Electronic device and method of assembling an electronic device

Abstract

The present disclosure is an electronic device and an assembling method of the electronic device. The electronic device comprises a partition plate, a display module and a glue assembly. The display module comprises a main body part and an extension part. The first end of the extension part is connected with the side edge of the main body part. The second end of the extension part is connected with the back of the main body part to form a step structure. The glue assembly comprises a first glue and a second glue. The first glue is located at the step structure and connected with the partition plate, the main body part and the extension part. The first glue is formed by solidification of liquid glue. The second glue is located at the side of the step structure away from the side edge and connected with the partition plate and the main body part. In the present disclosure, a certain height of liquid glue can be stacked on the partition plate through the second glue. When the main body part is fixedly connected with the second glue, the step structure extrudes the liquid glue, and then the first glue formed after solidification of the liquid glue can be obtained. Thus, the present disclosure can preliminarily solve the problem that the display module and the partition plate are inconvenient to bond.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to an electronic device and a method for assembling the electronic device. Background Technology

[0002] In electronic devices, COF (Chip On Film) packaging technology is commonly used to encapsulate the driver chip in the display module. When using COF packaging technology, the display layer and the substrate layer form a stepped structure on the back of the display module. This results in the back of the display module not being a complete flat surface, making it difficult to bond the display module to the partition. Summary of the Invention

[0003] This disclosure provides an electronic device and a method for assembling the electronic device to solve the aforementioned technical problems in the related art. The technical solution is as follows:

[0004] In a first aspect, an electronic device is provided, the electronic device comprising a partition, a display module, and a colloid assembly;

[0005] The display module includes a main body and an extension. The first end of the extension is connected to the side edge of the main body, and the second end of the extension is connected to the back of the main body to form a stepped structure.

[0006] The colloid assembly includes a first colloid and a second colloid. The first colloid is located at the stepped structure and is connected to the partition plate, the main body, and the extension. The first colloid is cured and formed by liquid adhesive. The second colloid is located on the side of the stepped structure away from the side edge and is connected to the partition plate and the main body.

[0007] In some possible implementations, the distance between the second colloid and the second end is 0.4mm-0.8mm.

[0008] In some possible implementations, the partition plate has a strip-shaped groove opposite to the stepped structure and accommodating a portion of the first colloid.

[0009] In some possible implementations, the depth of the strip groove is 0.8 mm to 1.5 mm.

[0010] In some possible implementations, the colloid assembly further includes a third colloid and a fourth colloid. The third colloid is arranged circumferentially along the partition and is fixedly connected to the partition and the main body, with its end opposite to the end of the first colloid. A portion of the fourth colloid is located between the first colloid and the third colloid and is fixedly connected to the display module, the first colloid, and the third colloid. The fourth colloid is cured and molded by liquid adhesive.

[0011] The partition plate also has a through hole that accommodates another portion of the fourth colloid and is used to inject liquid adhesive between the first colloid and the third colloid.

[0012] In some possible implementations, the partition includes a first portion and a second portion connected together, the first portion protruding from the second portion and fixedly connected to the first colloid, and the second portion fixedly connected to the third colloid.

[0013] In some possible implementations, portions of the first colloid and portions of the third colloid are located at the opening of the through-hole.

[0014] In some possible implementations, the through hole has a dimension of 1mm-2mm in the circumferential direction of the partition plate.

[0015] Secondly, a method for assembling an electronic device is provided. The electronic device includes a partition and a display module. The display module includes a main body and an extension. A first end of the extension is connected to a side edge of the main body, and a second end of the extension is connected to the back surface of the main body to form a stepped structure. The assembly method includes:

[0016] The second colloid is fixed to the partition plate;

[0017] Liquid adhesive is deposited onto the partition plate on the side of the second colloid, and the liquid adhesive is made to reach a specified height, which is higher than the height of the second colloid.

[0018] The main body is fixedly connected to the second colloid, and the stepped structure is used to squeeze the liquid colloid.

[0019] Wait for the liquid adhesive to cure and solidify to form the first colloid.

[0020] In some possible implementations, the height difference between the specified height and the second colloid is 0.3mm-0.7mm.

