A vibration temperature composite sensor that is easy to pot

Abstract

The present invention belongs to the field of temperature and vibration detection equipment, and specifically relates to a vibration temperature composite sensor that is easy to pot, comprising: an inner shell assembly, the inner shell assembly including a mounting frame; two circuit boards respectively mounted on both sides of the mounting frame, and enclosed with the mounting frame to form a clamping cavity; a temperature sensitive element housed in a second shell; two MEMS vibration sensors respectively welded on two circuit boards; one end of the clamping cavity is connected to the inner cavity of the second shell, and the other end of the clamping cavity is connected to the inner cavity of the first shell through a through hole; the inner cavity of the second shell is connected to the inner cavity of the first shell through a radial channel. The present invention ensures that the potting compound can fully fill the inner cavity of the sensor, completely eliminating the porosity problem caused by the traditional blind hole structure; at the same time, the screw fixing method avoids uneven potting caused by tilting or misalignment of the circuit board, so that the potting compound evenly wraps the circuits and components, greatly improving the reliability of the potting process and the product qualification rate.

Description

Technical Field

[0001] The invention belongs to the field of temperature and vibration detection equipment, and in particular relates to a vibration-temperature composite sensor which is convenient for potting. Background Art

[0002] Vibration-temperature composite sensors offer advantages such as high integration and easy installation and maintenance, making them widely used in fields such as railway transportation. MEMS (Micro-Electro-Mechanical System) vibration sensors are a type of vibration detection technology based on microelectromechanical systems. Their core components are micron-scale cantilever beams or mass-spring structures. When the sensor is subjected to external vibration, inertial forces cause the mass to displace, resulting in changes in the parameters of the connected piezoresistive, capacitive, or piezoelectric element (such as resistance, plate spacing, or charge). These changes are converted into electrical signals, amplified, and filtered, ultimately outputting an electrical signal proportional to the vibration acceleration, frequency, or amplitude, enabling precise measurement of mechanical vibration into electrical signals.

[0003] Since the vibration temperature composite sensor has a frequency range requirement for vibration acquisition (generally 160Hz~8kHz, ±3dB), that is, within the specified frequency range, the output of the sensor should not exceed the given deviation. This performance is proportional to the rigid connection strength between the vibration chip and the vibration source. The greater the rigid connection strength between the vibration chip and the vibration source, the more stable the high-frequency part of the sensor. In the prior art, the vibration chip and the sensor probe are simply surface-mounted, and the rigid connection strength is poor, resulting in instability in the high-frequency part of the sensor, which easily causes distortion of the collected signal. Specifically, in the prior art, a groove is set at the bottom of the inner cavity of the sensor probe, so the circuit board with the vibration chip has a degree of freedom constraint on only one side, and the other surfaces of the circuit board except the bottom surface have no effective constraints. In fact, after the circuit board is placed in the groove, it will often tilt, which will increase the lateral sensitivity of the vibration output (the lateral sensitivity is A harmful indicator of vibration sensors); and because the inner cavity of the sensor probe is relatively deep, it is not easy to quickly and effectively judge whether the circuit board is fully inserted in place during actual production; for dual-axis vibration and temperature composite sensors (that is, vibration signals in two directions need to be collected, and two circuit boards are required), if they are not installed in place, the consistency of the internal wiring space of the sensor will be poor; this leads to the existing technology having high requirements for the potting process operation of the sensor cavity (that is, after the circuit board is stuck in the groove, the sensor cavity is filled with potting glue such as epoxy resin), and a small space is easily formed between the circuit board and the sensor housing. The potting glue is not easy to pot the entire space of the cavity, which makes the insulation withstand voltage of the sensor easy to be broken down.

[0004] Secondly, the micro-mechanical structure of a single MEMS chip is generally distributed in a flat shape. When detecting vibration, keeping the distribution plane of the micro-mechanical structure consistent with the vibration direction of the main vibration source can achieve better detection results. The installation posture of the MEMS chip relative to the vibration source is mainly affected by two factors. On the one hand, it is the assembly method between the MEMS chip itself and the sensor housing, and on the other hand, it is the assembly method between the sensor housing and the vibration source. Even if the existing technology can make the MEMS chip maintain a specific angle with the sensor housing, during the sensor installation process, due to the existence of processing errors, it is still difficult to ensure that the MEMS chip can be at the ideal assembly angle with the vibration source after the thread is rotated into place. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a vibration-temperature composite sensor that is easy to pot, thereby ensuring the reliability of the vibration sensor installation structure and reducing the difficulty of the packaging process.

