Air conditioner and substrate processing apparatus including same

Abstract

Disclosed is an air conditioning apparatus for providing a downward airflow to a processing space from an upper portion of a processing chamber having the processing space in which a first processing unit and a second processing unit are arranged side by side, the air conditioning apparatus including: a housing having an inlet at one side through which air is introduced, an opening is formed in the lower surface of the shell, and the air introduced through the inlet flows downwards through the opening; and an internal duct for guiding air from the inlet to the center of the housing such that the air introduced through the inlet is uniformly supplied into the internal space of the housing.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Background Art

[0002] Generally, manufacturing semiconductor devices requires performing various processes such as cleaning, deposition, lithography, etching, and ion implantation. The lithography process is performed to form a pattern, and the lithography process plays an important role in achieving high integration of semiconductor devices.

[0003] The lithography process is performed to form a photoresist pattern on a semiconductor substrate made of silicon. The lithography process includes: a coating and soft baking process for forming a photoresist film on the substrate; an exposure and development process for forming a photoresist pattern from the photoresist film; an edge bead removal (EBR) process and a wafer edge exposure (EEW) process for removing an edge region of the photoresist film or pattern; and a hard baking process for stabilizing and densifying the photoresist pattern.

[0004] In a substrate processing apparatus for performing the lithography process, a multi-unit arrangement is adopted, in which a plurality of processing units are arranged in a single chamber, and in the substrate processing apparatus with the multi-unit arrangement, an air conditioning device such as a filter unit (FU) is provided in an upper portion of the chamber, and substrate processing is performed in a state where air flows downward from the air conditioning device.

[0005] However, in the existing air supply structure of the filter unit, gas is supplied and passes through the filter in an eccentric manner, so the air flow deflects vertically. In this case, since there is a heating element in another processing chamber located above the filter unit, a temperature deviation occurs. This causes a deviation in the ambient temperature in the processing chamber located at the bottom of the filter unit. This results in a thickness deviation after substrate processing due to the ambient temperature deviation. Summary of the Invention

[0006] The present invention is dedicated to providing an air conditioning device capable of uniformly distributing gas supplied upward, downward, leftward, and rightward from one side, and a substrate processing apparatus including the air conditioning device.

[0007] The present invention is also dedicated to providing an air conditioning device capable of minimizing the influence of temperature in the peripheral area, and a substrate processing apparatus including the air conditioning device.

[0008] The present invention is also dedicated to providing an air conditioning device capable of providing a uniform temperature air flow to a processing chamber in which a substrate processing unit is arranged, and a substrate processing apparatus including the air conditioning device.

[0009] The object of the present invention is not limited thereto, and other objects not mentioned can be clearly understood by those of ordinary skill in the art from the following description.

[0010] Exemplary embodiments of the present invention provide an air conditioning device for providing a downward airflow from an upper portion of a processing chamber having a processing space to the processing space, in which a first processing unit and a second processing unit are arranged side by side. The air conditioning device includes: a housing having an inlet at one side through which air is introduced, and the housing having an opening on a lower surface for the air introduced through the inlet to flow downward; and an internal duct for guiding the air from the inlet to the center of the housing so that the air introduced through the inlet is uniformly supplied to an internal space of the housing.

[0011] In addition, the internal duct may include a central duct that divides an internal space of the housing into a first space and a second space and supplies air to the first space and the second space.

[0012] In addition, the central duct may include a first partition wall in contact with the first space and a second partition wall in contact with the second space, and the first partition wall and the second partition wall may be made of a perforated plate.

[0013] In addition, the first space may be located on top of the first processing unit, and the second space may be located on top of the second processing unit.

[0014] In addition, the first space and the second space may have spaces symmetric with respect to the central duct.

[0015] In addition, the air conditioning device may further include an upper airbag provided on a top surface of the housing.

[0016] In addition, the air conditioning device may further include lateral airbags provided on two side surfaces of the housing.

[0017] In addition, the air conditioning device may further include: a plate-shaped filter installed in the opening; and a perforated plate installed at a bottom end of the filter.

[0018] Another exemplary embodiment of the present invention provides a substrate processing apparatus, including: a chamber having a processing space; a first processing unit and a second processing unit arranged in a row in a first direction in the processing space of the chamber; and an air conditioning device installed in an upper portion of the chamber and providing a downward airflow to the processing space of the chamber.

[0019] In addition, the internal duct may include a central duct that divides an internal space of the housing into a first space and a second space and supplies air to the first space and the second space.

[0020] In addition, the central duct may include a first partition wall in contact with the first space and a second partition wall in contact with the second space, and the first partition wall and the second partition wall may be made of a perforated plate.

[0021] In addition, the first space may be located on top of the first processing unit, and the second space may be located on top of the second processing unit.

[0022] In addition, the first space and the second space may have spaces symmetric with respect to the central duct.

[0023] In addition, the substrate processing apparatus may further include an upper airbag disposed on the top surface of the housing.

[0024] In addition, the substrate processing apparatus may further include lateral airbags disposed on two side surfaces of the housing.

[0025] In addition, the substrate processing apparatus may further include: a plate-shaped filter installed in the opening; and a perforated plate installed at the bottom end of the filter.

[0026] In addition, the first processing unit and the second processing unit may apply a liquid to the substrate.

[0027] In addition, the chambers are stacked in plurality.

