High-temperature creep test device and test method

Abstract

The invention discloses a high-temperature creep test device and a high-temperature creep test method. The test device comprises a solid substrate, a plurality of insulating heat conduction pipes, a plurality of first heating assemblies, a plurality of cooling assemblies, a second heating assembly and a measurement module, a plurality of through holes are formed in the solid base body; the first heating assembly and the cooling assembly are arranged in the open holes in a penetrating mode according to a set rule. The insulating heat conduction pipes are in one-to-one correspondence with the first heating assemblies and located between the first heating assemblies and the solid base body. The first heating assembly is used for locally heating the solid substrate; the second heating assembly is used for integrally heating the solid substrate; the cooling assembly is used for locally cooling the solid substrate; the measuring module is used for collecting deformation data of the solid substrate. The experimental device can perform non-uniform heating on the solid substrate, perform a high-temperature creep experiment on the solid substrate under the condition of non-uniform heating, and automatically collect deformation data of the solid substrate by using the measurement module.

Description

Technical Field

[0001] The present invention relates to the technical field of high-temperature creep experiments, and particularly to a high-temperature creep test device and an experimental method. Background Art

[0002] The heat pipe cooled nuclear reactor adopts a solid matrix core design, and the core heat is exported in a passive manner through heat pipes. It has outstanding advantages such as simple reactor structure, high inherent safety characteristics, and easy modular design and expansion. The solid core has a significant characteristic of fast transient response speed compared with traditional reactors, and even allows short-term over-rated power operation within the thermal-hydraulic operation limit of the material. Under the action of a non-uniform and rapidly changing temperature field, the honeycomb-shaped core metal matrix will undergo significant and complex deformations. In addition, the fuel arrangement in the solid core is compact, and the space between components is filled with metal matrix materials, making the core a continuous solid whole, with rapid and complex mechanical load transfer. Therefore, the solid core has typical dynamic geometric characteristics, and the creep characteristics under long-term high-temperature operation are an important part of its safety analysis.

[0003] The solid matrix of the heat pipe cooled nuclear reactor is a complex large component in the shape of honeycomb coal, and the fuel rod channels and coolant channels are discretely distributed in the openings of the solid matrix. Therefore, the temperature of the solid matrix shows significant non-uniformity during actual operation. Under certain special working conditions, there are also instantaneous power increases or decreases in the solid matrix core, resulting in transient thermal loads in the matrix. Under the above asymmetric geometry, non-uniform temperature distribution, and transient thermal loads, there are complex high-temperature creep behaviors inside the solid matrix.

[0004] Existing high-temperature creep experiments on metal materials usually target standard specimens in the form of sheets or rods. Some specially designed high-temperature creep test devices can conduct high-temperature creep experiments on other types of non-standard specimens with planar symmetry or axial symmetry. The above test specimens must be clamped by special fixtures to facilitate the application of external tensile loads. Since the moving distance of the mechanism components for applying loads is limited, and considering the deformation of the test specimens during the high-temperature creep experiment, the size of the test specimens is usually small. In addition, the high-temperature creep process of metal materials is sensitive to temperature. Usually, an incubator design is used to heat and keep the test specimens at a constant temperature to reduce the temperature fluctuation of the test specimens during the experiment. Therefore, the existing experimental designs cannot conduct high-temperature creep experiments on large components with complex geometries such as the solid matrix of heat pipe cooled nuclear reactors, cannot achieve non-uniform heating conditions for large components, are difficult to provide transient thermal loads, and cannot conduct non-contact, global, and real-time temperature-displacement-strain coupling measurements on the solid matrix. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a high-temperature creep test device and an experimental method.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a high-temperature creep test device, including a solid matrix, a plurality of insulating heat-conducting tubes, a plurality of first heating components, a plurality of cooling components, a second heating component, and a measurement module;

[0007] The solid matrix is provided with a number of through holes; the first heating components and the cooling components are respectively inserted into the through holes according to a set rule;

[0008] The insulating heat-conducting tubes correspond to the first heating components one by one and are located between the first heating components and the solid matrix;

[0009] The first heating components locally heat the solid matrix; the second heating component globally heats the solid matrix;

[0010] The cooling components are used to locally cool the solid matrix;

[0011] The measurement module is used to collect the deformation data of the solid matrix.

[0012] In some embodiments, the plurality of first heating components are arranged in a hexagonal pattern, and each cooling component is disposed in the middle of the hexagonal arrangement.

