Pressure sensing adhesive tape and manufacturing method and using method thereof

Abstract

The invention discloses a pressure sensing adhesive tape and a manufacturing method and a using method thereof. The pressure sensing adhesive tape comprises a supporting layer, an adhesion layer and a stripping layer. The solid component of the adhesive layer includes a crosslinkable acrylic resin, an acrylate monomer or an oligomer thereof, an isocyanate crosslinking agent, and a photoinitiator. Before the adhesive layer is irradiated by ultraviolet light, the acrylate monomer or oligomer thereof does not generate crosslinking curing reaction. After the adhesive layer is irradiated by ultraviolet light, the photoinitiator generates free radicals with initiator polymerization capability, and the crosslinking acrylic resin, the acrylate monomer or oligomer thereof and the isocyanate crosslinking agent are subjected to crosslinking curing reaction, so that the adhesive force of the adhesive layer is reduced. Therefore, the crystal bonding phenomenon that the crystal grains fall off in the semiconductor cutting process and the crystal grains are still attached to the adhesive layer after dispergation can be overcome.

Description

Technical Field

[0001] The present invention relates to a pressure-sensitive tape, and more particularly to a pressure-sensitive tape that can be photocured by ultraviolet light, a manufacturing method thereof, and a using method thereof. Background Art

[0002] In the prior art, in the wafer processing of semiconductors, the wafer is processed into multiple small pieces containing integrated circuit chips through processes such as laser dicing, plasma dicing, scribing dicing, or saw dicing, and these chips are individually separated for packaging or used in a larger circuit in an unpackaged form.

[0003] In the above cutting operations, a commonly used photocurable tape is used to mount the wafer to be cut on a carrier substrate. The carrier substrate allows ultraviolet light to penetrate through to permit the tape to be photocured, facilitating subsequent chip picking.

[0004] However, the adhesive strength of the existing pressure-sensitive tape attached to the cutting substrate is insufficient, which leads to problems such as chip detachment or easy scattering of materials during the cutting process. After UV exposure, the adhesive strength between the pressure-sensitive tape and the cutting substrate is too high, making it difficult for the pressure-sensitive adhesive to be peeled off from the cutting substrate and resulting in residual glue, that is, the chip sticking phenomenon where the chip still adheres to the adhesive layer after photocuring. That is, after UV exposure, the pressure-sensitive tape has a reduced adhesive force, but it is not sufficient to cause the chip to fall off. Therefore, when the existing pressure-sensitive tape is used in the wafer cutting operation in the semiconductor manufacturing process, there are process difficulties that need to be overcome.

[0005] Therefore, the inventor of the present invention felt that the above defects could be improved, and thus specifically devoted himself to research and combined with the application of scientific principles, and finally proposed the present invention with a reasonable design and effectively improving the above defects. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a pressure-sensitive tape, a manufacturing method thereof, and a using method thereof in view of the deficiencies of the prior art, which can overcome the problems of chip detachment and chip sticking phenomenon where the chip still adheres to the adhesive layer after photocuring in the semiconductor cutting process. The pressure-sensitive tape provided by the present invention is particularly suitable for a pressure-sensitive tape that can be photocured by ultraviolet light in the semiconductor manufacturing process, and can achieve good chip pick-up performance.

[0007] To solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a pressure-sensitive tape, which includes: a support layer; an adhesive layer formed on one side surface of the support layer; wherein, the solid components of the adhesive layer include: a crosslinkable acrylic resin; an acrylate monomer or its oligomer; an isocyanate crosslinking agent; and a photoinitiator; and a release layer detachably formed on the side surface of the adhesive layer away from the support layer; wherein, before ultraviolet light irradiation, the acrylate monomer or its oligomer in the adhesive layer does not undergo a crosslinking and curing reaction; and after ultraviolet light irradiation, the photoinitiator generates free radicals with the ability to initiate polymerization, and the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate crosslinking agent undergo a crosslinking and curing reaction, thereby reducing the adhesive force of the adhesive layer.

[0008] Preferably, based on the total weight of the solid components of the adhesive layer being 100 wt%, the content of the crosslinkable acrylic resin is 50 - 95 wt%, the content of the acrylate monomer or its oligomer is 1 - 40 wt%, the content of the isocyanate crosslinking agent is 0.1 - 10 wt%, and the content of the photoinitiator is 0.1 - 10 wt%.

[0009] Preferably, based on the total weight of the solid components of the adhesive layer being 100 wt%, the content of the crosslinkable acrylic resin is 50 - 90 wt%, the content of the acrylate monomer or its oligomer is 5 - 35 wt%, the content of the isocyanate crosslinking agent is 0.1 - 5 wt%, and the content of the photoinitiator is 0.1 - 5 wt%.

[0010] Preferably, the crosslinkable acrylic resin is polymerized from at least one of the following monomer components: 2-hydroxyethyl acrylate, methyl acrylate, 2-methoxyethyl acrylate, acrylic acid, acrylonitrile, 2-ethylhexyl acrylate, 2-phenoxyethyl acrylate, and butyl acrylate; wherein, the molecular structure of the crosslinkable acrylic resin has at least: an alkenyl group, a hydroxyl group, and a carboxyl group.

