Substrate clamping device for substrate chuck and tool and method for debugging substrate clamping device

By designing a substrate clamping device including a mounting base, a positioning part, a driving part and a clamping part on the substrate chuck, the problem of unstable substrate clamping state is solved, and stable clamping and efficient etching and cleaning of the substrate are realized.

CN120221491APending Publication Date: 2025-06-27ACM RES (SHANGHAI) INC
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Patent Information

Application Number
CN202311811775.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-12-26
Publication Date
2025-06-27

AI Technical Summary

Technical Problem

The clamping state of the substrate clamping mechanism is unstable during the operation, resulting in problems such as substrate tilt, poor concentricity, shaking, fragments and liquid splashing, affecting the etching effect and cleaning effect.

Method used

A substrate clamping device for a substrate chuck is designed, including a mounting base, a positioning unit, a driving unit and a clamping unit. The positioning part fixes the relative positions of the first push rod and the second push rod through a locking member to ensure that it does not rotate in the groove, thereby stably clamping the substrate.

Benefits of technology

Through the design of the substrate clamping device, the stability of substrate clamping is ensured, the substrate is shaken and the splash of medicine liquid is avoided, and the etching and cleaning effect is improved.

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Abstract

The invention provides a substrate clamping device for a substrate chuck and a tool and method for debugging the substrate clamping device. The substrate clamping device comprises a mounting seat, a positioning part, a driving part and a clamping part, and the mounting seat is used for fixing the substrate clamping device to a substrate chuck; the positioning part is used for being arranged in the groove and comprises a locking piece, a first push rod and a second push rod, the first push rod and the second push rod are movably connected, the locking piece is used for fixing the relative position of the first push rod and the second push rod, and the positioning part is matched with the groove in size so that the positioning part cannot rotate in the groove; the driving part is connected with the mounting seat and used for driving the first push rod and the second push rod to move in the groove; the clamping part is rotatably connected with the mounting base through a rotating shaft, the clamping part is provided with a contact end and a connecting end, the contact end is used for making contact with the substrate, the connecting end is connected with the first push rod, and when the first push rod moves, the connecting end is driven to move, and meanwhile the clamping part is driven to rotate and the contact end is driven to move.
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Description

Technical Field

[0001] This application mainly relates to the field of semiconductor technology, and particularly to a substrate clamping device for a substrate chuck, as well as a tooling and method for debugging the substrate clamping device. Background Art

[0002] In the backside cleaning and etching process of a substrate single wafer cleaning machine, a clamping mechanism is usually used to clamp the substrate. The clamping mechanism is arranged in a groove of the chuck. The piston rod on the clamping mechanism is in the groove, and the outer end of the piston rod is connected to a substrate clamping pin. By moving the position of the piston rod, the angle of the substrate clamping pin can be adjusted to clamp or loosen the substrate. When the angle of the substrate clamping pin is determined, a lock nut located in the groove is used to fix the position of the piston rod, so as to fix the angle of the substrate clamping pin. However, during the operation, the lock nut sometimes rotates in the groove, resulting in instability of the clamping mechanism, leading to problems such as substrate tilt and poor substrate concentricity, and further causing problems such as substrate wobbling, fragmentation, liquid medicine splashing, and uneven etching rate at the front edge, affecting the etching effect and cleaning effect. Summary of the Invention

[0003] The technical problem to be solved by this application is the problem of unstable clamping state of the substrate clamping mechanism during the operation.

[0004] To solve the above technical problem, this application provides a substrate clamping device for a substrate chuck. The substrate chuck has a groove for setting the substrate clamping device. The groove extends along a first direction and includes a mounting seat, a positioning part, a driving part, and a clamping part. Among them, the mounting seat is used to fix the substrate clamping device to the substrate chuck; the positioning part is used to be arranged in the groove. The positioning part includes a locking member, a first push rod, and a second push rod. The first push rod and the second push rod are movably connected. The locking member is used to fix the relative positions of the first push rod and the second push rod. Among them, the positioning part is adapted to the size of the groove so that the positioning part does not rotate in the groove; the driving part is connected to the mounting seat and is used to drive the first push rod and the second push rod to move in the groove; the clamping part is rotatably connected to the mounting seat through a rotating shaft. The clamping part has a contact end and a connection end. The contact end is used to contact the substrate, and the connection end is connected to the first push rod. When the first push rod moves, it drives the connection end to move, and at the same time drives the clamping part to rotate and drives the contact end to move.

[0005] The present application also provides a tooling for debugging a substrate clamping device to solve the above technical problems, which includes a simulation chuck device and a simulation substrate device. A plurality of clamping device mounting positions are provided on the simulation chuck device, and each clamping device mounting position is used to mount one of the substrate clamping devices. The simulation substrate device includes a simulation edge for simulating the edge of the substrate. When debugging the substrate clamping device, the clamping part of each substrate clamping device is used to clamp the simulation edge.

