Anode target disc detection method and device and computer equipment

Abstract

The invention relates to an anode target disc detection method and device and computer equipment, and the method comprises the steps: enabling a bombardment surface comprising a plane region and an inclined plane region on a to-be-detected anode target disc to face upwards, placing the to-be-detected anode target disc in an ultrasonic detection pool, determining the scanning range of the bombardment surface, and determining the parameters of an ultrasonic probe according to the scanning range, scanning the scanning range according to the ultrasonic probe parameters so as to determine the welding conditions of the plane area and the inclined plane area according to the echo signals of the first scanning range and the second scanning range under the condition that the scanning range comprises the first scanning range corresponding to the plane area and the second scanning range corresponding to the plane area and the inclined plane area, and the welding condition of the anode target disc to be detected is determined according to the welding conditions of the plane area and the inclined plane area. According to the method, nondestructive detection of the anode target disc to be detected is achieved, meanwhile, the reliability of the obtained welding condition is improved, and the reliability of the detection result is correspondingly improved.

Description

Technical Field

[0001] This application relates to the field of nondestructive testing technologies, and particularly to a method, device, and computer equipment for detecting an anode target disc. Background Art

[0002] The anode target disc is the core component in an X-ray tube that directly bears the electron beam bombardment, and is generally obtained by welding a metal substrate and a base. For example, a Titnaium-Zirconium-Molybdenum (TZM) alloy is used as the metal substrate, and graphite is used as the base, and the TZM alloy is welded onto the graphite base.

[0003] The reliable connection between the metal substrate and the base in the anode target disc is the key to affecting the operation of the X-ray tube. In related technologies, tensile tests, cut-block observations, etc. are usually used to detect the welding reliability between the metal substrate and the base.

[0004] However, the reliability of the detection results obtained in related technologies is poor. Summary of the Invention

[0005] Based on this, in view of the above technical problems, it is necessary to provide a method, device, and computer equipment for detecting an anode target disc.

[0006] In a first aspect, this application provides a method for detecting an anode target disc, including:

[0007] Placing the bombardment surface of the anode target disc to be detected face up in an ultrasonic detection pool, where the bombardment surface of the anode target disc to be detected includes a planar region and an inclined surface region;

[0008] Determining the scanning range of the bombardment surface, and determining ultrasonic probe parameters according to the scanning range;

[0009] Performing ultrasonic scanning on the scanning range according to the ultrasonic probe parameters;

[0010] When the scanning range includes a first scanning range corresponding to the planar region and a second scanning range corresponding to the planar region and the inclined surface region, determining the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range and the second scanning range;

[0011] Determining the welding condition of the anode target disc to be detected according to the welding conditions of the planar region and the inclined surface region.

[0012] In one of the embodiments, determining the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range and the second scanning range includes:

[0013] Determining a first defect echo signal according to the echo signal of the first scanning range, and determining the welding condition of the planar region according to the first defect echo signal;

[0014] Determine the second defect echo signal based on the echo signal in the second scanning range, and determine the welding condition of the inclined surface area according to the second defect echo signal.

[0015] In one embodiment, determining the first defect echo signal based on the echo signal in the first scanning range includes:

[0016] Determine the start time and end time of the first defect echo signal according to the intensity of the echo signal in the first scanning range;

[0017] Grab the first defect echo signal from the echo signal in the first scanning range according to the start time and end time.

[0018] In one embodiment, the echo signal in the first scanning range includes the surface echo signal reflected by the bombarded surface and the first defect echo signal; determining the start time and end time of the first defect echo signal according to the intensity of the echo signal in the first scanning range includes:

[0019] Determine the maximum peak time of the surface echo signal according to the intensity of the echo signal in the first scanning range;

[0020] Determine the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal.

[0021] In one embodiment, determining the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal includes:

[0022] Determine the first duration and the second duration according to the substrate thickness; wherein, the first duration is the interval duration between the maximum peak time of the surface echo signal and the start time, and the second duration is the duration of the first defect echo signal;

[0023] Determine the start time according to the maximum peak time of the surface echo signal and the first duration, and determine the end time according to the start time and the second duration.

[0024] In one embodiment, determining the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal includes:

[0025] Determine the second duration and the third duration according to the substrate thickness; the second duration is the duration of the first defect echo signal; the third duration is the interval duration between the maximum peak time of the surface echo signal and the maximum peak time of the first defect echo signal;

[0026] Determine the maximum peak time of the first defect echo signal according to the maximum peak time of the surface echo signal and the third time duration;

[0027] Determine the start time and end time of the first defect echo signal according to the maximum peak time of the first defect echo signal and the second time duration.

[0028] In one embodiment, determining the welding condition of the inclined plane area according to the second defect echo signal includes:

[0029] Determine the global defect distribution map of the corresponding plane area and inclined plane area according to the second defect echo signal;

[0030] Remove the part corresponding to the plane area in the global defect distribution map to obtain the inclined plane defect distribution map of the inclined plane area;

[0031] Determine the welding condition of the inclined plane area according to the inclined plane defect distribution map.

[0032] In one embodiment, the welding condition of the plane area includes the plane defect distribution map of the plane area, and the welding condition of the inclined plane area includes the plane defect distribution map of the plane area; determining the welding condition of the anode target disk to be measured according to the welding conditions of the plane area and the inclined plane area includes:

[0033] Merge the plane defect distribution map and the inclined plane defect distribution map to obtain a merged defect distribution map;

[0034] Determine the welding condition of the anode target disk to be measured according to the merged defect distribution map.

[0035] In a second aspect, the present application also provides a detection device for an anode target disk, including:

[0036] A detection control module for placing the bombardment surface of the anode target disk to be measured face up in an ultrasonic detection pool, and the bombardment surface of the anode target disk to be measured includes a plane area and an inclined plane area;

[0037] A parameter determination module for determining the scanning range of the bombardment surface and determining ultrasonic probe parameters according to the scanning range;

[0038] A scanning execution module for performing ultrasonic scanning on the scanning range according to the ultrasonic probe parameters;

[0039] A signal analysis module for respectively determining the welding conditions of the plane area and the inclined plane area according to the echo signals of the first scanning range and the second scanning range when the scanning range includes the first scanning range corresponding to the plane area and the second scanning range corresponding to the plane area and the inclined plane area;

[0040] A welding determination module for determining the welding condition of the anode target disk to be measured according to the welding conditions of the plane area and the inclined plane area.

[0041] In a third aspect, the present application further provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of any one of the above methods are implemented.