[0006] To achieve the above and other related objectives, the present invention provides a vibration-temperature composite sensor that is easy to pot, comprising:

[0007] An inner shell assembly, the inner shell assembly comprising a cylindrical first shell and a second shell, the second shell being connected to a first end wall of the first shell, and the inner cavity of the second shell being in communication with the inner cavity of the first shell; a mounting frame being provided on the inner side of the first end wall and extending axially;

[0008] Circuit boards, two of which are mounted on either side of the mounting frame and enclose a cavity with the mounting frame, with the surfaces of the circuit boards parallel to the axis of the inner shell assembly;

[0009] a temperature sensitive element housed in the second housing;

[0010] MEMS vibration sensors, wherein the two MEMS vibration sensors are respectively welded on the sides of the two circuit boards facing away from the clamping cavity;

[0011] An end of the clamping cavity close to the first end wall is in communication with the inner cavity of the second shell, and an end of the clamping cavity away from the first end wall is in communication with the inner cavity of the first shell via a through hole provided on the mounting frame;

[0012] A radial channel is provided on the inner side of the first end wall, and the inner cavity of the second shell is connected to the inner cavity of the first shell through the radial channel;

[0013] The first shell is provided with a cable interface, the signal lines of the temperature sensitive element and the circuit board are led to the cable interface, and the signal lines of the temperature sensitive element pass through the radial channel.

[0014] In an optional embodiment of the present invention, it also includes an outer shell component, which includes a base, a first side of the base is provided with a groove for accommodating the first shell, and a second side of the base is protruded with a threaded tube for connecting to the inspected device, the inner cavity of the threaded tube is connected to the groove, and the second shell is accommodated in the inner cavity of the threaded tube; a positioning mechanism is provided on the second side of the base, and the positioning mechanism is configured so that when the threaded tube and the inspected device are connected to a preset depth and the base is rotated to a preset angle relative to the inspected device, the positioning mechanism can cooperate with the preset positioning groove on the inspected device to keep the base at the preset angle; a limiting mechanism is provided between the inner shell component and the base, and the limiting mechanism is configured to prevent the inner shell component from rotating relative to the base.

[0015] In an optional embodiment of the present invention, a pre-tightening mechanism is further included, which is configured to generate a pre-tightening force parallel to the axial direction of the threaded tube between the base and the inspected device when the threaded tube is connected to the inspected device to a preset depth and the base is rotated to a preset angle relative to the inspected device.

[0016] In an optional embodiment of the present invention, the pre-tightening mechanism includes a pressure cover and a force transmission medium, the pressure cover is threadedly connected to the base, the force transmission medium is arranged through the base, one end of the force transmission medium abuts against the pressure cover, and the other end of the force transmission medium is used to abut against the surface of the inspected equipment.

[0017] In an optional embodiment of the present invention, a protrusion is provided on the outer side of the first end wall of the first shell, and the protrusion passes through the base through a hollow portion provided on the base. The pressure cover abuts against the first shell, the first shell and the protrusion constitute the force transmission medium, and the protrusion and the hollow portion constitute the limiting mechanism.

[0018] In an optional embodiment of the present invention, the positioning mechanism includes a positioning ring, a protrusion is provided on the outer circumferential surface of the positioning ring, and a ring groove is provided on the second side of the base surrounding the threaded tube, the positioning ring is sleeved on the root of the threaded tube, the positioning ring is arranged to rotate synchronously with the threaded tube, and the positioning ring is arranged to slide along the axial direction of the threaded tube, an elastic element is provided between the positioning ring and the base, and the elastic element is configured so that its elastic force can drive the positioning ring to move in a direction away from the base, and a holding mechanism is further provided on the second side of the base, the holding mechanism is configured to be able to hold the positioning ring located in the ring groove in the ring groove, and when the holding mechanism is squeezed by external force, the positioning ring can be released so that the positioning ring protrudes from the second side of the base under the action of the elastic element.