[0006] The present application also provides a method for adjusting a substrate clamping device to solve the above technical problems. The method is applied to the substrate clamping device as described above and includes: adjusting the relative positions of the first push rod and the second push rod, and further adjusting the rotation position of the clamping part so that the contact end is located at the target position and contacts the substrate edge; fixing the relative positions of the first push rod and the second push rod through the locking member.

[0007] The locking member and the first push rod in the positioning part of the substrate clamping device of the present application will not rotate in the groove of the substrate chuck, so that it can be ensured that the substrate clamping device will not shake during operation. According to the tooling and method of the present application, multiple substrate clamping devices can be conveniently debugged, so that the clamping degrees of the multiple substrate clamping devices are adjusted uniformly, ensuring the stability of the substrate during the process after being loaded onto the machine. Description of the Drawings

[0008] Including the drawings is to provide a further understanding of the present application. They are incorporated and constitute a part of the present application. The drawings show embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the drawings:

[0009] Figure 1 is a schematic structural diagram of a substrate chuck equipped with a substrate clamping mechanism;

[0010] Figure 2 is Figure 1 a side view of the substrate clamping mechanism in ;

[0011] Figure 3 is Figure 1 a schematic diagram of the positional relationship between the locking nut and the groove when the substrate clamping mechanism in is arranged in the groove;

[0012] Figure 4 is a cross-sectional view of a substrate clamping device for a substrate chuck according to an embodiment of the present application;

[0013] Figure 5 is Figure 4 a three-dimensional schematic diagram of a partial structure in the substrate clamping device in ;

[0014] Figure 6Schematic diagram of the positional relationship between the locking member and the groove when the substrate clamping device of the present application is disposed in the groove;

[0015] Figure 7 Schematic perspective view of the substrate clamping device according to another embodiment of the present application;

[0016] Figure 8 Is Figure 7 Cross-sectional view of the substrate clamping device;

[0017] Figure 9 Schematic perspective view of the tooling for debugging the substrate clamping device according to an embodiment of the present application;

[0018] Figure 10 Is Figure 9 Cross-sectional view when the simulated chuck device and the simulated substrate device in the tooling shown are in a separated state;

[0019] Figure 11 Is Figure 9 Top view of the tooling shown;

[0020] Figure 12 Is Figure 11 Cross-sectional view along line CC in;

[0021] Figure 13 Schematic perspective view of the tooling for the substrate clamping device according to another embodiment of the present application;

[0022] Figure 14 And Figure 15 Both are Figure 13 Schematic perspective view when the simulated chuck device and the simulated substrate device in the tooling shown are in a separated state;

[0023] Figure 16 Is Figure 13 Top view of the tooling shown;

[0024] Figure 17 Is Figure 16 Cross-sectional view along line HH in;

[0025] Figure 18 Exemplary flowchart of the adjustment method of the substrate clamping device according to an embodiment of the present application;

[0026] Figures 19 to 23 The process diagram of the adjustment method of the substrate clamping device according to an embodiment of the present application is shown as follows. Detailed implementation manners

[0027] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. Unless obvious from the language context or otherwise stated, the same reference numerals in the drawings represent the same structure or operation.

[0028] As shown in the present application, unless the context clearly indicates an exceptional situation, words such as "a", "an", "one", and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0029] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and numerical values described in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience of description, the sizes of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0030] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal", and "top, bottom" are usually based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the protection scope of the present application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0031] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations are made for the spatial relative descriptions used herein.

[0032] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used, but also through the meanings implied by each term.

[0033] Flowcharts are used in this application to illustrate the operations performed by the systems according to the embodiments of this application. It should be understood that the operations before or below do not necessarily need to be executed precisely in sequence. On the contrary, they can be executed in reverse order or simultaneously. At the same time, other operations may be added to these processes, or one or several steps of operations may be removed from these processes.

[0034] Figure 1 is a schematic structural diagram of a substrate chuck equipped with a substrate clamping mechanism. As Figure 1As shown, the substrate chuck 110 is generally a disk with a certain thickness, and has some grooves 111 on one of its surfaces. A substrate clamping mechanism 120 is provided in each groove 111. Specifically, there are 6 grooves 111 on the substrate chuck 110, and each groove 111 extends along the radial direction of the substrate chuck 110 and points to the center of the circle. The substrate clamping mechanism 120 is arranged at the end near the outer periphery in the groove 111. A positioning hole 112 is provided at this end. The substrate clamping mechanism 120 has a mounting seat 121 and a fixing member 122. The fixing member 122 is, for example, a screw. The fixing member 122 can pass through the positioning hole 112 and be tightened, so that the substrate clamping mechanism 120 is fixed in the groove 111 through the mounting seat 121.

