Server device

Abstract

The embodiment of the invention provides server equipment. The server device comprises a case, a hard disk backboard, a heat dissipation assembly, a plurality of partition plates and a plurality of sets of hard disks. And the hard disk backboard is arranged at the bottom of the case in the case. The hard disk backplane is coupled to the chassis, and the hard disk backplane includes a plurality of data interfaces. The plurality of partition plates are arranged in the case and are separated from one another, and a mounting area for inserting a hard disk is defined between every two adjacent partition plates in the plurality of partition plates; the multiple sets of hard disks are arranged in the corresponding installation areas among the multiple partition plates respectively and detachably coupled to the corresponding data interfaces respectively. The heat dissipation assembly is arranged on one side of the multiple partition plates. The heat dissipation assembly is coupled to the case and can exchange heat with the multiple sets of hard disks. By means of the arrangement, in the case, multiple sets of hard disks can be fixed through the multiple partition plates, the multiple partition plates do not occupy too much space in the case, and the arrangement density of the hard disks can be improved.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to the field of computer system architectures, and more particularly to a server device. Background Art

[0002] Hard disk servers are widely used in scenarios such as data centers, cloud computing platforms, and video surveillance systems. They can store massive amounts of information, ensuring high availability and fast access to data. However, when the hard disk is working, heat is generated. If the heat dissipation is poor and the temperature is too high, it will directly affect the performance of the hard disk and shorten its service life. In some conventional hard disk servers, a hard disk frame can be used as a cold plate waterway, combined with the guide rails on both sides of the hard disk bracket to form a heat dissipation system. The cold plate system consists of two parts of waterways arranged vertically and horizontally, and multiple assembly connection points increase the risk of liquid leakage. Secondly, since the cold plate also undertakes the function of the hard disk chute, its structure is complicated, increasing the processing difficulty and cost. In addition, the relatively thick partition reduces the density of hard disk deployment and affects the space utilization rate of the server. Summary of the Invention

[0003] The purpose of the embodiments of the present disclosure is to provide a server device to at least partially solve the above problems and other potential problems.

[0004] The present disclosure provides a server device. The server device includes: a chassis; a hard disk backplane, which is disposed at the bottom of the chassis in the chassis and is coupled to the chassis, and the hard disk backplane includes a plurality of data interfaces; a plurality of partitions, which are disposed in the chassis and are spaced apart from each other, and an installation area for inserting a hard disk is defined between adjacent partitions among the plurality of partitions; multiple groups of hard disks, which are respectively disposed in the corresponding installation areas between the plurality of partitions and are respectively detachably coupled to the corresponding data interfaces; and a heat dissipation component, which is disposed on one side of the plurality of partitions and is coupled to the chassis to exchange heat with the multiple groups of hard disks.

[0005] It should be understood that the content described in this part is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. Brief Description of the Drawings

[0006] In combination with the drawings and referring to the following detailed description, the above and other features, advantages, and aspects of the embodiments of the present disclosure will become more obvious. In the drawings, the same or similar reference numerals represent the same or similar elements, where:

[0007] Figure 1 A perspective view of the server device according to the embodiment of the present disclosure is shown, where the top shell of the chassis is not shown;

[0008] Figure 2 Shows a top view of the server device according to an embodiment of the present disclosure;

[0009] Figure 3 Shows Figure 2 a cross-sectional view taken along line A-A of;

[0010] Figure 4 Shows a perspective view of the cold plate and the hard disk backplane according to an embodiment of the present disclosure;

[0011] Figure 5 Shows a cross-sectional view of the hard disk according to an embodiment of the present disclosure;

[0012] Figure 6 Shows a perspective view of the hard disk according to an embodiment of the present disclosure; and

[0013] Figure 7 Shows a perspective view of the partition according to an embodiment of the present disclosure.

[0014] Description of reference numerals:

[0015] 10, chassis;

[0016] 20, hard disk backplane; 21, data interface;

[0017] 30, partition; 303, installation area; 31, limit hole; 32, ventilation hole;

[0018] 40, hard disk; 41, hard disk body; 42, hot-swappable component; 421, connecting piece; 4211, first end; 4212, second end; 422, button; 423, elastic member; 43, heat dissipation member; 431, bottom plate; 432, side plate; 433, first heat conduction pad; 434, second heat conduction pad;

[0019] 500, heat dissipation component; 50, cold plate; 51, through hole; 52, water inlet; 53, water return port. Detailed implementation manners

[0020] Hereinafter, the preferred embodiments of the present disclosure will be described in more detail with reference to the drawings. Although the preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be more thorough and complete, and can fully convey the scope of the present disclosure to those skilled in the art.