[0028] Another exemplary embodiment of the present invention provides a substrate processing apparatus, including: a chamber having a processing space; a first processing unit and a second processing unit, the first processing unit and the second processing unit being arranged in a row in the processing space of the chamber along a first direction and applying a liquid to a substrate; and an air conditioning device installed in an upper portion of the chamber and providing a downward flowing air current into the processing space of the chamber, wherein the air conditioning device includes: a housing having an inlet at one side through which air is introduced, and the housing having an opening at a lower surface for the air introduced through the inlet to flow downward; an internal duct for guiding air from the inlet to the center of the housing such that the air introduced through the inlet is uniformly supplied to an internal space of the housing; a plate-shaped filter installed in the opening; a perforated plate installed at the bottom end of the filter; an upper airbag disposed on the top surface of the housing; and lateral airbags disposed on two side surfaces of the housing, and the internal duct includes a central duct that divides the internal space of the housing into a first space located on top of the first processing unit and a second space located on top of the second processing unit and supplies air to the first space and the second space.

[0029] Furthermore, the central duct may include a first partition wall in contact with the first space and a second partition wall in contact with the second space. The first partition wall and the second partition wall may be made of a perforated plate, and the first space and the second space may have spaces symmetric with respect to the central duct.

[0030] According to an exemplary embodiment of the present invention, the air supplied through the inlet may diffuse from the center of the housing to the first space and the second space through an internal duct formed inside the housing, so as to provide a uniform air flow to the processing space.

[0031] According to an exemplary embodiment of the present invention, by disposing air bags on the top surface and two side surfaces of the housing, the temperature influence caused by the heating element in the periphery can be minimized, so as to provide air with uniform temperature to the processing space.

[0032] According to an exemplary embodiment of the present invention, air is supplied from the center of the housing to the first space and the second space and flows downward into the liquid processing chamber. In particular, the heat transferred to the top surface and the side surfaces of the housing is blocked by the air bags. Therefore, when air is supplied to the liquid processing chamber, temperature equalization can be expected.

[0033] The effects of the present invention are not limited to the foregoing effects, and those skilled in the art will clearly understand the effects not mentioned according to this specification and the drawings. Description of the Drawings

[0034] After reading the detailed description in conjunction with the drawings, various features and advantages of the non-limiting exemplary embodiments of this specification will become apparent. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings should not be regarded as drawn to scale. For clarity, various dimensions in the figures may be exaggerated.

[0035] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 is Figure 1 a front view of the substrate processing apparatus.

[0037] Figure 3 is Figure 1 a top view of a coating block in the substrate processing apparatus.

[0038] Figure 4 is Figure 1 a top view of a developing block in the substrate processing apparatus.

[0039] Figure 5 is schematically showing Figure 3 a top view of the transfer robot.

[0040] Figure 6 is a top view schematically showing Figure 3 or Figure 4 an example of a heat treatment chamber.

[0041] Figure 7 is Figure 6 a cross-sectional view of the heat treatment chamber.

[0042] Figure 8 is a cross-sectional view showing an exemplary embodiment of a liquid processing chamber.

[0043] Figure 9 is Figure 8 a top view of the liquid processing chamber.

[0044] Figure 10 is a perspective view showing an example of an air conditioning device installed in a stacked liquid processing chamber.

[0045] Figure 11 is Figure 10 a perspective view of the air conditioning device shown.

[0046] Figure 12 and Figure 13 are a top view and a side cross-sectional view of the air conditioning device.

[0047] Figure 14 is Figure 12 a perspective view of the internal pipe shown.

[0048] Figure 15 is a side cross-sectional view showing an example of an air conditioning device installed in a stacked liquid processing chamber. Detailed Description

[0049] Example embodiments will now be described more fully with reference to the accompanying drawings. The example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. Those skilled in the art will understand that the example embodiments may be embodied in many different forms and should not be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known techniques have not been described in detail.

[0050] The terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, plural forms may also be intended herein when the quantity is not specified. The terms "comprising," "including," "containing," and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Method steps, processes, and operations described herein should not be construed as necessarily requiring execution in the particular order discussed or illustrated, unless explicitly identified as an order of execution. It should also be understood that additional or alternative steps may be employed.

[0051] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it can be directly on, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, intervening elements or layers may not be present. Other words used to describe the relationship between elements should be interpreted in a like manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or section from another region, layer, or section. Unless the context clearly indicates otherwise, numerical terms such as "first," "second," and other numerical terms used herein do not denote an order or sequence. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0053] Spatial relative terms, such as "inner," "outer," "beneath," "below," "lower," "above," "upper," etc., may be used herein to describe a relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientation shown in the figures, the spatial relative terms may also encompass different orientations of the device in use or operation. For example, if the device in the figures is turned over, an element described as "beneath" or "below" another element or feature would then be oriented "above" the other element or feature. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein may be interpreted accordingly.

[0054] When the terms "same" or "identical" are used in the description of the exemplary embodiments, some imprecision should be understood. Thus, when an element or value is said to be the same as another element or value, it should be understood that the element or value is the same as the other element or value within manufacturing or operating tolerances (e.g., ±10%).

[0055] When the terms "about" or "substantially" are used with a numerical value, it should be understood that the relevant numerical value includes manufacturing or operating tolerances around the stated numerical value (e.g., ±10%). In addition, when the words "substantially" and "about" are used with a geometric shape, it should be understood that precision of the geometric shape is not required, but the degree of freedom of the shape is within the scope of the present disclosure.

[0056] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should also be understood that terms (including those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0057] In the present exemplary embodiment, a wafer is taken as an example of the object to be processed, but the technical idea of the present invention can be applied to devices for processing other types of substrates, and is not limited to wafers.

[0058] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings.

[0059] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention, Figure 2 is Figure 1 a front view of the substrate processing apparatus. Figure 3 is Figure 1 a top view of a coating block in the substrate processing apparatus, Figure 4 is Figure 1 a top view of a developing block in the substrate processing apparatus.