[0021] The beneficial effects of the technical solution provided in this disclosure include at least the following:

[0022] In this disclosure, a second adhesive allows liquid adhesive to accumulate to a certain height on the partition plate. When the main body is fixedly connected to the second adhesive, the stepped structure compresses the liquid adhesive, thereby filling the space between the stepped structure and the partition plate. This allows the first adhesive, formed after the liquid adhesive has cured, to adhere tightly to the partition plate, the main body, and the extension at the stepped structure. Therefore, this disclosure can initially solve the problem of inconvenient bonding between the display module and the partition plate.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure;

[0026] Figure 2 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this disclosure;

[0027] Figure 3 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this disclosure;

[0028] Figure 4 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this disclosure;

[0029] Figure 5 This is a schematic flowchart of an assembly method provided in an embodiment of this disclosure.

[0030] Figure label:

[0031] 1. Middle partition; 11. Strip groove; 12. Through hole; 101. First part; 102. Second part;

[0032] 2. Display module; 21. Main body; 21a. Side edge; 22. Extension; 22a. First end; 22b. Second end; 23. Glass cover; 24. OCA adhesive; 25. Protective adhesive layer; 26. Driver circuit board; 27. FPC cable; 2a. Stepped structure;

[0033] 3. Colloidal component; 31. First colloidal component; 32. Second colloidal component; 33. Third colloidal component; 34. Fourth colloidal component;

[0034] 4. Border. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] In electronic devices, COF (Chip On Film) packaging technology is commonly used to package the driver chip in the display module. When using COF packaging technology, the display layer and the substrate layer form a stepped structure on the back of the display module. This results in the back of the display module not being a complete plane, making it difficult to bond the display module to the partition 1.

[0038] To solve the above technical problems, such as Figure 1 As shown, this disclosure provides an electronic device, which can be, for example, but not limited to, a smartphone, a smart bracelet, a tablet computer, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, or a laptop computer. This electronic device may also be referred to as a user device, a portable terminal, a laptop computer, or other names.

[0039] Figure 2 yes Figure 1 A sectional view at position AA, combined with Figure 2 As shown, the electronic device includes a partition 1, a display module 2, and a gel assembly 3. The display module 2 includes a main body 21 and an extension 22. The first end 22a of the extension 22 is connected to the side edge 21a of the main body 21, and the second end 22b of the extension 22 is connected to the back of the main body 21 to form a stepped structure 2a. The gel assembly 3 includes a first gel 31 and a second gel 32. The first gel 31 is located at the stepped structure 2a and is connected to the partition 1, the main body 21, and the extension 22. The first gel 31 is cured by liquid adhesive. The second gel 32 is located on the side of the stepped structure 2a away from the side edge 21a and is connected to the partition 1 and the main body 21.

[0040] The electronic device provided in this embodiment allows for the accumulation of a certain height of liquid adhesive on the partition 1 via the second adhesive 32. When the main body 21 is fixedly connected to the second adhesive 32, the stepped structure 2a compresses the liquid adhesive, filling the space between the stepped structure 2a and the partition 1. This allows the first adhesive 31, formed after the liquid adhesive has cured, to adhere tightly to the partition 1, the main body 21, and the extension 22 at the stepped structure 2a. Therefore, this embodiment can initially solve the problem of inconvenient bonding between the display module 2 and the partition 1.

[0041] In this embodiment, the second adhesive 32 is not a liquid adhesive that has been cured. For example, the second adhesive 32 can be double-sided tape. After the second adhesive 32 is attached to the partition 1, the second adhesive 32 can support the accumulation of liquid adhesive, thereby allowing the liquid adhesive to accumulate to a certain height. This ensures that when the stepped structure 2a squeezes the liquid adhesive, the liquid adhesive can fill the space between the stepped structure 2a and the partition 1, thereby ensuring that the first adhesive 31 is tightly bonded to the partition 1, the main body 21, and the extension 22.

[0042] In this embodiment, COF packaging technology is used to package the driver chip in the display module 2. The main body 21 includes a display layer and a display substrate. The display layer is mainly used to display images, while the display substrate includes a support material and an adhesive. The support material supports the display layer, and the adhesive connects the support material and the display layer. The extension 22 is an integral structure with the display layer. It is a non-display portion extending from the display layer to the side edge 21a, primarily serving the function of electrical signal transmission. The second end 22b of the extension 22 is bent to the back of the main body 21 for electrical connection with the driver chip located on the back of the display module 2.