[0011] Preferably, the acrylate monomer or its oligomer is selected from at least one of the materials in the material group consisting of: bisphenol A acrylate, 2-acrylate (1-methylethylidene) bis(4,1-phenyleneoxy-2,1-ethanediyl) ester, ethoxylated bisphenol A dimethacrylate, isobornyl acrylate, and polyurethane acrylate.

[0012] Preferably, the diisocyanate is at least one selected from the group consisting of toluene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, and lysine diisocyanate.

[0013] Preferably, the photoinitiator is at least one selected from the group consisting of benzophenone, 2-hydroxy-2-methyl-1-phenylpropanone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoin compounds, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triaryl imidazole dimer.

[0014] To solve the above technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a pressure-sensitive tape, which includes: providing a release layer; coating a coating material on one side surface of the release layer; wherein the coating material includes a solid component and a solvent component, the solid component includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate crosslinking agent, and a photoinitiator; the solvent component is at least one of ethyl acetate and methyl ethyl ketone; wherein the weight ratio between the solvent component and the solid component is between 5:95 and 30:70; removing the solvent component in the coating material to form an adhesive layer on the side surface of the release layer; attaching a support layer to the side surface of the adhesive layer away from the release layer to complete the preparation of a pressure-sensitive tape.

[0015] Wherein, the release layer can be peeled off from the adhesive layer, so that the adhesive layer is exposed to the external environment and can be adhered to a substrate to be cut.

[0016] Wherein, before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction.

[0017] Wherein, after the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals with the ability to initiate polymerization, and the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate crosslinking agent undergo a crosslinking and curing reaction, thereby reducing the adhesion of the adhesive layer.

[0018] To solve the above technical problems, another technical solution adopted by the present invention is to provide a method for using a pressure-sensitive tape, which includes: providing the pressure-sensitive tape as described above; peeling the release layer in the pressure-sensitive tape from the side surface of the adhesive layer so that the adhesive layer is exposed to the external environment; providing a substrate to be cut, and arranging the adhesive surface of the pressure-sensitive tape facing the substrate to be cut; attaching the pressure-sensitive tape to the substrate to be cut through the adhesive layer; wherein, a first peel strength between the adhesive layer and the substrate to be cut is between 200 and 2,500 gf / inch; performing a cutting operation on the substrate to be cut to form a cut substrate; irradiating the adhesive layer of the pressure-sensitive tape with ultraviolet light so that the photoinitiator generates free radicals with the ability to initiate polymerization of the initiator, and the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate crosslinking agent undergo a crosslinking and curing reaction to reduce the adhesiveness of the adhesive layer.

[0019] Wherein, after being irradiated with the ultraviolet light, a second peel strength between the adhesive layer and the cut substrate is between 10 and 75 gf / inch.

[0020] Preferably, a wavelength of the ultraviolet light is between 300 nanometers and 380 nanometers, and an irradiation energy of the ultraviolet light on the adhesive layer is greater than 300 mJ / cm 2 and less than 2,000 mJ / cm 2 , and an irradiation time is between 5 seconds and 2 minutes.

[0021] The beneficial effect of the present invention is that the pressure-sensitive tape, its manufacturing method and using method provided by the present invention can overcome the phenomenon of die shedding and the die still adhering to the adhesive layer after debonding in the semiconductor cutting process through the technical solutions of "the solid components of the adhesive layer include a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate crosslinking agent, and a photoinitiator" and "before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction. After the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals with the ability to initiate polymerization of the initiator, and the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate crosslinking agent undergo a crosslinking and curing reaction, thereby reducing the adhesiveness of the adhesive layer".

[0022] The pressure-sensitive tape provided by the present invention is particularly suitable for a pressure-sensitive tape that can be debonded by ultraviolet light in semiconductor manufacturing processes, and the pressure-sensitive tape can achieve good die pick-up performance in the wafer cutting operation of semiconductor manufacturing processes.

[0023] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not impose any limitation on the protection scope of the present invention. Description of the Drawings

[0024] Figure 1 It is a schematic diagram of the pressure-sensitive tape according to an embodiment of the present invention.

[0025] Figure 2A It is a schematic diagram of step S110 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention.

[0026] Figure 2B It is a schematic diagram of step S120 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention.

[0027] Figure 2C It is a schematic diagram of step S130 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention.

[0028] Figure 2D It is a schematic diagram of step S140 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention.

[0029] Figure 2E It is a schematic diagram of step S150 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention.

[0030] Figure 2F It is a schematic diagram of step S160 of the usage method of the pressure-sensitive tape according to an embodiment of the present invention. Detailed Embodiments

[0031] The following are specific embodiments to illustrate the embodiments of the "light-emitting device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention.

[0032] In addition, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, hereby stated. The following embodiments will further detail the relevant technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0033] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one signal from another. Additionally, the term "or" as used herein may, depending on the actual situation, include any combination of one or more of the associated listed items.

[0034] [Pressure - sensitive tape]

[0035] Please refer to Figure 1 As shown, an embodiment of the present invention provides a pressure - sensitive tape 100 that can be photocured by ultraviolet light, which is applicable to component cutting operations, particularly wafer cutting operations in semiconductor manufacturing processes or cutting operations of packaged components, but the present invention is not limited thereto.