[0019] In an optional embodiment of the present invention, the retaining mechanism includes a retaining frame made of an elastic material, the retaining frame is fixed in the annular groove, the retaining frame is provided with an elastic clip on the side facing the positioning ring, the positioning ring is provided with a slot that cooperates with the elastic clip, and the elastic clip is provided with a convex portion protruding from the second side of the base on the side away from the base, and the elastic clip is configured to separate the elastic clip from the slot when the convex portion is squeezed by an external force axially directed to the base.

[0020] In an optional embodiment of the present invention, a through hole is provided in the annular groove and passes through the base, a screw is provided in the through hole, a radial flange is provided at one end of the screw located on the first side of the base, and the other end of the screw is connected to the threaded hole provided on the positioning ring.

[0021] In an optional embodiment of the present invention, a buffer pad made of elastic material is provided between the first end wall of the first shell and the first side of the base.

[0022] In an optional embodiment of the present invention, the base and the pressure cover have non-circular outer circumferential surfaces capable of cooperating with a screwing tool.

[0023] The technical effect of the present invention is that: the present invention significantly improves the potting effect by designing an inner shell component with a mounting frame and optimizing the potting structure. The mounting frame fixes the two circuit boards in a standardized manner and forms a clamping cavity, and cooperates with the top through hole and the radial channel to form a two-way potting path, ensuring that the potting glue can fully fill the inner cavity of the sensor, especially the connecting area between the clamping cavity and the second shell, completely eliminating the porosity problem caused by the traditional blind hole structure; at the same time, the screw fixing method avoids uneven potting caused by tilting or out of position of the circuit board, so that the potting glue evenly wraps the circuit and components, greatly improving the reliability of the potting process and the product qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is an exploded view of an inner shell assembly provided by an embodiment of the present invention;

[0025] Figure 2 is an exploded view of a vibration-temperature composite sensor provided by an embodiment of the present invention;

[0026] Figure 3 is a three-dimensional diagram of a vibration-temperature composite sensor provided by an embodiment of the present invention;

[0027] Figure 4 yes Figure 3 I local enlarged view;

[0028] Figure 5 is an end view of a vibration-temperature composite sensor provided by an embodiment of the present invention;

[0029] Figure 6 yes Figure 5 AA cross-sectional view;

[0030] Figure 7 yes Figure 6 II partial enlarged view;

[0031] Figure 8 is an exploded view of a base and its accessories provided by an embodiment of the present invention;

[0032] Figure 9 is an exploded view of a locating ring and a retaining frame provided by an embodiment of the present invention;

[0033] Description of the accompanying drawings: 10. First shell; 11. First end wall; 12. Cylindrical side wall; 13. Second end wall; 14. Radial channel; 15. Cable interface; 16. Protrusion; 17. Mounting frame; 171. Clamping cavity; 18. Through hole; 20. Second shell; 30. Circuit board; 40. Temperature sensitive element; 50. Base; 51. Threaded tube; 52. Hollow portion; 53. Buffer pad; 54. Ring groove; 60. Pressure cover; 70. Positioning ring; 71. Bump; 72. Screw; 73. Slot; 80. Retaining frame; 81. Elastic buckle; 82. Protrusion; 90. Elastic element. DETAILED DESCRIPTION

[0034] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0035] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0036] See also Figure 1 As shown, the embodiment of the present invention provides a vibration-temperature composite sensor that is easy to encapsulate, including an inner shell assembly, a circuit board 30, a temperature sensitive element 40 and a MEMS vibration sensor; the inner shell assembly includes a cylindrical first shell 10 and a second shell 20, the second shell 20 is connected to the first end wall 11 of the first shell 10, and the inner cavity of the second shell 20 is connected to the inner cavity of the first shell 10; the inner side of the first end wall 11 is provided with a mounting frame 17 that is axially protruding; the two circuit boards 30 are respectively mounted on both sides of the mounting frame 17, and enclose a clamping cavity 171 with the mounting frame 17, and the board surface of the circuit board 30 is parallel to the axis of the inner shell assembly; the temperature sensitive element 40 is accommodated in the second shell 20; the two The MEMS vibration sensors are respectively welded on the side of the two circuit boards 30 facing away from the clamping cavity 171; the end of the clamping cavity 171 close to the first end wall 11 is connected to the inner cavity of the second shell 20, and the end of the clamping cavity 171 away from the first end wall 11 is connected to the inner cavity of the first shell 10 through the through hole 18 opened on the mounting frame 17; a radial channel 14 is provided on the inner side of the first end wall 11, and the inner cavity of the second shell 20 is connected to the inner cavity of the first shell 10 through the radial channel 14; a cable interface 15 is provided on the first shell 10, and the signal lines of the temperature sensitive element 40 and the circuit board 30 are led to the cable interface 15, and the signal line of the temperature sensitive element 40 passes through the radial channel 14.