[0042] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any one of the above methods are implemented.

[0043] In a fifth aspect, the present application further provides a computer program product, including a computer program. When the computer program is executed by a processor, the steps of any one of the above methods are implemented.

[0044] In the above detection method, device and computer device of the anode target disc, by placing the bombardment surface including the planar region and the inclined surface region on the anode target disc to be detected face up in the ultrasonic detection pool, determining the scanning range of the bombardment surface, and determining the ultrasonic probe parameters according to the scanning range, and scanning the scanning range according to the ultrasonic probe parameters. When the scanning range includes the first scanning range corresponding to the planar region and the second scanning range corresponding to the planar region and the inclined surface region, the welding conditions of the planar region and the inclined surface region are determined respectively according to the echo signals of the first scanning range and the second scanning range, and the welding condition of the anode target disc to be detected is determined according to the welding conditions of the planar region and the inclined surface region. In the above method, not only the non-destructive detection of the anode target disc to be detected is realized, but also the echo signals obtained by ultrasonic scanning can be used to reflect the internal structure of the anode target disc to be detected, so as to accurately reflect the welding condition between the metal matrix and the base in the anode target disc to be detected. Therefore, the reliability of the obtained welding condition is improved, and the reliability of the detection result is correspondingly improved. Description of the Drawings

[0045] Figure 1 It is an application environment diagram of the detection method of the anode target disc in an embodiment;

[0046] Figure 2 It is a schematic flowchart of the detection of the anode target disc in an embodiment;

[0047] Figure 3 It is a partial structural schematic diagram of the anode target disc to be detected in an embodiment;

[0048] Figure 4 It is a schematic flowchart of determining the welding conditions of the planar region and the inclined surface region in an embodiment;

[0049] Figure 5 It is a schematic flowchart of determining the first defect echo signal in an embodiment;

[0050] Figure 6Schematic diagram of the process for determining the start time and end time of the first defect echo signal in one embodiment;

[0051] Figure 7 Schematic diagram of the process for determining the start time and end time of the first defect echo signal in another embodiment;

[0052] Figure 8 Schematic diagram of the process for determining the start time and end time of the first defect echo signal in another embodiment;

[0053] Figure 9 Schematic diagram of the process for determining the welding condition of the inclined plane area in one embodiment;

[0054] Figure 10 Schematic diagram of the first defect distribution map in one embodiment;

[0055] Figure 11 Schematic diagram of the second defect distribution map in one embodiment;

[0056] Figure 12 Schematic diagram of the process for determining the welding condition of the anode target disk to be measured in one embodiment;

[0057] Figure 13 Schematic diagram of the merged defect distribution map in one embodiment;

[0058] Figure 14 Schematic diagram of the process for the detection method of the anode target disk in another embodiment;

[0059] Figure 15 Structural block diagram of the detection device for the anode target disk in one embodiment;

[0060] Figure 16 Internal structure diagram of a computer device in one embodiment. Detailed implementation manners

[0061] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0062] The detection method of the anode target disk provided by the embodiments of the present application can be applied to, for example Figure 1In the application environment shown. Among them, the computer device communicates with the ultrasonic probe. The bombarding surface of the anodic target disk to be measured is placed upward in the ultrasonic detection cell, and the medium in the ultrasonic detection cell (usually deionized water) covers the bombarding surface of the anodic target disk to be measured. The computer device can, when a user triggers an operation instruction, control the ultrasonic probe to move and emit an ultrasonic signal to the anodic target disk to be measured, and synchronously monitor the echo signal reflected by the anodic target disk to be measured, so as to determine the welding condition of the anodic target disk to be measured according to the echo signal.

[0063] In one embodiment, as Figure 2 shown, a method for detecting an anodic target disk is provided. Taking this method applied to a computer device as an example for illustration, it includes the following steps:

[0064] S210. Place the bombarding surface of the anodic target disk to be measured upward in the ultrasonic detection cell. The bombarding surface of the anodic target disk to be measured includes a planar region and an inclined surface region.

[0065] In practical applications, welding materials are usually used to weld the metal matrix and the base together to form an anodic target disk. Exemplarily, as Figure 3 shown, the metal matrix of the anodic target disk to be measured can be made of TZM alloy, the base can be made of graphite, and the welding materials can be made of zirconium (Zr), titanium (Ti), or nickel (Ni), or can also be Zr alloy, Ti alloy, or Ni alloy doped with other elements. The bombarding surface of the anodic target disk to be measured is the surface of the metal matrix where the orbit to be bombarded by the electron beam is located. The inclined surface region on the bombarding surface is the region where the orbit is located, the orbit is annular, and the planar region is the matrix surface inside the orbit.

[0066] Before detecting the anodic target disk to be measured, the anodic target disk to be measured can be pretreated, such as decontamination and cleaning, to obtain the pretreated anodic target disk to be measured.

[0067] Optionally, the computer device can communicate with the ultrasonic probe to place the bombarding surface of the anodic target disk to be measured upward in the ultrasonic detection cell when a user triggers an operation instruction, so that the entire anodic target disk to be measured is in the medium environment in the ultrasonic detection cell. The computer device can also control the ultrasonic probe to perform other related operations based on the operation instruction triggered by the user. Exemplarily, the computer device can control the ultrasonic probe to perform calibration processing, such as coordinate calibration and focal length calibration, when a user triggers a one-key calibration instruction, and can also perform an auxiliary operation to remove the bubbles formed on the surface of the probe after the ultrasonic probe enters the water.

[0068] S220. Determine the scanning range of the bombarding surface and determine the ultrasonic probe parameters according to the scanning range.

[0069] Among them, the scanning range is used to characterize the area on the bombardment surface to be detected, and can be any area on the bombardment surface. The ultrasonic probe parameters are the working parameters of the ultrasonic probe.

[0070] Optionally, the computer device may receive a user's input operation, determine the scanning range of the bombardment surface according to the user's input operation, and determine the ultrasonic probe parameters corresponding to the scanning range based on the scanning range.

[0071] Exemplarily, the scanning range can be characterized by a scanning diameter. The user's input operation can be to input the scanning diameter, and the computer device will use the scanning diameter input by the user as the scanning range of the bombardment surface. The computer device can also automatically determine the scanning range of the bombardment surface. For example, multiple scanning ranges are pre-stored in the computer device. After receiving a scanning instruction, the computer device can sequentially determine the pre-stored multiple scanning ranges as the scanning ranges of the bombardment surface in a preset order, and automatically switch to the next scanning range for ultrasonic scanning after completing the ultrasonic scanning of the previous scanning range.