[0060] Referring to Figures 1 to 4 , the substrate processing apparatus 10 includes a transfer module 100, a processing module 300, and an interface module 500. According to an exemplary embodiment, the transfer module 100, the processing module 300, and the interface module 500 are arranged in a row in sequence. Hereinafter, the direction in which the transfer module 100, the processing module 300, and the interface module 500 are arranged is referred to as the first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as the second direction 14, and the direction perpendicular to the first direction 12 and the second direction 14 is referred to as the third direction 16.

[0061] The transfer module 100 is configured to transfer the substrate W between the container F accommodating the substrate W and the processing module 300. The longitudinal direction of the transfer module 100 is set in the second direction 14. The transfer module 100 includes a load port 110 and a transfer frame 130. The container F accommodating the substrate W is placed on the load port 110. The load port 110 is located on the opposite side of the processing module 300 with respect to the transfer frame 130. A plurality of load ports 110 may be provided, and the plurality of load ports 110 may be arranged along the second direction 14. Any one of the plurality of load ports 110 may be provided with a dummy container DF containing a dummy substrate. The dummy substrate accommodated in the dummy container DF can be used to clean the drying chamber.

[0062] In an example, the container F may be an airtight container F such as a front-opening unified pod (FOUP). The container F can be placed on the load port 110 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor or an automated guided vehicle, or an operator.

[0063] The transfer robot 132 is disposed inside the transfer frame 130. Guide rails 136 are provided inside the transfer frame 130. The longitudinal direction of the guide rails 136 is arranged along the second direction 14. The transfer robot 132 is mounted on the guide rails 136 so as to be movable along the guide rails 136. The transfer robot 132 includes a hand 132a, and the substrate W is placed on the hand 132a. The hand 132a can be configured to be movable back and forth, linearly movable along the third direction, and rotatably movable about the third direction 16 as an axis.

[0064] The processing module 300 performs a coating process and a developing process on the substrate W. The processing module 300 includes a coating block 300a and a developing block 300b.

[0065] The coating block 300a performs a coating process on the substrate W before the exposure process. The developing block 300b performs a developing process on the substrate W after the exposure process. A plurality of coating blocks 300a are provided. The plurality of coating blocks 300a may be arranged to be stacked on top of each other. A plurality of developing blocks 300b are provided. The plurality of developing blocks 300b may be arranged to be stacked on each other. In one example, two coating blocks 300a and two developing blocks 300b are provided. The plurality of coating blocks 300a may be located below the developing block 300b.

[0066] In one example, the plurality of coating blocks 300a may be configured to have the same structure as each other. The film coated on the substrate W in each of the plurality of coating blocks 300a may be the same type of film. Optionally, the film coated on the substrate W by each coating block 300a may be a different type of film. The film coated on the substrate W includes a photoresist film. The film coated on the substrate W may further include an anti-reflection film. Optionally, the film coated on the substrate W may further include a protective film.

[0067] In addition, the two developing blocks 300b can be set to have the same structure as each other. The developer supplied to the substrate W in the plurality of developing blocks 300b can be the same type of liquid. Optionally, depending on the difference in the developing blocks 300b, the developer supplied to the substrate W can be different types of developers. For example, a process for removing the light-irradiated area in the alignment film area on the substrate W can be performed in one of the two developing blocks 300b, and a process for removing the non-irradiated area can be performed in the other of the two developing blocks 300b.

[0068] Reference Figure 3 , the coating block 300a includes a buffer unit 310, a cooling unit 320, a hydrophobization chamber 340, a transfer chamber 350, a heat treatment chamber 800, and a liquid treatment chamber 380.

[0069] The buffer unit 310, the cooling unit 320, and the hydrophobization chamber 340 are disposed adjacent to the transfer module 100. The hydrophobization chamber 340 and the buffer unit 310 can be sequentially disposed along the second direction 14. In addition, the cooling unit 320 and the buffer unit 310 can be set to be stacked on top of each other in the vertical direction.

[0070] The buffer unit 310 includes one or more buffers 312. When a plurality of buffers 312 are provided, the plurality of buffers 312 can be arranged to be stacked on top of each other. When the substrate W is transferred between the transfer module 100 and the processing module 300, the buffer 312 provides a space for the substrate W to stay. The hydrophobization chamber 340 provides a hydrophobization treatment to the surface of the substrate W. The hydrophobization treatment can be performed before performing the coating process on the substrate W. The hydrophobization treatment can be achieved by supplying a hydrophobization gas to the substrate W while heating the substrate W. The cooling unit 320 cools the substrate W. The cooling unit 320 includes one or more cooling plates. When a plurality of cooling plates are provided, the plurality of cooling plates can be arranged to be stacked on top of each other. In one example, the cooling unit 320 can be disposed below the buffer unit 310. The cooling plate can have a flow path through which a coolant flows. The substrate W after the hydrophobization treatment can be cooled on the cooling plate.

[0071] The transfer mechanism 330 is disposed between the hydrophobization chamber 340 and the buffer unit 310 and between the hydrophobization chamber 340 and the cooling unit 320. The transfer mechanism 330 is configured to transfer the substrate W between the buffer unit 310, the hydrophobization chamber 340, and the cooling unit 320.

[0072] The transfer mechanism 330 includes a hand 332 on which the substrate W is placed, and the hand 332 can be set to move back and forth, rotate about the third direction 16 as an axis, and move along the third direction 16. In one example, the transfer mechanism 330 moves in the third direction 16 along a guide rail 334. The guide rail 334 extends from the coating block at the lowest position in the coating block 300a to the developing block at the highest position in the developing block 300b. This enables the transfer mechanism 330 to transfer the substrate W between the blocks 300a and 300b provided on different layers. For example, the transfer mechanism 330 can transfer the substrate W between the coating block 300a and the developing block 300b provided on different layers. The transfer mechanism 330 can also transfer the substrate W between the coating block 300a and the developing block 300b.

