Cooling structure of cooler through which fluid can flow

Abstract

The invention relates to a cooling structure (1) of a cooler (100) through which a fluid can flow, which cooling structure is formed from a U-shaped profile (10) that repeats periodically in a repeating direction (501), which U-shaped profile comprises corrugated limbs (15) that extend in a longitudinal direction (502) of the cooling structure (1) and are formed according to a trigonometric function (13).

Description

Field of the Invention

[0001] The present invention relates to a cooling structure of a fluid-permeable cooler for cooling a power electronic device, a method for manufacturing such a cooling structure, and a fluid-permeable cooler. Furthermore, the present invention relates to a power electronic device-component having such a cooler and a power electronic device. Background Art

[0002] It is known that power semiconductors of power electronic devices conduct high currents. The resulting conduction losses together with switching losses are the cause of a high loss thermal power, which has to be dissipated on a very small surface. Here, the maximum allowable semiconductor temperature is critical for failure, so it is crucial to minimize the thermal resistance between the semiconductor and the coolant. For efficient cooling, the power substrate is mounted on a fluid-permeable cooler. These coolers are made of aluminum alloy, AlSiC alloy or copper alloy. Pins or ribs are arranged inside the cooler to increase the heat conduction surface and to enhance heat conduction. To achieve a low thermal resistance between the power substrate, in particular an AMB / DBC power substrate (AMB: active metal braze, DBC: direct copper bonding), and the cooler, the power substrate is joined to the cooler by means of a soldering process, optionally also by means of a sintering process. For this purpose, these coolers are surface-coated with a material suitable for the soldering process or the sintering process, if necessary. In automotive technology, aluminum coolers, as well as AlSiC coolers or copper coolers, which are composed of a plurality of components joined in particular by means of a hard soldering process, are generally known. Summary of the Invention

[0003] When a cooling structure is used in such a cooler and the cooler is traversed by a fluid, the cooling structure according to the invention of the cooler through which the fluid can pass has the advantage of a good balance between the heat conduction performance from the cooling structure to the fluid used as coolant and the pressure drop caused by the cooling structure. This is achieved by the cooling structure of the cooler through which the fluid can pass, which is formed by U-shaped profiles that are periodically repeated in a repeating direction, and the U-shaped profiles include corrugated arms. The corrugated arms extend along the longitudinal direction of the cooling structure and are formed according to trigonometric functions. In other words, the corrugated arms each have the shape of a trigonometric function. Since the corrugated arms are components of the repeating U-shaped profiles, all the corrugated arms of the cooling structure advantageously have the same shape. By the repetition of the U-shaped profiles in the repeating direction, an integral and continuous profile is advantageously produced, which can particularly be called a corrugated profile within the scope of the present invention. The corrugated arms of the cooling structure cause a turbulent flow of the fluid used as coolant, which, when the resulting pressure drop is acceptable, increases the heat dissipation due to the corrugated shape of the arms. Therefore, the cooling structure according to the invention is particularly suitable for use in coolers through which a fluid can pass, especially high-efficiency coolers for power electronics applications.

[0004] The dependent claims indicate preferred improvements of the present invention.

[0005] Preferably, the U-shaped profiles are repeated an integer or non-integer number of times. That is, in the case where the number of repetitions of the U-shaped profiles is an integer, the cooling structure corresponds to an integer multiple of the periodically repeated U-shaped profiles. On the other hand, a non-integer number of repetitions means that the cooling structure is not an integer multiple of the periodically repeated U-shaped profiles. The number of times the U-shaped profiles are repeated advantageously depends on the width of the power electronics device to be cooled by the cooler through which the fluid can pass and which includes the cooling structure. The U-shaped profiles can, for example, be repeated 5 times in the repeating direction. Here, the cooling structure has 5 repetitions of the U-shaped profiles or in other words 5 U-shaped profiles, which are connected to each other such that an integral and continuous corrugated profile is produced.

