping device, comprising the stamping die as described above.

[0025] In a third aspect, the present application further provides a method for manufacturing a stamping die material, which is applied to the stamping die as described above, and the manufacturing method comprises the following steps:

[0026] Putting the substrate layer, the first target material and the second target material into a vacuum plating furnace;

[0027] Evacuate the vacuum plating furnace to a basic vacuum degree;

[0028] Introduce a target medium into the vacuum plating furnace, and the target medium reacts with the first target to form a first film layer on the outer surface of the substrate layer;

[0029] Form a second film layer on the outer surface of the first film layer through ion deposition of the second target, and the hardness of the second film layer is less than that of the first film layer;

[0030] Cool the substrate layer, the first film layer covering the outer periphery of the substrate layer, and the second film layer covering the outer periphery of the first film layer, and restore the inside of the vacuum plating furnace to atmospheric pressure to form a first mold body and / or a second mold body.

[0031] According to one or more embodiments, the first target includes a titanium target; and / or, the second target includes a soft metal target.

[0032] According to one or more embodiments, the base vacuum degree is less than or equal to 3×10 -3 Pa.

[0033] According to one or more embodiments, after the step of evacuating the inside of the vacuum plating furnace to the base vacuum degree, the following step is further included:

[0034] Introduce an inert gas into the vacuum plating furnace.

[0035] According to one or more embodiments, after the step of introducing an inert gas into the vacuum plating furnace, the following step is further included:

[0036] Bake and heat the substrate layer and perform argon ion bombardment;

[0037] Introduce nitrogen and maintain the vacuum degree at 10 -1 Pa.

[0038] According to one or more embodiments, before the step of placing the substrate layer, the first target, and the second target into the vacuum plating furnace, the following step is further included:

[0039] Clean the substrate layer by ultrasonic cleaning with water, ultrasonic cleaning with alkali solution, ultrasonic cleaning with acetone, and ultrasonic cleaning with ethanol;

[0040] Dry the cleaned substrate layer.

[0041] According to one or more embodiments, the thickness range of the first film layer is 4μm to 20μm; and / or, the thickness range of the second film layer is 4μm to 20μm.

[0042] According to one or more embodiments, after the steps of cooling the substrate layer, the first film layer coated on the outer periphery of the substrate layer, and the second film layer coated on the outer periphery of the first film layer, and restoring the inside of the vacuum plating furnace to atmospheric pressure to form the first die body and / or the second die body, the method further includes the steps of:

[0043] Stack the first die body and the second die body in a preset direction, and form a receiving groove for receiving the battery electrode sheet therebetween;

[0044] Place the battery electrode sheet in the receiving groove;

[0045] Abut a first template against one end of the first die body facing away from the second die body, and limit the first die body in a first limiting groove of the first template;

[0046] Abut a second template against one end of the second die body facing away from the first die body, and limit the second die body in a second limiting groove of the second template;

[0047] Abut the first die base against one end of the first template facing away from the first die body, and abut the second die base against one end of the second template facing away from the second die body.

[0048] In the manufacturing method of the above stamping die, stamping equipment and stamping die material, the battery electrode sheet is placed between the first die body and the second die body. The first die body and the second die body can perform stamping forming on the battery electrode sheet. At the same time, the first die body and / or the second die body is set as a multi-layer structure of a substrate layer, a first film layer and a second film layer, and the layers are coated with each other. The second film layer is located on the outermost layer, and the hardness of the second film layer is less than that of the first film layer. In this way, through the first film layer, the overall hardness of the first die body and / or the second die body can be guaranteed, and the service life of the first die body and / or the second die body can be effectively improved; in addition, the outermost second film layer has good lubrication and anti-friction effects, which can reduce the probability of the surface of the battery electrode sheet being scratched and effectively protect the battery electrode sheet; in this way, through the mutual cooperation of the first film layer and the second film layer, the first die body and / or the second die body can take into account both higher hardness and good stamping effect on the battery electrode sheet, and effectively improve the stamping quality. Description of the Drawings

[0049] Figure 1 It is a schematic structural diagram of a stamping die according to one or more embodiments.

[0050] Figure 2 It is a schematic structural diagram of the first die body and the second die body in a stamping die according to one or more embodiments.

[0051] Figure 3Schematic structural diagram of the first die body in a stamping die according to one or more embodiments.