[0072] S230. Perform ultrasonic scanning on the scanning range according to the ultrasonic probe parameters.

[0073] Optionally, after determining the scanning range of the bombardment surface and the ultrasonic probe parameters corresponding to the scanning range, the computer device can control the ultrasonic probe to work according to the determined ultrasonic probe parameters, so as to control the ultrasonic probe to move to the upper region directly above the corresponding scanning range on the bombardment surface, and control the ultrasonic probe to emit ultrasonic signals to perform ultrasonic scanning on the corresponding scanning range.

[0074] Exemplarily, the ultrasonic probe parameters include the probe distance and the ultrasonic intensity. After the computer device obtains the ultrasonic probe parameters corresponding to the scanning range, it can respond to the user's movement instruction, control the ultrasonic probe to move to the upper region directly above the corresponding scanning range of the bombardment surface, and adjust the distance to reach the probe distance in the ultrasonic probe parameters, so as to emit ultrasonic signals with the ultrasonic intensity in the ultrasonic probe parameters to the corresponding scanning range of the bombardment surface.

[0075] S240. In the case where the scanning range includes a first scanning range corresponding to a planar region and a second scanning range corresponding to a planar region and an inclined surface region, determine the welding conditions of the planar region and the inclined surface region according to the echo signals of the first scanning range and the second scanning range respectively.

[0076] Among them, the echo signal is the ultrasonic signal reflected back at the medium junction during the ultrasonic scanning process. The ultrasonic signal propagates in a medium (such as water), and when it reaches the medium junction such as the bombardment surface of the anode target to be measured or the welding layer in the anode target to be measured, part of the ultrasonic signal will be reflected back, that is, an echo signal is formed. Different scanning ranges correspond to different echo signals. The welding condition is the welding condition between the metal matrix of the anode target to be measured and the base.

[0077] It should be noted that the ultrasonic scanning is a continuous surface scanning. On the bombardment surface of the anode target disk to be measured, the planar region is located inside the inclined surface region. Therefore, ultrasonic scanning can be performed based on the first scanning range of the corresponding planar region to determine the welding condition of the planar region; the inclined surface region is located outside the planar region, and scanning the complete inclined surface region will also synchronously scan the planar region. Therefore, ultrasonic scanning needs to be performed based on the second scanning range of the corresponding planar region and inclined surface region to determine the welding condition of the inclined surface region.

[0078] Optionally, after performing ultrasonic scanning on the anode target disk to be measured, when the scanning range includes the first scanning range of the corresponding planar region and the second scanning range of the corresponding planar region and inclined surface region, the computer device can determine the welding condition of the anode target disk to be measured in the planar region based on the echo signal obtained by performing ultrasonic scanning on the first scanning range, and determine the welding condition of the anode target disk to be measured in the inclined surface region based on the echo signal obtained by performing ultrasonic scanning on the second scanning range.

[0079] S250. Determine the welding condition of the anode target disk to be measured according to the welding conditions of the planar region and the inclined surface region.

[0080] Among them, the welding condition of the anode target disk to be measured can be determined based on the pore defect distribution of the welding layer formed by the welding material between the metal matrix and the base. For example, the pore distribution can be characterized by the porosity / full-welding rate or a pore defect distribution chart.

[0081] Optionally, after the computer device obtains the welding conditions of the planar region and the inclined surface region on the bombardment surface of the anode target disk to be measured, it can comprehensively determine the welding condition of the anode target disk to be measured based on the welding conditions of the planar region and the inclined surface region. For example, the computer device can determine and visually present the pore defect distribution chart of the corresponding complete welding layer based on the pore defect distribution charts of the planar region and the inclined surface region, and use the pore defect distribution chart of the corresponding complete welding layer as the welding condition of the anode target disk to be measured. It can also further analyze and determine the porosity / full-welding rate of the welding layer based on the pore defect distribution chart of the corresponding complete welding layer as the welding condition of the anode target disk to be measured.

[0082] In the embodiments of the present application, the bombardment surface including the planar region and the inclined surface region on the anode target disk to be measured is placed upward in the ultrasonic detection pool, the scanning range of the bombardment surface is determined, and the ultrasonic probe parameters are determined according to the scanning range. The scanning range is scanned according to the ultrasonic probe parameters. When the scanning range includes the first scanning range corresponding to the planar region and the second scanning range corresponding to the planar region and the inclined surface region, the welding conditions of the planar region and the inclined surface region are determined respectively according to the echo signals of the first scanning range and the second scanning range, and the welding condition of the anode target disk to be measured is determined according to the welding conditions of the planar region and the inclined surface region. In the above method, not only the nondestructive detection of the anode target disk to be measured is realized, but also the echo signals obtained by ultrasonic scanning can be used to reflect the internal structure of the anode target disk to be measured, so as to accurately reflect the welding condition between the metal matrix and the base in the anode target disk to be measured. Therefore, the reliability of the obtained welding condition is improved, and the reliability of the detection result is correspondingly improved.

[0083] The welding condition can be determined based on the pore defect distribution in the welding layer, and the pore defect distribution in the welding layer can be determined based on the defect echo signals reflected from the welding layer in the echo signals. Therefore, in one embodiment, as Figure 4 shown, in the above S240, determining the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range and the second scanning range includes:

[0084] S410. Determine the first defect echo signal according to the echo signal of the first scanning range, and determine the welding condition of the planar region according to the first defect echo signal.

[0085] Among them, the defect echo signal is the echo signal reflected by the ultrasonic signal emitted by the ultrasonic probe propagating to the welding layer of the anode target disk to be measured and affected by the pore defects in the welding layer, and can be used to reflect the pore defect distribution in the welding layer. The first defect echo signal is the echo signal reflected by emitting the ultrasonic signal for the first scanning range.

[0086] Optionally, the computer device can monitor the echo signal of the first scanning range while performing ultrasonic scanning on the first scanning range, and grab the first defect echo signal based on the characteristic information of the monitored echo signal, so as to analyze and determine the pore defect distribution in the welding layer of the corresponding planar region according to the first defect echo signal, and thus obtain the welding condition of the planar region. Among them, the characteristic information of the echo signal can be amplitude or frequency.