[0035] Figure 2 is Figure 1 a side view of the substrate clamping mechanism in. As Figure 2 shown, a connecting block 123 is provided below the mounting seat 121 of the substrate clamping mechanism 120, and the connecting block 123 is connected to the housing of a cylinder 129. A clamping portion 127 is also provided on the mounting seat 121. The clamping portion 127 is connected to the mounting seat 121 through a rotating shaft 126. The cylinder 129 has a piston rod 124. The upper end of the clamping portion 127 is used to directly contact the substrate when clamping the substrate, and the lower end is connected to the piston rod 124. When the position of the piston rod 124 changes, it will drive the lower end of the clamping portion 127 to move. At the same time, the clamping portion 127 rotates around the rotating shaft 126, so as to adjust the position of the upper end of the clamping portion 127. Specifically, the piston rod 124 generally includes two sections of push rods. One section is an internal push rod 124a, which is partially located inside the cylinder 129, and the other section is an external push rod 124b, which is located outside the cylinder 129. The two sections of push rods are movably connected, and are locked and fixed by a lock nut 125 between the two sections of push rods, so as to limit the length of the piston rod 124 and the clamping position or release position of the clamping portion 127. In Figure 2 when the cylinder 129 is ventilated, the internal push rod 124a moves to the right and drives the external push rod 124b to move to the right, so that the clamping portion 127 moves to the left to be in the clamping position to clamp the substrate. Figure 3 shows a schematic diagram of the positional relationship between the lock nut 125 and the groove 111 when the substrate clamping mechanism 120 is arranged in the groove 111. Since the sizes of the lock nut 125 and the piston rod 124 are relatively small, during long-term operation, the lock nut 125 may rotate by itself, resulting in loosening between the two sections of push rods of the piston rod 124, changing the length of the piston rod 124, which will cause the clamping position of the clamping portion 127 to change, resulting in unstable substrate clamping, and bringing about adverse consequences such as substrate shaking, fragmentation, liquid medicine splashing, uneven etching rate of the front edge, etc.

[0036] Figure 4is a cross-sectional view of a substrate clamping device for a substrate chuck according to an embodiment of the present application. The substrate clamping device 400 of the present application can be disposed in the groove 111 of the substrate chuck 110 shown in Figure 1 . Therefore, the substrate chuck 110 in Figure 1 will be described hereinafter. However, the present application does not limit the extending direction of the groove 111, and it is not limited to Figure 1 . The extending direction of the groove 111 is defined as the first direction. It should be further noted that the substrate includes a wafer, but the shape of the substrate is not limited to a circular shape and can be any shape. Therefore, the shape of the substrate chuck 110 is adapted to the shape of the substrate to be processed.

[0037] Referring to Figure 4 , the substrate clamping device 400 includes a mounting base 410, a positioning portion 420, a clamping portion 430, and a driving portion 440. Among them, the mounting base 410 is used to fixedly mount the substrate clamping device 400 as a whole to the substrate chuck 110. The mounting base 410 is structurally adapted to the groove 111. For example, similar to that shown in Figure 1 , the mounting base 410 can be fixedly disposed in the groove 111 by the cooperation of the fixing member 122 and the positioning hole 112 on the groove 111. The positioning portion 420 includes a locking member 421, a first push rod 422, and a second push rod 423. The first push rod 422 and the second push rod 423 are movably connected (for example, threadedly connected). The locking member 421 is used to fix the relative positions of the first push rod 422 and the second push rod 243. Among them, the positioning portion 420 is adapted to the size of the groove 111 so that the positioning portion 420 will not rotate in the groove 111. The clamping portion 430 is rotatably connected to the mounting base 410 through a rotating shaft 431. The clamping portion 430 has a contact end 432 and a connection end 433. The contact end 432 is used to contact the substrate, and the connection end 433 is connected to the first push rod 422. When the first push rod 422 moves, it drives the connection end 433 to move, and at the same time drives the clamping portion 430 to rotate and drives the contact end 432 to move. A connecting member 411 is disposed below the mounting base 410, and the driving portion 440 is fixed below the mounting base 410 through the connecting member 411. After being assembled, both the positioning portion 420 and the driving portion 440 are located in the groove 111, and the driving portion 440 is used to drive the first push rod 422 and the second push rod 423 to move in the groove 111 along the first direction.

[0038] In this embodiment, the driving portion 440 is specifically implemented as a cylinder. As shown in Figure 4, One end of the second push rod 423 is arranged inside the cylinder, and the other end is connected to the first push rod 422. When the cylinder is ventilated, it pushes the second push rod 423 to move rightward, and the spring 441 is compressed. Since the right end of the second push rod 423 abuts against the inside of the first push rod 422, the first push rod 422 can be pushed to move rightward as well. In this example, the first push rod 422 is screwed around the periphery of the second push rod 423. Therefore, by rotating the piston end 422a of the first push rod 422, the relative positions of the first push rod 422 and the second push rod 423 can be adjusted. In Figure 4 , the locking member 421 is sleeved around the outer periphery of the second push rod 423. When the relative positions of the first push rod 422 and the second push rod 423 are determined, the first push rod 422 can be locked by the locking member 421, so that the relative positions of the first push rod 422 and the second push rod 423 are fixed. The first push rod 422 and the second push rod 423 together form a piston rod.