[0006] Preferably, the cooling structure has, in addition to the longitudinal direction, a width direction and a height direction. The repeating direction preferably corresponds to the width direction. The longitudinal direction preferably can be perpendicular or inclined to the repeating direction. The height direction is perpendicular to the width direction and the longitudinal direction. Preferably, the longitudinal direction is the direction parallel to the line connecting the geometric center of gravity of the cross-section of the U-shaped profile at the first end of the cooling structure to the geometric center of gravity of the cross-section of the U-shaped profile at the second end of the cooling structure.

[0007] Preferably, the repeating direction is parallel to the Y-axis of a spatially fixed coordinate system, and the height direction is parallel to the Z-axis of the spatially fixed coordinate system. The longitudinal direction can preferably be parallel to or inclined to the X-axis of the spatially fixed coordinate system. The X-axis, Y-axis, and Z-axis of the spatially fixed coordinate system are perpendicular to each other. In other words, the spatially fixed coordinate system is a Cartesian coordinate system in three-dimensional space.

[0008] The longitudinal direction can preferably be the direction in which the cooling structure has its longest dimension. The longitudinal direction of the cooling structure preferably corresponds to the extending direction of the repeating U-shaped profile.

[0009] Trigonometric functions can, for example, be sine functions. Within the scope of the present invention, the support arm can also be referred to as a side wall.

[0010] Preferably, the height of the periodically repeating U-shaped profile is from 3.7 mm to 4.5 mm, particularly preferably 4 mm. The height of the U-shaped profile corresponds to the dimension of the U-shaped profile in the height direction perpendicular to the repeating direction. Advantageously, the height of the U-shaped profile corresponds to the height of the cooling structure. This particularly means that the cooling structure has a constant height.

[0011] Preferably, the period of the periodically repeating U-shaped profile is from 2 mm to 3.1 mm, particularly preferably 2.8 mm. It can be understood that the period of the periodically repeating U-shaped profile is the dimension in the repeating direction. It can also be understood that the period between the first end (side end) and the second end (side end) of the cooling structure is constant in the repeating direction. In other words, this particularly means that the periodically repeating U-shaped profile repeats regularly.

[0012] Preferably, the period of the trigonometric function is from 5.1 mm to 6 mm, particularly preferably 5.5 mm. It can be understood that the period of the trigonometric function is the dimension in the longitudinal direction.

[0013] Preferably, the amplitude of the trigonometric function is from 0.25 mm to 0.8 mm, particularly preferably 0.4 mm. The amplitude of the trigonometric function corresponds to the maximum distance of the trigonometric function relative to the rest position of the trigonometric function, which is located at the midpoint between the highest and lowest function values of the trigonometric function.

[0014] Preferably, the material thickness of the periodically repeating U-shaped profile is from 0.2 mm to 0.4 mm, particularly preferably 0.3 mm. In other words, the material thickness of the corrugated support arm is preferably from 0.2 mm to 0.4 mm, particularly preferably 0.3 mm. The periodically repeating profile advantageously has a constant material thickness.

[0015] Each value range in the value ranges given previously individually contributes to a good balance between the achieved heat conduction performance and the resulting pressure drop. Particularly preferred values of the corresponding parameters from the previously mentioned parameters (height of the periodically repeated U-shaped profile, period of the periodically repeated U-shaped profile, period of the trigonometric function, amplitude of the trigonometric function, material thickness of the periodically repeated profile) achieve an optimal balance with respect to the corresponding parameters between the achieved heat conduction performance and the resulting pressure drop.

[0016] In a particularly preferred embodiment according to the invention, the height of the periodically repeated U-shaped profile is 4 mm, the period of the trigonometric function is 5.5 mm, the amplitude of the trigonometric function is 0.8 mm, and the material thickness of the periodically repeated U-shaped profile is 0.3 mm. This design of the cooling structure has the advantage of an optimal balance between the achieved heat conduction performance and the resulting pressure drop.

