Electronic device

Abstract

An electronic device comprises a shell, a circuit board, a heat source, a radiator and a fixing piece. The heat source is arranged on one side of the circuit board. The radiator is located between the shell and the side of the circuit board and makes contact with a heat source. The fixing part is configured to fix the circuit board to the shell and is connected with the radiator. Therefore, the total number of the locking structures in the shell can be reduced, the cost of the whole machine can be reduced, the assembly process can be simplified, and the planning elasticity of the internal space of the shell can be improved.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly to an electronic device with a heat sink. Background Art

[0002] In most existing notebook computers, the heat source (e.g., CPU) inside the main body is usually cooled by a heat sink and a fan. The heat sink is generally fixed to the motherboard by directly contacting the CPU and then locking it. However, in the case where the internal space of the main body is relatively limited, the locking structure between the heat sink and the motherboard may affect the overall planning of the internal space of the main body, making the space utilization less flexible.

[0003] Therefore, how to propose an electronic device that can solve the above problems is one of the problems that the industry is eager to invest in research and development resources to solve currently. Summary of the Invention

[0004] In view of this, an object of the present invention is to propose an electronic device that can solve the above problems.

[0005] To achieve the above object, according to an embodiment of the present invention, an electronic device includes a housing, a circuit board, a heat source, a heat sink, and a fixing member. The heat source is disposed on one side of the circuit board. The heat sink is located between the housing and the aforementioned one side of the circuit board and contacts the heat source. The fixing member is configured to fix the circuit board to the housing and connect the heat sink.

[0006] In one or more embodiments of the present invention, the fixing member passes through the heat sink.

[0007] In one or more embodiments of the present invention, the heat sink includes a contact portion and a spring arm portion. The contact portion contacts the heat source. The spring arm portion is connected to the contact portion. The fixing member passes through the spring arm portion.

[0008] In one or more embodiments of the present invention, the heat sink is pressed between the housing and the heat source, causing the spring arm portion to elastically deform.

[0009] In one or more embodiments of the present invention, there is a first distance between the surface of the contact portion away from the spring arm portion and the surface of the spring arm portion away from the contact portion in a direction perpendicular to the aforementioned one surface of the contact portion. The housing has a bearing surface for bearing the spring arm portion. There is a second distance between the heat source and the bearing surface in a direction perpendicular to the surface of the heat source away from the circuit board. The second distance is less than the first distance.

[0010] In one or more embodiments of the present invention, the housing includes a stud. The fixing member is a screw locked to the stud.

[0011] In one or more embodiments of the present invention, the stud abuts against the aforementioned one side of the circuit board.

[0012] In one or more embodiments of the present invention, the heat sink is sleeved on the stud.

[0013] In one or more embodiments of the present invention, the stud includes a first stud segment and a second stud segment. The first stud segment has a bearing surface. The bearing surface faces the circuit board. The second stud segment is connected to the bearing surface and abuts against the aforementioned side of the circuit board. The heat sink is carried on the bearing surface and sleeved on the second stud segment.

[0014] In one or more embodiments of the present invention, the heat sink includes spring arm portions. The spring arm portions are sleeved on the second stud segment and carried on the bearing surface. The heat sink is pressed between the heat source and the bearing surface, causing the spring arm portions to elastically deform.

[0015] In one or more embodiments of the present invention, the housing includes a first housing portion and a second housing portion. An accommodation space is formed between the first housing portion and the second housing portion. The heat sink is located between the first housing portion and the aforementioned side of the circuit board. The fixing member is configured to fix the circuit board to the first housing portion and limit the heat sink between the first housing portion and the aforementioned side of the circuit board.

[0016] In one or more embodiments of the present invention, the fixing member includes a coupling portion and a head. The coupling portion passes through the circuit board and the heat sink and is fixed to the first housing portion. The head is connected to the coupling portion and abuts against the side of the circuit board away from the first housing portion.

[0017] In one or more embodiments of the present invention, the fixing member includes a coupling portion and a head. The coupling portion passes through the second housing portion, the circuit board and the heat sink and is fixed to the first housing portion. The head is connected to the coupling portion and abuts against the side of the second housing portion away from the first housing portion.