[0021] As used herein, the term "comprising" and its variations mean open-ended inclusion, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and / or". The term "based on" means "at least partially based on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects.

[0022] As described above, in some conventional hard disk servers, a hard disk frame can be used as a cold plate waterway, and a heat dissipation system is formed in combination with the guide rails on both sides of the hard disk bracket. The cold plate system is composed of two parts of waterways arranged vertically and horizontally, and multiple assembly connection points increase the risk of liquid leakage. Secondly, since the cold plate also undertakes the function of the hard disk chute, its structure is complicated, which increases the processing difficulty and cost. In addition, the relatively thick partition reduces the density of hard disk deployment and affects the space utilization rate of the server.

[0023] Embodiments of the present disclosure provide a server device. The server device includes a chassis, a hard disk backplane, a heat dissipation component, a plurality of partitions, and multiple groups of hard disks. The hard disk backplane is disposed at the bottom of the chassis within the chassis. The hard disk backplane is coupled to the chassis, and the hard disk backplane includes a plurality of data interfaces. The plurality of partitions are disposed within the chassis and spaced apart from each other, and an installation area for inserting a hard disk is defined between adjacent partitions among the plurality of partitions. The multiple groups of hard disks are respectively disposed in corresponding installation areas between the plurality of partitions and are respectively detachably coupled to corresponding data interfaces. The heat dissipation component is disposed on one side of the plurality of partitions. The heat dissipation component is coupled to the chassis and can exchange heat with the multiple groups of hard disks. With this arrangement, within the chassis, the plurality of partitions can fix the multiple groups of hard disks, and the plurality of partitions do not occupy too much space within the chassis, which helps to improve the layout density of the hard disks. In addition, the heat dissipation component is disposed on one side of the chassis, and the structure of the heat dissipation component can be simplified, reducing the assembly connection points, thereby reducing the risk of liquid leakage and the processing difficulty. The principles of the present disclosure will be described in detail below in conjunction with Figures 1 to 7 to describe the principles of the present disclosure in detail.

[0024] As Figures 1 to 3 shown, the server device includes a chassis 10, a hard disk backplane 20, a heat dissipation component 500, a plurality of partitions 30, and multiple groups of hard disks 40.

[0025] The chassis 10 serves as the frame structure of the server device, and an accommodation cavity is formed inside it. Various electronic components can be placed in the accommodation cavity, and multiple support structures and electronic components can be fixed.

[0026] As Figure 3As shown, the hard disk backplane 20 is disposed within the chassis 10 and at the bottom of the chassis 10. The hard disk backplane 20 is coupled to the chassis 10. A plurality of data interfaces 21 are provided on the top surface of the hard disk backplane 20. Each data interface 21 can be detachably connected to a hard disk 40, so that the hard disk backplane 20 is simultaneously connected to a plurality of hard disks 40. It should be understood that the type of the data interface 21 (such as SATA, SAS, NVMe, etc.) can be determined according to factors such as specific application scenarios, performance requirements, budget limitations, and compatibility with other hardware components. In this way, users can select the type of data interface 21 that best suits their needs, thereby enhancing the applicability of the server device.

[0027] As Figure 1 and Figure 2 shown, a plurality of partitions 30 are spaced apart from each other and disposed within the chassis 10. An installation area 303 for inserting the hard disk 40 is defined between adjacent partitions 30. For example, 9 installation areas 303 can be defined between 10 partitions 30. Here, these partitions 30 can function to support the hard disk 40. In some embodiments, these partitions 30 can be made of sheet metal or rigid plastic parts, which can reduce the weight while ensuring the structural strength. The spacing between adjacent partitions 30 is adapted to the size of the hard disk 40, allowing the hard disk 40 to be inserted between adjacent partitions 30. In addition, there is no need to provide a water circuit system within the partition 30, and the thickness of the partition 30 is less than the thickness of the cold plate 50, which can reduce the occupation of the internal space of the chassis 10 by the partition 30, thereby increasing the arrangement quantity and density of the hard disks 40.