[0073] In addition, another transfer unit 331 can be further provided on the opposite side of the side where the hydrophobization chamber 340 is provided with respect to the buffer unit 310. The other transfer unit 331 can be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in the same blocks 300a and 300b. In addition, the other transfer unit 331 can be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in different blocks 300a and 300b.

[0074] The transfer chamber 350 is set such that its longitudinal direction is parallel to the first direction 12. One end of the transfer chamber 350 can be positioned adjacent to the buffer unit 310 and / or the cooling unit 320. The other end of the transfer chamber 350 can be positioned adjacent to the interface module 500.

[0075] A plurality of heat treatment chambers 800 are provided. Some of the heat treatment chambers 800 are arranged along the first direction 12. In addition, some of the heat treatment chambers 800 are stacked along the third direction 16. All of the heat treatment chambers 800 can be located on one side of the transfer chamber 350.

[0076] In one example, the liquid treatment chamber 380 has a multi-unit arrangement in which a plurality of coating units are provided in a single chamber. The liquid treatment chamber 380 with the multi-unit arrangement is equipped with an air conditioning device 900 at the top and performs a process in a state where air flows downward from the air conditioning device 900.

[0077] The liquid processing chamber 380 performs a liquid film forming process to form a liquid film on the substrate W. In one example, the liquid film forming process includes a resist film forming process. The liquid film forming process may include an anti-reflection film forming process. Optionally, the liquid film forming process may further include a protective film forming process. A plurality of liquid processing chambers 380 are provided. The liquid processing chambers 380 may be located on the opposite side of the heat treatment chamber 800. For example, all the liquid processing chambers 380 may be located on the other side of the transfer chamber 350. The liquid processing chambers 3600 are arranged side by side in the first direction 12. Optionally, some of the liquid processing chambers 800 may be stacked along the third direction 16.

[0078] In one example, the liquid processing chamber 380 includes a front-end liquid processing chamber 382 and a rear-end liquid processing chamber 384. The front-end liquid processing chamber 382 is arranged relatively close to the indexing module 100, and the rear-end liquid processing chamber 384 is arranged relatively closer to the interface module 500.

[0079] The front-end liquid processing chamber 382 coats a first liquid onto the substrate W, and the rear-end liquid processing chamber 384 coats a second liquid onto the substrate W. The first liquid and the second liquid may be different types of liquids. In one example, the first liquid may be a liquid for forming an anti-reflection film, and the second liquid may be a liquid for forming a photoresist film. The photoresist film may be formed on the substrate W that has been coated with the anti-reflection film. Optionally, the first liquid may be a liquid for forming a photoresist film, and the second liquid may be a liquid for forming an anti-reflection film. In this case, the anti-reflection film may be formed on the substrate W on which the photoresist film has been formed. Optionally, the first liquid and the second liquid may be the same type of liquid, and both of them may be liquids for forming a photoresist film.

[0080] Reference Figure 4 , the developing block 300b includes a buffer unit 310, a cooling unit 320, a transfer chamber 350, a heat treatment chamber 800, a drying chamber 600, and a liquid processing chamber 380.

[0081] The arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 800, and the liquid processing chamber 380 in the developing block 300b may be the same as the arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 800, and the liquid processing chamber 380 in the coating block 300a. When viewed from above, the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 800, and the liquid processing chamber 380 in the developing block 300b and the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 800, and the liquid processing chamber 380 in the coating block 300 may be arranged at overlapping positions.

[0082] The heat treatment chamber 800 performs a heating process on the substrate W. The heating process includes a post-exposure bake process performed on the substrate W after the exposure process is completed, and a hard bake process performed on the substrate W after the development process is completed.

[0083] In addition, the heat treatment chamber 800 performs a heating process on the dummy substrate DW. The heating process performed on the dummy substrate DW includes a baking process for the dummy substrate DW used to clean and dry the chamber 600. The dummy substrate DW can be baked in the heat treatment chamber 800 to completely remove any residual chemical liquid on the dummy substrate.

[0084] The liquid processing chamber 380 performs a development process by supplying a developer onto the substrate W and developing the substrate W. In addition, the liquid processing chamber 380 performs a wetting process in which a cleaning chemical liquid is coated onto the dummy substrate DW used to clean and dry the chamber 600. The dummy substrate DW wetted with the cleaning chemical liquid in the liquid processing chamber 380 is transferred to the drying chamber 600 by the transfer robot 351.

[0085] In Figure 3 or Figure 4 the transfer chamber 350 is provided with a transfer robot 351. The transfer robot 351 transfers the substrate W between the buffer unit 310, the cooling unit 320, the heat treatment chamber 800, the drying chamber 600, the liquid processing chamber 380, and the buffer unit 510 or the cooling unit 520 of the interface module 500. In addition, the transfer robot 351 transfers the dummy substrate between the buffer unit 310, the liquid processing chamber 380, the drying chamber 600, and the heat treatment chamber 800.

[0086] In one example, the transfer robot 351 includes a hand 352 on which the substrate W or the dummy substrate DW is placed. The hand 352 can be set to move back and forth, rotate about the third direction 16 as an axis, and move along the third direction 16. A guide rail 356 is provided in the transfer chamber 350, the longitudinal direction of which is parallel to the first direction 12, and the transfer robot 351 can be movably provided on the guide rail 356.

[0087] Figure 5 is a diagram showing an example of the hand of the transfer robot. Refer to Figure 5 , the hand 352 includes a base 352a and a support protrusion 352b. The base 352a can have an annular shape with a part of the circumference bent. The inner diameter of the base 352a is larger than the diameter of the substrate W. The support protrusion 352b extends inward from the base 352a. A plurality of support protrusions 352b are provided and support the edge region of the substrate W. In one example, the support protrusions 352b can be set in four equally spaced rows.