[0017] Within the scope of the present invention, the U-shaped profile preferably can represent a part of the cooling structure, which includes two (adjacent) arms, two first connection regions, and a second connection region. The second connection region connects the two arms to each other, wherein the first connection region connects the U-shaped profile to the adjacent U-shaped profiles (repetition parts of the U-shaped profile) respectively. The first connection region and the second connection region are preferably parallel to a plane perpendicular to the height direction. In the state where the cooling structure is installed in a cooler through which a fluid can flow (where power electronics are arranged), the first connection region is closer to the power electronics than the second connection region.

[0018] The repeated U-shaped profile is preferably a rounded profile. This particularly means that the transition between the arm and the connection region (first connection region or second connection region) has a rounding. In other words, the arm transitions into the first connection region or the second connection region with a rounding radius. However, it is also feasible that the repeated U-shaped profile is a chamfered profile, that is, there is no rounding at the mentioned positions.

[0019] According to a design of the present invention, the cooling structure can be constructed such that all cross-sections of the cooling structure in a cut made with a plane whose normal vector is perpendicular to the repetition direction have the same cross-sectional area. As an alternative, the cooling structure can be constructed such that not all cross-sections of the cooling structure in a cut made with a plane whose normal vector is perpendicular to the repetition direction have the same cross-sectional area.

[0020] The cooling structure can be manufactured by means of a stamping process, a roll forming process, or an extrusion process.

[0021] Within the scope of the present invention, the cooling structure is preferably understood as a structure that enlarges the surface, guides the flow, and improves heat conduction.

[0022] Within the scope of the present invention, the cooling structure can also be referred to as a cooling rib structure, since cooling ribs are formed by repeating U-shaped profiles. The cooling structure can in particular also be referred to as a turbulator, since, as already described above, the cooling structure causes a turbulent flow of the flowing fluid.

[0023] The flow-through direction of the cooler corresponds in particular to the main flow direction of the fluid used as the coolant, which fluid flows through the through-opening formed by the cooling structure. Here, the main flow direction is in particular the direction along which the fluid mainly flows, that is to say the direction in which the velocity component of the fluid is greater than the velocity component of the fluid in the direction perpendicular to the main flow direction. The main flow direction preferably can correspond to the introduction direction of the fluid into the cooler through which the fluid can flow through.

[0024] The cooling structure is preferably at least partially, in particular completely, composed of a material having a thermal conductivity greater than 200 W / (m·K) and / or coated with such a material. Advantageously, the cooling structure can be at least partially, in particular completely, composed of aluminum or coated with aluminum.

[0025] The cooler through which the fluid can flow through can also be used for cooling components to be cooled other than power electronic devices, which components to be cooled are located on the cooler in a power electronic device assembly, such as an EMV filter, a capacitor or a bus bar.

[0026] Furthermore, the present invention relates to a cooler through which a fluid can flow through for cooling a power electronic device. The cooler through which the fluid can flow through includes the cooling structure described above, a first metal part and a second metal part. The first metal part and the second metal part are connected to each other and define a cooling channel in which the cooling structure is arranged. The cooling channel direction, that is to say the direction along which the cooling channel extends, preferably runs parallel to or is inclined to the longitudinal direction of the cooling structure or parallel to the longitudinal axis of the spatially fixed coordinate system mentioned above.

[0027] The first metal part and the second metal part advantageously form a housing that defines, in particular encloses, the cooling channel. The cooling channel in particular corresponds to the interior space of the housing. Preferably, an inlet and an outlet for the fluid used as the coolant are arranged directly at the housing.

[0028] The first metal part and the second metal part are preferably capable of being connected to each other directly or indirectly. Direct connection especially means that there is only one connection layer, especially a brazing layer, between the first metal part and the second metal part. Indirect connection especially means that at least one additional metal part is arranged between the first metal part and the second metal part, wherein the first metal part and the second metal part are connected by at least one additional metal part and the connection layer, especially the brazing layer, between the first metal part and the at least one additional metal part and the connection layer, especially the brazing layer, between the second metal part and the at least one additional metal part.

[0029] The first metal part and / or the second metal part are preferably configured as one or more plates.