[0036] In the above - mentioned semiconductor manufacturing process, the component to be cut to which the pressure - sensitive tape 100 is attached can be, for example, a wafer, a light - emitting diode (LED) substrate, a glass substrate, or a ceramic substrate, and the wafer and the LED substrate can be cut into small chips containing integrated circuits through the cutting operation.

[0037] Please continue to refer to Figure 1 As shown, the pressure - sensitive tape of the embodiment of the present invention includes a support layer 1, an adhesive layer 2, and a release layer 3 stacked in sequence from bottom to top. That is to say, the adhesive layer 2 is formed on one side surface of the support layer 1 (such as the upper surface of the support layer 1 in Figure 1 ), and the release layer 3 is formed on the side surface of the adhesive layer 2 away from the support layer 1 (such as the upper surface of the adhesive layer 2 in Figure 1 ), but the present invention is not limited thereto. In practical applications, the arrangement directions of the support layer 1, the adhesive layer 2, and the release layer 3 of the pressure - sensitive tape 100 can be changed according to requirements. For example, the support layer 1 can be located at the topmost layer, the release layer 3 can be located at the lowermost layer, and the adhesive layer 2 is located between the support layer 1 and the release layer 3. Next, for the convenience of understanding the present invention, the material characteristics of each layer of the pressure - sensitive tape 100 in the embodiment of the present invention will be described in detail below, and the connection relationships between each layer will be explained as appropriate.

[0038] [Support layer]

[0039] The support layer 1 can be, for example, a polyolefin film (PO film) or a polyvinyl chloride film (PVC film). In terms of the thickness range, a first thickness D1 of the support layer 1 is between 50 micrometers and 180 micrometers, and preferably between 80 micrometers and 150 micrometers. Among them, the types of materials of the polyolefin film can be, for example, at least one selected from the group consisting of the following materials: polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), and polybutene-1 (PB-1).

[0040] Preferably, the type of material of the polyolefin film can be, for example, polypropylene, but the present invention is not limited thereto.

[0041] [Adhesive layer]

[0042] The adhesive layer 2 is formed on one side surface of the support layer 1. When the release layer 3 is peeled off from the adhesive layer, the adhesive layer 2 can be exposed to the external environment and adhered to the substrate to be cut.

[0043] The adhesive layer 2 can be attached to the back surface of the substrate to be cut (such as a wafer, an LED substrate, a glass / ceramic substrate) during the cutting process of the component. A second thickness D2 of the adhesive layer 2 is between 5 micrometers and 35 micrometers, and preferably between 8 micrometers and 33 micrometers, but the present invention is not limited thereto.

[0044] Furthermore, the solid components of the adhesive layer 2 include:

[0045] (a) Self-crosslinking acrylic resin.

[0046] (b) Acrylate monomer or its oligomer.

[0047] (c) Isocyanate crosslinking agent.

[0048] (d) Photo-initiator.

[0049] Based on the total weight of the solid components of the adhesive layer 2 being 100 wt%, the content of the crosslinkable acrylic resin is between 50 wt% and 95 wt%, and preferably between 50 wt% and 90 wt%. The content of the acrylate monomer or its oligomer is between 1 wt% and 40 wt%, and preferably between 5 wt% and 35 wt%. The content of the isocyanate crosslinking agent is between 0.1 wt% and 10 wt%, and preferably between 0.1 wt% and 5 wt%. Furthermore, the content of the photoinitiator is between 0.1 wt% and 10 wt%, and preferably between 0.1 wt% and 5 wt%. Further, the adhesive layer 2 is formed by coating a coating material formed from the above solid components and a solvent component on the support layer 1 or the release layer 3 and then removing the solvent, however, the present invention is not limited thereto.

[0050] [Crosslinkable acrylic resin]

[0051] The crosslinkable acrylic resin introduces a crosslinking group or a crosslinking system into the main chain of the acrylic resin molecular structure. The weight average molecular weight (Mw) of the crosslinkable acrylic resin (before being irradiated with UV light) is between 120,000 and 650,000. The crosslinkable acrylic resin can generate a polymer with a network structure through the reaction between crosslinking groups.

[0052] The crosslinkable acrylic resin can be polymerized from at least one of the following monomer components: 2-hydroxyethyl acrylate (HEA), methyl acrylate (MA), 2-methoxyethyl acrylate (MEA), acrylic acid (AA), acrylonitrile, 2-ethylhexyl methacrylate (EHA), 2-phenoxyethyl acrylate (PEA), and butyl acrylate (BA).

[0053] In addition, the molecular structure of the crosslinkable acrylic resin has at least the following functional groups: propylene group, hydroxyl group, and carboxyl group.

[0054] In an embodiment of the present invention, the crosslinkable acrylic resin can be formed, for example, by introducing N-hydroxymethylacrylamide and acrylic acid into an acrylic resin formed from acrylonitrile, methyl acrylate, and butyl acrylate, however, the present invention is not limited thereto.