[0018] In one or more embodiments of the present invention, the heat sink includes spring arm portions. The heat sink is pressed between the housing and the heat source, causing the spring arm portions to elastically deform.

[0019] In summary, in the electronic device of the present invention, by using the fixing method of simultaneously connecting the housing, the circuit board and the heat sink with the fixing member, the total number of locking structures inside the housing can be reduced. This can not only reduce the overall cost of the machine, simplify the assembly process, but also improve the planning flexibility of the internal space of the housing. In addition, the structural configuration of the aforementioned locking structure can effectively reduce the span between the locking structures. Besides strengthening the overall structural rigidity of the electronic device, it can also reduce the degree of board bending of the circuit board, thereby reducing the risk of damage to the heat source disposed on the circuit board (for example, the CPU suffers from solder cracking).

[0020] The above is only used to elaborate on the problems to be solved by the present invention, the technical means for solving the problems, and the effects produced thereby. The specific details of the present invention will be introduced in detail in the following embodiments and related drawings. Description of the Drawings

[0021] To make the above and other objects, features, and advantages of the present invention and its embodiments more obvious and understandable, the description of the accompanying drawings is as follows:

[0022] Figure 1 To illustrate a perspective view of an electronic device according to an embodiment of the present invention.

[0023] Figure 2 To illustrate Figure 1 a cross-sectional view of the electronic device in

[0024] Figure 3 To illustrate Figure 1 a partial perspective view of some components of the electronic device in

[0025] Figure 4 To illustrate Figure 1 a partial perspective view of the first housing in

[0026] Figure 5 To illustrate Figure 2 a partial enlarged view of

[0027] Among them, the description of the reference numerals is as follows:

[0028] 100: Electronic device

[0029] 110: First housing

[0030] 111: First housing part

[0031] 112: Second housing part

[0032] 112a: Countersunk hole

[0033] 113: Stud

[0034] 113a: First column section

[0035] 113a1: Bearing surface

[0036] 113b: Second column section

[0037] 113c: Rib

[0038] 120: Second housing

[0039] 130: Circuit board

[0040] 140: Heat source

[0041] 150: Heat sink

[0042] 151: Contact part

[0043] 152: Spring arm part

[0044] 152a: Perforation

[0045] 160: Fastener

[0046] 161: Joint portion

[0047] 162: Head

[0048] S: Accommodating space

[0049] D1: First distance

[0050] D2: Second distance Detailed implementation manners

[0051] Multiple implementation manners of the present invention will be disclosed below with reference to the accompanying drawings. For the sake of clear illustration, many practical details will be described together in the following description. However, it should be understood that these practical details are not used to limit the present invention. That is to say, in some implementation manners of the present invention, these practical details are not necessary. In addition, for the sake of simplifying the accompanying drawings, some conventional structures and elements will be shown in a simple schematic manner in the accompanying drawings.

[0052] Please refer to Figure 1 . Figure 1 To show a perspective view of an electronic device 100 according to an implementation manner of the present invention. As Figure 1 shown, the electronic device 100 includes a first housing 110 and a second housing 120. The first housing 110 and the second housing 120 can be flipped relative to each other (for example, through a hinge device). The electronic device 100 is taken as a notebook computer as an example, where the first housing 110 can be the outer shell of the main body of the host computer, and the second housing 120 can be the outer shell of the display, but the present invention is not limited thereto. In practical applications, the electronic device 100 can be other types of electronic products.

[0053] Please refer to Figure 2 , which shows a cross-sectional view of the electronic device 100 in Figure 1 in an implementation manner. As Figure 2As shown, the electronic device 100 further includes a circuit board 130, a heat source 140, a heat sink 150, and a fixing member 160. The circuit board 130 is disposed within the first housing 110. The heat source 140 is disposed on the circuit board 130. The heat sink 150 is located between the first housing 110 and the circuit board 130 and contacts the heat source 140. The fixing member 160 is configured to fix the circuit board 130 to the first housing 110 and connect the heat sink 150. In some embodiments, the heat source 140 is, for example, a Central Processing Unit (CPU), but the present invention is not limited thereto. In practical applications, the heat source 140 may be other types of wafers that generate heat during operation, such as memories, Graphic Processing Units (GPUs), and the like.