[0013] In some embodiments, the cooling component includes a central tube and sleeves located on both sides of the central tube. The first end of the central tube is communicated with the sleeves, and the second end of the central tube is externally connected to a water source; the sleeves are closely attached to the hole wall of the axial through hole.

[0014] In some embodiments, at least one limiting structure is further included. The limiting structure is fixedly connected to the outer periphery of the cooling component and is disposed at the lower part of the solid matrix to prevent the cooling component from detaching from the solid matrix due to insufficient friction.

[0015] In some embodiments, at least one clamping device connected to the outside is further included. The clamping device is disposed at the lower part of the limiting structure or above the solid matrix and is fixedly connected to the cooling component to axially support the entire experimental device.

[0016] In some embodiments, the solid matrix is made of a metal material, and the first heating component is a resistive heating rod.

[0017] In some embodiments, the solid matrix is made of a metal material, the second heating component is an electromagnetic induction heating coil, and the second heating component surrounds the outer periphery of the solid matrix.

[0018] The present invention also constructs a high-temperature creep experiment method, using the high-temperature creep test device described in any one of the above; including the following steps:

[0019] S1: Spray a high-temperature resistant marking light spot on the top of the solid matrix;

[0020] S2: According to the experimental requirements, operate the first number of the cooling components, and operate the second heating component to gradually heat the solid matrix to a specified temperature platform and maintain stability. Use the measurement module to continuously measure the deformation data of the solid matrix to obtain the high-temperature creep evolution law of the solid matrix under steady-state conditions;

[0021] S3: According to the experimental requirements, operate the second number of the cooling components, and operate the third number of the first heating components to locally heat the solid matrix. The insulating heat-conducting tube conducts the heat generated by the first heating component into the solid matrix to instantaneously heat the solid matrix. At the same time, use the measurement module to measure the deformation data of the solid matrix in real time to obtain the high-temperature creep evolution law of the solid matrix under transient conditions.

[0022] In some embodiments, it further includes step S4: Turn off the second heating component and the third number of the first heating components, and continue to operate the fourth number of the cooling components to cool the solid matrix to room temperature. At the same time, use the measurement module to measure the deformation data of the solid matrix in real time to obtain the residual strain of the solid matrix in the cold state.

[0023] In some embodiments, the cooling component is of a folded return path structure, including a central tube and sleeves located on both sides of the central tube. The central tube is communicated with the sleeves;

[0024] In steps S2, S3, and S4, when operating the cooling component, the coolant flows from the bottom to the top through the central tube and flows out from the sleeves from the top to the bottom; or the coolant flows from the top to the bottom through the central tube and flows out from the sleeves from the bottom to the top.

[0025] By implementing the present invention, the following beneficial effects are achieved:

[0026] The high-temperature creep test device of the present invention can heat the solid matrix through multiple first heating components and a second heating component, effectively simulating the complex thermal load conditions of the solid matrix. The influence of the second heating component on the first heating component is eliminated through the insulating heat-conducting tube. Multiple cooling components provide a cooling function, and multiple cooling components combined with multiple first heating components or a second heating component achieve non-uniform temperature distribution. The measurement module is used for real-time, non-contact temperature-displacement-strain coupling measurement. Overall, it can be used for high-temperature creep experiments with non-uniform temperature distribution of the solid matrix, adapting to various complex transient non-uniform heating conditions and high-temperature scenarios, and being close to actual working conditions.

[0027] The high-temperature creep experiment method of the present invention can provide non-uniform heating conditions for large solid components, provide transient thermal loads, and perform non-contact, global, and real-time temperature-displacement-strain coupling measurements on solid matrices. It can adapt to various complex transient non-uniform heating conditions and high-temperature scenarios, and realize high-temperature creep experiments under non-uniform heating conditions of solid matrices. It is convenient to study the dynamic geometric characteristics of solid matrices and the creep characteristics under long-term high-temperature operation. Description of the Drawings

[0028] The present invention will be further described below in conjunction with the drawings and embodiments. In the drawings:

[0029] Figure 1 is a longitudinal sectional view of a high-temperature creep test device according to an embodiment of the present invention;

[0030] Figure 2 is Figure 1 the A-A sectional view of the high-temperature creep test device in Detailed Embodiments

[0031] In order to have a clearer understanding of the technical features, objectives, and effects of the present invention, the specific embodiments of the present invention will now be described in detail with reference to the drawings.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0033] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a chemical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Embodiment 1:

[0035] Referring to Figures 1 to 2 , Embodiment 1 of the present invention discloses a high-temperature creep test device, which includes a solid matrix 1, a plurality of insulating heat-conducting tubes 2, a plurality of first heating components 3, a plurality of cooling components 4, a second heating component 5, and a measurement module 6. The solid matrix 1 is provided with a number of through holes. The first heating components 3 and the cooling components 4 are respectively inserted into the through holes according to a set rule. The insulating heat-conducting tubes 2 correspond to the first heating components 3 one by one and are located between the first heating components 3 and the solid matrix 1. The first heating components 3 perform local heating on the solid matrix 1; the second heating component 5 performs overall heating on the solid matrix 1. The cooling components 4 are used to perform local cooling on the solid matrix 1. The measurement module 6 is used to collect the deformation data of the solid matrix 1.

[0036] Specifically, each first heating component 3 is wrapped with an insulating heat-conducting tube 2 and fixedly arranged in the through hole of the solid matrix 1 to instantaneously heat the solid matrix 1. The second heating component 5 is sleeved on the outer periphery of the solid matrix 1 to overall heat the solid matrix 1. The measurement module 6 is arranged on the upper part of the solid matrix 1 to measure the deformation data of the solid matrix 1. The second heating component 5 provides a steady-state heating function to realize the uniform heating of the solid matrix 1 and can raise the temperature of the solid matrix 1 to the temperature level required for the test. The first heating components 3 provide a transient heating function to simulate the instantaneous temperature rise process. Since the power of each first heating component 3 can be individually adjusted, complex non-uniform heating conditions of the solid matrix 1 can be achieved. Among them, the solid matrix 1 is made of a metal material, and the first heating components 3 can be resistive heating coils. The second heating component 5 can be an electromagnetic induction heating coil, and the second heating component 5 surrounds the outer periphery of the solid matrix 1. The cooling component 4 is a tubular condenser. The measurement module 6 is a displacement-strain-temperature distribution laser measurement system. The insulating heat-conducting tubes 2 can be insulating ceramic tubes.

[0037] Among them, the solid matrix 1 is the object of the high-temperature creep experiment, and the solid matrix 1 can be a solid with an asymmetric geometry and a non-uniform temperature distribution. For example, in this embodiment, the solid matrix 1 is the solid matrix of a heat pipe-cooled nuclear reactor. The solid matrix 1 is provided with a number of through holes that extend along the axial direction of the solid matrix 1, and the cross section of the solid matrix 1 is integrally honeycomb-shaped. The through-hole part is used to install the first heating components 3 to simulate the fuel rod channels, and the first heating components 3 are used to simulate the fuel rods. Part of it is used to install the cooling components 4 to simulate the coolant channels, and the cooling components 4 are used to simulate the heat pipe cooling components.

[0038] The first heating component 3 is closely fitted with the opening through the insulating heat-conducting tube 2. The insulating heat-conducting tube 2 wraps the first heating component 3, providing insulation protection to prevent the solid matrix 1 and the cooling component 4 from conducting electricity, ensuring the safety of the experimental equipment and experimental personnel. At the same time, it provides a heat-conducting function, which can conduct the heat generated by the first heating component 3 well into the solid matrix 1 and prevent it from being heated by the second heating component 5. To be closer to the actual situation of the solid matrix of the heat pipe-cooled nuclear reactor, multiple first heating components 3 are arranged in a hexagonal pattern, and each cooling component 4 is arranged in the middle of the hexagonal arrangement. The openings are respectively covered and not shown in the figure.

[0039] Due to the compact design of the solid matrix 1, there is not enough space to install traditional contact temperature and strain measurement equipment except for installing the first heating component 3 and the cooling component 4 in its openings. Using the measurement module 6 does not occupy the space of the solid matrix 1. The measurement module 6 can perform real-time, non-contact temperature-displacement-strain coupling measurement by using an optical method and can adapt to various complex transient non-uniform heating conditions and high-temperature scenarios. Among them, the lens of the measurement module 6 is located directly above the solid matrix 1, and its field of view can cover the entire solid matrix 1.