[0055] [Acrylate monomer or its oligomer]

[0056] The acrylate monomer or its oligomer has an alkenyl group (such as vinyl or propenyl) in its molecular structure. The acrylate monomer can be at least one of the following compounds.

[0057] Bisphenol A dimethacrylate (referred to as bisphenol A acrylate for short).

[0058]

[0059] 2 - Acrylate (1 - methylethylidene) bis(4,1 - phenyleneoxy - 2,1 - ethanediyl) ester.

[0060]

[0061] Ethoxylated bisphenol A dimethacrylate.

[0062]

[0063] Isobornyl acrylate (IBOA).

[0064]

[0065] The oligomer of the acrylate monomer can be, for example, polyurethane acrylate (PUA).

[0066] Here, m = 3 to 20, and n = 3 to 20.

[0067]

[0068] In a specific embodiment of the present invention, the acrylate monomer is selected as bisphenol A dimethacrylate, but the present invention is not limited thereto.

[0069] [Isocyanate cross - linker]

[0070] The isocyanate cross - linker increases the degree of polymerization of the resin composition in the adhesive layer 2.

[0071] Among them, the isocyanate cross - linker can be, for example, diisocyanate.

[0072] In some embodiments of the present invention, the diisocyanate may be, for example, at least one selected from the group consisting of the following materials: toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), diphenylmethanediisocyanate (MDI), dicyclohexylmethane diisocyanate (H12MDI), and lysine diisocyanate (LDI).

[0073] In a specific embodiment of the present invention, the isocyanate crosslinking agent is isophorone diisocyanate (IPDI), but the present invention is not limited thereto.

[0074] [Photoinitiator]

[0075] The photoinitiator in the adhesive layer 2 can absorb radiant energy under ultraviolet light irradiation, and through chemical changes, generate free radicals with the ability to initiate polymerization of the initiator, and then cooperate with the above-mentioned crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate crosslinking agent to carry out a crosslinking curing reaction.

[0076] In some embodiments of the present invention, the photoinitiator is at least one selected from the group consisting of the following materials: benzophenone, 2-hydroxy-2-methyl-1-phenylpropanone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoin, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triaryl imidazole dimer.

[0077] In a specific embodiment of the present invention, the photoinitiator is 1-hydroxycyclohexyl phenyl ketone, that is to say, the photoinitiator is photoinitiator-184 (that is, Irgacure-184), however, the present invention is not limited thereto.

[0078] [Release layer]

[0079] The release layer 3 provides a surface for the adhesive layer 2 to be formed thereon. During the cutting operation of the component (such as wafer cutting), the release layer 3 can be separated from the adhesive layer 2, so that the adhesive layer 2 can be exposed to the external environment and can be attached to the component to be cut.

[0080] In terms of the thickness range, a third thickness D3 of the release layer 3 is between 25 microns and 45 microns, and preferably between 28 microns and 40 microns. However, the present invention is not limited thereto.

[0081] The release layer 3 may be, for example, a polyester release layer (e.g., PET release film).

[0082] In some embodiments of the present invention, the polyester release layer may be, for example, coated with a layer of silicone oil on the surface of the polyester film or an inorganic material may be added to the polyester film to reduce the adhesion on the surface of the polyester film, thereby achieving the release effect.

[0083] [Mechanism of ultraviolet light de-bonding]

[0084] In terms of the mechanism of ultraviolet light de-bonding, the photoinitiator in the adhesive layer 2 can absorb radiation energy under ultraviolet light irradiation, causing the photoinitiator to undergo chemical changes to generate free radicals with the ability to initiate polymerization of initiators, and then cooperate with the above-mentioned crosslinkable acrylic resin, acrylate monomers or their oligomers, and isocyanate crosslinking agent to carry out crosslinking and curing reactions.

[0085] Before ultraviolet light irradiation, the adhesive layer 2 has a certain adhesion to the component to be cut (such as a wafer, an LED substrate, a glass substrate, a ceramic substrate), which can prevent the component to be cut from falling off after being cut (such as preventing the situation of grain detachment).

[0086] After ultraviolet light is irradiated for a predetermined time, the adhesion of the adhesive layer 2 decreases due to the crosslinking and curing reaction, thereby achieving the effect of ultraviolet light de-bonding, which can prevent the situation of adhesive or residual glue on the cut component after de-bonding when the cut component is separated from the adhesive layer 2.

[0087] A light wavelength of the ultraviolet light may be, for example, between 300 nanometers and 380 nanometers, preferably between 340 nanometers and 380 nanometers, and particularly preferably between 360 nanometers and 375 nanometers. However, the present invention is not limited thereto.

[0088] An irradiation energy of the ultraviolet light irradiating the adhesive layer may be, for example, greater than 300 mJ / cm 2 and less than 2,000 mJ / cm 2 、preferably greater than 500 mJ / cm 2 and less than 1,500 mJ / cm 2 、particularly preferably greater than 500 mJ / cm 2 and less than 1,000 mJ / cm 2 .

[0089] In addition, the irradiation time of the ultraviolet light on the adhesive layer 2 can be, for example, between 5 seconds and 2 minutes, preferably between 10 seconds and 1 minute, and particularly preferably between 10 seconds and 45 seconds, but the present invention is not limited thereto.