[0052] Figure 4 Schematic structural diagram of the second die body in a stamping die according to one or more embodiments.

[0053] Figure 5 Schematic structural diagram of a stamping die according to one or more embodiments.

[0054] Figure 6 It is Figure 1 Partial enlarged view of location A in

[0055] Figure 7 It is Figure 2 Partial enlarged view of location B in

[0056] Figure 8 Schematic flow diagram of a manufacturing method of a stamping die material according to one or more embodiments.

[0057] Figure 9 Schematic flow diagram of a manufacturing method of a stamping die material according to one or more embodiments.

[0058] Figure 10 Schematic flow diagram of a manufacturing method of a stamping die material according to one or more embodiments.

[0059] Figure 11 Schematic flow diagram of a manufacturing method of a stamping die material according to one or more embodiments.

[0060] Explanation of reference numerals: 100, stamping die; 200, battery pole piece; 10, first die body; 20, second die body; 30, receiving groove; 40, first die assembly; 50, second die assembly; 11, base material layer; 12, first film layer; 13, second film layer; 41, first die base; 42, first template; 43, first limiting groove; 51, second die base; 52, second template; 53, second limiting groove; a, preset direction. Detailed implementation manners

[0061] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0062] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0063] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0064] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "coupled", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0065] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0066] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0067] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , an embodiment of the present application provides a stamping die 100 for stamping and forming a battery electrode plate 200. The stamping die 100 includes a first die body 10 and a second die body 20. The first die body 10 and the second die body 20 are stacked along a preset direction a for accommodating the battery electrode plate 200. Among them, at least one of the first die body 10 and the second die body 20 includes a base material layer 11, a first film layer 12 and a second film layer 13. The first film layer 12 is coated on the outer periphery of the base material layer 11, and the second film layer 13 is coated on the outer periphery of the first film layer 12, and the hardness of the second film layer 13 is less than the hardness of the first film layer 12.

[0068] It should be noted that a fuel cell is a device that directly converts the chemical energy of fuel into electrical energy. It has the advantages of high energy conversion efficiency, environmental friendliness, low operating temperature, etc., and is a clean energy technology with great development prospects. A fuel cell is usually composed of a plurality of single cells stacked, and a single cell usually includes a cathode plate and an anode plate. Hydrogen is introduced into the anode plate as fuel, and air is introduced into the cathode plate as an oxidant. Under the connection of the load, hydrogen and oxygen react to generate electrical energy. The metal bipolar plate is the core component of the proton exchange membrane fuel cell. The metal bipolar plate has obvious advantages compared with graphite and composite bipolar plates, such as good thermal and electrical conductivity, good gas barrier property, high mechanical strength, etc., and is gradually becoming the technical trend and research hotspot of high-power density fuel cell design.

[0069] During the stamping and forming process of the battery electrode plate 200, due to the tangential friction force during stamping, the surface of the formed battery electrode plate 200 is scratched. Since the battery electrode plate 200 of the fuel cell has extremely high requirements for surface finish, the ordinary stamping quality cannot meet the requirements of the finished product, resulting in the need for secondary electroplating treatment for the formed battery electrode plate 200. This process is to first stamp the battery electrode plate 200 and then electroplate the coating, that is, electroplate after forming. The coating is uneven and affected by the process, and some depressions are not electroplated successfully or are extremely easy to fall off.

[0070] In addition, in the industry, for the processing technology of the battery electrode sheet 200, the base material of the electrode sheet needs to be secondarily treated to electroplate a coating layer, and then stamping is carried out. Although this process is simple and low-cost, and the surface coating is uniform, affected by friction, the surface scratches are serious and the defective rate is high.

[0071] Under such a premise, when stamping the battery electrode sheet 200, the current stamping die 100 is likely to cause scratches on the surface of the battery electrode sheet 200, affecting the quality of the finally formed battery electrode sheet 200.

[0072] In the present application, the stamping die 100 can be used to stamp the battery electrode sheet 200. Of course, it can also be used to stamp other products according to actual needs. The preset direction a can be set as the vertical direction or the horizontal direction. The first die body 10 and the second die body 20 are stacked along the preset direction a, and a receiving groove 30 is formed therebetween. The battery electrode sheet 200 can be placed in the receiving groove 30. When the first die body 10 and the second die body 20 move towards each other, pressure can be provided to the battery electrode sheet 200 in the receiving groove 30, so that it can be successfully formed in the receiving groove 30.