[0054] From the foregoing structural configuration, it can be seen that the electronic device 100 of the present embodiment uses the fixing member 160 to connect the first housing 110, the circuit board 130, and the heat sink 150 at the same time. Therefore, the total number of locking structures inside the first housing 110 can be reduced, which can not only reduce the overall cost of the machine and simplify the assembly process, but also improve the planning flexibility of the internal space of the first housing 110. The following details the specific manner in which the fixing member 160 connects the first housing 110, the circuit board 130, and the heat sink 150. As Figure 2 shown, the fixing member 160 is connected to the heat sink 150 in a manner that passes through the heat sink 150. In other words, the heat sink 150 is sleeved outside the outer edge of the fixing member 160 and is limited between the first housing 110 and the circuit board 130 fixed by the fixing member 160.

[0055] Specifically, the first housing 110 includes a first housing portion 111 and a second housing portion 112. An accommodation space S is formed between the first housing portion 111 and the second housing portion 112. For example, the first housing portion 111 is the upper housing portion of the main body of the host with a keyboard device, and the second housing portion 112 is the lower housing portion of the main body of the host. The heat sink 150 is limited between the first housing portion 111 and the circuit board 130. The fixing member 160 is configured to fix the circuit board 130 to the first housing portion 111 and limit the heat sink 150 between the first housing portion 111 and the circuit board 130.

[0056] Please refer to Figure 3 which is a partial perspective view showing some components of the electronic device 100 in Figure 1 . Figure 3 Specifically presents the first housing portion 111 of the first housing 110 and the heat sink 150. As Figure 2 and Figure 3As shown, the heat sink 150 includes a contact portion 151. The contact portion 151 is in a flat plate shape and contacts the heat source 140 in a surface contact manner, so that the heat generated by the heat source 140 can be quickly conducted away in a thermal conduction manner.

[0057] In some embodiments, the contact portion 151 of the heat sink 150 includes a material with high thermal conductivity, such as a metal material. The metal material includes, for example, silver and / or copper, but the invention is not limited thereto.

[0058] like Figure 2 and Figure 3 As shown, the heat sink 150 further includes an elastic arm portion 152. The elastic arm portion 152 extends from the edge of the contact portion 151. Specifically, one end of the elastic arm portion 152 away from the contact portion 151 has a through hole 152a. The fixing member 160 passes through the heat sink 150 through the through hole 152a to connect with the heat sink 150.

[0059] like Figure 3 As shown, in this embodiment, the number of the elastic arm portions 152 included in the heat sink 150 is four, but the present invention is not limited thereto and can be flexibly increased or decreased according to actual needs.

[0060] like Figure 2 and Figure 3 As shown, the first housing 110 further includes a stud 113. The stud 113 is connected to the first housing 111. The fixing member 160 is a screw that is locked to the stud 113. The stud 113 abuts against the side of the circuit board 130 facing the first housing 111. The heat sink 150 is sleeved on the stud 113 by allowing the stud 113 to pass through the through hole 152a of the elastic arm portion 152. In other words, the fixing member 160 passes through the through hole 152a of the elastic arm portion 152 and is locked to the stud 113, and is connected to the elastic arm portion 152 via the stud 113.

[0061] In some embodiments, the first shell portion 111 and the stud 113 are different parts of a single body structure. The single body structure is, for example, a plastic part, but the invention is not limited thereto.

[0062] Please refer to Figure 4 , which is a drawing Figure 1 A partial stereoscopic view of the first housing 110 in FIG. Figure 2 and Figure 4 As shown, the stud 113 includes a first column section 113a and a second column section 113b. The first column section 113a is connected to the first shell 111 and has a bearing surface 113a1. The bearing surface 113a1 faces the circuit board 130. The second column section 113b is connected to the bearing surface 113a1 and abuts against a side of the circuit board 130 facing the first shell 111. The elastic arm portion 152 of the heat sink 150 is sleeved on the second column section 113b and is carried on the bearing surface 113a1.

[0063] As shown Figure 4 in the figure, the bearing surface 113a1 is annular, that is, the second column section 113b is retracted relative to the first column section 113a. Thereby, the bearing surface 113a1 can stably bear the elastic arm portion 152. In addition, in the Figure 4 embodiment shown in the figure, both the first column section 113a and the second column section 113b are cylindrical, and the outer diameter of the second column section 113b is smaller than the outer diameter of the first column section 113a, but the present invention is not limited thereto.