[0090] Furthermore, the adhesive layer 2 is configured to be attached to a substrate S to be cut (as shown in Figure 2C the figure) during a component cutting process. Before the adhesive layer 2 is irradiated with ultraviolet light, a first peel strength between the adhesive layer 2 and the substrate S to be cut is between 200 and 2,500 gf / inch. That is to say, the adhesive layer 2 has a high adhesion strength to the substrate S to be cut before being irradiated with ultraviolet light.

[0091] After the adhesive layer 2 is irradiated with ultraviolet light, the crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate crosslinking agent in the adhesive layer 2 undergo a crosslinking and curing reaction, and an irradiated adhesive layer 2a is formed (as shown in Figure 2E the figure).

[0092] Among them, a second peel strength between the irradiated adhesive layer 2a and the cut substrate S' (such as a die) is between 10 and 75 gf / inch, and the decrease amplitude compared with that before irradiation is 75 to 99.9%.

[0093] That is to say, the adhesion strength between the irradiated adhesive layer 2a and the cut substrate S' is significantly reduced after irradiation. Therefore, the irradiated adhesive layer 2a can be easily peeled off from the cut substrate S' without any residual adhesive layer remaining on the cut substrate.

[0094] The test methods for the first peel strength and the second peel strength can be, for example, tested according to ASTM D3330. For example, the test method is to roll the adhesive layer 2 back and forth with a roller to stick it to the substrate to be cut, and the test can be carried out after standing still. The substrate is fixed to the lower fixture, and the sample is fixed to the upper fixture by being folded back 180 degrees. The adhesive layer is peeled off from the substrate at a predetermined speed (such as 300 mm / min), and the average value during tearing is measured. The peel strength unit is recorded in gf / inch.

[0095] Overall, the adhesive layer 2 absorbs radiation energy under ultraviolet light irradiation through an initiator, generates free radicals with the ability to initiate polymerization through chemical changes, and then enables the crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate crosslinking agent to undergo a crosslinking and curing reaction, thereby achieving the effect of debonding. Moreover, the difference in peel strength before and after ultraviolet light irradiation is large, and there is a wide range of peel force regulation.

[0096] It is worth mentioning that the above crosslinkable acrylic resin and acrylate monomer (or its oligomer) play an important role in the adhesive layer 2, which can make the adhesive layer 2 have a large difference in peel strength before and after ultraviolet light irradiation. If the crosslinkable acrylic resin or acrylate monomer of the embodiment of the present invention is not added to the adhesive layer 2, the difference in peel strength of the adhesive layer 2 before and after ultraviolet light irradiation is small, resulting in the phenomenon that the adhesive layer remains on the surface of the substrate when the tape is attached to and removed from the substrate, and there will also be phenomena such as residual glue and degumming after irradiation.

[0097] [Manufacturing method of pressure-sensitive tape]

[0098] The above embodiments describe the material characteristics and structural characteristics of the pressure-sensitive tape. Next, the manufacturing method of the pressure-sensitive tape according to the embodiments of the present invention will be described, including step S110, step S120, and step S130. It should be noted that the order of each step described in the embodiments of the present invention and the actual operation method can be adjusted according to requirements, and is not limited to those described in this embodiment.

[0099] The step S110 includes: providing a release layer 3. The release layer 3 can be, for example, a polyester release layer (e.g., PET release film).

[0100] The step S120 includes: coating an adhesive coating liquid composition on one side surface of the release layer 3, and removing the solvent component in the adhesive coating liquid composition, thereby forming an adhesive layer 2 on the side surface of the release layer 3.

[0101] Among them, the coating method in step S120 can be, for example, roller coating, screen coating, gravure coating, or off-line coating to complete the coating operation, and then by performing desolvation treatment or hardening treatment on the adhesive coating liquid composition, the coated adhesive composition is formed into a film, thereby manufacturing the adhesive layer.

[0102] Among them, the adhesive coating liquid composition (coating) can include a solid component and a solvent component. The solid component includes (a) crosslinkable acrylic resin, (b) acrylate monomer or its oligomer, (c) isocyanate crosslinking agent, and (d) photoinitiator in the above embodiments. The material characteristics and formulation of the solid component are as described in the above embodiments, and will not be elaborated here.

[0103] The solvent component is used to dilute the solid component so that the adhesive coating composition has a predetermined viscosity, making it easier to coat onto the release layer 3 and facilitating molding. Among them, the weight ratio between the solvent component and the solid component ranges from 5:95 to 30:70. The solvent component can be, for example, at least one of ethyl acetate (EAC) and methyl ethyl ketone (MEK). Preferably, the solvent component is ethyl acetate, but the present invention is not limited thereto.

[0104] It is worth mentioning that the acrylate monomer or its oligomer will not undergo a crosslinking and curing reaction before being irradiated with ultraviolet light, so that the adhesive layer 2 has a higher adhesion and can be better adhered to the substrate to be cut. Also, the adhesive layer 2 will undergo a crosslinking and curing reaction after being irradiated with ultraviolet light, thereby significantly reducing the adhesion and making it easy to separate from the substrate.