[0088] Figure 6is schematically shown Figure 3 or Figure 4 a top view of an example of a heat treatment chamber, Figure 7 is Figure 6 a front view of the heat treatment chamber. Hereinafter, the heat treatment chamber is described as a substrate heat treatment apparatus. For reference, in Figure 6 the lid of the heating unit is omitted for ease of illustration.

[0089] Referring to Figure 6 and Figure 7 the heat treatment chamber 800 may include a housing 810, a heating unit 820, and a transfer plate 830.

[0090] The housing 810 may include a bottom surface 811, a first side surface 812, and a second side surface 814. The first side surface 812 may be provided with an inlet opening 813 through which the substrate W enters and exits. The inlet opening 813 may be kept in an open state. Optionally, a door (not shown) may be provided to open and close the inlet opening. The heating unit 820 and the transfer plate 830 may be provided inside the housing 810. The second side surface 814 may be positioned in contact with a utility space.

[0091] The heating unit 820 may be provided adjacent to the second side surface. The heating unit 820 may include a baking plate 822 and a lid 824.

[0092] Viewed from the top, the baking plate 822 has a generally circular shape. The baking plate 822 has a diameter larger than that of the substrate W. The baking plate 822 transfers the heat generated by the heater 823 to the substrate W. In one example, the heater 823 may be a printed pattern or a heating wire heated by a power source. The baking plate 822 may be provided in the shape of a circular plate. The top surface of the baking plate 822 has a diameter larger than that of the substrate. The top surface of the baking plate 822 serves as a seating surface on which the substrate W is placed. A plurality of lifting holes 822a, vacuum holes 828, and proximal pins (not shown) are formed on the seating surface. The lifting holes 822a and the vacuum holes 828 are located in different regions. Each of the lifting holes 822a may be spaced apart from each other in the circumferential direction. A lifting pin 822b may be provided in each of the lifting holes 822a. The lifting pin 822b may be provided to be movable up and down in a third direction 16. The lifting pin 822b may receive the substrate W from the transfer plate 830 and place the substrate W down on the baking plate 822, or lift the substrate W from the baking plate 822 and transfer the substrate to the transfer plate 830. In one example, three lifting pins 822b may be provided.

[0093] The vacuum holes 828 can provide a negative pressure between the seat surface and the edge of the substrate W. The negative pressure provided by the vacuum holes 828 can flatten and fix the warped substrate to the baking plate 822. In one example, the vacuum holes 828 can be evenly arranged in the edge area of the seat surface. The vacuum holes 828 are connected to a vacuum pressure supply pipeline 829. The vacuum pressure supply pipeline 829 supplies vacuum pressure to the vacuum holes 828. The vacuum pressure supply pipeline 829 is connected to a capture module.

[0094] The inside of the cover 824 has a lower open space. The cover 824 is located on top of the baking plate 822 and moves up and down by a driver (not shown). The space formed by the cover 824 and the baking plate 822 according to the movement of the cover 824 is set as a heating space for heating the substrate W.

[0095] The transfer plate 830 is set to be generally disk-shaped, and its diameter corresponds to the diameter of the substrate W. Notches 830 are formed at the edge of the transfer plate 832. The notches 832 can have a shape corresponding to the protrusions 352b formed on the hand 352 of the above-mentioned transfer robot 352. In addition, the notches 832 are set to be the same number as the protrusions 352b formed on the hand and are formed at positions corresponding to the protrusions 352b. In the position where the hand and the transfer plate 830 are arranged in the vertical direction, when the vertical positions of the hand and the transfer plate 830 change, the substrate W is transferred between the hand 352 and the transfer plate 830. The transfer plate 830 can be mounted on a guide rail 838 and can move along the guide rail 838 by a driver 839.

[0096] A plurality of slit-shaped guide grooves 830 are provided in the transfer plate 834. The guide grooves 834 extend from the distal end of the transfer plate 830 to the inside of the transfer plate 830. The guide grooves 834 are set such that their longitudinal directions are along the second direction 14, and the guide grooves 834 are spaced apart from each other along the first direction 12. The guide grooves 834 prevent interference between the transfer plate 830 and the lifting pins 822c when the substrate W is transferred between the transfer plate 830 and the heating unit 820.

[0097] The transfer plate 830 is made of a heat-conductive material. According to an example, the transfer plate 830 can be made of a metal material.

[0098] A cooling flow path 836 is formed in the transfer plate 830. The cooling channel 836 is connected to a refrigerant supply pipeline 837a, and the cooling channel 836 is supplied with coolant via the refrigerant supply pipeline 837a. The substrate W that has been fully heated in the heating unit 820 can be cooled while being transferred by the transfer plate 830. That is, the transfer plate 830 can be used as a cooling unit to cool the substrate. In addition, the substrate W can be cooled on the transfer plate 830 while waiting to be transferred to the transfer robot 351 on the transfer plate 830.

[0099] Although not shown, optionally, a cooling unit may be additionally provided within the housing 810. In this case, the cooling unit may be arranged in parallel with the heating unit 810. The cooling unit may be provided as a cooling plate in which channels for a coolant to flow are formed. The substrate that has been heated in the heating unit may be returned to the cooling unit for cooling.

[0100] Referring again to Figures 1 to 4 , the interface module 500 connects the processing module 300 to the external exposure apparatus 700. The interface module 500 includes an interface frame 501, a buffer unit 510, a cooling unit 520, a transfer mechanism 530, an interface unit 540, and an additional processing chamber 560.

[0101] At the top of the interface frame 501, a fan filter unit may be provided in which a downward air flow is formed. The buffer unit 510, the cooling unit 520, the transfer mechanism 530, the interface unit 540, and the additional processing chamber 560 are provided inside the interface frame 501.