[0030] Another aspect of the present invention relates to a power electronic device - assembly, which includes the above-described fluid - flow - through cooler for cooling the power electronic device and a power electronic device arranged at the fluid - flow - through cooler. The heat generated by the power electronic device during its operation can be efficiently discharged through the fluid - flow - through cooler.

[0031] The power electronic device preferably can include at least one power module having a power substrate. The at least one power module is fastened at / on the first metal part of the fluid - flow - through cooler by means of the power substrate.

[0032] The power substrate is preferably constructed of copper and / or ceramic (AMB / DBC power substrate; AMB: active metal braze, DBC: direct copper bonding).

[0033] In order to achieve the purpose of low thermal resistance between the power substrate and the cooler, especially the first metal part, the power substrate is preferably joined to the cooler, especially the first metal part, by means of a soldering process, optionally also by means of a sintering process. This means that the power module is preferably joined to the fluid - flow - through cooler or the first metal part by means of a layer produced by the soldering process or the sintering process (this layer is accordingly a soldering layer or a sintering layer).

[0034] The power module preferably includes one or more power semiconductors. The one or more power semiconductors generate heat during the operation of the power module, and this heat can be discharged through the cooler.

[0035] Furthermore, the present invention relates to a cooling structure for manufacturing a cooler through which a fluid can flow, in particular a method for the cooling structure described above, which is formed by U-shaped profiles that are periodically repeated along a repeating direction. The U-shaped profiles include corrugated arms that extend along the longitudinal direction of the cooling structure and are formed according to a trigonometric function. The method includes the step of extruding the repeated U-shaped profiles in the extrusion direction along the trigonometric function, and the extrusion direction is perpendicular to the repeating direction or extends tangentially to the trigonometric function or lies between these two orientations. The expression "between these two orientations" particularly means that the extrusion direction lies between the corresponding tangent of the trigonometric function and the vertical line perpendicular to the repeating direction. The expression "extruding the U-shaped profile along the trigonometric function" preferably means that the geometric center of gravity of the U-shaped profile moves / lies on the mapping of the geometric function. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the drawings:

[0037] Figure 1 A schematic simplified cross-sectional view of a power electronics component according to the present invention having a power electronics device and a cooler according to the present invention is shown, and the cooler includes a cooling structure according to a first embodiment of the present invention.

[0038] Figure 2 A schematic simplified perspective view of the cooling structure according to the first embodiment of the present invention is shown.

[0039] Figure 3 A simplified schematic view for explaining the manufacturing method according to the present invention of the cooling structure according to the first embodiment is shown, wherein the cooling structure is shown in a top view.

[0040] Figure 4 A simplified schematic view for explaining the manufacturing method of the cooling structure according to the second embodiment is shown, wherein the cooling structure is shown in a top view, and

[0041] Figure 5 A schematic simplified cross-sectional view of a power electronics component according to the present invention having a power electronics device and a cooler according to the third embodiment is shown, and the cooler includes Figure 2 the cooling structure in. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] The following will be described with reference to Figures 1 to 3 a power electronics component 1000 according to the present invention, which includes a power electronics device 200 and a cooler 100 having a cooling structure 1 according to a first embodiment of the present invention.

[0043] As can be seen from Figure 1As can be seen, the power electronic device 200 includes a power module 210, which can also be referred to as a power electronic device - structural unit. The power module 210 has a circuit board 204, conductor lines 203, 205, and power semiconductors 201. The conductor lines 203, 205 are particularly configured as copper conductor lines, and the circuit board 204 is preferably made of ceramic.

[0044] The power semiconductors 201 are applied to the conductor lines 203 by means of a layer 202. Here, the layer 202 is particularly configured as a soldering layer or a sintering layer.

[0045] The conductor lines 203, 205 and the circuit board 204 together form a power substrate 208. The power substrate 208 is joined to the cooler 100, particularly to a first metal part 101 of the housing 110 of the cooler 100, by means of a layer 206 (which layer is accordingly a soldering layer or a sintering layer) produced by a soldering process or a sintering process.

[0046] In addition, the housing 110 of the cooler 100 includes a second metal part 102, which is connected to the first metal part 101 by means of a layer (connection layer) 103 particularly configured as a hard soldering layer. The first metal part 101 and the second metal part 102 are preferably aluminum components.