[0105] The step S130 includes: attaching a support layer 1 to the surface of the adhesive layer 2 away from the release layer 3 to complete the preparation of the pressure-sensitive tape 100.

[0106] It should be noted that although this embodiment is described by taking the adhesive layer 2 being formed on the release layer 3 first and then attaching the support layer 1 to the adhesive layer 2 as an example, the present invention is not limited thereto. For example, the adhesive layer 2 can also be formed on the support layer 1 first and then the release layer 3 is attached to the adhesive layer 2.

[0107] [Usage method of the pressure-sensitive tape]

[0108] The above embodiments describe the material characteristics, structural characteristics, and manufacturing methods of the pressure-sensitive tape. Next, the usage method of the pressure-sensitive tape according to an embodiment of the present invention will be described, including step S210, step S220, step S230, step S240, step S250, step S260, and step S170. It must be noted that the order of each step described in the embodiments of the present invention and the actual operation method can be adjusted according to requirements and is not limited to those described in this embodiment.

[0109] As Figure 2A shown, the step S210 includes providing the pressure-sensitive tape 100 as described in the above embodiment and peeling the release layer 3 of the pressure-sensitive tape 100 from the surface of the adhesive layer 2 so that the adhesive layer 2 is exposed to the external environment.

[0110] As Figure 2B shown, the step S220 includes: providing a substrate S to be cut (such as a wafer) and arranging the adhesive layer 2 side of the pressure-sensitive tape 100 facing the substrate S to be cut.

[0111] As shown Figure 2C in FIG. 2, step S230 includes: attaching the pressure-sensitive adhesive tape 100 to the substrate S to be cut through its adhesive layer 2. Wherein, a first peel strength between the adhesive layer 2 and the substrate S to be cut is between 200 and 2,500 gf / inch.

[0112] As shown Figure 2D in FIG. 3, step S240 includes: performing a cutting operation on the substrate S to be cut, so that the substrate S to be cut is cut from the side surface away from the adhesive layer 2 to form a cut substrate S' (such as a wafer being cut into multiple small pieces including integrated circuit dies).

[0113] As shown Figure 2E in FIG. 4, step S250 includes: irradiating the adhesive layer 2 of the pressure-sensitive adhesive tape 100 with ultraviolet light, so that the photoinitiator in the adhesive layer 2 can absorb radiant energy under the irradiation of ultraviolet light, and the photoinitiator undergoes a chemical change to generate free radicals with the ability to initiate polymerization of the initiator, and then cooperate with the above-mentioned crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate crosslinking agent to perform a crosslinking curing reaction and form an irradiated adhesive layer 2a.

[0114] In some embodiments of the present invention, a wavelength of the ultraviolet light can be, for example, between 300 nm and 380 nm. An irradiation energy of the ultraviolet light irradiated on the adhesive layer can be greater than 300 mJ / cm 2 and less than 2,000 mJ / cm 2 , and an irradiation time can be between 5 seconds and 2 minutes, however, the present invention is not limited thereto.

[0115] Wherein a second peel strength between the irradiated adhesive layer 2a and the cut substrate S' is between 10 and 75 gf / inch, and the decrease amplitude compared with before irradiation is 75 to 99.9%. Accordingly, the adhesion strength between the irradiated adhesive layer 2a and the cut substrate S' can be greatly reduced, and it is easy to separate from each other.

[0116] As shown Figure 2F in FIG. 5, step S260 includes: separating the cut substrate S' from the irradiated adhesive layer 2a, so that the cut substrate S' can be separated into a plurality of small sheet materials (such as: multiple small pieces including integrated circuit dies).

[0117] According to the above configuration, the pressure-sensitive adhesive tape 100 provided by the embodiment of the present invention can have a high adhesion force with the substrate S to be cut through the adhesive layer 2, and the adhesive layer 2 can closely adhere to the substrate S to be cut without falling off. When performing a cutting operation, the adhesive layer 2 will not have the phenomenon of degumming or generating glue filaments.

[0118] After being irradiated with ultraviolet light, the adhesion between the irradiated adhesive layer 2a and the cutting substrate S' is significantly reduced. The irradiated adhesive layer 2a can be easily peeled off from the cutting substrate S' without any residual glue.

[0119] [Experimental data and test results]

[0120] In order to confirm the technical effects of the pressure-sensitive tape according to the embodiments of the present invention, the following will be described with experimental data and experimental results. However, the protection scope of the present invention is not limited thereto.

[0121] <Example 1>: A coating is prepared by mixing 50 parts by weight of a crosslinkable acrylic resin (10AM, full name HT-6455UH-10AM, purchased from Shinzong Industry Co., Ltd.), 25 parts by weight of an acrylate monomer (bisphenol A acrylate), 0.5 parts by weight of an isocyanate crosslinking agent (isophorone diisocyanate, IPDI), 0.3 parts by weight of a photoinitiator (Irgacure-184), and 24.2 parts by weight of a solvent (ethyl acetate, EAC). The coating is applied to a polyester release film (PET release film), and the solvent in the coating is removed, thereby forming an adhesive layer (thickness 10 microns) on the release film. A support layer (polypropylene support layer) is attached to the surface of the adhesive layer away from the polyester release film to complete the preparation of the pressure-sensitive tape.

