Production and preparation method of liquid epoxy molded product

Abstract

The invention discloses a production and preparation method of a liquid epoxy molded product, and relates to the technical field of production and preparation. Whether the size and the surface transmittance of the product are qualified or not is judged by analyzing the produced liquid epoxy molded product; when the size or the surface light transmittance of the produced liquid epoxy molded product is unqualified, determining the preliminary adjustment amplitude of the adjustment parameters of the production system; obtaining the temperature of the environment where the liquid epoxy molded product is located during production and the aging information of the production mold to obtain an influence coefficient; and according to the influence coefficient and the preliminary adjustment amplitude, obtaining a final adjustment value of the adjustment parameter, and according to the final adjustment value, adjusting the corresponding production parameter to produce the liquid epoxy molded product. Therefore, all the systems work mutually and do not need to be regulated and controlled manually, the production process can be intelligently regulated and controlled according to the actual size and light transmittance of the liquid epoxy molded product, and it is ensured that the number of production flaws of the liquid epoxy molded product is large and the production flaws of the liquid epoxy molded product are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of production and preparation, and particularly relates to a production preparation method for a liquid epoxy molding product. Background Art

[0002] The molding process is a technical solution widely used in the fields of semiconductors, integrated circuits, LED packaging, etc. The currently common methods are divided into two categories: one is molding in the form of liquid silicone rubber, and the other is molding in the form of solid epoxy resin cakes. Liquid silicone rubber is widely used in the lenses of LED packaging products due to its excellent workability. This kind of lens can improve the luminous brightness of LEDs, achieving the effects of brightening and energy saving. However, the disadvantage is that the hardness of the silicone rubber after molding is relatively soft, and the bonding strength of the lens is insufficient, making it easy to fall off from the surface of the lead frame and unable to be applied in the outdoor display field; Epoxy resin cakes are in solid form, with no problem in workability, and their sealing performance and hardness can be applied in outdoor scenarios. They have been widely used in fields such as transmitting and receiving devices, IC packaging, etc. where there is no requirement for brightness. However, the light transmittance after the solid epoxy resin cake is molded is insufficient, and the brightness cannot be effectively excited when applied to LED packaging products; To solve the above problems, currently, a liquid epoxy molding product is produced by combining liquid silicone rubber and epoxy resin cakes to solve the above problems; specifically, by constructing a liquid epoxy feeding system (used to provide liquid epoxy raw materials; and this feeding system can form a vacuum chamber through a sealing structure to prevent the generation of bubbles during glue operation), a heating system (used to heat the liquid epoxy to an appropriate temperature; through structural design and parameter adjustment, the temperature in the entire mold cavity can reach ±1 degree, ensuring the consistency and stability of the molding), a customized structure mold (used to set the shape and size of the molding product; develop a precise lens angle according to the designed light shape size to keep the shape of the final product consistent), a molding device system (used to press the liquid epoxy into the customized structure mold; the flow rate / vacuum degree / moment of the glue in the mold cavity can be controlled through parameter programming to adapt to different mold cavity structures and product shapes), a cooling system (used to cool the glue channel of the liquid epoxy to room temperature to prevent the glue from curing in the glue channel; facilitating continuous production operation), and a demolding system (used to take out the cooled epoxy product from the mold. The equipment is designed with a bottom lifting structure. After the mold cavity is opened, the lifting structure can automatically lift the molded product, and the operator only needs to take out the material from the mold cavity to achieve automated operation) to produce a liquid epoxy molding product; However, in the above process, the work of each system is independent of each other and requires manual adjustment, and it cannot intelligently adjust and control the production process according to the actual size and light transmittance of the liquid epoxy molding product, resulting in more production defects of the liquid epoxy molding product and increasing the production cost. Summary of the Invention

[0003] The object of the present invention is to solve the above-mentioned problems and provide a production preparation and method for liquid epoxy molding products.

[0004] In the first aspect of the implementation of the present invention, a production method for liquid epoxy molding products is first proposed. The method includes: The method is applied to a central control system, and the central control system is signal-connected to a liquid epoxy feeding system, a heating system, a molding device system, a cooling system, and a demolding system, where: Analyze the produced liquid epoxy molding products to determine whether the size of the products is qualified and whether the surface light transmittance is qualified; When the size or surface light transmittance of the produced liquid epoxy molding products is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate of the glue in the mold cavity, the vacuum degree, and the torque of the molding device system; Obtain the temperature of the environment where the liquid epoxy molding products are produced and the aging information of the production mold to obtain an influence coefficient; Obtain the final adjustment value of the adjustment parameter according to the influence coefficient and the preliminary adjustment range, and adjust the corresponding production parameter according to the final adjustment value to produce liquid epoxy molding products.