[0073] For the current stamping die 100, die steels such as 45#, Cr12MoV, SKD11, DC53, SKH-9, Q235, SKH51, P20, YXM1, SLD, V4, etc. are usually used as the materials of the die. The hardness of these materials is usually between HRC45 and 50. After conventional heat treatment, the surface hardness reaches HRC58 - 60.

[0074] Therefore, the material hardness of the current stamping die 100 is relatively large, and when it is used to stamp and form the battery electrode sheet 200, it is likely to cause scratches on the surface of the battery electrode sheet 200.

[0075] Based on this, for the stamping die 100 provided in the present application, at least one of the first die body 10 and the second die body 20 is set as a multi-layer coating structure, that is, at least one of the first die body 10 and the second die body 20 includes a base material layer 11, a first film layer 12, and a second film layer 13 that are sequentially coated from the inside to the outside. Among them, the base material layer 11 is located on the innermost side, then the first film layer 12 is coated on the outer periphery of the base material layer 11, and then the second film layer 13 is coated on the outer periphery of the first film layer 12.

[0076] Understandably, the first mold body 10 can be set as a multi-layer structure in which the above-mentioned substrate layer 11, the first film layer 12, and the second film layer 13 are successively coated. The second mold body 20 can also be set as a multi-layer structure in which the above-mentioned substrate layer 11, the first film layer 12, and the second film layer 13 are successively coated. Of course, the first mold body 10 and the second mold body 20 can also be simultaneously set as a multi-layer structure in which the above-mentioned substrate layer 11, the first film layer 12, and the second film layer 13 are successively coated.

[0077] Furthermore, the hardness of the second film layer 13 is less than that of the first film layer 12. That is to say, the first film layer 12 has a relatively large hardness, and the first film layer 12 is located between the substrate layer 11 and the second film layer 13. In this way, on the one hand, the first film layer 12 can form a certain support strength for the overall structure of the first mold body 10 or the second mold body 20. On the other hand, the first film layer 12 can effectively reduce the probability of the surface of the first mold body 10 or the second mold body 20 being oxidized, and can effectively improve the surface hardness of the first mold body 10 or the second mold body 20.

[0078] In addition, the second film layer 13 is located on the outermost layer and has a relatively small hardness. In this way, during the stamping process, the second film layer 13 actually contacts the battery electrode plate 200. The second film layer 13 has good lubrication and anti-friction effects, and can better protect the surface of the battery electrode plate 200 from being scratched.

[0079] Therefore, through the above structure, during the stamping process of the battery electrode plate 200, the first film layer 12 and the second film layer 13 on the first mold body 10 and / or the second mold body 20 cooperate with each other. On the basis of taking into account the surface hardness of the first mold body 10 and / or the second mold body 20, the lubrication and anti-friction effects of the first mold body 10 and / or the second mold body 20 can be improved, the service life of the stamping die 100 can be extended, and the stamping forming quality can be improved.

[0080] In some embodiments, the first film layer 12 includes a titanium nitride film layer.

[0081] Specifically, the first film layer 12 can be but is not limited to being set as a titanium nitride (TiN) film layer. The titanium nitride film layer can effectively reduce the probability of the surface of the first mold body 10 and / or the second mold body 20 being oxidized, and can increase the surface hardness of the first mold body 10 and / or the second mold body 20 by three times compared with the case of conventional heat treatment, and can effectively extend the service life of the stamping die 100.

[0082] Furthermore, the first film layer 12 can adopt a physical vapor deposition technique. Under a vacuum state, a solid film or coating is deposited on the surface of the substrate layer 11 by using physical processes such as thermal evaporation, glow discharge, or arc discharge.

[0083] With the above structure, the titanium nitride film layer can effectively reduce the probability of oxidation on the surfaces of the first die body 10 and / or the second die body 20, and can effectively increase the surface hardness of the first die body 10 and / or the second die body 20, thereby extending the service life of the stamping die 100.

[0084] In some embodiments, the second film layer 13 includes a soft metal film layer.

[0085] Specifically, the second film layer 13 can be, but is not limited to, a soft metal film layer. Among them, the soft metal can be one of silver (Ag), copper (Cu), lead (Pb), and gold (Au). The soft metal film layer has good lubrication and anti-friction effects. Cooperating with the titanium nitride film layer, a composite metal film layer can be formed, which can effectively improve the forming quality of the battery electrode sheet 200 and reduce costs while significantly increasing the hardness and service life.

