Double-layer liquid cooling plate of data center server

Abstract

The invention provides a data center server double-layer liquid cooling plate, and relates to the technical field of data center liquid cooling heat dissipation, the data center server double-layer liquid cooling plate is provided with a shell, a cooling cavity is formed in the shell, a temperature equalizing plate is arranged in the cooling cavity, and the cooling cavity is divided into a first cooling flow channel and a second cooling flow channel by the temperature equalizing plate; a liquid inlet and a liquid outlet are formed in the shell, one end of the first cooling flow channel is connected to the liquid inlet, the other end of the first cooling flow channel is communicated with one end of the second cooling flow channel through a communication port, the other end of the second cooling flow channel is connected to the liquid outlet, and a flow distribution structure and a micro-channel structure are arranged in the first cooling flow channel; the flow distribution structure is connected with the liquid inlet, the micro-channel structure is arranged between the flow distribution structure and the communicating opening, and a temperature equalizing structure is arranged in the second cooling flow channel. The double-layer liquid cooling plate of the data center server has higher heat exchange efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling heat dissipation for data centers, and particularly to a double-layer liquid cooling plate for a data center server. Background Art

[0002] IT information technology devices such as computing, storage, and networking are stored inside a data center. During the operation of the data center, a large amount of heat is generated. To maintain the normal operation of the devices, the liquid cooling plate cooling technology is commonly used in the data center for server cooling nowadays. At present, high-performance chips are widely used in data centers. High-performance electronic chips have a higher operating speed, but the high heat flux density generated by the higher-speed operation poses challenges to the thermal management of the chips and the liquid cooling technology of the data center.

[0003] The microchannel liquid cooling plate has a high heat transfer coefficient and has a significant cooling effect on high heat flux density electronic chips. Therefore, it has been widely used in the liquid cooling field of data centers. However, the traditional microchannel liquid cooling plate has problems such as high pressure drop and uneven temperature. Some patents have proposed some microchannel liquid cooling plate structures for the field of electronic component cooling. For example, Patent CN219016929U designs a server liquid cooling plate structure, including a main body. A plurality of flow channels are provided on the main body. The plurality of flow channels are arranged in parallel, and the flow channels penetrate the main body from the end of the main body. A partition rib is provided between two adjacent flow channels. However, the flow resistance of the flow channels of this cold plate structure is relatively large, and the flow channel turbulence effect is poor, and the heat dissipation efficiency is low. Patent CN212209693U also designs a liquid cooling plate structure in the form of a stamping cold plate, including a lower substrate, an upper substrate, and a copper pipe. An S-shaped groove body is opened at the top of the lower substrate. A through partition long hole is opened on the right side of the lower substrate. The copper pipe is located in the groove bodies of the S-shaped groove body and the heating groove. One end of the copper pipe extending out of the left side of the lower substrate is provided with a liquid inlet pipe joint, and one end of the copper pipe extending out of the right side of the lower substrate is provided with a liquid outlet pipe joint. However, the flow channel length of this cold plate structure is relatively long, the flow resistance is relatively large, the temperature uniformity of the cold plate is poor, and the flow channel turbulence effect is small, and the heat transfer performance is weak.

[0004] In view of this, based on the production design experience of the inventor in this field and related fields for many years, after repeated experiments, a double-layer liquid cooling plate for a data center server is designed to solve the problems existing in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide a double-layer liquid cooling plate for a data center server, which has a greater heat exchange efficiency and a stronger heat exchange effect.

[0006] To achieve the above object, the present invention provides a double-layer liquid cooling plate for a data center server. The double-layer liquid cooling plate for a data center server has a housing, a cooling cavity is formed inside the housing, a heat pipe is arranged in the cooling cavity, and the heat pipe divides the cooling cavity into a first cooling flow channel and a second cooling flow channel; a liquid inlet and a liquid outlet are formed on the housing, one end of the first cooling flow channel is connected to the liquid inlet, the other end of the first cooling flow channel is communicated with one end of the second cooling flow channel through a communication port, the other end of the second cooling flow channel is connected to the liquid outlet, a flow distribution structure and a microchannel structure are arranged in the first cooling flow channel, the flow distribution structure is connected to the liquid inlet, the microchannel structure is arranged between the flow distribution structure and the communication port, and a heat equalization structure is arranged in the second cooling flow channel.