[0005] Optionally, analyzing the produced liquid epoxy molding products to determine whether the size of the products is qualified includes: Use a high-precision 3D scanner to scan the liquid epoxy molding products to obtain the three-dimensional coordinate points on the product surface and generate point cloud data; Convert the obtained point cloud data into a three-dimensional model, the three-dimensional model coincides with the preset product standard three-dimensional model, and calculate the coincidence degree of the key areas and the non-key areas in the three-dimensional model and the preset product standard three-dimensional model; If the coincidence degree of the key areas is equal to 1 and the coincidence degree of the non-key areas is not less than the preset coincidence degree threshold, the corresponding liquid epoxy molding product is qualified; otherwise, the corresponding liquid epoxy molding product is unqualified.

[0006] Optionally, analyzing the produced liquid epoxy molding products to determine whether the surface light transmittance of the products is qualified includes: Obtain the light intensity before and after passing through the liquid epoxy molding products, and divide the light intensity after passing through the liquid epoxy molding products by the light intensity before passing through the liquid epoxy molding products to obtain the light transmittance of the liquid epoxy molding products; Compare the light transmittance of the liquid epoxy molding products with the preset light transmittance threshold. If the light transmittance is greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding products is qualified; if the light transmittance is not greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding products is unqualified.

[0007] Optionally, when the size or surface light transmittance of the produced liquid epoxy molding product is unqualified, the preliminary adjustment range of the adjustment parameters of the production system includes: When the size of the produced liquid epoxy molding product is unqualified, increase the heating temperature; and if the size of the produced liquid epoxy molding product is greater than the preset size, increase the flow rate and torque; if the size of the produced liquid epoxy molding product is less than the preset size, decrease the flow rate and torque; When the light transmittance of the produced liquid epoxy molding product is unqualified, increase the heating temperature and the vacuum degree; Calculate the absolute difference between the size of the produced liquid epoxy molding product and the preset size, and correspond the absolute difference to the preset flow rate and torque adjustment range table respectively to obtain the preliminary adjustment ranges of the flow rate and torque; Calculate the absolute difference between the light transmittance of the produced liquid epoxy molding product and the preset light transmittance threshold, and correspond the absolute difference to the preset vacuum degree adjustment range table to obtain the preliminary adjustment range of the vacuum degree; Take the average value of the absolute difference between the size of the produced liquid epoxy molding product and the preset size and the absolute difference between the light transmittance and the preset light transmittance as the temperature adjustment coefficient, and correspond the temperature adjustment coefficient to the preset temperature adjustment range table to obtain the preliminary adjustment range of the heating temperature.

[0008] Optionally, the steps to obtain the influence coefficient of the preliminary adjustment range by acquiring the temperature of the environment where the liquid epoxy molding product is produced and the aging information of the production mold are as follows: Acquire the temperature and humidity of the environment where the liquid epoxy molding product is produced, and calculate the temperature and humidity influence coefficient according to the temperature and humidity of the environment and the preset temperature and humidity. The calculation formula is: Wherein, is the temperature and humidity influence coefficient, respectively represent the temperature and humidity of the environment where the liquid epoxy molding product is produced, represents the time period when the temperature of the environment is not less than the preset optimal temperature, represents the time period when the humidity of the environment is not less than the preset optimal humidity; and are respectively the preset proportional coefficients of temperature and humidity, and and are both greater than 0; Acquire the used duration and the preset service life of the production mold, divide the used duration by the preset service life to obtain the usage time coefficient, acquire the usage frequency of the produced mold, and multiply the usage frequency by the usage time coefficient to obtain the mold aging coefficient; Obtain the influence coefficient of the preliminary adjustment range based on the temperature and humidity influence coefficient and the mold aging coefficient.

[0009] Optionally, obtaining the influence coefficient of the preliminary adjustment range based on the temperature and humidity influence coefficient and the mold aging coefficient includes: In the formula, is the influence coefficient of the preliminary adjustment range, and are the temperature and humidity influence coefficient and the mold aging coefficient respectively, are respectively and preset proportionality coefficients, and are both greater than 0.

[0010] Optionally, obtaining the final adjustment value of the adjustment parameter based on the influence coefficient and the preliminary adjustment range includes: Multiply the preliminary adjustment range by the sum of the influence coefficient plus 1 to obtain the final adjustment range, and add or subtract the final adjustment range in accordance with the corresponding adjustment direction on the basis of the current production parameters to obtain the final adjustment value.

[0011] In the second aspect of the implementation of the present invention, a production preparation of a liquid epoxy molding product is proposed, and the preparation includes: Central control system: Signally connected to the liquid epoxy feeding system, heating system, molding device system, cooling system, and demolding system, and analyze the produced liquid epoxy molding product to determine whether the size of the product is qualified and whether the surface light transmittance is qualified; When the size or surface light transmittance of the produced liquid epoxy molding product is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate, vacuum degree, and torque of the glue in the mold cavity by the molding device system; Obtain the temperature of the environment where the liquid epoxy molding product is produced and the aging information of the production mold to obtain the influence coefficient; obtain the final adjustment value of the adjustment parameter based on the influence coefficient and the preliminary adjustment range, and send the final adjustment values of the heating temperature, flow rate, vacuum degree, and torque to the heating system and the molding device system respectively.