[0037] The present invention significantly improves the potting effect by designing an inner shell component with a mounting frame 17 and optimizing the potting structure. The mounting frame 17 fixes the two circuit boards 30 in a standardized manner and forms a clamping cavity 171, which cooperates with the top through hole 18 and the radial channel 14 to form a two-way potting path, ensuring that the potting glue can fully fill the sensor cavity, especially the connecting area between the clamping cavity 171 and the second shell 20, completely eliminating the porosity problem caused by the traditional blind hole structure; at the same time, the screw fixing method avoids uneven potting caused by tilting or misalignment of the circuit board 30, so that the potting glue evenly wraps the circuits and components, greatly improving the reliability of the potting process and the product qualification rate.

[0038] See also Figure 1As shown, in a specific embodiment, in order to facilitate processing and glue pouring, the first shell 10 can be split into multiple parts, such as the first end wall 11, the cylindrical side wall 12 and the second end wall 13, and the cable interface 15 can be set on the second end wall 13. Before pouring, the cylindrical side wall 12 and the first end wall 11 can be welded together to form a glue pouring space. After the pouring is completed, the second end wall 13 and the cylindrical side wall 12 are welded together to form a closed space.

[0039] See also Figure 2-9 As shown, in an optional embodiment of the present invention, it further includes an outer shell component, which includes a base 50, a first side of the base 50 is provided with a groove for accommodating the first shell 10, and a second side of the base 50 is protruded with a threaded tube 51 for connecting to the inspected device, the inner cavity of the threaded tube 51 is connected to the groove, and the second shell 20 is accommodated in the inner cavity of the threaded tube 51; a positioning mechanism is provided on the second side of the base 50, and the positioning mechanism is configured so that when the threaded tube 51 and the inspected device are connected to a preset depth and the base 50 is rotated to a preset angle relative to the inspected device, the positioning mechanism can cooperate with the preset positioning groove on the inspected device to keep the base 50 at the preset angle; a limiting mechanism is provided between the inner shell component and the base 50, and the limiting mechanism is configured to prevent the inner shell component from rotating relative to the base 50. This further embodiment achieves precise angular locking of the sensor housing and the device under test through the depth control of the threaded tube 51 and the cooperation of the positioning mechanism and the positioning groove. Combined with the limiting mechanism between the inner shell assembly and the base 50, the installation posture of the MEMS vibration chip is doubly guaranteed: when the thread is tightened to a preset depth, the positioning mechanism automatically snaps into the positioning groove of the device under test, forcibly fixing the circumferential angle of the outer shell assembly. At the same time, the limiting mechanism prevents the inner shell assembly from rotating relative to each other, ensuring that the sensitive direction of the MEMS chip is always strictly aligned with the main vibration direction of the vibration source, effectively eliminating the installation angle deviation caused by processing errors, and significantly improving the accuracy of vibration signal detection and frequency response consistency.

[0040] See also Figure 2 、 Figure 3 、 Figure 5 、 Figure 6As shown, in an optional embodiment of the present invention, a pre-tightening mechanism is further included, and the pre-tightening mechanism is configured to generate a pre-tightening force parallel to the axial direction of the threaded tube 51 between the base 50 and the device under test when the threaded tube 51 is connected to the device under test to a preset depth and the base 50 is rotated to a preset angle relative to the device under test. This further embodiment applies an axial pre-tightening force when the threaded tube 51 is tightened to a preset depth by the pre-tightening mechanism, so that a rigid and tight contact is formed between the sensor base 50 and the device under test, effectively eliminating the tiny gaps or looseness that may exist in traditional threaded connections; this stable mechanical coupling ensures efficient and lossless transmission of vibration energy from the device under test to the sensor housing, especially in high-frequency vibration scenarios, avoiding signal attenuation or distortion caused by micro-movement of the contact surface, thereby significantly improving the detection fidelity of the MEMS chip to the original signal of the vibration source and ensuring the measurement accuracy and stability of the sensor within the full frequency band.