[0043] Optionally, the partition 1 may be made of, for example, but not limited to, metal or plastic.

[0044] like Figure 2 As shown, the display module 2 also includes a glass cover plate 23. The glass cover plate 23 is located on the side of the electronic device display layer away from the middle partition plate 1. It is mainly used to support the display layer on the side of the electronic device display layer away from the middle partition plate 1. The glass cover plate 23 is connected to the display layer by OCA (Optically Clear Adhesive) glue 24. The use of OCA glue 24 can ensure that the display effect of the display layer is not interfered with.

[0045] like Figure 2 As shown, the display module 2 also includes a protective adhesive layer 25, which is located on the back of the display module 2 and is connected to both the main body 21 and the extension 22.

[0046] Thus, on the one hand, the roughness of the back of the display module 2 can be reduced by the protective adhesive layer 25, so that the adhesive can be bonded to the back of the display module 2. On the other hand, the extension 22 can be fixed to prevent the extension 22 from shaking during the installation of the display module 2. In addition, the protective adhesive layer 25 can also protect the back of the display module 2 to improve the structural strength of the display module 2.

[0047] like Figure 1 As shown, the display module 2 also includes a driving circuit board 26 and an FPC (Flexible Printed Circuit) cable 27. The driving circuit board 26 is electrically connected to the extension 22 and the FPC cable 27 respectively, so as to receive control signals through the FPC cable 27 and control the display layer.

[0048] In some embodiments, the distance between the second colloid 32 and the second end 22b is 0.4mm-0.8mm.

[0049] If the distance between the second colloid 32 and the second end 22b is less than 0.4mm, then the distance between the second colloid 32 and the second end 22b is too small. This may lead to the risk that the step structure 2a may touch the second colloid 32 when the display module 2 is installed, which means that it is not convenient to position the display module 2 and the second colloid 32.

[0050] If the distance between the second adhesive 32 and the second end 22b is greater than 0.8mm, then the distance between the second adhesive 32 and the second end 22b is too large. On the one hand, this will lead to an excessive amount of liquid adhesive that needs to be piled up, thereby increasing the cost of the liquid adhesive and the weight of the electronic device. On the other hand, since the pile height of the liquid adhesive will gradually decrease in the direction away from the second adhesive 32, it may be difficult for the liquid adhesive to fill the space between the stepped structure 2a and the partition plate 1, thereby reducing the reliability of the bonding between the main body 21, the extension 22 and the liquid adhesive.

[0051] Thus, by setting the distance between the second colloid 32 and the second end 22b to 0.4mm-0.8mm, the reliability of the bonding between the main body 21, the extension 22 and the liquid adhesive can be guaranteed, while also preventing the stepped structure 2a from touching the second colloid 32.

[0052] Optionally, the distance between the second colloid 32 and the second end 22b can be, for example, but not limited to, 0.5 mm, 0.6 mm or 0.7 mm, and the embodiments disclosed herein do not limit this.

[0053] In some embodiments, such as Figure 2 As shown, the partition 1 has a strip groove 11, which is opposite to the stepped structure 2a and accommodates a portion of the first colloid 31.

[0054] The second colloid 32 is located at the edge of the strip groove 11 and on the side of the strip groove 11 away from the frame 4 of the electronic device. In this way, by opening the strip groove 11 on the partition plate 1, the installation of the second colloid 32 can be positioned, thereby improving the convenience of assembling the display module 2 and the partition plate 1, and thus improving the efficiency of assembling the display module 2 and the partition plate 1.

[0055] The present disclosure does not limit the forming method of the strip groove 11. For example, the strip groove 11 can be formed together with the partition plate 1, or it can be milled out after the partition plate 1 is formed.

[0056] In some embodiments, the depth of the strip groove 11 is 0.8mm-1.5mm.

[0057] If the depth of the groove 11 is less than 0.8 mm, the depth of the groove 11 is too small. As a result, when the second adhesive 32 is pasted, the edge of the groove 11 is not obvious, which makes it difficult to position the second adhesive 32.

[0058] If the depth of the strip groove 11 is greater than 1.5mm, the depth of the strip groove 11 is too large, which will lead to a decrease in the overall structural strength of the partition plate 1, thereby causing a decrease in the overall structural strength of the electronic device.