[0012] Heating system: Used to adjust the heating temperature during the production process according to the final adjustment value of the heating temperature issued by the central control system; Molding device system: Used to adjust the flow rate, vacuum degree, and torque of the glue in the mold cavity according to the final adjustment values of the flow rate, vacuum degree, and torque issued by the central control system.

[0013] Advantages of the present invention: The present invention provides a method for producing and preparing a liquid epoxy molding product. By analyzing the produced liquid epoxy molding product, it is determined whether the size of the product is qualified and whether the surface light transmittance is qualified. When the size or surface light transmittance of the produced liquid epoxy molding product is unqualified, the preliminary adjustment range of the adjustment parameters of the production system is determined. The temperature of the environment during the production of the liquid epoxy molding product and the aging information of the production mold are obtained to obtain the influence coefficient. According to the influence coefficient and the preliminary adjustment range, the final adjustment value of the adjustment parameters is obtained, and the corresponding production parameters are adjusted according to the final adjustment value to produce the liquid epoxy molding product. In this way, the work between each system is mutual, and no manual control is required. The production process can be intelligently adjusted and controlled according to the actual size and light transmittance of the liquid epoxy molding product, ensuring that there are fewer production defects in the liquid epoxy molding product and reducing them. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The following further describes the present invention with reference to the accompanying drawings.

[0015] Figure 1 It is a flowchart of a production method for a liquid epoxy molding product; Figure 2 It is a framework diagram of the production and preparation of a liquid epoxy molding product. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0017] Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] The embodiments of the present invention provide a production method for a liquid epoxy molding product. Refer to Figure 1 , Figure 1 It is a flowchart of a production method for a liquid epoxy molding product provided by an embodiment of the present invention. This method is applied to a central control system, and the central control system is signal-connected to a liquid epoxy feeding system, a heating system, a molding device system, a cooling system, and a demolding system, where: Analyze the produced liquid epoxy molding product to determine whether the size of the product is qualified and whether the surface light transmittance is qualified; When the size or surface light transmittance of the produced liquid epoxy molding product is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate of the glue in the mold cavity by the molding device system, the vacuum degree, and the torque. Obtain the influence coefficient by acquiring the temperature of the environment where the liquid epoxy molding product is produced and the aging information of the production mold. Obtain the final adjustment value of the adjustment parameter according to the influence coefficient and the preliminary adjustment range, and adjust the corresponding production parameter according to the final adjustment value to produce the liquid epoxy molding product.

[0019] Based on the production method of a liquid epoxy molding product provided by the embodiment of the present invention, the work between each system is mutual, and no manual control is required. It can intelligently adjust and control the production process according to the actual size and light transmittance of the liquid epoxy molding product, ensuring that there are fewer production defects in the liquid epoxy molding product and reducing production costs.

[0020] It should be noted that analyzing whether the size of the liquid epoxy molding product is qualified and whether the surface light transmittance is qualified is directly related to whether the problems of "the hardness of the product is too soft after molding, the bonding strength of the lens is insufficient, it is easy to fall off from the surface of the lead frame, and it cannot be applied in the outdoor display field and the brightness cannot be effectively excited in the LED packaging product" can be solved, because these two criteria fundamentally solve the deficiencies of the liquid epoxy product in terms of hardness, strength, and light transmittance. First of all, the size qualification ensures the structural stability and consistency of the molded product, enabling the bonding surface of the final product to perfectly fit the lead frame. If the size deviation is large, the contact between the lens and the lead frame is not tight, which may lead to insufficient bonding strength and cause the lens to fall off from the frame, especially in outdoor use scenarios where the external environment changes greatly. Therefore, precise size control can greatly improve the bonding strength, thus solving the problems of soft product hardness and falling off; secondly, the surface light transmittance qualification solves the optical performance of the liquid epoxy material in LED packaging; although liquid silicone can improve the brightness of LEDs, its hardness is relatively soft, resulting in unstable use in applications such as outdoor displays; by ensuring that the liquid epoxy molding product has sufficient light transmittance, it can effectively transmit light, improve the light efficiency of LEDs, and thus overcome the problems of poor light transmittance and ineffective brightness excitation of epoxy glue cakes. At the same time, good light transmittance can also improve the overall optical performance, ensuring that the final brightness and color performance meet the requirements, achieving the effects of energy saving and brightness enhancement, especially in outdoor displays and high-brightness demand scenarios; by ensuring the qualified analysis of these two aspects, the liquid epoxy molding product can achieve an ideal balance in terms of hardness, strength, and optical performance, thereby solving the shortcomings of liquid silicone and epoxy glue cake materials, and realizing stable and efficient applications in the fields of LED packaging and outdoor displays, improving the performance of the overall product.