[0007] Compared with the prior art, the present invention has the following characteristics and advantages:

[0008] In the double-layer liquid cooling plate for a data center server provided by the present invention, the cooling cavity inside the housing is divided into a first cooling flow channel and a second cooling flow channel arranged in parallel by a heat pipe, thus forming a double-layer structure. The cooling medium first flows through the first cooling flow channel and then turns back and flows into the second cooling flow channel, effectively increasing the flow path of the cooling medium, increasing the heat exchange efficiency of the cooling medium, and at the same time, the heat in the first cooling flow channel can be quickly transferred to the second cooling flow channel through the heat pipe, enhancing the heat dissipation effect of the double-layer liquid cooling plate for a data center server. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes and proportional dimensions of the components in the drawings are only schematic and are used to assist in understanding the present invention, and do not specifically limit the shapes and proportional dimensions of the components of the present invention. Those skilled in the art can select various possible shapes and proportional dimensions according to specific circumstances to implement the present invention under the teaching of the present invention.

[0010] Figure 1 is a working schematic diagram of the double-layer liquid cooling plate for a data center server provided by the present invention;

[0011] Figure 2 is an assembly schematic diagram of the double-layer liquid cooling plate for a data center server in the present invention;

[0012] Figure 3 is a structural schematic diagram of the upper cover plate in the present invention;

[0013] Figure 4 is a structural schematic diagram of the heat pipe in the present invention;

[0014] Figure 5 is a structural schematic diagram of the bottom substrate in the present invention.

[0015] Description of Reference Numerals

[0016] 100. Double-layer liquid cooling plate for data center servers;

[0017] 10. Shell;

[0018] 11. Liquid inlet;

[0019] 12. Liquid outlet;

[0020] 13. Bottom substrate;

[0021] 131. The first arc structure;

[0022] 14. Upper cover plate;

[0023] 141, second arc structure;

[0024] 20. Temperature balancing board;

[0025] 30. A first cooling channel;

[0026] 31. Traffic distribution structure;

[0027] 311. Bionic flow distribution structure;

[0028] 312. A first flow distribution structure;

[0029] 313. A second flow distribution structure;

[0030] 32. Microchannel structure;

[0031] 321, microchannel rib wall;

[0032] 3211, rib wall body;

[0033] 322. Cooling microchannel;

[0034] 40. A second cooling channel;

[0035] 41. Uniform temperature structure;

[0036] 411, fin;

[0037] 50. Connecting port;

[0038] 200. Heat-generating electronic components. DETAILED DESCRIPTION

[0039] Combined with the accompanying drawings and the description of the specific embodiments of the present invention, the details of the present invention can be more clearly understood. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention and cannot be construed in any way as a limitation of the present invention. Under the teaching of the present invention, those skilled in the art can conceive any possible variations based on the present invention, and these should all be regarded as belonging to the scope of the present invention.

[0040] As Figures 1 to 5 shown, the present invention provides a double-layer liquid cooling plate 100 for a data center server. The double-layer liquid cooling plate 100 for a data center server has a housing 10. A cooling cavity is formed inside the housing 10. A heat pipe 20 is provided in the cooling cavity. The heat pipe 20 divides the cooling cavity into a first cooling flow channel 30 and a second cooling flow channel 40. An inlet 11 and an outlet 12 are formed on the housing 10. One end of the first cooling flow channel 30 is connected to the inlet 11. The other end of the first cooling flow channel 30 is connected to one end of the second cooling flow channel 40 through a communication port 50. The other end of the second cooling flow channel 40 is connected to the outlet 12. A flow distribution structure 31 and a microchannel structure 32 are provided in the first cooling flow channel 30. The flow distribution structure 31 is connected to the inlet 11. The microchannel structure 32 is arranged between the flow distribution structure 31 and the communication port 50. A heat pipe structure 41 is provided in the second cooling flow channel 40. The microchannel structure 32 includes a plurality of microchannel rib walls 321 arranged in parallel at intervals. An adjacent pair of microchannel rib walls 321 forms a cooling microchannel 322. The cooling microchannel 322 is arranged along the length direction of the first cooling flow channel 30. Each microchannel rib wall 321 is formed by a plurality of rib wall bodies 3211 arranged intermittently in sequence. Along the length direction of the microchannel rib wall 321 (i.e., the length direction of the first cooling flow channel 30), the length of the rib wall body 3211 decreases linearly. An arc-shaped diversion structure is provided at the end of the intermittently arranged rib wall bodies 3211.