[0047] In addition, as Figure 1 seen, the first metal part 101 is the upper part of the housing 110 and the second metal part 102 is the lower part of the housing. The first metal part 101 faces the power module 210, while the second metal part 102 faces away from the power module 210. In addition, in this embodiment, the first metal part 101 is configured in a plate shape, and the second metal part 102 has a plate-shaped region and a region trapezoidal in cross-section. However, it is also feasible that the first metal part 101 and the second metal part 102 have other shapes. The second metal part 102 can be advantageously made by a deep drawing process.

[0048] An intermediate layer 107 advantageously exists between the layer 206 and the cooler 100, particularly with the first metal part 101. This intermediate layer is fixedly connected to the first metal part 101 and allows wetting of the layer 206. The intermediate layer 107 is an optional feature of the power electronic device - assembly 1000 and can particularly be regarded as a separate component or as a component of the housing 110 of the cooler 100.

[0049] The first metal part 101 and the second metal part 102 form the housing 110 of the cooler 100 in the joined state, and an internal space is defined by the first metal part and the second metal part. This internal space serves as the cooling channel 111 of the cooler 100.

[0050] A cooling structure 1 is arranged in the cooling channel 111. This cooling structure serves as a surface-expanding structure that guides the flow of a fluid used as a coolant and improves heat conduction. The cooling structure 1 is advantageously joined to the first metal part 101 and the second metal part 102 by means of a layer 103.

[0051] As shown by Figure 1 and Figure 2 The cooling structure 1 is formed by U-shaped profiles 10 that are periodically repeated in a repeating direction 501. The repeating direction 501 is perpendicular to the flow-through direction 500 and in particular corresponds to the width direction of the cooler 100. The flow-through direction 500 corresponds to the main flow direction of the fluid used as a coolant when the fluid flows through the cooling channel 111, in particular through the through-opening 14 formed by the repeated U-shaped profiles 10 ( Figure 1 ). In addition, the flow-through direction 500 corresponds to the cooling channel direction, which is the direction along which the cooling channel 11 extends substantially. In this embodiment, the U-shaped profile 10 is repeated 6 times, so that six repetitions 19 of the U-shaped profile 10 or in other words six interconnected U-shaped profiles are provided in the cooling structure 1.

[0052] In Figure 2 , in addition to marking the repeating direction 501, the longitudinal direction 502 and the height direction 503 are also marked. The longitudinal direction 502 is inclined (i.e., not perpendicular) to the repeating direction 501 in this embodiment. The height direction 503 is perpendicular to the repeating direction 501 and the longitudinal direction 502. As shown by Figure 3 The longitudinal direction 502 is in particular the direction parallel to the line 509 that connects the geometric centroid 508 of the cross-section of the U-shaped profile 10 at the first end 11 of the cooling structure 1 to the geometric centroid 510 of the cross-section of the U-shaped profile 10 at the second end 12 of the cooling structure 1.

[0053] In addition, in Figure 2 a spatially fixed Cartesian three-dimensional coordinate system is marked. The repeating direction 501 is parallel to the Y-axis 601 of the coordinate system, and the height direction 503 is parallel to the Z-axis 603 of the coordinate system. The longitudinal direction 502 is inclined to the X-axis 602 of the coordinate system.

[0054] Referring to Figure 1 and Figure 2, the repeated U-shaped profile 10 has corrugated arms 15, a first connection region 16 and a second connection region 17. The first connection region 16 connects two adjacent corrugated arms 15 of adjacent repetitions 19 of the U-shaped profile 10 to each other in the upper region of the corrugated arms 15, wherein the second connection region 17 connects adjacent arms 15 of the same repetition 19 of the U-shaped profile 10 to each other in the lower region of the arms 15. The first connection region 16 is closer to the power electronics 200 than the second connection region 17. In particular, the corrugated arms 15 of each repetition 19 are connected to each other by means of the second connection region 16. In addition, each repetition 19 of the U-shaped profile 10 is connected to an adjacent repetition of the U-shaped profile 10. In particular, the corrugated arms 15 of each repetition 19 of the U-shaped profile 10 are connected to the corresponding corrugated arms 15 of an adjacent repetition 19 of the U-shaped profile 10 by means of the corresponding first connection regions 16 of the two repetitions 19.