[0087] Exemplarily, while monitoring the echo signals in the first scanning range, the computer device can analyze the characteristic information of the echo signals obtained from real-time monitoring to determine the occurrence time of the defect echo signal based on the characteristic information and start capturing, so as to obtain the first defect echo signal. The computer device can also pre-acquire the echo signals in the first scanning range monitored for a period of time and perform analysis of the characteristic information to determine the partial signals that meet the characteristic information corresponding to the defect echo signal in the acquired echo signals as the first defect echo signal.

[0088] S420. Determine the second defect echo signal according to the echo signals in the second scanning range, and determine the welding condition of the inclined surface area according to the second defect echo signal.

[0089] Wherein, the second defect echo signal is the echo signal reflected back by transmitting ultrasonic signals to the second scanning range.

[0090] Optionally, while performing ultrasonic scanning on the second scanning range, the computer device can monitor the echo signals in the second scanning range and capture the second defect echo signal based on the characteristic information of the monitored echo signals, so as to analyze and determine the pore defect distribution in the welding layer of the corresponding inclined surface area according to the second defect echo signal, thereby obtaining the welding condition of the inclined surface area.

[0091] In the embodiments of the present application, the first defect echo signal is determined according to the echo signals in the first scanning range, and the welding condition of the planar area is determined according to the first defect echo signal, and the second defect echo signal is determined according to the echo signals in the second scanning range, and the welding condition of the inclined surface area is determined according to the second defect echo signal. In the above method, the defect echo signal can accurately reflect the pore defect distribution in the welding layer, and determining the welding condition based on the defect echo signal can greatly improve the reliability and accuracy of the detection result.

[0092] Next, taking the first defect echo signal as an example, the capturing process of the first defect echo signal will be introduced in detail. The capturing process of the second defect echo signal is similar and will not be elaborated.

[0093] Generally, the ultrasonic probe first receives the echo signal reflected by the bombardment surface of the anode target to be measured, that is, the surface echo signal, and then receives the defect echo signal reflected by the welding layer, and the overall intensity of the surface echo signal is relatively large. Based on this, in one embodiment, as Figure 5 shown, determining the first defect echo signal according to the echo signals in the first scanning range in S410 above includes:

[0094] S510. Determine the start time and end time of the first defect echo signal according to the intensity of the echo signals in the first scanning range.

[0095] Optionally, using an ultrasonic probe to first receive the surface echo signal and then receive the defect echo signal, and based on the prior knowledge that the overall intensity of the surface echo signal is relatively large, the computer device can, while monitoring the echo signals in the first scanning range, obtain the intensity of the echo signals at each moment and determine whether the surface echo signal is received according to the intensity. In the case where it is determined that the surface echo signal is received, further estimate the start time and end time of the first defect echo signal.

[0096] S520. Grab the first defect echo signal from the echo signals in the first scanning range according to the start time and end time.

[0097] Optionally, after obtaining the start time and end time of the first defect echo signal, the computer device can, while monitoring the echo signals in the first scanning range, perform signal grabbing when the current time reaches the start time of the first defect echo signal until the current time reaches the end time of the first defect echo signal, so as to use the signal grabbed from the start time to the end time as the first defect echo signal.

[0098] In the embodiments of the present application, the start time and end time of the first defect echo signal are determined according to the intensity of the echo signals in the first scanning range, and then the first defect echo signal is grabbed from the echo signals in the first scanning range according to the start time and end time. In the above method, prior knowledge related to the signal intensity is used to locate the start time and end time of the first defect echo signal, improving the positioning accuracy of the first defect echo signal, and thus improving the accuracy and reliability of the detection result.

[0099] If the models of the anodic target disks to be measured are different and the substrate thicknesses of the corresponding metal substrates are different, it will affect the start time and end time of the defect echo signals. Based on this, in one embodiment, as Figure 6 shown, the above S510. Determine the start time and end time of the defect echo signal according to the intensity of the echo signals in the first scanning range, includes:

[0100] S610. Determine the maximum peak time of the surface echo signal according to the intensity of the echo signals in the first scanning range.

[0101] Among them, the echo signals include surface echo signals and defect echo signals. The maximum peak time of the surface echo signal is the occurrence time of the maximum peak in the surface echo signal.

[0102] Optionally, the computer device monitors the intensity of the echo signals in the first scanning range at each moment, and compares the intensity of the echo signals at each moment with a preset intensity threshold, so as to determine the maximum intensity of the surface echo signal as the signal intensity that is greater than the preset intensity threshold for the first time. This maximum intensity corresponds to the maximum peak of the surface echo signal. Then, the occurrence moment of this maximum peak is obtained as the maximum peak moment of the surface echo signal.

[0103] S620. Determine the start moment and end moment of the first defect echo signal according to the substrate thickness of the anodic target disk to be measured and the maximum peak moment of the surface echo signal.

[0104] Optionally, before performing ultrasonic scanning, the computer device can read the user's selection operation of the model of the anodic target disk to be measured to determine the substrate thickness corresponding to this model. The computer device can also directly receive the substrate thickness of the anodic target disk input by the user. After obtaining the maximum peak moment of the surface echo signal, the computer device can estimate the start moment of the first defect echo signal based on this maximum peak moment of the surface echo signal, and determine the duration of the first defect echo signal according to the substrate thickness, so as to obtain the end moment of the first defect echo signal after delaying the start moment of the first defect echo signal by the duration. For example, if the computer device estimates the start moment Ts of the first defect echo signal based on the maximum peak moment T1 of the surface echo signal, and the substrate thickness of the anodic target disk to be measured corresponds to a duration m, the end moment Te of the first defect echo signal can be obtained as Te = Ts + m.

[0105] In the embodiments of the present application, the maximum peak moment of the surface echo signal is determined according to the intensity of the echo signals in the first scanning range, and then the start moment and end moment of the first defect echo signal are determined according to the substrate thickness of the anodic target disk and the maximum peak moment of the surface echo signal. In the above method, the influence of the substrate thickness of the anodic target disk to be measured on the start moment and end moment of the defect echo signal is taken into account, realizing the accurate positioning of the defect echo signals reflected by different models of anodic target disks to be measured, and improving the detection accuracy for different models of anodic target disks to be measured.

[0106] To improve the convenience of positioning the start moment and end moment of the defect echo signal, in one embodiment, as Figure 7 shown, the above S620. Determine the start moment and end moment of the first defect echo signal according to the substrate thickness of the anodic target disk and the maximum peak moment of the surface echo signal, includes:

[0107] S710. Determine a first duration and a second duration according to the substrate thickness; wherein, the first duration is the interval duration between the maximum peak moment of the surface echo signal and the start moment, and the second duration is the duration of the first defect echo signal.