[0102] The structures and arrangements of the buffer unit 510 and the cooling unit 520 may be the same as or similar to those of the buffer unit 310 and the cooling unit 320 provided in the processing module 300. The buffer unit 510 and the cooling unit 520 are provided adjacent to the ends of the transfer chamber 350. The substrate W transferred between the processing module 300, the cooling unit 520, the additional processing chamber 560, and the exposure apparatus 700 may be temporarily stopped in the buffer unit 510. The cooling unit 520 may be provided only at a height corresponding to the coating block 300a between the coating block 300a and the developing block 300b.

[0103] The transfer mechanism 530 may transfer the substrate W between the buffer units 510. The transfer mechanism 530 may also transfer the substrate W between the buffer unit 510 and the cooling unit 520. The transfer mechanism 530 may be provided with a structure the same as or similar to that of the transfer mechanism 330 of the processing module 300. Another transfer mechanism 531 may also be provided in a region opposite to the region where the transfer mechanism 530 is provided with respect to the buffer unit 510.

[0104] The interface robot 540 is provided between the buffer unit 510 and the exposure apparatus 700. The interface unit 540 is provided for transferring the substrate W between the buffer unit 510, the cooling unit 520, the additional processing chamber 560, and the exposure apparatus 700. The interface unit 540 includes a hand 542 on which the substrate W is placed, and the hand 542 may be provided to be movable back and forth, rotatable about an axis parallel to the third direction 16, and movable along the third direction 16.

[0105] The additional processing chamber 560 may perform a predetermined additional process before loading the substrate W that has been processed in the coating block 300a into the exposure apparatus 700. Optionally, the additional processing chamber 560 may perform a predetermined additional process before loading the substrate W that has been processed in the exposure apparatus 700 into the developing block 300b. In one example, the additional process may be an edge exposure process for exposing an edge region of the substrate W, a top surface cleaning process for cleaning a top surface of the substrate W, a bottom surface cleaning process for cleaning a bottom surface of the substrate W, or an inspection process for performing a predetermined inspection on the substrate W. A plurality of additional processing chambers 560 may be provided, which may be stacked on top of each other.

[0106] The structure of the liquid processing chamber will be described in detail below. The liquid processing chamber provided in the coating block 300a will be described as an example below. In addition, the liquid processing chamber will be described based on the case of a chamber for coating a photoresist on a substrate.

[0107] Figure 8 is a cross-sectional view showing an exemplary embodiment of the liquid processing chamber, and Figure 9 is Figure 8 a top view of the liquid processing chamber.

[0108] Referring to Figure 8 and Figure 9 , the liquid processing chamber 1000 includes a housing 1100, a first processing unit 1201a, a second processing unit 1201b, a liquid supply unit 1400, an exhaust unit 1600, and a controller 1800.

[0109] The housing 1100 is provided in a rectangular column shape having an internal space. Openings 1101a and 1101b are formed on one side of the housing 1100. The openings 1101a and 1101b serve as channels for loading and unloading the substrate W. Doors 1103a and 1103b are installed in the openings 1101a and 1101b, and the doors 1103a and 1103b open and close the openings 1101a and 1101b.

[0110] An air conditioner 900 having a filter box for supplying a downward air flow to its internal space is provided on the upper wall of the housing 1100. The air conditioner 900 has a filter for introducing air from the outside into the internal space and filtering the air. The air conditioner 900 has another chamber arranged in an upper portion, which is directly affected by the temperature generated by heating elements (motor, heater, etc.) in the surrounding area. The air conditioner 900 of the present invention has a structure capable of minimizing the temperature influence of the surrounding area.

[0111] The first processing unit 1201a and the second processing unit 1201b are disposed in the internal space of the housing 1100. The first processing unit 1201a and the second processing unit 1201b are arranged in one direction.

[0112] The first processing unit 1201a has a first processing container 1220a and a first support unit 1240a.

[0113] The first processing container 1220a has a first internal space 1222a. The first internal space 1222a is provided with an open top.

[0114] The first support unit 1240a supports the substrate W in the first internal space 1222a of the first processing container 1220a. The first support unit 1240a includes a first support plate 1242a, a first drive shaft 1244a, and a first driver 1246a. The first support plate 1242a has a circular top surface. The diameter of the first support plate 1242a is smaller than the diameter of the substrate W. The first support plate 1242a is arranged to support the substrate W by vacuum pressure. Optionally, the first support plate 1242a may have a mechanical clamping structure for supporting the substrate W. The first drive shaft 1244a is coupled to the center of the bottom surface of the first support plate 1242a, and a first driver 1246a for providing a rotational force to the first drive shaft 1244a is provided on the first drive shaft 1244a. The first driver 1246a may be a motor.

[0115] The second processing unit 1201b includes a second processing container 1220b and a second support unit 1240b, and the second support unit 1240b includes a second support plate 1242b, a second drive shaft 1244b, and a second driver 1246b. The second processing container 1220b and the second support unit 1240b have substantially the same structure as the first processing container 1220a and the first support unit 1240a.

[0116] The liquid supply unit 1400 supplies liquid onto the substrate W. The liquid supply unit 1400 includes a first nozzle 1420a, a second nozzle 1420b, and a processing solution nozzle 1440. The first nozzle 1420a supplies liquid to the substrate W provided to the first support unit 1240a, and the second nozzle 1420b supplies liquid to the substrate W provided to the second support unit 1240b. The first nozzle 1420a and the second nozzle 1420b may be set to supply the same type of liquid. According to an example, the first nozzle 1420a and the second nozzle 1420b may supply a rinse liquid for cleaning the substrate W. For example, the rinse liquid may be water. According to another example, the first nozzle 1420a and the second nozzle 1420b may supply a removal liquid for removing photoresist from the edge region of the substrate W. For example, the removal liquid may be a thinner. Each of the first nozzle 1420a and the second nozzle 1420b can rotate about its rotation axis between a processing position and a waiting position. The processing position is the position where liquid is discharged onto the substrate W, and the waiting position is the position where the first nozzle 1420a and the second nozzle 1420b wait without discharging liquid onto the substrate W.