[0055] In this embodiment, the repeated profile 10 is rounded. This means that each arm 15 transitions into the corresponding first connection region 16 and the corresponding second connection region 17 with a rounding radius.

[0056] In order to achieve a good balance between the heat conduction transfer of the fluid used as coolant and the pressure drop caused by the cooling structure 1, the cooling structure 1 is constructed as follows:

[0057] The height 401 of the repeated U-shaped profile 10 or the cooling structure 1 is 3.7 mm to 4.5 mm, particularly preferably 4 mm. The period 402 of the periodically repeated U-shaped profile 10 is 2 mm to 3.1 mm, particularly preferably 2.8 mm. The period 403 of the trigonometric function 13 is 5.1 mm to 6 mm, particularly preferably 5.5 mm. In addition, the amplitude 404 of the trigonometric function 13 is 0.25 mm to 0.8 mm, particularly preferably 0.4 mm. In addition, the material thickness 405 of the periodically repeated U-shaped profile or the cooling structure 1 is 0.2 mm to 0.4 mm, particularly preferably 0.3 mm.

[0058] It should be noted that the length of the cooling structure 1 is preferably adapted to the length of the power module 10.

[0059] In order to promote the heat dissipation of the power module 210 by means of the fluid used as coolant, the cooling structure 1 is at least partially, in particular completely, made of a material with a thermal conductivity greater than 200 W / (m·K) and / or coated with said material. Advantageously, the cooling structure 1 can be at least partially, in particular completely, made of aluminum or coated with aluminum.

[0060] Figure 3A simplified schematic view is shown, based on which a method for manufacturing a cooling structure 1 according to the first embodiment is described.

[0061] In particular, Figure 3 the trigonometric function 13 is shown graphically. In addition, rectangles are marked, which respectively show the areas of the cooling structure 1 when viewed from above.

[0062] According to the manufacturing method, the repetitive U-shaped profile 10 can be extruded along the trigonometric function 13 in the extrusion direction 504 that is tangent to the trigonometric function 13. It should be noted that the extrusion direction 504 does not have a constant orientation but always extends tangentially to the trigonometric function 13.

[0063] Therefore, in this embodiment, the cooling structure 1 is configured as an extruded member, wherein the longitudinal direction 502 is inclined (at an angle not equal to 90 degrees) with respect to the repetitive direction 501.

[0064] According to this manufacturing method, the cooling structure 1 is configured such that not all cross-sectional areas of the cooling structure 1 in a cut made by a plane whose normal vector is perpendicular to the repetitive direction 501 have the same size.

[0065] Due to the described design of the repetitive U-shaped profile 10, the cooling structure 1 according to the invention and thus the cooler 100 and the power electronics component 1000 are characterized by a good ratio of thermal performance to the pressure loss caused in the cooling channels 111.

[0066] Figure 4 A simplified schematic view is shown, based on which a method for manufacturing a cooling structure 1 according to the second embodiment is described.

[0067] Similar to Figure 3 , in Figure 4 the trigonometric function 13 is shown graphically. In addition, rectangles are marked, which respectively show the areas of the cooling structure 1 when viewed from above.

[0068] To manufacture the cooling structure 1 according to the second embodiment, the repetitive U-shaped profile 10 can be extruded along the trigonometric function 13 in the extrusion direction 504. Different from the method for manufacturing the cooling structure 1 according to the first embodiment, this extrusion direction is not tangent to the trigonometric function 13 but perpendicular to the repetitive direction 501 or in other words parallel to the cooling channel direction. Here, the extrusion direction 504 (always) is parallel to the longitudinal direction 502.