[0028] In some embodiments, dedicated limiting structures are provided on the partition 30, and each limiting structure corresponds to a hard disk 40, so that the connection between the hard disk 40 and the partition 30 is both stable and easy to disassemble.

[0029] As Figure 2 shown, multiple groups of hard disks 40 are respectively arranged in the corresponding installation areas 303 between the partitions 30, and each hard disk 40 can be independently connected to the corresponding data interface 21.

[0030] In some embodiments, each group of hard disks 40 can include a plurality of hard disks 40. In other cases, each group of hard disks 40 can be a single hard disk 40, and the single hard disk 40 is located between two adjacent partitions 30. In this way, users can adjust the hard disk 40 configuration according to actual needs, thereby obtaining a higher storage capacity and a stronger data processing ability.

[0031] As Figure 1As shown, the heat dissipation component 500 is disposed on one side of a plurality of partitions 30, for example, at the bottom or one end of the chassis 10. The heat dissipation component 500 can exchange heat with multiple groups of hard disks 40 to maintain the normal operating temperature of the system. The heat dissipation component 500 can be a liquid cooling system or an air cooling system, depending on the requirements of the application environment.

[0032] With this arrangement, the multiple partitions 30 within the chassis 10 can fix multiple groups of hard disks 40 while minimizing the space occupied by the partitions 30 as much as possible, thereby increasing the arrangement quantity and density of the hard disks 40. In addition, the heat dissipation component 500 is disposed on one side of the chassis 10, reducing the assembly connection points, the risk of liquid leakage, and the processing difficulty.

[0033] In some embodiments, as Figure 3 and Figure 4 shown, the heat dissipation component 500 includes a cold plate 50. The cold plate 50 is disposed on the side of the hard disk backplane 20 facing the plurality of partitions 30 and is coupled to the plurality of partitions 30. The cold plate 50 includes a plurality of through holes 51 penetrating the top and bottom surfaces of the cold plate 50. The plurality of through holes 51 respectively correspond to a plurality of data interfaces 21, enabling the plurality of data interfaces 21 to respectively pass through the plurality of through holes 51. In this way, the cold plate 50 is disposed between the hard disk backplane 20 and the plurality of hard disks 40, and the cold plate 50 is in direct contact with the hard disk backplane 20 and the plurality of hard disks 40. The cold plate 50 can take away the heat generated during the operation of the hard disks 40 and the hard disk backplane 20. In addition, the cold plate 50 is disposed on one side of the plurality of hard disks 40, which can reduce the connection points between the waterway systems, thereby reducing the risk of liquid leakage.

[0034] In some embodiments, as Figure 5 and Figure 6 shown, each hard disk 40 includes a hard disk body 41 and a heat dissipation member 43. The heat dissipation member 43 is coupled to the hard disk body 41 and is connected to the cold plate 50. Compared with the traditional air cooling method, the heat dissipation member 43 can quickly conduct the heat generated during the operation of the hard disk body 41 to the cold plate 50, thereby improving the heat transfer efficiency. In this way, the speed of heat transfer from the hard disk body 41 to the cold plate 50 can be accelerated, which helps to maintain the hard disk 40 operating at an appropriate working temperature, thereby potentially improving the working efficiency and stability of the hard disk 40.

[0035] In some embodiments, as Figure 3 and Figure 5As shown, the heat sink 43 includes a bottom plate 431 and side plates 432. The bottom plate 431 is disposed on the side of the hard disk body 41 facing the cold plate 50 and directly abuts against the hard disk body 41 and the cold plate 50. An efficient heat conduction path can be formed among the hard disk body 41, the bottom plate 431, and the cold plate 50. In this way, the heat generated by the hard disk body 41 can be directly transferred to the cold plate 50, thereby improving the speed and efficiency of heat transfer. In addition, the side plates 432 are mounted on the sides of the hard disk body 41 and are coupled to the bottom plate 431. The side plates 432 can absorb heat from the sides of the hard disk body 41, then conduct this heat to the bottom plate 431, and finally transfer this heat to the cold plate 50.

[0036] In some embodiments, as Figure 3 and Figure 5 shown, the heat sink 43 may only include one side plate 432. This side plate 432 is located on one side of the hard disk body 41 and can increase the heat exchange area of the hard disk body 41. In other embodiments, the heat sink 43 may include multiple side plates 432. The multiple side plates 432 are respectively arranged on multiple sides of the hard disk body 41. For example, the heat sink 43 may include four side plates 432. The four side plates 432 can be respectively disposed on the four sides of the hard disk body 41, and can absorb the heat of the hard disk body 41 from all directions, thereby increasing the heat exchange efficiency of the heat sink 43.