[0041] See also Figure 2 、 Figure 3 、 Figure 5 、 Figure 6 As shown, in an optional embodiment of the present invention, the pre-tightening mechanism includes a pressure cap 60 and a force transmission medium. The pressure cap 60 is threadedly connected to the base 50. The force transmission medium is provided through the base 50. One end of the force transmission medium abuts the pressure cap 60, and the other end of the force transmission medium is used to abut the surface of the device under inspection. A protrusion 16 is provided on the outer side of the first end wall 11 of the first shell 10. The protrusion 16 is provided through the hollow portion 52 provided on the base 50 and extends through the base 50. The pressure cap 60 abuts against the first shell 10. The first shell 10 and the protrusion 16 constitute the force transmission medium, and the protrusion 16 and the hollow portion 52 constitute the limiting mechanism. This further embodiment utilizes an integrated design, utilizing the protrusion 16 of the first housing 10 as both a force transmission medium and a position limiting mechanism, reducing the number of parts and improving assembly reliability. The rigid protrusion 16 eliminates potential signal attenuation caused by the intermediate medium, ensuring lossless transmission of high-frequency vibrations to the MEMS chip. The combination of the protrusion 16 and the hollow portion 52 of the base 50 not only achieves preload, but also naturally limits the circumferential rotation of the inner housing assembly, doubly ensuring the angular accuracy of the MEMS chip's installation. The hollow portion 52 is designed to combine preload transmission and position limiting functions, avoiding the weakening of the base 50 that would result from separately fabricating the position limiting structure. This solution significantly improves production feasibility while enhancing sensor performance.

[0042] See also Figure 3-Figure 9As shown, in an optional embodiment of the present invention, the positioning mechanism includes a positioning ring 70, a protrusion 71 is provided on the outer circumferential surface of the positioning ring 70, and a ring groove 54 is provided on the second side of the base 50 around the threaded tube 51, the positioning ring 70 is sleeved on the root of the threaded tube 51, the positioning ring 70 is rotated synchronously with the threaded tube 51, and the positioning ring 70 is slid along the axial direction of the threaded tube 51, an elastic element 90 is provided between the positioning ring 70 and the base 50, and the elastic element 90 is configured so that its elastic force can drive the positioning ring 70 to move in a direction away from the base 50, and a holding mechanism is further provided on the second side of the base 50, the holding mechanism is configured to be able to hold the positioning ring 70 located in the ring groove 54 in the ring groove 54, and when the holding mechanism is squeezed by external force, the positioning ring 70 can be released so that the positioning ring 70 protrudes from the second side of the base 50 under the action of the elastic element 90. This further embodiment achieves an automatic ejection function for the positioning ring 70 through the synergistic effect of the elastic element 90 and the retaining mechanism: when the sensor is installed to a preset depth, the surface of the device under test presses against the retaining mechanism, triggering the release of the positioning ring 70. The elastic element 90 then pushes the positioning ring 70 out of the surface of the base 50, causing it to automatically snap into the positioning slot of the device under test. This design simplifies the installation process and effectively avoids human installation errors, thereby ensuring that the sensitive direction of the MEMS vibration chip strictly matches the main vibration direction of the vibration source, significantly improving the accuracy of vibration signal acquisition.