[0059] Thus, setting the depth of the strip groove 11 to 0.8mm-1.5mm ensures both the ease of positioning the second colloid 32 and the overall structural strength of the partition plate 1 remains largely unaffected.

[0060] Optionally, the depth of the strip groove 11 can be, for example, but not limited to, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm or 1.4 mm, and the present disclosure does not limit this.

[0061] In this embodiment of the disclosure, Figure 3 yes Figure 1 Sectional view at position BB. Figure 4 yes Figure 1 Sectional view at position CC.

[0062] In some embodiments, combined with Figure 1 , Figure 3 , Figure 4As shown, the colloid assembly 3 also includes a third colloid 33 and a fourth colloid 34. The third colloid 33 is arranged circumferentially along the partition 1 and is fixedly connected to the partition 1 and the main body 21, with its end opposite to the end of the first colloid 31. A portion of the fourth colloid 34 is located between the first colloid 31 and the third colloid 33 and is fixedly connected to the display module 2, the first colloid 31, and the third colloid 33. The fourth colloid 34 is cured and molded using liquid adhesive. The partition 1 also has a through hole 12, which accommodates another portion of the fourth colloid 34 and is used to inject liquid adhesive between the first colloid 31 and the third colloid 33.

[0063] Since the back of the main body 21 is basically flat, the third adhesive 33 is arranged circumferentially on the partition 1, enabling bonding of the main body 21 to the partition 1 at the edge of the back of the main body 21, away from the first adhesive 31 and the second adhesive 32. The third adhesive 33 is not cured from liquid adhesive to reduce the complexity of the connection between the third adhesive 33 and the main body 21. For example, the third adhesive 33 can be double-sided tape. This allows for relatively convenient bonding of the main body 21 to the partition 1, away from the first adhesive 31 and the second adhesive 32.

[0064] In this process, a gap is created between the first colloid 31 and the third colloid 33. Liquid adhesive is injected into this gap through the through hole 12, and the liquid adhesive cures to form a fourth colloid 34. This allows the fourth colloid 34 to bond tightly with the first colloid 31 and the third colloid 33, reducing the possibility of gaps between the end faces of the first colloid 31, the third colloid 33, and the fourth colloid 34. This ensures the sealing of the colloid assembly 3 at this location, and consequently ensures that the electronic device as a whole has good sealing performance.

[0065] Optionally, the fourth colloid 34 can be, for example, but not limited to, an injection molding compound.

[0066] In some embodiments, such as Figure 3 As shown, the partition 1 includes a first part 101 and a second part 102 connected together. The first part 101 protrudes from the second part 102 and is fixedly connected to the first colloid 31. The second part 102 is fixedly connected to the third colloid 33.

[0067] Since liquid adhesives often have strong adhesion and can bond even when the thickness is thin, the thickness of the first adhesive 31 can be appropriately reduced to avoid using too much liquid adhesive, thereby reducing the cost of the first adhesive 31 and consequently reducing the cost of electronic devices.

[0068] In some embodiments, combined with Figure 2 As shown, the strip groove 11 is formed in the first part 101.

[0069] Thus, since the first part 101 protrudes from the second part 102, that is, the thickness of the first part 101 is greater than that of the second part 102, it has better structural strength. Therefore, by opening the strip groove 11 in the first part 101, the impact of opening the strip groove 11 on the overall structural strength of the partition plate 1 can be reduced, so as to ensure that the electronic device has sufficient structural strength.

[0070] In some embodiments, portions of the first colloid 31 and the third colloid 33 are located at the opening of the through hole 12.

[0071] Thus, the dimension of the through hole 12 in the circumferential direction of the partition plate 1 is larger than the dimension of the gap between the first colloid 31 and the third colloid 33. After the fourth colloid 34 is formed, the fourth colloid 34 not only adheres to the opposing surfaces of the first colloid 31 and the third colloid 33, but also adheres to the side of the first colloid 31 away from the display module 2 and the side of the third colloid 33 away from the display module 2, respectively. This can protect the sealing performance between the fourth colloid 34 and the first colloid 31 and the third colloid 33, thereby ensuring the overall sealing performance of the colloid assembly 3.

[0072] In some embodiments, the through hole 12 has a circumferential dimension of 1mm-2mm in the middle partition 1.