[0021] In one embodiment, analyzing the produced liquid epoxy molding product to determine whether the product size is qualified includes: Using a high-precision 3D scanner to scan the liquid epoxy molding product to obtain the three-dimensional coordinate points on the product surface and generate point cloud data; Converting the obtained point cloud data into a 3D model, making the 3D model coincide with the preset standard 3D model of the product, and calculating the coincidence degree of the key areas and the non-key areas in the 3D model and the preset standard 3D model of the product; If the coincidence degree of the key area is equal to 1 and the coincidence degree of the non-key area is not less than the preset coincidence degree threshold, the corresponding liquid epoxy molding product is qualified; otherwise, the corresponding liquid epoxy molding product is unqualified.

[0022] It should be noted that in the process of analyzing the size qualification of the produced liquid epoxy molding product, by using high-precision 3D scanning technology and combining the method of 3D model comparison, it is possible to efficiently and accurately evaluate whether the actual size of the product meets the design requirements. The specific operation steps are as follows: 1. Obtaining point cloud data through 3D scanning: First, use a high-precision 3D scanner (such as a laser scanner or a structured light scanner) to scan the liquid epoxy molding product. During the scanning process, the device obtains the three-dimensional coordinate points of each position on the product surface through scanning and generates a point cloud data set. The point cloud data contains the detailed geometric information of the product surface and can accurately capture each part of the product, including curved surfaces, edges, and subtle shape features. Example: If the scanned product is a lens, each coordinate point on the product surface can be obtained through scanning, and the distribution of these points can fully describe the shape and size of the lens.

[0023] 2. Generating a 3D model: Process the point cloud data through professional 3D modeling software (such as Geomagic, MeshLab, etc.), clean the noise, remove unnecessary points, and generate a complete 3D model. This 3D model represents the actual appearance and size of the product. The generated 3D model can present every corner and surface form of the product in detail. Example: After data processing, a complete 3D lens model will be obtained, and each point of it corresponds to the size of the actual product.

[0024] 3. Comparing with the preset standard 3D model Compare the generated actual 3D model with the preset standard 3D model in the design drawing; the preset standard 3D model represents the ideal shape and size that the designer hopes the product to achieve; when comparing, the coincidence degree between the models can be calculated, that is, the matching degree between the actual product and the standard product in space.

[0025] Definition of Coincidence Degree: The coincidence degree refers to the degree of overlap between two 3D models in the same space, which can be quantified by calculating indicators such as the surface distance and curvature difference between the two; the higher the coincidence degree, the closer the shape of the product is to the design requirements.

[0026] Example: By comparing the surface of the lens, the coincidence degree between its surface and the surface of the standard model in key areas (such as the diameter, thickness, and angle of the lens) can be calculated to determine whether it meets the specifications.

[0027] 4. Coincidence Degree Analysis of Key Areas and Non-Key Areas: In 3D comparative analysis, a product can be divided into key areas and non-key areas: Key Areas: Usually the most important parts of product performance, such as the core part of the lens (such as surface smoothness, key dimensions such as diameter and thickness, etc.), these areas play a decisive role in the function and performance of the product; Non-Key Areas: These areas usually have less impact on the function of the product, such as some edge parts or non-load-bearing parts.

[0028] During analysis, first calculate the coincidence degree of the key areas. If the coincidence degree of these key areas is 1 (i.e., complete coincidence), it means that the dimensions of these core components fully meet the design requirements; calculate the coincidence degree of the non-key areas, and the coincidence degree of this area should not be less than a preset coincidence degree threshold. If this condition is met, it means that the dimensional error of the non-key areas is within an acceptable range.

[0029] Example: For example, the diameter, thickness, and surface smoothness of the lens are key areas. If their coincidence degree is 1, it means that the core dimensions of the lens fully meet the design requirements. For non-key areas such as slight errors on the side or edge, the coincidence degree requirement reaches a certain set threshold, such as 0.95, indicating that even with slight deviations, they are still acceptable.

[0030] 5. Judgment of Qualification: Based on the results of the above analysis, a conclusion is drawn on whether the product is qualified: If the coincidence degree of the key areas is 1 and the coincidence degree of the non-key areas is not less than the preset coincidence degree threshold (such as 0.95), it means that the dimensions of the liquid epoxy molding product meet the design requirements and the product can be considered qualified; if the coincidence degree of the key areas is not 1, or the coincidence degree of the non-key areas is lower than the preset threshold, it means that there are obvious deviations in the dimensions of the product and it cannot meet the design requirements and should be judged as unqualified.

[0031] Example: If the coincidence degree of the key areas (such as diameter and thickness) of the lens is 1, while the coincidence degree of the side edge part is 0.93, lower than the set threshold of 0.95, then the product is judged as unqualified because the deviation of the non-key area exceeds the tolerance range.