[0040] In some embodiments, the cooling component 4 includes a central tube and sleeves located on both sides of the central tube. The first end of the central tube is communicated with the sleeves, and the second end of the central tube is externally connected to a water source. The sleeves are closely attached to the wall of the axial opening to improve the heat transfer efficiency. The cooling component 4 is a sleeve-type cooling component 4, adopting a folded return path design. The coolant flows into the central tube and out of the sleeves. This design enables the coolant to absorb the heat of the coolant in the sleeves when flowing in the central tube and absorb the heat of the solid matrix 1 when flowing in the sleeves. Compared with the straight-tube coolant flow channel, the sleeve-type cooling component 4 can cool the solid matrix 1 more fully through a compact design. In addition, it avoids blocking or interfering with the measurement module 6. Among them, the cooling component 4 is used to simulate the cooling component of the cooling water heat pipe.

[0041] In some embodiments, there is also at least one limiting structure 7. The limiting structure 7 is fixedly connected to the outer periphery of the cooling component 4 and is arranged at the lower part of the solid matrix 1 to prevent the cooling component 4 from detaching from the solid matrix 1 due to insufficient friction. When not heated, the solid matrix 1 is supported by the friction force between the solid matrix 1 and the cooling component 4, making the solid matrix 1 suspended, reducing contact with other components, thereby reducing the cooling effect of other components on the solid matrix 1, and at the same time enabling the solid matrix 1 to deform more freely under high temperature creep. The limiting structure 7 is welded outside the cooling component 4 and is located below the solid matrix 1 to prevent the solid matrix 1 from slipping during the experimental heating process due to excessive deformation and reduced friction between the solid matrix 1 and the cooling component 4. Among them, the limiting structure 7 can be a limiting ring.

[0042] In some embodiments, it further includes at least one clamping device 8 connected to the outside. The clamping device 8 is disposed below the limiting structure 7 or above the solid matrix 1 and is fixedly connected to the cooling component 4 to axially support the whole experimental device. For example, the clamping device 8 is disposed below the limiting structure 7, and the clamping device 8 clamps the lower end of the cooling component 4 from the side to provide axial support for the whole experimental device. Among them, the clamping device 8 can be a sleeve, which is fixedly connected to the outer periphery of the lower part of the cooling component 4, such as by welding or abutting through fasteners. The sleeve is connected to an external support base, and the external support base stands on the ground, which can be used to support the cooling component 4. It can be understood that the function of the clamping device 8 is to provide support for the cooling component, and as long as the support function is satisfied, the specific structure of the clamping device 8 is not limited herein.

[0043] When not heated, the solid matrix 1 is supported by the frictional force between the solid matrix 1 and the cooling component 4, so that the solid matrix 1 is suspended, reducing the contact with other components, thereby reducing the cooling effect of other components on the solid matrix 1, and at the same time enabling the solid matrix 1 to undergo high-temperature creep deformation more freely. The limiting structure 7 is welded to the outside of the cooling component 4 and is located below the solid matrix 1, and is used to prevent the solid matrix 1 from slipping during the experimental heating process due to excessive deformation of the solid matrix 1 and a decrease in the frictional force between the solid matrix 1 and the cooling component 4. The clamping device 8 can be disposed below the limiting structure 7, and the clamping device 8 clamps the lower end of the cooling component 4 from the side to provide axial support for the whole experimental device.

[0044] Embodiment 2:

[0045] Embodiment 2 of the present invention discloses a high-temperature creep experiment method, using the high-temperature creep test device of Embodiment 1. This experimental method includes the following steps:

[0046] S1: Spray high-temperature resistant marked light spots on the top of the solid matrix 1 for measuring local displacements and strains during the high-temperature creep process. And turn on the measurement module 6, adjust the lens focal length, and set the temperature displacement and strain readings to zero.

[0047] S2: According to the experimental requirements, operate the first number of cooling components 4, and operate the second heating component 5 to gradually heat the solid matrix 1 to a specified temperature platform and keep it stable. Use the measurement module 6 to continuously measure the deformation data of the solid matrix 1 to obtain the high-temperature creep evolution law of the solid matrix 1 under the steady-state condition. Among them, operate the cooling components 4 according to actual needs. In this embodiment, all the cooling components 4 are operated simultaneously. When operating the second heating component 5, turn on the second heating component 5, slowly adjust the power, and use the measurement module 6 to confirm that the overall temperature of the solid matrix 1 is raised to the specified temperature platform and kept stable. Operating the cooling components 4 means introducing a specified flow rate of coolant into the cooling components 4, and the same applies hereinafter.