[0037] In some embodiments, as Figure 3 and Figure 5 shown, the side plate 432 is a structure formed by bending from the edge of the bottom plate 431. In this way, the integral structure can reduce the contact gap between the side plate 432 and the bottom plate 431, thereby improving the efficiency of heat transfer. Specifically, since there are no additional connection points or seams between the bottom plate 431 and the side plate 432, the heat conduction path is continuous, and the heat generated by the hard disk body 41 can be quickly transferred to the cold plate 50 through the bottom plate 431 and the side plate 432, thereby enhancing the overall heat dissipation performance. In addition, the integral structure can reduce potential failure points, such as connection loosening or material aging problems that may occur during long-term use, ensuring the stability of the heat dissipation performance.

[0038] In other embodiments, the side plate 432 and the bottom plate 431 can be independent components. The side plate 432 and the bottom plate 431 can be connected together in a detachable manner, such as by using methods like threaded connection or riveting. In some embodiments, in cases where high thermal conductivity performance is required, different materials of the bottom plate 431 and the side plate 432 can also be selected for combination.

[0039] In some embodiments, as Figure 5As shown, each hard disk 40 further includes a first thermal pad 433. The first thermal pad 433 is disposed between the side plate 432 and the hard disk body 41, and abuts against the side plate 432 and the hard disk body 41. The first thermal pad 433 can transfer the heat generated during the operation of the hard disk body 41 to the side plate 432. In this way, the heat generated during the operation of the hard disk body 41 can be conducted to the side plate 432 via the first thermal pad 433, and then further transferred to the bottom plate 431 and the cold plate 50, thereby achieving efficient heat dissipation.

[0040] In some embodiments, the first thermal pad 433 can be a flexible thermal pad. The flexible thermal pad not only has good thermal conductivity, but also can adapt to irregular surfaces, which can reduce the contact thermal resistance, thereby improving the overall heat dissipation efficiency. When there are size differences or unevenness between the hard disk body 41 and the side plate 432, the first thermal pad 433 can also ensure efficient heat transfer.

[0041] In some embodiments, as Figure 3 shown, the server device further includes a plurality of second thermal pads 434. The plurality of second thermal pads 434 are respectively disposed between the heat dissipation members 43 of the plurality of hard disks 40 and the cold plate 50. In this way, the second thermal pads 434 can fill the gap between the heat dissipation members 43 and the cold plate 50, which can reduce the contact thermal resistance, so that the heat is conducted from the heat dissipation members 43 to the cold plate 50. In some embodiments, the second thermal pads 434 can also be flexible thermal pads. The second thermal pads 434 have good thermal conductivity and can also adapt to irregular surfaces. When there is a slight misalignment between components, efficient heat transfer can still be achieved, maintaining the hard disk 40 within a suitable operating temperature range, thereby enhancing the overall stability and reliability of the system.

[0042] In some embodiments, as Figure 4 shown, the cold plate 50 includes a water inlet 52, a water outlet, and a flow channel. The flow channel is disposed inside the cold plate 50, and the flow channel is communicated with the water inlet 52 and the water return port 53, and can form a complete cooling medium circulation path. In this way, the cold plate 50 can be connected to an external heat exchange module through the water inlet 52, so as to receive the low-temperature cooling medium transported from the outside. When the low-temperature cooling medium flows in the flow channel, the cooling medium will absorb the heat dissipated by the hard disk 40 and other heating elements, resulting in an increase in its own temperature. The heated cooling medium then flows out of the cold plate 50 through the water outlet and returns to the external heat exchange module for re-cooling. In the external heat exchange module, the high-temperature cooling medium releases the absorbed heat and returns to the low-temperature state again, and then enters the cold plate 50 through the water inlet 52 again to continue to participate in the next round of heat exchange process.

[0043] In some embodiments, as Figure 4As shown, the number of the water inlet 52 and the water return port 53 of the cold plate 50 can each be set to one. With this arrangement, the cooling medium can enter the interior of the cold plate 50 from a single water inlet 52, flow along a preset flow path, and finally flow out through the only water outlet to complete a heat exchange cycle. This method has a simple structure, is convenient for maintenance and installation, and is suitable for application scenarios with relatively low cooling requirements or limited space.