[0041] The double-layer liquid cooling plate 100 for a data center server provided by the present invention divides the cooling cavity inside the housing 10 into a first cooling flow channel 30 and a second cooling flow channel 40 arranged in parallel through the heat pipe 20, thus forming a double-layer structure. The cooling medium first flows through the first cooling flow channel 30 and then turns back and flows into the second cooling flow channel 40, effectively increasing the flow path of the cooling medium and increasing the heat exchange efficiency of the cooling medium. At the same time, the heat in the first cooling flow channel 30 can be quickly transferred to the second cooling flow channel 40 through the heat pipe 20, enhancing the heat dissipation effect of the double-layer liquid cooling plate 100 for a data center server.

[0042] The double-layer liquid cooling plate 100 of the data center server proposed by the present invention turbulizes and distributes the flow of the cooling medium flowing in through the liquid inlet 11 through the flow distribution structure 31. While enhancing the heat transfer performance, the flow distribution can be made more uniform. Then, the microchannel structure 32 further distributes the flow of the cooling medium, making the flow distribution of the cooling medium more uniform. In addition, the temperature equalization structure 41 can quickly transfer the heat in the first cooling channel 30 to the second cooling channel 40, and the temperature of the double-layer liquid cooling plate 100 of the data center server can be more evenly distributed.

[0043] In the double-layer liquid cooling plate 100 of the data center server proposed by the present invention, the lengths of the multiple rib wall bodies 3211 constituting the microchannel rib wall 321 gradually decrease, forming gradually denser rib wall bodies 3211. When the cooling medium flows through the microchannel structure 32, it comes into full contact with the temperature equalizing plate 20, and can fully transfer the heat to the temperature equalizing plate 20. Then, the heat is transferred to the cooling medium in the second cooling channel 40 through the temperature equalizing plate 20 and the temperature equalization structure 41, improving the heat exchange efficiency of the cooling medium.

[0044] In an optional embodiment of the present invention, the linear decreasing gradient of the length of the rib wall body 3211 is 10% reduction per section.

[0045] In an optional embodiment of the present invention, the ratio of the radius of curvature of the arc-shaped diversion structure to the height of the rib wall body 3211 is 1:1.

[0046] In an optional embodiment of the present invention, the flow distribution structure 31 includes a bionic flow distribution structure 311, a first flow distribution structure 312, and two second flow distribution structures 313. The bionic flow distribution structure 311 is connected to the liquid inlet 11. The two second flow distribution structures 313 are symmetrically arranged on both sides of the bionic flow distribution structure 311. The first flow distribution structure 312 is arranged between the bionic flow distribution structure 311 and the microchannel structure 32.

[0047] In an optional example of this embodiment, the cooling medium entering from the liquid inlet 11 passes through the bionic flow distribution structure 311. A part of the cooling medium is evenly distributed along both sides of the bionic flow distribution structure 311 and flows to the two second flow distribution structures 313 respectively. Another part flows to the first flow distribution structure 312 through the bionic flow distribution structure 311. The cooling medium completes the preliminary flow distribution when flowing through the bionic flow distribution structure 311, and produces a turbulizing effect after flowing to the two second flow distribution structures 313, obtaining the effect of further flow distribution.

[0048] In an optional example, the bionic flow distribution structure 311 is a willow leaf-shaped flow distribution structure with multiple branched slots, having good streamline, and the flow resistance suffered by the cooling medium when flowing through the multiple branched slots is small.

[0049] Further, the length of the willow-leaf-shaped flow distribution structure is 27 mm, the width is 5.5 mm, and the height is 4 mm; the initial distance between the willow-leaf-shaped flow distribution structure and the microchannel rib wall is 3 mm.

[0050] In an alternative example, the first flow distribution structure 312 and the second flow distribution structure 313 each include at least one cylindrical structure. When the cooling medium flows through the cylindrical structure, a turbulent flow effect is generated to obtain a further flow distribution effect.

[0051] Further, the first flow distribution structure 312 has two cylindrical structures arranged at intervals, and the second flow distribution structure 313 has three cylindrical structures arranged at intervals.

[0052] In an alternative embodiment of the present invention, the diameter of the cylinders in the first flow distribution structure 312 is 0.5 mm, the height is 5 mm, and the spacing is 12.5 mm; the diameter of the cylinders in the second flow distribution structure 313 is 0.5 mm, the height is 3 mm, and the spacing is 3 mm.