[0108] It should be noted that under different scanning ranges, different time groups, namely the first duration and the second duration, correspond to the same substrate thickness. For example, under the first scanning range, the substrate thickness m1 corresponds to a time group composed of the first duration T1 and the second duration T2; under the second scanning range, the substrate thickness m1 corresponds to a time group composed of the first duration T1' and the second duration T2'.

[0109] Optionally, the preset correspondence between the scanning range, the substrate thickness, and the duration includes the correspondence between multiple models of the anode target disk to be measured under the first scanning range and the second scanning range and the first duration and the second duration. After determining the substrate thickness of the anode target disk to be measured, the computer device can obtain the first duration and the second duration corresponding to the substrate thickness under the first scanning range based on the preset correspondence between the scanning range, the substrate thickness, and the duration. The substrate thicknesses of different models of the anode target disk to be measured are different.

[0110] Optionally, to obtain the correspondence between multiple models of the anode target disk to be measured under the first scanning range and the first duration and the second duration, before detecting the anode target disk to be measured, the computer device can control the ultrasonic probe to perform a pre-scan on the first scanning range directly above the bombardment surface of the anode target disk to be measured in the same scanning environment (the same probe distance and ultrasonic intensity as during detection), so as to obtain an ultrasonic signal diagram representing the complete echo signal of the anode target disk of this model, and based on this ultrasonic signal diagram, determine the first duration and the second duration corresponding to the anode target disk to be measured of the corresponding model.

[0111] Exemplarily, the computer device can determine the maximum peak moment of the surface echo signal, as well as the start moment and the end moment of the first defect echo signal based on the ultrasonic signal diagram, and then calculate the interval duration between the maximum peak moment of the surface echo signal and the start moment as the first duration, and calculate the interval duration between the start moment and the end moment as the second duration, so as to obtain the first duration and the second duration corresponding to the anode target disk to be measured of this model. The computer device can also perform multiple pre-scans on the first scanning range and determine the first duration and the second duration corresponding to the anode target disk to be measured of the corresponding model based on the first duration and the second duration obtained from the multiple pre-scans. For example, take the average value of the first durations obtained from the multiple pre-scans as the first duration corresponding to the anode target disk to be measured of this model; take the average value of the second durations obtained from the multiple pre-scans as the second duration corresponding to the anode target disk to be measured of this model.

[0112] Optionally, similarly, the corresponding relationships between various types of anodic target discs to be measured under the second scanning range and the first duration and the second duration can also be obtained. The difference is that the computer device first moves the ultrasonic probe to the position of the lowest point of the corresponding inclined plane area for an ultrasonic scan to obtain the start time and the end time of the corresponding defect echo signal, and then moves the ultrasonic probe to the position of the highest point of the corresponding inclined plane area for an ultrasonic scan to obtain the start time and the end time of the corresponding defect echo signal, and takes the union of the time periods obtained from the two ultrasonic scans to calculate the start time and the end time of the union to determine the first duration and the second duration corresponding to the anodic target disc to be measured of this type.

[0113] Optionally, the computer device can also determine the foregoing preset intensity threshold for determining the maximum peak time based on the ultrasonic signal map obtained by pre-scanning. For example, the preset intensity threshold is determined according to the maximum peak in the surface echo signal in the ultrasonic signal map obtained by pre-scanning. Exemplarily, the minimum value among the maximum peaks in the surface echo signals of each ultrasonic signal map is taken as the preset intensity threshold.

[0114] S720. Determine the start time according to the maximum peak time of the surface echo signal and the first duration, and determine the end time according to the start time and the second duration.

[0115] Optionally, after the computer device determines the maximum peak time, it can delay the maximum peak time by the first duration to obtain the start time of the first defect echo signal, and delay the start time of the first defect echo signal by the second duration to obtain the end time of the first defect echo signal.

[0116] In the embodiments of the present application, the first duration and the second duration are determined according to the substrate thickness, so as to determine the start time according to the maximum peak time of the surface echo signal and the first duration, and determine the end time according to the start time and the second duration. Among them, the first duration is the interval duration between the maximum peak time of the surface echo signal and the start time, and the second duration is the duration of the first defect echo signal. In the above method, the substrate thickness of the anodic target disc to be measured is associated with the first duration and the second duration for positioning the start time and the end time of the first defect echo signal, and the corresponding first duration and second duration can be selected for different types of anodic target discs to be measured, which improves the convenience of positioning the start time and the end time of the first defect echo signal, is applicable to batch detection, and there is no need to switch parameters when continuously batch detecting anodic target discs of the same type, greatly improving the batch detection efficiency.

[0117] After the ultrasonic probe receives the surface echo signal, it takes a period of time to receive the defect echo signal. Therefore, in one of the embodiments, such as Figure 8As shown, the above S620 determines the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal, including:

[0118] S810. Determine a second duration and a third duration according to the substrate thickness; the second duration is the duration of the first defect echo signal; the third duration is the interval duration between the maximum peak time of the surface echo signal and the maximum peak time of the first defect echo signal.

[0119] Optionally, the preset scanning range, substrate thickness, and duration correspondence includes the correspondence between multiple models of anode target disks to be measured under the first scanning range and the second scanning range and the second duration and the third duration. After the computer device determines the substrate thickness of the anode target disk to be measured, it can obtain the second duration and the third duration corresponding to the substrate thickness of the anode target disk to be measured under the first scanning range based on the preset scanning range, substrate thickness, and duration correspondence.

[0120] The correspondence between multiple models of anode target disks to be measured under the first scanning range and the second scanning range and the second duration and the third duration is the same as the correspondence between multiple models of anode target disks to be measured under the first scanning range and the second scanning range and the first duration and the second duration, that is, it can be obtained based on pre-scanning, and the specific process is similar and will not be elaborated here.

[0121] S820. Determine the maximum peak time of the first defect echo signal according to the maximum peak time of the surface echo signal and the third duration.

[0122] Optionally, after the computer device obtains the maximum peak time of the surface echo signal and the third duration, it can use the correlation relationship among the third duration, the maximum peak time of the surface echo signal, and the maximum peak time of the first defect echo signal to determine the maximum peak time of the first defect echo signal. For example, after delaying the maximum peak time of the surface echo signal by the third duration, the maximum peak time of the first defect echo signal is obtained.

[0123] S830. Determine the start time and end time of the first defect echo signal according to the maximum peak time of the first defect echo signal and the second duration.