[0043] See also Figure 3-Figure 9As shown, in an optional embodiment of the present invention, the retaining mechanism includes a retaining frame 80 made of elastic material, the retaining frame 80 is fixed in the annular groove 54, the retaining frame 80 is provided with an elastic clip 81 on the side facing the positioning ring 70, the positioning ring 70 is provided with a slot 73 that cooperates with the elastic clip 81, the elastic clip 81 is provided with a convex portion 82 protruding from the second side of the base 50 on the side away from the base 50, and the elastic clip 81 is configured to separate the elastic clip 81 from the slot 73 when the convex portion 82 is squeezed by an external force axially directed to the base 50. The specific principle of the holding mechanism is as follows: when the threaded tube 51 is screwed into the device to be inspected to a preset depth, the surface of the device to be inspected squeezes the convex portion 82, and the elastic buckle 81 collapses at this time, thereby separating the elastic buckle 81 from the slot 73, and the positioning ring 70 pops out. However, at this time, the protrusion 71 on the positioning ring 70 does not necessarily align with the notch on the edge of the positioning slot on the device to be inspected. If the two are not aligned, the positioning ring 70 will not temporarily pop into the positioning slot. As the threaded tube 51 continues to be screwed, the protrusion 71 on the positioning ring 70 will inevitably reach a position aligned with the notch on the edge of the positioning slot. At this time, the positioning ring 70 will pop into the positioning slot, thereby achieving circumferential fixation between the base 50 and the device to be inspected. This further embodiment achieves adaptive and precise positioning of the positioning ring 70. When the threaded tube 51 is screwed in to a preset depth, the device under inspection squeezes the protrusion 82, triggering the elastic snap 81 to separate from the slot 73. Under the action of the elastic element 90, the positioning ring 70 enters a ready-to-eject state. As the threaded tube 51 continues to rotate, the protrusion 71 of the positioning ring 70 automatically locates its position until it aligns with the notch in the positioning slot, instantly snapping in and locking. This pre-trigger plus dynamic calibration mechanism avoids the tedious precise alignment required by traditional positioning methods. Even in complex installation environments, it can still 100% guarantee the precise alignment of the MEMS chip's sensitive direction with the main vibration direction of the vibration source, significantly improving installation efficiency and measurement accuracy.

[0044] See also Figure 6 、 Figure 7 、 Figure 8As shown, in an optional embodiment of the present invention, a through-hole extending through the base 50 is provided within the annular groove 54. A screw 72 is mounted within the through-hole. One end of the screw 72, located on the first side of the base 50, is provided with a radial flange, and the other end of the screw 72 is connected to a threaded hole in the positioning ring 70. This further embodiment, by providing a screw 72 with a radial flange within the annular groove 54 to connect the positioning ring 70, enables rapid and non-destructive sensor removal. To remove the sensor, simply tighten the screw 72 from the first side of the base 50. The axial force of the screw 72 smoothly withdraws the positioning ring 70 from the positioning groove of the device under test, while simultaneously compressing the elastic element 90 to return the positioning ring 70 to the annular groove 54. This design not only avoids the mechanical damage to the positioning ring 70 or the positioning groove that can occur during disassembly of traditional positioning structures, but also significantly reduces the force required for disassembly through the mechanical advantage of the screw 72. This allows the sensor to be quickly detached from the device under test during maintenance without affecting the repeatable accuracy of the positioning mechanism, significantly improving the maintainability and service life of the product.

[0045] See also Figure 2 、 Figure 3 、 Figure 6 As shown, in an optional embodiment of the present invention, a buffer pad 53 made of elastic material is disposed between the first end wall 11 of the first housing 10 and the first side of the base 50. The base 50 and the gland 60 have non-circular outer surfaces that can be engaged with screwing tools. The elastic buffer pad 53 mitigates stress concentration caused by the installation preload force, preventing rigid compression between the first housing 10 and the base 50. The non-circular outer surfaces of the base 50 and gland 60 facilitate quick clamping with standardized tools, significantly improving on-site assembly and disassembly efficiency.