[0086] In some embodiments, the thickness range of the first film layer 12 is 4μm to 20μm.

[0087] Specifically, the thickness of the first film layer 12, that is, the thickness of the titanium nitride film layer, will affect the probability of oxidation on the surfaces of the first die body 10 and / or the second die body 20, and will also affect the surface hardness of the first die body 10 and / or the second die body 20, thereby affecting the service life of the stamping die 100.

[0088] Therefore, during the formation of the first film layer 12, making the thickness of the first film layer 12 within the above range can effectively reduce the probability of oxidation on the surfaces of the first die body 10 and / or the second die body 20, and can effectively increase the surface hardness of the first die body 10 and / or the second die body 20, thereby extending the service life of the stamping die 100.

[0089] In some embodiments, the thickness range of the second film layer 13 is 4μm to 20μm.

[0090] Specifically, the thickness of the second film layer 13, that is, the thickness of the soft metal film layer, will affect the lubrication and anti-friction effects of the first die body 10 and / or the second die body 20, thereby affecting the quality of the finally formed battery electrode sheet 200.

[0091] Therefore, during the formation of the second film layer 13, making the thickness of the second film layer 13 within the above range can effectively improve the lubrication and anti-friction effects of the first die body 10 and / or the second die body 20, and improve the forming quality of the battery electrode sheet 200.

[0092] In some embodiments, the material of the substrate layer 11 includes one or more of 45# steel, Cr12MoV die steel, SKD11 die steel, DC53 die steel, SKH-9 die steel, Q235 die steel, SKH51 die steel, P20 die steel, YXM1 die steel, SLD die steel, and V4 die steel.

[0093] Specifically, the material of the substrate layer 11 can be selected from the materials of conventional stamping dies 100. For example, the material of the substrate layer 11 can be, but is not limited to, 45# steel, Cr12MoV die steel, SKD11 die steel, DC53 die steel, SKH-9 die steel, Q235 die steel, SKH51 die steel, P20 die steel, YXM1 die steel, SLD die steel, and V4 die steel.

[0094] Furthermore, the substrate layer 11 can provide a support basis for the subsequent attachment of the first film layer 12 and the second film layer 13, and together with the first film layer 12 and the second film layer 13, form the first die body 10 and / or the second die body 20 of the multi-layer structure, so that the first die body 10 and / or the second die body 20 can take into account a relatively large surface hardness as well as good lubrication and anti-friction effects.

[0095] As Figure 1 、 Figure 5 、 Figure 6 and Figure 7 shown, in some embodiments, the stamping die 100 further includes a first die assembly 40 and a second die assembly 50. The first die assembly 40 is disposed on one side of the first die body 10 away from the second die body 20 along a preset direction a, and the second die assembly 50 is disposed on one side of the second die body 20 away from the first die body 10 along the preset direction a. The first die assembly 40 and the second die assembly 50 are used to provide a pressing force for the first die body 10 and the second die body 20 to approach each other along the preset direction a.

[0096] Specifically, the first die assembly 40, the second die assembly 50, the first die body 10, and the second die body 20 are jointly assembled to form the stamping die 100. Among them, the first die assembly 40, the first die body 10, the second die body 20, and the second die assembly 50 can be arranged in sequence from top to bottom. That is, the first die body 10 and the second die body 20 are clamped between the first die assembly 40 and the second die assembly 50, and the battery electrode plate 200 is disposed between the first die body 10 and the second die body 20.

[0097] In this way, the first die assembly 40 and the second die assembly 50 can provide an external force to the first die body 10 and the second die body 20 along the preset direction a, so that the first die body 10 and the second die body 20 can more stably limit and fix the battery electrode plate 200 located between them, and enable the battery electrode plate 200 to be successfully formed.

[0098] In some embodiments, the first mold assembly 40 includes a first mold base 41 and a first template 42 that are connected to each other. A first limiting groove 43 for accommodating the first mold body 10 is formed on a surface of the first template 42 facing away from the first mold base 41.

[0099] Specifically, the first mold assembly 40 can be further divided into a first mold base 41 and a first template 42. Among them, the first mold base 41 and the first template 42 can be detachably connected by bolts or other means.