[0124] Optionally, after the computer device obtains the maximum peak time of the first defect echo signal, it can infer the start time and end time of the first defect echo signal based on the second duration, that is, the duration of the first defect echo signal determined according to the substrate thickness of the anode target disk to be measured. For example, advancing the maximum peak time of the first defect echo signal by 1 / 2 of the second duration to obtain the start time of the first defect echo signal; delaying the maximum peak time of the first defect echo signal by 1 / 2 of the second duration to obtain the end time of the first defect echo signal.

[0125] In the embodiments of the present application, the second duration and the third duration are determined according to the substrate thickness; the second duration is the duration of the first defect echo signal; the third duration is the interval duration between the maximum peak time of the surface echo signal and the maximum peak time of the first defect echo signal. The maximum peak time of the first defect echo signal is determined according to the maximum peak time of the surface echo signal and the third duration, and then the start time and the end time of the first defect echo signal are determined according to the maximum peak time of the first defect echo signal and the second duration. In the above method, the substrate thickness of the anode target disc is associated with the second duration and the third duration for positioning the start time and the end time of the first defect echo signal. Just select the corresponding second duration and third duration for different types of anode target discs to be tested, which improves the convenience of positioning the start time and the end time of the first defect echo signal, is suitable for batch detection, and there is no need to switch parameters when continuously batch detecting anode target discs of the same type, greatly improving the batch detection efficiency.

[0126] The inclined plane area surrounds the plane area to form the bombardment surface of the anode target disc to be tested. Therefore, the second defect echo signal reflects the global pore defect situation of the bombardment surface corresponding to the plane area and the inclined plane area. Based on this, in one embodiment, as Figure 9 shown, determining the welding condition of the inclined plane area according to the second defect echo signal in S420 above includes:

[0127] S910. Determine the global defect distribution map corresponding to the plane area and the inclined plane area according to the second defect echo signal.

[0128] It should be noted that ultrasonic scanning is a non-destructive detection process for detecting internal defects of a sample to be tested without damaging the sample. Its principle is to utilize the characteristics that ultrasonic waves will reflect, refract and transmit when contacting the surface of an object. Among them, when ultrasonic waves pass through two different media, the greater the acoustic impedance difference between the media, the stronger the reflection signal. Moreover, in the case of pore defects such as cavities in the medium, the intensity of the reflected wave signal will also increase.

[0129] Optionally, after obtaining the second defect echo signal, the computer device can determine the global pore defect distribution of the welding layer corresponding to the plane area and the inclined plane area, that is, the entire bombardment surface, based on the strength distribution of the second defect echo signal, so as to determine the pore defect area in the entire welding layer and generate the global defect distribution map corresponding to the plane area and the inclined plane area.

[0130] Among them, the defect echo signal includes signals reflected from each position point in the welding layer at different times. When the signal intensity is greater than or equal to the intensity threshold, it indicates that there is a pore defect at the corresponding position point, and the greater the signal intensity, the greater the thickness of the pore defect, and the smaller the signal intensity, the smaller the thickness of the pore defect. When the signal intensity is less than the intensity threshold, it indicates that there is no pore defect at the corresponding position point.

[0131] Optionally, the computer device can obtain the defect echo signal at a certain moment in the second defect echo signal, and determine the position point where the corresponding signal intensity is greater than or equal to the intensity threshold in the welding layer as the position point where the pore defect is located, and the position point where the corresponding signal intensity is less than the intensity threshold as the position point where the welding material is located, so as to form a global defect distribution map of the welding layer.

[0132] S920. Remove a part of the corresponding planar region in the global defect distribution map to obtain a bevel defect distribution map of the bevel region.

[0133] Optionally, after the computer device generates a global defect distribution map based on the second defect echo signal, it can remove a part of the corresponding planar region in the global defect distribution map based on the position and size of the planar region on the bombardment surface, and use the remaining part as the bevel defect distribution map of the bevel region.

[0134] The planar defect distribution map can be directly determined based on the intensity of the first defect echo signal. For the specific process, refer to S910 and will not be elaborated here. Exemplarily, Figure 10 shows the planar defect distribution map formed based on the first defect echo signal, and the annular region corresponds to Figure 3 the planar region of the bombardment surface in Figure 11 shows the bevel defect distribution map formed based on the second defect echo signal, and the annular region corresponds to Figure 3 the bevel region in . In the planar defect distribution map and the bevel defect distribution map, the lighter-colored regions in the annular region are the pore defect regions.

[0135] S930. Determine the welding condition of the bevel region according to the bevel defect distribution map.

[0136] Optionally, after the computer device obtains the bevel defect distribution map of the bevel region, it can directly use the bevel defect distribution map as the welding condition of the bevel region and visually present it through the display unit. The computer device can also determine the porosity / full-welding rate of the bevel region based on the bevel defect distribution map to quantitatively characterize the welding condition of the bevel region.

[0137] The porosity / full-welding rate can be used to characterize the welding strength between the metal matrix and the base in the to-be-tested anode target. The porosity is the proportion of pore defects, and the sum of the porosity and the full-welding rate is 1. Exemplarily, the porosity can be the volume proportion of pores or the area proportion of pores.

[0138] Exemplarily, the welding condition of the inclined surface area includes the full welding rate of the inclined surface area. After the computer device obtains the inclined surface defect distribution map, it can determine the pore defects in the inclined surface defect distribution map based on the image processing algorithm to obtain the area occupied by the pore defects, calculate the ratio of the area occupied by the pore defects to the area of the inclined surface area to obtain the porosity of the inclined surface area, and then obtain the difference between 1 and the porosity to obtain the full welding rate of the inclined surface area. It is also possible to first obtain the area difference between the area occupied by the pore defects and the area of the inclined surface area, and then obtain the ratio of the area difference to the area of the inclined surface area, thereby obtaining the full welding rate of the inclined surface area.

[0139] Similarly, for the welding condition of the planar area, after the computer device obtains the planar defect distribution map of the planar area, it can directly use the planar defect distribution map as the welding condition of the planar area and visually present it through the display unit. The computer device can also determine the porosity / full welding rate of the planar area based on the planar defect distribution map to quantitatively characterize the welding condition of the planar area.