[0048] S3: According to the experimental requirements, run the second number of cooling components 4, and run the third number of first heating components 3 to locally heat the solid matrix 1. The insulating heat-conducting tube 2 conducts the heat generated by the first heating components 3 into the solid matrix 1, instantaneously heating the solid matrix 1. At the same time, use the measurement module 6 to measure the deformation data of the solid matrix 1 in real time to obtain the high-temperature creep evolution law of the solid matrix 1 under transient conditions. Among them, run the cooling components 4 according to actual needs. In this embodiment, then run all the cooling components 4 without interruption during the high-temperature creep experiment of the solid matrix under steady-state conditions. When running the first heating components 3, adjust the heating power of each first heating component 3 respectively according to the predetermined transient condition requirements to instantaneously increase the temperature of the solid matrix 1.

[0049] Among them, after the high-temperature creep experiment of the solid matrix under steady-state conditions ends, the second heating component 5 can be turned off, or the second heating component 5 can continue to run while conducting the high-temperature creep experiment of the solid matrix under transient conditions. After the high-temperature creep experiment of the solid matrix under transient conditions ends, the second heating component 5 and the first heating components 3 can be turned off.

[0050] In some embodiments, it further includes step S4: Turn off the second heating component 5 and the third number of first heating components 3, and continue to run the fourth number of cooling components 4 to cool the solid matrix 1 to room temperature. At the same time, use the measurement module 6 to measure the deformation data of the solid matrix 1 in real time to obtain the residual strain of the solid matrix 1 in the cold state.

[0051] In some embodiments, the cooling component 4 is of a folded return path structure, including a central tube and sleeves located on both sides of the central tube. The central tube is communicated with the sleeves. In steps S2, S3, and S4, when running the cooling component 4, the coolant flows from the bottom to the top in the central tube and flows out from the sleeves from the top to the bottom. Or the coolant flows from the top to the bottom in the central tube and flows out from the sleeves from the bottom to the bottom. The cooling component 4 is a sleeve-type cooling component 4, adopting a folded return path design. The coolant flows into the central tube and flows out from the sleeves. This design enables the coolant to absorb the heat of the coolant in the sleeves when flowing in the central tube and absorb the heat of the solid matrix 1 when flowing in the sleeves. Compared with the straight tube-type coolant flow channel, the sleeve-type cooling component 4 can cool the solid matrix 1 more fully through a compact design. In addition, it also avoids blocking or interfering with the measurement module 6.

[0052] Finally, after all the experiments are carried out, turn off all the cooling components 4 and the measurement module 6, and the experiment ends.

[0053] The cooling components 4 in the first quantity, second quantity, and fourth quantity mentioned above, where the first quantity, second quantity, and fourth quantity can be the same or different. In the first heating components 3 in the third quantity, the third quantity can be all or part of the quantity. The quantities of the cooling components 4 and the first heating components 3 are both determined according to actual experimental requirements, and the present invention does not limit this here.

[0054] It can be understood that the high-temperature creep test method in this embodiment uses the high-temperature creep test device in Embodiment 1 during the experiment. No additional illustration is provided here, please refer to Figure 1 and Figure 2 . Other structures of the high-temperature creep test device are the same as those in Embodiment 1 and will not be elaborated here.

[0055] By implementing the present invention, the following beneficial effects are achieved:

[0056] The high-temperature creep test device of the present invention can heat the solid matrix 1 through multiple first heating components 3 and second heating components 5, effectively simulating the complex thermal load conditions of the solid matrix 1. Multiple cooling components 4 provide a cooling function, and multiple cooling components 4 combined with multiple first heating components 3 or second heating components 5 achieve a non-uniform temperature distribution. The measurement module 6 is used for real-time, non-contact temperature-displacement-strain coupling measurement. Overall, it can be used for high-temperature creep experiments with non-uniform temperature distribution of the solid matrix 1, adapting to various complex transient non-uniform heating conditions and high-temperature scenarios, and being close to the actual working conditions.

[0057] The high-temperature creep test method of the present invention can provide non-uniform heating conditions, provide transient thermal loads, and perform non-contact, global, and real-time temperature-displacement-strain coupling measurement on the solid matrix 1 for large solid components. It can adapt to various complex transient non-uniform heating conditions and high-temperature scenarios, and realize high-temperature creep experiments under non-uniform heating conditions of the solid matrix 1. It is convenient to study the dynamic geometric characteristics of the solid matrix 1 and the creep characteristics under long-term high-temperature operation.