[0100] Connect the first template 42 to the first mold body 10, and connect the first mold base 41 to one end of the first template 42 facing away from the first mold body 10. Further, a first limiting groove 43 is formed on a surface of the first template 42 facing away from the first mold base 41. In this way, the first mold body 10 can be limited in the first limiting groove 43, making the relative position between the first mold body 10 and the first template 42 more stable.

[0101] Thus, through the above structure, on the one hand, the disassembly and assembly between the first mold base 41 and the first template 42 can be more convenient, and the relative positions between various structures can be adjusted better; on the other hand, the first limiting groove 43 can limit the first mold body 10, making the position of the first mold body 10 more stable, so that the force on the first mold body 10 is more uniform and stable.

[0102] In some embodiments, the second mold assembly 50 includes a second mold base 51 and a second template 52 that are connected to each other. A second limiting groove 53 for accommodating the second mold body 20 is formed on a surface of the second template 52 facing away from the second mold base 51.

[0103] Specifically, the second mold assembly 50 can be further divided into a second mold base 51 and a second template 52. Among them, the second mold base 51 and the second template 52 can be detachably connected by bolts or other means.

[0104] Connect the second template 52 to the second mold body 20, and connect the second mold base 51 to one end of the second template 52 facing away from the second mold body 20. Further, a second limiting groove 53 is formed on a surface of the second template 52 facing away from the second mold base 51. In this way, the second mold body 20 can be limited in the second limiting groove 53, making the relative position between the second mold body 20 and the second template 52 more stable.

[0105] Thus, through the above structure, on the one hand, the disassembly and assembly between the second mold base 51 and the second template 52 can be more convenient, and the relative positions between various structures can be adjusted better; on the other hand, the second limiting groove 53 can limit the second mold body 20, making the position of the second mold body 20 more stable, so that the force on the second mold body 20 is more uniform and stable.

[0106] Based on the same concept as the above stamping die 100, the present application also provides a stamping device, including the stamping die 100 as described above.

[0107] As Figure 8 shown, based on the same concept as the above stamping die 100, the present application also provides a manufacturing method for the material of the stamping die 100, which is applied to the stamping die 100 as described above. The manufacturing method includes the following steps:

[0108] S10: Place the base material layer 11, the first target, and the second target into a vacuum plating furnace.

[0109] S20: Evacuate the inside of the vacuum plating furnace to the base vacuum level.

[0110] S30: Introduce a target medium into the vacuum plating furnace. The target medium reacts with the first target and forms a first film layer 12 on the outer surface of the base material layer 11.

[0111] S40: Form a second film layer 13 on the outer surface of the first film layer 12 through ion deposition of the second target, and the hardness of the second film layer 13 is less than the hardness of the first film layer 12.

[0112] S50: Cool the base material layer 11, the first film layer 12 coated on the outer periphery of the base material layer 11, and the second film layer 13 coated on the outer periphery of the first film layer 12, and restore the inside of the vacuum plating furnace to atmospheric pressure to form the first die body 10 and / or the second die body 20.

[0113] Specifically, during the process of manufacturing the stamping die 100, first select a material from conventional die materials to form the base material layer 11 of the first die body 10 and / or the second die body 20, and process the base material layer 11 into the shape required for stamping.

[0114] Furthermore, place the base material layer 11, the first target, and the second target together into a PVD vacuum plating furnace, and evacuate the inside of the vacuum plating furnace so that the vacuum level inside the vacuum plating furnace remains at the base vacuum level.

[0115] It should be noted that the base vacuum level can be a range, and it is only necessary to keep the vacuum level inside the vacuum plating furnace within this range.

[0116] When the vacuum level inside the vacuum plating furnace is stable, introduce a target medium into the vacuum plating furnace. Among them, the target medium can be adjusted accordingly according to the specific material of the first target, so that the target medium can react smoothly with the first target to produce a specific compound, and finally form a first film layer 12 covering the outer surface of the base material layer 11.

[0117] After the first film layer 12 is formed stably, the second target can form a second film layer 13 coated on the outer surface of the first film layer 12 by means of ion deposition.

[0118] After both the first film layer 12 and the second film layer 13 are formed stably, cooling treatment is performed on the first die body 10 and / or the second die body 20 of the multi-layer structure jointly formed by the substrate layer 11, the first film layer 12 and the second film layer 13. In a vacuum environment, the first die body 10 and / or the second die body 20 are cooled to below 40°C, and then the air is released and gradually restored to atmospheric pressure to complete the surface treatment.