[0117] The processing solution nozzle 1440 supplies a processing solution to the substrate W provided to the first support unit 1240a and the substrate W provided to the second support unit 1240b. The processing solution may be photoresist. The nozzle driver 1448 drives the processing solution nozzle 1440 such that the processing solution nozzle 1440 moves along the guide rail 1442 between a first processing position, a waiting position, and a second processing position. The first processing position is the position for supplying the processing solution to the substrate W supported by the first support unit 1240a, and the second processing position is the position for supplying the processing solution to the substrate W supported by the second support unit 1240b. The waiting position is the position of the waiting port 1444 between the first processing unit 1201a and the second processing unit 1201b where the nozzle waits when the photoresist is not discharged from the processing solution nozzle 1440.

[0118] A gas-liquid separation plate 1229a may be provided in the internal space 1201a of the first processing container 1220a. The gas-liquid separation plate 1229a may be provided to extend upward from the bottom wall of the first processing container 1220a. The gas-liquid separation plate 1229a may be provided in an annular shape.

[0119] According to the example, the outside of the gas-liquid separation plate 1229a can be set as a discharge space for discharging liquid, and the inside of the gas-liquid separation plate 1229a can be set as an exhaust space for discharging air. A discharge pipe 1228a for discharging the processing solution is connected to the bottom wall of the first processing container 1220a. The discharge pipe 1228a discharges the processing solution introduced between the side wall of the first processing container 1220a and the gas-liquid separation plate 1229a to the outside of the first processing container 1220a. The air flow flowing into the space between the side wall of the first processing container 1220a and the gas-liquid separation plate 1229a is introduced into the gas-liquid separation plate 1229a. During this process, the processing solution contained in the air flow is discharged from the discharge space to the outside of the first processing container 1220a through the discharge pipe 1228a, and the air flow is introduced into the exhaust space of the first processing container 1220a.

[0120] Although not shown, a lifting drive for adjusting the relative height of the first support plate 1242a and the first processing container 1220a can be provided.

[0121] Figure 10 is a perspective view showing an example of an air-conditioning device installed in a stacked liquid processing chamber, Figure 11 is Figure 10 a perspective view of the air-conditioning device shown in Figure 12 and Figure 13 are a top view and a side cross-sectional view of the air-conditioning device, Figure 14 is Figure 12 a perspective view of the internal pipe shown in Figure 15 is a side cross-sectional view showing an example of an air-conditioning device installed in a stacked liquid processing chamber.

[0122] Referring Figures 10 to 15 , the air-conditioning device 900 can include a housing 910, an internal pipe 930, a top airbag 950, side airbags 960-1 and 960-2, a filter 990, and a perforated plate 992.

[0123] The housing 910 is formed with internal spaces 913 and 914 that allow the air injected therein to diffuse. The internal spaces 913 and 914 can be divided into a first space 913 and a second space 914 by a central duct 930 of the internal duct 930. The first space 913 and the second space 914 have spaces that are symmetric about the central duct left and right. For this purpose, the airbag 960-2 in the side airbags 960-1 and 960-2 has a shape corresponding to the shape of the internal duct 930. The first processing unit 1201a of the liquid processing chamber is located below the first space 913, and the second processing unit 1201b is located below the second space 914. In this way, the first space 913 and the second space 914 have a symmetric structure, so that the air conditioner 900 can provide a uniform downward air flow to the first processing unit 1201a and the second processing unit 1201b.

[0124] As Figure 13 shown, the upper airbag 950 can be provided in the upper part of the housing 910. The upper airbag 950 blocks the temperature influence of heating elements (such as motors, drivers, etc.) of another liquid processing chamber located above the air conditioner 900.

[0125] The housing 910 can have a box shape, which includes a bottom part, side walls vertically extending from opposite ends of the bottom part to the bottom part, and a cover body covering the side walls. The housing 910 can be arranged to have an area equal to or greater than the area occupied by two processing units arranged in the first direction of the liquid processing chamber 1000. The housing 910 can be arranged on top of the liquid processing chamber 1000.

[0126] In an exemplary embodiment of the present invention, one side of the housing 910 has an inlet 912 through which air is introduced.

[0127] The inlet 912 of the housing 910 receives air through a supply duct 901. The supply duct 901 supplies air to each of the air conditioners 900 of a plurality of stacked liquid processing chambers 1000. An air flow regulator (not shown) is installed in the supply duct 901, which regulates the air flow rate flowing into the air conditioner 900.

[0128] The bottom of the housing 910 has an opening 916 to allow the air introduced into the first space 913 and the second space 914 to flow downward. A plate-shaped filter 990 is installed in the opening 916. A perforated plate 992 is installed on the lower side of the filter 990.

[0129] The internal duct 930 guides air from the inlet 912 to the center of the housing 910, such that the air introduced through the inlet 912 is uniformly supplied to the interior space of the housing 910. The internal duct 930 may include a central duct 940 and a connecting duct 932 that connects the central duct 940 to the inlet 912. The central duct 940 divides the interior space of the housing 910 into a first space 913 and a second space 914. The central duct 940 has a structure that can supply air to the first space 913 and the second space 914. The central duct 940 may include a first partition wall 942 that contacts the first space 913 and a second partition wall 944 that contacts the second space 914. The first partition wall 942 and the second partition wall 944 are made of perforated plates.