[0044] In other embodiments, in order to improve the cooling efficiency and uniformity, the number of the water inlet 52 and the water outlet can be multiple respectively, so as to form multiple independent or interconnected cooling medium circulation paths in the cold plate 50. By setting multiple flow paths, the cooling medium can be more evenly distributed inside the cold plate 50, so as to efficiently cool the hard disk 40.

[0045] In some embodiments, multiple flow paths can operate independently of each other to cool different regions.

[0046] In other embodiments, multiple flow paths can also be interconnected to ensure more balanced flow of the cooling medium throughout the cold plate 50.

[0047] In some embodiments, the heat dissipation component 500 includes an air cooling module. The air cooling module is arranged at one end of the chassis 10. In this way, the server device can drive the air flow through the air cooling module to take away the heat generated when the hard disk 40 works. Here, the air cooling module does not occupy the space inside the chassis 10, thus increasing the arrangement quantity and density of the hard disks 40.

[0048] In some embodiments, such as Figure 3 and Figure 7 As shown, ventilation holes 32 are provided on each partition 30. When the air cooling module operates, the air flow can flow along these ventilation holes 32 and directly pass through the hard disk 40 installation area 303 between the partitions 30. The air can contact the surface of the hard disk 40 and take away the heat generated by the hard disk 40 during operation. In this way, the heat dissipation efficiency of the hard disk 40 can be improved.

[0049] In some embodiments, such as Figure 5 and Figure 6As shown, each hard disk 40 further includes a hot-swappable component 42. The hot-swappable component 42 is disposed on a side of the hard disk body 41 away from the hard disk backplane 20. The hot-swappable component 42 is coupled to the hard disk body 41, and the hot-swappable component 42 is detachably coupled to the corresponding partition 30. In this way, when it is necessary to increase the storage capacity or replace a faulty hard disk 40, the user can directly operate without shutting down the server, reducing the system downtime and improving the work efficiency. In addition, inserting or removing the hard disk 40 will not cause interference to data transmission or damage to the hardware. Even under high-load operating conditions, the continuity and reliability of the system can be guaranteed.

[0050] In some embodiments, as Figure 6 and Figure 7 shown, a plurality of limiting holes 31 are provided on each partition 30, and these limiting holes 31 can cooperate with the hot-swappable component 42 to ensure the stable installation and convenient disassembly of the hard disk 40. The hot-swappable component 42 includes a connecting member 421 and a button 422. The connecting member 421 is coupled to the hard disk body 41 in a rotatable manner and can be switched between an unlocked position and a locked position to realize the fixation or release of the hard disk 40.

[0051] As Figure 6 shown, the connecting member 421 has opposite first end 4211 and second end 4212. The first end 4211 of the connecting member 421 can be inserted into the limiting hole 31 on the partition 30, and the second end 4212 of the connecting member 421 can be connected to the button 422. The button 422 itself is also coupled to the hard disk body 41 and functions to control the state of the connecting member 421.

[0052] When the connecting member 421 is in the locked position, the first end 4211 of the connecting member 421 will be inserted into the corresponding limiting hole 31, and at the same time the second end 4212 is tightly coupled to the button 422, and the hard disk body 41 can be fixed on the partition 30. Here, the hot-swappable component 42 can also ensure a stable connection between the hard disk body 41 and the hard disk backplane 20, avoiding data transmission problems caused by poor contact. In addition, through the cooperation of the limiting hole 31 and the connecting member 421, the hard disk 40 can remain stable during operation, reducing the risk of potential damage caused by vibration or other external factors.

[0053] When it is necessary to replace or maintain the hard disk 40, the user can operate the button 422 to switch the connecting member 421 from the locked position to the unlocked position. In this state, the first end 4211 of the connecting member 421 will be withdrawn from the limiting hole 31, and at the same time the second end 4212 is separated from the button 422, thus releasing the fixed connection between the partition 30 and the hard disk body 41. At this time, the user can take out the hard disk 40 from between the partitions 30 without shutting down the server device or interrupting the system operation, improving the efficiency and convenience of the maintenance work.

[0054] In some embodiments, as Figure 6 shown, the hot-swap component 42 further includes an elastic member 423. The elastic member 423 is coupled to the hard disk body 41 and the connecting member 421, and the elastic member 423 is adapted to apply a force to the connecting member 421 to move the connecting member 421 toward the unlocking position.