[0046] In summary, the present invention significantly improves the potting effect by designing an inner shell component with a mounting frame 17 and optimizing the potting structure. The mounting frame 17 fixes the two circuit boards 30 in a standardized manner and forms a clamping cavity 171, which cooperates with the top through hole 18 and the radial channel 14 to form a bidirectional potting path, ensuring that the potting glue can fully fill the sensor cavity, especially the communication area between the clamping cavity 171 and the second shell 20, completely eliminating the porosity problem caused by the traditional blind hole structure; at the same time, the screw 72 fixing method avoids the uneven potting caused by the tilt or misalignment of the circuit board 30, so that the potting glue evenly wraps the circuit and components, greatly improving the reliability of the potting process and the product qualification rate; through the depth control of the threaded tube 51 and the cooperation of the positioning mechanism and the positioning groove, the precise angle locking of the sensor housing and the device under test is achieved, and combined with the limiting mechanism between the inner shell component and the base 50, the installation posture of the MEMS vibration chip is doubly guaranteed: when the thread is tightened to the preset depth, the positioning mechanism automatically snaps into the positioning groove of the device under test, forcibly fixing the circumferential angle of the outer shell component, and at the same time the limiting mechanism prevents the inner shell component from rotating relative to ensure MEMS The sensitive direction of the MEMS chip is always strictly aligned with the main vibration direction of the vibration source, effectively eliminating installation angle deviation caused by machining errors and significantly improving the accuracy and frequency response consistency of vibration signal detection. A preload mechanism applies an axial preload when the threaded tube 51 is tightened to a preset depth, establishing rigid and tight contact between the sensor base 50 and the device under test, effectively eliminating the slight gaps or looseness that may exist in traditional threaded connections. This stable mechanical coupling ensures efficient and lossless transmission of vibration energy from the device under test to the sensor housing. Especially in high-frequency vibration scenarios, it avoids signal attenuation or distortion caused by micro-motion of the contact surface, significantly improving the MEMS chip's detection fidelity of the vibration source's original signal and ensuring the sensor's measurement accuracy and stability across the entire frequency band. The synergistic effect of the elastic element 90 and the retaining mechanism enables the automatic ejection function of the positioning ring 70: when the sensor is installed to the preset depth, the surface pressure of the device under test triggers the retaining mechanism to release the positioning ring 70. The elastic element 90 then pushes the positioning ring 70 out of the surface of the base 50, causing it to automatically engage the positioning groove of the device under test. This design simplifies the installation operation process and effectively avoids human installation errors, thereby ensuring that the sensitive direction of the MEMS vibration chip is strictly matched with the main vibration direction of the vibration source, significantly improving the accuracy of vibration signal acquisition; and realizing adaptive and precise positioning of the positioning ring 70: when the threaded tube 51 is screwed in to a preset depth, the inspected equipment squeezes the protrusion 82 to trigger the elastic buckle 81 to separate from the slot 73, and the positioning ring 70 enters the ejection state under the action of the elastic element 90; as the threaded tube 51 continues to rotate, the protrusion 71 of the positioning ring 70 automatically locates its position until it is aligned with the notch of the positioning slot and instantly ejects and locks.This pre-trigger plus dynamic calibration mechanism avoids the tedious operation of precise alignment required by traditional positioning methods. Even in complex installation environments, it can still 100% guarantee the precise alignment of the sensitive direction of the MEMS chip and the main vibration direction of the vibration source, greatly improving installation efficiency and measurement accuracy.

[0047] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

[0048] In the description herein, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of the embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more of the specific details or with other devices, systems, assemblies, methods, components, materials, parts, etc. In other cases, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.

Claims

1. A vibration temperature composite sensor that is easy to pot, characterized in that: include: An inner shell assembly, the inner shell assembly comprising a cylindrical first shell (10) and a second shell (20), the second shell (20) being connected to a first end wall (11) of the first shell (10), and the inner cavity of the second shell (20) being in communication with the inner cavity of the first shell (10); a mounting frame (17) being provided on the inner side of the first end wall (11) and extending in an axial direction; Circuit boards (30), two circuit boards (30) are respectively mounted on both sides of the mounting frame (17) and enclose a clamping cavity (171) with the mounting frame (17), and the board surface of the circuit boards (30) is parallel to the axis of the inner shell assembly; A temperature sensitive element (40) is housed in the second shell (20); MEMS vibration sensors, wherein the two MEMS vibration sensors are respectively welded on the sides of the two circuit boards (30) facing away from the clamping cavity (171); One end of the clamping cavity (171) close to the first end wall (11) is in communication with the inner cavity of the second shell (20), and one end of the clamping cavity (171) away from the first end wall (11) is in communication with the inner cavity of the first shell (10) via a through hole (18) provided on the mounting frame (17); A radial channel (14) is provided on the inner side of the first end wall (11), and the inner cavity of the second shell (20) is communicated with the inner cavity of the first shell (10) through the radial channel (14); A cable interface (15) is provided on the first housing (10), and signal lines of the temperature sensitive element (40) and the circuit board (30) are led to the cable interface (15), and the signal line of the temperature sensitive element (40) passes through the radial channel (14).