[0058] It can be understood that the above embodiments only represent the preferred implementation modes of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention patent; it should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, the above embodiments or technical features can be freely combined, and several deformations and improvements can also be made, which all belong to the protection scope of the present invention, that is, the embodiments described in "in some embodiments" can be freely combined with any of the above or below embodiments; therefore, all equivalent transformations and modifications made to the scope of the claims of the present invention should fall within the scope covered by the claims of the present invention.

Claims

1. A high temperature creep test device, characterized in that: It comprises a solid matrix (1), a plurality of insulating heat-conducting pipes (2), a plurality of first heating components (3), a plurality of cooling components (4), a second heating component (5) and a measuring module (6); The solid matrix (1) is provided with a plurality of through openings; the first heating component (3) and the cooling component (4) are respectively inserted into the openings according to a set rule; The insulating heat-conducting pipe (2) corresponds to the first heating component (3) one by one, and is located between the first heating component (3) and the solid matrix (1); The first heating component (3) performs local heating on the solid substrate (1); and the second heating component (5) performs overall heating on the solid substrate (1); The cooling component (4) is used to locally cool the solid matrix (1); The measuring module (6) is used to collect deformation data of the solid matrix (1).

2. The high temperature creep test device according to claim 1, characterized in that: The plurality of first heating components (3) are arranged in a hexagonal shape, and each cooling component (4) is arranged in the middle of the hexagonal shape.

3. The high temperature creep test device according to claim 1, characterized in that: The cooling assembly (4) comprises a central tube and sleeves located on both sides of the central tube, the first end of the central tube is connected to the sleeves, and the second end of the central tube is connected to an external water source; the sleeves are tightly fitted to the hole wall of the opening.

4. The high temperature creep test device according to claim 1, characterized in that: It also includes at least one limiting structure (7), which is fixedly connected to the periphery of the cooling component (4) and is arranged at the lower part of the solid matrix (1) to prevent the cooling component (4) from being separated from the solid matrix (1) due to insufficient friction force.

5. The high temperature creep test device according to claim 4, characterized in that: It also includes at least one clamping device (8) connected to the outside, wherein the clamping device (8) is arranged at the bottom of the limiting structure (7) or above the solid matrix (1) and is fixedly connected to the cooling component (4) to axially support the entire experimental device.

6. The high temperature creep test device according to any one of claims 1 to 5, characterized in that: The solid matrix (1) is made of metal material, and the first heating component (3) is a resistive heating rod.

7. The high temperature creep test device according to any one of claims 1 to 5, characterized in that: The solid-state substrate (1) is made of metal material, the second heating component (5) is an electromagnetic induction heating coil, and the second heating component (5) is arranged around the outer periphery of the solid-state substrate (1).

8. A high temperature creep test method, characterized in that: Using the high temperature creep test device according to any one of claims 1 to 7; comprising the following steps: S1: spraying a high temperature resistant marking spot on the top of the solid substrate (1); S2: according to the experimental requirements, the first number of cooling components (4) are operated, and the second heating components (5) are operated to gradually heat the solid matrix (1) to a specified temperature platform and keep it stable, and the measurement module (6) is used to continuously measure the deformation data of the solid matrix (1) to obtain the high-temperature creep evolution law of the solid matrix (1) under steady-state conditions; S3: According to the experimental requirements, a second number of the cooling components (4) are operated, and a third number of the first heating components (3) are operated to locally heat the solid matrix (1); the insulating heat pipe (2) conducts the heat generated by the first heating components (3) to the solid matrix (1), and instantly heats the solid matrix (1); at the same time, the measurement module (6) is used to measure the deformation data of the solid matrix (1) in real time, and the high-temperature creep evolution law of the solid matrix (1) under transient conditions is obtained.

9. The high temperature creep test method according to claim 8, characterized in that: The method further comprises step S4: turning off the second heating component (5) and the third number of the first heating components (3), continuing to operate the fourth number of the cooling components (4) to cool the solid matrix (1) to room temperature, and simultaneously using the measuring module (6) to measure the deformation data of the solid matrix (1) in real time to obtain the residual strain of the solid matrix (1) in the cold state.

10. The high temperature creep test method according to claim 9, characterized in that: The cooling assembly (4) is a return circuit structure, comprising a central tube and sleeves located on both sides of the central tube, wherein the central tube is in communication with the sleeves; In step S2, step S3 and step S4, when the cooling component (4) is operated, the coolant flows into the central tube from bottom to top and flows out of the sleeve from top to bottom; or the coolant flows into the central tube from top to bottom and flows out of the sleeve from bottom to top.

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