[0055] When the user needs to remove the hard disk 40, the locked state can be released simply by operating the button 422. The elastic member 423 assists in pushing the connecting member 421 from the locked position to the unlocking position, so that the first end 4211 smoothly exits from the limiting hole 31 of the partition plate 30. In this way, the elastic member 423 reduces the force and complexity required for manual unlocking, and facilitates the installation and removal of the hard disk 40 even in a compact or hard-to-reach space. In addition, without external intervention, the connecting member 421 can automatically return to the unlocked state, improving the efficiency of maintenance work.

[0056] Embodiments of the present disclosure are also reflected in the following examples.

[0057] Example 1. A server device, comprising:

[0058] A chassis;

[0059] A hard disk backplane, disposed at the bottom of the chassis within the chassis and coupled to the chassis, and the hard disk backplane includes a plurality of data interfaces;

[0060] A plurality of partition plates, disposed within the chassis and spaced apart from each other, and an installation area for inserting a hard disk is defined between adjacent partition plates among the plurality of partition plates;

[0061] A plurality of groups of hard disks, the plurality of groups of hard disks are respectively disposed in the corresponding installation areas between the plurality of partition plates and are respectively detachably coupled to the corresponding data interfaces; and

[0062] A heat dissipation component, disposed on one side of the plurality of partition plates and coupled to the chassis to exchange heat with the plurality of groups of hard disks.

[0063] Example 2. The server device according to Example 1, wherein the heat dissipation component includes:

[0064] A cold plate, disposed on a side of the hard disk backplane facing the plurality of partition plates and coupled to the plurality of partition plates, and the cold plate includes a plurality of through holes penetrating through a top surface and a bottom surface of the cold plate, and the plurality of through holes respectively correspond to the plurality of data interfaces so that the plurality of data interfaces respectively pass through the plurality of through holes.

[0065] Example 3. The server device according to Example 2, wherein each of the hard disks includes:

[0066] a hard disk body; and

[0067] a heat sink, coupled to the hard disk body and coupled to the cold plate.

[0068] Example 4. The server device according to Example 3, wherein the heat sink includes:

[0069] a bottom plate, disposed on a side of the hard disk body facing the cold plate and abutting against the hard disk body and the cold plate; and

[0070] a side plate, disposed on a side of the hard disk body and coupled to the bottom plate.

[0071] Example 5. The server device according to Example 4, wherein the side plate is a structure bent from an edge of the bottom plate.

[0072] Example 6. The server device according to Example 4, wherein each hard disk further includes:

[0073] a first thermal pad, disposed between the side plate and the hard disk body to transfer heat of the hard disk body to the side plate via the first thermal pad.

[0074] Example 7. The server device according to Example 4, further including:

[0075] a plurality of second thermal pads, respectively disposed between the heat sinks of the plurality of groups of hard disks and the cold plate.

[0076] Example 8. The server device according to any one of Examples 2 to 7, wherein the cold plate includes:

[0077] at least one water inlet;

[0078] at least one water return port; and

[0079] a flow channel, disposed in the cold plate and communicating with the at least one water inlet and the at least one water return port.

[0080] Example 9. The server device according to Example 1, wherein the heat dissipation component includes:

[0081] an air-cooling module, disposed at one end of the chassis.

[0082] Example 10. The server device according to Example 9, wherein ventilation holes are provided on each partition.

[0083] Example 11. The server device according to any one of Examples 3 to 7 and 9 to 10, wherein each hard disk further includes:

[0084] The hot-swap component is disposed on a side of the hard disk body away from the hard disk backplane, and is coupled to the hard disk body, and the hot-swap component is detachably coupled to the corresponding partition board.

[0085] Example 12. The server device according to Example 11, wherein a plurality of limiting holes are provided on each of the partition boards, and the hot-swap component includes:

[0086] A connecting member rotatably coupled to the hard disk body and adapted to switch between an unlocked position and a locked position, the connecting member including a first end and a second end opposite to each other; and

[0087] A button coupled to the hard disk body;

[0088] Wherein when the connecting member is in the locked position, the first end is inserted into the corresponding limiting hole, and the second end is coupled to the button, and when the connecting member is in the unlocked position, the first end is separated from the corresponding limiting hole, and the second end is separated from the button.