2. The vibration-temperature composite sensor that is easy to pot according to claim 1, characterized in that: The invention also includes a shell component, the shell component includes a base (50), a first side of the base (50) is provided with a groove for accommodating the first shell (10), a second side of the base (50) is provided with a threaded tube (51) for connecting to the device to be inspected, the inner cavity of the threaded tube (51) is communicated with the groove, and the second shell (20) is accommodated in the inner cavity of the threaded tube (51); a second side of the base (50) is provided with a positioning mechanism, the positioning mechanism is configured to cooperate with the positioning groove preset on the device to be inspected when the threaded tube (51) and the device to be inspected are connected to a preset depth and the base (50) is rotated to a preset angle relative to the device to be inspected, so that the base (50) is maintained at the preset angle; a limiting mechanism is provided between the inner shell component and the base (50), the limiting mechanism is configured to prevent the inner shell component from rotating relative to the base (50).

3. The vibration-temperature composite sensor that is easy to pot according to claim 2, characterized in that: The invention also includes a pre-tightening mechanism, which is configured to generate a pre-tightening force parallel to the axial direction of the threaded tube (51) between the base (50) and the inspected device when the threaded tube (51) is connected to the inspected device to a preset depth and the base (50) is rotated to a preset angle relative to the inspected device.

4. The vibration-temperature composite sensor that is easy to pot according to claim 3, characterized in that: The pre-tightening mechanism includes a pressure cover (60) and a force transmission medium, wherein the pressure cover (60) is threadedly connected to the base (50), the force transmission medium is arranged to pass through the base (50), one end of the force transmission medium abuts against the pressure cover (60), and the other end of the force transmission medium is used to abut against the surface of the device under inspection.

5. The vibration-temperature composite sensor that is easy to pot according to claim 4, characterized in that: A protrusion (16) is provided on the outer side of the first end wall (11) of the first shell (10), and the protrusion (16) passes through the base (50) through a hollow portion (52) provided on the base (50). The pressure cover (60) abuts against the first shell (10), the first shell (10) and the protrusion (16) constitute the force transmission medium, and the protrusion (16) and the hollow portion (52) constitute the limiting mechanism.

6. The vibration-temperature composite sensor that is easy to pot according to claim 2, characterized in that: The positioning mechanism comprises a positioning ring (70), a protrusion (71) is provided on the outer peripheral surface of the positioning ring (70), a ring groove (54) is provided on the second side of the base (50) and is arranged around the threaded tube (51), the positioning ring (70) is sleeved on the root of the threaded tube (51), the positioning ring (70) and the threaded tube (51) are arranged to rotate synchronously, and the positioning ring (70) is arranged to slide along the axial direction of the threaded tube (51), and an elastic element (90) is provided between the positioning ring (70) and the base (50). The elastic element (90) is configured such that its elastic force can drive the positioning ring (70) to move in a direction away from the base (50), and a retaining mechanism is further provided on the second side of the base (50). The retaining mechanism is configured to retain the positioning ring (70) located in the annular groove (54) in the annular groove (54), and to release the positioning ring (70) when the retaining mechanism is squeezed by an external force, so that the positioning ring (70) protrudes from the second side of the base (50) under the action of the elastic element (90).

7. The vibration-temperature composite sensor that is easy to pot according to claim 6, characterized in that: The retaining mechanism comprises a retaining frame (80) made of elastic material, the retaining frame (80) being fixed in the annular groove (54), the retaining frame (80) being provided with an elastic snap (81) on the side facing the positioning ring (70), the positioning ring (70) being provided with a slot (73) cooperating with the elastic snap (81), the elastic snap (81) being provided with a convex portion (82) protruding from the second side of the base (50) on the side away from the base (50), the elastic snap (81) being configured to separate the elastic snap (81) from the slot (73) when the convex portion (82) is squeezed by an external force axially directed toward the base (50).

8. The vibration-temperature composite sensor that is easy to pot according to claim 7, characterized in that: A through hole is provided in the annular groove (54) and passes through the base (50). A screw (72) is provided in the through hole. One end of the screw (72) located on the first side of the base (50) is provided with a radial flange, and the other end of the screw (72) is connected to a threaded hole provided on the positioning ring (70).

9. The vibration-temperature composite sensor that is easy to pot according to claim 5, characterized in that: A buffer pad (53) made of elastic material is provided between the first end wall (11) of the first shell (10) and the first side of the base (50).

10. The vibration-temperature composite sensor that is easy to pot according to claim 4, characterized in that: The base (50) and the pressure cover (60) have non-circular outer peripheral surfaces capable of cooperating with a screwing tool.

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