[0032] In one implementation method, the point cloud data of the product is obtained through 3D scanning, and then the generated 3D model is compared and analyzed with the design model to accurately determine whether the size of the liquid epoxy molding product is qualified. This method not only improves the measurement accuracy but also comprehensively evaluates the conformity between the shape of the product and the design. By analyzing the coincidence degree of the key areas and non-key areas, it is possible to accurately distinguish which dimensions are crucial for the product performance and make a scientific and objective qualification judgment according to the coincidence degree standard.

[0033] In one embodiment, analyzing the produced liquid epoxy molding product to determine whether the surface light transmittance of the product is qualified includes: Obtain the light intensities before and after passing through the liquid epoxy molding product, and divide the light intensity after passing through the liquid epoxy molding product by the light intensity before passing through the liquid epoxy molding product to obtain the light transmittance of the liquid epoxy molding product; Compare the light transmittance of the liquid epoxy molding product with the preset light transmittance threshold. If the light transmittance is greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding product is qualified; if the light transmittance is not greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding product is unqualified.

[0034] It should be noted that the preset light transmittance threshold is set by professionals according to the actual situation, and specific details are not limited and will not be elaborated.

[0035] It should be noted that when measuring the light transmittance, a high-precision light intensity meter (such as a spectral transmissometer) is used to measure the light intensities before and after passing through the liquid epoxy molding product respectively.

[0036] Incident light intensity ( ): Record the light intensity before the light enters the liquid epoxy molding product.

[0037] Transmitted light intensity ( ): Record the light intensity after the light passes through the liquid epoxy molding product.

[0038] Calculate the light transmittance: The calculation formula is: ; When the light transmittance is greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding product is qualified; conversely, when the light transmittance is not greater than the preset light transmittance threshold, the surface light transmittance of the liquid epoxy molding product is unqualified.

[0039] In one implementation manner, by measuring the light intensity and calculating the transmittance, it is possible to accurately determine whether the transmittance of the liquid epoxy molding product is qualified. If the transmittance meets the standard, the product can be normally used in related applications such as LED packaging, etc.; if the transmittance does not meet the standard, it may affect the brightness and light efficiency of the final product, and thus affect the performance of the product. By strictly monitoring the transmittance, the production department can timely discover and improve possible process or material problems to ensure that the product quality meets the requirements.

[0040] In one embodiment, when the size or surface transmittance of the produced liquid epoxy molding product is unqualified, determining the preliminary adjustment range of the adjustment parameters of the production system includes; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate of the glue in the mold cavity by the molding device system, the vacuum degree, and the torque; When the size of the produced liquid epoxy molding product is unqualified, increase the heating temperature; and if the size of the produced liquid epoxy molding product is larger than the preset size, increase the flow rate and torque; if the size of the produced liquid epoxy molding product is smaller than the preset size, decrease the flow rate and torque; When the transmittance of the produced liquid epoxy molding product is unqualified, increase the heating temperature and the vacuum degree; Calculate the absolute difference between the size of the produced liquid epoxy molding product and the preset size, and correspond the absolute difference to the preset flow rate and torque adjustment range table respectively to obtain the preliminary adjustment ranges of the flow rate and torque; Calculate the absolute difference between the transmittance of the produced liquid epoxy molding product and the preset transmittance threshold, and correspond the absolute difference to the preset vacuum degree adjustment range table to obtain the preliminary adjustment range of the vacuum degree; Take the average value of the absolute difference between the size of the produced liquid epoxy molding product and the preset size and the absolute difference between the transmittance and the preset transmittance as the temperature adjustment coefficient, and correspond the temperature adjustment coefficient to the preset temperature adjustment range table to obtain the preliminary adjustment range of the heating temperature.

[0041] It should be noted that when the size of the produced liquid epoxy molding product is unqualified, the heating temperature is increased because increasing the temperature helps to increase the fluidity of the liquid epoxy, enabling it to better fill the mold and reducing dimensional errors caused by insufficient fluidity. At the same time, raising the heating temperature can make the curing process of the epoxy material more uniform, thus ensuring that the size of the final product meets the predetermined standards. If the size is larger than the preset value, the flow rate and torque are increased to push more glue into the mold and fill more space, thereby ensuring that the product can fully fill the mold shape during molding. Conversely, if the size is smaller than the preset value, reducing the flow rate and torque can slow down the inflow speed of the glue and prevent too much glue from being insufficient to fill the mold, resulting in a product with an incorrect size; when the light transmittance is unqualified, the reasons for increasing the heating temperature and vacuum degree are mainly related to the bubbles in the glue. During the molding process of liquid epoxy glue, if the heating temperature is too low, the glue may not have sufficient fluidity and mobility, resulting in bubbles not being discharged in time and affecting the final light transmittance. By increasing the vacuum degree, the bubbles in the glue can be removed more effectively because under a lower air pressure environment, the bubbles are prone to expand and overflow, thereby improving the light transmittance of the product. The combination of increasing the temperature and vacuum degree can reduce the generation of bubbles and enhance the transparency of the glue, enabling the product to achieve the desired optical properties.