[0039] It should be noted that using the cylinder as the driving part 440 is one implementation manner to push the first push rod 422 and the second push rod 423 to move. In other embodiments, other mechanical devices can also be used as the driving part to push the first push rod 422 and the second push rod 423 to move.

[0040] Figure 5 shows Figure 4 a three-dimensional schematic diagram of a partial structure in the substrate clamping device in , which includes a locking member 421, a first push rod 422, and a clamping part 430. Among them, the locking member 421 is specifically implemented as a locking nut, such as a hexagonal nut. The locking member 421 is arranged at one end 427 of the first push rod 422, specifically the end far from the piston end 422a. The locking member 421 is also arranged around the outer periphery of the second push rod 423. When the relative positions of the first push rod 422 and the second push rod 423 are determined, locking the locking member 421 can fix the relative positions of the first push rod 422 and the second push rod 423.

[0041] As Figure 4 shows, in some embodiments, the first push rod 422 has a threaded hole 424, the second push rod 423 is screwed into the threaded hole 424, the second push rod 423 also has an external thread, and the locking member 421 locks the first push rod 422 or the second push rod 423 through this external thread to fix the relative positions of the first push rod 422 and the second push rod 423.

[0042] In some embodiments, as Figure 5 shown, the locking member 421 and the first push rod 422 are fixedly connected by a first fixing member 428. Specifically, the first fixing member 428 can be a set screw.

[0043] Figure 6The positional relationship between the locking member 421 and the groove 111 is shown when the substrate clamping device 400 of the present application is disposed in the groove 111. In this embodiment, the locking member 421 has a first height H1 and a first width W1, and the groove 111 has a groove depth H0 and a groove width W0. The first width W1 is adapted to the groove width W0, that is, the first width W1 is less than or equal to the groove width W0, so that the locking member 421 cannot rotate relative to the groove 111. When designing W1 = W0, due to reasons such as tolerances, there may not be a perfect fit between the locking member 421 and the inner wall of the groove 111, but there is a certain gap. The adaptation of the first width W1 to the groove width W0 means that this gap is small enough to ensure that the locking member 421 will not rotate relative to the groove 111.

[0044] In some embodiments, the first height H1 may be greater than the groove depth H0, so that the locking member 421 protrudes from the groove 111. It should be noted that the bottom of the locking member 421 generally does not contact the bottom of the groove 111.

[0045] In some embodiments, the locking member 421 has two oppositely arranged parallel faces 425, 426, and both of these two parallel faces 425, 426 are parallel to the groove wall of the groove 111. The first width W1 is the distance between these two parallel faces 425, 426. Through such a setting, it is further ensured that the locking member 421 will not rotate in the groove 111.

[0046] Reference Figure 5 , the height and width of the first push rod 422 are substantially the same as those of the locking member 421. However, their outer contours can be different.

[0047] In some embodiments, the cross-sectional area of the first push rod 422 is less than or equal to the cross-sectional area of the locking member 421. Then, when both are placed in the groove 111, since the locking member 421 and the first push rod 422 are also locked to each other and will not rotate relative to each other when the position of the first push rod 422 is fixed, therefore, by setting the first width of the locking member 421, the first push rod 422 will not rotate in the groove 111 either.

[0048] In some embodiments, the first push rod 422 has two oppositely arranged parallel faces, reference Figure 5 , and both of these two parallel faces are parallel to the groove wall of the groove 111. Such a setting also further ensures that the first push rod 422 will not rotate in the groove 111.

[0049] In some other embodiments, the first push rod 422 has a second height H2 and a second width W2, and the groove 111 has a groove depth H0 and a groove width W0. The second width W2 is adapted to the groove width W0 such that the first push rod 422 does not rotate in the groove 111. In these embodiments, the size of the locking member 421 can be smaller than the size of the first push rod 422, and the fact that the first push rod 422 does not rotate ensures that the locking member 421 also does not rotate.

[0050] In some embodiments, the second height H2 is greater than the groove depth H0.

[0051] In some embodiments, the sizes and shapes of the first push rod 422 and the locking member 421 are each set to ensure that they do not rotate in the groove 111.