[0119] In some embodiments, the first target includes a titanium target; and / or, the second target includes a soft metal target.

[0120] Specifically, if the first target is a titanium target, nitrogen can be used as the target medium. A protective gas, such as argon, is introduced into the vacuum plating furnace and the vacuum degree is maintained. The substrate layer 11 is baked and heated to nearly 200°C, and argon ion bombardment is performed on the substrate layer 11. After the argon ion bombardment sputtering cleaning is completed, nitrogen is introduced into the vacuum plating furnace. The titanium atoms and nitrogen interact with each other after being plasma-activated to generate titanium nitride compounds, which are deposited on the outer surface of the substrate layer 11 to form a titanium nitride film layer, that is, the first film layer 12.

[0121] Further, the second target can be set as a soft metal target. After the first film layer 12 is formed stably, the nitrogen supply is stopped and the titanium electron gun is cut off, and soft metal ion deposition is performed to form a soft metal film layer on the outer surface of the first film layer 12, that is, the second film layer 13.

[0122] Thus, a titanium nitride film layer can be smoothly formed on the outer surface of the substrate layer 11 through the titanium target, and a soft metal film layer can be formed on the outer surface of the titanium nitride film layer through the soft metal target. In this way, the titanium nitride film layer can effectively reduce the probability of the surface of the first die body 10 and / or the second die body 20 being oxidized, and at the same time improve the surface hardness of the first die body 10 and / or the second die body 20, increasing the service life; meanwhile, the soft metal film layer can provide good lubrication and anti-friction effects.

[0123] In some embodiments, the base vacuum degree is less than or equal to 3×10 -3 Pa.

[0124] Specifically, after putting the dried substrate layer 11, the first target and the second target into the vacuum plating furnace, the inside of the vacuum plating furnace is evacuated to less than or equal to 3×10 -3 Pa, and then a protective gas, such as argon, is introduced into the vacuum plating furnace to keep the vacuum degree inside the vacuum plating furnace.

[0125] Such as Figure 9As shown, in some embodiments, after step S20, the method further includes the steps of:

[0126] S21: Introduce an inert gas into the vacuum plating furnace. The inert gas can be, but is not limited to, argon. Introducing argon into the vacuum plating furnace can better maintain the vacuum degree inside the vacuum plating furnace and make the reaction environment more stable.

[0127] In some embodiments, after step S21, the method further includes the steps of:

[0128] S22: Bake and heat the substrate layer 11 and perform argon ion bombardment.

[0129] S23: Introduce nitrogen gas and maintain the vacuum degree at 10 -1 Pa.

[0130] Specifically, the first target is a titanium target. Bake and heat the substrate layer 11 to fully evaporate the moisture inside the substrate layer 11. Then perform argon ion bombardment on the substrate layer 11. After completing the argon ion bombardment sputtering cleaning, introduce nitrogen gas into the vacuum plating furnace. The titanium atoms and nitrogen gas interact with each other after being plasma-activated to form a compound titanium nitride, which is deposited on the outer surface of the substrate layer 11, thereby smoothly forming a titanium nitride film layer.

[0131] As Figure 10 shown, in some embodiments, before step S10, the method further includes the steps of:

[0132] S08: Clean the substrate layer 11 by ultrasonic cleaning with water, ultrasonic cleaning with alkali solution, ultrasonic cleaning with acetone, and ultrasonic cleaning with ethanol.

[0133] S09: Dry the cleaned substrate layer 11.

[0134] Specifically, ultrasonic cleaning with water can remove dust from the substrate layer 11. Ultrasonic cleaning with alkali solution can remove animal oil on the surface of the substrate layer 11. Ultrasonic cleaning with acetone can remove vegetable oil on the surface of the substrate layer 11. Ultrasonic cleaning with ethanol can dehydrate the substrate layer 11.

[0135] Further, after cleaning, dry the substrate layer 11 to better achieve subsequent reactions.

[0136] In some embodiments, the thickness range of the first film layer 12 is 4μm to 20μm; and / or, the thickness range of the second film layer 13 is 4μm to 20μm.

[0137] Specifically, the thickness of the first film layer 12, that is, the thickness of the titanium nitride film layer, will affect the probability of oxidation of the surfaces of the first die body 10 and / or the second die body 20, and will also affect the surface hardness of the first die body 10 and / or the second die body 20, thereby affecting the service life of the stamping die 100.