[0122] The preparation methods of the pressure-sensitive tapes of Examples 2 to 7 are substantially the same as that of Example 1 above, except for the preparation conditions and test results of the adhesive layer, which are listed in Table 1 below.

[0123] The preparation methods of the pressure-sensitive tapes of Comparative Examples 1 to 3 are substantially the same as that of Example 1 above. The main difference is that the acrylate monomers are not added to the adhesive layers of Comparative Examples 1 to 3. The preparation conditions and test results of the adhesive layers are listed in Table 2 below.

[0124] Among them, in the crosslinkable acrylic resin, the full name of 10AM is HT-6455UH-10AM, and it is purchased from Shinzong Industry Co., Ltd. The full name of SD-488 is UV-debonding acrylic adhesive, and it is purchased from Nanbao Resin. Furthermore, the full name of NC22 is UV-debonding glue, and it is purchased from Haoyang Industrial Co., Ltd.

[0125] After the release layer of the pressure-sensitive tapes prepared in the above Examples 1 to 7 and Comparative Examples 1 to 3 is removed, the adhesive layer is attached to a substrate to be cut (for example, a wafer), and the peel strength of the adhesive layer before and after being irradiated with ultraviolet light is tested, and whether there is residual glue of the adhesive layer on the substrate to be cut is observed.

[0126] <Peeling Strength>: The adhesive layer is adhered to the substrate to be cut by rolling it back and forth with a roller once, and the test can be carried out only after standing. The test method can adopt ASTM D3330, and the unit of peeling strength is recorded in gf / inch, including the peeling strength before and after UV photocleavage. Among them, the UV light irradiation energy is 500 mJ / cm 2 , and the irradiation time is 15 seconds.

[0127] [Table 1 - Examples]

[0128]

[0129] [Table 2 - Comparative Examples]

[0130]

[0131]

[0132] [Test Results]

[0133] The pressure-sensitive tapes prepared in the above Examples 1 to 7 have high peeling strength (270 - 2,200 gf / inch) before UV photocleavage. Especially in Examples 1 and 3 to 5, when the dosage of acrylate monomers is 15 - 25 parts by weight, the peeling strength before UV photocleavage is higher (850 - 2,200 gf / inch). In addition, the peeling strength of the pressure-sensitive tapes prepared in Examples 1 to 7 drops significantly after UV photocleavage (30 - 75 gf / inch). Furthermore, after the pressure-sensitive tapes prepared in Examples 1 to 7 are separated from the substrate, no residual glue appears, so they are particularly suitable for wafer cutting operations in semiconductor processes. It is worth mentioning that in Examples 1 and 3 to 5, a quantitative ratio between the dosage of crosslinkable acrylic resin and the dosage of acrylate monomers is between 50:25 and 70:15, which can make the pressure-sensitive tape have a better difference in peeling strength.

[0134] On the other hand, the pressure-sensitive tapes prepared in Comparative Examples 1 to 3 have ordinary peeling strength before UV photocleavage (370 - 730 gf / inch). Also, the peeling strength of the pressure-sensitive tapes prepared in Comparative Examples 1 to 3 does not drop significantly after UV photocleavage (220 - 365 gf / inch), and the drop amplitude does not exceed 50%. After the pressure-sensitive tapes prepared in Comparative Examples 1 to 3 are separated from the substrate, some have the situation of residual glue or are not easily separated from the substrate due to high peeling strength, which is likely to cause crystal damage.

[0135] [Advantages of Examples]

[0136] The beneficial effects of the embodiments of the present invention are as follows. The pressure-sensitive tape, its manufacturing method and usage method provided by the embodiments of the present invention can, through the technical solutions that "the solid components of the adhesive layer include crosslinkable acrylic resin, acrylate monomer or its oligomer, isocyanate crosslinking agent, and photoinitiator" and "before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo crosslinking and curing reaction. After the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals with the ability to initiate polymerization, and the crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate crosslinking agent undergo crosslinking and curing reaction, thereby reducing the adhesive force of the adhesive layer", overcome the phenomena of die shedding during the semiconductor cutting process and die sticking where the die still adheres to the adhesive layer after debonding.

[0137] The pressure-sensitive tape provided by the present invention is particularly suitable for the pressure-sensitive tape that can be debonded by ultraviolet light in semiconductor manufacturing processes, and it can achieve good die pick-up performance.

[0138] The above are only the preferred and feasible embodiments of the present invention, and are not intended to limit the protection scope of the present invention. All equivalent changes and modifications made according to the claims of the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A pressure-sensitive adhesive tape, characterized in that: The pressure-sensitive tape comprises: a supporting layer; an adhesive layer formed on one side surface of the support layer; Wherein, the solid components of the adhesive layer include: A cross-linked acrylic resin; An acrylic acid ester monomer or an oligomer thereof; an isocyanate cross-linking agent; and a photoinitiator; and a peeling layer, the peeling layer being formed on a surface of the adhesive layer away from the supporting layer in a peelable manner; Wherein, before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or oligomer thereof does not undergo a cross-linking and curing reaction; After the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals with initiator polymerization ability, and the cross-linking acrylic resin, the acrylate monomer or its oligomer, and the isocyanate cross-linking agent undergo a cross-linking curing reaction to reduce the adhesion of the adhesive layer.