[0052] It should be noted that since the first push rod 422 is sleeved on the outer periphery of the second push rod 423, the cross-sectional area of the first push rod 422 is larger than the cross-sectional area of the second push rod 423. The size of the first push rod 422 and / or the locking member 421 can be used to characterize the maximum outer dimension of the positioning portion 420. By setting the sizes of the first push rod 422 and / or the locking member 421 to be adapted to the groove 111, it can be ensured that the positioning portion 420 as a whole does not rotate in the groove 111, and at the same time, it can also be ensured that the second push rod 423 does not rotate. In some other embodiments, the right end of the second push rod 423 can be set to have a structure similar to the left end of the first push rod 422, and the right end of the second push rod 423 is sleeved on the outer periphery of the first push rod 422 with a smaller size. Then, the size of the right end of the second push rod 423 can be set to be adapted to the size of the groove 111 so that the positioning portion 420 does not rotate in the groove 111.

[0053] Figure 7 and Figure 8 respectively show a cross-sectional view of a three-dimensional view of a substrate clamping device according to another embodiment of the present application. Similar to Figure 4 the embodiment shown, the substrate clamping device 700 of this embodiment also includes a mounting base 710, a positioning portion 720, a clamping portion 730, and a driving portion 750. The driving portion 750 is specifically implemented as a cylinder. The mounting base 710 is connected to the driving portion 750 through a connecting block 711. Specifically, the connecting block 711 is connected to the outer shell of the cylinder. A part of the second push rod 740 in the positioning portion 720 is located in the cylinder. The second push rod 740 is movably connected to the first push rod 722. The locking member 721 is sleeved on the second push rod 740 and is used to lock the first push rod 722 and the second push rod 740. Among them, the positioning portion 720 further includes a sleeve 723. The sleeve 723 wraps around the outer periphery of the locking member 721 and the first push rod 722. When the positioning portion 720 is disposed in the groove 111, the sleeve 723 is disposed in the groove 111 and does not rotate.

[0054] In some embodiments, the sleeve 723 has a third height H3 and a third width W3, and the groove 111 has a groove depth H0 and a groove width W0. The third width W3 is adapted to the groove width W0 such that the sleeve 723 does not rotate in the groove 111.

[0055] In some embodiments, the third height H3 is greater than the groove depth H0.

[0056] Similar to the locking member 421 and the first push rod 422, two opposite parallel faces may be provided on the sleeve 723. Figure 7 One of the parallel faces 724 is shown in the figure, and both of the two parallel faces are parallel to the groove wall of the groove 111.

[0057] As Figure 7 shown, the sleeve 723 further includes at least one fixing member 725. The fixing member 725 penetrates the barrel wall of the sleeve 723 and is used to fix the sleeve 723 on the outside of the locking member 721 or the first push rod 722. Specifically, the fixing member 725 may be a setscrew.

[0058] As Figure 8 shown, a part of the first push rod 722 is located inside the sleeve 723. As Figure 8 shown, the inner end of the fixing member 725 contacts the outer surface of the first push rod 722 to directly fix the relative positions of the first push rod 722 and the sleeve 723. In other embodiments, the inner end of the fixing member 725 may also contact the outer surface of the locking member 721 to directly fix the locking member 721 and the sleeve 723.

[0059] As Figure 8 shown, in this embodiment, the first push rod 722 has a threaded hole 726, and the second push rod 740 is screwed into the threaded hole 726. The locking member 721 is provided on the outer periphery of the second push rod 740 and is used to lock the first push rod 722 or the second push rod 740 to fix the relative positions of the first push rod 722 and the second push rod 740. This application does not limit how the locking member 721 locks. As Figure 8 shown, in this embodiment, the locking member 721 has an internal thread, and the second push rod 740 is also screwed to the locking member 721.

[0060] As Figure 7 and Figure 8, the cylinder serving as the driving part 750 is connected to a gas source through a gas interface 751. A part of the second push rod 740 is disposed in the internal space of the cylinder 750, and a spring 752 is disposed on the outer periphery of the second push rod 740. When the cylinder operates, the second push rod 740 is forced to move in the first direction and compress or stretch the spring 752. According to such an embodiment, a cylinder can be used to control the position of the second push rod 740 in the groove 111, thereby controlling the position of the first push rod 722, and further controlling the position of the clamping part 730, so that the substrate clamping device 700 can clamp or release the substrate as required, and in the case of long-term operation, the positioning part 720 will not rotate in the groove 111, ensuring the stability of substrate clamping.

[0061] Before using the above substrate clamping device, it is often necessary to debug the substrate clamping device to determine the position of the clamping part to effectively clamp the substrate. The present application also proposes a tooling for debugging the above substrate clamping device.