[0042] It should be noted that the absolute difference between the size of the produced liquid epoxy molding product and the preset size, as well as whether the size of the produced liquid epoxy molding product is larger than the preset size, can be calculated and judged by a dimensional measuring instrument and an automated data acquisition system. First, use precise measuring tools such as a coordinate measuring machine (CMM), a laser scanner, or an image measuring system to measure the size of the molding product with high precision to ensure that the measured size data is accurate. Then, by comparing with the preset size, the absolute difference between the product size and the preset size is obtained. If it is necessary to determine whether the product size is larger or smaller than the preset size, directly compare the measured actual size with the preset size. If the actual size is larger than the preset size, it is judged as "oversize"; if the actual size is smaller than the preset size, it is judged as "undersize". Through these measurement and calculation steps, the deviation of the product size can be accurately obtained and used as a basis for subsequent adjustment parameters to ensure that the product meets the quality standards.

[0043] It should be noted that the corresponding table for preset vacuum degree adjustment range, the corresponding table for preset flow rate and torque adjustment range, and the corresponding table for preset temperature adjustment range are all set by professionals according to the actual situation, and are set by professionals based on long-term experiments and data analysis according to actual production experience, process requirements, and product characteristics. The specific values are not limited and will not be elaborated.

[0044] In one implementation manner, calculating the adjustment amplitude based on the actual deviations of the product size and light transmittance helps to accurately identify and eliminate the deviations in the production process, ensuring that each batch of products can meet the preset quality standards; using empirical data and actual measurement results to adjust each adjustment parameter not only reduces the error of manual adjustment but also improves the production efficiency and stability. By dynamically adjusting key process parameters such as temperature, flow rate, torque, and vacuum degree, the system can adaptively respond to the changes in different production environments and raw material batches, optimize the production conditions, and reduce the defective product rate.

[0045] In one embodiment, obtaining the temperature of the environment where the liquid epoxy molding product is produced and the aging information of the production mold to obtain the influence coefficient of the preliminary adjustment amplitude includes: Obtaining the temperature and humidity of the environment where the liquid epoxy molding product is produced, and calculating the temperature and humidity influence coefficient according to the temperature and humidity of the environment and the preset temperature and humidity. The calculation formula is: Wherein, is the temperature and humidity influence coefficient, respectively represent the temperature and humidity of the environment where the liquid epoxy molding product is produced, represents the time period when the temperature of the environment is not less than the preset optimal temperature, represents the time period when the humidity of the environment is not less than the preset optimal humidity; And are respectively the preset proportional coefficients of temperature and humidity, and And are both greater than 0; It should be noted that, And are set by professionals according to the actual situation. Generally, And The sum of is 1. For example, And can be 0.5, 0.5 respectively, or other numbers, and there is no specific limitation; Obtaining the used duration and preset service life of the production mold, dividing the used duration by the preset service life to obtain the usage time coefficient, obtaining the usage frequency of the produced mold, and multiplying the usage frequency by the usage time coefficient to obtain the mold aging coefficient; Obtaining the influence coefficient of the preliminary adjustment amplitude according to the temperature and humidity influence coefficient and the mold aging coefficient.

[0046] It should be noted that the temperature and humidity of the environment during the production of liquid epoxy molding products are obtained through a real-time monitoring system. These data can be collected by temperature and humidity sensors installed in the production environment and updated regularly; the preset optimal values of temperature and humidity are set by professionals according to process requirements and material characteristics, and these preset values can be obtained from process manuals or production databases; the usage duration and preset service life of the molds can be extracted from the production management system or equipment logs, and the usage frequency of the molds is usually automatically recorded by the production scheduling system.

[0047] In one embodiment, the influence coefficients for obtaining the preliminary adjustment range according to the temperature and humidity influence coefficient and the mold aging coefficient include: In the formula, is the influence coefficient of the preliminary adjustment range, and are the temperature and humidity influence coefficient and the mold aging coefficient respectively, are respectively and preset proportionality coefficients, and are both greater than 0.

[0048] It should be noted that is set by professionals according to the actual situation. Generally, the sum of is 1. For example, can be 0.4 and 0.6 respectively, or other numbers, which are not specifically limited; and before calculating the influence coefficient of the preliminary adjustment range, it is necessary to calculate after removing the units of the temperature and humidity influence coefficient and the mold aging coefficient.

[0049] In one embodiment, the final adjustment value of the adjustment parameter according to the influence coefficient and the preliminary adjustment range includes: Multiply the preliminary adjustment range by the sum of the influence coefficient plus 1 to obtain the final adjustment range, and add or subtract the final adjustment range in the corresponding adjustment direction based on the current production parameters to obtain the final adjustment value.