[0138] Therefore, during the formation of the first film layer 12, making the thickness of the first film layer 12 fall within the above range can effectively reduce the probability of oxidation of the surfaces of the first die body 10 and / or the second die body 20, and can effectively increase the surface hardness of the first die body 10 and / or the second die body 20, thus enhancing the service life of the stamping die 100.

[0139] Similarly, the thickness of the second film layer 13, that is, the thickness of the soft metal film layer, will affect the lubrication and anti-friction effects of the first die body 10 and / or the second die body 20, thereby affecting the quality of the finally formed battery electrode sheet 200.

[0140] Therefore, during the formation of the second film layer 13, making the thickness of the second film layer 13 fall within the above range can effectively improve the lubrication and anti-friction effects of the first die body 10 and / or the second die body 20, and improve the forming quality of the battery electrode sheet 200.

[0141] As Figure 11 shown, in some embodiments, after the step S50, the method further includes the steps of:

[0142] S51: Stack the first die body 10 and the second die body 20 along a preset direction a, and form a receiving groove 30 therebetween for receiving the battery electrode sheet 200.

[0143] S52: Place the battery electrode sheet 200 into the receiving groove 30.

[0144] S53: Abutt the first template 42 against one end of the first die body 10 facing away from the second die body 20, and limit the first die body 10 in the first limiting groove 43 of the first template 42.

[0145] S54: Abutt the second template 52 against one end of the second die body 20 facing away from the first die body 10, and limit the second die body 20 in the second limiting groove 53 of the second template 52.

[0146] S55: Abutt the first die base 41 against one end of the first template 42 facing away from the first die body 10, and abut the second die base 51 against one end of the second template 52 facing away from the second die body 20.

[0147] Specifically, the battery electrode 200 is arranged in the accommodating groove 30 enclosed between the first mold body 10 and the second mold body 20, which can not only make the battery electrode 200 more stably stamped between the first mold body 10 and the second mold body 20, but also limit the battery electrode 200 to make the force more uniform.

[0148] The first template 42 is connected to the first mold body 10, and the first mold base 41 is connected to the end of the first template 42 away from the first mold body 10. Furthermore, a first limiting groove 43 is provided on the surface of the first template 42 on one side away from the first mold base 41, so that the first mold body 10 can be limited in the first limiting groove 43, so that the relative position between the first mold body 10 and the first template 42 is more stable.

[0149] Therefore, through the above structure, on the one hand, the first mold base 41 and the first mold plate 42 can be more conveniently disassembled and assembled, and the relative positions of the structures can be better adjusted; on the other hand, the first limiting groove 43 can limit the first mold body 10, so that the position of the first mold body 10 is more stable, so that the force on the first mold body 10 is more uniform and stable.

[0150] Similarly, the second template 52 is connected to the second mold body 20, and the second mold base 51 is connected to the end of the second template 52 away from the second mold body 20. Further, a second limiting groove 53 is provided on the surface of the second template 52 on one side away from the second mold base 51, so that the second mold body 20 can be limited in the second limiting groove 53, so that the relative position between the second mold body 20 and the second template 52 is more stable.

[0151] Therefore, through the above structure, on the one hand, the second mold base 51 and the second mold plate 52 can be disassembled and assembled more conveniently, and the relative positions of the structures can be better adjusted; on the other hand, the second limiting groove 53 can limit the second mold body 20, so that the position of the second mold body 20 is more stable, so that the force on the second mold body 20 is more uniform and stable.

[0152] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0153] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A stamping die, characterized in that: Used for stamping and forming a battery pole piece, the stamping die comprises a first mold body and a second mold body, the first mold body and the second mold body are stacked along a preset direction to accommodate the battery pole piece; At least one of the first mold body and the second mold body includes a substrate layer, a first film layer and a second film layer, the first film layer is coated on the periphery of the substrate layer, the second film layer is coated on the periphery of the first film layer, and the hardness of the second film layer is less than the hardness of the first film layer.

2. The stamping die according to claim 1, characterized in that: The first film layer includes a titanium nitride film layer.

3. The stamping die according to claim 1, characterized in that: The second film layer includes a soft metal film layer.

4. The stamping die according to any one of claims 1 to 3, characterized in that: The thickness of the first film layer ranges from 4 μm to 20 μm.

5. The stamping die according to any one of claims 1 to 3, characterized in that: The thickness of the second film layer is in the range of 4 μm to 20 μm.