[0069] According to this manufacturing method, the cooling structure 1 is constructed such that all cross-sections in a cut of the cooling structure 1 with a plane whose normal vector is perpendicular to the repeating direction 501 have the same cross-sectional area.

[0070] Figure 5 A power electronic device-component 1000 according to a third embodiment of the present invention is shown.

[0071] The power electronic device-component 1000 according to the third embodiment differs from the power electronic device-component according to the first embodiment in that the first metal piece 101, which is the upper part and thus faces the power module 210, has a plate-shaped region and a region that is trapezoidal in cross-section, and the second metal piece 102, which is the lower part and thus faces the power module 210, is constructed in a plate shape.

[0072] This configuration of the housing 110 can be advantageous in the case of a lack of space in the immediate vicinity of the power module 210.

[0073] It should be noted that the housing 110 of the cooler 100 according to the third embodiment can also be combined with the cooling structure 1 manufactured by the manufacturing method according to the second embodiment.

[0074] In the previously described embodiments, the power electronic device 200 includes only one power module 210. However, it is feasible for the power electronic device 200 to have two or more power modules 210. For this purpose, a corresponding number of cooling structures 1 can be arranged in the cooling channels 111 of the cooler 100, where each cooling structure 1 is assigned to one of the power modules 210.

Claims

1. A cooling structure (1) of a cooler (100) through which a fluid can flow, the cooling structure being formed by U-shaped profiles that are periodically repeated along a repeating direction (501), the U-shaped profiles including corrugated arms (15) that extend along a longitudinal direction (502) of the cooling structure (1) and are formed according to a trigonometric function (13).

2. The cooling structure (1) according to claim 1, wherein, The height (401) of the periodically repeated U-shaped profile (10) is 3.7 mm to 4.5 mm, preferably 4 mm.

3. The cooling structure (1) according to any one of the preceding claims, wherein, The period (402) of the periodically repeated U-shaped profile (10) is 2 mm to 3.1 mm, preferably 2.8 mm.

4. The cooling structure (1) according to any one of the preceding claims, wherein, The period (403) of the trigonometric function (13) is 5.1 mm to 6 mm, preferably 5.5 mm.

5. The cooling structure (1) according to any one of the preceding claims, wherein, The amplitude (404) of the trigonometric function (13) is 0.25 mm to 0.8 mm, preferably 0.4 mm.

6. The cooling structure (1) according to any one of the preceding claims, wherein, The material thickness of the periodically repeated U-shaped profile (10) is 0.2 mm to 0.4 mm, preferably 0.3 mm.

7. The cooling structure (1) according to any one of the preceding claims, wherein, The cooling structure (1) is constructed such that all cross-sections in a cut of the cooling structure (1) made in a plane whose normal vector is perpendicular to the repeating direction (501) have the same cross-sectional area, or alternatively, not all cross-sections in a cut of the cooling structure (1) made in a plane whose normal vector is perpendicular to the repeating direction (501) have the same cross-sectional area.

8. A cooler (100) through which a fluid can flow, which is used for cooling a power electronic device (200), the cooler through which a fluid can flow comprising: ■ The cooling structure (1) according to any one of the preceding claims, ■ A first metal piece (101), and ■ A second metal piece (102), wherein the first metal piece (101) and the second metal piece (102) are connected to each other and define a cooling channel (111), and the cooling structure (1) is arranged in the cooling channel.

9. A power electronic device-component (1000), which comprises: ● The cooler (100) through which a fluid can flow according to claim 8 for cooling a power electronic device, and ● A power electronic device (200), which is arranged at the cooler (100) through which a fluid can flow.

10. A method for manufacturing a cooling structure (1) of a cooler (100) through which a fluid can flow, the cooling structure being formed by U-shaped profiles (10) that are periodically repeated along a repeating direction, the U-shaped profiles including corrugated arms (15) that extend along the longitudinal direction of the cooling structure (1) and are formed according to a trigonometric function (13), wherein, The repeated U-shaped profile (10) is extruded along the trigonometric function (13) in an extrusion direction that is perpendicular to the repeating direction (501) or tangent to the trigonometric function (13) or lies between these two orientations.

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