[0073] If the size of the through hole 12 in the circumferential direction of the partition plate is less than 1 mm, then the size of the through hole 12 is too small. This is not conducive to the flow of liquid adhesive, that is, it is not convenient to inject liquid adhesive between the first adhesive 31 and the third adhesive 33, and may even cause the liquid adhesive to be blocked, thus preventing the liquid adhesive from filling the gap between the first adhesive 31 and the third adhesive 33.

[0074] If the size of the through hole 12 in the circumferential direction of the partition plate 1 is greater than 2mm, then the size of the through hole 12 is too large, which will lead to a decrease in the overall structural strength of the partition plate 1.

[0075] Thus, setting the size of the through hole 12 in the circumferential direction of the partition plate 1 to 1mm-2mm can ensure both the convenience of liquid adhesive flow and the overall structural strength of the partition plate 1 remains largely unaffected.

[0076] Optionally, the dimensions of the through hole 12 in the circumferential direction of the partition plate 1 are 1.2 mm, 1.4 mm, 1.6 mm or 1.8 mm, and the embodiments disclosed herein are not limited thereto.

[0077] Optionally, the through hole 12 is a circular hole.

[0078] If the size of the through hole 12 in the circumferential direction of the partition plate 1 is greater than 2mm, then the size of the fourth colloid 34 is too large. This will occupy too much space between the display module 2 and the partition plate 1, and there is a possibility that the FPC cable 27 and other structures under the display module 2 will be squeezed.

[0079] Based on the same concept, embodiments of this disclosure also provide a method for assembling an electronic device, such as... Figure 2 As shown, the electronic device includes a partition and a display module 2. The display module 2 includes a main body 21 and an extension 22. The first end 22a of the extension 22 is connected to the side edge 21a of the main body 21, and the second end 22b of the extension 22 is connected to the back surface of the main body 21 to form a stepped structure 2a. Figure 5 As shown, the assembly method includes:

[0080] 501. Fix the second colloid 32 to the middle partition plate;

[0081] 502. On the side of the second colloid 32, liquid adhesive is deposited onto the partition plate and the liquid adhesive reaches a specified height, which is higher than the height of the second colloid 32.

[0082] 503. Fix the main body 21 to the second colloid 32, and squeeze the liquid colloid by the stepped structure 2a;

[0083] 504. Wait for the liquid adhesive to cure and solidify to form the first colloid 31.

[0084] Using the assembly method provided in this embodiment, liquid adhesive of a specified height can be accumulated on the partition plate via the second adhesive 32. When the main body 21 is fixedly connected to the second adhesive 32, the stepped structure 2a compresses the liquid adhesive. Since the specified height is higher than the height of the first adhesive 31, the liquid adhesive can fill the space between the stepped structure 2a and the partition plate. This allows the first adhesive 31, formed after the liquid adhesive has cured, to connect with the partition plate, the main body 21, and the extension 22 at the stepped structure 2a. Therefore, this embodiment can initially solve the problem of inconvenient bonding between the display module 2 and the partition plate.

[0085] "Liquid adhesive reaches the specified height" means that the maximum height of the liquid adhesive has reached the specified height.

[0086] In some embodiments, the height difference between the specified height and the second colloid 32 is 0.3mm-0.7mm.

[0087] If the height difference between the specified height and the second colloid 32 is less than 0.3 mm, the amount of liquid adhesive piled up is too small. This will make it difficult for the liquid adhesive to fill the space between the step structure 2a and the partition plate, thus making it difficult to guarantee the bonding strength between the first colloid 31 and the main body 21 and the extension 22.

[0088] If the height difference between the specified height and the second colloid 32 is greater than 0.7mm, there will be too much liquid adhesive. This may cause the liquid adhesive to overflow to the side when it is squeezed, and squeeze the extension 22, resulting in damage to the extension 22. On the other hand, it will cause waste of liquid adhesive and increase material costs.

[0089] Thus, by setting the height difference between the specified height and the second colloid 32 to 0.3mm-0.7mm, the bonding strength between the first colloid 31 and the main body 21 and the extension 22 can be guaranteed, while avoiding damage to the extension 22 by the liquid adhesive.