6. The stamping die according to claim 1, characterized in that: The material of the substrate layer includes one or more of 45# steel, Cr12MoV mold steel, SKD11 mold steel, DC53 mold steel, SKH-9 mold steel, Q235 mold steel, SKH51 mold steel, P20 mold steel, YXM1 mold steel, SLD mold steel, and V4 mold steel.

7. The stamping die according to claim 1, characterized in that: The stamping die also includes a first mold assembly and a second mold assembly. The first mold assembly is arranged on a side of the first mold body away from the second mold body along the preset direction, and the second mold assembly is arranged on a side of the second mold body away from the first mold body along the preset direction. The first mold assembly and the second mold assembly are used to provide a pressing force along the preset direction to bring the first mold body and the second mold body closer to each other.

8. The stamping die according to claim 7, characterized in that: The first mold assembly includes a first mold base and a first mold plate which are connected to each other. A first limiting groove for accommodating the first mold body is formed on a surface of the first mold plate which is away from the first mold base.

9. The stamping die according to claim 7 or 8, characterized in that: The second mold assembly comprises a second mold base and a second mold plate which are connected to each other. A second limiting groove for accommodating the second mold body is formed on a surface of the second mold plate which is away from the second mold base.

10. A stamping device, characterized in that: Comprising the stamping die as described in any one of claims 1-9.

11. A method for manufacturing a stamping die material, characterized in that: Applied to the stamping die according to any one of claims 1 to 9, the manufacturing method comprises the following steps: Putting the substrate layer, the first target material and the second target material into a vacuum plating furnace; Evacuate the vacuum plating furnace to a basic vacuum degree; Passing a target medium into the vacuum plating furnace, wherein the target medium reacts with the first target material and forms a first film layer on the outer surface of the substrate layer; forming a second film layer on the outer surface of the first film layer by ion deposition of the second target material, wherein the hardness of the second film layer is less than the hardness of the first film layer; The substrate layer, the first film layer covering the periphery of the substrate layer, and the second film layer covering the periphery of the first film layer are cooled, and the interior of the vacuum plating furnace is restored to atmospheric pressure to form a first mold and / or a second mold.

12. The manufacturing method according to claim 11, characterized in that: The first target material includes a titanium target; and / or the second target material includes a soft metal target.

13. The manufacturing method according to claim 11, characterized in that: The basic vacuum degree is less than or equal to 3×10 - 3 Pa.

14. The manufacturing method according to claim 11, characterized in that: After the step of evacuating the vacuum plating furnace to a basic vacuum degree, the method further comprises the following steps: An inert gas is introduced into the vacuum plating furnace.

15. The manufacturing method according to claim 14, characterized in that: After the step of introducing inert gas into the vacuum plating furnace, the method further comprises the following steps: The substrate layer is baked and heated and bombarded with argon ions; Nitrogen was introduced to maintain the vacuum degree at 10 -1 Pa.

16. The manufacturing method according to claim 11, characterized in that: Before the step of placing the substrate layer, the first target material and the second target material into the vacuum plating furnace, the step further includes: The substrate layer is cleaned by using clean water ultrasonic cleaning, alkali solution ultrasonic cleaning, acetone ultrasonic cleaning and ethanol ultrasonic cleaning; The cleaned substrate layer is dried.

17. The manufacturing method according to claim 11, characterized in that: The thickness of the first film layer is in the range of 4 μm to 20 μm; and / or the thickness of the second film layer is in the range of 4 μm to 20 μm.

18. The manufacturing method according to claim 11, characterized in that: After cooling the substrate layer, the first film layer wrapped around the substrate layer, and the second film layer wrapped around the first film layer, and restoring the interior of the vacuum plating furnace to atmospheric pressure to form a first mold and / or a second mold, the method further includes: The first mold body and the second mold body are stacked in a preset direction, and a receiving groove for receiving the battery electrode sheet is formed between the two; Placing the battery electrode in the receiving groove; Abutting the first template against one end of the first mold body away from the second mold body, and limiting the first mold body in the first limiting groove of the first template; Abutting the second template against one end of the second mold body away from the first mold body, and limiting the second mold body in the second limiting groove of the second template; The first mold base is abutted against an end of the first mold plate facing away from the first mold body, and the second mold base is abutted against an end of the second mold plate facing away from the second mold body.

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