[0050] It should be noted that when the temperature and humidity influence coefficient is larger and the mold aging coefficient is larger, the adjustment range of the corresponding parameter is larger because: In one implementation, when the temperature and humidity influence coefficient and the mold aging coefficient are larger, it means that the instability of the production environment and the wear degree of the mold increase, thus the influence on the parameters in the production process will become more significant. Temperature and humidity have a direct impact on the production process of liquid epoxy molding products. For example, when the temperature is too high or the humidity is too high, it may cause changes in the glue flow rate, curing speed, etc., and then affect the size and light transmittance of the product. When the temperature and humidity influence coefficient increases, it indicates that the fluctuations of the environmental temperature and humidity are large, and greater adjustments need to be made to parameters such as the heating temperature and vacuum degree to ensure that the product quality remains stable under these fluctuations. The increase in the mold aging coefficient means that the surface wear and aging of the mold lead to a decline in the mold performance, which may affect the precise control of the flow rate, pressure and shape. Therefore, it is necessary to increase the adjustment range of the flow rate and torque, etc., to make up for the negative impact brought by the mold aging. In summary, as the temperature and humidity influence coefficient and the mold aging coefficient increase, a greater adjustment range is required to ensure the stability of the production process and the quality of the final product meet the preset requirements.

[0051] Based on the same inventive concept, the embodiments of the present invention also provide a production preparation of a liquid epoxy molding product. Refer to Figure 2 , Figure 2 which is a framework diagram of a production preparation of a liquid epoxy molding product provided by the embodiments of the present invention. The preparation includes: Central control system: Signally connected to the liquid epoxy feeding system, heating system, molding device system, cooling system, and demolding system, and analyzes the produced liquid epoxy molding product to determine whether the size of the product is qualified and whether the surface light transmittance is qualified; When the size or surface light transmittance of the produced liquid epoxy molding product is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate of the glue in the mold cavity, the vacuum degree, and the torque of the molding device system; Obtain the temperature of the environment where the liquid epoxy molding product is produced and the aging information of the production mold to obtain the influence coefficient; obtain the final adjustment value of the adjustment parameter according to the influence coefficient and the preliminary adjustment range, and send the final adjustment values of the heating temperature, flow rate, vacuum degree, and torque to the heating system and the molding device system respectively.

[0052] Heating system: Used to adjust the heating temperature in the production process according to the final adjustment value of the heating temperature sent by the central control system; Molding device system: Used to adjust the flow rate, vacuum degree, and torque of the glue in the mold cavity according to the final adjustment values of the flow rate, vacuum degree, and torque sent by the central control system.

[0053] Based on the production and preparation of a liquid epoxy molding product provided by an embodiment of the present invention, the work between each system is mutual and does not require manual adjustment. It can intelligently adjust and control the production process according to the actual size and light transmittance of the liquid epoxy molding product, ensuring that there are fewer production defects in the liquid epoxy molding product and reducing production costs.

[0054] The above has described in detail an embodiment of the present invention, but the content described is only the preferred embodiment of the present invention and cannot be used to artificially limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention shall still fall within the scope covered by the patent of the present invention.

Claims

1. A method for producing a liquid epoxy molded product, characterized in that: The method is applied to a central control system, which is connected to a liquid epoxy feeding system, a heating system, a molding device system, a cooling system, and a demoulding system by signal, wherein: Analyze the produced liquid epoxy molded products to determine whether the product size and surface transmittance are qualified; When the size or surface transmittance of the produced liquid epoxy molded product is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate, vacuum degree and torque of the glue in the mold cavity by the molding device system; Obtain the temperature of the environment in which the liquid epoxy molded products are produced and the aging information of the production mold to obtain the influence coefficient; The final adjustment value of the adjustment parameter is obtained according to the influence coefficient and the preliminary adjustment range, and the corresponding production parameters are adjusted according to the final adjustment value to produce liquid epoxy molded products.

2. The method for producing a liquid epoxy molded product according to claim 1, characterized in that: The analysis of the produced liquid epoxy molded products to determine whether the product size is qualified includes: Use a high-precision 3D scanner to scan liquid epoxy molded products to obtain the 3D coordinate points on the product surface and generate point cloud data; The obtained point cloud data is converted into a three-dimensional model, the three-dimensional model is overlapped with a preset product standard three-dimensional model, and the overlap degree of the three-dimensional model with the preset product standard three-dimensional model in the key area and the overlap degree of the non-key area; If the overlap degree of the critical area is equal to 1 and the overlap degree of the non-critical area is not less than the preset overlap degree threshold, the corresponding liquid epoxy molded product is qualified; otherwise, the corresponding liquid epoxy molded product is unqualified.

3. The method for producing a liquid epoxy molded product according to claim 1, characterized in that: Analysis of the produced liquid epoxy molded products to determine whether the surface transmittance of the products is qualified includes: Obtaining the light intensity before and after passing through the liquid epoxy molded product, and dividing the light intensity after passing through the liquid epoxy molded product by the light intensity before passing through the liquid epoxy molded product to obtain the light transmittance of the liquid epoxy molded product; The transmittance of the liquid epoxy molded product is compared with the preset transmittance threshold. If the transmittance is greater than the preset transmittance threshold, the surface transmittance of the liquid epoxy molded product is qualified; if the transmittance is not greater than the preset transmittance threshold, the surface transmittance of the liquid epoxy molded product is unqualified.