[0130] In the air conditioner 900, the air introduced through the inlet 912 is guided to the center of the housing 910 through the internal duct 930, and then supplied to the left space 913 and the right space 914. Accordingly, a uniform downward air flow can be provided to the first processing unit 1201a and the second processing unit 1201b.

[0131] Specifically, by providing air bags 950, 960-1, and 960-2 on the upper surface and two side surfaces of the housing 910, the air conditioner 900 can block the heat transferred from the surrounding environment (the chamber located on top of the air conditioner), thereby providing a uniformly heated air flow to the liquid processing chamber 1000. Accordingly, the temperature deviation around the first processing unit 1201a and the second processing unit 1201b can be significantly reduced.

[0132] As described above, in the air conditioner 900 of the present invention, air is supplied from the center of the housing to the first space and the second space and flows downward into the liquid processing chamber. In particular, the top surface and side surfaces of the housing are thermally insulated using air bags, so it is expected that the temperature will be balanced when air is supplied to the liquid processing chamber.

[0133] The above detailed description illustrates the present invention. In addition, the above shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, the above can be modified or corrected within the scope of the inventive concept disclosed in this specification, within the scope equivalent to the present invention, and / or within the scope of the skills or knowledge in the art. The above exemplary embodiments describe the best state of implementing the technical spirit of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the appended claims should be construed as also including other exemplary embodiments.

Claims

1. An air conditioning device for providing a downward airflow from an upper portion of a processing chamber having a processing space to the processing space, wherein a first processing unit and a second processing unit are arranged side by side in the processing space, the air conditioning device comprising: a housing having an inlet at one side through which air is introduced, and an opening on a lower surface for allowing the air introduced through the inlet to flow downward; and An internal duct for guiding air from the inlet to the center of the housing so that the air introduced through the inlet is uniformly supplied into an internal space of the housing.

2. The air conditioning device according to claim 1, wherein: The internal duct includes a central duct that divides an internal space of the housing into a first space and a second space and supplies air to the first space and the second space.

3. The air conditioning device according to claim 2, wherein: The central duct includes a first partition wall in contact with the first space and a second partition wall in contact with the second space, and The first partition wall and the second partition wall are made of a perforated plate.

4. The air conditioning device according to claim 2, wherein: The first space is located on top of the first processing unit, and The second space is located on the top of the second processing unit. 5 . The air conditioning apparatus according to claim 2 , wherein the first space and the second space have symmetrical spaces with respect to the central duct.

6. The air conditioning device according to claim 2, further comprising: An upper air bag is disposed on a top surface of the housing.

7. The air conditioning device according to claim 2, further comprising: Side airbags are provided on both side surfaces of the housing.

8. The air conditioning device according to claim 2, further comprising: a plate filter mounted in the opening; as well as A perforated plate is installed at the bottom end of the filter.

9. A substrate processing device comprising: a chamber having a processing space; a first processing unit and a second processing unit arranged in a row along a first direction in the processing space of the chamber; as well as an air conditioning device mounted in an upper portion of the chamber and providing a downwardly flowing airflow into the processing space of the chamber, Wherein, the air conditioning device comprises: a housing having an inlet at one side through which air is introduced, and an opening on a lower surface for allowing the air introduced through the inlet to flow downward; and An internal duct for guiding the air from the inlet to the center of the housing so that the air introduced through the inlet is uniformly supplied into an internal space of the housing.

10. The substrate processing apparatus according to claim 9, wherein: The internal duct includes a central duct that divides an internal space of the housing into a first space and a second space and supplies air to the first space and the second space.

11. The substrate processing apparatus according to claim 10, wherein: The central duct includes a first partition wall in contact with the first space and a second partition wall in contact with the second space, and The first partition wall and the second partition wall are made of perforated plates.

12. The substrate processing apparatus according to claim 11, wherein the first space is located on the top of the first processing unit, and The second space is located on the top of the second processing unit.

13. The substrate processing apparatus according to claim 10, wherein: The first space and the second space have symmetrical spaces with respect to the central duct.

14. The substrate processing apparatus according to claim 10, further comprising: An upper air bag is disposed on a top surface of the housing.

15. The substrate processing apparatus according to claim 10, further comprising: Side airbags are provided on both side surfaces of the housing.

16. The substrate processing apparatus according to claim 10, further comprising: a plate filter mounted in the opening; as well as A perforated plate is installed at the bottom end of the filter.

17. The substrate processing apparatus according to claim 10, wherein: The first processing unit and the second processing unit apply liquid to the substrate.

18. The substrate processing apparatus according to claim 10, wherein: The chambers are stacked in plural numbers.

19. A substrate processing device comprising: a chamber having a processing space; first and second processing units which are arranged in a row along a first direction in the processing space of the chamber and apply liquid to a substrate; and an air conditioning device mounted in an upper portion of the chamber and providing a downwardly flowing airflow into the processing space of the chamber, Wherein, the air conditioning device comprises: a housing having an inlet at one side through which air is introduced, and an opening on a lower surface for allowing the air introduced through the inlet to flow downward; an internal duct for guiding the air from the inlet to the center of the housing so that the air introduced through the inlet is uniformly supplied to the internal space of the housing; a plate-shaped filter installed in the opening; a perforated plate, the perforated plate being mounted at the bottom end of the filter; an upper air bag disposed on a top surface of the housing; and side airbags disposed on both side surfaces of the housing, and An internal duct including a central duct that divides an internal space of the housing into a first space located on a top of the first processing unit and a second space located on a top of the second processing unit and supplies air to the first space and the second space.

20. The substrate processing apparatus according to claim 19, wherein: The central duct includes a first partition wall in contact with the first space and a second partition wall in contact with the second space, The first partition wall and the second partition wall are made of perforated plates, and The first space and the second space have symmetrical spaces with respect to the central duct.

Images