[0140] It should be noted that the detection distance and ultrasonic intensity used for ultrasonic scanning of the first scanning range and the second scanning range can be the same or different, and can be set according to the actual situation. In practical applications, the probe distance and ultrasonic intensity used for ultrasonic scanning have a certain impact on the full welding rate of the welding layer. As can be seen from Table 1 below, when the probe distance is 10 μm and the ultrasonic intensity is 24 dB, the planar full welding rate for the planar area is the smallest; when the probe distance is 10 μm and the ultrasonic intensity is 30 dB, the inclined surface full welding rate for the inclined surface area is the smallest. To achieve strict detection, the preset detection distance and preset ultrasonic intensity for the first scanning range can be 10 μm and 24 dB respectively, and the preset detection distance and preset ultrasonic intensity for the second scanning range can be 10 μm and 30 dB respectively.

[0141] Table 1 Influence of probe distance and ultrasonic intensity on full welding rate

[0142]

[0143] In the embodiments of the present application, the global defect distribution maps corresponding to the planar area and the inclined surface area are determined according to the second defect echo signal, and the part corresponding to the planar area in the global defect distribution map is removed to obtain the inclined surface defect distribution map of the inclined surface area, so as to determine the welding condition of the inclined surface area according to the inclined surface defect distribution map. In the above method, the inclined surface defect distribution map for the inclined surface area is separated from the global defect map determined based on the second defect echo signal, realizing the independent determination of the welding condition of the inclined surface area, providing a data basis for subsequent determination of the welding condition of the anode target disk to be measured, and being beneficial to improving the accuracy and precision of the obtained welding condition of the anode target disk to be measured.

[0144] In the case where the welding condition of the planar region includes the planar defect distribution map of the planar region and the welding condition of the inclined surface region includes the planar defect distribution map of the planar region, in one embodiment, as Figure 12 shown, the above S250 determines the welding condition of the anode target disk to be measured according to the welding conditions of the planar region and the inclined surface region, including:

[0145] S1210. Combine the planar defect distribution map and the inclined surface defect distribution map to obtain a combined defect distribution map.

[0146] Optionally, the computer device can combine the planar defect distribution map and the inclined surface defect distribution map to obtain a complete pore defect distribution map of the corresponding welding layer as the combined defect distribution map. The computer device can also display the combined defect distribution map through a display unit to facilitate the user to visually observe the distribution of pore defects on the welding layer. Exemplarily, Figure 13 shows the combined defect distribution map obtained by combining the Figure 10 -based planar defect distribution map and the Figure 11 -based inclined surface defect distribution map. The positional relationship between the inclined surface region and the planar region on the bombardment surface of the anode target disk to be measured is that the inclined surface region surrounds the planar region. The combined defect distribution map is essentially the defect distribution map obtained by placing the Figure 10 -shaped ring region in the Figure 11 -shaped ring region.

[0147] S1220. Determine the welding condition of the anode target disk to be measured according to the combined defect distribution map.

[0148] Optionally, after obtaining the combined defect distribution map, the computer device can directly use the combined defect distribution map as the welding condition of the inclined surface region, and can also determine the porosity / full welding rate based on the combined defect distribution map to quantitatively characterize the welding condition of the anode target disk to be measured.

[0149] Exemplarily, the computer device can determine the pore defects in the combined defect distribution map based on an image processing algorithm to obtain the area occupied by the pore defects, and determine the porosity / full welding rate of the anode target disk to be measured according to the area occupied by the pore defects and the projected area of the bombardment surface. Among them, the projected area of the bombardment surface is the area of the corresponding welding layer.

[0150] In the embodiments of the present application, the planar defect distribution map and the inclined surface defect distribution map are combined to obtain a combined defect distribution map, so as to determine the welding condition of the anode target disk to be measured according to the combined defect distribution map.. In the above method, the welding condition of the anode target disk to be measured is comprehensively determined based on the planar defect distribution map and the inclined surface defect distribution map obtained by separate scanning, which improves the detection accuracy of the anode target disk to be measured and correspondingly improves the reliability and accuracy of the obtained detection results.

[0151] For the convenience of those skilled in the art, the following provides a detailed introduction to the detection method of the anode target disc provided by this application. As Figure 14 shown, the method may include:

[0152] S1401. Place the bombardment surface of the anode target disc to be measured facing upward in an ultrasonic detection cell. The bombardment surface of the anode target disc to be measured includes a planar region and an inclined surface region;

[0153] S1402. Determine the scanning range of the bombardment surface, and determine the ultrasonic probe parameters according to the scanning range;

[0154] S1403. Perform ultrasonic scanning on the scanning range according to the ultrasonic probe parameters;

[0155] S1404. When the scanning range includes a first scanning range corresponding to the planar region and a second scanning range corresponding to the planar region and the inclined surface region; determine a first defect echo signal according to the echo signal of the first scanning range, and determine the welding condition of the planar region according to the first defect echo signal; determine a second defect echo signal according to the echo signal of the second scanning range, and determine the welding condition of the inclined surface region according to the second defect echo signal;

[0156] S1405. The welding condition of the planar region includes a planar defect distribution map of the planar region, and the welding condition of the inclined surface region includes a planar defect distribution map of the planar region; merge the planar defect distribution map and the inclined surface defect distribution map to obtain a merged defect distribution map;

[0157] S1406. Determine the welding condition of the anode target disc to be measured according to the merged defect distribution map.

[0158] It should be noted that for the descriptions in S1401 - S1406 above, reference may be made to the relevant descriptions in the above embodiments, and their effects are similar. This embodiment will not be elaborated here.

[0159] It should be understood that although each step in the flowcharts involved in the above - mentioned embodiments is shown in sequence according to the indication of the arrow, these steps are not necessarily executed in the order indicated by the arrow. Unless there is a clear description in this article, the execution of these steps has no strict order limit, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above - mentioned embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment, but can be executed at different moments. The execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0160] Based on the same inventive concept, an embodiment of the present application further provides a detection device for an anode target disk for implementing the detection method of the anode target disk involved above. The implementation solutions provided by this device to solve problems are similar to those recorded in the above method. Therefore, the specific limitations in one or more embodiments of the detection device for the anode target disk provided below can refer to the limitations on the detection method of the anode target disk in the above text, and will not be repeated here.

[0161] In one embodiment, as Figure 15 shown, a detection device for an anode target disk is provided, including: a detection control module 1501, a parameter determination module 1502, a scanning execution module 1503, a signal analysis module 1504, and a welding determination module 1505, where:

[0162] The detection control module 1501 is used to place the bombardment surface of the anode target disk to be detected face up in an ultrasonic detection pool, and the bombardment surface of the anode target disk to be detected includes a planar region and an inclined surface region;

[0163] The parameter determination module 1502 is used to determine the scanning range of the bombardment surface and determine the ultrasonic probe parameters according to the scanning range;

[0164] The scanning execution module 1503 is used to perform ultrasonic scanning on the scanning range according to the ultrasonic probe parameters;

[0165] The signal analysis module 1504 is used to determine the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range corresponding to the planar region and the second scanning range corresponding to the planar region and the inclined surface region when the scanning range includes the first scanning range corresponding to the planar region and the second scanning range corresponding to the planar region and the inclined surface region;

[0166] The welding determination module 1505 is used to determine the welding conditions of the anode target disk to be detected according to the welding conditions of the planar region and the inclined surface region.