2. The pressure-sensitive adhesive tape according to claim 1, characterized in that: Based on the total weight of the solid content of the adhesive layer being 100 mass %, the content of the crosslinkable acrylic resin is 50-95 mass %, the content of the acrylate monomer or its oligomer is 1-40 mass %, the content of the isocyanate crosslinking agent is 0.1-10 mass %, and the content of the photoinitiator is 0.1-10 mass %.

3. The pressure-sensitive adhesive tape according to claim 2, characterized in that: Based on the total weight of the solid content of the adhesive layer being 100 mass %, the content of the crosslinkable acrylic resin is 50-90 mass %, the content of the acrylate monomer or its oligomer is 5-35 mass %, the content of the isocyanate crosslinking agent is 0.1-5 mass %, and the content of the photoinitiator is 0.1-5 mass %.

4. The pressure-sensitive adhesive tape according to claim 1, characterized in that: The cross-linked acrylic resin is polymerized from at least one of the following monomer components: 2-hydroxyethyl acrylate, methyl acrylate, 2-methoxyethyl acrylate, acrylic acid, acrylonitrile, 2-ethylhexyl methacrylate, 2-phenoxyethyl acrylate, and butyl acrylate; wherein the molecular structure of the cross-linked acrylic resin has at least: an acryl group, a hydroxyl group, and a carboxyl group.

5. The pressure-sensitive adhesive tape according to claim 1, characterized in that: The acrylic ester monomer or oligomer thereof is at least one selected from the group consisting of bisphenol A acrylate, 2-(1-methylethylene)bis(4,1-phenyleneoxy-2,1-ethanediyl)acrylate, ethoxylated bisphenol A dimethacrylate, isobornyl acrylate, and polyurethane acrylate.

6. The pressure-sensitive adhesive tape according to claim 1, characterized in that: The diisocyanate is at least one selected from the group consisting of toluene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, and lysine diisocyanate.

7. The pressure-sensitive adhesive tape according to claim 1, characterized in that: The photoinitiator is at least one selected from the group consisting of benzophenone, 2-hydroxy-2-methyl-1-propiophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoins, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triarylimidazole dimer.

8. A method for manufacturing a pressure-sensitive adhesive tape, characterized in that: The method for manufacturing the pressure-sensitive adhesive tape comprises: providing a peeling layer; A coating is applied to one side surface of the peeling layer; wherein the coating comprises a solid component and a solvent component, wherein the solid component comprises a cross-linking acrylic resin, an acrylate monomer or an oligomer thereof, an isocyanate cross-linking agent, and a photoinitiator; the solvent component is at least one of ethyl acetate and methyl ethyl ketone; wherein the weight ratio of the solvent component to the solid component is between 5:95 and 30:70; removing the solvent component in the coating to form an adhesive layer on the side surface of the release layer; and Attaching a support layer to a surface of the adhesive layer on a side away from the release layer to complete the preparation of the pressure-sensitive adhesive tape; The peeling layer can be peeled off from the adhesive layer, so that the adhesive layer is exposed to the external environment and can be attached to a substrate to be cut; Wherein, before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or oligomer thereof does not undergo a cross-linking and curing reaction; After the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals with initiator polymerization ability, and the cross-linking acrylic resin, the acrylate monomer or its oligomer, and the isocyanate cross-linking agent undergo a cross-linking and curing reaction, thereby reducing the adhesion of the adhesive layer.

9. A method for using a pressure-sensitive tape, characterized in that: The method for using the pressure-sensitive adhesive tape comprises: providing the pressure-sensitive adhesive tape according to any one of claims 1 to 7; Peeling the release layer in the pressure-sensitive tape off the side surface of the adhesive layer so that the adhesive layer is exposed to the external environment; Providing a substrate to be cut, and arranging the adhesive surface of the pressure-sensitive tape toward the substrate to be cut; The pressure-sensitive tape is attached to the substrate to be cut through the adhesive layer; wherein a first peel strength between the adhesive layer and the substrate to be cut is between 200 and 2,500 gf / inch; Performing a cutting operation on the substrate to be cut to form a cut substrate; and The adhesive layer of the pressure-sensitive adhesive tape is irradiated with ultraviolet light, so that the photoinitiator generates free radicals with initiator polymerization ability, and the cross-linking acrylic resin, the acrylate monomer or oligomer thereof, and the isocyanate cross-linking agent undergo a cross-linking curing reaction to reduce the adhesion of the adhesive layer; After the ultraviolet light irradiation, a second peel strength between the adhesive layer and the cut substrate is between 10 and 75 gf / inch.

10. The method for using the pressure-sensitive adhesive tape according to claim 9, characterized in that: The wavelength of the ultraviolet light is between 300 nanometers and 380 nanometers, the energy of the ultraviolet light irradiating the adhesive layer is greater than 300 millijoules / square centimeter and less than 2,000 millijoules / square centimeter, and the irradiation time is between 5 seconds and 2 minutes.

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