4. The method for producing a liquid epoxy molded product according to claim 1, characterized in that: When the size or surface transmittance of the produced liquid epoxy molded products is unqualified, the initial adjustment range of the adjustment parameters of the production system is determined to include: When the size of the produced liquid epoxy molded product is unqualified, the heating temperature is increased; and if the size of the produced liquid epoxy molded product is larger than the preset size, the flow rate and torque are increased; if the size of the produced liquid epoxy molded product is smaller than the preset size, the flow rate and torque are decreased; When the light transmittance of the produced liquid epoxy molded products is unqualified, increase the heating temperature and vacuum degree; Calculate the absolute difference between the size of the produced liquid epoxy molded product and the preset size, and correspond the absolute difference to the preset flow rate and torque adjustment range correspondence table, and obtain the preliminary adjustment range of the flow rate and torque respectively; Calculate the absolute difference between the transmittance of the produced liquid epoxy molded product and the preset transmittance threshold, and correspond the absolute difference with the preset vacuum adjustment range correspondence table to obtain the preliminary adjustment range of the vacuum degree; The absolute difference between the size of the produced liquid epoxy molded product and the preset size and the average of the absolute difference between the transmittance and the preset transmittance are used as the temperature adjustment coefficient, and the temperature adjustment coefficient and the preset temperature adjustment range correspondence table are matched to obtain the preliminary adjustment range of the heating temperature.

5. The method for producing a liquid epoxy molded product according to claim 1, characterized in that: The steps for obtaining the temperature of the environment in which the liquid epoxy molded product is produced and the aging information of the production mold to obtain the influence coefficient of the preliminary adjustment range are as follows: The temperature and humidity of the environment in which the liquid epoxy molded products are produced are obtained, and the temperature and humidity influence coefficient is calculated based on the temperature and humidity of the environment and the preset temperature and humidity. The calculation formula is: in, is the temperature and humidity influence coefficient, Respectively represent the temperature and humidity of the environment in which liquid epoxy molded products are produced. Indicates the time period when the ambient temperature is not less than the preset optimal temperature. Indicates the time period when the humidity of the environment is not less than the preset optimal humidity; and are the preset proportional coefficients for temperature and humidity, respectively, and and All are greater than 0; Obtain the usage time and preset service life of the production abrasive tool, divide the usage time by the preset service life to obtain the usage time coefficient, obtain the usage frequency of the produced abrasive tool, and multiply the usage frequency by the usage time coefficient to obtain the abrasive tool aging coefficient; The influence coefficient of the preliminary adjustment range is obtained based on the temperature and humidity influence coefficient and the mold aging coefficient.

6. The method for producing a liquid epoxy molded product according to claim 5, characterized in that: The influence coefficients of the preliminary adjustment range obtained based on the temperature and humidity influence coefficient and the mold aging coefficient include: In the formula, is the influence coefficient of the initial adjustment amplitude, and They are the temperature and humidity influence coefficient and the mold aging coefficient. They are and The preset scaling factor of Both are greater than 0.

7. The method for producing a liquid epoxy molded product according to claim 1, characterized in that: The final adjustment values ​​of the adjustment parameters obtained according to the influence coefficient and the preliminary adjustment range include: The initial adjustment range is multiplied by the sum of the influence coefficient plus 1 to obtain the final adjustment range. Based on the current production parameters, the final adjustment range is added or subtracted according to the corresponding adjustment direction to obtain the final adjustment value.

8. A method for producing a liquid epoxy molded product, for realizing a method for producing a liquid epoxy molded product according to any one of claims 1 to 7, characterized in that: The preparation comprises: Central control system: connected with the liquid epoxy feeding system, heating system, molding device system, cooling system, demoulding system signal, and analyzes the produced liquid epoxy molded products to determine whether the product size and surface transmittance are qualified; When the size or surface transmittance of the produced liquid epoxy molded product is unqualified, determine the preliminary adjustment range of the adjustment parameters of the production system; the adjustment parameters include the heating temperature of the liquid epoxy by the heating system, the flow rate, vacuum degree and torque of the glue in the mold cavity by the molding device system; Obtain the temperature of the environment in which the liquid epoxy molded product is produced and the aging information of the production mold to obtain the influence coefficient; obtain the final adjustment value of the adjustment parameter based on the influence coefficient and the initial adjustment range, and send the final adjustment values ​​of the heating temperature, flow rate, vacuum degree, and torque to the heating system and the molding device system respectively; Heating system: used to adjust the heating temperature during the production process according to the final adjustment value of the heating temperature issued by the central control system; Molding device system: used to adjust the flow rate, vacuum degree and torque of the glue in the mold cavity according to the final adjustment values ​​of flow rate, vacuum degree and torque issued by the central control system.

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