[0062] Figure 9 is a perspective schematic view of the tooling of the substrate clamping device according to an embodiment of the present application. Figure 10 is Figure 9 a sectional view showing the state where the simulated chuck device and the simulated substrate device in the shown tooling are separated. Figure 11 is Figure 9 a top view of the shown tooling. Figure 12 is Figure 11 a sectional view taken along line CC in Figures 9 to 12 As shown in combination with

[0063] As Figure 9 and Figure 10, several fixing blocks 941, 942, 943 can be used to fixedly install each substrate clamping device 930 on the simulation chuck device 910, and this application does not limit how to install specifically. It should be noted that the shape and size of the simulation chuck device 910 are the same as those of the actual substrate chuck, and the clamping device installation position 911 is the same as the installation position of the substrate clamping device in the actual process. The distance or height between the simulation chuck device 910 and the simulation substrate device 920 is also the same as the actual process requirements. It should be noted that during use, the simulation substrate device 920 can be arranged on a horizontal table to ensure that each substrate clamping device 930 is on the same horizontal plane.

[0064] As Figure 10 shown, at the center of the simulation chuck device 910, there is a first pair of middle parts, specifically a positioning groove 912, and at the center of the simulation substrate device 920, there is a second pair of middle parts, specifically a positioning protrusion 922. The positioning groove 912 and the positioning protrusion 922 can cooperate with each other to align the centers of the simulation chuck device 910 and the simulation substrate device 920.

[0065] As Figure 10 shown, the simulation edge 921 is a circular edge similar to the substrate edge, which is used to contact the contact end 932 on the clamping part 931. The shape of the simulation edge 921 is the same as the shape of the substrate to be simulated. During debugging, by adjusting the relative positions of the first push rod and the second push rod in the positioning part 933, the contact end 932 just contacts the simulation edge 921, and then the relative positions of the first push rod and the second push rod are fixed by the locking part in the positioning part 933. The substrate clamping device 930 is removed from the simulation chuck device 910 and installed on the actual substrate chuck. At this time, the clamping state of the substrate clamping device 930 on the substrate is the same as the clamping state on the tooling.

[0066] As Figure 12 shown, the diameter of the simulation edge 921 is D. In some embodiments, the diameter D of the simulation edge 921 is smaller than the actual diameter of the substrate to be simulated, which is used to debug the position of the clamping part when the substrate clamping device clamps the substrate. In other embodiments, the diameter D of the simulation edge 921 is larger than the actual diameter of the substrate to be simulated, which is used to debug the position of the clamping part when the substrate clamping device releases the substrate.

[0067] Combined with Figure 9 and Figure 12 , in this embodiment, the simulation chuck device 910 is located above the simulation substrate device 920, and the clamping part 931 extends downward to clamp the simulation edge 921.

[0068] Figure 13 is a three-dimensional schematic diagram of the tooling of the substrate clamping device in another embodiment of this application.Figure 14 And Figure 15 both are Figure 13 A perspective schematic view when the simulation chuck device and the simulation substrate device in the shown tooling are in a separated state. Figure 16 is Figure 13 A top view of the shown tooling. Figure 17 is Figure 16 A cross-sectional view along line HH in Figures 13 to 17 As shown in Figure 13 a plurality of fixing blocks 1341, 1342 are shown in Figure 13 for fixedly mounting each substrate clamping device 1330 on the simulation chuck device 1310.

[0069] As Figure 15 , in this embodiment, the first pair of middle parts at the center of the simulation chuck device 1310 are positioning holes 1312, 1313, and the second pair of middle parts at the center of the simulation substrate device 1320 are positioning shafts 1322, 1323. During mating, the positioning hole 1312 and the positioning shaft 1322 are in clearance fit, and the positioning hole 1313 and the positioning shaft 1323 are in threaded fit, so that the centers of the simulation chuck device 1310 and the simulation substrate device 1320 are aligned.

[0070] In other embodiments, the first pair of middle parts can be positioning shafts, and the second pair of middle parts can be positioning holes.

[0071] As Figure 14 and Figure 17 shown, a plurality of adjusting columns 1350 are provided on the surface of the simulation chuck device 1310 facing the simulation substrate device 1320 to adjust the distance d between the simulation chuck device 1310 and the simulation substrate device 1320. This distance d can be adjusted according to actual needs. After the adjustment of the distance d is completed, lock the first pair of middle parts and the second pair of middle parts to fix this distance d.

[0072] According to the tooling of the present application, the relative positions of the first push rod and the second push rod in the positioning part can be conveniently adjusted, so as to adjust the position when the clamping part clamps the substrate or the position when the substrate is released in each substrate clamping device, and the relative positions of the first push rod and the second push rod are fixed by the locking parts in the positioning part.

[0073] Figure 18 FIG. is an exemplary flowchart of an adjustment method for a substrate clamping device according to an embodiment of the present application. This adjustment method can be used to adjust the substrate clamping device, and can be adjusted on the tooling described above. All the content about the substrate clamping device and the tooling above can be used to illustrate this adjustment method. However, this adjustment method can also be directly executed on an actual substrate chuck and substrate. As Figure 18 shown, the adjustment method of this embodiment includes the following steps:

[0074] Step S1810: Adjust the relative positions of the first push rod and the second push rod, and further adjust the rotation position of the clamping part so that the contact end is located at the target position and contacts the substrate edge;

[0075] Step S1820: Fix the relative positions of the first push rod and the second push rod through the locking part.