[0053] In an alternative embodiment of the present invention, the inlet flow velocities of the first flow distribution structure 312 and the second flow distribution structure 313 match the length decreasing gradient of the rib wall body 3211, so that the Reynolds number of the cooling medium is maintained within the range of 800 - 1000.

[0054] In an alternative embodiment of the present invention, the temperature equalizing structure 41 includes a plurality of fins 411 arranged in parallel at intervals, and two adjacent fins 411 form a temperature equalizing channel, which is arranged along the length direction of the second cooling channel 40. Each fin 411 has a heat dissipation function and can quickly transfer the temperature of the temperature equalizing plate 20 into the second cooling channel 40 to further improve the heat exchange efficiency of the cooling medium.

[0055] In an alternative example of this embodiment, each fin 411 is welded to the temperature equalizing plate 20.

[0056] In an alternative embodiment of the present invention, the housing 10 includes a bottom substrate 13 and an upper cover plate 14, and the upper cover plate 14 and the bottom substrate 13 are hermetically and fixedly connected to enclose a cooling cavity.

[0057] In an alternative example of this embodiment, the bottom substrate 13 has a downwardly recessed lower chamber, and the upper cover plate 14 has an upwardly recessed upper chamber. After the bottom substrate 13 and the upper cover plate 14 are hermetically connected, the lower chamber and the upper chamber form a cooling cavity.

[0058] In an optional example of this embodiment, the heat pipe 20 is placed above the bottom substrate 13, and the bottom substrate 13 is hermetically connected to the heat pipe 20. The upper cover plate 14 is placed above the heat pipe 20 and the bottom substrate 13 and is hermetically connected to the heat pipe 20 and the bottom substrate 13. With the above structure, the space between the heat pipe 20 and the bottom substrate 13 forms the first cooling channel 30, and the heat pipe 20 and the upper cover plate 14 form the second cooling channel 40.

[0059] Further, one end of the heat pipe 20 has a gap with the bottom substrate 13 and the upper cover plate 14 to form a communication port 50 for the cooling medium to flow from the first cooling channel 30 into the second cooling channel 40.

[0060] In an optional example, the flow distribution structure 31 and the microchannel structure 32 are integrally formed with the bottom substrate 13.

[0061] In an optional example, a heat-generating electronic component 200 is provided on the outer wall of the bottom substrate 13, and the bottom substrate 13 can dissipate heat from and rapidly cool the heat-generating electronic component 200.

[0062] In an optional example, the bottom substrate 13 has a first arc structure 131 that is in alignment and cooperation with the communication port 50, and the upper cover plate 14 has a second arc structure 141 that is in alignment and cooperation with the communication port 50. The first arc structure 131 and the second arc structure 141 have a guiding effect on the cooling medium, further reducing the flow resistance of the cooling medium.

[0063] Specifically, the first arc structure 131 has an upward guiding effect, guiding the cooling medium to the second arc structure 141, and then the second arc structure 141 guides the cooling medium into the second cooling channel 40.

[0064] In an optional example, the length direction of the first cooling channel 30 is also the length direction of the lower chamber of the bottom substrate 13, and the liquid inlet 11 and the communication port 50 are respectively located at both ends of the length direction of the lower chamber.

[0065] Further, the depth of the lower chamber of the bottom substrate 13 is 5 mm, the length is 80 mm, and the width is 60 mm.

[0066] Preferably, the flow distribution structure 31 and the microchannel structure 32 are located in the lower chamber. The height of the bionic flow distribution structure 311 is 4 mm, and the depth of the branched slots of the bionic flow distribution structure 311 is 1.5 mm; the height of the second flow distribution structure 313 is 3 mm; the height of the first flow distribution structure 312 is 4 mm.

[0067] Preferably, the height of the microchannel rib wall 321 of the microchannel structure 32 is 5 mm.

[0068] In an alternative example, the thickness of the heat pipe 20 is 0.5 mm, the length is 75 mm, and the width is 60 mm; the height of the fin 411 is 3 mm.

[0069] In an alternative example, the arc of the first arc structure 131 is a 1 / 4 arc, and its arc radius is 5 mm; the arc of the second arc structure 141 is a 1 / 4 arc, and its arc radius is 4.5 mm.