[0090] In some embodiments, such as Figure 3 As shown, the partition 1 also has a through hole 12, which is located on the circumferential side of the first colloid 31. The assembly method further includes:

[0091] Before step 502, the third colloid 33 is fixed to the partition plate 1;

[0092] After step 504, liquid adhesive is injected into the through hole 12 and the liquid adhesive is allowed to cure and form a fourth adhesive 34.

[0093] In this way, the fourth colloid 34 can be tightly bonded to the first colloid 31 and the third colloid 33, thereby reducing the possibility of gaps between the end faces of the first colloid 31, the third colloid 33 and the fourth colloid 34, thus ensuring the sealing of the colloid assembly 3 at this position, and further ensuring that the electronic device as a whole has good sealing performance.

[0094] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0095] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this disclosure. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0096] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0097] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0098] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this disclosure.

[0099] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. An electronic device, characterized in that, The electronic device includes a partition (1), a display module (2), a colloid assembly (3), and a frame (4); The partition (1) is located inside the frame (4), and the partition (1) has a strip groove (11) with a gap between the strip groove (11) and the frame (4). The display module (2) includes a main body (21) and an extension (22). The first end (22a) of the extension (22) is connected to the side edge (21a) of the main body (21), and the second end (22b) of the extension (22) is connected to the back side of the main body (21) to form a stepped structure (2a). The stepped structure (2a) is opposite to the strip groove (11). The colloid assembly (3) includes a first colloid (31) and a second colloid (32). The first colloid (31) is located at the stepped structure (2a) and on the side of the display module (2) near the partition plate (1). The first colloid (31) is partially located in the strip groove (11) and is connected to the partition plate (1), the main body (21) and the extension (22). The first colloid (31) is cured and formed by liquid adhesive. The second colloid (32) is located on the side of the stepped structure (2a) away from the side edge (21a) and on the edge of the strip groove (11), and is connected to the partition plate (1) and the main body (21).

2. The electronic device according to claim 1, characterized in that, The distance between the second colloid (32) and the second end (22b) is 0.4mm-0.8mm.

3. The electronic device according to claim 1, characterized in that, The depth of the strip groove (11) is 0.8mm-1.5mm.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The colloid assembly (3) further includes a third colloid (33) and a fourth colloid (34). The third colloid (33) is arranged circumferentially along the partition plate (1) and is fixedly connected to the partition plate (1) and the main body (21), and its end is opposite to the end of the first colloid (31). A portion of the fourth colloid (34) is located between the first colloid (31) and the third colloid (33) and is fixedly connected to the display module (2), the first colloid (31) and the third colloid (33). The fourth colloid (34) is cured and formed by liquid adhesive. The partition plate (1) also has a through hole (12) that accommodates another portion of the fourth colloid (34) and is used to inject liquid adhesive between the first colloid (31) and the third colloid (33).

5. The electronic device according to claim 4, characterized in that, The partition (1) includes a first part (101) and a second part (102) connected together. The first part (101) protrudes from the second part (102) and is fixedly connected to the first colloid (31). The second part (102) is fixedly connected to the third colloid (33).

6. The electronic device according to claim 4, characterized in that, A portion of the first colloid (31) and a portion of the third colloid (33) are located at the opening of the through hole (12).

7. The electronic device according to claim 4, characterized in that, The through hole (12) has a circumferential dimension of 1mm-2mm in the middle partition (1).

8. A method for assembling an electronic device, characterized in that, The electronic device includes a partition (1), a display module (2), and a frame (4). The partition (1) has a strip groove (11) with a gap between it and the frame (4). The display module (2) includes a main body (21) and an extension (22). The first end (22a) of the extension (22) is connected to the side edge (21a) of the main body (21), and the second end (22b) of the extension (22) is connected to the back of the main body (21) to form a stepped structure (2a). The assembly method includes: The second colloid (32) is fixed to the partition plate (1) and to the edge of the strip groove (11); Liquid adhesive is deposited onto the partition plate (1) on the side of the second colloid (32) and the liquid adhesive is made to reach a specified height, which is higher than the height of the second colloid (32); The main body (21) is fixedly connected to the second colloid (32), so that the stepped structure (2a) is opposite to the strip groove (11), and the liquid colloid is squeezed. Wait for the liquid adhesive to cure and solidify to form the first colloid (31).

9. The assembly method according to claim 8, characterized in that, The height difference between the specified height and the second colloid (32) is 0.3mm-0.7mm.

Images