[0064] As shown Figure 4 in the figure, the stud 113 further includes a plurality of rib portions 113c. The rib portions 113c are connected to the outer surface of the first column section 113a in a radial arrangement and are connected to the first housing portion 111. Thereby, the rib portions 113c can not only increase the structural strength of the stud 113 itself, but also increase the connection strength between the stud 113 and the first housing portion 111.

[0065] As shown Figure 4 in the figure, the bearing surface 113a1 is jointly formed by the surface of the first column section 113a away from the first housing portion 111 and the surface of the rib portion 113c away from the first housing portion 111. Thereby, the bearing surface 113a1 can more stably bear the elastic arm portion 152.

[0066] As shown Figure 2 in the figure, two fixing members 160 and two studs 113 are shown. Each fixing member 160 includes a connected engaging portion 161 and a head portion 162. The engaging portion 161 of the left fixing member 160 passes through the through hole 152a of the elastic arm portion 152 of the circuit board 130 and the radiator 150, and is fixed to the first housing portion 111 by engaging with the left stud 113. The head portion 162 of the left fixing member 160 abuts against the side of the circuit board 130 away from the first housing portion 111. Thereby, the left fixing member 160 that simultaneously connects the first housing 110, the circuit board 130, and the radiator 150 can effectively reduce the total number of locking structures inside the housing.

[0067] Similarly shown in Figure 2, the joint portion 161 of the right fixing member 160 passes through the counterbore 112a of the second housing portion 112, the circuit board 130, and the through hole 152a of the spring arm portion 152 of the heat sink 150 in sequence from outside the housing, and is fixed to the first housing portion 111 by engaging with the right stud 113. The head portion 162 of the right fixing member 160 abuts against the side of the second housing portion 112 away from the first housing portion 111. In this embodiment, the head portion 162 of the right fixing member 160 abuts in the counterbore 112a of the second housing portion 112. Thus, the right fixing member 160 that simultaneously engages the first housing 110, the circuit board 130, and the heat sink 150 can also effectively reduce the total number of locking structures inside the housing. Compared with the locking structure between the housing and the circuit board in the conventional electronic device that must be arranged in a staggered manner with the locking structure between the circuit board and the heat sink, the structural configuration of the foregoing locking structure of the present invention can also effectively reduce the span between the locking structures. In addition to strengthening the overall structural rigidity of the electronic device 100, it can also reduce the degree of board bending of the circuit board 130, thereby reducing the risk of damage to the heat source 140 disposed on the circuit board 130 (for example, the CPU suffers from solder cracking).

[0068] It should be noted that Figure 2 Two locking methods of the fixing member 160 are disclosed. One is the locking method of the left fixing member 160 (that is, simultaneously engaging the heat sink 150, the circuit board 130, and the first housing portion 111), and the other is the locking method of the right fixing member 160 (that is, simultaneously engaging the second housing portion 112, the circuit board 130, the heat sink 150, and the first housing portion 111). With reference to Figure 3 , the number of the spring arm portions 152 of the heat sink 150 and the number of the studs 113 are both four. For example, the locking method of three left fixing members 160 and the locking method of one right fixing member 160 can be adopted, but the present invention is not limited thereto, and the foregoing two locking methods can be elastically configured according to actual needs.

[0069] In some embodiments, the heat sink 150 is pressed between the housing and the heat source 140, causing the spring arm portion 152 to elastically deform. Specifically, as Figure 2 shown, the surface of the contact portion 151 of the heat sink 150 facing the heat source 140 is pressed by the heat source 140, and the spring arm portion 152 of the heat sink 150 is pressed by the bearing surface 113a1 of the first column section 113a in a direction opposite to the pressing direction of the contact portion 151, so that the spring arm portion 152 elastically deforms. The elastically deformed spring arm portion 152 can make the contact portion 151 abut against the heat source 140 more tightly, thereby providing a better heat conduction effect.