[0076] The following combines Figure 19 and Figure 20 to illustrate the above steps.

[0077] Figures 19 to 23 FIG. shows a process diagram of the adjustment method for the substrate clamping device, specifically the process of adjusting the position of the clamping part of the substrate clamping device 1900 in the state of clamping the substrate. The substrate clamping device 1900 shown is only an example, and the method steps can be implemented by using the tooling 900 as shown in Figure 9 shown. Due to the use of the tooling 900, the substrate edge in steps S1810 and S1820 is the simulated edge 921. As Figure 19 shown, initially, the substrate clamping device 1900 is installed at the clamping device installation position on the tooling. At this time, there is a large gap G1 between the contact end 1931 of the clamping part 1930 and the simulated edge 921. For the embodiment including a cylinder, at this time, the cylinder 1950 is in an unventilated state. Under the action of the spring 1952, the left end 1941 of the second push rod 1940 abuts against the left side 1951 in the inner space of the cylinder 1950, and the clamping part 1930 is in the maximum open state. As Figure 20 shown, after the cylinder 1950 is ventilated, the second push rod 1940 and the first push rod 1920 move to the right, the spring 1952 is compressed, and the left end 1941 of the second push rod 1940 abuts against the right side 1953 in the inner space of the cylinder 1950. At this time, the contact end 1931 may or may not contact the simulated edge 921. In Figure 20In the illustrated example, the contact end 1931 does not contact the simulation edge 921. Specifically, at this time, there is a gap G2 between the contact end 1931 and the simulation edge 921, and G2 is smaller than G1. At this time, step S1810 includes:

[0078] Step S1811: Adjust the position of the locking member 1921 to lock the position of the second push rod 1940. As Figure 21 shown, this step is specifically to move the locking member 1921 to the right end 1954 of the cylinder 1950 and lock the position of the second push rod 1940 here.

[0079] Step S1812: Move the first push rod 1920 so that the contact end 1931 contacts the simulation edge 921. As Figure 22 shown, the first push rod 1920 is moved to the right, increasing the sum L of the lengths of the first push rod 1920 and the second push rod 1940, and at the same time driving the contact end 1931 to move to the left. It should be noted that since multiple substrate clamping devices are required for substrate clamping, in this step, each substrate clamping device is adjusted separately or simultaneously so that each contact end 1931 contacts the simulation edge 921.

[0080] Step S1813: When the contact end 1931 contacts the simulation edge 921, stop adjusting the position of the first push rod 1920. Figure 22 shows a gap G3, indicating that the contact end 1931 and the simulation edge 921 just contact. The horizontal distance of this gap G3 can be 0 or a small value greater than 0, such as 0.02 - 0.03 mm.

[0081] When debugging with the simulated substrate device, for example, if the actual diameter of the substrate is 300 mm, the diameter of the simulation edge can be designed to be 299.6 mm, so as to ensure sufficient and stable clamping force during use.

[0082] The process of adjusting the position of the clamping part of the substrate clamping device 1900 in the state of releasing the substrate is similar to the above process.

[0083] In these embodiments, step S1820 is specifically implemented as: Move the locking member 1921 to the end 1922 of the first push rod 1920 close to the locking member 1921 and lock the locking member 1921. As Figure 23 shown, the locking member 1921 abuts against the end 1922 of the first push rod 1920, fixing the first push rod 1920 at this position and completing the adjustment of the rotation position of the clamping part 1930. In this step, since the locking member 1921, the first push rod 1920, and the second push rod 1940 are all thread - connected, when the air supply of the cylinder ends, the relative positions of the first push rod 1920 and the second push rod 1940 will not change.

[0084] According to the substrate clamping device, the tooling for debugging the substrate clamping device, and the debugging method of the present application, the clamping degrees of a plurality of substrate clamping devices to be used can be adjusted to be consistent before being put into use, ensuring the stability of the substrate during the process after being put into use.

[0085] The basic concepts have been described above. Obviously, for those skilled in the art, the above application disclosure is only an example and does not constitute a limitation to the present application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to the present application. Such modifications, improvements, and corrections are proposed in the present application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of the present application.

[0086] Meanwhile, the present application uses specific terms to describe the embodiments of the present application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.

[0087] Similarly, it should be noted that, in order to simplify the expression of the present application disclosure and thus help the understanding of one or more inventive embodiments, in the foregoing description of the embodiments of the present application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of the present application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0088] In some embodiments, numbers describing the components and the quantity of attributes are used. It should be understood that such numbers used for the description of the embodiments are modified by the modifiers "about", "approximately", or "substantially" in some examples. Unless otherwise stated, "about", "approximately", or "substantially" indicate that the said numbers allow a change of ±20%. Accordingly, in some embodiments, the numerical parameters used in the present application are all approximate values, and such approximate values can change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used to confirm the breadth of the scope in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within the feasible range.