[0089] Example 13. The server device according to Example 12, wherein the hot-swap component further includes:

[0090] An elastic member coupled to the hard disk body and the connecting member, and adapted to apply a force to the connecting member to move the connecting member towards the unlocked position.

[0091] The embodiments of the present disclosure have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application or the improvement of the technology in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A server device, comprising: Chassis (10); A hard disk backplane (20) is arranged in the chassis (10) at the bottom of the chassis (10) and is coupled to the chassis (10), and the hard disk backplane (20) includes a plurality of data interfaces (21); A plurality of partitions (30) are arranged in the chassis (10) and are spaced apart from each other, and an installation area (303) for inserting a hard disk (40) is defined between adjacent partitions (30) among the plurality of partitions (30); A plurality of sets of hard disks (40), the plurality of sets of hard disks (40) being respectively arranged in the corresponding installation areas (303) between the plurality of partitions (30), and respectively detachably coupled to the corresponding data interfaces (21); as well as The heat dissipation component (500) is disposed on one side of the plurality of partitions (30) and is coupled to the chassis (10) to perform heat exchange with the plurality of hard disks (40).

2. The server device according to claim 1, wherein the heat dissipation component (500) comprises: A cold plate (50) is arranged on a side of the hard disk backplane (20) facing the plurality of partitions (30) and is coupled to the plurality of partitions (30), and the cold plate (50) comprises a plurality of through holes (51) penetrating the top surface and the bottom surface of the cold plate (50), the plurality of through holes (51) respectively corresponding to the plurality of data interfaces (21), so that the plurality of data interfaces (21) respectively pass through the plurality of through holes (51).

3. The server device according to claim 2, wherein each of the hard disks (40) comprises: Hard disk body (40); as well as The heat sink (43) is coupled to the hard disk body (40) and to the cold plate (50).

4. The server device according to claim 3, wherein the heat sink (43) comprises: a bottom plate (431), arranged on a side of the hard disk body (40) facing the cold plate (50), and abutting against the hard disk body (40) and the cold plate (50); and The side plate (432) is arranged on the side of the hard disk body (40) and is coupled to the bottom plate (431).

5. The server device according to claim 4, wherein the side plate (432) is a structure bent from the edge of the bottom plate (431).

6. The server device according to claim 4, wherein each of the hard disks (40) further comprises: The first thermal pad (433) is arranged between the side plate (432) and the hard disk body (40) so as to transfer the heat of the hard disk body (40) to the side plate (432) via the first thermal pad (433).

7. The server device according to claim 4, further comprising: A plurality of second thermally conductive pads (434) are respectively arranged between the heat sink (43) and the cold plate (50) of the plurality of hard disk groups (40).

8. The server device according to any one of claims 2 to 7, wherein the cold plate (50) comprises: at least one water inlet (52); at least one water return port (53); as well as A flow channel is arranged in the cold plate (50) and is in communication with the at least one water inlet (52) and the at least one water return port (53).

9. The server device according to claim 1, wherein the heat dissipation component (500) comprises: An air cooling module is arranged at one end of the chassis (10).

10. The server device according to claim 9, wherein each of the partitions (30) is provided with a ventilation hole (32).

11. The server device according to any one of claims 3 to 7 and 9 to 10, wherein each of the hard disks (40) further comprises: A hot-swap component (42) is arranged on a side of the hard disk body (40) away from the hard disk backplane (20) and is coupled to the hard disk body (40), and the hot-swap component (42) is detachably coupled to the corresponding partition (30).

12. The server device according to claim 11, wherein each of the partitions (30) is provided with a plurality of limiting holes (31), and the hot-swap assembly (42) comprises: a connecting member (421) rotatably coupled to the hard disk body (40) and adapted to switch between an unlocked position and a locked position, the connecting member (421) comprising a first end (4211) and a second end (4212) opposite to each other; and A button (422), coupled to the hard disk body (40); When the connecting member (421) is in the locked position, the first end (4211) is inserted into the corresponding limiting hole (31), and the second end (4212) is coupled to the button (422), and when the connecting member (421) is in the unlocked position, the first end (4211) is separated from the corresponding limiting hole (31), and the second end (4212) is separated from the button (422).

13. The server device according to claim 12, wherein the hot-swap component (42) further comprises: The elastic member (423) is coupled to the hard disk body (40) and the connecting member (421), and is suitable for applying a force to the connecting member (421) to move the connecting member (421) toward the unlocking position.

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