[0070] Please refer to Figure 5 , which is a partial enlarged view showing Figure 2 . As Figure 2 and Figure 5As shown, the elastic arm portion 152 of the heat sink 150 is fixed on the surface of the contact portion 151 facing the first shell portion 111. The surface of the elastic arm portion 152 away from the contact portion 151 is a flat surface. There is a first distance D1 between the surface of the contact portion 151 away from the elastic arm portion 152 and the surface of the elastic arm portion 152 away from the contact portion 151 in a direction perpendicular to the surface of the contact portion 151 away from the elastic arm portion 152. In addition, there is a second distance D2 between the heat source 140 and the bearing surface 113a1 of the first column section 113a in a direction perpendicular to the surface of the heat source 140 away from the circuit board 130. By making the second distance D2 smaller than the first distance D1, the purpose of making the heat sink 150 pressed between the shell and the heat source 140 can be achieved.

[0071] From the above detailed description of the specific implementation of the present invention, it can be clearly seen that in the electronic device of the present invention, by using the fixing means to simultaneously connect the housing, the circuit board and the heat sink, the total number of locking structures inside the housing can be reduced, which can not only reduce the cost of the whole machine and simplify the assembly process, but also improve the planning flexibility of the internal space of the housing. In addition, the structural configuration of the aforementioned locking structure can also effectively reduce the span between the locking structures, which can not only strengthen the overall structural rigidity of the electronic device, but also reduce the amplitude of the board bending of the circuit board, thereby reducing the risk of damage to the heat source set on the circuit board (for example, the CPU tin cracking).

[0072] Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the following claims.

Claims

1. An electronic device, characterized in that, Comprising: A housing; A circuit board; A heat source, disposed on one side of the circuit board; A radiator, located between the housing and that side of the circuit board and in contact with the heat source; and A fixing member, configured to fix the circuit board to the housing and connect the radiator.

2. The electronic device according to claim 1, wherein The fixing member passes through the radiator.

3. The electronic device according to claim 2, wherein The radiator comprises: A contact portion, in contact with the heat source; and A spring arm portion, connecting the contact portion, wherein the fixing member passes through the spring arm portion.

4. The electronic device according to claim 3, wherein The radiator is pressed between the housing and the heat source, causing the spring arm portion to elastically deform.

5. The electronic device according to claim 3, characterized in that, There is a first distance in a direction perpendicular to the surface of the contact portion between a surface of the contact portion away from the spring arm portion and a surface of the spring arm portion away from the contact portion. The housing has a bearing surface for bearing the spring arm portion. There is a second distance in a direction perpendicular to the surface of the heat source away from the circuit board between the heat source and the bearing surface, and the second distance is less than the first distance.

6. The electronic device according to claim 1, characterized in that, The housing includes a stud, and the fixing member is a screw locked to the stud.

7. The electronic device according to claim 6, wherein The stud abuts against that side of the circuit board.

8. The electronic device according to claim 6, wherein The radiator is sleeved on the stud.

9. The electronic device according to claim 8, wherein The stud comprises: A first column section, having a bearing surface facing the circuit board; and A second column section, connecting the bearing surface and abutting against that side of the circuit board, wherein the radiator is borne on the bearing surface and sleeved on the second column section.

10. The electronic device according to claim 9, wherein The radiator includes a spring arm portion. The spring arm portion is sleeved on the second column section and borne on the bearing surface. The radiator is pressed between the heat source and the bearing surface, causing the spring arm portion to elastically deform.

11. The electronic device according to claim 1, wherein, The housing includes a first housing portion and a second housing portion. An accommodating space is formed between the first housing portion and the second housing portion. The radiator is located between the first housing portion and that side of the circuit board. The fixing member is configured to fix the circuit board to the first housing portion and limit the radiator between the first housing portion and that side of the circuit board.

12. The electronic device according to claim 11, wherein The fixing member comprises: A coupling portion, passing through the circuit board and the radiator and fixed to the first housing portion; and A head, connecting the coupling portion and abutting against a side of the circuit board away from the first housing portion.

13. The electronic device according to claim 11, wherein The fixing member comprises: A coupling portion, passing through the second housing portion, the circuit board and the radiator and fixed to the first housing portion; and A head, connecting the coupling portion and abutting against a side of the second housing portion away from the first housing portion.

14. The electronic device according to claim 12 or 13, characterized in that, The radiator includes a spring arm portion. The radiator is pressed between the housing and the heat source, causing the spring arm portion to elastically deform.

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