Claims

1. A substrate clamping device for a substrate chuck, wherein the substrate chuck has a groove for arranging the substrate clamping device, and the groove extends along a first direction, characterized in that, It includes a mounting base, a positioning part, a driving part and a clamping part. Among them, the mounting base is used to fix the substrate clamping device to the substrate chuck; the positioning part is used to be arranged in the groove. The positioning part includes a locking piece, a first push rod and a second push rod. The first push rod and the second push rod are movably connected. The locking piece is used to fix the relative positions of the first push rod and the second push rod. Among them, the dimensions of the positioning part and the groove are adapted so that the positioning part will not rotate in the groove; the driving part is connected to the mounting base and is used to drive the first push rod and the second push rod to move in the groove; the clamping part is rotatably connected to the mounting base through a rotating shaft. The clamping part has a contact end and a connection end. The contact end is used to contact the substrate. The connection end is connected to the first push rod. When the first push rod moves, it drives the connection end to move, and at the same time drives the clamping part to rotate and drives the contact end to move.

2. The substrate clamping device according to claim 1, wherein The locking piece has a first width, and the groove has a groove width. The first width is adapted to the groove width so that the locking piece will not rotate in the groove.

3. The substrate clamping device according to claim 2, wherein The locking piece has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

4. The substrate clamping device according to claim 1 or 2, characterized in that, The first push rod has a second width, and the groove has a groove width. The second width is adapted to the groove width so that the first push rod will not rotate in the groove.

5. The substrate clamping device according to claim 4, wherein The first push rod has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

6. The substrate clamping device according to claim 1, wherein, The positioning part further includes a sleeve. The sleeve wraps around the outer periphery of the locking piece and the first push rod and is arranged in the groove. The dimensions of the sleeve and the groove are adapted so that the sleeve will not rotate in the groove.

7. The substrate clamping device according to claim 6, wherein The sleeve has a third width, and the groove has a groove width. The third width is adapted to the groove width so that the sleeve will not rotate in the groove.

8. The substrate clamping device according to claim 6, wherein, The sleeve has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

9. The substrate clamping device according to claim 6, wherein, A part of the first push rod is located inside the sleeve.

10. The substrate clamping device according to claim 6, characterized in that, The sleeve further includes at least one fixing piece. The at least one fixing piece penetrates through the barrel wall of the sleeve and is used to fix the sleeve on the outside of the locking piece or the first push rod.

11. The substrate clamping device according to claim 1, wherein, The first push rod has a threaded hole, and the second push rod is screwed into the threaded hole. The locking piece is arranged on the outer periphery of the second push rod.

12. A tool for debugging a substrate clamping device, characterized in that, It includes a simulation chuck device and a simulation substrate device. A plurality of clamping device mounting positions are arranged on the simulation chuck device. Each clamping device mounting position is used to mount one substrate clamping device. The simulation substrate device includes a simulation edge for simulating the edge of the substrate. When debugging the substrate clamping device, the clamping part of each substrate clamping device is used to clamp the simulation edge.

13. The tooling according to claim 12, characterized in that, The center of the simulation chuck device has a first pair of middle parts, and the center of the simulation substrate device has a second pair of middle parts. The first pair of middle parts and the second pair of middle parts are cooperatively arranged.

14. The tooling according to claim 12, characterized in that, A plurality of adjusting columns are provided on the surface of the simulation chuck device facing the simulation substrate device, and the plurality of adjusting columns are used to adjust the distance between the simulation chuck device and the simulation substrate device.

15. The tooling according to claim 12, characterized in that, The simulation chuck device is located below the simulation substrate device, and the clamping portion extends upward to clamp the simulation edge.

16. The tooling according to claim 12, characterized in that, The simulation chuck device is located above the simulation substrate device, and the clamping portion extends downward to clamp the simulation edge.

17. The tooling according to claim 12, characterized in that, The diameter of the simulation edge is smaller than the actual diameter of the simulated substrate, and is used to debug the position of the clamping portion of the substrate clamping device when clamping the substrate.

18. The tooling according to claim 12, characterized in that, The diameter of the simulation edge is larger than the actual diameter of the simulated substrate, and is used to debug the position of the clamping portion of the substrate clamping device when releasing the substrate.

19. A method for adjusting a substrate clamping device, applied to the substrate clamping device according to any one of claims 1-11, characterized in that, Comprising: Adjust the relative positions of the first push rod and the second push rod, and further adjust the rotation position of the clamping portion so that the contact end is located at the target position and contacts the substrate edge; Fix the relative positions of the first push rod and the second push rod through the locking member.