[0070] In an alternative embodiment of the present invention, the inner diameter of the liquid inlet 11 is 4 mm.

[0071] In an alternative example of the present invention, the liquid outlet 12 includes a first liquid outlet and a second liquid outlet. The inner diameters of the first liquid outlet and the second liquid outlet are the same, both being 3 mm, and they are distributed on both sides of the upper cover plate 14.

[0072] In an alternative embodiment of the present invention, the cooling medium is liquid water.

[0073] In an alternative embodiment of the present invention, the housing 10 and the heat pipe 20 are made of copper with good thermal conductivity.

[0074] Furthermore, the housing 10 and the heat pipe 20 can also be made of other heat-conducting materials known to those skilled in the art, which will not be elaborated here.

[0075] The detailed explanations for the above embodiments are only for the purpose of explaining the present invention so as to better understand the present invention. However, these descriptions cannot be construed as limitations on the present invention for any reason. In particular, the various features described in different embodiments can be arbitrarily combined with each other to form other embodiments. Unless there are express contrary descriptions, these features should be understood to be applicable to any one of the embodiments and not limited to the described embodiments only.

Claims

1. A double-layer liquid cooling plate for a data center server, characterized in that: The double-layer liquid cooling plate of the data center server has a shell, a cooling cavity is formed in the shell, a temperature averaging plate is arranged in the cooling cavity, and the temperature averaging plate divides the cooling cavity into a first cooling channel and a second cooling channel; a liquid inlet and a liquid outlet are opened on the shell, one end of the first cooling channel is connected to the liquid inlet, the other end of the first cooling channel is connected to one end of the second cooling channel through a connecting port, and the other end of the second cooling channel is connected to the liquid outlet, a flow distribution structure and a microchannel structure are arranged in the first cooling channel, the flow distribution structure is connected to the liquid inlet, the microchannel structure is arranged between the flow distribution structure and the connecting port, and a temperature averaging structure is arranged in the second cooling channel; The microchannel structure includes a plurality of microchannel ribs arranged in parallel and at intervals, two adjacent microchannel ribs form a cooling microchannel, the cooling microchannel is arranged along the length direction of the first cooling channel, each of the microchannel ribs is formed by a plurality of rib wall bodies arranged intermittently in sequence, and the length of the rib wall body decreases linearly along the flow direction of the fluid; an arc-shaped guide structure is provided at the end of the intermittently arranged rib wall body.

2. The double-layer liquid cooling plate for a data center server according to claim 1, characterized in that: The length of the rib wall decreases linearly by 10% per section.

3. The double-layer liquid cooling plate for a data center server according to claim 1, characterized in that: The flow distribution structure includes a bionic flow distribution structure, a first flow distribution structure and two second flow distribution structures. The bionic flow distribution structure is connected to the liquid inlet, and the two second flow distribution structures are symmetrically arranged on both sides of the bionic flow distribution structure. The first flow distribution structure is arranged between the bionic flow distribution structure and the microchannel structure.

4. The double-layer liquid cooling plate for a data center server according to claim 3, characterized in that: The bionic flow distribution structure is a bionic willow-leaf-shaped flow distribution structure.

5. The double-layer liquid cooling plate for a data center server according to claim 4, characterized in that: The first flow distribution structure and the second flow distribution structure each include at least one cylindrical structure.

6. The double-layer liquid cooling plate for a data center server according to claim 4, characterized in that: The inlet flow rate of the first flow distribution structure and the inlet flow rate of the second flow distribution structure are set to keep the Reynolds number of the cooling medium within the range of 800-1000.

7. The double-layer liquid cooling plate for a data center server according to claim 1, characterized in that: The temperature-averaging structure includes a plurality of fins arranged in parallel and at intervals, and two adjacent fins form a temperature-averaging channel, which is arranged along the length direction of the second cooling channel.

8. The double-layer liquid cooling plate for a data center server according to claim 1, characterized in that: The shell comprises a bottom substrate and an upper cover plate, and the upper cover plate and the bottom substrate are sealed and fixedly connected to enclose and form the cooling cavity.

9. The double-layer liquid cooling plate for a data center server according to claim 8, characterized in that: A heat-generating electronic component is arranged on the outer wall of the bottom substrate.

10. The double-layer liquid cooling plate for a data center server according to claim 8, characterized in that: The flow distribution structure and the microchannel structure are integrally formed with the bottom substrate.

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