[0167] Each module in the above detection device for the anode target disk can be implemented in whole or in part by software, hardware, and their combination to implement any one of the above detection methods for the anode target disk. The above modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each of the above modules.

[0168] In one embodiment, a computer device is provided. This computer device can be a terminal, and its internal structure diagram can be as Figure 16As shown in the figure. The computer device includes a processor, a memory, a communication interface, a display unit, and an input device connected via a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner, and the wireless manner can be implemented through WIFI, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it realizes a method for detecting an anode target disk. The display unit of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads provided on the housing of the computer device, or an external keyboard, touchpad, or mouse, etc.

[0169] Those skilled in the art can understand that Figure 16 the structure shown in the figure is only a block diagram of some structures related to the solution of this application, and does not constitute a limitation on the computer device to which the solution of this application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0170] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, it realizes the steps of any one of the above-mentioned methods for detecting an anode target disk.

[0171] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by the processor, it realizes the steps of any one of the above-mentioned methods for detecting an anode target disk.

[0172] In one embodiment, a computer program product is provided, including a computer program. When the computer program is executed by the processor, it realizes the steps of any one of the above-mentioned methods for detecting an anode target disk.

[0173] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in the present application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processors involved in the embodiments provided in the present application can be general-purpose processors, central processors, graphics processors, digital signal processors, programmable logic devices, data processing logics based on quantum computing, etc., without limitation.

[0174] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0175] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A detection method for an anode target disc, characterized in that, The method includes: Placing the bombarding surface of the anode target disk to be measured face up in an ultrasonic detection cell, where the bombarding surface of the anode target disk to be measured includes a planar region and an inclined surface region; Determining the scanning range of the bombarding surface and determining ultrasonic probe parameters according to the scanning range; Performing ultrasonic scanning on the scanning range according to the ultrasonic probe parameters; When the scanning range includes a first scanning range corresponding to the planar region and a second scanning range corresponding to the planar region and the inclined surface region, determining the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range and the second scanning range; Determining the welding condition of the anode target disk to be measured according to the welding conditions of the planar region and the inclined surface region.

2. The method according to claim 1, wherein The determining the welding conditions of the planar region and the inclined surface region respectively according to the echo signals of the first scanning range and the second scanning range includes: Determining a first defect echo signal according to the echo signal of the first scanning range and determining the welding condition of the planar region according to the first defect echo signal; Determining a second defect echo signal according to the echo signal of the second scanning range and determining the welding condition of the inclined surface region according to the second defect echo signal.

3. The method according to claim 2, characterized in that, The determining the first defect echo signal according to the echo signal of the first scanning range includes: Determining the start time and end time of the first defect echo signal according to the intensity of the echo signal of the first scanning range; Grabbing the first defect echo signal from the echo signal of the first scanning range according to the start time and the end time.

4. The method according to claim 3, characterized in that, The echo signal of the first scanning range includes a surface echo signal reflected by the bombarding surface and the first defect echo signal; the determining the start time and end time of the first defect echo signal according to the intensity of the echo signal of the first scanning range includes: Determining the maximum peak time of the surface echo signal according to the intensity of the echo signal of the first scanning range; Determining the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal.

5. The method according to claim 4, wherein The determining the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal includes: Determining a first time duration and a second time duration according to the substrate thickness; where the first time duration is the interval time between the maximum peak time of the surface echo signal and the start time, and the second time duration is the duration of the first defect echo signal; Determining the start time according to the maximum peak time of the surface echo signal and the first time duration, and determining the end time according to the start time and the second time duration.

6. The method according to claim 4, characterized in that The determining the start time and end time of the first defect echo signal according to the substrate thickness of the anode target disk to be measured and the maximum peak time of the surface echo signal includes: Determine a second time duration and a third time duration according to the substrate thickness; the second time duration is the duration of the first defect echo signal; the third time duration is the interval duration between the maximum peak time of the surface echo signal and the maximum peak time of the first defect echo signal; Determine the maximum peak time of the first defect echo signal according to the maximum peak time of the surface echo signal and the third time duration; Determine the start time and the end time of the first defect echo signal according to the maximum peak time of the first defect echo signal and the second time duration.

7. The method according to any one of claims 2-6, characterized in that, The determining the welding condition of the inclined surface area according to the second defect echo signal includes: Determine a global defect distribution map corresponding to the planar area and the inclined surface area according to the second defect echo signal; Remove the part corresponding to the planar area in the global defect distribution map to obtain an inclined surface defect distribution map of the inclined surface area; Determine the welding condition of the inclined surface area according to the inclined surface defect distribution map.

8. The method according to any one of claims 1-6, characterized in that The welding condition of the planar area includes a planar defect distribution map of the planar area, and the welding condition of the inclined surface area includes a planar defect distribution map of the planar area; the determining the welding condition of the to-be-detected anode target disc according to the welding conditions of the planar area and the inclined surface area includes: Merge the planar defect distribution map and the inclined surface defect distribution map to obtain a merged defect distribution map; Determine the welding condition of the to-be-detected anode target disc according to the merged defect distribution map.

9. A detection device for an anode target disc, characterized in that, The device includes: A detection control module, configured to place the bombardment surface of the to-be-detected anode target disc facing upward in an ultrasonic detection pool, where the bombardment surface of the to-be-detected anode target disc includes a planar area and an inclined surface area; A parameter determination module, configured to determine the scanning range of the bombardment surface and determine ultrasonic probe parameters according to the scanning range; A scanning execution module, configured to perform ultrasonic scanning on the scanning range according to the ultrasonic probe parameters; A signal analysis module, configured to, when the scanning range includes a first scanning range corresponding to the planar area and a second scanning range corresponding to the planar area and the inclined surface area, determine the welding conditions of the planar area and the inclined surface area respectively according to the echo signals of the first scanning range and the second scanning range; A welding determination module, configured to determine the welding condition of the to-be-detected anode target disc according to the welding conditions of the planar area and the inclined surface area.

10. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

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